CN113692104B - Packaging structure, printed circuit board and electronic equipment - Google Patents

Packaging structure, printed circuit board and electronic equipment Download PDF

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Publication number
CN113692104B
CN113692104B CN202010423380.5A CN202010423380A CN113692104B CN 113692104 B CN113692104 B CN 113692104B CN 202010423380 A CN202010423380 A CN 202010423380A CN 113692104 B CN113692104 B CN 113692104B
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Prior art keywords
conductive
bonding pad
layer
conductive body
pad body
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CN113692104A (en
Inventor
叶峰
虞程华
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Zhejiang Uniview Technologies Co Ltd
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Zhejiang Uniview Technologies Co Ltd
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands

Abstract

The invention discloses a packaging structure, a printed circuit board and electronic equipment, wherein the packaging structureThe bonding pad assembly comprises a bonding pad body and a conductive body, wherein the conductive body is arranged on the periphery of the bonding pad body, and the impedance of the bonding pad assembly is equal to preset impedance Z 0 The method comprises the steps of carrying out a first treatment on the surface of the The electronic element is electrically connected with the bonding pad body, and the bonding pad body is connected with the signal wire; the substrate comprises a conductive layer and a dielectric layer, the dielectric layer comprises a first dielectric layer, and the conductive layer comprises a first conductive layer; the pad assembly and the signal wire are arranged on the outer surface of the first dielectric layer, the first conductive layer is arranged on one side, away from the pad assembly, of the first dielectric layer, the first dielectric layer is provided with a through hole, the inner surface of the through hole is provided with a conductive film, and the conductive body is connected with the first conductive layer through the conductive film; the conducting layer is provided with an opening structure, and the orthographic projection of the bonding pad body on the conducting layer is positioned in the opening structure. The packaging structure provided by the invention is beneficial to improving the impedance continuity and improving the signal transmission effect.

Description

Packaging structure, printed circuit board and electronic equipment
Technical Field
The present invention relates to the field of electronic devices, and in particular, to a packaging structure, a printed circuit board, and an electronic device.
Background
In a high-speed serial link system, to increase the noise margin of a circuit, an ac coupling capacitor is usually required to be connected to a signal input terminal and a signal output terminal, so as to improve the anti-interference capability of a high-speed signal.
In the high-speed link, the impedance of the signal transmission path is inversely related to the width of the signal line, and the larger the width of the signal line is, the smaller the impedance of the signal transmission path is. However, the width of the packaging bonding pad of the ac coupling capacitor is far greater than the width of the signal line, so that the bonding pad impedance is smaller than the impedance of the signal line, which results in the problem of discontinuous impedance of the high-speed link at the bonding pad, the discontinuous impedance can cause signal reflection distortion, and along with the continuous improvement of the signal transmission rate, the influence of the discontinuous impedance on the signal integrity is greater and greater, and the signal transmission effect is affected.
Disclosure of Invention
The invention provides a packaging structure, which solves the problem of discontinuous impedance of a high-speed link at a bonding pad, can realize quantitative control of the bonding pad impedance and improves the signal transmission effect.
In a first aspect, an embodiment of the present invention provides a package structure, including: a substrate, an electronic component, and a pad assembly including a pad body and a lead disposed opposite to the pad bodyThe electric body is arranged at the periphery of the bonding pad body, a space interval is arranged between the electric body and the bonding pad body, and the impedance of the bonding pad assembly is equal to the preset impedance Z 0 The method comprises the steps of carrying out a first treatment on the surface of the The electronic element is electrically connected with the bonding pad body, and the bonding pad body is connected with the corresponding signal wire; the substrate comprises a conductive layer and a dielectric layer, wherein the dielectric layer is arranged between two adjacent conductive layers, the dielectric layer comprises a first dielectric layer, and the conductive layer comprises a first conductive layer; the bonding pad assembly and the signal wire are arranged on the outer surface of the first dielectric layer, the first conductive layer is arranged on one side, away from the bonding pad assembly, of the first dielectric layer, a through hole is formed in the first dielectric layer, a conductive film is arranged on the inner wall surface forming the through hole, and the conductive body is connected with the first conductive layer through the conductive film; the conducting layer is provided with an opening structure, and the orthographic projection of the bonding pad body on the conducting layer is positioned in the opening structure.
Optionally, the conductive body has a strip-shaped structure, and an extending direction of the conductive body is parallel to an extending direction of the signal line; in the extending direction parallel to the signal line, the length of the conductive body is greater than or equal to the length of the bonding pad body.
Optionally, the conductive body is in a semi-surrounding structure; the length of the conductive body is greater than or equal to the length of the bonding pad body in the extending direction parallel to the signal line; in the extending direction perpendicular to the signal line, the minimum distance between the conductive body and the signal line is larger than a preset distance threshold.
Optionally, a first distance L is provided between an edge of the conductive body near the side of the pad body and an edge of the pad body near the side of the conductive body.
Optionally, the conductive body comprises copper foil.
Optionally, the orthographic projection of the conductive body on the first conductive layer completely covers the orthographic projection of the through hole on the first conductive layer.
Optionally, the electronic component comprises an ac coupling capacitor.
In a second aspect, an embodiment of the present invention further provides a printed circuit board, including the above-mentioned package structure.
In a third aspect, an embodiment of the present invention further provides an electronic device, including the above printed circuit board.
According to the electronic equipment provided by the embodiment of the invention, the packaging structure is provided, the conductive body is arranged around the bonding pad body, the conductive layer is provided with the opening structure in the area corresponding to the bonding pad body, when alternating current signals flow through the bonding pad body, the conductive body provides a reflux path for the signals, so that the impedance of the bonding pad assembly is increased, the problem that the impedance of a high-speed link is discontinuous at the bonding pad is solved, the impedance of the bonding pad can be accurately controlled by adjusting the interval between the conductive body and the bonding pad body, the impedance continuity is improved, and the signal transmission effect is improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a package structure according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a package structure according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a pad assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural view of another pad assembly according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a printed circuit board according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
Fig. 1 is a schematic cross-sectional view of a package structure according to an embodiment of the invention. Fig. 2 is a schematic top view of a package structure according to an embodiment of the invention. The embodiment may be suitable for an application scenario of precisely adjusting the impedance of the package pad in the ac link, where the signal line 140 is used for transmitting an ac electrical signal.
As shown in fig. 1, a package structure 01 provided in an embodiment of the present invention includes: a substrate 110, an electronic component 120, and a pad assembly 130.
Referring to fig. 1 and 2 in combination, the pad assembly 130 includes a plurality of pad bodies 301 and a conductive body 302 disposed opposite to the pad bodies 301, the conductive body 302 being disposed at the periphery of the pad bodies 301, a space interval being provided between the conductive body 302 and the pad bodies 301, the space interval between the conductive body 302 and the pad bodies 301 being adjusted so that the impedance of the pad assembly 130 is equal to a preset impedance Z 0 The method comprises the steps of carrying out a first treatment on the surface of the The electronic component 120 is soldered to the pad body 301 and electrically connected to the pad body 301, and the pad body 301 is connected to the corresponding signal line 140; the substrate 110 comprises conductive layers 101 and dielectric layers 102, the conductive layers 101 and the dielectric layers 102 are stacked at intervals, the dielectric layers 102 are arranged between two adjacent conductive layers 101, the dielectric layers 102 comprise first dielectric layers M01, the first dielectric layers M01 are adjacent to the top layer or the bottom layer of the substrate 110, the top layer or the bottom layer of the substrate 110 is a conductive layer, the top layer or the bottom layer of the substrate 110 can be used for setting signal lines, and the conductive layers comprise first conductive layers L01; the pad assembly 130 and the signal line 140 are arranged on the outer surface of the first dielectric layer M01, the first conductive layer L01 is arranged on one side of the first dielectric layer M01, which is away from the pad assembly 130, the first dielectric layer M01 is provided with a through hole 103, the inner wall surface forming the through hole 103 is provided with a conductive film 104, and the conductive body 302 is connected with the first conductive layer L01 through the conductive film 104; the conductive layer 101 is provided with an opening structure 105, and an orthographic projection of the pad body 301 on the conductive layer 101 is located in the opening structure 105.
The pad assembly 130 and the signal line 140 are disposed on the same layer, for example, the pad assembly 130 and the signal line 140 may be disposed on a top layer or a bottom layer of the substrate 110, and the pad body 301, the conductive body 302 and the signal line 140 are all made of conductive materials laid on the outer surface of the first dielectric layer M01.
The pad assembly 130 and the signal line 140 may be disposed on a top layer or a bottom layer of the substrate 110. If the pad assembly 130 and the signal line 140 are disposed on the top layer of the substrate 110, the outer surface of the first dielectric layer M01 is the top surface of the first dielectric layer M01; if the pad assembly 130 and the signal line 140 are disposed on the bottom layer of the substrate 110, the outer surface of the first dielectric layer M01 is the bottom surface of the first dielectric layer M01.
Alternatively, the conductive body 302 may comprise copper foil. Of course, on the premise that the conductivity of the conductive body 302 is not changed, other conductive materials may be used for the conductive body 302, which is not limited.
In this embodiment, a copper foil may be used as the conductive body 302, and the copper foil may be the same as the conductive material of the conductive layer 101 and the conductive material of the signal line 140, and in the Z direction perpendicular to the substrate 110, the thickness of the conductive body 302, the thickness of the pad body 301 and the thickness of the signal line 140 may be consistent, for example, the thickness may be T, which is beneficial to improving the normalization of the conductive material in the signal transmission link.
Illustratively, a layer of copper foil may be laid on the outer surface of the first dielectric layer M01, and patterned copper foils corresponding to the pad body 301, the conductive body 302 and the signal line 140 are reserved by etching technology. The etched patterned copper foil as shown in fig. 2 includes four pad bodies 301, four signal lines 140, and a conductive body 302 disposed at the periphery of the pad bodies 301, wherein the pad bodies 301 are connected between a signal input end and a signal output end of an ac link through the signal lines 140, and a first distance L is provided between an edge of the conductive body 302 near the pad body 301 and an edge of the pad body 301 near the conductive body 302.
Referring to fig. 1 and 2 in combination, the conductive layer 101 is provided with an opening structure 105, the orthographic projection of the pad body 301 on the conductive layer 101 is located in the opening structure 105, the opening structure 105 is not provided with conductive material, that is, the conductive layer 101 is provided with the opening structure 105 at the area corresponding to the pad body 301 to form a hollow, and the conductive layer 101 cannot form a reflow path at the area corresponding to the pad body 301. When the signal line 140 at the input end of the electronic component 120 transmits an ac electrical signal to the pad body 301, the conductive body 302 disposed at the periphery of the pad body 301 generates an induced electrical signal, and the induced electrical signal is transmitted to the first conductive layer L01 through the conductive film 104, and forms a reflow path through the conductive film 104, the conductive body 302, the pad body 301 and the signal line 140 disposed at the output end of the electronic component 120.
In the present embodiment, the pad body 301 has a trace impedance, the differential impedance between the conductive body 302 and the pad body 301 determines the impedance of the pad assembly 130, and by adjusting the parameters of the first spacing L, the impedance of the pad assembly 130 can be precisely controlled so that the impedance of the pad assembly 130 is equal to the preset impedance Z 0 。
Optionally, referring to fig. 1, the orthographic projection of the conductive body 302 on the conductive layer 101 is located outside the opening structure 105, that is, the area of the opening structure 105 may be set to be approximately equal to the area of the pad body 301, so that the conductive layer 101 has conductive material at the area corresponding to the conductive body 302, which is beneficial to achieve reliable electrical connection between the conductive body 302 and the first conductive layer L01.
Alternatively, as shown in fig. 1, the orthographic projection of the conductive body 302 on the first conductive layer L01 completely covers the orthographic projection of the via 103 on the first conductive layer L01.
As shown in fig. 1, a through hole 103 is provided in a region corresponding to the conductive body 302 in the first dielectric layer M01, and if the conductive body 302 is provided on the top layer, the through hole 103 in the first dielectric layer M01 is located directly under the conductive body 302; if the conductive body 302 is disposed on the bottom layer, the through hole 103 in the first dielectric layer M01 is located directly above the conductive body 302, and the cross-sectional area of the through hole 103 may be smaller than or equal to the bottom area of the conductive body 302, where the conductive body 302 fully contacts the conductive film 104 disposed on the inner surface of the through hole 103, so that the conductive body 302 is electrically connected with the first conductive layer L01 through the conductive film 104.
Therefore, in the packaging structure provided by the embodiment of the invention, the conductive body is arranged around the bonding pad body provided with the electronic element, and the conductive layer is hollowed out in the area corresponding to the bonding pad body, so that when alternating current signals flow through the bonding pad body, the conductive body provides a reflux path for signal transmission, the impedance of the bonding pad assembly is increased, the problem that the impedance of a high-speed link is discontinuous at the bonding pad is solved, the impedance of the bonding pad can be quantitatively controlled by adjusting the interval between the conductive body and the bonding pad body, the influence of the electronic element on the impedance continuity is reduced, and the signal transmission effect is improved.
Illustratively, embodiments of the present invention provide two specific embodiments of the pad assembly.
Fig. 3 is a schematic structural view of a pad assembly according to an embodiment of the present invention. Fig. 4 is a schematic structural view of another pad assembly according to an embodiment of the present invention.
Alternatively, as shown in fig. 3 and 4, the conductive body 302 is disposed at the periphery of the pad body 301, and a first distance L is provided between an edge of the pad body 301 near the side of the conductive body 302 and an edge of the pad body 301 near the side of the conductive body 302.
The conductive body 302 is disposed opposite to the pad body 301, and a first distance L is provided between the conductive body 302 and the pad body 301, so that when an ac signal flows through the pad body 301, the conductive body 302 can generate an induced electrical signal, and the conductive body 302 and the signal line 140 are disposed at a space interval, for example, the space between the conductive body 302 and the signal line 140 can be set to be greater than the first distance L, so as to avoid a short-circuit risk caused by the contact between the conductive body 302 and the signal line 140.
Example 1
The bonding pad assembly provided by the embodiment of the invention comprises a conductive body with a strip-shaped structure.
Alternatively, as shown in fig. 3, the conductive body 302 has a strip-shaped structure, and the extending direction of the conductive body 302 is parallel to the extending direction of the signal line 140; in the extending direction X parallel to the signal line 140, the length L10 of the conductive body 302 is equal to or greater than the length L20 of the pad body 301.
In this embodiment, as shown in fig. 3, the extending direction parallel to the signal line 140 is defined as the X direction, the direction perpendicular to the signal line 140 is defined as the Y direction, in which the extending direction of the conductive body 302 is parallel to the X direction, the pad body 301 has a rectangular structure, the signal line 140 is connected to one vertex of the pad body 301, and the edge of the signal line 140 on the side away from the conductive body 302 is aligned with the edge of the pad body 301 on the side away from the conductive body 302. In the extending direction X parallel to the signal line 140, the length L10 of the conductive body 302 is greater than or equal to the length L20 of the pad body 301, so that when an ac signal flows through the pad body 301, the conductive body 302 can induce an electrical signal, and the conductive body 302 provides a reflow path for electrical signal transmission, which is beneficial to improving the signal transmission capability between the conductive body 302 and the pad body 301.
Illustratively, the conductive body 302 includes a first strip-shaped conductive body and a second strip-shaped conductive body symmetrically disposed on both sides of the plurality of pad body 301 assemblies, and an extension direction of the first strip-shaped conductive body and the second strip-shaped conductive body is parallel to an extension direction of the signal line 140; in the extending direction X parallel to the signal line 140, the lengths of the first and second strip-shaped conductive bodies are equal to or greater than the length of the pad body 301. Of course, the first and second strip-shaped conductive bodies may have different lengths in the extending direction X parallel to the signal line 140, which is not limited.
Example two
The second embodiment of the invention provides a bonding pad assembly comprising a conductive body with a semi-surrounding structure.
Alternatively, as shown in fig. 2 and 4, the conductive body 302 has a semi-surrounding structure, and the conductive body 302 has a first conductive portion 3021 parallel to the extending direction X of the signal line 140 and a second conductive portion 3022 perpendicular to the extending direction of the signal line 140; in the direction parallel to the extending direction X of the signal line 140, the length L10 of the conductive body 302 is equal to or greater than the length L20 of the pad body 301; in the extending direction perpendicular to the signal line 140, the minimum distance L30 between the conductive body 302 and the signal line 140 is greater than a preset distance threshold, where the minimum distance L30 between the conductive body 302 and the signal line 140 is the distance between the second conductive portion 3022 and the signal line 140.
Specifically, as shown in fig. 2 and 4, the pad body 301 may have a rectangular structure defining an X direction parallel to the extending direction of the signal line 140 and a Y direction perpendicular to the signal line 140, in which the pad body 301 has a second width W 2 . The conductive body 302 may be shaped like a C and have a semi-enclosed structure, the bonding pad body 301 is disposed in the C-shaped semi-enclosed structure, and the bonding pad body 301 has mutually orthogonal structuresThe first edge a1 of the pad body 301 is parallel to the extending direction of the signal line 140, and the second edge a2 of the pad body 301 is parallel to the extending direction of the signal line 140. The extending direction of the first conductive portion 3021 of the conductive body 302 is parallel to the first edge of the pad body 301, and a first distance L is provided between the first conductive portion 3021 and the first edge a1 of the pad body 301, the extending direction of the second conductive portion 3022 of the conductive body 302 is parallel to the second edge a2 of the pad body 301, and a first distance L is provided between the second conductive portion 3022 and the second edge a2 of the pad body 301, and a minimum distance L30 between the conductive body 302 and the signal line 140 (i.e. a distance between the second conductive portion 3022 and the signal line 140) is greater than a predetermined distance threshold, for example, the predetermined distance threshold may be greater thanIs beneficial to avoiding signal interference between the conductive body 302 and the signal line 140, improving signal transmission capability between the conductive body 302 and the pad body 301, and avoiding short circuit risk caused by contact between the conductive body 302 and the signal line 140.
Illustratively, as shown in fig. 2, the conductive body 302 may be a C-like semi-surrounding structure, the conductive body 302 includes a first C-type conductive body and a second C-type conductive body, the first C-type conductive body and the second C-type conductive body are disposed in a mirror symmetry manner outside the pad body 301, the first C-type conductive body and the second C-type conductive body form a surrounding area having an opening, the pad body 301 is disposed in the surrounding area, and the signal line 140 penetrates the opening of the surrounding area. In the extending direction parallel to the signal line 140, the length L10 of the first and second C-type conductive bodies is equal to or greater than the length L20 of the pad body 301 to enhance the signal transmission capability between the conductive body 302 and the pad body 301; in the extending direction perpendicular to the signal line 140, the minimum distance L30 between the conductive body 302 and the signal line 140 (i.e. the distance between the second conductive portion 3022 and the signal line 140) is greater than a predetermined distance threshold, for example, the predetermined distance threshold may be greater thanIs beneficial to avoiding the conductive body 302 and signalsSignal interference between the wires 140 improves the signal transmission capability between the conductive body 302 and the pad body 301, and avoids the risk of short circuit caused by contact of the conductive body 302 with the signal wires 140.
As shown in fig. 2 to 4 in combination, the first spacing L between the conductive body 302 and the pad body 301 satisfies the following formula one,
wherein Z is 0 Representing a preset impedance, Z represents an impedance of the pad body 301, and D represents a spacing between the two signal lines 140.
As shown in fig. 2 to 4, defining an extending direction parallel to the signal lines 140 as an X direction and a direction perpendicular to the signal lines 140 as a Y direction, in which a pitch between the two pad bodies 301 is equal to a pitch D between the two signal lines 140, the signal lines 140 have a first width W 1 The pad body 301 has a second width W 2 In the Z direction perpendicular to the substrate 110, the pad body 301 has a thickness T, the above parameters are substituted into the formula two shown below, the impedance Z of the pad body 301 is calculated,
wherein E is r Represents the dielectric constant of the dielectric layer 102, H represents the thickness of the dielectric layer 102, W 2 The width of the pad body 301 in the Y direction is represented, and T represents the thickness of the pad body 301 in the Z direction.
Specifically, in the preparation process of the package structure, after the dielectric layer 102 is determined, the dielectric constant E of the dielectric layer 102 can be obtained by a table look-up method r And the thickness H of the dielectric layer 102, the width W of the pad body 301 in the Y direction can be obtained by measurement 2 And the thickness T of the pad body 301 in the Z direction, substituting the above parameters into the formula two, and calculating to obtain the impedance Z of the pad body 301.
Further, according to signal transmissionThe impedance requirement of the link determines a preset impedance Z 0 Typically, the impedance Z is preset 0 Which may be 100 ohms or 50 ohms. Obtaining the distance D between the two signal lines 140 by measurement method, and presetting the impedance Z 0 The impedance Z of the pad body 301 and the distance D between the two signal lines 140 are substituted into formula one, and the value of the first distance L between the conductive body 302 and the pad body 301 is calculated.
Alternatively, the electronic component 120 may include an ac coupling capacitance.
In the present embodiment, as shown in fig. 2, the pad assembly 130 includes four pad bodies 301, and pins of the ac coupling capacitor are soldered to the pad bodies 301.
Illustratively, as shown in FIG. 2, the pad body 301 for soldering the AC coupling capacitor has a rectangular structure, defining an extending direction parallel to the signal line 140 as an X direction and a direction perpendicular to the signal line 140 as a Y direction, in which the second width W of the pad body 301 is 2 May be 22mil, the spacing D between the two pad bodies 301 is equal to the spacing between the two signal lines 140, D may be 18mil, the thickness T of the pad bodies 301 may be 1.6mil, the thickness H of the dielectric layer 102 may be 4.3mil, and W will be 2 22mil, d 18mil, t 1.6mil, h 4.3mil, and E r Substituting equation two, it is calculated that the impedance Z at the pad body 301 is equal to 47.41 ohms when the conductive body 302 is not provided.
The conductive body 302 is arranged according to the wiring structure, if the preset impedance Z of the signal transmission link is known 0 By measuring the distance D between the two signal lines 140, Z 0 The first spacing l=6 mil between the conductive body 302 and the pad body 301 is calculated by substituting z=47.41 ohms and D for equation one.
Therefore, the embodiment of the invention can set the conductive body around the bonding pad body 301 welded with the ac coupling capacitor, adjust the interval between the conductive body and the bonding pad body according to the preset impedance of the signal transmission link, realize quantitative control of the bonding pad impedance, be favorable for reducing the influence of the set ac coupling capacitor on the link impedance continuity, and improve the signal transmission effect.
The embodiment of the invention also provides a printed circuit board. Fig. 5 is a schematic structural view of a printed circuit board according to an embodiment of the present invention. As shown in fig. 5, the printed circuit board 02 includes the above-described package structure 01.
According to the printed circuit board provided by the embodiment of the invention, the packaging structure is provided, the conductive body is arranged around the bonding pad body, the conductive layer is hollowed out in the area corresponding to the bonding pad body, when an alternating current signal flows through the bonding pad body, the conductive body provides a reflux path for signal transmission, differential impedance exists between the conductive body and the bonding pad body, the impedance of the bonding pad assembly is increased, the problem that the impedance of a high-speed link at the bonding pad is discontinuous is solved, the impedance of the bonding pad can be accurately controlled by adjusting the interval between the conductive body and the bonding pad body, the continuity of the circuit impedance of the printed circuit board is facilitated to be improved, and the signal transmission effect is improved.
The embodiment of the invention also provides electronic equipment. Fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. As shown in fig. 6, the electronic device 03 includes the above-described printed circuit board 02.
According to the electronic equipment provided by the embodiment of the invention, the packaging structure is provided, the conductive body is arranged around the bonding pad body, the conductive layer is hollowed out in the area corresponding to the bonding pad body, when alternating current signals flow through the bonding pad body, the conductive body provides a reflux path for signal transmission, the impedance of the bonding pad assembly is increased, the problem that the impedance of a high-speed link is discontinuous at the bonding pad is solved, the impedance of the bonding pad can be accurately controlled by adjusting the interval between the conductive body and the bonding pad body, the continuity of the circuit impedance of the electronic equipment is improved, and the signal transmission effect is improved.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.

Claims (9)

1. A package structure for use in an ac link, the package structure comprising: the electronic component is an alternating current coupling capacitor, the bonding pad component comprises a bonding pad body and a conductive body which is arranged opposite to the bonding pad body, the conductive body is arranged on the periphery of the bonding pad body, a space interval is arranged between the conductive body and the bonding pad body, and the impedance of the bonding pad component can be equal to preset impedance through the arrangement of the space interval between the conductive body and the bonding pad body;
the electronic element is electrically connected with the bonding pad body, and the bonding pad body is connected with the corresponding signal wire;
the substrate comprises a conductive layer and a dielectric layer, wherein the dielectric layer is arranged between two adjacent conductive layers, the dielectric layer comprises a first dielectric layer, and the conductive layer comprises a first conductive layer;
the pad assembly and the signal wire are arranged on the outer surface of the first dielectric layer, the first conductive layer is arranged on one side, away from the pad assembly, of the first dielectric layer, a through hole is formed in the first dielectric layer, a conductive film is arranged on the inner wall surface forming the through hole, the conductive body is connected with the first conductive layer through the conductive film, and when an alternating current electric signal is transmitted to the corresponding pad body through the input end of the alternating current coupling capacitor, an induced electric signal can be generated in the conductive body, and the induced electric signal can be transmitted to the first conductive layer through the conductive film;
the conducting layer is provided with an opening structure, and the orthographic projection of the bonding pad body on the conducting layer is positioned in the opening structure.
2. The package structure according to claim 1, wherein the conductive body has a strip-like structure, and an extending direction of the conductive body is parallel to an extending direction of the signal line;
in the extending direction parallel to the signal line, the length of the conductive body is greater than or equal to the length of the bonding pad body.
3. The package structure of claim 1, wherein the conductive body is a semi-enclosed structure;
the length of the conductive body is greater than or equal to the length of the bonding pad body in the extending direction parallel to the signal line;
in the extending direction perpendicular to the signal line, the minimum distance between the conductive body and the signal line is larger than a preset distance threshold.
4. A package structure according to any one of claims 1-3, wherein a first distance L is provided between an edge of the conductive body on a side close to the pad body and an edge of the pad body on a side close to the conductive body.
5. A package structure according to any one of claims 1-3, wherein the orthographic projection of the conductive body on the conductive layer is located outside the opening structure.
6. The package structure of any one of claims 1-3, wherein the conductive body comprises a copper foil.
7. A package structure according to any one of claims 1-3, wherein the orthographic projection of the conductive body on the first conductive layer completely covers the orthographic projection of the via on the first conductive layer.
8. A printed circuit board comprising the package structure of any of claims 1-7.
9. An electronic device comprising the printed circuit board of claim 8.
CN202010423380.5A 2020-05-19 2020-05-19 Packaging structure, printed circuit board and electronic equipment Active CN113692104B (en)

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CN102300400A (en) * 2010-06-25 2011-12-28 智原科技股份有限公司 Circuit board structure with low capacitance
US8841560B1 (en) * 2010-11-17 2014-09-23 Dawn VME Products Backplane slot interconnection system, method and apparatus
CN204231747U (en) * 2014-12-09 2015-03-25 重庆蓝岸通讯技术有限公司 Chip-R pad structure in PCB circuit

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