CN113691699A

CN113691699A - Imaging chip assembly, camera module, focusing method of camera module and electronic equipment

Info

Publication number: CN113691699A
Application number: CN202110884745.9A
Authority: CN
Inventors: 范敦贵; 李华聪
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-08-02
Filing date: 2021-08-02
Publication date: 2021-11-23
Anticipated expiration: 2041-08-02
Also published as: CN113691699B

Abstract

The application discloses an imaging chip assembly, which comprises an imaging chip, a connecting substrate and a plurality of micro-motors; the imaging chip comprises a plurality of photosensitive units arranged in a matrix form; a plurality of the photosensitive units are disposed on one side of the connection substrate; the quantity of micromotors is the same as the quantity of photosensitive units, the micromotors are arranged on the other side of the connecting substrate, the power output ends of the micromotors are opposite to the photosensitive units one by one, and each micromotor pushes each corresponding photosensitive unit to move in the direction perpendicular to the connecting substrate through the power output ends. In this application, form the formation of image chip through setting up a plurality of sensitization units that are the matrix and arrange to set up micromotor under every sensitization unit, make every piece sensitization unit can adjust the position alone, make every position of formation of image chip can both realize focusing.

Description

Imaging chip assembly, camera module, focusing method of camera module and electronic equipment

Technical Field

The application belongs to the technical field of electronic equipment components, and particularly relates to an imaging chip component, a camera module, a focusing method of the camera module and electronic equipment.

Background

With the continuous development and progress of the technology level, most portable digital products are equipped with a camera function, and consumers have higher requirements on the image quality of the camera. At present, the majority of automatic focusing camera modules use voice coil motor drive camera lens to accomplish automatic focusing, and many electronic products begin to carry on the big base chip and obtain the high-quality image that luminance is better, noise level root number for clearer picture quality to bring better use experience for the consumer.

In the prior art, a large-bottom chip is often required to be matched with a lens with a larger diameter, the peripheral definition of the large-diameter lens is often poor, and particularly the peripheral blurring degree of a near focus is more serious. In addition, as the area of the large-bottom chip is larger and the flatness requirement is higher and higher, the field curvature problem caused by the unevenness can also cause the local blurring of the picture and the image quality of the shot image.

Disclosure of Invention

The present application is directed to an imaging chip assembly, a camera module, a focusing method of a camera module, and an electronic device, which at least solve one of the problems of the related art.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides an imaging chip assembly, including:

the imaging chip comprises a plurality of photosensitive units arranged in a matrix form;

a connection substrate on one side of which a plurality of the photosensitive units are disposed;

the quantity of micromotors is the same as that of the photosensitive units, the micromotors are arranged on the other side of the connecting substrate, the power output ends of the micromotors are opposite to the photosensitive units one by one, and the micromotors push the photosensitive units to correspond to each other through the power output ends and move in the direction perpendicular to the connecting substrate.

In a second aspect, an embodiment of the present application provides a camera module, including:

an optical lens, a driving assembly and the imaging chip assembly of the first aspect;

the imaging chip assembly is arranged at the imaging end of the optical lens, and the imaging chip is arranged on one side, close to the imaging end, of the connecting substrate and opposite to the optical lens;

the driving assembly is connected with the optical lens or the imaging chip and used for adjusting the distance between the optical lens and the imaging chip along the axial direction of the optical lens.

In a third aspect, an embodiment of the present application provides a focusing method for a camera module, which is applied to the camera module of the second aspect, the focusing method includes:

presetting a focusing standard, controlling the whole optical lens to be close to or far away from the imaging chip through a driving assembly, and executing focusing action on the imaging chip;

acquiring the number and the positions of the photosensitive units in the imaging chip, the imaging of which does not reach the focusing standard;

the micro motor pushes the photosensitive unit which is not up to the standard in imaging to move along the optical axis direction of the optical lens, so that the imaging of the photosensitive unit reaches the focusing standard.

In a fourth aspect, an embodiment of the present application provides an electronic device, including the camera module according to the second aspect of the claims.

In the embodiment of this application, the imaging chip includes a plurality of sensitization units that are the matrix and arrange, is provided with little motor with every sensitization unit relatively, and the power take off end of little motor can adjust every sensitization unit along the position of optical lens axis direction (the direction of perpendicular to connection substrate) to the module of making a video recording that makes this imaging chip subassembly can take out the clear photo of global focus.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic front view of an imaging chip having a plurality of photosensitive cells according to an embodiment of the present application;

FIG. 2 is a schematic top view of FIG. 1;

FIG. 3 is a schematic left side view of FIG. 1;

FIG. 4 is a schematic view of an imaging chip assembly according to an embodiment of the application.

Reference numerals:

1-an imaging chip; 11-a light-sensing unit; 2-a micro-motor; 21-a piezoelectric body; 22-a slide block; 23-a track; 24-a ball bearing; 3-connecting the substrates.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present disclosure.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The camera module generally comprises a lens assembly, a focusing motor and an image sensor, wherein when the camera module is used for shooting, the lens assembly is focused by the focusing motor, an image acquired by the focused lens assembly is converted into an electric signal by the image sensor to be output, and the shooting process is realized.

In order to obtain a high-quality image with higher brightness and better noise level, an image sensor is usually realized by adopting a large-bottom chip, but the large-bottom chip needs to be provided with a lens with a larger diameter, the peripheral definition of the large-diameter lens is poorer, and particularly the peripheral definition of a near-focus position is poorer; in addition, the large-sized chip is usually disposed on the circuit substrate, and due to the large size, if the circuit substrate or the large-sized chip is not flat, the problem of field curvature is caused, so that the obtained picture has a local blurring phenomenon.

In order to solve the above problems, the prior art adopts the method of improving the flatness of the circuit board or the outsole chip and improving the assembly process of the camera module, which greatly improves the production cost.

The following describes an image pickup module and an electronic apparatus according to an embodiment of the present application with reference to the drawings.

As shown in fig. 1-4, an imaging chip assembly is provided according to some embodiments of the present application, including an imaging chip 1, a connection substrate 3, and a plurality of micro-motors 2; the imaging chip 1 comprises a plurality of photosensitive units 11 arranged in a matrix form; a plurality of the photosensitive cells 11 are provided on one side of the connection substrate 3; the quantity of micromotor 2 with photosensitive unit 11's quantity is the same, and is a plurality of micromotor 2 sets up on the opposite side of connection substrate 3, every 2 micromotor's power take off end and every photosensitive unit 11 one-to-one, every 2 micromotor pass through power take off end promotes every corresponding photosensitive unit 11 is along the perpendicular to the direction of connection substrate 3 removes.

Specifically, in this embodiment, the imaging chip assembly can be directly applied to various conventional camera modules, after the camera module performs focusing, the entire matrix-type imaging chip 1 is at a focusing position, but due to the field curvature problem caused by the unevenness of the imaging chip 1 or the connection substrate 3, the area of the individual photosensitive unit 11 of the imaging chip 1 is not focused, at this time, detection can be performed by combining an auto-focusing algorithm in the camera module, if the area of one of the photosensitive units 11 in the imaging chip 1 is at an incomplete focusing position, the micro-motor 2 arranged opposite to the area can drive the photosensitive unit 11 to move along the optical lens axis direction through a power output end, the areas of different photosensitive units 11 have different back focuses, so as to implement a focusing process, so that each photosensitive unit 11 of the entire imaging chip 1 is at a precise focusing position, at this point a clear picture of the global focus can be taken (see fig. 4). The micro motor 2, i.e. a micro motor, has a wide variety of options, such as piezoelectric type and giant magnetostrictive type, and can be specifically selected according to the specific structure and form of the camera module.

In the present embodiment, the imaging chip 1 includes a plurality of photosensitive cells 11 arranged in a matrix form (see fig. 1 to 3), a micro-motor 2 is disposed opposite to each photosensitive unit 11 (as shown in fig. 4, only one photosensitive unit is illustrated corresponding to one micro-motor 2; in addition, for convenience of understanding, the small blocks illustrated on each photosensitive unit can be understood as a plurality of pixel blocks on the photosensitive unit), the power output end of the micro-motor 2 can adjust the position of each photosensitive unit 11 along the axial direction of the optical lens, so that the camera module focuses through the optical lens or the imaging chip 1, and then pushes the photosensitive units 11 through the micro-motor 2 to perform secondary focusing, and finally the purpose that each photosensitive unit 11 can accurately focus is realized, therefore, in the camera module with the large-bottom chip, a globally focused clear picture can be shot.

Meanwhile, the rear focuses of the photosensitive units 11 in different areas are changed by the micro motor 2, so that the defect problems caused by warping of a large-bottom chip, warping of the connecting substrate 3 and local dropping points of the large-diameter optical lens are solved, the requirement on the flatness of the connecting substrate 3 is lowered, and the lens with the local dropping points can be covered to a certain extent, so that the requirement on the optical lens can be properly lowered, the yield of secondary materials can be improved by lowering the requirement on the secondary materials (the connecting substrate 3 and the optical lens), and the production cost is lowered.

Alternatively, the micro-motors 2 are piezoelectric motors, and the power output end of each piezoelectric motor is a piezoelectric body 21.

Specifically, the piezoelectric motor, i.e., the ultrasonic motor, is an electric motor device that performs electromechanical energy conversion by utilizing the piezoelectric reverse effect of the piezoelectric body 21. In general, the piezoelectric body 21 has low energy conversion efficiency and small amplitude of vibration or expansion and contraction, and creep with small displacement can be obtained. In this application, the module of making a video recording is after realizing focusing operation, and the whole majority of formation of image chip 1 all is in the position of focusing, and only individual sensitization unit 11 region is in the position of not focusing, and at this moment, only need little displacement alright make it be in the state of focusing, consequently, adopt piezoelectric motor as driving piece promotion not focused sensitization unit 11 to realize the state of focusing, its degree of accuracy is higher to easy control. In addition, the strip-shaped piezoelectric body 21 of the piezoelectric motor can be directly used as a power output end, so that the transmission efficiency of the micromotor 2 is improved.

Alternatively, as shown in fig. 4, each of the piezoelectric motors further includes a slider 22 and a slide rail, one end of the slider 22 is in frictional contact with the piezoelectric body 21, and the other end of the slider 22 is opposite to the photosensitive unit 11; the piezoelectric body 21 can push the slider 22 to move back and forth in the sliding rail under the action of voltage.

Specifically, in this embodiment, the slider 22 is disposed on the slide rail as the power output end of the micro-motor 2, one end of the slider is opposite to the photosensitive unit 11, and the other end of the slider is in friction contact with the piezoelectric body 21, so that the piezoelectric body 21 is deformed by stretching under the action of voltage, and the slider 22 can move up and down in the slide rail to push the photosensitive unit 11 to move along the axial direction of the optical lens, thereby implementing the focusing process. By using the slider 22 as a power output end, the voltage of the piezoelectric body 21 can be prevented from being transmitted to the photosensitive unit 11 after being electrified, and the imaging function of the chip can be prevented from being disturbed.

Alternatively, as shown in fig. 4, the slide rail includes a ball 24 and a rail 23, and the slider 22 moves back and forth in the rail 23 through the ball 24.

Specifically, the slide rail comprises the ball 24 and the rail 23, the slide rail is simple in structure, and when the slide 22 moves in the slide rail through the ball 24, friction is small, so that the transmission efficiency of the piezoelectric motor can be improved.

Alternatively, the piezoelectric body 21 is a piezoelectric ceramic.

Specifically, the piezoelectric ceramic is a ceramic material which can convert mechanical energy and electric energy into each other, and the amount of deformation generated by the piezoelectric ceramic under the action of an electric field is small and is not more than one ten million of the size of the piezoelectric ceramic at most, so that when the piezoelectric ceramic pushes the dynamic light unit 11 to move under the action of voltage, the displacement can be small, and accurate focusing is realized.

Optionally, the connection substrate 3 is a flexible circuit board or a rigid-flex board.

Specifically, a Flexible Printed Circuit (FPC) is a highly reliable and flexible printed circuit made of mylar or polyimide as a base material, and is formed on a thin and light flexible plastic sheet to form a flexible circuit. The circuit can be bent at will, is light in weight, small in size, good in heat dissipation and convenient to install, and in the embodiment, the flexible circuit board is adopted, so that the imaging chip 1 and other components can be conveniently installed, and in addition, due to the characteristic of easy bending, the micromotor 2 is easier to realize when the photosensitive unit 11 is pushed.

The soft and hard combined board is a flexible circuit board and a hard circuit board, and is combined together according to relevant process requirements through procedures such as pressing and the like to form a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, on one hand, the circuit board has the PCB characteristics and is convenient for fixing the imaging chip 1, the imaging chip 1 is prevented from moving relative to the micromotor 2 along with the connecting substrate 3, the focusing accuracy is improved, on the other hand, the FPC characteristics are provided, the micromotor 2 is convenient for pushing the photosensitive unit 11 to move for focusing, and the focusing efficiency of the photosensitive unit 11 is improved.

The application also provides a camera module which comprises an optical lens, a driving component and any one imaging chip component in the embodiment; the imaging chip assembly is arranged at the imaging end of the optical lens, and the imaging chip 1 is arranged on one side, close to the imaging end, of the connecting substrate 3 and is opposite to the optical lens; the driving component is connected with the optical lens or the imaging chip 1, and the driving component is used for adjusting the distance between the optical lens and the imaging chip 1 along the axial direction of the optical lens.

Specifically, in the present embodiment, the imaging chip 1 serves as an image sensor for receiving image information generated by the optical lens, converting an optical signal of the image information into an electrical signal, and transmitting the electrical signal to a circuit of the image capturing module. The connection substrate 3 is disposed at an imaging end of the optical lens so that image information generated by the optical lens can fall on the imaging chip 1. The connection substrate 3 is a circuit board of the camera module, and can be connected with a mainboard or a control system of an external electronic product, so that an electric signal converted by the imaging chip 1 can be transmitted through the connection substrate 3. When taking a picture, the driving component can adjust the distance between the optical lens and the imaging chip 1 along the axial direction of the optical lens by driving the optical lens or the imaging chip 1 to move, so that most of image information acquired by the optical lens can be accurately projected on the imaging chip 1, and the focusing process is realized. The driving component may be a piezoelectric motor or an electromagnetic motor, and may be specifically selected according to the form of a component such as an optical lens, which is not limited in the present application.

By adopting the camera module in the embodiment, secondary focusing adjustment can be performed on the local unfocused position by adjusting the position of the photosensitive unit 11 after focusing, so that the area with unclear imaging can be imaged clearly, the finally shot image is clearer, and the problem of unclear local image caused by the adoption of a conventional large-size imaging chip (image sensor) of the camera module is avoided. In the present embodiment, the movement of each corresponding photosensitive unit 11 in the direction perpendicular to the connection substrate may mean the movement in the optical lens axis direction. In addition, in the production process of the camera module, the focusing precision requirement of a module factory can also reduce the labor cost, thereby being beneficial to improving the product yield and the production efficiency and reducing the production cost; after the precision requirement of the camera module is reduced, the focusing equipment has more optional spaces, and the equipment cost can be indirectly reduced.

Alternatively, as shown in fig. 4, the driving assembly is connected to the optical lens, and the relative positions of the micro-motor 2 and the connection substrate 3 are fixed.

Specifically, the driving assembly is connected to the optical lens, that is, the driving assembly can adjust the distance between the optical lens and the imaging chip 1 by driving the optical lens to move along the axial direction thereof during focusing. In this embodiment, each photosensitive unit 11 of the imaging chip 1 is in one-to-one correspondence with the plurality of micro motors 2, and the photosensitive units 11 are disposed on the connection substrate 3, so that the positions of the micro motors 2 and the connection substrate 3 are relatively fixed, and after the driving assembly focuses, the positions of the photosensitive units 11 relative to the micro motors 2 are also relatively fixed, thereby avoiding the deviation when the micro motors 2 push the unfocused photosensitive units 11 to focus due to the position deviation of the connection substrate 3 after focusing, and further improving the focusing accuracy.

Wherein the drive assembly may be an electromagnetic motor. An electromagnetic motor is a motor device which realizes electric energy conversion or transmission according to an electromagnetic induction law. In the present embodiment, when the electromagnetic motor is used to drive the optical lens or the imaging chip 1, the focusing speed is fast and the noise is low.

The application also provides a focusing method of the camera module, which is applied to the camera module in the embodiment, and the focusing method comprises the following steps:

firstly, setting a focusing standard in advance, controlling the whole optical lens to be close to or far away from the imaging chip through a driving assembly, and executing focusing action on the imaging chip;

secondly, acquiring the number and the positions of the photosensitive units in the imaging chip, the images of which do not reach the focusing standard;

thirdly, the micromotor pushes the photosensitive unit which is not up to the standard to move along the optical axis direction of the optical lens, so that the imaging of the photosensitive unit reaches the focusing standard.

Specifically, in this embodiment, the driving component may be connected to the optical lens and may also be connected to the imaging chip 1, that is, the driving component may move by adjusting the optical lens, and may also adjust the distance between the two by adjusting the movement of the imaging chip 1, so as to implement the process of global focusing; after focusing is finished, the positions and the number of the individual photosensitive units 11 in the photosensitive units 11, of which the images do not reach the focusing standard, are obtained, wherein the obtaining method can obtain the positions and the number through various algorithms, and can also obtain the positions and the number through analyzing the current imaging information on the chip, which is not limited herein. After the information is obtained, because the micro-motor 2 is correspondingly arranged below each photosensitive unit 11, the micro-motor 2 below the photosensitive unit 11 which does not reach the focusing standard is imaged, and the power output end of the micro-motor 2 pushes the photosensitive unit 11 which does not reach the focusing standard to move to the focusing position.

The whole focusing method is simple and easy to operate, and secondary focusing can be performed on unclear areas on the imaging chip 1, so that finally obtained image information is clear in each imaging area. In the above embodiment, whether each photosensitive unit 11 is focused or not may be determined by determining the imaging sharpness of each photosensitive unit 11, and the imaging sharpness of the photosensitive unit 11 may be the same as the algorithm in the first focusing, which is not limited in this application. The moving distance of the photosensitive unit 11 which has not reached the focusing standard can be determined by comparing the distance between the photosensitive unit 11 which has not reached the focusing standard and the photosensitive unit 11 which has reached the focusing standard, and after the distance which needs to be moved of the photosensitive unit 11 which has not reached the focusing standard is determined, the micromotor 2 corresponding to the photosensitive unit 11 which has not reached the focusing standard drives the photosensitive unit to move to a focusing position, wherein the focusing position is located on the same plane with the photosensitive unit 11 which has reached the focusing standard, so that the global focusing is realized.

The application also provides an electronic device comprising the camera module in any of the above embodiments.

Specifically, the electronic product in the present application is not limited to a mobile phone, a computer, a personal game machine, a digital camera, and the like, and any electronic device that can be equipped with a camera shooting function can adopt the camera shooting module in this embodiment. By adopting the electronic equipment with the camera module, the quality of the shot picture is clearer; in addition, when the electronic equipment adopts a large-bottom chip as the imaging chip 1, the situation of fuzzy periphery generated by a picture shot by a large-diameter lens can be improved; because the requirement on secondary materials is reduced, the production efficiency is improved, and the production cost is reduced.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An imaging chip assembly, comprising:

the imaging chip (1), the imaging chip (1) comprises a plurality of photosensitive units (11) arranged in a matrix form;

a connection substrate (3), a plurality of the photosensitive units (11) being disposed on one side of the connection substrate (3);

a plurality of micromotors (2), the quantity of micromotor (2) with the quantity of sensitization unit (11) is the same, and is a plurality of micromotor (2) set up on the opposite side of connecting substrate (3), every the power take off end and every of micromotor (2) sensitization unit (11) one-to-one, every micromotor (2) pass through power take off end promotes every and corresponds sensitization unit (11) are followed the perpendicular to the direction of connecting substrate (3) is removed.

2. An imaging chip assembly according to claim 1, characterized in that said micromotors (2) are piezoelectric motors, the power output of each of which is a piezoelectric body (21).

3. An imaging chip assembly according to claim 2, wherein each of said piezo motors further comprises a slider (22) and a slide rail, one end of said slider (22) is in frictional contact with said piezo (21), the other end of said slider (22) is opposite to said photo-sensing unit (11), and said piezo (21) is capable of pushing said slider (22) to move back and forth in said slide rail under the action of a voltage.

4. An imaging chip assembly according to claim 3, characterized in that the slide comprises a ball (24) and a track (23), the slide (22) being moved back and forth in the track (23) by the ball (24).

5. An imaging chip assembly according to claim 2, characterized in that said piezoelectric body (21) is a piezoelectric ceramic.

6. An imaging chip assembly according to claim 1, characterized in that said connection substrate (3) is a flexible circuit board or a rigid-flex board.

7. The utility model provides a module of making a video recording which characterized in that includes:

an optical lens, a driving assembly and an imaging chip assembly according to any one of claims 1 to 6;

the imaging chip assembly is arranged at the imaging end of the optical lens, and the imaging chip (1) is arranged on one side, close to the imaging end, of the connecting substrate (3) and is opposite to the optical lens;

the driving assembly is connected with the optical lens or the imaging chip (1), and the driving assembly is used for adjusting the distance between the optical lens and the imaging chip (1) along the axial direction of the optical lens.

8. The camera module according to claim 7, characterized in that said driving assembly is connected to said optical lens, and the relative positions of said plurality of micro-motors (2) and said connection substrate (3) are fixed.

9. A focusing method for a camera module according to claim 7 or 8, the focusing method comprising:

presetting a focusing standard, controlling the whole optical lens to be close to or far away from the imaging chip (1) through a driving assembly, and executing focusing action on the imaging chip (1);

acquiring the number and the positions of the photosensitive units (11) which do not reach the focusing standard in the imaging chip (1);

through micromotor (2) promote formation of image and do not reach the standard sensitization unit (11) are followed optical lens's optical axis direction removes to make the formation of image of sensitization unit (11) reach the standard of focusing.

10. The method of claim 9, wherein the focusing criterion is the imaging sharpness of the photosensitive unit (11).

11. The focusing method of the camera module according to claim 9, wherein the distance that the photosensitive unit (11) that has not reached the focusing standard needs to be moved is determined by comparing the distance between the photosensitive unit (11) that has not reached the focusing standard and the photosensitive unit (11) that has reached the focusing standard.

12. An electronic apparatus, characterized by comprising the camera module of claim 7 or 8.