CN113691699B

CN113691699B - Imaging chip assembly, camera module, focusing method of camera module and electronic equipment

Info

Publication number: CN113691699B
Application number: CN202110884745.9A
Authority: CN
Inventors: 范敦贵; 李华聪
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-08-02
Filing date: 2021-08-02
Publication date: 2023-06-20
Anticipated expiration: 2041-08-02
Also published as: CN113691699A

Abstract

The application discloses an imaging chip assembly, which comprises an imaging chip, a connecting substrate and a plurality of micro motors; the imaging chip comprises a plurality of photosensitive units which are arranged in a matrix; a plurality of the photosensitive units are arranged on one side of the connection substrate; the number of the micro motors is the same as that of the photosensitive units, a plurality of the micro motors are arranged on the other side of the connecting substrate, the power output ends of the micro motors are opposite to the photosensitive units one by one, and the micro motors push the photosensitive units to move along the direction perpendicular to the connecting substrate. In the application, the imaging chip is formed by arranging a plurality of photosensitive units which are arranged in a matrix, and a micro motor is arranged under each photosensitive unit, so that each photosensitive unit can be independently adjusted in position, and each position of the imaging chip can be focused.

Description

Imaging chip assembly, camera module, focusing method of camera module and electronic equipment

Technical Field

The application belongs to the technical field of electronic equipment components, and particularly relates to an imaging chip component, a camera module, a focusing method of the camera module and electronic equipment.

Background

With the continuous development and progress of the technology level, most portable digital products are equipped with a camera function, and consumers have higher requirements on the quality of the photographed images. At present, most of automatic focusing camera modules use voice coil motors to drive lenses to complete automatic focusing, and many electronic products begin to carry outsole chips for clearer image quality so as to obtain high-quality images with better brightness and noise level root numbers, so that better use experience is brought to consumers.

In the prior art, the outsole chip is often matched with a lens with a larger diameter, and the definition of the periphery of the lens with the larger diameter is often poorer, and especially the peripheral blurring degree of near focus is more serious. In addition, as the area of the outsole chip is larger, the flatness requirement is higher and higher, and the field curvature problem caused by the unevenness can also cause local blurring of a photo and the image shooting image quality.

Disclosure of Invention

The application aims to provide an imaging chip assembly, a camera module, a focusing method of the camera module and electronic equipment, and at least one of the problems in the background technology is solved.

In order to solve the technical problems, the application is realized as follows:

in a first aspect, an embodiment of the present application proposes an imaging chip assembly, including:

the imaging chip comprises a plurality of photosensitive units which are arranged in a matrix;

a connection substrate on one side of which a plurality of the photosensitive units are disposed;

the micro motors are the same as the photosensitive units in number, the micro motors are arranged on the other side of the connecting substrate, the power output ends of the micro motors are opposite to the photosensitive units one by one, and the micro motors push the photosensitive units to move along the direction perpendicular to the connecting substrate.

In a second aspect, an embodiment of the present application provides a camera module, including:

an optical lens, a driving assembly and the imaging chip assembly of the first aspect;

the imaging chip component is arranged at the imaging end of the optical lens, and the imaging chip is arranged on one side of the connecting substrate close to the imaging end and is opposite to the optical lens;

the driving component is connected with the optical lens or the imaging chip and is used for adjusting the distance between the optical lens and the imaging chip along the axial direction of the optical lens.

In a third aspect, an embodiment of the present application provides a focusing method of an image capturing module, which is applied to the image capturing module in the second aspect, where the focusing method includes:

presetting a focusing standard, controlling the whole optical lens to be close to or far away from the imaging chip through a driving assembly, and executing focusing action on the imaging chip;

acquiring the number and positions of photosensitive units which are imaged in the imaging chip and do not reach the focusing standard;

and pushing the photosensitive unit with the imaging failing to reach the standard to move along the optical axis direction of the optical lens by the micro motor so as to enable the imaging of the photosensitive unit to reach the focusing standard.

In a fourth aspect, an embodiment of the present application provides an electronic device, including an imaging module set in the second aspect.

In the embodiment of the application, the imaging chip comprises a plurality of photosensitive units which are arranged in a matrix, a micro motor is arranged opposite to each photosensitive unit, and the power output end of the micro motor can adjust the position of each photosensitive unit along the axial direction (the direction perpendicular to the connecting substrate) of the optical lens, so that a clear picture in global focusing can be taken by the camera module adopting the imaging chip assembly.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, wherein:

FIG. 1 is a schematic front view of an imaging chip having a plurality of photosensitive cells according to an embodiment of the present application;

FIG. 2 is a schematic top view of FIG. 1;

FIG. 3 is a left side schematic view of FIG. 1;

fig. 4 is a schematic diagram of an imaging chip assembly according to an embodiment of the present application.

Reference numerals:

1-an imaging chip; 11-a photosensitive unit; 2-a micro motor; 21-a piezoelectric body; 22-slide block; 23-track; 24-balls; 3-connection substrate.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functionality throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application are within the scope of the protection of the present application.

The features of the terms "first", "second", and the like in the description and in the claims of this application may be used for descriptive or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

The camera module generally comprises a lens assembly, a focusing motor and an image sensor, when shooting is performed, the lens assembly is focused through the focusing motor, and an image acquired by the lens assembly after focusing can be converted into an electric signal through the image sensor to be output, so that a shooting process is realized.

In order to obtain a high-quality image with higher brightness and better noise level, an image sensor is usually realized by adopting an outsole chip, but the outsole chip is required to be provided with a lens with a larger diameter, the surrounding definition of the lens with the larger diameter is poorer, and especially the surrounding definition at a near-focus position is poorer; in addition, the outsole chip is generally arranged on the circuit substrate, and the circuit substrate or the outsole chip can cause a field curvature problem if uneven due to large size, so that the acquired picture can be locally blurred.

In order to solve the above problems, the prior art adopts to improve the flatness of the circuit substrate or the outsole chip and to improve the assembly process of the camera module, which greatly improves the production cost.

An image capturing module and an electronic apparatus according to an embodiment of the present application are described below with reference to the accompanying drawings.

As shown in fig. 1 to 4, there is provided an imaging chip assembly according to some embodiments of the present application, including an imaging chip 1, a connection substrate 3, and a plurality of micro motors 2; the imaging chip 1 comprises a plurality of photosensitive units 11 which are arranged in a matrix; a plurality of the photosensitive cells 11 are provided on one side of the connection substrate 3; the number of the micro-motors 2 is the same as that of the photosensitive units 11, a plurality of the micro-motors 2 are arranged on the other side of the connecting substrate 3, the power output ends of the micro-motors 2 are opposite to the photosensitive units 11 one by one, and the micro-motors 2 push the photosensitive units 11 to move along the direction perpendicular to the connecting substrate 3.

Specifically, in this embodiment, the imaging chip assembly may be directly applied to various conventional imaging modules, after the imaging module performs focusing, the whole matrix imaging chip 1 is located at a focusing position, but because of field curvature problem caused by the unevenness of the imaging chip 1 or the connection substrate 3, the area of the individual photosensitive units 11 of the imaging chip 1 is not focused, at this time, detection may be combined with an autofocus algorithm in the imaging module, if the area of one of the photosensitive units 11 in the imaging chip 1 is located at an incompletely focusing position, the micro motor 2 disposed opposite to the imaging chip 1 may drive the photosensitive units 11 at this point to move along the axial direction of the optical lens through the power output end, and the areas of the different photosensitive units 11 have different back focuses, so that a focusing process is implemented, so that each photosensitive unit 11 of the whole imaging chip 1 is located at a precisely focusing position, and at this time, a clear picture of global focusing may be taken (refer to fig. 4). Among them, the micro motor 2, that is, a micro motor, has a variety of selectable types, such as a piezoelectric type, a giant magnetostrictive type, and the like, and can be specifically selected according to the specific structure and form of the camera module.

In this embodiment, the imaging chip 1 includes a plurality of photosensitive units 11 (as shown in fig. 1 to 3) arranged in a matrix, and a micro motor 2 is disposed opposite to each photosensitive unit 11 (as shown in fig. 4, only one of the photosensitive units corresponds to one micro motor 2 is shown, and in addition, for convenience of understanding, a small square on each photosensitive unit is shown and can be understood as a plurality of pixel blocks on the photosensitive unit), the position of each photosensitive unit 11 along the axial direction of the optical lens can be adjusted by the power output end of the micro motor 2, so that after the imaging module focuses through the optical lens or the imaging chip 1, the micro motor 2 pushes the photosensitive unit 11 to perform secondary focusing, and finally, the purpose that each photosensitive unit 11 can perform accurate focusing is achieved, and a clear picture focused globally can be taken in the imaging module equipped with a large-bottom chip.

Meanwhile, as the micro motor 2 is adopted to change the back focus of the photosensitive unit 11 in different areas, the defect problems caused by the warpage of the outsole chip, the warpage of the connecting substrate 3 and the local drop of the large-diameter optical lens are solved, the flatness requirement on the connecting substrate 3 is reduced, the lens with the local drop can be covered to a certain extent, the requirement on the optical lens can be properly reduced, the yield of the secondary material can be improved by reducing the requirements on the secondary material (the connecting substrate 3 and the optical lens), and the production cost is reduced.

Alternatively, the micro-motors 2 are piezoelectric motors, and the power output end of each piezoelectric motor is a piezoelectric body 21.

Specifically, the piezoelectric motor, that is, the ultrasonic motor is a motor device that converts electromechanical energy by utilizing the piezoelectric inverse effect of the piezoelectric body 21. In general, the piezoelectric body 21 has relatively low energy conversion efficiency, and relatively small amplitude of vibration or expansion and contraction, so that creep with minute displacement can be obtained. In this application, after focusing operation is implemented, most of the imaging chip 1 is in the focusing position, and only the area of the individual photosensitive unit 11 is in the unfocused position, at this time, only a small displacement is required to enable the imaging module to be in the focusing state, so that the piezoelectric motor is used as a driving member to push the unfocused photosensitive unit 11 to implement the focusing state, and the accuracy is higher and the control is easy. In addition, the strip-shaped piezoelectric body 21 of the piezoelectric motor can be directly used as a power output end, so that the transmission efficiency of the micro-motor 2 is improved.

Alternatively, as shown in fig. 4, each of the piezoelectric motors further includes a slider 22 and a slide rail, one end of the slider 22 is in frictional contact with the piezoelectric body 21, and the other end of the slider 22 is opposite to the photosensitive unit 11; the piezoelectric body 21 can push the sliding block 22 to move back and forth in the sliding rail under the action of voltage.

Specifically, in the present embodiment, the slider 22 is disposed on the slide rail as the power output end of the micro motor 2, and one end is opposite to the photosensitive unit 11, and the other end is in friction contact with the piezoelectric body 21, and the piezoelectric body 21 is deformed in a stretching manner under the action of voltage, so that the slider 22 can move up and down in the slide rail, and the photosensitive unit 11 is pushed to move along the axial direction of the optical lens, so as to implement the focusing process. By using the slider 22 as a power output end, the voltage of the piezoelectric body 21 is prevented from being transmitted to the photosensitive unit 11 after the piezoelectric body is electrified, and the imaging function of the chip is prevented from being interfered.

Alternatively, as shown in fig. 4, the slide rail includes a ball 24 and a rail 23, and the slider 22 moves back and forth in the rail 23 through the ball 24.

Specifically, the sliding rail comprises the balls 24 and the rails 23, the sliding rail is simple in structural form, and when the sliding block 22 moves in the sliding rail through the balls 24, the friction force is small, so that the transmission efficiency of the piezoelectric motor can be improved.

Alternatively, the piezoelectric body 21 is a piezoelectric ceramic.

Specifically, the piezoelectric ceramic is a ceramic material capable of mutually converting mechanical energy and electric energy, and the deformation amount generated by the piezoelectric ceramic under the action of an electric field is very small and is not more than one ten million times of the size of the piezoelectric ceramic, so that the displacement amount can be very small when the piezoelectric ceramic pushes the photosensitive unit 11 to move under the action of voltage, and accurate focusing is realized.

Optionally, the connection substrate 3 is a flexible circuit board or a rigid-flex board.

Specifically, a flexible circuit board (FPC) is a printed circuit made of a polyester film or polyimide as a base material, which has high reliability and excellent flexibility, and is formed into a flexible circuit by being formed on a thin plastic sheet which is flexible and thin. The circuit can be bent at will, has light folding weight, small volume, good heat dissipation and convenient installation, and in the embodiment, the flexible circuit board is adopted to not only facilitate the installation of the imaging chip 1 and other components, but also facilitate the realization of the micro motor 2 when pushing the photosensitive unit 11 due to the characteristic of easy bending.

The soft and hard combined board is a circuit board which is formed by combining a flexible circuit board and a hard circuit board together according to related technological requirements through pressing and other procedures, has the characteristics of an FPC (flexible printed Circuit) and a PCB (printed Circuit Board), is convenient for fixing the imaging chip 1 due to the characteristics of the PCB, prevents the imaging chip 1 from moving relative to the micro motor 2 along with the connecting substrate 3, improves the focusing accuracy, and has the characteristics of the FPC, so that the micro motor 2 can push the photosensitive unit 11 to move and focus, and the focusing efficiency of the photosensitive unit 11 is improved.

The application also provides a camera module, which comprises an optical lens, a driving assembly and any one of the imaging chip assemblies in the embodiment; the imaging chip component is arranged at the imaging end of the optical lens, and the imaging chip 1 is arranged on one side of the connecting substrate 3 close to the imaging end and is opposite to the optical lens; the driving component is connected with the optical lens or the imaging chip 1 and is used for adjusting the distance between the optical lens and the imaging chip 1 along the axial direction of the optical lens.

Specifically, in the present embodiment, the imaging chip 1 is used as an image sensor, and is configured to receive image information generated by the optical lens, convert an optical signal of the image information into an electrical signal, and transmit the electrical signal to a circuit of the image capturing module. The connection substrate 3 is disposed at the imaging end of the optical lens so that image information generated by the optical lens can fall on the imaging chip 1. The connection substrate 3 is a circuit board of the camera module, and can be connected with a main board or a control system of an external electronic product, so that the electric signals converted by the imaging chip 1 can be transmitted through the connection substrate 3. When photographing, the driving component can adjust the distance between the optical lens and the imaging chip 1 along the axial direction of the optical lens by driving the optical lens or the imaging chip 1 to move, so that the image information acquired by the optical lens can be mostly and accurately projected on the imaging chip 1, and the focusing process is realized. The driving component may be a piezoelectric motor, an electromagnetic motor, or the like, and may be specifically selected according to the form of components such as an optical lens, which is not limited in the present application.

By adopting the camera module in the embodiment, the secondary focusing adjustment can be carried out on the local unfocused position by adjusting the position of the photosensitive unit 11 after focusing, so that an area with unclear imaging is clearly imaged, the finally shot image is clearer, and the problem of unclear local image caused by adopting a conventional large-size imaging chip (image sensor) for the camera module is avoided. In this embodiment, each corresponding photosensitive unit 11 moves in a direction perpendicular to the connection substrate, that is, in the direction of the optical lens axis. In addition, in the production process of the camera module, the requirement on focusing precision of a module factory can also reduce the labor cost, thereby being beneficial to improving the product yield and the production efficiency and reducing the production cost; after the precision requirement of the camera module is reduced, the focusing equipment has more optional spaces, and the equipment cost can be indirectly reduced.

Alternatively, as shown in fig. 4, the driving assembly is connected to the optical lens, and the relative positions of the micro motor 2 and the connection substrate 3 are fixed.

Specifically, the driving assembly is connected to the optical lens, that is, the driving assembly can adjust the distance between the optical lens and the imaging chip 1 by driving the optical lens to move in the axial direction thereof during focusing. In this embodiment, each photosensitive unit 11 of the imaging chip 1 is opposite to the plurality of micro-motors 2 one by one, and the photosensitive units 11 are disposed on the connection substrate 3, so that the positions of the micro-motors 2 and the connection substrate 3 are relatively fixed, and the positions of the photosensitive units 11 relative to the micro-motors 2 are relatively fixed after focusing by the driving assembly, so that deviation when the micro-motors 2 push the unfocused photosensitive units 11 to focus due to the position deviation of the connection substrate 3 after focusing can be avoided, and focusing accuracy is further improved.

Wherein the drive assembly may be an electromagnetic motor. An electromagnetic motor is a motor device for converting or transmitting electric energy according to the law of electromagnetic induction. In the present embodiment, when the optical lens or the imaging chip 1 is driven by the electromagnetic motor, the focusing speed is high and the noise is low.

The application also provides a focusing method of the camera module, which is applied to the camera module in the embodiment, and the focusing method comprises the following steps:

firstly, presetting a focusing standard, controlling the whole optical lens to be close to or far away from the imaging chip through a driving assembly, and executing focusing action on the imaging chip;

secondly, acquiring the number and positions of photosensitive units which are imaged in the imaging chip and do not reach the focusing standard;

thirdly, pushing the photosensitive unit with the imaging failing to reach the standard to move along the optical axis direction of the optical lens by the micro motor so as to enable the imaging of the photosensitive unit to reach the focusing standard.

Specifically, in this embodiment, the driving component may be connected to the optical lens or may be connected to the imaging chip 1, that is, the driving component may adjust the movement of the optical lens, or may adjust the distance between the two by adjusting the movement of the imaging chip 1, so as to implement the global focusing process; after focusing is finished, the positions and the number of the individual photosensitive units 11 which are imaged in the photosensitive units 11 and do not reach the focusing standard are obtained, wherein the obtaining method can be obtained through various algorithms, and can also be obtained through analyzing the current imaging information on the chip, and the application is not limited herein. After the information is acquired, as the micro motor 2 is correspondingly arranged below each photosensitive unit 11, the power output end of the micro motor 2 below the photosensitive unit 11 which does not reach the focusing standard is pushed to move to the focusing position.

The whole focusing method is simple and easy to operate, and secondary focusing can be carried out on the unclear region on the imaging chip 1, so that the finally acquired image information is clear in each imaging region. In the above embodiment, whether or not each of the photosensitive units 11 is focused may be confirmed by judging the imaging definition of each of the photosensitive units 11, and the imaging definition of the photosensitive unit 11 may be the same as the algorithm at the time of first focusing, which is not limited in this application. The moving distance of the photosensitive unit 11 which is imaged and does not reach the focusing standard can be determined by comparing the distance between the photosensitive unit 11 which is imaged and does not reach the focusing standard with the distance between the photosensitive unit 11 which is imaged and does not reach the focusing standard, and after the distance that the photosensitive unit 11 which is not imaged and does not reach the focusing standard is determined, the micro motor 2 corresponding to the photosensitive unit 11 which is not imaged and does not reach the focusing standard drives the micro motor to move to the focusing position, namely, the focusing position and the photosensitive unit 11 which is imaged and does not reach the focusing standard are positioned on the same plane, so that global focusing is realized.

The application also provides electronic equipment, which comprises the camera module set in any embodiment.

Specifically, the electronic product in the application is not limited to a mobile phone, a computer, a personal game machine, a digital camera, and the like, and any electronic device capable of being equipped with a camera function can use the camera module in the embodiment. The electronic equipment adopting the camera module can be used for shooting the picture with clearer quality; in addition, when the electronic equipment adopts the outsole chip as the imaging chip 1, the condition of peripheral blurring generated by a photo shot by a large-diameter lens can be improved; the requirement on secondary materials is reduced, so that the production efficiency is improved, and the production cost is reduced.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An imaging chip assembly, comprising:

an imaging chip (1), wherein the imaging chip (1) comprises a plurality of photosensitive units (11) which are arranged in a matrix;

a connection substrate (3), a plurality of the photosensitive units (11) being provided on one side of the connection substrate (3);

the micro-motors (2) are the same in number as the photosensitive units (11), the micro-motors (2) are arranged on the other side of the connecting substrate (3), the power output ends of the micro-motors (2) are opposite to the photosensitive units (11), and the micro-motors (2) push the photosensitive units (11) to move along the direction perpendicular to the connecting substrate (3) through the power output ends, so that the photosensitive units (11) can be in a focusing position.

2. An imaging chip assembly according to claim 1, characterized in that the micro-motors (2) are piezo motors, the power output of each of which is a piezo body (21).

3. An imaging chip assembly according to claim 2, wherein each of said piezo motors further comprises a slider (22) and a slide rail, one end of said slider (22) being in frictional contact with said piezo-element (21), the other end of said slider (22) being opposite to said photosensitive element (11), said piezo-element (21) being capable of pushing said slider (22) back and forth in said slide rail under voltage.

4. An imaging chip assembly according to claim 3, characterized in that the slide rail comprises balls (24) and a track (23), the slider (22) being moved back and forth in the track (23) by means of the balls (24).

5. An imaging chip assembly according to claim 2, characterized in that the piezoelectric body (21) is a piezoelectric ceramic.

6. An imaging chip assembly according to claim 1, characterized in that the connection substrate (3) is a flexible circuit board or a rigid-flex board.

7. A camera module, comprising:

an optical lens, a driving assembly, and the imaging chip assembly of any one of claims 1-6;

the imaging chip component is arranged at the imaging end of the optical lens, and the imaging chip (1) is arranged on one side, close to the imaging end, of the connecting substrate (3) and is opposite to the optical lens;

the driving component is connected with the optical lens or the imaging chip (1), and is used for adjusting the distance between the optical lens and the imaging chip (1) along the axial direction of the optical lens.

8. An imaging module according to claim 7, wherein the driving assembly is connected to the optical lens, and the relative positions of the plurality of micro-motors (2) and the connection substrate (3) are fixed.

9. A focusing method of a camera module, applied to the camera module of claim 7 or 8, the focusing method comprising:

presetting a focusing standard, controlling the whole optical lens to be close to or far away from the imaging chip (1) through a driving assembly, and executing focusing action on the imaging chip (1);

acquiring the number and positions of photosensitive units (11) which are imaged in the imaging chip (1) and do not reach a focusing standard;

the micro motor (2) pushes the photosensitive unit (11) with the imaging reaching the standard to move along the optical axis direction of the optical lens, so that the imaging of the photosensitive unit (11) reaches the focusing standard.

10. The method according to claim 9, wherein the focusing criterion is an imaging sharpness of the photosensitive unit (11).

11. The focusing method of an image capturing module according to claim 9, wherein the distance that the imaging light sensing unit (11) which does not reach the focusing standard needs to be moved is determined by comparing the distance between the imaging light sensing unit (11) which does not reach the focusing standard and the imaging light sensing unit (11) which reaches the focusing standard.

12. An electronic device comprising the camera module of claim 7 or 8.