CN216774876U - Camera module and electronic equipment - Google Patents

Abstract

The application discloses module and electronic equipment make a video recording belongs to electronic product technical field. The camera shooting module comprises a base, a lens assembly, a photosensitive chip and a piezoelectric element, wherein the piezoelectric element is fixedly arranged on the base, the lens assembly is connected with the base in a sliding manner, the photosensitive chip is arranged towards the lens assembly, and the piezoelectric element is abutted against the lens assembly; under the action of the piezoelectric element, the lens assembly can slide relative to the base and is close to or far away from the photosensitive chip.

Description

Camera module and electronic equipment

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to a camera module and electronic equipment.

Background

With the development and progress of the technology, the requirements of users on the photographing performance of mobile phones and other electronic devices are higher and higher, in order to meet the photographing requirements of different scenes with different focal lengths, the lens can be designed to be in a telescopic form, and the height of the lens is automatically adjusted according to the focal length requirements of different scenes.

In the related art, the camera module usually uses a motor and a series of transmission mechanisms to drive the lens to do telescopic motion to realize the zooming function, for example, the rotating shaft of the motor rotates to drive the screw rod to rotate, so as to drive the lens to displace along the screw rod, however, the transmission mechanisms such as the motor and the screw rod occupy more space, which is not beneficial to the miniaturization design of the camera module.

It is thus clear that current camera module exists the space and occupies big problem.

SUMMERY OF THE UTILITY MODEL

The application aims at providing a camera module and electronic equipment, and the problem that the space occupied by the existing camera module is large can be solved.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a camera module, which includes a camera module, and includes a base, a lens assembly, a photosensitive chip, and a piezoelectric element, where the piezoelectric element is fixedly disposed on the base, the lens assembly is slidably connected to the base, the photosensitive chip is disposed toward the lens assembly, and the piezoelectric element abuts against the lens assembly;

under the action of the piezoelectric element, the lens assembly can slide relative to the base and is close to or far away from the photosensitive chip.

In a second aspect, an embodiment of the present application provides an electronic device, including the camera module of the first aspect.

In the embodiment of this application, provide drive power through piezoelectric element to the relative base of drive lens subassembly slides, and then realizes that the lens subassembly is close to or keeps away from sensitization chip, so that satisfy the shooting demand of making a video recording the module. Moreover, the piezoelectric element has smaller volume compared with the traditional screw rod driving component; therefore, drive power is provided through the piezoelectric element to realize that the lens subassembly is close to or keeps away from the sensitization chip, can effectively reduce the whole occupation space of the module of making a video recording.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a camera module according to an embodiment of the present disclosure;

fig. 2 is a second schematic structural diagram of a camera module according to an embodiment of the present disclosure;

fig. 3 is a third schematic structural diagram of a camera module according to an embodiment of the present disclosure;

fig. 4 is a fourth schematic structural diagram of a camera module according to an embodiment of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

As shown in fig. 1 to 4, an embodiment of the present application provides a camera module, which includes a base 10, a lens assembly 20, a photosensitive chip (not shown) and a piezoelectric element 30, wherein the lens assembly 20 and the base 10 are slidably connected, the photosensitive chip is disposed toward the lens assembly 20, and the piezoelectric element 30 abuts against the lens assembly 20;

wherein, under the action of the piezoelectric element 30, the lens assembly 20 can slide relative to the base 10 and move close to or away from the photosensitive chip.

In this embodiment, the piezoelectric element 30 can provide a driving force to drive the lens assembly 20 to slide relative to the base 10, so that the lens assembly 20 is close to or far away from the photosensitive chip, so as to meet the shooting requirement of the camera module. Moreover, the piezoelectric element 30 has a smaller volume compared with the conventional lead screw driving assembly; therefore, the piezoelectric element 30 provides driving force to enable the lens assembly 20 to approach or depart from the photosensitive chip, and the overall occupied space of the camera module can be effectively reduced.

It is understood that when the piezoelectric element 30 abuts the lens assembly 20, the lens assembly 20 can be maintained stationary relative to the base 10 by the abutting friction of the piezoelectric element 30 and the lens assembly 20, even if the lens assembly 20 is maintained at a particular position. When the piezoelectric element 30 is operated, for example, a voltage with a certain frequency is applied to the piezoelectric element 30, so that the piezoelectric element 30 generates a counter pressure effect, and the counter pressure effect can deform the piezoelectric element 30, and the piezoelectric element 30 generates a deformation force to enable displacement between the piezoelectric element 30 and the lens assembly 20; and because the piezoelectric element 30 can be arranged on the base 10 by a fixed connection manner, while the lens assembly 20 is connected with the base 10 in a sliding manner; therefore, the deformation force of the piezoelectric element 30 can drive the lens assembly 20 to move relative to the base 10, and therefore the piezoelectric element 30 drives the lens assembly 20 to move.

Specifically, in the process of generating deformation by the counter-pressure effect of the piezoelectric element 30, the voltage direction may be changed to generate clockwise deformation or counterclockwise deformation of the piezoelectric element 30. For example, the piezoelectric element 30 may be a rectangular parallelepiped, and when the piezoelectric element 30 is powered, it will deform and bend, and the deformation direction relative to the lens assembly 20 may include forward movement, upward movement, backward movement, and downward movement, and the arrangement of the deformation direction may be adjusted to realize the upward movement or the downward movement of the lens assembly 20, that is, to realize the control of the lens assembly 20 to approach or depart from the photo sensor chip.

When the piezoelectric element 30 generates the deformation in the clockwise direction, the macro motion law of the piezoelectric element 30 is four steps of forward movement, upward movement, backward movement, and downward movement. The forward movement can increase the abutting friction force between the piezoelectric element 30 and the lens assembly 20, so that when the piezoelectric element 30 moves upwards, the lens assembly 20 can be driven to move together, and the lens assembly 20 can generate inertia to move upwards; when the piezoelectric element 30 moves backwards, the piezoelectric element 30 is separated from the lens assembly 20, but because the lens assembly 20 also has moving inertia moving upwards, and meanwhile, the piezoelectric element 30 moves downwards, so that a displacement difference is generated between the piezoelectric element 30 and the lens assembly 20; then, by repeating this process continuously, the lens assembly 20 is driven to move upward, for example, the lens assembly 20 is driven away from the photosensitive chip.

Accordingly, when the piezoelectric element 30 is deformed in the counterclockwise direction, the macro motion law of the piezoelectric element 30 is four steps of forward movement, downward movement, backward movement, and upward movement. The forward movement can increase the abutting friction force between the piezoelectric element 30 and the lens assembly 20, so that when the piezoelectric element 30 moves downwards, the lens assembly 20 can be driven to move together, and the lens assembly 20 can generate downward moving inertia; when the piezoelectric element 30 moves backwards, the piezoelectric element 30 is separated from the lens assembly 20, but because the lens assembly 20 also has moving inertia moving downwards, and meanwhile, the piezoelectric element 30 moves upwards, so that a displacement difference is generated between the piezoelectric element 30 and the lens assembly 20; then, by repeating this process continuously, the lens assembly 20 is driven to move downward, for example, the lens assembly 20 is driven to approach the photosensitive chip.

Thus, the axial displacement of the lens assembly 20 can be accurately controlled by accurately controlling the voltage applied to the piezoelectric element 30, and the displacement stroke of the lens assembly 20 is not limited as long as the contact surface between the lens assembly 20 and the base 10 is long enough. In addition, since the piezoelectric element 30 is fixed on the base 10, it is also possible to increase the structural stability of the camera module and to improve the stability of the movement of the lens assembly 20.

In the present application, the photosensitive chip is used for receiving the transmitted light of the lens assembly 20 and converting the transmitted light into an electrical signal, and the specific position of the photosensitive chip can be set according to actual needs. In some embodiments, the lens assembly 20 may be disposed on a first side of the base 10, and the photosensitive chip may be disposed on a second side of the base 20, that is, the lens assembly 20 and the photosensitive chip may be respectively disposed on two opposite sides of the base 10, and a through hole may be disposed on the base 10 for transmitting light, so that the light transmitted by the lens assembly 20 can be irradiated onto the photosensitive chip. In other embodiments, the lens assembly 20 and the photosensitive chip can be disposed on the same side of the base 10, as long as the piezoelectric element 30 can drive the lens assembly 20 to move closer to or away from the photosensitive chip.

Alternatively, as shown in fig. 1, the lens assembly 20 includes a sleeve 21, a column 22 and a lens 23, the lens 23 is assembled in the sleeve 21, the column 22 is fixedly connected with the sleeve 21, the sleeve 21 is slidably connected with the base 10, and the piezoelectric element 30 abuts against the column 22;

the piezoelectric element 30 can drive the column 22 to move, and the column 22 drives the sleeve 21 to slide relative to the base 21, so that the lens 23 approaches to or departs from the photo sensor chip.

In the present embodiment, by providing the column 22, the U-shaped structure formed when the piezoelectric element 30 is deformed and bent can be wrapped on the cylindrical sidewall of the column 22, that is, the contact area between the piezoelectric element 30 and the column 22 when the piezoelectric element is deformed and bent can be effectively increased, and thus the purpose of increasing the abutting friction force between the piezoelectric element 30 and the column 22 is achieved, and the piezoelectric element 30 can better drive the column 22 to generate displacement.

Wherein, the piezoelectric element 10 is used to drive the sleeve 21 to move the lens 23 relative to the photosensitive chip, i.e. the sliding direction of the sleeve 21 relative to the base 10 is determined based on the arrangement orientation of the photosensitive chip. Therefore, when the photosensitive chip is disposed in the vertical direction as shown in fig. 2, the sleeve 21 can be driven by the piezoelectric element 10 to move in the vertical direction with respect to the base 10; when the photosensitive chip is disposed in the horizontal direction, the sleeve 21 can be driven by the piezoelectric element 10 to move in the horizontal direction with respect to the base 10.

In some embodiments, the post 22 and the sleeve 21 may be a unitary structure to improve the integrity of the lens assembly 20.

In other embodiments, the stand column 22 and the sleeve 21 can be detachable, so that the stand columns 22 of different models can be adapted based on the performance of the piezoelectric element 30, and application scenes of the camera module are enriched.

Optionally, the base 10 has a receiving cavity 11, and an inner wall of the receiving cavity 11 is provided with a first sliding structure 12;

the sleeve 21 is positioned in the accommodating cavity 11, and the outer side wall of the sleeve 21 is provided with a second sliding structure 211 matched with the first sliding structure 12;

the sleeve 21 is slidable relative to the base 10 by the sliding connection of the first sliding structure 12 and the second sliding structure 211.

In this embodiment, the first sliding structure 12 and the second sliding structure 211 are provided to realize the sliding connection between the sleeve 21 and the base 10, so that the lens assembly 20 can be moved better.

In some embodiments, the first sliding structure 12 may be a guide post disposed on the inner wall of the accommodating cavity 11, and the second sliding structure 211 may be a guide groove disposed on the outer side wall of the sleeve 21; through locating the setting for first sliding structure 12 can also provide the guide effect, has avoided the phenomenon such as the position deviation to appear in the removal in-process of lens subassembly 20, the effectual removal effect that promotes lens subassembly 20.

In other embodiments, two or more sets of sliding structures may be provided to improve the stability of the sliding connection of the sleeve 21 to the base 10.

Optionally, the camera module further includes an elastic member 40, and the piezoelectric element 30 is mounted on the base 10 through the elastic member 40;

the elastic member 40 is used to increase the abutting friction between the piezoelectric element 30 and the lens assembly 20.

In the present embodiment, the elastic member 40 is provided to make the piezoelectric element 30 contact with the lens module 20 more favorably, and to improve the stability of the movement of the lens module 20.

The elastic member 40 can be a spring, which not only can better assemble the piezoelectric element 30 on the base 10, but also can provide a larger abutting friction force for the piezoelectric element 30.

Alternatively, as shown in fig. 3 and 4, the elastic member 40 includes a base 41, a first elastic arm 42 and a second elastic arm 43 formed by extending from opposite ends of the base 41;

the base 10 is provided with a first clamping groove 13 and a second clamping groove 14, the tail end of the first elastic arm 42 is clamped with the first clamping groove 13, and the tail end of the second elastic arm 43 is clamped with the second clamping groove 14.

In this embodiment, the elastic member 40 may be assembled on the base 10 by engaging the end of the elastic arm with the engaging groove.

In some embodiments, the first elastic arm 42 and the second elastic arm 43 may be relatively large in size and may be distributed along the inner wall of the accommodating chamber 11; and by setting the sizes of the first elastic arm 42 and the second elastic arm 43 to be larger, the elastic pressure of the elastic piece 40 on the piezoelectric element 30 can be increased, so that in the case that the lens assembly 20 is pressed by an external force or the camera module is in a falling state, the elastic pressure applied by the elastic piece 40 on the piezoelectric element 30 can effectively improve the failure risk of the camera module.

Further optionally, the camera module further includes a flexible circuit board 50, the flexible circuit board 50 is electrically connected to the piezoelectric element 30, and the base 41, the flexible circuit board 50, and the piezoelectric element 30 are sequentially stacked in an abutting direction of the piezoelectric element 30 and the lens assembly 20.

In the present embodiment, the piezoelectric element 30 can be supplied with power through the flexible circuit board 50, and the base portion 41, the flexible circuit board 50, and the piezoelectric element 30 are sequentially stacked in the abutting direction of the piezoelectric element 30 and the lens assembly 20, so that the mounting space required for the base portion 41, the flexible circuit board 50, and the piezoelectric element 30 can be reduced, and the overall occupied space of the camera module can be further reduced.

Alternatively, the base 41, the flexible circuit board 50, and the piezoelectric element 30 may be sequentially adhesively fixed, such as by a glue layer or a double-sided tape.

The first time of the base 41 departing from the flexible circuit board 50 may also be fixed to the inner wall of the accommodating cavity 11 by glue or double-sided tape.

Alternatively, as shown in fig. 1 and 3, the base 10 includes a base 15 and a fixing base 16, the fixing base 16 is disposed on the base 15, the piezoelectric element 30 is disposed on the fixing base 16, and the lens assembly 20 is slidably connected to the fixing base 16.

The fixing base 16 further has a receiving cavity 11, and the first engaging groove 13 and the second engaging groove 14 may also be disposed on the fixing base 16.

The embodiment of the application further provides an electronic device which comprises the camera shooting module.

It should be noted that the implementation manner of the above-mentioned embodiment of the camera module is also applicable to the embodiment of the electronic device, and can achieve the same technical effect, and is not described herein again.

It should be understood that the electronic device may be a mobile electronic device or a non-mobile electronic device. By way of example, the mobile electronic device may be a mobile phone, a tablet Computer, a notebook Computer, a palm top Computer, an in-vehicle electronic device, a wearable device, an Ultra-mobile Personal Computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a Personal Computer (PC), a Television (TV), a teller machine, a self-service machine, and the like, and the embodiments of the present application are not particularly limited.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A camera module is characterized by comprising a base, a lens assembly, a photosensitive chip and a piezoelectric element, wherein the piezoelectric element is fixedly arranged on the base, the lens assembly is connected with the base in a sliding manner, the photosensitive chip is arranged towards the lens assembly, and the piezoelectric element is abutted against the lens assembly;

under the action of the piezoelectric element, the lens assembly can slide relative to the base and is close to or far away from the photosensitive chip.

2. The camera module of claim 1, wherein: the lens assembly comprises a sleeve, an upright post and a lens, the lens is assembled in the sleeve, the upright post is fixedly connected with the sleeve, the sleeve is connected with the base in a sliding manner, and the piezoelectric element is abutted against the upright post;

the piezoelectric element can drive the upright post to move, and the upright post drives the sleeve to slide relative to the base, so that the lens is close to or far away from the photosensitive chip.

3. The camera module according to claim 2, wherein the base has a receiving cavity, and a first sliding structure is disposed on an inner wall of the receiving cavity;

the sleeve is positioned in the accommodating cavity, and a second sliding structure matched with the first sliding structure is arranged on the outer side wall of the sleeve;

the sleeve is slidable relative to the base through the sliding connection of the first sliding structure and the second sliding structure.

4. The camera module of claim 3, wherein the first sliding structure is a guiding post disposed on an inner wall of the receiving cavity, and the second sliding structure is a guiding groove disposed on an outer sidewall of the sleeve.

5. The camera module of claim 1, further comprising an elastic member, wherein the piezoelectric element is mounted on the base through the elastic member;

the elastic piece is used for increasing abutting friction force of the piezoelectric element and the lens assembly.

6. The camera module of claim 5, wherein the resilient member includes a base, a first resilient arm and a second resilient arm extending from opposite ends of the base;

the base is equipped with first draw-in groove and second draw-in groove, the end of first elastic arm with first draw-in groove joint, the end of second elastic arm with the second draw-in groove joint.

7. The camera module of claim 6, further comprising a flexible circuit board electrically connected to the piezoelectric element, wherein the base, the flexible circuit board and the piezoelectric element are sequentially stacked in an abutting direction of the piezoelectric element and the lens assembly.

8. The camera module of claim 7, wherein the base, the flexible circuit board and the piezoelectric element are sequentially bonded and fixed.

9. The camera module according to claim 7, wherein the base comprises a base and a fixing base, the fixing base is disposed on the base, the piezoelectric element is disposed on the fixing base, and the lens assembly is slidably connected to the fixing base;

one end of the flexible circuit board, which is far away from the piezoelectric element, is arranged on the base.

10. An electronic apparatus comprising the camera module according to any one of claims 1 to 9.

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