CN113686903B - Optical element defect detection system and detection method - Google Patents
Optical element defect detection system and detection method Download PDFInfo
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- CN113686903B CN113686903B CN202111094288.XA CN202111094288A CN113686903B CN 113686903 B CN113686903 B CN 113686903B CN 202111094288 A CN202111094288 A CN 202111094288A CN 113686903 B CN113686903 B CN 113686903B
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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Abstract
本发明公开了一种光学元件缺陷检测系统及检测方法，包括床身支撑模块、隔振模块、定位夹持模块、缺陷检测模块、缺陷分析模块、扫描运动模块和电气控制模块，每个模块完成相应的功能，具体工作步骤包括：开启设备及软件、系统初始化设置、设置系统参数、放置被测样品、设置测量参数、样品扫描测试、检测数据采集、缺陷类型分析、缺陷特性评价和结果输出系统关闭。本发明解决了人工检验可能由于某些人员原因导致的缺陷形貌误判和缺陷定位错误，降低了缺陷定位错误发生率，进一步提高了大口径光学元器件的缺陷检测准确率。
The present invention discloses an optical element defect detection system and detection method, including a bed support module, a vibration isolation module, a positioning clamping module, a defect detection module, a defect analysis module, a scanning motion module and an electrical control module, each module completes a corresponding function, and the specific working steps include: turning on the equipment and software, system initialization settings, setting system parameters, placing the sample to be tested, setting measurement parameters, sample scanning test, detection data collection, defect type analysis, defect characteristic evaluation and result output system shutdown. The present invention solves the problem of defect morphology misjudgment and defect positioning errors caused by some personnel reasons in manual inspection, reduces the occurrence rate of defect positioning errors, and further improves the defect detection accuracy of large-caliber optical components.
Description
Technical Field
The invention relates to the field of ultra-precise machining and detection of optical elements, in particular to a micrometer/submicron defect test during and after polishing of large-caliber optical elements.
Background
The rapid development of modern large optical engineering places stringent demands on the quality of the processing of optical elements. In particular, in the manufacturing process of large-caliber optical elements, an inspection process is required to detect defects on the polished surface of the optical element, so that the qualification rate of the optical element processing is improved, and the requirements of large caliber, high surface shape precision, ultra-smoothness and low defects are required. The inspection process may be classified into an equipment inspection process and a manual inspection process according to the inspection subject. The equipment inspection process is mainly used for processing the small-caliber sample under the same process. The manual inspection process requires that the inspection personnel make a determination of the defect morphology feature while the inspection tool is in use and manually make a defect identification, which process relies heavily on the experience of the inspection personnel. Although the defects can be found in time by manual inspection, the qualification rate of the finished products of the optical elements is greatly improved, in the manual inspection process, error judgment of the appearance of the defects, error positioning of the defects and the like caused by some human reasons are inevitably generated.
Therefore, how to improve the defect detection accuracy and reduce the defect positioning error occurrence rate of the large-caliber optical component is a problem to be solved at present.
Disclosure of Invention
The present invention is directed to solving the above-mentioned problems and provides a system and a method for detecting defects of an optical element.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
An optical element defect detection system specifically comprises the following modules:
the positioning and clamping module is used for positioning and clamping the test sample and automatically adjusting the posture of the test sample;
The defect detection module is used for detecting and recording the defects of the test sample piece through laser scattering scanning and high-power objective imaging;
The defect analysis module is used for carrying out classification statistics on defects through a defect background removal algorithm and a defect characteristic identification comparison classification flow, and giving a detailed test result;
The scanning movement module is used for carrying the defect detection module and testing and splicing the whole surface of the large-caliber test sample; the splicing refers to splicing a plurality of small-area tests in the large-caliber sample testing process through a splicing algorithm to realize large-caliber full-range display;
and the electric control module is used for controlling the movement of the scanning movement module and the test of the test sample.
Preferably, a laser emission detection system and a high power microscope are arranged in the defect detection module.
Preferably, the laser emission detection system comprises a laser emitter, a laser power adjusting device, a beam shaping module, a light polarization control module, a beam focusing module, a laser scattering detection module, a laser scattering collection module and a reflection light control module.
Preferably, the electrical appliance control module is further used for performing feedback processing on the sensor signals and the like, so that the equipment can be ensured to normally operate according to the instructions.
Preferably, the system further comprises a bed supporting module which is positioned at the bottom layer of the whole system and is used for supporting the rest modules of the system and the placement of the test sample.
Preferably, the vibration isolation device further comprises a vibration isolation module, wherein the vibration isolation module is positioned above the lathe bed supporting module, the electric control module, the scanning movement module, the defect analysis module, the defect detection module and the positioning clamping module are arranged above the vibration isolation module, and the vibration isolation module is used for keeping stability of the relationship between the rest modules and the test sample in the test process, and is particularly not influenced by environmental vibration.
The invention also provides a defect detection method of the optical element defect detection system, which comprises the following steps:
step one: sample scanning test, forming a defect statistical table and a defect distribution schematic diagram through two-dimensional scanning of a laser beam on a test sample;
Step two: acquiring detection data, and performing high-magnification microscopic imaging and size judgment on the defects according to all the defects or the position coordinates of the selected defects obtained in the step one;
Step three: analyzing the defect types, and classifying and counting the defects through a defect background removal algorithm and a defect characteristic identification and comparison classification flow;
step four: and (3) evaluating the defect characteristics, and analyzing and evaluating the defects classified in the step (III) according to the defect judging conditions and requirements.
Preferably, sample posture adjustment is required before the sample scanning test, specifically: and adjusting the pitching inclined state of the sample according to the automatic focusing definition under the high-power objective lens, wherein the high-power objective lens adopts a four-corner position judging method and a four-corner and center position imaging judging method to judge whether the gesture of the sample forms a specified fixed included angle with a test light path.
Preferably, the sample scanning test adopts a compound test method combining laser scattering and high-power imaging.
Preferably, the defect type analysis specifically includes: performing background signal removal on defect scattering signals collected through the sample scanning test; extracting a characteristic peak value through frequency transformation; judging the severity of the defect according to the characteristic peak value; and judging the shape and the size of the defect according to the peak integral area, and correspondingly determining the position of the defect according to the peak position.
Preferably, the sample scanning test step specifically comprises: the method comprises the steps that an incident laser beam is incident to the surface of a test sample piece at a given angle, a two-dimensional scanning operation is carried out on the incident laser beam in the transmission process, a detector responds in real time to obtain a scattering signal, then the high-power objective lens images the positioned defect, a two-dimensional scattering image of the surface defect is formed through the two-dimensional scanning operation, the defect is a bright spot, and the defect is a dark spot.
Preferably, the defect scattering signals are divided into three types: background signal, background signal noise fluctuations and defect intrinsic signals; the defect intrinsic signal can generate a peak value at the defect, and the defect is extracted by setting a defect signal threshold value.
Preferably, the background signal is mainly generated by the ambient light intensity, the detector dark current and the sample surface roughness.
Preferably, the background signal noise is mainly generated due to detector noise fluctuations, ambient noise fluctuations and sample surface roughness fluctuations.
Preferably, the range of testable calibers for defect detection of the test element includes 30mm by 30mm to 1500mm by 500mm.
Preferably, the defect detection of the test element can test for defects with a resolution of not less than 0.3 μm.
Preferably, the steps further include: starting equipment and software, initializing the system, setting system parameters, placing a sample to be measured, and setting measurement parameters.
Preferably, the system initialization setting specifically includes: the device automatically performs system initialization on laser intensity, polarized light transmission paths, scanning system zero setting and the like.
Preferably, the system parameters set before the sample to be measured is placed include: and (3) selecting corresponding system file parameters such as test color distribution, contrast setting, laser intensity setting, polarized light angle setting and the like according to the types of the test sample pieces, the types of the defects to be tested, the morphology of the sample and the like, and ensuring that the test environments of the same type of sample pieces are consistent especially under the condition of needing front-back comparison.
Preferably, the measurement parameters set after the sample to be measured is placed are specifically: detecting a scanning range, a testing depth, a testing type and the like, and inputting a sample name, a shape, a size and scanning parameters according to actual information: scan start point, scan end point, scan line number, etc.
Preferably, the sample scanning test procedure tests the whole surface, converts the defect information in the optical signal into visual information for collection and storage, identifies, extracts and classifies the detected defects through special software, counts the detected defects, and outputs a judging result and a conclusion according to an input judging basis.
Preferably, the detection system has the following advantages:
① And writing a defect identification algorithm to realize an automatic statistics function, and carrying out classification statistics according to the morphologies of different sizes.
② And (5) accepting and according to the judgment basis, issuing a test result and a conclusion.
③ The background noise shielding technology based on laser irradiation can realize the detection of the optical mirror surface defects.
④ The detection process can be kept clean and pollution-free.
Compared with the prior art, the invention has the following beneficial effects:
According to the technical scheme, compared with the small-caliber sample processing and manual inspection process in the prior art, the defect detection system and the detection method solve the problems of defect morphology misjudgment and defect positioning errors possibly caused by some reasons through detection data acquisition, defect type analysis, defect characteristic evaluation and the like, reduce the defect positioning error occurrence rate and further improve the defect detection accuracy of the large-caliber optical component.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an optical element defect detection system according to the present invention.
FIG. 2 is a flowchart showing a method for detecting defects of an optical element according to the present invention.
FIG. 3 is a schematic diagram of a defect scattering signal provided by the present invention.
Fig. 4 is a drawing showing a defect scan provided by the present invention.
FIG. 5 is a graph showing the detection result of laser scattering defect provided by the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The first aspect of the embodiment of the invention discloses an optical element defect detection system.
Referring to the schematic diagram of an optical element defect detection system shown in fig. 1 of the specification, the system comprises the following modules:
The positioning and clamping module 105 is used for positioning and clamping the test sample and automatically adjusting the posture of the test sample;
The defect detection module 104 detects and records the defects of the test sample piece through laser scattering scanning and high-power objective imaging;
The defect analysis module 103 performs classification statistics on defects through a defect background removal algorithm and a defect characteristic identification comparison classification flow;
the scanning movement module 102 is used for carrying the defect detection module 104 and testing and splicing the whole surface of the large-caliber test sample; splicing refers to splicing a plurality of small-area tests in the large-caliber sample testing process through a splicing algorithm to realize large-caliber full-range display;
An electrical control module 101 for controlling the movement of the scan movement module 102 and the testing of the test sample.
In one embodiment, a laser emission detection system and a high power microscope are provided in defect detection module 104.
In one embodiment, the high power micro-mirrors are positioned horizontally adjacent to the laser emission testing system.
In one embodiment, a laser emission detection system includes a laser emitter, a laser power adjustment device, a beam shaping module, a light polarization control module, a beam focusing module, a laser scatter detection module, a laser scatter collection module, and a reflected light control module.
In one embodiment, the electrical control module is further used for performing feedback processing on the sensor signals and the like, so that the equipment can be ensured to normally operate according to the instructions.
In one embodiment, the system further comprises a bed support module 107, which is located at the bottom layer of the whole system and is used for supporting the rest modules of the system and placing test samples.
In one embodiment, the vibration isolation module 106 is further disposed above the bed support module 107, and the electrical control module 101, the scanning movement module 102, the defect analysis module 103, the defect detection module 104 and the positioning and clamping module 105 are disposed above the vibration isolation module 106, and the vibration isolation module 106 is used for maintaining stability of the rest modules and the inter-relation between the test sample during the test, especially not affected by environmental vibration.
In one embodiment, optical mirror defect detection may be achieved based on background noise shielding techniques of laser irradiation.
In one embodiment, the defect detection process may remain clean and contamination free.
The second aspect of the embodiment of the invention also discloses a defect detection method of the optical element defect detection system.
Referring to fig. 2 of the specification, a working flow chart of a defect detection method for an optical element includes the following steps:
step one: sample scanning test, forming a defect statistical table and a defect distribution schematic diagram through two-dimensional scanning of a laser beam on a test sample;
Step two: acquiring detection data, and performing high-magnification microscopic imaging and size judgment on the defects according to all the defects or the position coordinates of the selected defects obtained in the step one;
Step three: analyzing the defect types, and classifying and counting the defects through a defect background removal algorithm and a defect characteristic identification and comparison classification flow;
step four: and (3) evaluating the defect characteristics, and analyzing and evaluating the defects classified in the step (III) according to the defect judging conditions and requirements.
In one embodiment, sample pose adjustment is required prior to sample scan testing, specifically: and adjusting the pitching inclined state of the sample according to the automatic focusing definition under the high-power objective lens, and judging whether the sample gesture forms a specified fixed included angle with the test light path by adopting a four-corner position judging method and a four-corner and center position imaging judging method by the high-power objective lens.
In one embodiment, the fixed angle is typically in the range of 60-80.
In one embodiment, the sample scanning test employs a compound test method of laser scattering in combination with high power imaging.
In one embodiment, the defect type analysis specifically includes: performing background signal removal on defect scattering signals collected through a sample scanning test; extracting a characteristic peak value through frequency transformation; judging the severity of the defect according to the characteristic peak value; and judging the shape and the size of the defect according to the peak integral area, and correspondingly determining the position of the defect according to the peak position.
In one embodiment, the sample scanning test step is specifically: the method comprises the steps that an incident laser beam is incident on the surface of a test sample piece at a given angle, a two-dimensional scanning operation is carried out on the incident laser beam in the transmission process, a detector responds in real time to obtain a scattering signal, then a high-power objective lens images the positioned defect, a two-dimensional scattering image of the surface defect is formed through the two-dimensional scanning operation, the defect is a bright point, and the defect is a dark point.
In one embodiment, the defect scatter signals are divided into three types: background signal, background signal noise fluctuations and defect intrinsic signals; the defect intrinsic signal will generate peak value at the defect, and the defect is extracted by setting the defect signal threshold value.
In one embodiment, the background signal is generated primarily by the ambient light intensity, detector dark current, and sample surface roughness.
In one embodiment, background signal noise is generated primarily due to detector noise fluctuations, ambient noise fluctuations, and sample surface roughness fluctuations.
In one embodiment, the range of testable calibers for defect detection of the test element includes 30mm by 30mm-1500mm by 500mm and can test for defects with resolution of no less than 0.3 μm.
In one embodiment, further comprising: starting equipment and software, initializing the system, setting system parameters, placing a sample to be measured, and setting measurement parameters.
In one embodiment, the system initialization settings are specifically: the device automatically performs system initialization on laser intensity, polarized light transmission paths, scanning system zero setting and the like.
In one embodiment, the system parameters set prior to placement of the sample under test include: and (3) selecting corresponding system file parameters such as test color distribution, contrast setting, laser intensity setting, polarized light angle setting and the like according to the types of the test sample pieces, the types of the defects to be tested, the morphology of the sample and the like, and ensuring that the test environments of the same type of sample pieces are consistent especially under the condition of needing front-back comparison.
In one embodiment, the measurement parameters set after the sample to be measured is placed are specifically: detecting a scanning range, a testing depth, a testing type and the like, and inputting a sample name, a shape, a size and scanning parameters according to actual information: scan start point, scan end point, scan line number, etc.
In one embodiment, the sample scanning test procedure tests the whole surface, converts the defect information in the optical signal into visual information for collection and storage, identifies, extracts and classifies the detected defects through special software, counts the detected defects, and outputs a judging result and a conclusion according to the input judging basis.
The following is a specific implementation procedure for testing defects of a 400mm×400mm×40mm fused silica sample by using the optical element defect detection method provided in the second aspect of the present embodiment:
firstly, turning on a power switch of the equipment, turning on special test software of the equipment, and automatically carrying out system initialization on laser intensity, a polarized light transmission path, scanning system zero setting and the like by the equipment;
Then, corresponding system file parameters such as test color distribution R:149, G:200, B:190 and contrast setting are selected according to the characteristics of the type of the test sample, the type of the detected defect, the appearance of the sample and the like: 55% laser light intensity setting: 39, and the polarized light angle is set to 45 degrees, etc., so as to ensure that the test environments of the same type of sample piece are consistent especially in the case of front-to-back comparison.
Then placing the sample piece to a specified position according to the requirement, positioning and clamping, starting the sample piece posture adjustment function, and adjusting the pitching inclined state of the sample piece according to the automatic focusing definition under the high-power objective lens, wherein the element adopts four-corner position judgment, and then judges whether the sample piece posture forms a certain fixed included angle with a test light path through four-corner and center position imaging. (the test included angle is generally controlled in the range of 60-80 degrees, and the improper selection of the angle can influence the detection precision of some shallow scratches).
And then inputting the sample name according to the actual information: large caliber fused quartz sample piece, shape: rectangular, size: 400mm x 400mm and scan parameters: scan start point (100 mm,50 mm), scan end point (500 mm,450 mm), scan line number 46, etc.
And executing a sample scanning program, generating a defect statistical table and a defect distribution diagram from a scanning starting point to a scanning end point, carrying out high-odds microscopic imaging and size judgment on defects according to all defects or selected defect position coordinates, filling morphology information into the defect statistical table, classifying the defects according to defect conditions, and respectively obtaining corresponding defect width and area information if the scratch defects are generally designed to be less than or equal to 1 mu m,1 mu m to 3 mu m,3 mu m to 6 mu m,6 mu m to 10 mu m,11 mu m to 20 mu m,21 mu m to 30 mu m,31 mu m to 40 mu m, more than 40 mu m and the like according to width information. The human-computer interaction interface inputs judging conditions and requirements, and the equipment automatically sends out a detailed test report and judges whether the requirements are met.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
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| CN114689596A (en) * | 2022-03-17 | 2022-07-01 | 中国兵器科学研究院宁波分院 | Optical element surface defect detection device |
| CN117232790B (en) * | 2023-11-07 | 2024-02-02 | 中国科学院长春光学精密机械与物理研究所 | Evaluation method and system for surface defects of optical components based on two-dimensional scattering |
| CN118896959A (en) * | 2024-07-22 | 2024-11-05 | 川崎(重庆)机器人工程有限公司 | An intelligent robot detection system for special-shaped workpiece surfaces |
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