CN113671590B - Infrared sensor and infrared sensing system - Google Patents
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- CN113671590B CN113671590B CN202110749008.8A CN202110749008A CN113671590B CN 113671590 B CN113671590 B CN 113671590B CN 202110749008 A CN202110749008 A CN 202110749008A CN 113671590 B CN113671590 B CN 113671590B
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Abstract
The application relates to an infrared sensor and an infrared sensing system, wherein the infrared sensor comprises an infrared emission module and an infrared receiving module, the infrared emission module comprises a first control unit and a first resistor, the tail end of the first resistor is electrically connected with the first control unit, two ends of the first resistor are respectively formed into two connecting terminals of the infrared emission module, the infrared receiving module comprises a second control unit and a second resistor, the tail end of the second resistor is electrically connected with the second control unit, and two ends of the second resistor are respectively formed into two connecting terminals of the infrared receiving module; the voltage value of the tail end of the resistor is collected through each control unit, and the position number of the corresponding module can be determined according to the voltage value. The method solves the problems that the installation of the infrared sensor is complex and the code learning is needed before the installation in the related technology, simplifies the construction installation operation of the infrared sensor, and can realize the beneficial effect of power-on self-adaptive identification without the code learning before the construction installation.
Description
Technical Field
The present application relates to the field of infrared correlation, and in particular to infrared sensors and infrared sensing systems.
Background
The infrared correlation switch commonly used in the market consists of two parts, namely a transmitting end and a receiving end. The transmitting end only transmits the infrared pulse signal, the receiving end outputs a judging signal, such as an NPN infrared correlation switch, according to whether the infrared pulse signal is received or not, if the receiving end can receive the infrared pulse signal, the judging signal outputs a high level, and if the infrared pulse signal is not received, the judging signal outputs a low level.
In the infrared correlation type switch in the related art, the transmitting end transmits pulse signals with the same frequency, the receiving end can only output signals by judging whether infrared signals are received or not, if the two groups of infrared switches are close in installation distance, mutual interference can be caused, and if the two groups of infrared switches are far in installation distance, detection blind areas can exist.
In order to solve the problem, the related art provides an infrared opposite-emission sensor, including light projecting module and light receiving module, light projecting module is including electric connection's carrier signal encoder in proper order, infrared lamp drive circuit and infrared lamp are constituteed, light receiving module is including electric connection's photoreceptor in proper order, study and decoder and drive amplification circuit are constituteed, this kind of infrared opposite-emission sensor is through carrying out the code to the signal that light projecting module sent, make every light projecting module all have unique transmitting code, light receiving module learns the code of the signal that light projecting module sent, guarantee every light receiving module only response and its own discernment's the same light projecting module of sign indicating number, realize infrared opposite-emission sensor paired uniqueness.
However, such infrared correlation sensors have the following drawbacks:
(1) Each pair of infrared opposite-emitting switches are mutually independent, and are inconvenient to construct and install when used in a large scale. Under the scene of using infrared correlation switch on a large scale, the overall arrangement wiring is more, and the construction degree of difficulty increases, and every infrared correlation pipe of pair all is independent work, and the receiver signal also independently reports, to the circuit board of received signal, need set up more interfaces just can satisfy the work demand.
(2) The coded infrared correlation tube is adopted, coding learning is carried out before installation and construction, power-on self-adaptive identification cannot be achieved, and subsequent replacement is inconvenient.
At present, no effective solution is proposed for the problems that the installation of the infrared sensor is complex and the code learning is required before the installation in the related art.
Disclosure of Invention
The embodiment of the application provides an infrared sensor and an infrared sensing system, which are used for at least solving the problems that the installation of the infrared sensor is complex and the code learning is needed before the installation in the related technology.
In a first aspect, embodiments of the present application provide an infrared sensor comprising an infrared emitting module and an infrared receiving module, wherein,
the infrared emission module comprises a first control unit and a first resistor, the tail end of the first resistor is electrically connected with the first control unit, two ends of the first resistor are respectively formed into two connecting terminals of the infrared emission module, and the first control unit is used for collecting a first voltage value of the tail end of the first resistor and determining a position number of the infrared emission module according to the first voltage value;
the infrared receiving module comprises a second control unit and a second resistor, the tail end of the second resistor is electrically connected with the second control unit, two ends of the second resistor are respectively formed into two connecting terminals of the infrared receiving module, and the second control unit is used for collecting a second voltage value of the tail end of the second resistor and determining the position number of the infrared receiving module according to the second voltage value.
In some embodiments, the first resistor and the second resistor have equal resistance values.
In a second aspect, an embodiment of the present application provides an infrared sensing system, including a plurality of infrared emission modules and a plurality of infrared receiving modules, where the plurality of infrared emission modules and the plurality of infrared receiving modules are in one-to-one correspondence;
each infrared emission module comprises a first control unit and a first resistor, and the tail end of the first resistor of each infrared emission module is electrically connected with the first control unit of the infrared emission module; the first resistors of the infrared emission modules are connected between the voltage source and the grounding end in series; the first control unit is used for collecting a first voltage value of the tail end of the first resistor and determining the position number of the infrared emission module according to the first voltage value;
each infrared receiving module comprises a second control unit and a second resistor, and the tail end of the second resistor of each infrared receiving module is electrically connected with the second control unit of the infrared receiving module; the second resistors of the plurality of infrared receiving modules are connected between the voltage source and the grounding end in series; the second control unit is used for collecting a second voltage value of the tail end of the second resistor and determining the position number of the infrared receiving module according to the second voltage value.
In some embodiments, the second resistors of the plurality of infrared receiving modules are cascaded between the voltage source and the ground in the same cascading order as the corresponding first resistor.
In some embodiments, the first resistor has a value equal to the first resistor.
In some embodiments, the first end of the first resistor in cascade connection in the infrared emission modules is electrically connected with a voltage source, and the tail end of the last first resistor in cascade connection in the infrared emission modules is electrically connected with a ground terminal;
the head end of a first second resistor in cascade connection in the infrared receiving modules is electrically connected with a voltage source, and the tail end of a last second resistor in cascade connection in the infrared transmitting modules is electrically connected with a grounding end.
In some embodiments, the infrared transmitting module further includes a modulation coding unit and a transmitting unit, where the modulation coding unit is configured to generate a coded modulation signal according to a coding parameter corresponding to a position number of the infrared transmitting module; the transmitting unit is used for transmitting the code modulation signal;
the infrared receiving module further comprises a receiving unit and a demodulating unit, wherein the receiving unit is used for receiving the code modulation signal; the demodulation unit is used for demodulating the code modulation signal according to the code parameters corresponding to the position numbers of the infrared receiving modules to obtain detection signals, and transmitting the detection signals to the second control unit.
In some embodiments, the infrared receiving module further comprises a signal amplifying unit, wherein the signal amplifying unit is connected between the receiving unit and the demodulating unit, and the signal amplifying unit is used for amplifying the code modulation signal.
In some of these embodiments, the receiving unit comprises a light-sensitive receiving tube.
In some embodiments, the infrared sensing system further includes a single bus, and the plurality of infrared receiving modules are connected to the single bus, where the single bus is used for reporting detection signals detected by the infrared receiving modules.
Compared with the related art, the infrared sensor and the infrared sensing system provided in the embodiment solve the problems that the installation of the infrared sensor is complex and the code learning is needed before the installation in the related art, simplify the construction and installation operation of the infrared sensor, and realize the beneficial effects of power-on self-adaptive identification without the code learning before the construction and installation.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
fig. 1 is a schematic structural view of an infrared sensor according to an embodiment of the present application;
fig. 2 is a schematic diagram of an installation implementation of an infrared sensor according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of an infrared sensing system according to an embodiment of the present application;
fig. 4 is a second schematic structural diagram of the infrared sensing system according to the embodiment of the present application;
FIG. 5 is a schematic diagram of an infrared receiving module according to an embodiment of the present application;
FIG. 6 is a second schematic structural diagram of an infrared receiving module according to an embodiment of the present application;
fig. 7 is a schematic structural view of an infrared sensing system according to a preferred embodiment of the present application;
fig. 8 is an enlarged schematic diagram of a partial hardware structure of the infrared sensing system according to the preferred embodiment of the present application.
Reference numerals:
10. an infrared emission module; 11. a first control unit; 12. a first resistor; 13. a first voltage source; 14. a first ground terminal; 15. a modulation encoding unit; 16. a transmitting unit;
20. an infrared receiving module; 21. a second control unit; 22. a second resistor; 23. a second voltage source; 24. a second ground terminal; 25. a demodulation unit; 26. a receiving unit; 27. a signal amplifying unit; 28. a single bus.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described and illustrated below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden on the person of ordinary skill in the art based on the embodiments provided herein, are intended to be within the scope of the present application.
It is apparent that the drawings in the following description are only some examples or embodiments of the present application, and it is possible for those of ordinary skill in the art to apply the present application to other similar situations according to these drawings without inventive effort. Moreover, it should be appreciated that while such a development effort might be complex and lengthy, it would nevertheless be a routine undertaking of design, fabrication, or manufacture for those of ordinary skill having the benefit of this disclosure, and thus should not be construed as having the benefit of this disclosure.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is to be expressly and implicitly understood by those of ordinary skill in the art that the embodiments described herein can be combined with other embodiments without conflict.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. Reference to "a," "an," "the," and similar terms herein do not denote a limitation of quantity, but rather denote the singular or plural. The terms "comprising," "including," "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, article, or apparatus that comprises a list of steps or modules (elements) is not limited to only those steps or elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. The terms "connected," "coupled," and the like in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The term "plurality" as used herein refers to two or more. "and/or" describes an association relationship of an association object, meaning that there may be three relationships, e.g., "a and/or B" may mean: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The terms "first," "second," "third," and the like, as used herein, are merely distinguishing between similar objects and not representing a particular ordering of objects.
In this embodiment, an infrared sensor is provided, fig. 1 is a schematic structural diagram of the infrared sensor according to the embodiment of the present application, and as shown in fig. 1, the infrared sensor includes: an infrared emission module 10 and an infrared receiving module 20.
The infrared emission module 10 includes a first control unit 11 and a first resistor 12, wherein the end of the first resistor 12 is electrically connected with the first control unit 11, two ends of the first resistor 12 are respectively formed into two connection terminals of the infrared emission module 10, and the first control unit 11 is used for collecting a first voltage value of the end of the first resistor 12 and determining a position number of the infrared emission module 10 according to the first voltage value.
The infrared receiving module 20 includes a second control unit 21 and a second resistor 22, wherein the end of the second resistor 22 is electrically connected with the second control unit 21, two ends of the second resistor 22 are respectively formed into two connection terminals of the infrared receiving module 20, and the second control unit 21 is used for collecting a second voltage value of the end of the second resistor 22 and determining a position number of the infrared receiving module 20 according to the second voltage value.
Fig. 2 is a schematic diagram of an installation implementation of an infrared sensor according to an embodiment of the present application, as shown in fig. 2, when the infrared sensor is installed, at an infrared signal emitting end, only two connection terminals of a plurality of infrared emitting modules 10 need to be connected end to end, that is, the tail end of a first resistor 12 of a previous infrared emitting module 10 is connected with the head end of a first resistor 12 of a next infrared emitting module 10, the head end of a first resistor 12 cascaded in the plurality of infrared emitting modules 10 is electrically connected with a first voltage source 13, and the tail end of a last first resistor 12 cascaded in the plurality of infrared emitting modules 10 is electrically connected with a first grounding end 14.
Similarly, at the infrared signal receiving end, only two connection terminals of the plurality of infrared receiving modules 20 need to be connected end to end, that is, the tail end of the second resistor 22 of the previous infrared receiving module 20 is connected with the head end of the second resistor 22 of the next infrared receiving module 20, the head end of the first second resistor 22 cascaded in the plurality of infrared receiving modules 20 is electrically connected with the second voltage source 23, and the tail end of the last second resistor 22 cascaded in the plurality of infrared transmitting modules 10 is electrically connected with the second grounding end 24.
When the infrared emission module 10 and the infrared receiving module 20 are connected with a power supply, both ends of each resistor are distributed with a certain voltage, and the position numbers of the infrared emission module 10 and the infrared receiving module 20 can be determined according to the voltage values by pre-configuring the voltage and the position numbers of each resistor in a table look-up mode.
In some preferred embodiments, the resistances of the first resistor 12 and the second resistor 22 are equal, and according to the principle of voltage division of series resistors, the voltage values of these resistors change regularly, and according to the voltage values, the position numbers of the infrared emitting module 10 and the infrared receiving module 20 can be calculated.
For example, in the infrared emission module 10, 4 resistors with the same resistance are sequentially connected in series between the voltage source and the ground, the numbers are respectively 1, 2, 3 and 4, wherein the head end of the resistor No. 1 is connected with the voltage source, the tail end of the resistor No. 4 is connected with the ground, the total voltage dropped on the resistor No. 4 is 1V, then the voltage values distributed to the resistor No. 4 are respectively 1/4V, 2/4V, 3/4V and 4/4V, and each first control unit 11 can determine the position number of the corresponding infrared emission module 10 by determining the voltage value of the corresponding resistor through a calculation mode (position number=single resistor voltage value×resistor number). The principle of determining the position number by the infrared receiving module 20 is similar to that of the infrared transmitting module 10, and will not be described here again.
In the case of a plurality of pairs of infrared correlation tubes (i.e., a plurality of infrared emission modules 10 and a plurality of infrared receiving modules 20), there may be a problem of mutual interference between the infrared correlation tubes of different pairs, and in order to solve the problem, the construction and installation of the infrared correlation switch are complicated and coding learning is required before the installation and construction. Compared with the related art, the infrared sensor of the embodiment supports cascade use, the position of the infrared sensor can be determined only through the partition resistor without power-on learning, and each infrared receiving module 20 only receives the signal sent by the corresponding infrared transmitting module 10 and judges whether the infrared sensor is shielded or not according to the signal. Through this embodiment, the problem that infrared sensor installs complicacy and need encode study before the installation among the correlation technique has been solved, the construction installation operation of infrared sensor has been simplified to and need not carry out the code study before the construction installation can realize the beneficial effect of power on self-adaptation discernment.
In combination with the infrared sensor of the foregoing embodiment, this embodiment further provides an infrared sensing system, and fig. 3 is a schematic structural diagram of the infrared sensing system of the embodiment of the present application, as shown in fig. 3, and the infrared sensing system includes: the infrared transmitting modules 10 and the infrared receiving modules 20 are in one-to-one correspondence with each other.
Each infrared emission module 10 comprises a first control unit 11 and a first resistor 12, and the first resistor end of each infrared emission module 10 is electrically connected with the first control unit 11 of the infrared emission module 10; the first resistors 12 of the infrared emission modules 10 are cascaded between a first voltage source 13 and a first grounding end 14; the first control unit 11 is configured to collect a first voltage value at the end of the first resistor 12, and determine a position number of the infrared emission module 10 according to the first voltage value.
Each infrared receiving module 20 comprises a second control unit 21 and a second resistor 22, and the tail end of the second resistor 22 of each infrared receiving module 20 is electrically connected with the second control unit 21 of the infrared receiving module 20; the second resistors 22 of the plurality of infrared receiving modules 20 are cascaded between a second voltage source 23 and a second grounding terminal 24; the second control unit 21 is configured to collect a second voltage value at the end of the second resistor 22, and determine the position number of the infrared receiving module 20 according to the second voltage value.
The working principle of the infrared sensing system has been described in the above embodiment, and this embodiment will not be described again.
In some embodiments, the second resistors 22 of the plurality of infrared receiving modules 20 are cascaded between the voltage source and ground in the same cascading order as the corresponding first resistor 12.
So set up for infrared receiving module 20 and infrared emission module 10 have the same order serial number, make things convenient for infrared receiving module 20 when receiving the signal that infrared emission module 10 sent, only need carry out simple comparison with the position number that the signal that sends carried and self position number, select to compare the signal of unanimity and carry out subsequent processing, for example, judge whether infrared sensor is sheltered from.
In some preferred embodiments, the first resistor 12 and the second resistor 22 have equal resistance values.
The voltage values of the resistors are changed regularly, and the position numbers of the infrared transmitting module 10 and the infrared receiving module 20 can be calculated after the voltage values are acquired according to the principle of voltage division of the resistors connected in series, so that the relation between the voltage and the position numbers of the resistors is not required to be configured in advance.
Referring to fig. 3, in some embodiments, a head end of a first resistor 12 in cascade connection in the plurality of infrared emission modules 10 is electrically connected to a first voltage source 13, and an end of a last first resistor 12 in cascade connection in the plurality of infrared emission modules 10 is electrically connected to a first ground 14; the first end of the first second resistor 22 in cascade connection in the plurality of infrared receiving modules 20 is electrically connected with the second voltage source 23, and the tail end of the last second resistor 22 in cascade connection in the plurality of infrared emitting modules 10 is electrically connected with the second grounding end 24.
Referring to fig. 4, in some embodiments, the infrared emission module 10 further includes a modulation coding unit 15 and a transmitting unit 16, where the modulation coding unit 15 is configured to generate a coded modulation signal according to a coding parameter corresponding to the position number of the infrared emission module 10; the transmitting unit 16 is used for transmitting the code modulated signal.
The infrared receiving module 20 further comprises a demodulation unit 25 and a receiving unit 26, wherein the receiving unit 26 is used for receiving the code modulation signal; the demodulation unit 25 is configured to demodulate the coded modulation signal according to the coding parameter corresponding to the position number of the infrared receiving module 20, obtain a detection signal, and transmit the detection signal to the second control unit 21.
Referring to fig. 5, in some embodiments, the infrared receiving module 20 further includes a signal amplifying unit 27, where the signal amplifying unit 27 is connected between the receiving unit 26 and the demodulating unit 25, and the signal amplifying unit 27 is used to amplify the code modulated signal.
In some embodiments, the receiving unit 26 comprises a photosensitive receiving tube. In the infrared emission module 10, the emission unit 16 can be implemented by an LED, and the photosensitive receiving tube can sense light waves emitted by the LED to implement receiving of light signals.
Referring to fig. 6, in some embodiments, the infrared sensing system further includes a single bus 28, where the plurality of infrared receiving modules 20 are connected to the single bus 28, and the single bus 28 is used to report the detection signals detected by the infrared receiving modules 20.
The infrared sensing system of the present application will be described by way of a preferred embodiment.
Fig. 7 is a schematic structural view of the infrared sensing system according to the preferred embodiment of the present application, and fig. 8 is an enlarged schematic structural view of partial hardware of the infrared sensing system according to the preferred embodiment of the present application, as shown in fig. 7 to 8:
the infrared emission module has 3 inlet wires and 3 outgoing lines, and wherein 3 inlet wires include VCC, GND, ra, and 3 outgoing lines include VCC, GND, rb. The infrared emission module comprises an MCU, a partition resistor R, a modulation encoder and an infrared lamp. The infrared emission module is in cascade connection mode, wherein the Ra end of the first partition resistor is connected to VCC, the Rb end of the last partition resistor is connected to GND, and the Rb end of each partition resistor is connected to an ADC pin of the MCU. After the infrared emission modules are cascaded, the connection sequence of the infrared emission modules is determined by collecting the voltages of the Rb ends, and the infrared emission modules emit carrier waves with different codes according to the sequence.
The infrared receiving module is provided with 4 incoming lines and 4 outgoing lines, wherein the 4 incoming lines comprise VCC, signal, ra, GND; the 4-heel line includes VCC, signal, rb, GND. The infrared receiving module comprises a photosensitive receiving tube, a photoelectric amplifier, a demodulator, an MCU and a partition resistor R. The infrared receiving module cascading mode is that the Ra end of the first partition resistor is connected to VCC, the Rb end of the last partition resistor is connected to GND, the Rb end of each partition resistor is connected to an ADC pin of the MCU, and therefore the connection sequence of the infrared receiving module is determined by collecting the voltage of the Rb ends after the infrared receiving module cascading.
The cascade installation mode of the infrared emission module and the infrared receiving module reduces the construction difficulty and saves the construction cost. Moreover, the infrared transmitting module and the infrared receiving module can accurately identify the position of the infrared transmitting module by detecting the voltage of the partition resistor without power-on learning, each path of infrared receiving module only receives the coded modulation signal sent by the corresponding infrared transmitting module and carries out demodulation processing, the processed signal is transmitted to the MCU, and the MCU judges whether the infrared opposite-emitting tube is shielded or not by judging whether the corresponding coded signal is received or not. Finally, the infrared receiving module outputs and reports the information outwards in a single bus (Signal) communication mode. The two adjacent infrared correlation tubes are not interfered even if being closely separated due to different infrared codes.
It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to be limiting. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present application, are within the scope of the present application in light of the embodiments provided herein.
It is evident that the drawings are only examples or embodiments of the present application, from which the present application can also be adapted to other similar situations by a person skilled in the art without the inventive effort. In addition, it should be appreciated that while the development effort might be complex and lengthy, it would nevertheless be a routine undertaking of design, fabrication, or manufacture for those of ordinary skill having the benefit of this disclosure, and thus should not be construed as an admission of insufficient detail.
The term "embodiment" in this application means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive. It will be clear or implicitly understood by those of ordinary skill in the art that the embodiments described in this application can be combined with other embodiments without conflict.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the patent. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application shall be subject to the appended claims.
Claims (10)
1. An infrared sensor, characterized in that the infrared sensor comprises an infrared emission module and an infrared receiving module, wherein,
the infrared emission module comprises a first control unit and a first resistor, the tail end of the first resistor is electrically connected with the first control unit, two ends of the first resistor are respectively formed into two connecting terminals of the infrared emission module, and the first control unit is used for collecting a first voltage value of the tail end of the first resistor and determining a position number of the infrared emission module according to the first voltage value;
the infrared receiving module comprises a second control unit and a second resistor, the tail end of the second resistor is electrically connected with the second control unit, two ends of the second resistor are respectively formed into two connecting terminals of the infrared receiving module, and the second control unit is used for collecting a second voltage value of the tail end of the second resistor and determining the position number of the infrared receiving module according to the second voltage value.
2. The infrared sensor of claim 1, wherein the first resistor and the second resistor have equal resistance values.
3. The infrared sensing system is characterized by comprising a plurality of infrared emission modules and a plurality of infrared receiving modules, wherein the plurality of infrared emission modules correspond to the plurality of infrared receiving modules one by one;
each infrared emission module comprises a first control unit and a first resistor, and the tail end of the first resistor of each infrared emission module is electrically connected with the first control unit of the infrared emission module; the first resistors of the infrared emission modules are connected between the voltage source and the grounding end in series; the first control unit is used for collecting a first voltage value of the tail end of the first resistor and determining the position number of the infrared emission module according to the first voltage value;
each infrared receiving module comprises a second control unit and a second resistor, and the tail end of the second resistor of each infrared receiving module is electrically connected with the second control unit of the infrared receiving module; the second resistors of the plurality of infrared receiving modules are connected between the voltage source and the grounding end in series; the second control unit is used for collecting a second voltage value of the tail end of the second resistor and determining the position number of the infrared receiving module according to the second voltage value.
4. The infrared sensing system of claim 3, wherein the second resistors of the plurality of infrared receiving modules are cascaded between the voltage source and the ground in the same cascading order as the corresponding first resistors.
5. The infrared sensing system of claim 4, wherein the first resistor has an equal resistance value as the first resistor.
6. The infrared sensing system of claim 3, wherein the infrared sensing system comprises,
the head end of a first resistor in cascade connection in the infrared emission modules is electrically connected with a voltage source, and the tail end of a last first resistor in cascade connection in the infrared emission modules is electrically connected with a grounding end;
the head end of a first second resistor in cascade connection in the infrared receiving modules is electrically connected with a voltage source, and the tail end of a last second resistor in cascade connection in the infrared transmitting modules is electrically connected with a grounding end.
7. The infrared sensing system of claim 3, wherein the infrared sensing system comprises,
the infrared emission module further comprises a modulation coding unit and an emission unit, wherein the modulation coding unit is used for generating a coded modulation signal according to coding parameters corresponding to the position numbers of the infrared emission module; the transmitting unit is used for transmitting the code modulation signal;
the infrared receiving module further comprises a receiving unit and a demodulating unit, wherein the receiving unit is used for receiving the code modulation signal; the demodulation unit is used for demodulating the code modulation signal according to the code parameters corresponding to the position numbers of the infrared receiving modules to obtain detection signals, and transmitting the detection signals to the second control unit.
8. The infrared sensing system of claim 7, wherein the infrared receiving module further comprises a signal amplifying unit connected between the receiving unit and the demodulating unit, the signal amplifying unit for amplifying the code modulated signal.
9. The infrared sensing system of claim 7, wherein the receiving unit comprises a photosensitive receiving tube.
10. The infrared sensing system according to any one of claims 3 to 9, further comprising a single bus, wherein a plurality of the infrared receiving modules are connected to the single bus, and the single bus is used for reporting detection signals detected by each of the infrared receiving modules.
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