CN113665245B - Liquid injection device and packaging structure - Google Patents
Liquid injection device and packaging structure Download PDFInfo
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- CN113665245B CN113665245B CN202010407123.2A CN202010407123A CN113665245B CN 113665245 B CN113665245 B CN 113665245B CN 202010407123 A CN202010407123 A CN 202010407123A CN 113665245 B CN113665245 B CN 113665245B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The invention provides a liquid injection device and a packaging structure, the device sequentially comprises a packaging plate, a vibrating plate, a flow channel plate, an ink channel plate, a connecting plate and a spray hole plate from top to bottom, wherein at least one first ink hole is formed in the packaging plate, and a plurality of grooves are formed in the lower surface of the packaging plate; at least one second ink hole is formed in the vibrating plate, and a plurality of thin film piezoelectric structures are arranged on the upper surface of the vibrating plate; the flow channel plate is provided with at least one third ink hole, a plurality of first piezoelectric cavities and a plurality of flow channels, and each first piezoelectric cavity is respectively communicated with at least one flow channel; the ink channel plate is provided with at least one fourth ink hole, a plurality of second piezoelectric cavities and at least one ink inlet channel, and the ink inlet channel is communicated with the flow channel; the ink cavity is communicated with the fourth ink hole and the ink inlet channel; the orifice plate encloses at least a portion of the ink chamber and has a plurality of orifices disposed therein. The invention adopts the design of the all-MEMS structure, realizes the liquid ejecting device with the all-MEMS structure, and can eject high ink jet amount aiming at high-viscosity liquid materials.
Description
Technical Field
The invention belongs to the field of semiconductor integrated circuit manufacturing, the field of Micro Electro Mechanical Systems (MEMS) and the technical field of ink-jet printing, and relates to a liquid ejecting device and a packaging structure.
Background
Inkjet printing is widely used in many fields such as printing, textile printing, and industrial manufacturing. Particularly, with the advance of industrial intelligence, the additive manufacturing technology is gradually sought after in related fields due to the characteristics of less material consumption, low cost, high processing freedom degree and the like. One of the important bases of additive manufacturing is the inkjet printing technology, the most central technology of which is the print head. The print head can be classified into a thermal bubble print head and a piezoelectric print head according to the ink jet principle. Among them, the thermal bubble type printing head cannot effectively jet ink with high viscosity and high boiling point due to the limitation of the foaming principle. The piezoelectric type printing head has the overwhelming advantage in the ink material adaptability, however, the traditional piezoelectric type printing head is produced by adopting a semi-micro-electro-mechanical system (MEMS) manufacturing process, and the processing precision of the traditional piezoelectric type printing head cannot be comparable to that of the thermal bubble type printing head manufactured by a full MEMS process. Thus, the resolution of conventional piezoelectric printheads is generally low. In recent years, some manufacturers have manufactured all-MEMS piezoelectric printheads using thin film piezoelectric materials through semiconductor processing techniques, which have high resolution and ink compatibility. However, due to design concept and market orientation, these thin film piezoelectric MEMS printheads are only used for lower viscosity inks. Currently, the additive manufacturing field is developing towards high precision, and due to the process and other reasons, it is necessary to perform a printing operation with a large ink ejection amount by using ink with high viscosity. However, there is no product that can perform a printing operation with a large ink ejection amount for a high-precision full MEMS structure by using a high-viscosity ink.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention is directed to a liquid ejecting device and a package structure, which can solve the problem that the prior art is difficult to realize the printing operation of high ink ejection amount of high-precision all MEMS structure under the condition of using high-viscosity ink.
To achieve the above and other related objects, the present invention provides a liquid ejection device comprising:
the packaging plate is internally provided with at least one first ink hole which vertically penetrates through the packaging plate, and the lower surface of the packaging plate is provided with a plurality of grooves;
the vibrating plate is positioned below the packaging plate, at least one second ink hole penetrating through the vibrating plate up and down is formed in the vibrating plate, the second ink hole is aligned to the first ink hole, a plurality of thin film piezoelectric structures are arranged on the upper surface of the vibrating plate, and the thin film piezoelectric structures are aligned to the grooves;
the runner plate is positioned below the vibrating plate, at least one third ink hole, a plurality of first piezoelectric cavities and a plurality of runners are formed in the runner plate and penetrate through the runner plate up and down, the third ink hole is aligned to the second ink hole, the first piezoelectric cavities are aligned to the thin film piezoelectric structure, and each first piezoelectric cavity is communicated with at least one runner;
the ink channel plate is positioned below the flow channel plate, at least one fourth ink hole, a plurality of second piezoelectric cavities and at least one ink inlet channel are formed in the ink channel plate and penetrate through the ink channel plate up and down, the fourth ink hole is aligned to the third ink hole, the second piezoelectric cavities are aligned to the first piezoelectric cavities, and the ink inlet channels are communicated with the flow channel;
the connecting plate is positioned below the ink channel plate, an ink cavity and a plurality of connecting cavities which vertically penetrate through the connecting plate are arranged in the connecting plate, the connecting cavities are aligned to the second piezoelectric cavity, and the ink cavity is communicated with the fourth ink hole and the ink inlet channel;
and the jet orifice plate is positioned below the connecting plate and seals at least one part of the ink cavity, a plurality of jet orifices are arranged in the jet orifice plate, and the jet orifices are aligned with the connecting cavity.
Optionally, the lower surface of the connecting plate is further provided with an adhesion layer, and the spray orifice plate is connected to the lower surface of the adhesion layer.
Optionally, the material of the adhesion layer includes a metal.
Optionally, the ink chamber includes a main ink channel and a branch ink channel connected to each other, the main ink channel is communicated with the fourth ink hole, and the branch ink channel is aligned with the ink inlet channel.
Optionally, the orifice plate seals the branch ink channel, and the liquid ejecting device further includes a flexible film layer located below the connection plate and sealing the main ink channel.
Optionally, the material of the flexible film layer includes a polymer material.
Optionally, the lower surface of the connecting plate is further provided with an adhesion layer, and the flexible film layer is attached to the lower surface of the adhesion layer.
Optionally, a material of the adhesion layer includes a metal.
Optionally, the plurality of first piezoelectric cavities and the plurality of second piezoelectric cavities corresponding to the first piezoelectric cavities are arranged in an array.
Optionally, a plurality of the second piezoelectric chambers are arranged in a column, wherein the second piezoelectric chambers in the column use one ink inlet channel, or the second piezoelectric chambers in the column use two ink inlet channels; or the plurality of second piezoelectric cavities are arranged in at least two rows, wherein the two rows of second piezoelectric cavities share one ink inlet channel, or each row of second piezoelectric cavities uses two ink inlet channels.
Optionally, the thin film piezoelectric structure includes an upper electrode, a lower electrode, and a piezoelectric material layer, where the piezoelectric material layer is located between the upper electrode and the lower electrode, and the upper electrode and the lower electrode are respectively connected to a wire.
Optionally, the piezoelectric material layer comprises lead zirconate titanate.
Optionally, the piezoelectric material layer comprises single crystal lead zirconate titanate.
Optionally, the packaging plate, the vibrating plate, the flow channel plate, the ink channel plate, the connecting plate, and the orifice plate are made of at least one of silicon, silicon oxide, glass, rigid plastic, and metal.
Optionally, at least one group of two adjacent layers or three adjacent layers of the packaging plate, the vibration plate, the flow channel plate, the ink channel plate, the connecting plate and the orifice plate are integrally processed.
Optionally, in the package plate, the vibration plate, the flow channel plate, the ink channel plate, the connection plate, and the orifice plate, two adjacent layers are combined in an adhesive connection manner or a direct bonding manner.
Optionally, an opening area of the nozzle hole is smaller than an opening area of the connection cavity.
The present invention also provides a package structure, comprising:
the structure fixing component comprises an accommodating groove and at least one driving chip, wherein an opening is formed in the bottom of the accommodating groove;
the liquid ejecting device according to any of the above embodiments, placed in the receiving groove, and electrically connected to the driving chip, wherein a surface of the liquid ejecting device having the nozzle faces downward, and the nozzle is exposed by the opening;
an outer ink assembly positioned above the liquid ejection device for supplying ink to the liquid ejection device through the first ink orifice.
Optionally, an ink chamber is arranged inside the external ink component, the ink chamber is communicated with the first ink hole of the packaging plate, and the upper surface of the external ink component is provided with at least one ink conveying hole communicated with the ink chamber.
Optionally, the liquid ejection device and the driving chip are interconnected by a flexible printing plate or a bonding wire.
As described above, the liquid ejection device of the present invention can be manufactured by using an all-MEMS process, and has the advantages of high precision and high integration, wherein the piezoelectric cavities in the flow channel plate and the ink channel plate are arranged in an array manner, the monolithic integration density is higher, the design flexibility is better, the high resolution and high breadth arrangement of a monolithic chip can be completed, and the size of the piezoelectric cavity can be changed according to different viscosities of the ink, so that not only low viscosity ink can be adapted, but also high viscosity ink can be adapted, droplets with larger ejection size can be ejected, a large ejection volume of the high viscosity ink can be realized, and the requirement of large throughput in industrial manufacturing can be satisfied. The liquid injection device adopts the thin film piezoelectric material, so that better frequency characteristics can be brought, the energy consumption is lower, and the heat productivity is less; since the processing can be performed using a semiconductor process, the cost can be reduced in mass production. The liquid jet device can be packaged together with an external ink component and a driving chip through a structure fixing component to form the ink jet device.
Drawings
Fig. 1 is a schematic view showing an exploded structure of a liquid ejecting apparatus according to the present invention.
Fig. 2 is a partial cross-sectional view of a liquid ejection device of the present invention.
Fig. 3 is an exploded view of the package structure of the present invention.
Fig. 4 is a schematic view of the package structure after assembly.
Description of the element reference numerals
1. Packaging plate
101. First ink hole
102. Groove
2. Vibrating plate
201. Second ink hole
202. Thin film piezoelectric structure
3. Runner plate
301. Third ink hole
302. First piezoelectric cavity
303. Flow passage
4. Ink channel plate
401. The fourth ink hole
402. Second piezoelectric cavity
403. Ink inlet channel
5. Connecting plate
501. Ink chamber
5011. Main ink channel
5012. Ink branch channel
502. Connecting cavity
6. Spray orifice plate
601. Spray orifice
7. Flexible film layer
8. Adhesive layer
9. Structure fixing assembly
901. Accommodating groove
902. Driving chip
903. Opening of the container
904. Rigid structural frame
905. Metal frame
10. External ink supply assembly
10a ink cartridge
10b ink feed holes
11. Liquid ejection device
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 4. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
Example one
In the present embodiment, a liquid ejecting device is provided, please refer to fig. 1, which is an exploded schematic view of the liquid ejecting device, and includes, from top to bottom, a package plate 1, a vibrating plate 2, a channel plate 3, an ink channel plate 4, a connecting plate 5, and a nozzle plate 6. Referring again to FIG. 2, a partial cross-sectional view of the liquid ejection device is shown.
Specifically, the package board 1 is provided with at least one first ink hole 101 vertically penetrating through the package board 1, and the lower surface of the package board 1 is provided with a plurality of grooves 102 for accommodating a thin film piezoelectric structure 202 described later. The size of the groove is determined by the size of the thin-film piezoelectric structure 202, and is larger than the thin-film piezoelectric structure 202 and aligned with the thin-film piezoelectric structure 202, but for reliability, the groove should not be too large.
In this embodiment, the packaging plate 1 is provided with two first ink holes 101, which are respectively close to two ends of a diagonal line of the packaging plate 1. In practical applications, both of the first ink holes 101 may be used as ink inlet holes, one of the first ink holes may be used as an ink inlet, and the other one may be used as an ink outlet, or one of the first ink holes 101 may be completely closed. Of course, in other embodiments, the number and the position of the first ink holes 101 may be adjusted according to the requirement.
Specifically, the vibrating plate 2 is located below the package plate 1, at least one second ink hole 201 penetrating through the vibrating plate 2 from top to bottom is formed in the vibrating plate 2, the second ink hole 201 is aligned with the first ink hole 101, the upper surface of the vibrating plate 2 is provided with a plurality of thin film piezoelectric structures 202, and the thin film piezoelectric structures 202 are aligned with the grooves in the lower surface of the package plate 1.
As an example, the vibration plate 2 is a rigid thin plate having a thickness of less than 10 μm.
As an example, the whole thin-film piezoelectric structure 202 may be designed to be circular, oval or other shape, and a plurality of thin-film piezoelectric structures 202 are arranged in an array, and the specific arrangement rule may be determined according to the application requirement. The thin film piezoelectric structure 202 at least includes an upper electrode, a lower electrode, and a piezoelectric material layer, the piezoelectric material layer is located between the upper electrode and the lower electrode, and the upper electrode and the lower electrode are respectively connected to a wire to achieve electrical connection with a circuit in the package board 1. The existing thin film piezoelectric material can be applied to the piezoelectric material layer to some extent, including but not limited to lead zirconate titanate (PZT), and in this embodiment, the piezoelectric material layer is preferably single crystal lead zirconate titanate, which can withstand higher temperature, thereby facilitating the expansion of the process window and obtaining better characteristics of the device. The thin-film piezoelectric structure 202 may further include a passivation layer and an adaptation layer to improve certain properties. The thin film piezoelectric structure 202 may be manufactured by an all-MEMS process.
Specifically, the flow channel plate 3 is located below the vibration plate 2, at least one third ink hole 301, a plurality of first piezoelectric cavities 302 and a plurality of flow channels 303 are formed in the flow channel plate 3 and vertically penetrate through the flow channel plate 3, the third ink hole 301 is aligned with the second ink hole 201, the plurality of first piezoelectric cavities 302 are arrayed like the plurality of thin film piezoelectric structures 202, the first piezoelectric cavities 302 are aligned with the thin film piezoelectric structures 202, and each first piezoelectric cavity 302 is respectively communicated with at least one flow channel 303.
For example, the size of the first piezoelectric cavity 302 is determined by the size of the thin film piezoelectric structure 202, and is larger than the thin film piezoelectric structure 202 and aligned with the thin film piezoelectric structure 202, but should not be too large for reliability.
As an example, the flow channel 303 is a rectangular through groove, which is located on one side or two sides of the first piezoelectric cavity 302, and the specific location is determined according to the application requirement. In this embodiment, the flow channels 303 are located at one side of the first piezoelectric cavity 302, and the flow channels of every two rows of the first piezoelectric cavities 302 are arranged oppositely to share one ink inlet channel 403 which will be described later.
Specifically, the ink channel plate 4 is located below the flow channel plate 3, at least one fourth ink hole 401, a plurality of second piezoelectric cavities 402, and at least one ink inlet channel 403 are formed in the ink channel plate 4 and vertically penetrate through the ink channel plate 4, the fourth ink hole 401 is aligned with the third ink hole 301, the ink inlet channel 403 is communicated with the flow channel 303, the plurality of second piezoelectric cavities 402 are arranged in an array manner as the plurality of first piezoelectric cavities 302, and the second piezoelectric cavities 402 are aligned with the first piezoelectric cavities 302.
As an example, the ink inlet channel 403 is a rectangular through slot, the size of which needs to consider the size of the first piezoelectric cavity 302, the flow channel 303 and the second piezoelectric cavity 402, and in design, the ink inlet channel 403 needs to be connected with the flow channel 303, but preferably is not directly connected with the first piezoelectric cavity 302, so that the measurement accuracy should be measured during alignment.
As an example, the plurality of second piezoelectric cavities 402 are arranged in at least two rows, where two rows of the second piezoelectric cavities share one ink inlet channel, or one ink inlet channel is used for each row of the second piezoelectric cavities, or two ink inlet channels are used for each row of the second piezoelectric cavities. In this embodiment, it is preferable that two rows of the second piezoelectric chambers 402 share one ink inlet channel 403. Of course, in other embodiments, a plurality of the second piezoelectric chambers 402 may be arranged in only one row, wherein one ink inlet channel is used for the second piezoelectric chamber 402 in the row, or two ink inlet channels are used for the second piezoelectric chamber 402 in the row.
Specifically, the connecting plate 5 is located below the ink channel plate 4, an ink cavity 501 and a plurality of connecting cavities 502 penetrating the connecting plate 5 up and down are arranged in the connecting plate 5, the connecting cavities 502 are aligned with the second piezoelectric cavity 402, and the ink cavity 501 is communicated with the fourth ink hole 401 and the ink inlet channel 403.
As an example, the ink chamber 501 includes a main ink passage 5011 and a branch ink passage 5012 connected to each other, the main ink passage 5011 communicates with the fourth ink hole 401, and the branch ink passage 5012 is aligned with the ink inlet 403. In this embodiment, corresponding to the two fourth ink holes 401, the ink chamber 501 includes two main ink paths 5011 disposed oppositely, a plurality of branch ink paths 5012 are located between the two main ink paths 5011, and two ends of each branch ink path 5012 are respectively connected to the two main ink paths 5011.
By way of example, the opening of the connection chamber 502 is not larger than the opening of the second piezoelectric chamber 402, and the branch ink passage 5012 is not smaller than the ink inlet passage 403, but is not so large as to directly communicate with the second piezoelectric chamber 402.
As an example, the edge of the connection cavity 502 may not be flush with the second piezoelectric cavity 402, and the edge of the branch ink passage 5012 may not be flush with the edge of the ink inlet passage 403.
Specifically, the orifice plate 6 is located below the connecting plate 5 and closes at least a portion of the ink chamber 501, a plurality of orifices 601 are provided in the orifice plate 6, and the orifices 601 are aligned with the connecting chamber 502. The opening area of the nozzle 601 is smaller than the opening area of the connection cavity 502, and the specific size of the nozzle is determined by the actual application scenario.
It should be noted that the orifice plate 6 may close all of the ink chamber 501, or may close only the branch ink paths 5012 of the ink chamber 501, while the main ink path 5011 of the ink chamber 501 is closed by a flexible film layer 7. In this embodiment, the flexible film layer 7 is preferably used to close the main ink channel 5011 of the ink chamber 501, which is beneficial to increase the deformation amount of the ink chamber, generate greater ink thrust, and help prevent the backflow of ink. In this embodiment, the material of the flexible film layer 7 is preferably a polymer material, so as to meet the requirements of some ink materials with high corrosivity. The flexible film layer 7 and the orifice plate 6 can be processed separately or integrally.
As an example, as shown in fig. 2, an adhesive layer 8 is further disposed on a lower surface of the connection plate 5 to improve a bonding force between the connection plate 5 and the orifice plate 7, the orifice plate 7 is connected to a lower surface of the adhesive layer 8, and the flexible film layer 7 is also attached to a lower surface of the adhesive layer 8. In this embodiment, the adhesion layer 8 is preferably made of a metal plate with low cost and easy processing, the pattern of the adhesion layer 8 can be completely consistent with the pattern of the connection plate 5, and the pattern in the adhesion layer 8 can be obtained by laser processing. The adhesive layer 8 may be bonded or adhered to the lower surface of the connection plate 5.
Specifically, the material of the package plate 1, the vibration plate 2, the flow channel plate 3, the ink channel plate 4, the connection plate 5, and the orifice plate 6 includes at least one of silicon, silicon oxide, glass, hard plastic (high-hardness organic material), and metal. In this embodiment, the packaging plate 1, the vibrating plate 2, the flow channel plate 3, the ink channel plate 4, the connecting plate 5, and the orifice plate 6 are preferably made of silicon material and its oxide, and can be conveniently manufactured by a semiconductor processing process to realize fine processing of an all-MEMS structure.
In the microfabrication process, ion thinning (ion mill), ion coupled plasma etching (ion coupled plasma etch), reactive ion etching (reactive ion etch), wet etching (wet etch) and other methods can be used for processing the thin-film piezoelectric material and the silicon, depending on the processing conditions and capabilities. In the processing process, the photoresist is inevitably used for patterning or protecting the material and the structure, and special attention should be paid to the method for removing the photoresist and the developing solution, so that the material is prevented from being damaged in the engineering and the degradation is avoided. In particular, it is important to note that piezoelectric materials exhibit depolarization at high temperatures, and that process conditions should be carefully tailored to the material tolerances.
As an example, the package plate 1, the vibration plate 2, the flow channel plate 3, the ink channel plate 4, the connection plate 5, and the orifice plate 6 may be processed separately, or at least one group of two or three adjacent layers may be processed integrally, which may save a certain material cost, but may provide a greater challenge for processing. In this embodiment, the diaphragm 2 and the flow path plate 3 are integrally formed, and the ink path plate 4 and the connection plate 5 are integrally formed.
As an example, two adjacent layers of the package plate 1, the vibration plate 2, the flow channel plate 3, the ink channel plate 4, the connection plate 5, and the orifice plate 6 are bonded by using an adhesive method or a direct bonding method, in this embodiment, direct bonding is preferably used, which is beneficial to avoiding the situations of material mismatch and the like. For the condition of adopting the gluing mode for combination, a high polymer material is preferentially adopted for adhesion so as to meet the requirement of dealing with some ink materials with higher corrosivity. In addition, under the premise of low ink corrosivity, common adhesives can be used for gluing. During the packaging process, special attention should be paid to the fact that high temperature may cause temperature mismatch of materials, thereby affecting reliability; in addition, high temperatures can also cause depolarization of the piezoelectric material, and should be avoided as much as possible.
It should be noted that, in the package plate 1, the vibration plate 2, the flow channel plate 3, the ink channel plate 4, the connection plate 5, and the orifice plate 6, many patterns need to be aligned strictly, and in alignment, various methods such as pin alignment, optical alignment, and the like may be adopted, and depending on the alignment method, alignment holes, alignment patterns, and the like may be added to each layer.
When the liquid ejecting device of the embodiment is used, ink flows in through the first, second, third and fourth aligned ink holes, flows into the ink inlet channel, the flow channel, the first vibration cavity, the second vibration cavity and the connecting cavity through the ink cavity in sequence, and is finally ejected out of the nozzle hole, so that ink jet printing is realized. The device is based on a thin film piezoelectric material and a silicon-based material, is assisted by an organic material film and a metal precision workpiece (the metal plate), adopts a full MEMS structure design, realizes a full MEMS structure liquid jet device, and can jet high-jet-quantity liquid materials.
Example two
In the present embodiment, a package structure is provided, please refer to fig. 3, which is an exploded schematic view of the package structure, and includes a structure fixing component 9, an external ink component 10, and a liquid ejecting device 11 as in the first embodiment, where the structure fixing component 9 includes a receiving slot 901 and at least one driving chip 902, and an opening 903 is formed at the bottom of the receiving slot 901; the liquid ejecting device 11 is placed in the accommodating groove 901 and electrically connected to the driving chip 902, wherein a surface of the liquid ejecting device 11 having the nozzle hole faces downward, and the nozzle hole is exposed by the opening 903 at the bottom of the accommodating groove 901; the outer ink assembly 10 is positioned above the liquid ejection device 11 for supplying ink to the liquid ejection device 11 through the first ink orifice 101.
Specifically, the outer ink assembly 10 is used to provide an interface to and from the outer ink, typically using metal tubing for connection. The external ink supply assembly 10 may have an ink chamber 10a therein for accommodating a volume of ink, and the ink chamber 10a may have an interface for interfacing with a liquid ejection ink orifice, i.e., the ink chamber 10a communicates with the first ink orifice 101 of the package plate. The upper surface of the outer ink assembly 10 may be provided with at least one ink feed hole 10b communicating with the ink reservoir 10 a.
As an example, the receiving groove 901 is surrounded by a pair of hard structural frames 904 and a metal frame 905 located between the pair of hard structural frames 904, the hard structural frames 904 may be made of hard plastic, glass, metal, or the like, and are used for protecting the droplet ejection device, and the opening 903 in the metal frame 905 is used for not blocking the nozzle hole. It should be noted that the receiving groove 901 should be prevented from being too large to lose the protection effect while accommodating the droplet ejection device 11.
After the droplet ejection device 11 is mounted in the structural mounting assembly 9, it is generally necessary to interconnect the leads inside the droplet ejection device 11 with the driver chip 902. The interconnection method may use various mainstream interconnection methods such as a flexographic plate interconnection, a bonding wire interconnection, and the like. After the interconnection of the devices and the assembly of the devices and other components are completed, the devices can be further protected by one-time packaging by using protective glue. Please refer to fig. 4, which is a schematic diagram of the package structure after the assembly is completed.
In practical applications, both ink holes of the droplet ejection device 11 may be used as ink inlets, one end of each ink hole may be used as an ink inlet, and the other end of each ink hole may be used as an ink outlet, or one end of each ink hole may be completely closed. Ink is injected through an ink hole of an external ink component, and after a proper voltage is applied to a pin, a piezoelectric film structure in the device deforms to form pressure waves and jet the ink out of the ink hole in the form of ink drops.
In summary, the liquid ejection device of the present invention can be manufactured by a full MEMS process, and has the advantages of high precision and high integration, wherein the piezoelectric cavities in the flow channel plate and the ink channel plate are arranged in an array, the monolithic integration density is higher, the design flexibility is better, the high resolution and high breadth arrangement of the monolithic chip can be completed, and the size of the piezoelectric cavity can be changed according to different viscosities of the ink, so that not only low viscosity ink can be adapted, but also high viscosity ink can be adapted, droplets with larger ejection size can be ejected, a large amount of ink ejection of the high viscosity ink can be realized, and the requirement of large flux in industrial manufacturing can be satisfied. The liquid injection device adopts the thin film piezoelectric material, so that better frequency characteristics can be brought, the energy consumption is lower, and the heat productivity is less; since the processing can be performed using a semiconductor process, the cost can be reduced in mass production. The liquid jet device can be packaged together with an external ink component and a driving chip through a structure fixing component to form the ink jet device. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (18)
1. A liquid ejection device, comprising:
the packaging plate is provided with at least one first ink hole which vertically penetrates through the packaging plate, and the lower surface of the packaging plate is provided with a plurality of grooves;
the vibration plate is positioned below the packaging plate, at least one second ink hole which vertically penetrates through the vibration plate is formed in the vibration plate, the second ink hole is aligned with the first ink hole, a plurality of thin film piezoelectric structures are arranged on the upper surface of the vibration plate, and the thin film piezoelectric structures are aligned with the grooves;
the runner plate is positioned below the vibrating plate, at least one third ink hole, a plurality of first piezoelectric cavities and a plurality of runners are formed in the runner plate and penetrate through the runner plate up and down, the third ink hole is aligned to the second ink hole, the first piezoelectric cavities are aligned to the thin film piezoelectric structure, and each first piezoelectric cavity is communicated with at least one runner;
the ink channel plate is positioned below the flow channel plate, at least one fourth ink hole, a plurality of second piezoelectric cavities and at least one ink inlet channel are formed in the ink channel plate and penetrate through the ink channel plate up and down, the fourth ink hole is aligned to the third ink hole, the second piezoelectric cavities are aligned to the first piezoelectric cavities, and the ink inlet channels are communicated with the flow channel;
the connecting plate is positioned below the ink channel plate, an ink cavity and a plurality of connecting cavities which vertically penetrate through the connecting plate are arranged in the connecting plate, the connecting cavities are aligned to the second piezoelectric cavity, and the ink cavity is communicated with the fourth ink hole and the ink inlet channel;
the jet orifice plate is positioned below the connecting plate and closes at least one part of the ink cavity, a plurality of jet orifices are arranged in the jet orifice plate, and the jet orifices are aligned with the connecting cavity;
the first piezoelectric cavities and the second piezoelectric cavities corresponding to the first piezoelectric cavities are arranged in an array, the second piezoelectric cavities are arranged in a row, and one ink inlet channel is used for the second piezoelectric cavities in the row or two ink inlet channels are used for the second piezoelectric cavities in the row; or the plurality of second piezoelectric cavities are arranged in at least two rows, wherein the two rows of second piezoelectric cavities share one ink inlet channel, or each row of second piezoelectric cavities uses two ink inlet channels.
2. The liquid ejection device according to claim 1, wherein: the lower surface of the connecting plate is further provided with an adhesion layer, and the spraying hole plate is connected to the lower surface of the adhesion layer.
3. The liquid ejection device according to claim 2, wherein: the material of the adhesion layer comprises metal.
4. The liquid ejection device according to claim 1, wherein: the ink cavity comprises a main ink channel and a branch ink channel which are connected, the main ink channel is communicated with the fourth ink hole, and the branch ink channel is aligned with the ink inlet channel.
5. The liquid ejection device according to claim 4, wherein: the orifice plate seals the branch ink channel, and the liquid ejecting device further includes a flexible film layer located below the connection plate and sealing the main ink channel.
6. The liquid ejection device according to claim 5, wherein: the flexible film layer is made of high polymer materials.
7. The liquid ejection device according to claim 5, wherein: the lower surface of the connecting plate is also provided with an adhesion layer, and the flexible film layer is attached to the lower surface of the adhesion layer.
8. The liquid ejection device according to claim 7, wherein: the material of the adhesion layer comprises metal.
9. The liquid ejection device according to claim 1, wherein: the film piezoelectric structure comprises an upper electrode, a lower electrode and a piezoelectric material layer, wherein the piezoelectric material layer is positioned between the upper electrode and the lower electrode, and the upper electrode and the lower electrode are respectively connected with a lead.
10. The liquid ejection device according to claim 9, wherein: the piezoelectric material layer includes lead zirconate titanate.
11. The liquid ejection device according to claim 10, wherein: the piezoelectric material layer includes single crystal lead zirconate titanate.
12. The liquid ejection device according to claim 1, wherein: the packaging plate, the vibrating plate, the runner plate, the ink channel plate, the connecting plate and the orifice plate are made of at least one of silicon, silicon oxide, glass, hard plastics and metal.
13. The liquid ejection device according to claim 1, wherein: at least one group of two adjacent layers or three adjacent layers of the packaging plate, the vibrating plate, the runner plate, the ink channel plate, the connecting plate and the orifice plate are integrally processed.
14. The liquid ejection device according to claim 1, wherein: and adjacent two layers of the packaging plate, the vibration plate, the runner plate, the ink channel plate, the connecting plate and the orifice plate are combined in an adhesive connection mode or a direct bonding mode.
15. The liquid ejection device according to claim 1, wherein: the opening area of the jet hole is smaller than that of the connecting cavity.
16. A package structure, comprising:
the structure fixing component comprises an accommodating groove and at least one driving chip, and an opening is formed in the bottom of the accommodating groove;
the liquid ejecting device as claimed in any of claims 1 to 15, placed in the receiving container and electrically connected to the driving chip, wherein a surface of the liquid ejecting device having the nozzle faces downward, and the opening exposes the nozzle;
an outer ink assembly positioned above the liquid ejection device for supplying ink to the liquid ejection device through the first ink orifice.
17. The package structure of claim 16, wherein: an ink chamber is arranged in the external ink component and is communicated with the first ink hole of the packaging plate, and at least one ink conveying hole communicated with the ink chamber is formed in the upper surface of the external ink component.
18. The package structure of claim 16, wherein: the liquid ejection device and the driving chip are interconnected through a flexible printing plate or a bonding wire.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010407123.2A CN113665245B (en) | 2020-05-14 | 2020-05-14 | Liquid injection device and packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010407123.2A CN113665245B (en) | 2020-05-14 | 2020-05-14 | Liquid injection device and packaging structure |
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| CN113665245B true CN113665245B (en) | 2022-10-28 |
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| CN114633560B (en) * | 2022-03-30 | 2022-11-11 | 山东中康国创先进印染技术研究院有限公司 | Ink jet printing head and ink jet printing equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE3250105C2 (en) * | 1981-12-29 | 2001-02-22 | Canon Kk | Ink jet printer head |
| KR20070025312A (en) * | 2005-09-01 | 2007-03-08 | 삼성전자주식회사 | Array type print head and inkjet image forming apparatus with the same |
| DE602007012162D1 (en) * | 2006-03-20 | 2011-03-10 | Brother Ind Ltd | A method of manufacturing a piezoelectric actuator, ink jet head and ink jet printer with aerosol deposition method, piezoelectric actuator, ink jet head and ink jet printer |
| KR100773566B1 (en) * | 2006-12-27 | 2007-11-05 | 삼성전자주식회사 | Damper of inkjet head and method of forming the same |
| CN101342520B (en) * | 2007-07-10 | 2011-08-03 | 研能科技股份有限公司 | Fine liquid drop spray structure |
| TWI342267B (en) * | 2007-07-13 | 2011-05-21 | Microjet Technology Co Ltd | Micro-droplet spray structure |
| CN101888931B (en) * | 2007-12-10 | 2012-09-05 | 柯尼卡美能达控股株式会社 | Ink jet head and electrostatic attraction ink jet head |
| JP2011167855A (en) * | 2010-02-16 | 2011-09-01 | Seiko Epson Corp | Liquid ejecting head and liquid ejecting apparatus |
| JP5686080B2 (en) * | 2011-09-30 | 2015-03-18 | ブラザー工業株式会社 | Droplet ejector |
| CN111038105B (en) * | 2019-12-19 | 2021-09-07 | 西安增材制造国家研究院有限公司 | Piezoelectric type ink-jet printing head |
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