CN1136599A - Corrosion apparatus - Google Patents

Corrosion apparatus Download PDF

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Publication number
CN1136599A
CN1136599A CN95121846A CN95121846A CN1136599A CN 1136599 A CN1136599 A CN 1136599A CN 95121846 A CN95121846 A CN 95121846A CN 95121846 A CN95121846 A CN 95121846A CN 1136599 A CN1136599 A CN 1136599A
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corrosion
equipment
chamber
halogen gas
substrate
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CN1128893C (en
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山崎舜平
须泽英臣
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Thin Film Transistor (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

A Etching device comprises a substrate carry-in chamber, a substrate carrier chambers, a substrate carry-out chambe and a erode chamber. In the erode chamber, etching is done with the use of halogen fluoride gas such as ClF3, such as etching the source layer of the film transistor, on the condition that, not to make halogen fluoride gas ionize or the plasma enhance. Since no plasma damage follows etching, avoiding the apperence of the trap energy level, whereupon, restraining the movement of the current carrier through the trap energy level, thus reducing the cut-off current value in the film transistor.

Description

Etching apparatus
The present invention relates to a kind of etching apparatus that is used to corrode silicon semiconductor, particularly be used for forming the etching apparatus of thin film transistor (TFT) active layer by corrosion.
Recently, people pay close attention to active-matrix liquid crystal display device.In these devices, the pixel capacitors more than 100 * 100 is arranged in matrix form, and each pixel capacitors is connected with a TFT with silicon film, so that control the electric charge that remains in each pixel by TFT.
Because liquid crystal display device must be a printing opacity basically, must be with visible light permeable material as substrate.Visible light permeable material comprises quartz substrate and glass substrate.Because of the quartz substrate costliness, generally need not be quartzy, and use glass substrate.Yet, desire on glass substrate to produce that to have high performance TFT be difficult.
In order to improve the characteristic of TFT, the most effective way is the degree of crystallinity that increases stand-by silicon film.But when using glass substrate, since the problem of the heat resisting temperature of glass, the very difficult single crystal that obtains single crystal or corresponding silicon film.Generally, can obtain to have the title polycrystalline of insufficient crystal form or the silicon fiml of crystallite.When use had the silicon film production TFT of polycrystalline or microlitic structure, vital technical problem was relevant with cutoff current characteristic.
Generally, when making TFT with the silicon film with polycrystalline or microlitic structure, the cut-off current value is more greatly a fact.Cut-off current is being represented and is being worked as the electric current between source, the drain region of flowing through that TFT is in off-state.
In a TFT who is configured in the pixel capacitors, when the source of TFT is connected to a source line and the leakage of TFT when being connected to pixel capacitors, by the conducting of TFT, the quantity of electric charge of expection flows to pixel capacitors from the source line through TFT.In addition, by ending of TFT, the quantity of electric charge of expection is remained in the pixel capacitors.At this moment, when the cut-off current value was very big, electric charge flowed from pixel capacitors gradually.Under this state, because in the time cycle of expection, in pixel capacitors, do not keep the quantity of electric charge of expection, then can not finish necessary demonstration.The problem relevant with cut-off current may be to be caused by the motion of current carrier by crystal boundary.
In N ditch type TFT, when positive voltage put on gate electrode, raceway groove became the N type, therefore finished the conducting operation.In addition, when negative voltage was put on gate electrode, raceway groove became the P type, therefore finished by operation.
In operation, because source, drain region become the N type, and raceway groove becomes the P type, so form a NPN structure between source, drain region.So ideal should not have electric current to flow through between source, drain region.But this state is to have the perfect condition that is obtained under the situation of single crystal structure at the silicon film that constitutes active layer.In fact, because silicon film does not have complete single crystal structure, current carrier may be by trap level motion in the crystal boundary.Because this carrier moving has cut-off current and flows.
As mentioned above, have on glass substrate the crystalline of formation silicon semiconductor film and have many crystallizations or microlitic structure, in this film, have a large amount of crystal boundaries.In crystal boundary, there is a large amount of trap levels.
Current carrier is significant in the zone that has applied high electric field by the motion of trap level.Particularly the interface in channel region and drain region and near, this motion is significant.So as a kind of method that suppresses current carrier by the motion of this district's internal trap energy level, well-known is to form a light doping section and the deviate region (electric field buffer zone) of boundary between channel region and drain region.Generally, these two kinds of structures are called LDD (lightly doped drain) structure and skew grid structure.
In fact, when be formed with the crystalline silicon film on glass substrate, when using this kind silicon film to make TFT then, LDD structure and skew grid structure are effectively, so that cut-off current can reduce to a certain extent.Yet, also be difficult to obtain necessary low cutoff current characteristic.
Generally, make the resist composition, form the figure of expection, make mask with resist then, use isoionic dry corrosion, so that finish the formation of active layer by photoetching process.
According to the result of study to the cut-off current problem among the top TFT, the present inventor obtains following understanding.
In with dry corrosion method corrosion active layer, plasma damage appears at the active layer both sides.Because this plasma damage can form highdensity trap level in the active layer both sides.Particularly, be a kind of state that high-density produces trap level because have the crystal silicon film of polycrystalline or microlitic structure, this phenomenon is significant.
When a large amount of trap level of therefore planting plasma damage in the active layer both sides and being produced existed with high-density, current carrier may be astonishing by the motion of trap level.That is, cut-off current can increase.This class problem is particularly having the film of a large amount of crystal boundaries, as being serious in polysilicon film or the microcrystalline sillicon film.That is, because trap level is present in crystal boundary easily and is easy to generate.
Be formed at the lateral trap level density of active layer and be higher than the density that is formed at active layer inside (film inside) far away.So, though formed LDD structure or skew grid structure, by being formed at impossible how much minimizing of the quantity of electric charge that the lateral trap level of active layer moves.That is how many cut-off current values can not reduce.
LDD structure and off-set construction suppress to influence the carrier moving of cut-off current by the strength of electric field that reduces the electric field concentration zones.Say definitely, these structure decrease the quantity of motion current carrier.But when the trap level density that influences carrier moving was extremely high, even electric field has reduced, motion current carrier total amount also can not reduce so many.
Improve the problem relevant by reducing the lateral trap level density of active layer with cut-off current.From as can be known above, the plasma damage in being to corrode has mainly produced and has concentrated on the lateral trap level of active layer.Thereby, by reducing the plasma damage of dry corrosion, can improve the problem relevant with the TFT cut-off current.
As the method that prevents the lateral plasma damage of active layer, a kind of method of carrying out wet etching is proposed in the formation of active layer.Yet, use the method for wet etching to have following problem.
(1) do not have and only selectively to corrode silicon fiml, the suitable etching reagent of good corrosion control and well reproduced is arranged.
(2) be difficult to control the temperature and the etching condition of etching reagent.
Purpose in the disclosed the present invention of specification sheets is to provide a kind of energy to implement to use dry corrosion and do not make trap level concentrate on the etching apparatus of the lateral technology of active layer.
Being characterised in that of the disclosed the present invention of specification sheets, this equipment has a use and fluoridizes halogen gas and do not make and fluoridize the chamber that halogen gas ionization or plasma enhanced are used for etching process.Fluoridize halogen gas and comprise ClF 3, ClF, BrF 3, IF 3, BrF, BrF 5And IF 5In at least a.In addition, needn't use 100% the halogen gas of fluoridizing, use behind the available suitable gas dilution.Do not make and fluoridize halogen gas ionization or plasma enhanced etching process, in etching process, reduce plasma damage.
According to being characterised in that of another kind of structure of the present invention, this equipment comprises that one is used to implement corrosive first Room, one and keeps second Room of a large amount of substrates and one to be arranged at having device that transmits substrate and the 3rd Room that can reduce pressure between first and second Room, halogen gas is fluoridized in use wherein, does not fluoridize the halogen gas ionization or plasma enhanced etching process carries out in first Room and do not make.
One example of said structure is shown in Fig. 1.In Fig. 1, an equipment comprises: corresponding to the oorroding house 800 of first Room; Substrate holding chamber 702 corresponding to second Room that keeps a large amount of substrates; And being arranged at substrate transfer chamber 701 between oorroding house 800 and the substrate holding chamber 702, this chamber is provided with a mechanical arm 710 corresponding to the device that transmits substrate.
According to being characterised in that of another kind of structure of the present invention, this equipment comprises having the chamber that imports the device of fluoridizing halogen gas, use is wherein fluoridized halogen gas and is not made and fluoridize the halogen gas ionization or plasma enhanced etching process carries out in this chamber, and this chamber also has and is used for the device that measuring light is treated the transmission of corrosion material and determined the etch state of material.
One example of said structure is shown in Fig. 1.In Fig. 1, one equipment comprises that has an oorroding house 800 that imports the gas delivery system 812 of fluoridizing halogen gas, the etching process that non-ionization of use wherein or non-plasma enhanced are fluoridized halogen gas carries out at oorroding house 800, comprises that also is used for a device 806 and the device 804 that is used to detect transmitted light that corrosion material is treated in the exposure light transmission.
According to being characterised in that of another structure of the present invention, this equipment comprises: untreated substrate holding chamber, the first substrate transfer chamber that links to each other with substrate holding chamber before handling, the oorroding house that links to each other with the first substrate transfer chamber, the second substrate transfer chamber that links to each other with oorroding house and with processing that the second substrate transfer chamber links to each other after the substrate holding chamber, substrate holding chamber after substrate holding chamber before the processing wherein and the processing has the function that keeps a large amount of substrates, first and second transfer chambers have the device that transmits substrate, and oorroding house has the non-ionization of use or non-plasma enhanced and fluoridizes halogen gas and carry out the corrosive function as etchant gas.
One example of said structure is shown in Fig. 1.In Fig. 1, show substrate holding chamber 702 before handling, the first substrate transfer chamber 701, oorroding house 800, the second substrate transfer chamber 820, handle back substrate holding chamber 830 and corresponding to the mechanical arm 710 and 821 of the device that transmits substrate.Figure 10 has represented the top view of the etching apparatus of Fig. 1.
When the equipment that uses Fig. 1 forms the active layer of TFT, must prevent that the plasma of fluoridizing halogen gas from strengthening (ionization), so that unlikely generation plasma is to the damage of active layer.When gas is not excited with not ionization, can prevent that plasma from strengthening.In addition, when not applying electromagnetic energy, can prevent ionization.Electromagnetic energy comprises high-frequency energy and micro-wave energy.
When fluoridizing halogen gas and do not apply electromagnetic energy, can prevent that plasma from strengthening and the exciting and ionization of gas.Because fluoridize halogen gas such as ClF 3Silicon there is very strong corrosive nature, under the condition that does not apply electromagnetic energy such as high-frequency energy, promptly can two-forty ground corrosion silicon.
In order to prevent the corrosive rapid processing, expectation corrosive pressure is 0.001～100Torr, preferably at 0.01～1Torr.Can obtain suitable erosion rate in this pressure range.
According to being characterised in that of another structure of the present invention, this equipment comprise use fluoridize halogen gas and do not make fluoridize halogen gas ionization or plasma enhanced carry out corrosion treatment first Room, be used to remove second Room of resist and link to each other with first and second Room and have the chamber of the device that is used to transmit substrate.
In said structure, corrode simultaneously and heating is effective.This is because heating can increase erosion rate.In addition, it is effective carrying out the temperature that corrosive remains on expection simultaneously.This is because use ClF in corrosion 3Erosion rate as etchant gas is high, and the difference of corrosion temperature is very little, and also great changes have taken place for etch state.
Fig. 1 represents the sectional view of the etching apparatus of embodiment 1;
Fig. 2 A～2D and Fig. 3 A～3C represent to make the technology of the thin film transistor (TFT) of embodiment 2;
Fig. 4 is the signal enlarged view that characterizes the active layer state;
Fig. 5 A～5D and Fig. 6 A, 6B represent to make the technology of the TFT that is arranged at peripheral drive circuit district and pixel region of embodiment 3;
Fig. 7 A～7G represents to make the technology that embodiment 4 is arranged at the TFT of pixel region;
Fig. 8 A and 8B represent the sectional view of the etching apparatus of embodiment 5;
Fig. 9 represents the sectional view of the etching apparatus of embodiment 6;
Figure 10 is the top view of the etching apparatus of Fig. 1.
Embodiment 1
Fig. 1 represents the sectional view of the etching apparatus of embodiment 1, and Figure 10 is the top view of Fig. 1 etching apparatus.This etching apparatus can be handled a large amount of substrates (material) one by one.By corrode, handle a large amount of substrates that remain in the box of handling in the preceding substrate holding chamber 702 712 one by one at oorroding house 800.Substrate after the processing is maintained in the box of handling in the back substrate holding chamber 830 835.So, it is characterized in that a large amount of substrates handles by corroding one by one.(equipment describe)
A large amount of pending substrates (material) is remained in the cassette of substrates 712, send into from the outside again and handle the preceding substrate holding chamber 702.About substrate 711, use glass substrate and quartz substrate, form thereon and treat the corrosive silicon semiconductor layer.In the chamber 702, be provided with and import nitrogen (or a kind of rare gas element) system and air-bleed system (all not shown), if necessary, available nitrogen wash.Particularly, chamber 702 is not designed to will obtain to subtract (low) pressure condition.
Keep the cassette of substrates 712 of substrate 711 to be set on the platform 754 that moves by along the vertical direction elevator 753.Substrate holding chamber 702 links to each other with the substrate transfer chamber 701 with mechanical arm 710 by gate valve 706 before handling.
Substrate transfer chamber 701 has a gas delivery system 794, so that import nitrogen or rare gas element, also has a fine pumping system that is made of gate valve 790 and fine pumping pump 791.By the flow of valve 793 controls from the gas of system's 794 importings.
Substrate transfer chamber 701 links to each other with oorroding house 800 by valve 801.Oorroding house 800 is provided with platform 803 (quartzy system), LASER Light Source 806, the speculum 807 of placing substrate, is used to make laser to introduce the quartz window 805 of chamber 800 and the photosensor that is used for detection laser.
Etchant gas is imported into oorroding house 800 from gas delivery system 812 through valve 810.Import nitrogen or rare gas element from gas delivery system 813 through valve 811.In order to extract useless gas and the low-pressure state for obtaining at oorroding house to expect out, chamber 800 links to each other with vacuum air pump 809 by valve 808.
Oorroding house 800 links to each other with substrate transfer chamber 820 by gate valve 814.The substrate 822 that to finish corrosion treatment with mechanical arm 821 800 is delivered to chamber 820 from the chamber.In chamber 820, be provided for importing the gas delivery system 827 of nitrogen or rare gas element and the air-bleed system that constitutes by valve 825 and vacuum air pump 823.Control the flow of the gas that imports from system 827 by valve 826.
Substrate transfer chamber 820 links to each other with processing back substrate holding chamber 830 by gate valve 828.In chamber 830, on the platform that moves along the vertical direction by elevator 832, the cassette of substrates 835 (identical with cassette of substrates 712) that can keep a large amount of substrates is set.(operating process example)
Explain the corrosion operational instances now.Closeall gate valve 706,801,814 and 828.With off-gas pump 791,809 and 823, the substrate transfer of finding time chamber 701,820 and oorroding house 800, to obtain high vacuum state.The cassette of substrates 835 that does not keep substrate is put into the preceding substrate holding chamber 830 of processing.Make chamber 830 reach an atmospheric nitrogen full state.
Under this state, the cassette of substrates that keeps the substrate of desired number is sent into the preceding substrate holding chamber 702 of processing from the external world.After sending into cassette of substrates, chamber 702 is filled with an atmospheric nitrogen.
Then, nitrogen is imported substrate transfer chamber 701, to reach a normal atmosphere.When chamber 701 becomes an atmospheric pressure state, open gate valve 706, take out a substrate 711 with mechanical arm from cassette of substrates 712 then.At this moment, elevator moves along the vertical direction, makes mechanical arm aim at the position of substrate 711.After substrate 711 usefulness mechanical arms 710 are sent to chamber 701, closing gate valve 706.
Then, make substrate transfer chamber 701 reach high vacuum state.When chamber 701 becomes high vacuum state, open gate valve 801, substrate is placed on the estrade 803.Then, closing gate valve 801.
Then, with ClF 3Gas imports oorroding house 800, and under the low-pressure state of expection, corrosion is formed on the semiconductor film on the substrate surface.Etch state can be verified from the transmissive state of the laser (having the shortwave wavelength) that gives off from light source 806.
For example, have under the thick crystal silicon film situation of 500nm, wavelength is that the optical transmission rate of 500nm is 50%, and under glass substrate or the situation by the estrade 803 of quartz system, transmissivity is 80%.Thereby, when use wavelength from light source 806 be the photoirradiation of 500nm be formed on the glass substrate treat the corrosive crystal silicon film time, after the corrosion of finishing crystal silicon film, very big variation is arranged by the detected light intensity of photosensor.So, when when very big, stopping to import etchant gases, simultaneously, import nitrogen, so that can prevent unnecessary corrosion (for example, in horizontal hysteresis corrosion) from gas delivery system 813 by gas delivery system 812 by the detected intensity variation of photosensor.
After finishing corrosion, make oorroding house 800 reach high vacuum state, open gate valve 814, take out substrate 822 with mechanical arm 821 from oorroding house 800 then.Then, closing gate valve 814 charges into substrate transfer chamber 820 with nitrogen.When chamber 820 becomes a normal atmosphere, open gate valve 828, substrate 822 is remained in the cassette of substrates 835.Then, behind closing gate valve 828, make chamber 820 reach high vacuum state again.
Its result charges into chamber 702 and 830 with nitrogen and reach an atmospheric state, and chamber 701,800 and 820 still is in high vacuum state.In addition, all valves 706,801,814 and 828 are in closing condition.Under this state, after making chamber 701 reach an atmospheric pressure state again, open gate valve 706, take out next substrate with mechanical arm 710 from cassette of substrates 712 then and send into chamber 701, so that begin the etching process of next substrate, repeat aforesaid operations and corrode next substrate.
Like this, handle the whole substrates that remain in the cassette of substrates 712 by corrosion one by one.This etching process process under the control of computer (not shown), can be carried out automatically.
In the structure of Fig. 1, use the laser of shortwave wavelength to determine etch state by measuring transmitted light.But also can measure reflected light.In this measures,,, variation by the observation reflective light intensity and catoptrical change of interference fringes finish so can detecting corrosive because be that corrosion process with silicon fiml changes corresponding to the light reflection state of specific wavelength.Embodiment 2
The present embodiment is illustrated in disclosed the present invention in the specification sheets is suitable for making thin film transistor (TFT) method on glass substrate situation.Fig. 2 A～2D represents the manufacture craft of TFT in this embodiment.
On glass substrate (Corning 1737 glass substrate or Corning 7059 glass substrate) 101, form the silicon oxide film 102 of thick 3000 as counterdie with plasma chemical vapour deposition (plasma CVD) or low pressure hot CVD.This film 102 is used for preventing the diffusion of contaminants from glass substrate 101, and reduces the stress between glass substrate and the formed subsequently active layer thereon.
On silicon oxide film 102, form the amorphous silicon film 103 of thick 500 with plasma CVD or low pressure hot CVD.This film 103 is used as the original membrane (Fig. 2 A) of the active layer that is formed in post-order process formation TFT.
Method by expection makes established amorphous silicon film 103 crystallizations.As the method that makes film 103 crystallizations, known heating method, laser radiation method arranged, add thermal bond laser irradiation method and similar approach.In the present embodiment, adopt the crystallization method of heating, wherein used the metallic element that promotes silicon crystallization.
The following describes the crystallization method of this embodiment.Adopt Ni (nickel) as the metallic element that promotes silicon crystallization.To contain and expect that the nickelous acetate solution of nickel element of concentration is coated on the surface of amorphous silicon film 103.The concentration that is contained in the nickel element in the nickelous acetate solution is to regulate like this, makes the nickel element concentration that is incorporated in the amorphous silicon film 103 be set in about 1 * 10 16Cm -3～5 * 10 19Cm -3If introduce a large amount of nickel, then silicon becomes nickel silicide, and has damaged as semi-conductive characteristic.In addition, if it is very few to introduce the amount of nickel, do not have the effect that promotes crystallization.
Nickelous acetate solution is being coated on amorphous silicon film 103 surfaces, after making the nickel element maintenance and film 103 surfaces contacting, at 550 ℃ temperature heating 4 hours, the crystallization of intact pair of films 103.Generally, though can make the amorphous silicon film crystallization the about 550 ℃ processing of carrying out more than tens of hours.But as described in the present embodiment, when using nickel, compare, can realize crystallization by inherent cryogenic heat treated of short time cycle with common process.In common process, in order to make the amorphous silicon film crystallization, must be in the thermal treatment of carrying out tens of hours more than 600 ℃.
Generally, by containing highdensity defective and high trap level density arranged to the heating of amorphous silicon film or with the resulting crystal silicon film of laser irradiation.
After obtaining crystal silicon film,, form the active layer of TFT with the equipment composition of Fig. 1.Shown in Fig. 2 B, use photo-resist to be formed for forming the mask 100 of active layer.Then, shown in Fig. 2 C, adopt ClF 3Gas corrodes, and forms the active layer 104 of TFT.This corrosion can be carried out under no plasma enhanced room temperature.So almost can prevent the damage of plasma fully to active layer 104 side surfaces.This corrosion is to be undertaken by the technology of the present embodiment 1 equipment with Fig. 1.
Make ClF 3The corrosive feature is that also resist is damaged hardly.When implementing, because big, and exist resist not to be removed fully and stay the situation of part resist the damage of resist with isoionic reactive ion etching (RIE) or wet etching.In making semiconductor device technology, do not need the lingering section of resist.Yet, use ClF according to the present embodiment 3The corrosion of gas is easily.Should note, use ClF 3The corrosion of gas is an isotropic etch.
The etching condition that forms active layer 104 is as follows:
Etchant gas: ClF 3
Reaction pressure: 0.4Torr
Temperature of reaction: room temperature
Erosion rate: 500 /minute
Mask: photo-resist
Be described in room temperature corrosive one example now.Heating etchant gas and don't making its ionization is favourable to improving speed of response.
After finishing corrosion, remove Etching mask 100, obtain the structural state shown in Fig. 2 D.After forming the active layer 104 of Fig. 2 D, adopt plasma CVD, form the gate insulating film 105 of thick 1000 , as shown in Figure 3A.Form the main aluminiferous film of thick 6000 by sputter, form gate electrode 106 by composition then.Then, make anode, in electrolytic solution, carry out anodic oxidation, form the anodic oxide coating 107 (Fig. 3 A) of thick 2000 with gate electrode.
After the structural state that obtains as Fig. 3 A, inject phosphorus (P) ion with plasma doping, press self-aligned manner and form source region 108, channel formation region 109 and drain region 110.Meanwhile, press self-aligned manner and form deviate region 111, this is to make mask because use around the anodic oxide coating 107 of gate electrode 106.Because phosphonium ion is not injected into deviate region 111, thereby be intrinsic basically.In addition, do not make raceway groove with deviate region, and with it as the buffer zone (Fig. 3 B) between channel formation region 109 and source, the drain region 108,110.
After finishing doping, carry out laser or high light irradiation, activate source region 108 and drain region 110.
Shown in Fig. 3 C, the silicon oxide film 112 that forms thick 7000 by plasma CVD is made interlayer dielectric.In addition, after forming contact hole, use aluminium or other metal to form source electrode 113 and drain electrode 115.In hydrogenous atmosphere, carry out thermal treatment in 1 hour then, finish the TFT shown in Fig. 3 C at 350 ℃.
Fig. 4 is the synoptic diagram of active layer state.In the isoionic dry corrosion of the usefulness of routine (generally using RIE),, then there is the path of moving 302 on current carrier edge because produced the high density traps energy level by plasma damage at the side surface 300 of active layer.302 transmit current carriers by trap level along the path.No matter whether form raceway groove at channel formation region 109, always path 302 existence.So though formed deviate region 111, when applying a voltage between source region 108 and drain region 110, current carrier just 302 moves along the path.Since this carrier moving, and increased cut-off current.
In the present embodiment, because active layer is by using ClF 3Gaseous corrosion and composition, can prevent the damage of ion pair active layer side surface 300.Thereby almost can prevent the trap level density that causes because of plasma damage fully at active layer side surface 300.As a result, can reduce the 302 current carrier quantity of moving along the path.In addition, do not suppress the moving of original current carrier of 301 current carriers that move, thereby can effectively utilize skew grid region 11, and can obtain the littler characteristic of cut-off current along the path.Embodiment 3
The present embodiment is showed the technology be used to make active-matrix liquid crystal display device, especially for making the technology of TFT that is formed at the TFT (pixel TFT) in active matrix district and is used to drive the peripheral drive circuit of the TFT that is arranged in the active matrix district simultaneously.
Fig. 5 A～5D represents to make the technology of the TFT of the present embodiment.The silicon oxide film 102 that forms thick 3000 with sputtering method on glass substrate 101 is made counterdie.Form the amorphous silicon film of thick 500 by plasma CVD or low pressure hot CVD, make it crystallization to obtain crystal silicon film 400 through heating or laser irradiation then.
Be formed for forming the Etching mask 401 and the Etching mask 402 (Fig. 5 A) that is used to form the TFT active layer that is arranged in active matrix district (pixel region) of TFT active layer in the peripheral drive circuit.
Utilize the equipment of Fig. 1 to use ClF 3Corrode, form active layer 403 and 404.Etching condition is as follows:
Etchant gas: ClF 3
Reaction pressure: 2Torr
Temperature of reaction: room temperature
Erosion rate: 1000 /minute
Mask: photo-resist
After finishing corrosion, remove Etching mask, thereby obtain the structural state shown in Fig. 5 B.In Fig. 5 B, active layer 403 is used to constitute the TFT of peripheral drive circuit, and active layer 404 is used to be arranged in the TFT of pixel region.
After forming active layer 403 and 404, deposited by electron beam evaporation forms the main aluminiferous film of thick 600 , and composition forms gate electrode 405 and 406 then.Then, make anode with gate electrode 405 and 406, carry out anodic oxidation in electrolytic solution, forming respectively has the thick anodic oxide coating of 2000 407 and 408.Use anodic oxide coating 407 and 408, can form skew grid region (Fig. 5 C) by follow-up impure ion injection technology.
After the structural state that obtains Fig. 5 C,, the foreign ion that is used to form source, drain region is injected into active layer 403 and 404 by ion implantation or plasma doping.For making N channel-type TFT, inject phosphonium ion by plasma doping.
By the injection of phosphonium ion, can form source region 409 and 413 and drain region 412 and 416 at active layer 403 and 404 by autoregistration.In addition, there is not the district of implanting impurity ion to determine as channel formation region 411 and 415 and skew grid region 410 and 414 (Fig. 5 D).
After finishing the foreign ion injection,, make the regional annealing that has injected foreign ion with laser or high light irradiation.In this annealing process, make in preceding step foreign ion injection and make it decrystallized regional 409,412,413 and 416 recrystallize, finish the activation (Fig. 6 A) of implanted dopant simultaneously.
After forming 409,412,413 and 416 districts, shown in Fig. 6 B, the silicon oxide film 501 that forms thick 6000 by plasma CVD is made interlayer dielectric.In addition, form contact hole, form source electrode 502 and the drain electrode 503 of the TFT that is arranged in the peripheral drive circuit district then with aluminium.Simultaneously, form the source electrode 504 of the TFT that is arranged in pixel region.
Form the silicon oxide film 505 of thick 3000 by plasma CVD.After forming contact hole, form tin indium oxide (ITO) electrode 506 that constitutes pixel capacitors.Direct be connected with the drain electrode 416 of the TFT that is arranged in pixel region (Fig. 6 B) of this ITO electrode.
In hydrogenous atmosphere, carry out 1 hour hydrogen treatment, to finish the structure shown in Fig. 6 B at 350 ℃.When forming the structure of the present embodiment,, can obtain owing to form the huge effect that skew grid structure causes reducing cut-off current because reduced widely along TFT active layer side surface mobile cut-off current.That is, can obtain the TFT of little cut-off current.The TFT of this little cut-off current is well suited for as the TFT in the pixel region that is arranged in the active-matrix liquid crystal display device, shown in Fig. 6 B.Embodiment 4
The present embodiment relates at least one and is arranged on the structure of TFT that layout in the active-matrix liquid crystal display device becomes each pixel of matrix form.
Fig. 7 A～7G represents to make the technology of the TFT in the present embodiment.In Fig. 7 A, on glass substrate, form silicon nitride film 602 by plasma CVD and make counterdie.In addition, form silicon oxide film 603 by sputter.Form the amorphous silicon film 604 of thick 500 by plasma CVD or low pressure hot CVD.Form the mask of making by silicon oxide film 605 with known photoetching process.A part of exposing amorphous silicon film 604 by mask 605.
By spin coating, apply the nickelous acetate solution that contains expection concentration nickel element.Nickel element has the katalysis that promotes silicon crystallization.In the case, form nickel element layer or contain layer 606 (Fig. 7 A) of nickel element.
Then 550 ℃ of thermal treatments of carrying out 4 hours.Through this thermal treatment, shown in Fig. 7 B, crystal growth advances from direct importing nickel element district 608 along arrow 600 directions, thereby forms crystal growth district 607.Zone 609 and 610 is terminals of crystal growth.Crystal growth is needle-like or column propelling along the direction that is parallel to substrate.The nickel element of high density is contained in zone 608 and 610.
The nickel concentration (the maximum concentration of measuring) in crystal growth district 607 must be set in 1 * 10 16Cm -3～5 * 10 19Cm -3Regulate the concentration of the nickel element in the nickelous acetate solution in the spin coating proceeding that is contained in Fig. 7 A like this.The concentration of nickel element is the greatest measurement that is recorded by sims (SIMS) by definition.
Adopt disclosed the present invention in the specification sheets, form Etching mask waiting to constitute on the zone of active layer, then, use ClF by photoetching 3Corrosion forms the active layer 611 shown in Fig. 7 C.Can set and embodiment 1 or 2 identical detailed conditions.
Form the silicon oxide film 612 of thick 1000 as gate insulating film by plasma CVD.In addition, form the aluminium film of thick 6000 (containing scandium), then with photoresist mask 614 corrosion by sputter.Though this step etching process is finished.But still Etching mask 614 is remained.The photoresist mask 614 that utilization stays uses the aluminium film that stays to carry out anodic oxidation as anode in electrolytic solution, forms the porous anode layer 615 of thick 5000 .Electrolytic solution contains 3～20% nitric acid (30 ℃).In anodic oxidation, apply the voltage of 10V to the aluminium that stays.Behind this step process, use the part 613 that stays aluminium to make gate electrode (Fig. 7 C).
After removing Etching mask 614, make anode with gate electrode 613 again, in containing the tartaric ethylene glycol solution (pH=7) of 1-3%, carry out anodic oxidation, form the meticulous anodic oxide coating 616 of dense form of thick 2000 .
By the dry corrosion of RIE, the gate insulating film 612 that corrosion is exposed.In this technology, because of the difference of erosion rate, anodic oxide coating 615 and 616 is corroded hardly.Continue this corrosion until exposing active layer 611.As Fig. 7 D, only stayed the gate insulating film 612 at position below gate electrode 613 and anodic oxide coating 615 and 616 '.
After the structural state that obtains shown in Fig. 7 D, remove porous anodic oxide coating 615.Then, by plasma doping, ion implantation in active layer 611 boron (B) with the acceleration voltage of low about 10KV.Thereby the boron ionic imports the restriction that is subjected to gate insulating film exposed part 612, and the boron ion is not injected in the zone 622.On the contrary, the boron ion is injected in the zone 617.Its result is defined as deviate region (Fig. 7 E) with the zone 622 of implanting impurity ion not.
500 ℃ of heating 4 hours, activate the impurity that mixes then.And then, with KrF excimer laser irradiation, improve the annealing effect.The interface (form PI knot place) that the boundary is 617 and 622 in the zone be through gate insulating film 612 ' laser activate fully.Because the trap level in the interface of boundary between zone 617 (corresponding to source-drain areas) and regional 622 (corresponding to deviate regions) causes cut-off current, activate or this district that anneals is very effective to reducing cut-off current.
The silicon oxide film 618 that forms thick 3000 by plasma CVD is made interlayer dielectric.After forming contact hole, use the aluminium film to form source electrode 619.In addition, form the silicon nitride film 620 of thick 3000 again as interlayer dielectric.After forming contact hole, form ITO electrode 621 and make pixel capacitors.So just can obtain a P ditch type TFT (Fig. 7 F and 7G) that deviate region 622 is arranged.
When forming crystal silicon film with the metallic element that promotes silicon crystallization, when composition was formed with the source region then, plasma had brought damage to the surface of active area, had therefore produced the trap level that is caused by metallic element.As mentioned above, when forming active layer, at its side surface plasma damage has appearred.
Described in the present embodiment, when forming active layer with the etch that plasma damage does not take place, though will promote the metallic element of silicon crystallization to be used for constituting the formation of the crystal silicon film of active layer, not high especially in the trap level density of the side surface of active layer.So can suppress the motion of current carrier, and can obtain the TFT of little cut-off current by the active layer side surface.In addition, owing to can suppress the motion of current carrier by the active layer side surface, the formation of deviate region and light doping section has obtained very big effect.Embodiment 5
Fig. 8 A and 8B represent disclosed etching apparatus one example in this specification sheets.The etching apparatus of Fig. 8 A and 8B comprises: oorroding house 902, substrate (material) transfer chamber 900, the substrate holding chamber 903 before handling and handle after substrate holding chamber 904.In oorroding house 902, be provided with place treat the platform 910 of corrosive substrate (material) and have will expection underlayer temperature be controlled at ± heating and cooling mechanism in 5 ℃ the accuracy rating.
Oorroding house 902 links to each other with substrate transfer chamber 900 by gate valve 905.In chamber 900, be provided with the mechanical arm 908 that transmits substrate 909.Chamber 900 links to each other with processing back substrate holding chamber 904 with the preceding substrate holding chamber 903 of processing respectively with 907 by gate valve 906.In chamber 903 and 904, be provided with the cassette of substrates that keeps a large amount of substrates.
Fig. 8 A is the top view of this equipment, and Fig. 8 B represents the sectional view along A-A '.Shown in Fig. 8 B, fine pumping system 921 links to each other with substrate transfer chamber 900 with oorroding house 902 with 912 by the vacuum-pumping system valve 920 in the etching apparatus respectively with 913.
Substrate transfer chamber 900 has the plenum system 915 of nitrogen or rare gas element, if be necessary, and can be by purge.The plenum system 918 of nitrogen or rare gas element and etchant gas (ClF for example 3) plenum system 919 link to each other with oorroding house 902 with 917 by gas supply system valve 916.
Keep the cassette of substrates 911 of a large amount of substrates 909 to be placed on the lifting table 923, do upper and lower to motion by elevator then.When transmitting substrate 909, then use this mechanism with mechanical arm 908.
Not expression among the figure, 903 and 904 are provided with the fine pumping system in the chamber, and it is useful that fine pumping is carried out in these chambers.When with this structure, always can take out composition from the etchant gas of oorroding house 902, so can improve the corrosion tolerance range, can obtain the stability of technology.Embodiment 6
In Fig. 9, etching apparatus has substrate holding chamber 1006 after substrate holding chamber 1002 before the processing, the processing, comprise the chamber 1003～1005 of at least one oorroding house, public substrate transfer chamber 1001, gate valve 1007～1001 that chamber 1001 is linked to each other with other chamber.
In the structure example of the etching apparatus of Fig. 9, chamber 1003 can be used as uses ClF 3Oorroding house, chamber 1004 can be used as in the ashing chamber of peelling off at used Etching mask of when corrosion, and chamber 1005 can be used as the chamber of removing residual resist with ultraviolet (UV) photoirradiation.
In the technology of the insulated-gate type field effect transistor that is manufactured with silicide gate, must after the corrosion silicide, corrode silicon again, and then the corrosion gate insulating film.In the case, chamber 1003 can be used as use ClF 3Oorroding house, chamber 1004 can be used as the chamber of corroding gate insulating film, and chamber 1005 can be used as the ashing chamber of peelling off resist.
Perhaps, chamber 1003 can be used as the oorroding house that corrodes silicide, and chamber 1004 can be used as the chamber of corroding silicon, and chamber 1005 can be used as the ashing chamber of peelling off resist.In the case, oorroding house 103 and 104 can be used as use ClF 3Oorroding house.Because the condition of corrosion silicide is different with the condition of corrosion silicon, each chamber is used as the oorroding house by a kind of condition, to improve the efficient of processing.
In etching apparatus of the present invention, because in the formation of the active layer of TFT, implemented not take place the corrosion of plasma damage, just can prevent the appearance of trap level in the active layer side surface, thereby suppress the motion of current carrier by the trap level in the active layer side surface.Thereby, can make the little TFT of cut-off current by means of etching apparatus of the present invention.

Claims (25)

1. etching apparatus comprises that a use is fluoridized halogen gas and do not made and fluoridizes halogen gas ionization or plasma and strengthen and carry out the corrosive chamber.
2. etching apparatus comprises:
Carry out corrosive first Room for one;
Second Room that keeps a plurality of substrates; And
One is arranged at the 3rd Room that can reduce pressure that has the transmission substrate devices between first and second Room,
Wherein use the etching process fluoridize halogen gas to fluoridize the halogen gas ionization or plasma enhanced first Room is finished not making.
3. etching apparatus comprises:
One has the chamber that imports the device of fluoridizing halogen gas,
Wherein use the etching process fluoridize halogen gas to finish not making to fluoridize in halogen gas ionization or the plasma enhanced chamber, this chamber also has measuring light and sees through the device for the treatment of corrosion material and determining the etch state of material.
4. etching apparatus comprises:
The substrate holding chamber that processing is preceding;
One with handle before the first substrate transfer chamber that links to each other of substrate holding chamber;
An oorroding house that links to each other with the first substrate transfer chamber;
A second substrate transfer chamber that links to each other with oorroding house; And
One with processing that the second substrate transfer chamber links to each other after the substrate holding chamber;
Substrate holding chamber before wherein handling and the substrate holding chamber after the processing have the device that keeps a plurality of substrates, first and second transfer chambers have the device that transmits substrate, and oorroding house has to use and fluoridizes halogen gas and do not make as etchant gas and fluoridize halogen gas ionization or plasma and strengthen and carry out the corrosive device.
5. the equipment of claim 1, the halogen gas of fluoridizing wherein comprises ClF 3, ClF, BrF 3, IF 3, BF, BrF 5And IF 5In at least a.
6. the equipment of claim 2, the halogen gas of fluoridizing wherein comprises ClF 3, ClF, BrF 3, IF 3, BF, BrF 5And IF 5In at least a.
7. the equipment of claim 3, the halogen gas of fluoridizing wherein comprises ClF 3, ClF, BrF 3, IF 3, BF, BrF 5And IF 5In at least a.
8. the equipment of claim 4, the halogen gas of fluoridizing wherein comprises ClF 3, ClF, BrF 3, IF 3, BF, BrF 5And IF 5In at least a.
9. the equipment of claim 1, corrosion is wherein implemented under 0.01～1Torr.
10. the equipment of claim 2, corrosion is wherein implemented under 0.01～1Torr.
11. the equipment of claim 3, corrosion is wherein implemented under 0.01～1Torr.
12. the equipment of claim 4, corrosion is wherein implemented under 0.01～1Torr.
13. the equipment of claim 1, corrosion is wherein implemented under 0.001～100Torr.
14. the equipment of claim 2, corrosion is wherein implemented under 0.001～100Torr.
15. the equipment of claim 3, corrosion is wherein implemented under 0.001～100Torr.
16. the equipment of claim 4, corrosion is wherein implemented under 0.001～100Torr.
17. the equipment of claim 1, corrosion is wherein implemented simultaneously with heating.
18. the equipment of claim 2, corrosion is wherein implemented simultaneously with heating.
19. the equipment of claim 3, corrosion is wherein implemented simultaneously with heating.
20. the equipment of claim 4, corrosion is wherein implemented simultaneously with heating.
21. the equipment of claim 1, corrosion wherein are to implement when remaining on predetermined temperature.
22. the equipment of claim 2, corrosion wherein are to implement when remaining on predetermined temperature.
23. the equipment of claim 3, corrosion wherein are to implement when remaining on predetermined temperature.
24. the equipment of claim 4, corrosion wherein are to implement when remaining on predetermined temperature.
25. an etching apparatus comprises:
Use is fluoridized halogen gas and is not made and fluoridizes halogen gas ionization or plasma and strengthen and carry out corrosive first Room;
Peel off second Room that is used for the corrosive resist for one; And
One is arranged on the 3rd Room that has the device that transmits substrate between first and second Room.
CN95121846A 1994-11-26 1995-11-25 Corrosion apparatus Expired - Fee Related CN1128893C (en)

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JP6315473A JPH08153711A (en) 1994-11-26 1994-11-26 Etching device

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JP4134671B2 (en) * 2002-10-17 2008-08-20 松下電器産業株式会社 Plasma processing method
KR101225312B1 (en) * 2005-12-16 2013-01-22 엘지디스플레이 주식회사 Process apparatus
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CN102074157A (en) * 2011-01-07 2011-05-25 华南理工大学 Corrosion device for copper clad laminate
CN107112223A (en) * 2014-10-10 2017-08-29 关东电化工业株式会社 Silicon compound etching gas composition and engraving method
CN107112223B (en) * 2014-10-10 2021-05-07 关东电化工业株式会社 Etching gas composition for silicon compound and etching method

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