CN113652733A - Circuit board silver plating equipment capable of saving electroplating materials for integrated circuit production - Google Patents

Circuit board silver plating equipment capable of saving electroplating materials for integrated circuit production Download PDF

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Publication number
CN113652733A
CN113652733A CN202110949459.6A CN202110949459A CN113652733A CN 113652733 A CN113652733 A CN 113652733A CN 202110949459 A CN202110949459 A CN 202110949459A CN 113652733 A CN113652733 A CN 113652733A
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shaped
frame
special
wedge
sliding
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刘智
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention relates to a circuit board silver plating device, in particular to a circuit board silver plating device which is used for producing an integrated circuit and can save electroplating materials, and comprises a bottom box, a first slotting support, a second slotting support, a special-shaped fixing frame, a downward pressing rotating mechanism and the like; a first slotting support is fixedly installed on one side of the bottom box, a second slotting support is also fixedly installed on one side of the bottom box, a special-shaped fixing frame is fixedly connected to the first slotting support and the second slotting support, and a pressing rotating mechanism is arranged on one side of each slotting support. The circuit board is positioned above the bottom box by moving the special-shaped left sliding frame and the device on the special-shaped left sliding frame towards the direction far away from the special-shaped fixed frame, and then the special-shaped left sliding frame and the device on the special-shaped left sliding frame move downwards to immerse the circuit board in silver plating solution in the bottom box, and the silver plating solution plates the circuit board.

Description

Circuit board silver plating equipment capable of saving electroplating materials for integrated circuit production
Technical Field
The invention relates to a circuit board silver plating device, in particular to a circuit board silver plating device which is used for integrated circuit production and can save electroplating materials.
Background
The silver plating layer is easy to polish, has strong light reflection capability and good heat conduction, electric conduction and welding performance, is applied to decoration at first, is generally plated with silver to reduce the resistance of metal parts and improve the welding capability of metal in the electronic industry, communication configuration and instrument and meter manufacturing industry, and has much lower price than gold plating, high electric conduction, light reflection and chemical stability to organic acid and alkali, so the using range is much wider than that of gold.
In the existing circuit board silver plating process, a circuit board needs to be manually immersed in silver plating solution, a worker needs to hold the circuit board all the time to carry out silver plating operation, and in the silver plating operation process, a tool needs to be manually adopted to scrape off a silver film on the surface of the silver plating solution.
Disclosure of Invention
The invention aims to provide circuit board silver plating equipment which can carry out silver plating operation on a circuit board, can scrape off a silver film on the surface of silver plating solution, is convenient for collecting the silver-plated circuit board and can save electroplating materials in integrated circuit production, so as to solve the problem that the circuit board is easy to scrap because workers need to carry the circuit board all the time to carry out the silver plating operation in the background technology.
The technical scheme is as follows: the utility model provides a circuit board silver-plating equipment that is used for integrated circuit production can save electroplating material, including the under casing, fluting support one, fluting support two, abnormal shape mount, push down rotary mechanism, preceding pushing down on hold-down mechanism and clamping mechanism, under casing one side fixed mounting has fluting support one, fluting support two is fixed mounting in under casing one side equally, common rigid coupling has abnormal shape mount on fluting support one and the fluting support two, fluting support one side is provided with and pushes down rotary mechanism, preceding pushing down on hold-down mechanism slidable type is connected on abnormal shape mount, clamping mechanism locates before push down on the hold-down mechanism.
In a preferred embodiment of the invention, the downward pressing rotating mechanism comprises a special-shaped connecting frame, a push rod frame, an electric push rod, a round head frame, a grooved pulley, a wedge-shaped limiting frame, a first return spring and a hole-opening cross frame, the special-shaped connecting frame is welded on one side of the slotting support, the push rod frame is fixedly installed on one side of the bottom box, the electric push rod is fixedly installed on the push rod frame, the round head frame is welded above the special-shaped connecting frame, the grooved pulley is fixedly connected on the round head frame, the grooved pulley is connected with an electric push rod telescopic shaft in a sliding mode, the wedge-shaped limiting frame is connected on the special-shaped connecting frame in a sliding mode, the first return spring is connected on the wedge-shaped limiting frame, one end of the first return spring is fixedly connected with the special-shaped connecting frame, the hole-opening cross frame is rotatably connected to the top of the electric push rod telescopic shaft, the hole-opening cross frame is in limiting fit with the grooved pulley, and the hole-opening cross frame and the wedge-shaped limiting frame touch each other.
In a preferred embodiment of the invention, the front pushing and pressing mechanism comprises a special-shaped lower carriage, a second return spring, a special-shaped left carriage, a rectangular connecting rod, an extension spring, a large wedge block, a special-shaped rotating shaft frame, a slotted swing rod, a first torsion spring, a slotless swing rod and a second torsion spring, wherein the special-shaped lower carriage is connected to a special-shaped fixing frame in a lifting manner, the special-shaped lower carriage is contacted with the wedge-shaped limiting frame, the second return spring is fixedly connected to the special-shaped lower carriage, one end of the second return spring is fixedly connected with the special-shaped fixing frame, the special-shaped lower carriage is slidably connected with the special-shaped left carriage, the special-shaped left carriage is contacted with the wedge-shaped limiting frame, the rectangular connecting rod is welded on the special-shaped left carriage, the special-shaped left carriage is fixedly connected with a pair of extension springs, one end of the wedge-shaped spring is connected with the special-shaped lower carriage, the large block is welded on the rectangular connecting rod, and the special-shaped rotating shaft frame is fixedly installed at one side of the bottom box, the special-shaped rotating shaft frame is rotatably connected with a slotted oscillating bar, the slotted oscillating bar is connected with a pair of first torsion springs in a coupling mode, one end of each first torsion spring is fixedly connected with the special-shaped rotating shaft frame, the slotted oscillating bar is rotatably connected with a slotless oscillating bar, the large wedge-shaped block is mutually touched with the slotless oscillating bar, and a second torsion spring is connected between the slotless oscillating bar and the slotted oscillating bar.
In a preferred embodiment of the invention, the clamping mechanism comprises a wedge-shaped clamping plate, a third return spring, a wedge-shaped pushing frame and a fourth return spring, the wedge-shaped clamping plate is symmetrically and slidably connected to the special-shaped left sliding frame, the two wedge-shaped clamping plates are in contact with each other, the third return spring is connected to the wedge-shaped clamping plate in a coupling mode, one end of the third return spring is fixedly connected with the special-shaped left sliding frame, the wedge-shaped pushing frame is also slidably connected to the special-shaped left sliding frame, the wedge-shaped pushing frame is in contact with the wedge-shaped clamping plate, the third return spring is fixedly connected to the wedge-shaped pushing frame, and one end of the fourth return spring is connected with the special-shaped left sliding frame.
In a preferred embodiment of the invention, the scraping device is arranged on the top surface of the bottom box, and comprises a guide groove frame, a scraping plate, a sliding round bar, a fifth return spring, an N-shaped slide rail frame, a special-shaped support frame, a rotating shaft, a pinion, a short rack, a sixth return spring, a large gear, a rectangular slotted slider, a seventh return spring, a long rack, a sliding tooth and an eighth return spring, wherein the guide groove frame is welded on the top surface of the bottom box, the N-shaped slide rail frame is also fixedly arranged on the top surface of the bottom box, the N-shaped slide rail frame is slidably connected with the rectangular slotted slider, the rectangular slotted slider is connected with the scraping plate in a lifting manner, the sliding round bar is slidably connected with the sliding round bar, the sliding round bar is in limit fit with the guide groove frame, one end of the sliding round bar is fixedly connected with the fifth return spring, one end of the fifth return spring is connected with the scraping plate, one side of the N-shaped slide rail frame is fixedly provided with the special-shaped support frame, the special-shaped support frame is rotatably connected with a rotating shaft, a pinion is fixedly connected to the rotating shaft, a short rack is slidably connected to the special-shaped support frame, the short rack is meshed with the pinion, a sixth reset spring is connected to the short rack, one end of the sixth reset spring is connected with the special-shaped support frame, a large gear is fixedly connected to the rotating shaft, a seventh reset spring is connected between the scraping plate and the rectangular slotting slide block, a long rack is welded to the rectangular slotting slide block, a sliding tooth is slidably connected to the long rack, the sliding tooth is meshed with the large gear, and a pair of eighth reset springs is connected between the sliding tooth and the long rack.
In a preferred embodiment of the invention, the device further comprises a lower slide pushing mechanism, the lower slide pushing mechanism is arranged on the first slotting support, the lower slide pushing mechanism comprises a fixed wedge-shaped frame, a lower pressing plate, a ninth return spring, a wedge-shaped pushing plate and a tenth return spring, the fixed wedge-shaped frame is arranged on the top surface of the first slotting support, the lower pressing plate is connected to the first slotting support and the second slotting support in a sliding mode, the pair of ninth return springs is connected to the bottom surface of the lower pressing plate, one end of the ninth return spring is connected to the first slotting support, the other end of the ninth return spring is connected to the second slotting support, the wedge-shaped pushing plate is connected to the first slotting support in a sliding mode, the wedge-shaped pushing plate is in contact with the second slotting support, the tenth return spring is connected to the wedge-shaped pushing plate, and one end of the tenth return spring is connected to the first slotting support.
The invention has the beneficial effects that:
the circuit board is positioned above the bottom box by moving the special-shaped left sliding frame and the device on the special-shaped left sliding frame towards the direction far away from the special-shaped fixed frame, and then the special-shaped left sliding frame and the device on the special-shaped left sliding frame move downwards to immerse the circuit board in silver plating solution in the bottom box, and the silver plating solution plates the circuit board.
Through the effect of guide way frame, the seventh reset spring that is stretched resets and drives the scraper blade downstream, makes scraper blade and silver plating bath surface contact, and the scraper blade is towards moving near the push rod frame direction and is strickleed off the silver membrane on silver plating bath surface, avoids the silver membrane to lead to the fact the influence to next silvering.
The two wedge-shaped clamping plates are pushed to move relatively through the wedge-shaped pushing frame, the circuit board is not clamped by the two wedge-shaped clamping plates any more, the circuit board drops onto the lower pressing plate, the wedge-shaped pushing plate can push out the circuit board on the lower pressing plate, and the silver-plated circuit board is collected by later-stage workers.
Drawings
Fig. 1 is a schematic perspective view of a first embodiment of the present invention.
Fig. 2 is a schematic perspective view of a second embodiment of the present invention.
Fig. 3 is a schematic partial perspective view of the downward pressing and rotating mechanism of the present invention.
Fig. 4 is a partially disassembled perspective view of the downward pressing and rotating mechanism of the present invention.
Fig. 5 is a schematic view of a first partially assembled structure of the front pushing and pressing mechanism according to the present invention.
FIG. 6 is a schematic view of a second partial structure of the front pushing and pressing mechanism of the present invention.
Fig. 7 is a partially disassembled perspective view of the front pushing and pressing mechanism of the present invention.
Fig. 8 is a schematic disassembled perspective structure of the clamping mechanism of the present invention.
Fig. 9 is a schematic perspective view of a portion of the scraping mechanism of the present invention.
Fig. 10 is a schematic view of a first partially disassembled three-dimensional configuration of the scraping mechanism of the present invention.
Fig. 11 is a schematic view of a second partially disassembled solid construction of the scraping mechanism of the present invention.
Fig. 12 is a schematic perspective view of the downward-sliding push-out mechanism of the present invention.
Wherein the figures include the following reference numerals: 1: bottom case, 2: grooving support I, 3: and (2) a second slotted support, 4: abnormal shape mount, 5: pressing-down rotation mechanism, 51: special-shaped connecting frame, 52: push rod frame, 53: electric push rod, 54: round head frame, 55: sheave, 56: wedge spacing, 57: first return spring, 58: open-cell cross, 6: forward push-down mechanism, 61: profiled lower carriage, 62: second return spring, 63: profiled left carriage, 64: rectangular connecting rod, 65: tension spring, 66: large wedge block, 67: special-shaped rotating shaft frame, 68: slotted oscillating bar, 69: first torsion spring, 610: slotless oscillating bar, 611: second torsion spring, 7: clamping mechanism, 71: wedge-shaped clamping plate, 72: third return spring, 73: wedge-shaped pushing frame, 74: fourth return spring, 8: scraping mechanism, 81: guide way frame, 82: blade, 83: sliding round bar, 84: fifth return spring, 85: n-type slide rail, 86: special-shaped support frame, 87: rotation axis, 88: pinion, 89: short rack, 810: sixth return spring, 811: large gear, 812: rectangular slotted slider, 813: seventh return spring, 814: long rack, 815: sliding tooth, 816: eighth return spring, 9: glide release mechanism, 91: fixed wedge frame, 92: lower press plate, 93: ninth return spring, 94: wedge-shaped push plate, 95: a tenth return spring.
Detailed Description
The standard parts used in the invention can be purchased from the market, the special-shaped parts can be customized according to the description and the description of the attached drawings, and the specific connection mode of each part adopts the conventional means of mature bolts, rivets, welding, sticking and the like in the prior art, and the detailed description is not repeated.
Example 1
A circuit board silver plating device capable of saving electroplating materials for integrated circuit production is disclosed, as shown in figure 1-8, and comprises a bottom box 1, a first slotting support 2, a second slotting support 3, a special-shaped fixing frame 4, a downward pressing rotating mechanism 5, a forward pushing and downward pressing mechanism 6 and a clamping mechanism 7, wherein the first slotting support 2 is fixedly installed on one side of the bottom box 1 for containing silver plating solution, the second slotting support 3 is also fixedly installed on one side of the bottom box 1, the first slotting support 2 and the second slotting support 3 are jointly and fixedly connected with the special-shaped fixing frame 4, the downward pressing rotating mechanism 5 is arranged on one side of the first slotting support 2, the forward pushing and downward pressing mechanism 6 is connected to the special-shaped fixing frame 4 in a sliding manner, the forward pushing and downward pressing mechanism 6 is used for immersing a circuit board in the silver plating solution in the bottom box 1, and the clamping mechanism 7 for clamping the circuit board is arranged on the forward pushing and downward pressing mechanism 6.
The downward-pressing rotating mechanism 5 comprises a special-shaped connecting frame 51, a push rod frame 52, an electric push rod 53, a round head frame 54, a grooved wheel 55, a wedge-shaped limiting frame 56, a first reset spring 57 and a perforated cross 58, the special-shaped connecting frame 51 is welded on one side of a first slotted support 2, the push rod frame 52 is fixedly installed on one side of a bottom box 1, the electric push rod 53 is fixedly installed on the push rod frame 52, the round head frame 54 is welded on the special-shaped connecting frame 51, the grooved wheel 55 is fixedly connected on the round head frame 54, the grooved wheel 55 is connected with an electric push rod 53 telescopic shaft in a sliding mode, the wedge-shaped limiting frame 56 is connected on the special-shaped connecting frame 51 in a sliding mode, the first reset spring 57 is connected on the wedge-shaped limiting frame 56 in a rotating mode, one end of the first reset spring 57 far away from the wedge-shaped limiting frame 56 is fixedly connected with the special-shaped connecting frame 51, the perforated cross 58 is connected on the top of the electric push rod 53 telescopic shaft, and the perforated cross 58 is in limiting fit with the grooved wheel 55, the grooved wheel 55 is used for pushing the hole cross 58 and the device on the hole cross 58 to rotate ninety degrees, and the hole cross 58 and the wedge-shaped limiting frame 56 are mutually contacted.
The front pushing and pressing mechanism 6 comprises a special-shaped lower carriage 61, a second return spring 62, a special-shaped left carriage 63, a rectangular connecting rod 64, an extension spring 65, a large wedge block 66, a special-shaped rotating shaft frame 67, a slotted swing rod 68, a first torsion spring 69, a slotless swing rod 610 and a second torsion spring 611, wherein the special-shaped lower carriage 61 is connected to the special-shaped fixed frame 4 in a lifting manner, the special-shaped lower carriage 61 is in mutual contact with a wedge-shaped limiting frame 56, the second return spring 62 is fixedly connected to the special-shaped lower carriage 61, one end of the second return spring 62 far away from the special-shaped lower carriage 61 is fixedly connected with the special-shaped fixed frame 4, the special-shaped lower carriage 61 is slidably connected with the special-shaped left carriage 63, the special-shaped left carriage 63 is in mutual contact with the wedge-shaped limiting frame 56, the wedge-shaped limiting frame 56 is used for blocking the special-shaped left carriage 63, the rectangular connecting rod 64 is welded to the special-shaped left carriage 63, the pair of extension springs 65 are fixedly connected to the special-shaped left carriage 63, one end of an extension spring 65 far away from the special-shaped left sliding frame 63 is connected with the special-shaped lower sliding frame 61, a large wedge-shaped block 66 is welded on the rectangular connecting rod 64, the special-shaped rotating shaft frame 67 is fixedly installed on one side of the bottom case 1, a slotted swing rod 68 is rotatably connected above the special-shaped rotating shaft frame 67 far away from the bottom case 1, a pair of first torsion springs 69 are connected onto the slotted swing rod 68, one end of each first torsion spring 69 far away from the slotted swing rod 68 is fixedly connected with the special-shaped rotating shaft frame 67, a slotless swing rod 610 is rotatably connected onto the slotted swing rod 68 far away from the special-shaped rotating shaft frame 67, the large wedge-shaped block 66 is mutually touched with the slotless swing rod 610, the slotless swing rod 610 is used for pushing the large wedge-shaped block 66 and an upper device thereof to move towards the direction close to the special-shaped fixed frame 4, and a second torsion spring 611 is connected between the slotless swing rod 610 and the slotted swing rod 68.
The clamping mechanism 7 comprises a wedge-shaped clamping plate 71, a third reset spring 72, a wedge-shaped pushing frame 73 and a fourth reset spring 74, the wedge-shaped clamping plate 71 is symmetrically and slidably connected to the special-shaped left sliding frame 63, the two wedge-shaped clamping plates 71 are in contact with each other, the wedge-shaped clamping plate 71 is used for clamping a circuit board, the third reset spring 72 is connected to the wedge-shaped clamping plate 71 in a coupling mode, one end of the third reset spring 72, far away from the wedge-shaped clamping plate 71, is fixedly connected with the special-shaped left sliding frame 63, the wedge-shaped pushing frame 73 is also slidably connected to the special-shaped left sliding frame 63 in a coupling mode, the wedge-shaped pushing frame 73 is in contact with the wedge-shaped clamping plate 71, the wedge-shaped pushing frame 73 is used for pushing the two wedge-shaped clamping plates 71 to move relatively, the three fourth reset springs 74 are fixedly connected to the wedge-shaped pushing frame 73, and one end of the fourth reset spring 74, far away from the wedge-shaped pushing frame 73, is connected with the special-shaped left sliding frame 63.
Silver-colored plating solution is equipped with in the under casing 1, when needs carry out silvering to the circuit board, the staff is manual to be close to two 3 directions promotion wedge pushing frame 73 of slotted support, wedge pushing frame 73 promotes two wedge clamp plates 71 relative motion, the staff places the circuit board between two wedge clamp plates 71, then the staff loosens wedge pushing frame 73, the fourth reset spring 74 of compressed resets and drives wedge pushing frame 73 and reset, the three reset spring 72 that is stretched resets and drives two wedge clamp plates 71 and move in opposite directions, two wedge clamp plates 71 press from both sides the circuit board tightly.
The electric push rod 53 is controlled by a worker manually to shrink, the electric push rod 53 shrinks to drive the hole-forming cross 58 to move downwards, the hole-forming cross 58 can push the wedge-shaped limiting frame 56 to move towards the direction away from the second 3 slotted supports, the wedge-shaped limiting frame 56 does not block the special-shaped left sliding frame 63 any more, the extension spring 65 in the stretching state resets to drive the special-shaped left sliding frame 63 and the upper device thereof to move towards the direction away from the special-shaped fixed frame 4, the circuit board is located above the bottom box 1, and the large wedge block 66 is located above the slotless oscillating rod 610 and the slotted oscillating rod 68. When the hole-opening cross 58 is separated from the wedge-shaped limiting frame 56, the compressed first return spring 57 is reset to drive the wedge-shaped limiting frame 56 to move and reset towards the direction close to the second slotted bracket 3.
The hole-opening cross 58 continues to move downwards, the hole-opening cross 58 pushes the special-shaped lower sliding frame 61 and the upper device thereof to move downwards, so that the circuit board is immersed in silver plating solution in the bottom box 1, the silver plating solution plates the circuit board with silver, the large wedge-shaped block 66 pushes the grooved swing rod 68 and the slotless swing rod 610 to swing downwards, the compressed first torsion spring 69 resets to drive the grooved swing rod 68 to swing upwards, the large wedge-shaped block 66 pushes the slotless swing rod 610 to swing, and after the large wedge-shaped block 66 is separated from the slotless swing rod 610, the compressed second torsion spring 611 resets to drive the slotless swing rod 610 to swing upwards to reset.
The electric push rod 53 is controlled by a worker to extend manually, the electric push rod 53 extends to drive the opening cross 58 to move upwards, the grooved wheel 55 can push the opening cross 58 and the upper device thereof to rotate ninety degrees, and the opening cross 58 cannot be in contact with the wedge-shaped limiting frame 56 when moving upwards. The special-shaped lower carriage 61 and the upper device thereof move upwards to be reset under the action of the second reset spring 62, so that the circuit board is taken out from the silver plating solution in the bottom box 1, meanwhile, the slotless oscillating bar 610 pushes the large wedge-shaped block 66 and the upper device thereof to move towards the direction close to the special-shaped fixed frame 4, and the extension spring 65 is extended. When the special-shaped left sliding frame 63 is in contact with the wedge-shaped limiting frame 56, the special-shaped left sliding frame 63 pushes the wedge-shaped limiting frame 56 to move towards the direction away from the second slotted bracket 3, and then the wedge-shaped limiting frame 56 clamps the special-shaped left sliding frame 63 under the action of the first return spring 57. Finally, the worker manually pushes the wedge-shaped pushing frame 73 towards the direction close to the second slotting support 3, the wedge-shaped pushing frame 73 pushes the two wedge-shaped clamping plates 71 to move relatively, and the worker takes down the circuit board.
When the device is used next time, the worker controls the electric push rod 53 to contract, the electric push rod 53 contracts to drive the hole-opening cross 58 to move downwards, the hole-opening cross 58 cannot push the wedge-shaped limiting frame 56, the operation is repeated, then the worker controls the electric push rod 53 to extend, the electric push rod 53 extends to drive the hole-opening cross 58 to move upwards, and the grooved wheel 55 can push the hole-opening cross 58 and the device on the hole-opening cross 58 to rotate and reset by ninety degrees. The worker places the circuit board without silver plating between the two wedge-shaped clamping plates 71, repeats the above operation, and performs the silver plating operation on the circuit board.
Example 2
On the basis of the embodiment 1, as shown in fig. 9 to 11, the silver plating solution scraping device further includes a scraping mechanism 8, the scraping mechanism 8 is disposed on the top surface of the bottom case 1, the scraping mechanism 8 is used for scraping the silver film on the surface of the silver plating solution, the scraping mechanism 8 includes a guide groove frame 81, a scraping plate 82, a sliding round bar 83, a fifth return spring 84, an N-shaped slide rail frame 85, a special-shaped support frame 86, a rotating shaft 87, a pinion 88, a short rack 89, a sixth return spring 810, a large gear 811, a rectangular slotted slide block 812, a seventh return spring 813, a long rack 814, a sliding tooth 815 and an eighth return spring 816, the guide groove frame 81 is welded on the top surface of the bottom case 1, the N-shaped slide rail frame 85 is also fixedly mounted on the top surface of the bottom case 1, the rectangular slotted slide rail frame 85 is slidably connected with the rectangular slotted slide block 812, the rectangular slotted slide block 812 is connected with the scraping plate 82 in a lifting manner, the scraping plate 82 is used for scraping the silver film on the surface of the silver plating solution, a sliding round rod 83 is connected on the scraping plate 82 far away from the rectangular slotted sliding block 812 in a sliding way, the sliding round rod 83 is in limit fit with the guide slot frame 81, one end of the sliding round rod 83 is fixedly connected with a fifth return spring 84, one end of the fifth return spring 84 far away from the sliding round rod 83 is connected with the scraping plate 82, one side of the N-shaped sliding rail frame 85 is fixedly provided with a special-shaped supporting frame 86, the special-shaped supporting frame 86 is connected with a rotating shaft 87 in a rotating way, the rotating shaft 87 is fixedly connected with a pinion 88, the special-shaped supporting frame 86 is connected with a short rack 89 in a sliding way, the short rack 89 is meshed with the pinion 88, the short rack 89 is connected with a sixth return spring 810 in a connecting way, one end of the sixth return spring 810 far away from the short rack 89 is connected with the special-shaped supporting frame 86, the large gear 811 is also fixedly connected on the rotating shaft 87, a seventh return spring 813 is connected between the scraping plate 82 and the rectangular slotted sliding block 812, a long rack 814 is welded on the rectangular slotted sliding block 812, a sliding tooth 815 is slidably connected to the long rack 814 far from the rectangular slotted slider 812, the sliding tooth 815 is engaged with the large gear 811, and a pair of eighth return springs 816 is connected between the sliding tooth 815 and the long rack 814.
When the special-shaped lower sliding frame 61 and the upper device thereof move downwards, the special-shaped lower sliding frame 61 pushes the short rack 89 to move downwards, the short rack 89 drives the pinion 88 and the upper device thereof to rotate, the large gear 811 pushes the sliding teeth 815 to move towards the direction close to the push rod frame 52, and under the action of the eighth return spring 816, the sliding teeth 815 reciprocate left and right, so that the sliding teeth 815 are always meshed with the large gear 811. When the special-shaped lower carriage 61 and the upper device thereof move upwards, the special-shaped lower carriage 61 is separated from the short rack 89, the compressed sixth return spring 810 resets to drive the short rack 89 to move upwards for resetting, the short rack 89 drives the pinion 88 and the upper device thereof to rotate, and the large gear 811 drives the long rack 814 and the upper device thereof to move towards the direction far away from the push rod frame 52. Then, the stretched seventh return spring 813 is returned to drive the scraping plate 82 to move downwards by the action of the guide groove frame 81, so that the scraping plate 82 is contacted with the surface of the silver plating solution.
When the operator controls the electric push rod 53 to contract again, the hole-opening cross 58 pushes the special-shaped lower sliding frame 61 and the upper device thereof to move downwards again, the special-shaped lower sliding frame 61 pushes the short rack 89 to move downwards, the short rack 89 drives the pinion 88 and the upper device thereof to rotate, the large gear 811 pushes the long rack 814 and the upper device thereof to move towards the direction close to the push rod frame 52, and the scraper 82 scrapes off the silver film on the surface of the silver plating solution. The sliding rod 83 will drive the scraper 82 to move upward by the action of the guide channel frame 81.
Example 3
On the basis of embodiment 2, as shown in fig. 12, the electronic device further includes a downward sliding push-out mechanism 9, the downward sliding push-out mechanism 9 is disposed on the first slotted support 2, the downward sliding push-out mechanism 9 is configured to push the circuit board out, the downward sliding push-out mechanism 9 includes a fixed wedge frame 91, a lower pressing plate 92, a ninth return spring 93, a wedge pushing plate 94 and a tenth return spring 95, the top surface of the first slotted support 2 is provided with the fixed wedge frame 91, the fixed wedge frame 91 is configured to push the wedge pushing frame 73 to move toward a direction close to the second slotted support 3, the first slotted support 2 and the second slotted support 3 are jointly slidably connected with the lower pressing plate 92, the lower pressing plate 92 is configured to push the wedge pushing plate 94 to move toward a direction away from the bottom box 1, the bottom surface of the lower pressing plate 92 is connected with the pair of the ninth return springs 93, one end of the ninth return spring 93 is connected with the first slotted support 2, and the other end of the ninth return spring 93 is connected with the second slotted support 3, a wedge-shaped pushing plate 94 is connected to the first slotted support 2 in a sliding manner, the wedge-shaped pushing plate 94 is used for pushing out the circuit board on the lower pressing plate 92, the wedge-shaped pushing plate 94 is in contact with the second slotted support 3, a tenth return spring 95 is connected to the wedge-shaped pushing plate 94, and one end of the tenth return spring 95, which is far away from the wedge-shaped pushing plate 94, is connected to the first slotted support 2.
After the circuit board is subjected to silver plating operation, when the staff controls the electric push rod 53 to contract again, the electric push rod 53 contracts to drive the perforated cross 58 to move downwards, the special-shaped lower sliding frame 61 and the upper device thereof move downwards, when the wedge-shaped pushing frame 73 is in mutual contact with the fixed wedge-shaped frame 91, the fixed wedge-shaped frame 91 pushes the wedge-shaped pushing frame 73 to move towards the direction close to the second 3 of the slotting support, the wedge-shaped pushing frame 73 pushes the two wedge-shaped clamping plates 71 to move relatively, the two wedge-shaped clamping plates 71 no longer clamp the circuit board, and the circuit board falls onto the lower pressing plate 92. Then the large wedge-shaped block 66 pushes the lower pressing plate 92 to move downwards, the lower pressing plate 92 pushes the wedge-shaped pushing plate 94 to move towards the direction away from the bottom case 1, the wedge-shaped pushing plate 94 pushes the circuit board on the lower pressing plate 92 out, the compressed tenth reset spring 95 resets to drive the wedge-shaped pushing plate 94 to move and reset towards the direction close to the bottom case 1, and the compressed ninth reset spring 93 resets to drive the lower pressing plate 92 to move and reset upwards.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. The utility model provides a circuit board silver-plating equipment that is used for integrated circuit production can save electroplating material, characterized by, including under casing (1), fluting support (2), fluting support two (3), abnormal shape mount (4), push down rotary mechanism (5), preceding pushing down mechanism (6) and clamping mechanism (7), under casing (1) one side fixed mounting has fluting support one (2), same fixed mounting in under casing (1) one side of fluting support two (3), common rigid coupling has abnormal shape mount (4) on fluting support one (2) and fluting support two (3), fluting support one (2) one side is provided with pushing down rotary mechanism (5), preceding pushing down mechanism (6) slidingly connects on abnormal shape mount (4), clamping mechanism (7) are located before pushing down on mechanism (6).
2. The circuit board silver plating equipment used for integrated circuit production and capable of saving electroplating materials according to claim 1 is characterized in that the downward pressing rotating mechanism (5) comprises a special-shaped connecting frame (51), a push rod frame (52), an electric push rod (53), a round head frame (54), a grooved pulley (55), a wedge-shaped limiting frame (56), a first reset spring (57) and a hole-opening cross frame (58), the special-shaped connecting frame (51) is welded on one side of the first slotting support (2), the push rod frame (52) is fixedly installed on one side of the bottom box (1), the electric push rod (53) is fixedly installed on the push rod frame (52), the round head frame (54) is welded on the upper portion of the special-shaped connecting frame (51), the grooved pulley (55) is fixedly connected on the round head frame (54), the grooved pulley (55) is connected with an electric push rod (53) telescopic shaft in a sliding manner, the wedge-shaped limiting frame (56) is connected on the special-shaped connecting frame (51) in a sliding manner, the wedge-shaped limiting frame (56) is connected with a first reset spring (57), one end of the first reset spring (57) is fixedly connected with the special-shaped connecting frame (51), the top of the electric push rod (53) telescopic shaft is rotatably connected with a hole-opening cross (58), the hole-opening cross (58) is in limiting fit with the grooved pulley (55), and the hole-opening cross (58) and the wedge-shaped limiting frame (56) are mutually touched.
3. The circuit board silver plating equipment for integrated circuit production capable of saving electroplating materials according to claim 2, characterized in that the front pushing and pressing mechanism (6) comprises a special-shaped lower carriage (61), a second return spring (62), a special-shaped left carriage (63), a rectangular connecting rod (64), an extension spring (65), a large wedge-shaped block (66), a special-shaped rotating shaft frame (67), a slotted oscillating bar (68), a first torsion spring (69), a slotless oscillating bar (610) and a second torsion spring (611), the special-shaped lower carriage (61) is connected to the special-shaped fixing frame (4) in a lifting manner, the special-shaped lower carriage (61) is in mutual contact with the wedge-shaped limiting frame (56), the second return spring (62) is fixedly connected to the special-shaped lower carriage (61), one end of the second return spring (62) is fixedly connected to the special-shaped fixing frame (4), the special-shaped left carriage (63) is slidably connected to the special-shaped lower carriage (61), the special-shaped left sliding frame (63) is in contact with the wedge-shaped limiting frame (56), a rectangular connecting rod (64) is welded on the special-shaped left sliding frame (63), a pair of extension springs (65) are fixedly connected to the special-shaped left sliding frame (63), one end of each extension spring (65) is connected with the special-shaped lower sliding frame (61), a large wedge-shaped block (66) is welded on the rectangular connecting rod (64), the special-shaped rotating shaft frame (67) is fixedly installed on one side of the bottom box (1), a slotted swing rod (68) is rotatably connected to the upper portion of the special-shaped rotating shaft frame (67), a pair of first torsion springs (69) is connected to the slotted swing rod (68), one end of each first torsion spring (69) is fixedly connected with the special-shaped rotating shaft frame (67), a non-slotted wedge-shaped swing rod (610) is rotatably connected to the slotted swing rod (68), the large torsion springs (66) are in mutual contact with the non-slotted swing rod (610), and a second torsion spring (611) is connected between the non-slotted swing rod (610) and the slotted swing rod (68).
4. A circuit board silver plating apparatus for saving plating material for integrated circuit production according to claim 3, the clamping mechanism (7) is characterized by comprising a wedge-shaped clamping plate (71), a third reset spring (72), a wedge-shaped pushing frame (73) and a fourth reset spring (74), the wedge-shaped clamping plate (71) is symmetrically and slidably connected to the special-shaped left sliding frame (63), the two wedge-shaped clamping plates (71) are in mutual contact, the third reset spring (72) is connected to the wedge-shaped clamping plate (71) in a coupling mode, one end of the third reset spring (72) is fixedly connected with the special-shaped left sliding frame (63), the wedge-shaped pushing frame (73) is also slidably connected to the special-shaped left sliding frame (63), the wedge-shaped pushing frame (73) is in mutual contact with the wedge-shaped clamping plate (71), the third reset spring (74) is fixedly connected to the wedge-shaped pushing frame (73), and one end of the fourth reset spring (74) is connected with the special-shaped left sliding frame (63).
5. The circuit board silver plating equipment used for integrated circuit production and capable of saving electroplating materials according to claim 4 is characterized by further comprising a scraping mechanism (8), wherein the scraping mechanism (8) is arranged on the top surface of the bottom box (1), the scraping mechanism (8) comprises a guide groove frame (81), a scraping plate (82), a sliding round rod (83), a fifth reset spring (84), an N-shaped slide rail frame (85), a special-shaped support frame (86), a rotating shaft (87), a pinion (88), a short rack (89), a sixth reset spring (810), a bull gear (811), a rectangular slotted slide block (812), a seventh reset spring (813), a long rack (814), a sliding tooth (815) and an eighth reset spring (816), the guide groove frame (81) is welded on the top surface of the bottom box (1), the N-shaped slide rail frame (85) is also fixedly arranged on the top surface of the bottom box (1), the rectangular slotted slide block (812) is slidably connected on the N-shaped slide rail frame (85), a scraping plate (82) is connected to a rectangular slotted sliding block (812) in a lifting mode, a sliding round rod (83) is connected to the scraping plate (82) in a sliding mode, the sliding round rod (83) is in limit fit with a guide groove frame (81), a fifth reset spring (84) is fixedly connected to one end of the sliding round rod (83), one end of the fifth reset spring (84) is connected with the scraping plate (82) in a connecting mode, a special-shaped support frame (86) is fixedly installed on one side of an N-shaped sliding rail frame (85), a rotating shaft (87) is connected to the special-shaped support frame (86) in a rotating mode, a pinion (88) is fixedly connected to the rotating shaft (87), a short rack (89) is connected to the special-shaped support frame (86) in a sliding mode, the short rack (89) is meshed with the pinion (88), a sixth reset spring (810) is connected to the short rack (89) in a connecting mode, one end of the sixth reset spring (810) is connected to the special-shaped support frame (86), and a large gear (811) is fixedly connected to the rotating shaft (87) similarly, a seventh reset spring (813) is connected between the scraping plate (82) and the rectangular slotted sliding block (812), a long rack (814) is welded on the rectangular slotted sliding block (812), a sliding tooth (815) is connected on the long rack (814) in a sliding mode, the sliding tooth (815) is meshed with the large gear (811), and a pair of eighth reset springs (816) is connected between the sliding tooth (815) and the long rack (814).
6. The circuit board silver plating equipment used for integrated circuit production and capable of saving electroplating materials according to claim 5 is characterized by further comprising a lower sliding push-out mechanism (9), wherein the lower sliding push-out mechanism (9) is arranged on the first slotted support (2), the lower sliding push-out mechanism (9) comprises a fixed wedge-shaped frame (91), a lower pressing plate (92), a ninth reset spring (93), a wedge-shaped pushing plate (94) and a tenth reset spring (95), the fixed wedge-shaped frame (91) is arranged on the top surface of the first slotted support (2), the lower pressing plate (92) is connected on the first slotted support (2) and the second slotted support (3) in a sliding mode together, the bottom surface of the lower pressing plate (92) is connected with a pair of ninth reset springs (93), one end of one ninth reset spring (93) is connected with the first slotted support (2), and one end of the other ninth reset spring (93) is connected with the second slotted support (3), the first slotted support (2) is connected with a wedge-shaped pushing plate (94) in a sliding mode, the wedge-shaped pushing plate (94) is in contact with the second slotted support (3), the wedge-shaped pushing plate (94) is connected with a tenth reset spring (95) in a connecting mode, and one end of the tenth reset spring (95) is connected with the first slotted support (2).
CN202110949459.6A 2021-08-18 2021-08-18 Circuit board silver plating equipment capable of saving electroplating materials for integrated circuit production Pending CN113652733A (en)

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CN112899667A (en) * 2021-01-20 2021-06-04 常州工程职业技术学院 Chemical silver plating device for plastic products
CN112969305A (en) * 2021-02-02 2021-06-15 魏思良 Film laminating device in FPC circuit board production line
CN113235149A (en) * 2021-06-29 2021-08-10 张四华 Rotary metal plating device with plating degree detection function

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5512154A (en) * 1993-01-28 1996-04-30 Meco Equipment Engineers B.V. Apparatus for selectively electroplating apertured metal or metallized products
JPH11264098A (en) * 1998-03-17 1999-09-28 Hitachi Chem Co Ltd Basket for immersing treatment of printed wiring board
US20070284258A1 (en) * 2006-06-09 2007-12-13 Masakazu Yoshimoto Method For Silver Plating
US20100086807A1 (en) * 2008-10-02 2010-04-08 E. I. Du Pont De Nemours And Company Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom
WO2010103749A1 (en) * 2009-03-12 2010-09-16 住友ベークライト株式会社 Jig for plating
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CN112899667A (en) * 2021-01-20 2021-06-04 常州工程职业技术学院 Chemical silver plating device for plastic products
CN112969305A (en) * 2021-02-02 2021-06-15 魏思良 Film laminating device in FPC circuit board production line
CN113235149A (en) * 2021-06-29 2021-08-10 张四华 Rotary metal plating device with plating degree detection function

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