CN113652645B - Rotary film plating equipment - Google Patents
Rotary film plating equipment Download PDFInfo
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- CN113652645B CN113652645B CN202110897117.4A CN202110897117A CN113652645B CN 113652645 B CN113652645 B CN 113652645B CN 202110897117 A CN202110897117 A CN 202110897117A CN 113652645 B CN113652645 B CN 113652645B
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- rotary
- reaction
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- assembly
- coating apparatus
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- 238000007747 plating Methods 0.000 title description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 239000012495 reaction gas Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 40
- 230000005540 biological transmission Effects 0.000 claims description 16
- 238000004528 spin coating Methods 0.000 claims description 9
- 238000010926 purge Methods 0.000 claims description 8
- 239000002826 coolant Substances 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 description 18
- 239000011553 magnetic fluid Substances 0.000 description 15
- 239000007789 gas Substances 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002122 magnetic nanoparticle Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a rotary coating device, comprising: the reaction assembly comprises a reaction cavity and an air inlet disc, wherein the reaction cavity is provided with a reaction cavity, and the air inlet disc is arranged in the reaction cavity and is used for conveying reaction gas to the reaction cavity; an adjustment assembly including an adjustment table configured to be controllably movable; the heating table is rotatably connected to the adjusting table and is positioned in the reaction cavity, and the heating table is provided with a bearing position for bearing a workpiece and is used for heating the workpiece borne on the bearing position; the adjusting table can drive the workpiece on the bearing position to be close to or far away from the air inlet disc in the controlled movement process. According to the rotary coating equipment, the workpiece can be heated and simultaneously rotated, so that the reaction gas can be deposited on the workpiece more uniformly. Meanwhile, the distance between the workpiece and the air inlet disc can be adjusted through the adjusting table, so that the distance which is suitable for reaction can be ensured between the workpiece and the air inlet disc all the time, and the thickness uniformity of the deposited film of the workpiece is better.
Description
Technical Field
The invention relates to the technical field of vapor deposition, in particular to rotary film plating equipment.
Background
Physical vapor deposition (Physical Vapour Deposition, PVD) refers to a technique in which a source of solid or liquid surface material is vaporized into gaseous atoms, molecules, or partially ionized into ions by a physical method under vacuum conditions, and a thin film having a specific function is deposited on the wafer surface by low-pressure gas (or plasma).
In the existing semiconductor film plating equipment, reaction gas enters a cavity through an air inlet gas homogenizing disc and is uniformly sprayed on the surface of a wafer or flows through the surface of the wafer, so that a required film is formed by reaction deposition. Therefore, the uniformity of the thickness of the deposited film is determined by factors such as the uniformity of the gas inlet and the level of the wafer, which are difficult to adjust, so that the uniformity of the formed film is limited, and the uniformity of the formed film is difficult to meet higher requirements.
Disclosure of Invention
Based on this, it is necessary to provide a rotary coating apparatus against the problem of poor uniformity of coating film to a semiconductor coating apparatus.
A spin coating apparatus comprising:
the reaction assembly comprises a reaction cavity and an air inlet disc, wherein the reaction cavity is provided with a reaction cavity, and the air inlet disc is arranged in the reaction cavity and is used for conveying reaction gas to the reaction cavity;
an adjustment assembly including an adjustment table configured to be controllably movable; and
The heating table is rotatably connected to the adjusting table and is positioned in the reaction cavity, and is provided with a bearing position for bearing a workpiece and is used for heating the workpiece borne on the bearing position;
the adjusting table can drive the workpiece on the bearing position to be close to or far away from the air inlet disc in the controlled moving process.
In one embodiment, the adjusting assembly further comprises a rotating shaft, one end of the rotating shaft is rotatably connected to the adjusting table, the reaction cavity is provided with a through hole communicated with the reaction cavity, the other end of the rotating shaft penetrates into the reaction cavity through the through hole, and the heating table is connected to one end of the rotating shaft penetrating into the reaction cavity.
In one embodiment, the rotary coating apparatus further includes a dynamic seal assembly disposed between the adjustment table and the reaction chamber and disposed around the rotation shaft to seal the through hole of the reaction chamber.
In one embodiment, the dynamic seal assembly comprises a rotary seal and a telescopic seal, wherein the rotary seal is arranged on the adjusting table and is provided with a rotary hole for the rotary shaft to pass through, and a sealing medium is filled in the rotary hole; the telescopic sealing piece is sleeved outside the rotating shaft and is telescopic along the moving direction of the adjusting table, one end of the telescopic sealing piece is distributed around the through hole and is in sealing connection with the reaction cavity, and the other end of the telescopic sealing piece is distributed around the rotating hole and is in sealing connection with the rotating sealing piece.
In one embodiment, the dynamic seal assembly further includes a coolant line disposed on the rotary seal for cooling the sealing medium.
In one embodiment, the dynamic seal assembly further comprises a purge line disposed on the rotary seal for cleaning the sealing medium attached to the rotary shaft.
In one embodiment, the adjusting assembly further comprises a power source and a transmission assembly both mounted to the adjusting table, and the transmission assembly is in transmission connection between the power source and the rotating shaft.
In one embodiment, the transmission assembly includes a worm gear and a worm gear intermeshed, the worm gear being mounted to the rotating shaft, the worm being mounted to the output shaft of the power source.
In one embodiment, the transmission assembly includes a first bevel gear and a second bevel gear intermeshed, the first bevel gear being mounted to the rotatable shaft and the second bevel gear being mounted to the output shaft of the power source.
The adjusting assembly further comprises an electric slip ring assembly arranged on the adjusting table, the electric slip ring assembly comprises an electric slip ring, a rotor of the electric slip ring is relatively fixed with the rotating shaft, a stator of the electric slip ring is relatively fixed with the adjusting table, a rotor wire harness of the electric slip ring is electrically connected with the heating table, and a stator wire harness of the electric slip ring is electrically connected with an external power supply
According to the rotary coating equipment, the wafer can be rotated while being heated, so that the reaction gas can be deposited on the wafer more uniformly. Meanwhile, the distance between the wafer and the air inlet disc can be adjusted through the adjusting table, so that the wafer can always ensure a proper reaction distance with the air inlet disc. Compared with the existing film plating equipment, the thickness uniformity of the deposited film of the wafer is better.
Drawings
FIG. 1 is a schematic diagram of a rotary coating apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of an adjusting assembly of the rotary coating apparatus of FIG. 1;
FIG. 3 is a schematic view of the adjustment assembly of FIG. 2 in one embodiment;
fig. 4 is a schematic structural diagram of the adjusting assembly in fig. 2 in another embodiment.
Reaction assembly 10, reaction cavity 11, reaction cavity 12, air inlet disk 13; a through hole 14;
an adjusting unit 20, an adjusting table 21, and a rotation shaft 22; a power source 23; a worm wheel 241; a worm 242; a first bevel gear 251; a second bevel gear 252; an electrical slip ring assembly 26; rotor harness 261, stator harness 262, electrical slip ring 263, stator 264, rotor 265; a connecting rod 266; a housing 267; a lifting module 27;
a heating stage 30;
a dynamic seal assembly 40; a rotary seal 41; a rotary hole 411, a sealing medium 412; a telescoping seal 42; a coolant line 43; purge line 44.
A workpiece 50.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Referring to fig. 1, an embodiment of the present invention provides a spin coating apparatus, including: a reaction assembly 10, an adjustment assembly 20, and a heating stage 30.
The reaction assembly 10 includes a reaction chamber 11 and an air inlet plate 13, and the reaction chamber 11 has a reaction chamber 12 for performing a coating reaction and is in a vacuum state. The inlet plate 13 is disposed in the reaction chamber 12 and connected to an external gas source to supply a reaction gas for a plating reaction to the reaction chamber 12.
The heating stage 30 is disposed in the reaction chamber 12 and has a carrying position for carrying the workpiece 50. The heating plate can heat the workpiece 50 positioned on the bearing position, so that the heated workpiece 50 and the reaction gas input by the air inlet plate 13 perform a film coating reaction, and film coating on the workpiece 50 is realized.
The adjustment assembly 20 includes an adjustment table 21 configured to be controllably movable, and a heating table 30 rotatably coupled to the adjustment table 21 such that the heating table 30 is both rotatable relative to the adjustment table 21 and movable with the adjustment table 21. The heating stage 30 can be moved closer to or farther from the air inlet tray 13 during movement of the adjustment stage 21, so that the workpiece 50 at the loading position on the heating stage 30 can also be moved closer to or farther from the air inlet tray 13.
In actual use, the workpiece 50 is placed on the carrying position, and the adjustment table 21 is controlled to move, so that the workpiece 50 on the carrying position gradually approaches the air inlet disc 13 until the air inlet disc 13 and the workpiece 50 are at a distance suitable for reactive deposition. Thereafter, the heating stage 30 heats the workpiece 50, and the gas inlet plate 13 injects the reaction gas so that the reaction gas reacts with the workpiece 50. When the reaction proceeds to a certain stage, the heating table 30 starts to rotate and drives the workpiece 50 on the bearing position to rotate, so that the reaction gas can uniformly contact with the surface of the workpiece 50, and the film formed on the surface of the workpiece 50 due to the film plating reaction is ensured to be more uniform.
The rotary coating device can rotate while heating the workpiece 50, so that the reaction gas can be more uniformly contacted with the workpiece 50, a coating reaction occurs, and a more uniform film is formed on the surface of the workpiece 50. Meanwhile, the distance between the workpiece 50 and the air inlet plate 13 can be adjusted through the adjusting table 21, so that the workpiece 50 can always be kept at a proper reaction distance from the air inlet plate 13. The thickness uniformity of the deposited film of the workpiece 50 is better than that of the prior film plating equipment. Alternatively, the workpiece 50 may be a wafer to be coated.
In the embodiment of the invention, the adjusting assembly 20 comprises a rotating shaft 22, one end of the rotating shaft 22 is rotatably connected to the adjusting table 21, and the other end of the rotating shaft 22 is connected to the heating table 30, so that the adjusting table 21 drives the heating table 30 to move through the rotating shaft 22. Specifically, the adjustment table 21 is located outside the reaction chamber 11, the reaction chamber 11 has a through hole 14 communicating with the reaction chamber 12, and the other end of the rotation shaft 22 penetrates into the reaction chamber 12 through the through hole 14 and is connected to the heating table 30. In this way, the volume of the reaction chamber 12 can be reduced by placing the adjustment table 21 outside the reaction chamber 12. Optionally, the adjusting assembly 20 further includes a lifting module 27, and the adjusting table 21 is mounted on a driving end of the lifting module 27, so that the lifting module 27 drives the adjusting table 21 to move, and the workpiece 50 on the bearing position is driven by the rotating shaft 22 and the heating table 30 to be far away from or near the air inlet disc 13.
Since the reaction chamber 12 must be vacuum-tight, gas leakage may be caused at the position where the rotation shaft 22 passes through the reaction chamber 11, i.e., the through-hole 14. To this end, in some embodiments, the spin coating apparatus further includes a dynamic seal assembly 40, and the dynamic seal assembly 40 is disposed between the adjustment table 21 and the reaction chamber 11 and is disposed around the rotation shaft 22 to seal the through-hole 14 of the reaction chamber 11.
Since the movement of the rotation shaft 22 is complicated, including the movement together with the adjustment table 21 and the rotation thereof, the dynamic seal assembly 40 includes a rotary seal 41 and a telescopic seal 42, and the sealing of the reaction chamber 12 when the rotation shaft 22 rotates is ensured by the rotary seal 41 and the sealing of the reaction chamber 12 when the rotation shaft 22 moves is ensured by the telescopic seal 42.
Specifically, referring to fig. 2 and 3, the rotary seal 41 is disposed on the adjustment table 21 and has a rotary hole 411, and the rotary shaft 22 is disposed in the rotary hole 411. The telescopic sealing member 42 is sleeved on the rotating shaft 22, is positioned between the rotating sealing member 41 and the telescopic sealing member 42, and is telescopic along the moving direction of the adjusting table 21. One end of the expansion seal member 42 is disposed around the through hole 14 and is hermetically connected to the reaction chamber 11, and the other end of the expansion seal member 42 is disposed around the rotation hole 411 and is hermetically connected to the rotation seal member 41. Since both ends of the telescopic sealing member 42 are sealed, a sealed space is formed in the telescopic sealing member 42, which encloses the rotation shaft 22 and the through-hole 14, so that the through-hole 14 is sealed by the sealed space. Further, when the rotation shaft 22 moves, the expansion seal member 42 also expands and contracts in accordance with the movement of the rotation shaft 22, so that the reaction chamber 12 can be sealed even when the rotation shaft 22 moves.
Further, since the rotation shaft 22 is also rotated, leakage occurs at a place where the rotation shaft 22 rotates with respect to the rotary seal 41, that is, the rotation hole 411. In order to avoid this problem, a sealing medium 412 is filled in the rotation hole 411 to seal the rotation hole 411. That is, a rotary dynamic seal is formed with the rotary shaft 22 at the rotary hole 411 by the rotary seal 41, and a gap between the side wall of the rotary hole 411 and the rotary shaft 22 is filled with the sealing medium 412 so that the rotary shaft 22 can be sealed at the time of rotation. In this way, the rotary seal 41 cooperates with the telescopic seal 42 to seal the through-hole 14 in the reaction chamber 11.
In particular, in the embodiment, the rotary seal 41 is a magnetic fluid seal, that is, the sealing medium 412 is magnetic fluid, and the telescopic seal 42 is a bellows.
In the use process, the temperature of the magnetic fluid sealing piece can be increased, the excessive temperature can cause the evaporation of the magnetic fluid solvent, and meanwhile, the high temperature can also cause the decrease of the magnetic intensity of the magnetic nano-particles in the magnetic fluid, so that the sealing effect is affected. In particular to the embodiment, the dynamic seal assembly 40 further includes a coolant line 43 provided on the rotary seal 41, the coolant line 43 for cooling the sealing medium 412. It can be understood that the cooling water circulates in the cooling liquid pipeline 43, and the cooling water cools the magnetic fluid, so as to ensure the working temperature of the magnetic fluid in the magnetic fluid sealing element and prevent the magnetic fluid from losing magnetism in a high temperature state and affecting the sealing effect.
Further, the dynamic seal assembly 40 further includes a purge line 44 provided on the rotary seal 41, the purge line 44 being used to clean the sealing medium 412 attached to the rotary shaft 22. The purge line 44 is closely attached to the side wall of the rotation hole 411, and is located at one end of the rotation hole 411 near the reaction chamber 11. That is, the purge line 44 is adjacent to the outlet of the rotation hole 411 so that the rotation shaft 22 can be purged at the outlet of the rotation hole 411 to clean the magnetic fluid attached to the rotation shaft 22.
In the embodiment of the present invention, the adjusting assembly 20 further includes a power source 23 and a transmission assembly, both mounted on the adjusting table 21, and the transmission assembly is in transmission connection between the power source 23 and the rotating shaft 22. The power of the power source 23 is transmitted to the rotating shaft 22 through the transmission assembly, so that the rotating shaft 22 is driven to rotate, and the rotating shaft 22 drives the heating table 30 to rotate together.
Since it is necessary to provide an electric slip ring 263 structure below the rotation shaft 22 to supply power to the heating stage 30, the power source 23 is selectively placed sideways, i.e., the output shaft of the power source 23 intersects the rotation shaft 22. The transmission assembly is required to convert the driving direction of the power source 23 into the rotation direction of the rotation shaft 22. In some embodiments, referring again to FIG. 3, the transmission assembly includes a worm gear 241 and a worm 242 intermeshed, the worm gear 241 being mounted on the rotatable shaft 22, the worm 242 being mounted on the output shaft of the power source 23. The driving direction of the laterally placed power source 23 is converted into the rotation direction of the rotation shaft 22 by the worm wheel 241 worm 242.
In other embodiments, referring to fig. 4, the transmission assembly may also be a first bevel gear 251 and a second bevel gear 252 that intermesh, the first bevel gear 251 being mounted on the rotatable shaft 22, the second bevel gear 252 being mounted on the output shaft of the power source 23. In this way, the driving direction of the laterally placed power source 23 can also be converted into the rotation direction of the rotation shaft 22 by the bevel gear.
In the embodiment of the present invention, the adjusting assembly 20 further includes an electric slip ring assembly 26 disposed on the adjusting table 21, the electric slip ring assembly 26 includes an electric slip ring 263, a rotor 265 of the electric slip ring 263 is relatively fixed to the rotating shaft 22, and a stator 264 of the electric slip ring is relatively fixed to the adjusting table 21. The heating stage 30 is electrically connected to a rotor electric beam 261 of an electric slip ring 263, and a stator electric beam 262 of the electric slip ring 263 is electrically connected to an external power source. Thus, when the rotation shaft 22 rotates, the stator 264 and the stator wire harness 262 on the stator 264 do not rotate along with the rotation shaft 22, the rotor 265 and the rotor wire harness 261 on the rotor 265 rotate along with the rotation shaft 22, and the rotor 265 is electrically connected with the stator 264 by carbon brushes or the like. At this time, the stator harness 262 transmits the electric power of the external power source to the rotor harness 261 on the rotor 265 through the stator 264 and the rotor 265, and the rotor harness 261 transmits the electric power to the heating stage.
Specifically, the electrical slip ring assembly 26 further includes a connecting rod 266, and the rotor 265 is connected to the rotating shaft 22 via the connecting rod 266 and rotates with the rotating shaft 22.
In particular embodiments, the electrical slip ring assembly 26 further includes a protective housing within which the connecting rod 266 and the electrical slip ring 263 are disposed. The protective case is connected to the housing 267 of the magnetic fluid seal, integrating the structure of the electric slip ring 263 inside the magnetic fluid, and the rotor harness 261 passes through the inside of the rotating shaft 22 to be connected to the heating table 30. Therefore, the wire harness directly passes through the magnetic fluid sealing piece, the wire harness is not required to be sealed again, and the number of parts is greatly reduced.
The invention has the following advantages:
the workpiece 50 can be heated and rotated, so that the reaction gas can be more uniformly contacted with the workpiece 50, a coating reaction occurs, and a more uniform film is formed on the surface of the workpiece 50. Meanwhile, the distance between the workpiece 50 and the air inlet plate 13 can be adjusted through the adjusting table 21, so that the workpiece 50 can always be kept at a proper reaction distance from the air inlet plate 13. The thickness uniformity of the deposited film of the workpiece 50 is better than that of the prior film plating equipment. Alternatively, the workpiece 50 may be a wafer to be coated.
One end of the telescopic sealing member 42 is disposed around the through hole 14 and is hermetically coupled to the reaction chamber 11, and the other end of the telescopic sealing member 42 is disposed around the rotation hole 411 and is hermetically coupled to the rotation sealing member 41, thereby forming a sealed space enclosing the rotation shaft 22 and the through hole 14. When the rotation shaft 22 moves, the expansion seal member 42 also expands and contracts in association with the movement of the rotation shaft 22, so that the reaction chamber 12 can be sealed even when the rotation shaft 22 moves.
A rotary dynamic seal is formed with the rotary shaft 22 at the rotary hole 411 by the rotary seal 41, and a gap between the side wall of the rotary hole 411 and the rotary shaft 22 is filled with a sealing medium 412 so that the rotary shaft 22 can be sealed at the time of rotation. In this way, the rotary seal 41 cooperates with the telescopic seal 42 to seal the through-hole 14 in the reaction chamber 11.
The structure of the electric slip ring 263 is integrated inside the magnetic fluid, and the rotor harness 261 passes through the inside of the rotating shaft 22 to be connected with the heating table 30. Therefore, the wire harness directly passes through the magnetic fluid sealing piece, the wire harness is not required to be sealed again, and the number of parts is greatly reduced.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. A rotary coating apparatus, characterized in that the rotary coating apparatus comprises:
the reaction assembly (10) comprises a reaction cavity (11) and an air inlet disc (13), wherein the reaction cavity (11) is provided with a reaction cavity (12), and the air inlet disc (13) is arranged in the reaction cavity (12) and is used for conveying reaction gas to the reaction cavity (12);
an adjustment assembly (20) comprising an adjustment table (21) configured to be controllably movable, a rotary shaft (22), and a dynamic seal assembly (40), the dynamic seal assembly (40) comprising a rotary seal (41), a telescopic seal (42), and a coolant line (43) and a purge line (44) provided on the rotary seal (41), the rotary seal (41) being provided to the adjustment table (21) and having a rotary hole (411) through which the rotary shaft (22) passes, the rotary hole (411) being filled with a sealing medium (412);
a heating table (30) rotatably connected to the adjustment table (21) and located in the reaction chamber (12), wherein the heating table (30) has a carrying position for carrying a workpiece (50) and is used for heating the workpiece (50) carried on the carrying position;
wherein, the adjusting table (21) can drive the workpiece (50) on the bearing position to be close to or far away from the air inlet disc (13) in the controlled moving process.
2. The spin coating apparatus according to claim 1, wherein one end of the rotation shaft (22) is rotatably connected to the adjustment table (21), the reaction chamber (11) has a through hole (14) communicating with the reaction chamber (12), the other end of the rotation shaft (22) penetrates into the reaction chamber (12) through the through hole (14), and the heating table (30) is connected to one end of the rotation shaft (22) penetrating into the reaction chamber (12);
the dynamic seal assembly (40) is arranged between the adjusting table (21) and the reaction cavity (11) and is distributed around the rotating shaft (22) so as to seal the through hole (14) of the reaction cavity (11).
3. The spin coating apparatus according to claim 2, wherein the telescopic sealing member (42) is sleeved outside the rotation shaft (22) and is telescopic along the moving direction of the adjustment table (21), one end of the telescopic sealing member (42) is disposed around the through hole (14) and is hermetically connected to the reaction chamber (11), and the other end of the telescopic sealing member (42) is disposed around the rotation hole (411) and is hermetically connected to the rotary sealing member (41).
4. The spin coating apparatus according to claim 1, wherein the coolant line (43) is used for cooling the sealing medium (412).
5. The spin coating apparatus according to claim 1, wherein the purge line (44) is for cleaning the sealing medium (412) attached to the rotating shaft (22).
6. The rotary coating apparatus according to claim 2, wherein the adjustment assembly (20) further comprises a power source (23) and a transmission assembly, both mounted to the adjustment table (21), the transmission assembly being drivingly connected between the power source (23) and the rotation shaft (22).
7. The spin-coating apparatus according to claim 6, wherein the transmission assembly includes a worm wheel (241) and a worm (242) that are engaged with each other, the worm wheel (241) being mounted to the rotary shaft (22), the worm (242) being mounted to an output shaft of the power source (23).
8. The rotary coating apparatus according to claim 6, wherein the transmission assembly includes a first bevel gear (251) and a second bevel gear (252) that are meshed with each other, the first bevel gear (251) being mounted to the rotary shaft (22), the second bevel gear (252) being mounted on an output shaft of the power source (23).
9. The rotary coating apparatus according to claim 1, wherein the adjustment assembly (20) further comprises an electrical slip ring assembly (26) provided on the adjustment table (21), the electrical slip ring assembly (26) comprising an electrical slip ring (263), a rotor (265) of the electrical slip ring (263) being fixed relative to the rotation shaft (22), a stator (264) of the electrical slip ring (263) being fixed relative to the adjustment table (21), a rotor harness (261) of the electrical slip ring (263) being electrically connected to the heating table (30), a stator harness (262) of the electrical slip ring (263) being for electrical connection to an external power source.
10. The spin-coating apparatus of claim 1, wherein the adjustment assembly (20) comprises a protective shell and a housing that are connected and in communication with each other, the electrical slip ring (263) being sealingly disposed within the protective shell, the sealing medium (412) being sealingly disposed within the housing.
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| CN202110897117.4A CN113652645B (en) | 2021-08-05 | 2021-08-05 | Rotary film plating equipment |
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| CN202110897117.4A CN113652645B (en) | 2021-08-05 | 2021-08-05 | Rotary film plating equipment |
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| CN113652645B true CN113652645B (en) | 2023-08-11 |
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| CN115161612B (en) * | 2022-06-18 | 2023-08-25 | 安徽纯源镀膜科技有限公司 | Coating objective table |
| CN115505896A (en) * | 2022-10-11 | 2022-12-23 | 江苏鹏举半导体设备技术有限公司 | Rotary inner wall film coating device |
| CN116336156A (en) * | 2023-05-30 | 2023-06-27 | 上海陛通半导体能源科技股份有限公司 | Ultrahigh vacuum rotating device |
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