CN113650127A - Preparation process of graphene-containing fiber board and application of graphene-containing fiber board to floor heating floor - Google Patents
Preparation process of graphene-containing fiber board and application of graphene-containing fiber board to floor heating floor Download PDFInfo
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- CN113650127A CN113650127A CN202110907677.3A CN202110907677A CN113650127A CN 113650127 A CN113650127 A CN 113650127A CN 202110907677 A CN202110907677 A CN 202110907677A CN 113650127 A CN113650127 A CN 113650127A
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 58
- 239000011094 fiberboard Substances 0.000 title claims abstract description 40
- 238000010438 heat treatment Methods 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000000835 fiber Substances 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 239000002023 wood Substances 0.000 claims abstract description 27
- 239000007787 solid Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 7
- 230000000694 effects Effects 0.000 claims abstract description 7
- 238000005406 washing Methods 0.000 claims abstract description 6
- 238000010411 cooking Methods 0.000 claims abstract description 5
- 238000007731 hot pressing Methods 0.000 claims abstract description 5
- 238000012216 screening Methods 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims abstract description 3
- 238000007689 inspection Methods 0.000 claims abstract description 3
- 238000004806 packaging method and process Methods 0.000 claims abstract description 3
- 238000000926 separation method Methods 0.000 claims abstract description 3
- 238000007493 shaping process Methods 0.000 claims abstract description 3
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 claims description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims description 6
- 229920000877 Melamine resin Polymers 0.000 claims description 6
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 4
- 239000004640 Melamine resin Substances 0.000 claims description 4
- 239000012948 isocyanate Substances 0.000 claims description 4
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- QKIUAMUSENSFQQ-UHFFFAOYSA-N dimethylazanide Chemical compound C[N-]C QKIUAMUSENSFQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 14
- 239000002131 composite material Substances 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000009408 flooring Methods 0.000 description 3
- -1 graphite alkene Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
- B27M3/00—Manufacture or reconditioning of specific semi-finished or finished articles
- B27M3/04—Manufacture or reconditioning of specific semi-finished or finished articles of flooring elements, e.g. parqueting blocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/08—Moulding or pressing
- B27N3/10—Moulding of mats
- B27N3/12—Moulding of mats from fibres
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09J161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
- C09J161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09J161/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C09J161/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D3/00—Hot-water central heating systems
- F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
- F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
- E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Forests & Forestry (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Architecture (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
The invention belongs to the technical field of artificial boards, and relates to a preparation process of a graphene-containing fiberboard, which comprises the following steps: wood peeling → chipping → screening → washing → cooking → fiber separation → glue mixing → fiber drying → paving and shaping → prepressing → hot pressing → cooling → sanding → inspection and sorting → packaging and warehousing, wherein: in the glue mixing and applying step, resin containing graphene is applied to the fibers, and the mass of the resin containing graphene accounts for 8-12% of the mass of the absolutely dry fibers. The graphene-containing fiber board prepared by the method is applied to the field of fiber boards with heat conduction effect, such as core boards of floor heating floors. On the basis of not changing the process of the conventional medium-high density fiberboard, only the adhesive in the gluing process is adjusted, and the graphene with the content not exceeding 0.2-1% of the solid content of the resin is added, so that the prepared fiberboard has no obvious change in mechanical property, can be made into a core board of a floor heating floor, and is more convenient to produce and install.
Description
Technical Field
The invention belongs to the technical field of artificial boards, relates to a medium-high density fiberboard, and particularly relates to a preparation process of a graphene-containing fiberboard and application of the graphene-containing fiberboard to a floor heating floor.
Background
Along with the improvement of living conditions of people, more and more families adopt low-temperature ground radiation heating to supply heat to replace an air conditioner, such as tubular hot water floor heating, tubular resistance floor heating or heat conduction film floor heating, and a layer of strengthened wood floor with comfortable foot feeling is paved on the surface of the floor heating. The reinforced wood floor base material is a fiber board, but the fiber board has low thermal conductivity coefficient (0.11 w/m.k), and the following problems are easily caused: 1. the heating speed is slow, so that heat energy is wasted; 2. heat cannot be transferred, and the temperature of a heat source area is too high, so that potential safety hazards are formed; 3. the front surface of the back surface of the floor is unevenly heated, and the floor is likely to deform, has reduced mechanical strength, and has shortened service life.
In the prior art, many developments focused on floor heating floors, for example, a floor disclosed in "composite geothermal floor" with a publication number of CN100371553C includes a surface plate (1), a secondary surface plate (2), a core plate (3), and a bottom plate (4), wherein a transverse heat conduction groove (5) is provided in the core plate (3), a longitudinal heat conduction groove (6) is provided in the bottom plate (4), the transverse heat conduction groove (5) and the longitudinal heat conduction groove (6) are perpendicular to each other and are communicated, and a heat conduction medium (7) is filled in the transverse heat conduction groove (5) and the longitudinal heat conduction groove (6). The invention arranges the heat-conducting grooves in the core plate (3) and the floor (4) respectively, and has the defects that: (1) the grooves with the thickness of 1-5 mm are formed in the back plate, so that the static bending strength and the elastic modulus (or the mechanical strength) of the floor are reduced, the service life of the floor is shortened, and the wider the width of the grooves is, the more the mechanical strength is reduced; (2) the distance between the transverse heat conducting grooves of the core plate (3) is set to be 25-40 mm, the heat conducting grooves are arranged densely, the production cost of the floor is increased, and on the premise of achieving the heat conducting effect, the heat conducting grooves which are less are considered to be used as much as possible; (3) the thickness of the aluminum strip added to the transverse heat conduction groove is the same as the width of the transverse heat conduction groove, and the thickness of the aluminum strip is set to be 0.5-1.5 mm, even 2.5 mm; vertical heat conduction groove, it adds aluminium strip thickness and vertical heat conduction groove with the degree of depth, sets up at 1~3mm, and aluminium strip or copper bar thickness are thicker more aluminium strip or copper bar are thicker more, can lead to the manufacturing cost on floor higher, reaches under the prerequisite of heat conduction effect, should consider to use thinner aluminium strip or narrower heat conduction groove as far as possible. The publication No. CN2926381Y composite solid wood floor discloses a composite solid wood floor, which comprises a plate body with a tongue-and-groove structure on the side surface, wherein the plate body is composed of a surface material layer and a composite layer, the surface material layer is positioned on the composite layer, the utility model discloses a geothermal groove is opened on the back surface of the plate body, air is used as a heat conduction medium, and the defect of low heat conduction efficiency exists. The multilayer solid wood composite geothermal floor disclosed in the publication No. CN201059049Y 'multilayer solid wood composite geothermal floor' is composed of a panel, a core board and a bottom board, wherein the core board is composed of a plurality of unit small blocks arranged at intervals and forms a transverse channel, each unit small block is provided with a tenon and a groove, the bottom board is composed of a plurality of strip-shaped boards arranged at intervals and forms a longitudinal channel, the transverse channel of the core board and the longitudinal channel of the bottom board are staggered to form a reticular channel of the floor, and the core board is formed by bonding a plurality of thin boards. And the publication No. CN201103222Y multilayer solid wood floor with grooves on the bottom surface comprises vertical grooves (1) and horizontal grooves (2) which are mutually vertical and crossed, the ports at the two ends of each groove reach the wedge ports of the opposite side grooves, the distance between every two adjacent grooves is 1-300 mm, and the depth of each groove is 1-7 mm. The multilayer composite floor disclosed by the publication No. CN102277944A 'A multilayer composite floor and a production method thereof' comprises a fabric, a substrate and a solid wood back plate, wherein the fabric and the solid wood back plate are respectively adhered and fixed on the upper surface and the lower surface of the substrate, an upper groove is formed on the upper surface of the substrate, a lower groove is formed on the back surface of the solid wood back plate after the solid wood back plate and the substrate are adhered, and a through hole is formed at the shape intersection of the upper groove and the lower groove to conduct the upper groove and the lower groove. The multilayer composite floor forms uniform heat conduction grooves and heat conduction holes through the heat conduction channels of the lower groove, the through holes and the upper groove, and still adopts air as a heat conduction medium. The solid wood floor disclosed by the publication No. CN202430948U 'quick uniform heat conduction type geothermal floor', comprises a panel, a core board and a bottom board, wherein the core board is arranged between the panel and the bottom board, two opposite side surfaces of the core board are respectively provided with a tenon and a mortise corresponding to each other, the core board is composed of a frame and more than 2 wood laths, the wood laths are connected with the inner side of the frame, a heat conduction groove is arranged between every two wood laths, the main technical key points are that ventilation grooves which are perpendicular to and communicated with the heat conduction grooves are arranged in the frame and the wood laths of the core board, and the bottom board is a moistureproof sound insulation board.
In the prior art, many technical schemes for enhancing heat conduction efficiency of a floor core layer appear, for example, CN103266742B discloses a four-layer solid wood composite geothermal floor and a production process thereof, in the disclosed four-layer solid wood composite geothermal floor, a core plate 3 is formed by arranging core plate strips in the length direction, transverse heat conduction media 5-1 are arranged in the core plate strips, longitudinal heat conduction media 5-2 are arranged in the core plate formed by the core plate strips, heat conduction bands formed by the transverse heat conduction media 5-1 and the longitudinal heat conduction media 5-2 are mutually perpendicular and form a three-dimensional space heat conduction network, the distance between the adjacent transverse heat conduction media 5-1 is 200-300 mm, and the distance between the adjacent longitudinal heat conduction media 5-2 is 60-100 mm. CN108908642A discloses a novel heat conduction fiberboard and a processing method thereof, the novel heat conduction fiberboard comprises two fiberboards connected by adopting a clamping block, an installation frame is arranged on the fiberboards, the installation frame is fixed on the side surfaces of the fiberboards by bolts, and a buffer block is arranged between the fiberboards and the installation frame. The surface of the mounting frame is provided with a heat conducting plate, the heat conducting plate is connected with a plurality of heat conducting wires which penetrate through the mounting frame and extend to the inside of the fiber board body, and a layer of water proofing and a layer of wear resistance are arranged above the heat conducting plate. The novel heat-conducting fiber plate mainly increases the heat-conducting property of the novel fiber plate through the heat-conducting plate and the heat-conducting wires, so that heat can be conducted between the first fiber plate body and the second fiber plate body more quickly and better. The disadvantages are that: 1. the structure is complicated, and the processing degree of difficulty is high. Two fiber plates are combined, an installation frame and a buffer block are added, then the hole is drilled and fixed by bolts, and a heat conducting plate and a heat conducting wire are placed. 2. The heat conduction is not uniform, the inner part of the fiber board is heated only by the heat conduction wires in an accelerating way, the heating is not uniform, and the fiber board is easy to deform; 3. the heating wires are placed through drilling, the mechanical strength of the fiber board is damaged, and the hidden strength danger exists.
However, no matter the heat conducting strips or the heat conducting wires are added in the core board of the floor, the complete mechanical property of the core board can be changed, and the service life of the floor heating floor can be influenced in a long term. The improvement of the heat conductivity coefficient of the core plate and the doping of high heat conductivity substances in the fiber plate are one of the technical directions for solving the problems.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to disclose a preparation process of a graphene-containing fiber board.
Technical scheme
A preparation process of a graphene-containing fiberboard comprises the following specific steps: wood peeling → chipping → screening → washing → cooking → fiber separation → glue mixing → fiber drying → paving and shaping → prepressing → hot pressing → cooling → sanding → inspection and sorting → packaging and warehousing, wherein:
in the glue mixing and applying step, resin containing graphene is applied to the fibers, wherein the mass of the resin containing graphene accounts for 8-12% of the mass of the absolutely dry fibers, and the optimal mass is 10%.
In a preferred embodiment of the present invention, the graphene-containing resin is prepared by adding graphene to urea-formaldehyde resin (UF), melamine resin (MF), phenol-formaldehyde resin (PF) or isocyanate resin, wherein the addition amount of the graphene-containing resin is 0.1 to 1%, preferably 0.5%, of the solid content of the resin.
In a preferred embodiment of the present invention, the graphene-containing resin is prepared by adding a graphene solution to a urea-formaldehyde resin (UF), a melamine resin (MF), a phenol-formaldehyde resin (PF) or an isocyanate resin, wherein the addition amount of the graphene solution is 5-20%, preferably 12%, of the solid content of the resin.
In the preferred embodiment of the present invention, the graphene solution contains 1 to 5% by mass of graphene, and the solvent is water, N-methyl pyrrolidone, N, N-dimethylformamide, acetamide, chloroform, or the like.
In the preferred embodiment of the invention, the number of graphene layers is 1-10, the average thickness is 1-20 nm, and the size of each layer is 1-10 um.
The invention also aims to provide the graphene-containing fiber board prepared by the method, which is applied to the field of fiber boards with heat conduction effect, and particularly can be used as a core board of a floor heating floor.
The Graphene (GE) is composed of monoatomic layers in which carbon atoms are hybridized and connected in sp2 mode, has a high specific surface area, contains functional groups such as hydroxyl groups, epoxy groups and the like on a substrate plane, contains functional groups such as carbonyl groups, carboxyl groups and the like on the edge, and is excellent in performance, low in cost and good in processability.
The graphene used in the preparation process disclosed by the invention is Graphene Oxide (GO).
The invention firstly utilizes an improved Hummers method to prepare graphite oxide and further obtains Graphene Oxide (GO) by ultrasonic treatment, the improved Hummers method is used to prepare graphite oxide, and the preparation steps comprise:
adding 23mL of concentrated sulfuric acid into a 250mL three-neck flask in an ice water bath, and standing for 10 min; slowly adding 0.5g of sodium nitrate, 1g of natural graphite powder and 3g of potassium permanganate in sequence, reacting for 1 hour at the temperature lower than 20 ℃, heating the mixture to 35 ℃ to react for 2 hours, wherein the mixture is dark green; then, the temperature was raised to 90 ℃ and the mixture became brown; slowly dropwise adding 46mL of deionized water into a normal pressure funnel, changing the mixture from brown to bright yellow, and then reacting for 2 hours in an oil bath at 100 ℃; stopping heating, adding 140mL of deionized water and 10mL of 30% hydrogen peroxide, stirring for reaction for 30min, centrifuging, washing with 5% hydrochloric acid solution, and finally placing the centrifuged product in a vacuum drying oven at 60 ℃ for drying for 24h to obtain the graphite oxide.
Add the fibreboard of graphite alkene, have high heat conductivity and homogeneity, behind the laminate flooring of preparation, can be fast and even when opening ground and warm up transmit the heat to wooden floor, calorific loss is few, and the programming rate is fast simultaneously, and regional intensification is balanced, and the effect of rising the temperature is higher than conventional wooden fibreboard 2 ~4 ℃ per hour, and each regional surface temperature of face is unanimous simultaneously, and human sense of touch is better. In the conventional fiberboard, different positions have different heating rates, so that expansion and shrinkage are inconsistent, additional stress is generated, cracking is finally caused, the service life is shortened, and other risks are avoided; the graphene fiber board is uniformly heated, the drying shrinkage and the wet expansion of the board are regular, the cracking risk can be reduced, and the service life is prolonged.
Advantageous effects
On the basis of not changing the process of the conventional medium-high density fiberboard, only the adhesive in the sizing process is adjusted, graphene with the content not exceeding 0.2-1% of the solid content of the resin is added, and other processes are basically not changed. The mechanical property of the prepared fiberboard is not obviously changed, and the fiberboard is made into a core board of a reinforced floor and is used for a floor suitable for floor heating.
Detailed Description
The present invention will be described in detail below with reference to examples to enable those skilled in the art to better understand the present invention, but the present invention is not limited to the following examples.
Example 1
Firstly, needle leaves are processed: the broad-leaved wood is mixed according to the weight ratio of 1: peeling at a weight ratio of 1; slicing, screening out wood chips with the length, width and thickness of 15-25mm and 3-6mm, and washing with water;
the second step is that: adding graphene, adding graphene powder with the number of layers of 3-5, the average thickness of less than 12 nm and the sheet size of 9-11um into urea resin with the solid content of 55%, wherein the addition amount is 0.3% of the solid content of the resin, and uniformly mixing for later use;
the third step: cooking and softening wood chips at the temperature of 175 ℃ and 180 ℃ and under the pressure of 7.5bar for 3 minutes, separating fibers by a hot mill, and adding paraffin in an amount of 0.6 percent of the absolute dry fibers;
the fourth step: carrying out urea-formaldehyde resin application on the fibers, carrying out topdressing with the glue application amount of 110 and 130 kg/m, and then carrying out drying, wherein the moisture content of the dried fibers is 10-13%;
the fifth step: fiber paving and molding, and hot pressing is prepared, wherein the temperature ranges are 220-230, 210-200, 185-195, 170-180 and 160-170 ℃ respectively;
fourth, cool → sand light → test, etc. → pack.
The physical and chemical properties of the prepared fiber board meet the national standard, wherein the heat conductivity reaches 14.5 ℃/h, and the heat conductivity of the common fiber board is about 12 ℃/h.
Furthermore, the core board can be made into a laminate flooring core board suitable for floor heating.
Example 2
Firstly, needle leaves are processed: the broad-leaved wood is mixed according to the weight ratio of 1: peeling at a weight ratio of 1; slicing, screening out wood chips with the length, width and thickness of 15-25mm and 3-6mm, and washing with water;
the second step is that: adding graphene, adding a solvent of acetamide and 5% of graphene solution into 60% of melamine modified urea-formaldehyde resin with solid content, wherein the addition amount is 6% of the solid content of the resin, the number of graphene layers is 2-5, the average thickness is 1-3 nm, the diameter is 3-5um, and uniformly mixing for later use;
the third step: cooking and softening wood chips at the temperature of 175 ℃ and 180 ℃ and under the pressure of 7.5bar for 3 minutes, separating fibers by a hot mill, and adding paraffin in an amount of 0.5 percent of the absolute dry fibers;
the fourth step: carrying out fiber reinforcement by applying melamine modified urea-formaldehyde resin with the glue application amount of 90-110 kg/m, and then drying, wherein the water content of the dried fiber is 10-13%;
the fifth step: fiber paving and molding, and hot pressing is prepared, wherein the temperature ranges are 210-220, 200-190, 175-185, 170-180 and 160-170 ℃ respectively;
fourth, cool → sand light → test, etc. → pack.
The physical and chemical properties of the prepared fiber board meet the national standard, wherein the heat conductivity reaches 14.7 ℃/h, and the heat conductivity of the common fiber board is about 12 ℃/h.
Furthermore, the core board can be made into a laminate flooring core board suitable for floor heating.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. A preparation process of a graphene-containing fiberboard comprises the following specific steps: wood peeling → chipping → screening → washing → cooking → fiber separation → glue mixing → fiber drying → paving and shaping → prepressing → hot pressing → cooling → sanding → inspection and sorting → packaging and warehousing, which is characterized in that: in the glue mixing and applying step, resin containing graphene is applied to the fibers, and the mass of the resin containing graphene accounts for 8-12% of the mass of the absolutely dry fibers.
2. The process for preparing a graphene-containing fiber sheet according to claim 1, wherein: the mass of the graphene-containing resin accounts for 10% of the mass of the absolutely dry fiber.
3. The process for preparing a graphene-containing fiber sheet according to claim 1, wherein: the graphene-containing resin is prepared by adding graphene into urea-formaldehyde resin (UF), melamine resin (MF), phenol-formaldehyde resin (PF) or isocyanate resin, wherein the addition amount of the graphene-containing resin is 0.1-1% of the solid content of the resin.
4. The process for preparing a graphene-containing fiber sheet according to claim 3, wherein: the addition amount is 0.5% of the solid content of the resin.
5. The process for preparing a graphene-containing fiber sheet according to claim 1, wherein: the graphene-containing resin is prepared by adding a graphene solution into urea-formaldehyde resin (UF), melamine resin (MF), phenol-formaldehyde resin (PF) or isocyanate resin, wherein the addition amount of the graphene-containing resin is 5-20% of the solid content of the resin.
6. The process for preparing a graphene-containing fiber sheet according to claim 5, wherein: the addition amount is 12% of the solid content of the resin.
7. The process for preparing a graphene-containing fiber sheet according to claim 5 or 6, wherein: the graphene solution comprises 1-5% of graphene by mass, and a solvent which is water, N-methyl pyrrolidone, N, N-dimethyl amide, acetamide or chloroform.
8. The graphene-containing fiber board prepared according to any one of the processes of claims 1 to 7.
9. Use of the graphene-containing fiber sheet according to claim 8, wherein: it is applied to the field of fiber boards with heat conduction effect.
10. Use of the graphene-containing fiber sheet according to claim 9, wherein: the core board is applied to the core board of the floor heating floor.
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Application publication date: 20211116 |