CN113649449A - Stamping die for manufacturing semiconductor lead frame - Google Patents

Stamping die for manufacturing semiconductor lead frame Download PDF

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Publication number
CN113649449A
CN113649449A CN202110862032.2A CN202110862032A CN113649449A CN 113649449 A CN113649449 A CN 113649449A CN 202110862032 A CN202110862032 A CN 202110862032A CN 113649449 A CN113649449 A CN 113649449A
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CN
China
Prior art keywords
inner cavity
wall
shell
gear
rotating
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Granted
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CN202110862032.2A
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Chinese (zh)
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CN113649449B (en
Inventor
张伟
陈虎
陈惠�
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Taixing City Longteng Electronics Co ltd
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Taixing City Longteng Electronics Co ltd
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Priority to CN202110862032.2A priority Critical patent/CN113649449B/en
Publication of CN113649449A publication Critical patent/CN113649449A/en
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Publication of CN113649449B publication Critical patent/CN113649449B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/02Stamping using rigid devices or tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00Tools as parts of machines covered by this subclass
    • B21D37/04Movable or exchangeable mountings for tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/02Advancing work in relation to the stroke of the die or tool
    • B21D43/04Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work
    • B21D43/12Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work by chains or belts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/20Storage arrangements; Piling or unpiling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Punching Or Piercing (AREA)
  • Press Drives And Press Lines (AREA)

Abstract

The invention discloses a stamping die for manufacturing a semiconductor lead frame, which comprises: support, shell, punching machine, commentaries on classics roller and transport mechanism, the top at the support is installed to the shell, the punching machine assembly is on the top of shell, and the output extends into the inner chamber of shell, change roller quantity and be two, assemble respectively both ends about the support, the both ends of belt cup joint respectively in two outer walls that change the roller, still include: the transmission mechanism is assembled at the rear side of the inner cavity of the shell; the inclined plate is assembled at the left end of the bracket; and the storage mechanism is assembled on the left side of the bracket. This make semiconductor lead frame's stamping die, in the in-service use, can carry out the punching press in succession, improve work efficiency, can concentrate the collection and stack to the punching press finished product simultaneously, guarantee not take place the friction between the finished product, also guarantee that the finished product can not fall and damage, can also quick replacement punching press head to the punching press demand of the different model lead frames of adaptation.

Description

Stamping die for manufacturing semiconductor lead frame
Technical Field
The invention relates to the technical field of semiconductor manufacturing equipment, in particular to a stamping die for manufacturing a semiconductor lead frame.
Background
The semiconductor lead frame is a carrier of an integrated circuit, is a key structural member for realizing the connection of a leading-out end of an internal circuit of a chip and an external lead by means of metal to form a loop, plays a role of a bridge connected with an external lead, needs to use the lead frame in most semiconductor integrated blocks, and is an important basic material in the electronic information industry;
when stamping is carried out on a plate, the work efficiency is required to be improved, continuous stamping is required, and therefore a device capable of continuously pushing an original plate is required.
Disclosure of Invention
The invention aims to provide a stamping die for manufacturing a semiconductor lead frame, which at least solves the problems that the prior art can not carry out continuous die casting, can not avoid the accumulation friction of die casting finished products and can not quickly replace a die casting head.
In order to achieve the purpose, the invention provides the following technical scheme: a stamping die for manufacturing a semiconductor lead frame, comprising: support, shell, punching machine, commentaries on classics roller and transport mechanism, the top at the support is installed to the shell, the punching machine assembly is on the top of shell, and the output extends into the inner chamber of shell, change roller quantity and be two, assemble respectively both ends about the support, the both ends of belt cup joint respectively in two outer walls that change the roller, still include:
the transmission mechanism is assembled at the rear side of the inner cavity of the shell;
the inclined plate is assembled at the left end of the bracket;
the storage mechanism is assembled on the left side of the bracket;
the dismounting mechanism is assembled at the output end of the punching machine;
the transfer mechanism includes:
the first motor is arranged at the rear side of the shell, and the output end of the first motor extends into the inner cavity of the shell;
the first gear is locked at the output end of the first gear through a coupler;
the first rotating disc is fixedly arranged on the front side of the first gear;
the shifting block is arranged on the outer wall of the first rotary table;
the second gear is arranged on the inner wall of the shell through a bearing;
the second turntable is fixedly arranged on the front side of the second gear, the first motor drives the first gear to rotate, so that the first turntable rotates, the second turntable rotates reversely through transmission of the second gear, and the belt is driven to intermittently move by utilizing friction of the shifting block and the second turntable on the belt.
Preferably, the vertical distance between the outer wall of the first rotating disc and the outer wall of the belt is the same as the thickness of the shifting block.
Preferably, the storage mechanism includes: a storage box mounted on the left side of the bracket; the second motor is arranged on the right side of the containing box; the driving assembly is assembled in the inner cavity of the containing box; and the lifting component is assembled in the inner cavity of the containing box.
Preferably, the driving assembly includes: the two rotating shafts are arranged, one end of each rotating shaft is symmetrically arranged on the left side of the inner cavity of the containing box through a bearing, the other end of one rotating shaft is locked on the output end of the second motor through a coupler, and the other end of the other rotating shaft is arranged on the right side of the inner cavity of the containing box through a bearing; the third gears are in interference fit with the outer wall of the rotating shaft, and the two third gears are meshed with each other; one end of the rotating rod is fixedly arranged on the outer wall of the third gear; the first limiting groove is formed in the outer wall of the other end of the rotating rod, the second motor drives the rotating shaft to rotate, and then the third gear rotates, so that the two rotating rods swing.
Preferably, the lifting assembly comprises: the number of the fixing grooves is two, and the fixing grooves are respectively fixedly arranged on the front side and the rear side of the inner cavity of the containing box; one end of the push rod is slidably embedded in the inner cavity of the fixing groove, and the other end of the push rod extends to the top end of the containing box; one end of the limiting column is fixedly arranged on the outer wall of the push rod, and the other end of the limiting column is slidably embedded in the inner cavity of the first limiting groove; and the push plate is fixedly arranged at the other end of the push rod, and when the two rotating rods swing, the push rod pushes the push plate to move up and down by utilizing the matching of the first limiting groove and the limiting column.
Preferably, the detaching mechanism includes: the stamping head is assembled at the output end of the stamping machine; one end of the screw rod is in threaded connection with the outer wall of the stamping head, and the other end of the screw rod extends into the inner cavity of the stamping head; the limiting block is arranged at the other end of the screw rod through a bearing; the inserting block is arranged at the other end of the limiting block and can be inserted into an inserting hole formed in the outer wall of the output end of the punching machine; the two slide ways are symmetrically arranged at the bottom end of the inner cavity of the stamping head respectively; the two clamping blocks are symmetrically assembled in the inner cavity of the stamping head respectively, and the bottom ends of the two clamping blocks are embedded in the inner cavity of the slideway in a sliding manner respectively; the second limiting groove is formed in the outer wall of the clamping block, the outer wall of the limiting block is embedded in the inner cavity of the second limiting groove in a sliding mode, the limiting block is enabled to move inwards by rotating the screw rod, and the limiting block is utilized to limit the second limiting groove so that the two clamping blocks move inwards respectively.
Preferably, two ends of the outer wall of the limiting block are arranged in a splayed shape.
The stamping die for manufacturing the semiconductor lead frame has the advantages that:
1. the first motor drives the first gear to rotate, so that if the first turntable and the shifting block rotate together, the second turntable rotates reversely by utilizing the transmission of the second gear, and the shifting block and the second turntable rub the belt to intermittently transmit the belt;
2. the rotating shaft is driven to rotate by the second motor, so that the two third gears rotate and drive the rotating rod to swing, the push rod can push the push plate to move up and down by utilizing the mutual matching of the first limiting groove and the limiting column, in actual use, the height of the push plate can be adjusted according to the finished lead frame stacked at the top end of the push plate, the falling height of the lead frame is ensured to be minimum, and meanwhile, each lead frame is ensured to be orderly accommodated in the inner cavity of the accommodating box, and mutual friction is avoided;
3. according to the invention, the screw rod is rotated to push the limiting block to move inwards, the outer walls of the two ends of the limiting block are used for limiting the second limiting groove, the two clamping blocks are simultaneously moved inwards, the inserting block and the two clamping blocks are further inserted into the jack formed at the output end of the punching machine, and the opposite punching head is used for braking.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of a transfer mechanism according to the present invention;
FIG. 3 is a right side sectional view of the receiving mechanism of the present invention;
FIG. 4 is a front view of the punch head of the present invention;
FIG. 5 is a top sectional view of the detaching mechanism of the present invention.
In the figure: 1. the stamping machine comprises a support, 2, a shell, 3, a stamping machine, 4, a rotating roller, 5, a belt, 6, a conveying mechanism, 61, a first motor, 62, a first gear, 63, a first turntable, 64, a shifting block, 65, a second gear, 66, a second turntable, 7, an inclined plate, 8, an accommodating mechanism, 81, an accommodating box, 82, a second motor, 83, a rotating shaft, 84, a third gear, 85, a rotating rod, 86, a first limiting groove, 87, a fixing groove, 88, a push rod, 89, a limiting column, 810, a push plate, 9, a dismounting mechanism, 91, a stamping head, 92, a screw rod, 93, a limiting block, 94, an insertion block, 95, a slide way, 96, a clamping block, 97 and a second limiting groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a stamping die for manufacturing a semiconductor lead frame comprises a support 1, a shell 2, a stamping machine 3, two rotating rollers 4 and a conveying mechanism 6, wherein the shell 2 is installed at the top end of the support 1, the stamping machine 3 is assembled at the top end of the shell 2, the output end of the stamping machine extends into an inner cavity of the shell 2, the two rotating rollers 4 are respectively assembled at the left end and the right end of the support 1, two ends of a belt 5 are respectively sleeved on the outer walls of the two rotating rollers 4, the stamping die further comprises the conveying mechanism 6, an inclined plate 7, an accommodating mechanism 8 and a dismounting mechanism 9, the conveying mechanism 6 is assembled at the rear side of the inner cavity of the shell 2, the inclined plate 7 is assembled at the left end of the support 1, the accommodating mechanism 8 is assembled at the left side of the support 1, and the dismounting mechanism 9 is assembled at the output end of the stamping machine 3;
the transmission mechanism 6 comprises a first motor 61, a first gear 62, a first rotating disc 63, a shifting block 64, a second gear 65 and a second rotating disc 66, wherein the first motor 61 is installed at the rear side of the shell 2, the output end of the first motor extends into the inner cavity of the shell 2, the first gear 62 is locked at the output end of the first gear 62 through a coupler, the first rotating disc 63 is fixedly installed at the front side of the first gear 62, the shifting block 64 is installed at the outer wall of the first rotating disc 63, the second gear 65 is installed at the inner wall of the shell 2 through a bearing, the second rotating disc 66 is fixedly installed at the front side of the second gear 65, the first motor 61 drives the first gear 62 to rotate, so that the first rotating disc 63 rotates, the second rotating disc 66 rotates reversely through the transmission of the second gear 65, and the belt 5 is driven to move intermittently by the friction between the shifting block 64 and the second rotating disc 66.
Preferably, the vertical distance between the outer wall of the first rotating disc 63 and the outer wall of the belt 5 is the same as the thickness of the shifting block 64, so that the belt 5 can be driven to advance by the shifting block 64 for the same distance every time the first rotating disc 63 rotates one circle.
Preferably, the receiving mechanism 8 further includes a receiving box 81, a second motor 82, a rotating shaft 83, a third gear 84, a rotating rod 85, a first limiting groove 86, a fixing groove 87, a push rod 88, a limiting post 89, and a push plate 810, the receiving box 81 is assembled on the left side of the bracket 1, the second motor 82 is installed on the right side of the receiving box 81, the number of the rotating shafts 83 is two, one end of each rotating shaft 83 is symmetrically installed on the left side of the inner cavity of the receiving box 81 through a bearing, the other end of one rotating shaft 83 is locked on the output end of the second motor 82 through a coupling, the other end of the other rotating shaft 83 is installed on the right side of the inner cavity of the receiving box 81 through a bearing, the third gears 84 are in interference fit with the outer wall of the rotating shaft 83, the two third gears 84 are engaged with each other, one end of the rotating rod 85 is fixedly installed on the outer wall of the third gear 84, the first limiting groove 86 is opened on the outer wall of the other end of the rotating rod 85, the second motor 82 drives the rotating shaft 83 to rotate, and then make third gear 84 rotate to make two bull sticks 85 swing, fixed slot 87 quantity is two, fixed mounting is in both sides around the inner chamber of containing box 81 respectively, push rod 88 one end slidable is embedded in the inner chamber of fixed slot 87, and the other end extends to the top of containing box 81, spacing post 89 one end fixed mounting is in the outer wall of push rod 88, and the other end slidable is embedded in the inner chamber of first spacing groove 86, push plate 810 fixed mounting is in the other end of push rod 88, when two bull sticks 85 swings, utilize the cooperation of first spacing groove 86 and spacing post 89, make push rod 88 promote push plate 810 and reciprocate.
As a preferable scheme, further, the detaching mechanism 9 includes a stamping head 91, a screw 92, a limiting block 93, an insert block 94, a slideway 95, a clamping block 96 and a second limiting groove 97, the stamping head 91 is assembled at the output end of the stamping machine 3, one end of the screw 92 is screwed on the outer wall of the stamping head 91, and the other end extends into the inner cavity of the stamping head 91, the limiting block 93 is mounted at the other end of the screw 92 through a bearing, the insert block 94 is mounted at the other end of the limiting block 93 and can be inserted into a jack formed on the outer wall of the output end of the stamping machine 3, the number of the slideways 95 is two, the slideways are respectively symmetrically arranged at the bottom end of the inner cavity of the stamping head 91, the number of the clamping blocks 96 is two, the bottom ends are respectively symmetrically assembled in the inner cavity of the stamping head 91, the second limiting groove 97 is arranged on the outer wall of the clamping block 96, and the outer wall of the limiting block 93 is slidably embedded in the inner cavity of the second limiting groove 97, the screw 92 is rotated to move the limiting block 93 inwards, and the limiting block 93 limits the second limiting groove 97 to enable the two clamping blocks 96 to move inwards respectively.
As preferred scheme, further, the outer wall both ends of stopper 93 are "eight" font setting to guarantee that stopper 93 inwardly moved can order about fixture 96 inwardly moved, stopper 93 outwardly moved then can order about fixture 96 outwardly moved.
The detailed connection means is a technique known in the art, and the following mainly describes the working principle and process, and the specific operation is as follows.
The method comprises the following steps: placing lead frames to be punched at equal intervals on the top end of a belt 5, starting a punching machine 3 and a first motor 61, driving a first gear 62 to rotate by the first motor 61, enabling a second gear 65 to rotate reversely due to mutual meshing of the first gear 62 and the second gear 65, further enabling a first rotary disc 63 and a second rotary disc 66 to rotate in opposite directions, and enabling the belt 5 to transmit a distance by utilizing friction of the shifting block 64 and the second rotary disc 66 on the belt 5 when the shifting block 64 rotates along with the first rotary disc 63 to enable the next lead frame to correspond to the punching machine 3;
step two: after the punched lead frame is conveyed to the left end of the belt 5, the lead frame can slide down along the inclined plate 7 and fall into an inner cavity of the containing box 81, at the moment, the push plate 810 is positioned at the topmost end to ensure that the falling distance is shortest, the second motor 82 is started to be stacked along with the lead frame, the second motor 82 drives the rotating shaft 83 to drive one third gear 84 to rotate, two rotating rods 85 can be driven to simultaneously swing downwards due to mutual meshing of the two third gears 84, and the push rod 88 can move downwards along the inner cavity of the fixing groove 87 and drive the push plate 810 to move downwards, so that the lead frame can always fall into the inner cavity of the containing box 81 and ensure that the falling distance is minimum;
step three: when different punching heads 91 need to be replaced, the screw 92 is rotated to drive the limiting block 93 to move outwards, the limiting block 93 is used for limiting the second limiting groove 97 by utilizing the outer wall of the limiting block 93, so that the two clamping blocks 96 move outwards respectively, the clamping blocks 96 and the inserting blocks 94 leave the insertion holes reserved at the output end of the punching machine 3, the punching heads 91 can be taken away, the other punching head 91 is arranged at the output end of the punching machine 3, and the inserting blocks 94 and the clamping blocks 96 can be inserted into the insertion holes at the output end of the punching machine 3 by reversely rotating the screw 92, so that the punching heads 91 are braked;
in the in-service use, can carry out the punching press in succession, improve work efficiency, can concentrate the collection and stack to the punching press finished product simultaneously, guarantee not take place the friction between the finished product, also guarantee that the finished product can not fall and damage, can also quick replacement punching press head 91 to the punching press demand of the different model lead frames of adaptation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A stamping die for manufacturing a semiconductor lead frame, comprising: support (1), shell (2), punching machine (3), change roller (4) and transport mechanism (6), the top in support (1) is installed in shell (2), punching machine (3) assembly is on the top of shell (2), and the output extends into the inner chamber of shell (2), it is two to change roller (4) quantity, assembles respectively and is in both ends about support (1), the both ends of belt (5) are cup jointed respectively in two outer walls of changeing roller (4), its characterized in that still includes:
the conveying mechanism (6) is assembled at the rear side of the inner cavity of the shell (2);
a sloping plate (7) assembled at the left end of the bracket (1);
a storage mechanism (8) mounted on the left side of the bracket (1);
the dismounting mechanism (9) is assembled at the output end of the punch (3);
the transfer mechanism (6) comprises:
the first motor (61) is arranged at the rear side of the shell (2), and the output end of the first motor extends into the inner cavity of the shell (2);
the first gear (62) is locked at the output end of the first gear (62) through a coupling;
a first rotating disk (63) fixedly mounted on the front side of the first gear (62);
a shifting block (64) mounted on the outer wall of the first rotating disc (63);
a second gear (65) mounted to the inner wall of the housing (2) through a bearing;
and the second rotating disc (66) is fixedly arranged on the front side of the second gear (65), the first motor (61) drives the first gear (62) to rotate, so that the first rotating disc (63) rotates, the second rotating disc (66) reversely rotates through the transmission of the second gear (65), and the belt (5) is driven to intermittently move by utilizing the friction of the shifting block (64) and the second rotating disc (66) on the belt (5).
2. The stamping die for manufacturing semiconductor lead frames as claimed in claim 1, wherein: the vertical distance between the outer wall of the first rotating disc (63) and the outer wall of the belt (5) is the same as the thickness of the shifting block (64).
3. The stamping die for manufacturing semiconductor lead frames as claimed in claim 1, wherein: the storage mechanism (8) includes:
a storage box (81) mounted on the left side of the bracket (1);
a second motor (82) mounted on the right side of the storage box (81);
a drive assembly mounted in the inner cavity of the storage box (81);
and the lifting component is assembled in the inner cavity of the containing box (81).
4. The die set of claim 3, wherein: the drive assembly includes:
the number of the rotating shafts (83) is two, one end of each rotating shaft (83) is symmetrically arranged on the left side of the inner cavity of the containing box (81) through a bearing, the other end of one rotating shaft (83) is locked at the output end of the second motor (82) through a coupler, and the other end of the other rotating shaft (83) is arranged on the right side of the inner cavity of the containing box (81) through a bearing;
the third gears (84) are in interference fit with the outer wall of the rotating shaft (83), and the two third gears (84) are meshed with each other;
a rotating rod (85), one end of which is fixedly arranged on the outer wall of the third gear (84);
the first limiting groove (86) is formed in the outer wall of the other end of the rotating rod (85), the second motor (82) drives the rotating shaft (83) to rotate, and then the third gear (84) rotates, so that the two rotating rods (85) swing.
5. The die set of claim 3, wherein: the lifting assembly comprises:
two fixing grooves (87) which are respectively fixedly arranged at the front side and the rear side of the inner cavity of the containing box (81);
one end of the push rod (88) is slidably embedded in the inner cavity of the fixing groove (87), and the other end of the push rod extends to the top end of the containing box (81);
one end of the limiting column (89) is fixedly arranged on the outer wall of the push rod (88), and the other end of the limiting column is embedded in the inner cavity of the first limiting groove (86) in a sliding manner;
and the push plate (810) is fixedly arranged at the other end of the push rod (88), and when the two rotating rods (85) swing, the push rod (88) pushes the push plate (810) to move up and down by utilizing the matching of the first limiting groove (86) and the limiting column (89).
6. The stamping die for manufacturing semiconductor lead frames as claimed in claim 1, wherein: the dismounting mechanism (9) comprises:
a punch head (91) mounted at the output end of the punch (3);
one end of the screw rod (92) is screwed with the outer wall of the stamping head (91), and the other end of the screw rod extends into the inner cavity of the stamping head (91);
a limiting block (93) which is arranged at the other end of the screw (92) through a bearing;
the inserting block (94) is arranged at the other end of the limiting block (93) and can be inserted into a jack formed in the outer wall of the output end of the punching machine (3);
the number of the slide ways (95) is two, and the two slide ways are respectively symmetrically arranged at the bottom end of the inner cavity of the stamping head (91);
the two clamping blocks (96) are symmetrically assembled in the inner cavity of the stamping head (91) respectively, and the bottom ends of the two clamping blocks are embedded in the inner cavity of the slideway (95) in a sliding manner respectively;
the second limiting groove (97) is formed in the outer wall of the clamping block (96), the outer wall of the limiting block (93) is embedded in the inner cavity of the second limiting groove (97) in a sliding mode, the limiting block (93) is enabled to move inwards by rotating the screw (92), and the limiting block (93) is utilized to limit the second limiting groove (97) so that the two clamping blocks (96) move inwards respectively.
7. The die set of claim 6, wherein: the two ends of the outer wall of the limiting block (93) are arranged in a splayed shape.
CN202110862032.2A 2021-07-28 2021-07-28 Stamping die for manufacturing semiconductor lead frame Active CN113649449B (en)

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Application Number Priority Date Filing Date Title
CN202110862032.2A CN113649449B (en) 2021-07-28 2021-07-28 Stamping die for manufacturing semiconductor lead frame

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Application Number Priority Date Filing Date Title
CN202110862032.2A CN113649449B (en) 2021-07-28 2021-07-28 Stamping die for manufacturing semiconductor lead frame

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CN113649449A true CN113649449A (en) 2021-11-16
CN113649449B CN113649449B (en) 2023-07-25

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