CN113645800A

CN113645800A - Microgrid controller

Info

Publication number: CN113645800A
Application number: CN202110685749.4A
Authority: CN
Inventors: 王文超; 杨文辉; 朱见涛
Original assignee: Zhongteng Microgrid Shenzhen Technology Co ltd
Current assignee: Zhongteng Microgrid Shenzhen Technology Co ltd
Priority date: 2021-06-21
Filing date: 2021-06-21
Publication date: 2021-11-12

Abstract

The invention provides a micro-grid controller, and belongs to the technical field of grid equipment. The microgrid controller comprises: the cabinet body is provided with a first cavity and a second cavity, the first cavity is a sealed cavity, and the second cavity is a heat dissipation cavity; the incoming line fixing unit is arranged in the first cavity and is used for being connected with an external cable; the first circuit board assembly is arranged in the first cavity and is electrically connected with the incoming line fixing unit; a wiring board unit electrically connected to the first circuit board assembly; the inductance unit, the second cavity is located to the inductance unit, and the inductance unit passes through the wiring board unit to be connected with first circuit board assembly electricity, has solved that the internal structure overall arrangement of microgrid controller leads to among the prior art the line body is in disorder, equipment sealing performance and heat dispersion poor technical problem.

Description

Microgrid controller

Technical Field

The invention relates to the technical field of power grid equipment, in particular to a micro-grid controller.

Background

A Micro-Grid (Micro-Grid) is also translated into a Micro-Grid, which refers to a small power distribution system composed of a distributed power supply, an energy storage device, an energy conversion device, a load, a monitoring and protection device, and the like, and a device for carrying the small power distribution system is called a Micro-Grid controller.

Disclosure of Invention

The embodiment of the invention provides a microgrid controller, which solves the technical problems in the prior art.

In view of the foregoing problems, an embodiment of the present invention provides a microgrid controller, including:

the cabinet body is provided with a first cavity and a second cavity, the first cavity is a sealed cavity, and the second cavity is a heat dissipation cavity;

the inlet wire fixing unit is arranged in the first cavity and is used for being connected with an external cable;

the first circuit board assembly is arranged in the first cavity and is electrically connected with the incoming line fixing unit;

a terminal block unit electrically connected to the first circuit board assembly;

the inductance unit is arranged in the second cavity and is electrically connected with the first circuit board assembly through the wiring board unit.

In one embodiment, a first heat dissipation fan is disposed in the second cavity, and the first heat dissipation fan is used for dissipating heat of the inductance unit.

In one embodiment, the second cavity has disposed therein:

a support portion;

a heat dissipation fan fixing member, the heat dissipation fan fixing member penetrates through the cabinet body to enter the second cavity and is in sliding connection with the supporting portion, and the first heat dissipation fan is installed on the heat dissipation fan fixing member

In one embodiment, an IGBT module is disposed on the first circuit board assembly, the cabinet body is provided with a connection through hole for communicating the first cavity with the second cavity, the IGBT module is located at a position where the connection through hole is matched, a heat sink is disposed in the second cavity, the heat sink covers the second connection through hole, and the heat sink is disposed on an air inlet side or an air outlet side of the first cooling fan.

In one embodiment, the first cavity is provided with a first opening and a second opening which are arranged up and down, wherein,

a first cover body is arranged at the first opening and used for covering the first opening, a first sealing strip is arranged between the first opening and the first cover body, and the first circuit board assembly is arranged at a position matched with the first opening;

the second opening part is provided with a second cover body, the second cover body is used for covering the second opening, a second sealing strip is arranged between the second opening and the second cover body, and the inlet wire fixing unit is arranged at the position matched with the second opening.

The microgrid controller of claim 5, wherein a display panel is disposed on the first cover body, and the display panel is electrically connected to the first circuit board assembly.

In one embodiment, the incoming line fixing unit includes:

an incoming line fixing piece;

the wiring terminal is arranged on the incoming line fixing part and used for being connected with the first circuit board assembly and the external cable so that the first circuit board assembly is electrically connected with the external cable.

In one embodiment, the patch panel unit comprises:

a second circuit board assembly;

the threaded seats are fixedly connected to the second circuit board assembly, the threaded seats are electrically connected with the second circuit board assembly, and screws are connected to the threaded seats in a threaded mode;

the inductance unit is connected with the threaded seat through a wire, a conducting ring is arranged at the first end of the wire, and the conducting ring is fixed on the threaded seat through the screw.

In one embodiment, the outer surface of the inductor unit is covered with a heat-conducting glue, so as to form a glue-filled inductor, the glue-filled inductor is arranged in a glue-filled inductor shell, and the glue-filled inductor is fixed in the first cavity by the glue-filled inductor shell.

In one embodiment, a second heat dissipation fan is disposed in the first cavity, and the second heat dissipation fan is used for dissipating heat of the heating element in the first cavity.

One or more technical solutions in the embodiments of the present application have at least one or more of the following technical effects: the cabinet body is divided into a first cavity and a second cavity, wherein the first cavity is a sealed cavity, the second cavity is a heat dissipation cavity, the first circuit board assembly is arranged in the first cavity, so that an electronic element arranged on the first circuit board assembly is prevented from being damaged by water, the inductance unit is arranged in the heat dissipation cavity because the inductance unit is an electronic element with higher heat productivity, the inductance unit is independently dissipated heat, the heat dissipation effect is better, meanwhile, the incoming line fixing unit has the function of centralizing external cables when the micro-grid controller is connected with the external cables, so that the external cables are prevented from entering the micro-grid controller to be messy, the leads connected with the inductance unit and the first circuit board assembly are intensively fixed together through the wiring board unit and then are electrically connected with the first circuit board through the wiring board unit, so that the leads connected between the inductance unit and the first circuit board assembly are intensively fixed at one position, the messy wires inside the microgrid controller are avoided.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.

FIG. 1 is a schematic view of a first chamber in an embodiment of the invention;

FIG. 2 is a schematic view of a second chamber in an embodiment of the invention;

FIG. 3 is a front perspective view of an overall structure in an embodiment of the invention;

FIG. 4 is a schematic view of a fixing member of a heat dissipation fan according to an embodiment of the invention;

FIG. 5 is a schematic view of a connecting via in an embodiment of the invention;

FIG. 6 is a schematic view of an incoming line fixing unit according to an embodiment of the present invention

Figure 7 is a schematic diagram of a patch panel unit in an embodiment of the present invention.

Description of reference numerals: 100. a cabinet body; 110. a first cavity; 1110. a first opening; 1111. a first cover body; 1112. a first seal strip; 1113. a display panel; 1120. a second opening; 1121. a second cover body; 1122. a second seal strip; 120. a second cavity; 121. a support portion; 122. a heat radiation fan fixing member; 130. a connecting through hole; 200. an incoming line fixing unit; 210. an incoming line fixing piece; 220. a wiring terminal; 300. a first circuit board assembly; 310. an IGBT module; 400. a patch panel unit; 410. a second circuit board assembly; 420. a threaded seat; 421. a screw; 430. a wire; 431. conducting rings; 500. an inductance unit; 600. a first heat dissipation fan; 700. a heat sink; 800. a second heat dissipation fan; 900. a waterproof cable joint.

Detailed Description

The technical scheme provided by the invention has the following general idea:

the microgrid controller comprises: the cabinet comprises a cabinet body 100, wherein the cabinet body 100 is provided with a first cavity 110 and a second cavity 120, the first cavity 110 is a sealed cavity, and the second cavity 120 is a heat dissipation cavity; the incoming line fixing unit 200, the incoming line fixing unit 200 is arranged in the first cavity 110, and the incoming line fixing unit 200 is used for connecting with an external cable; the first circuit board assembly 300 is arranged in the first cavity 110, and the first circuit board assembly 300 is electrically connected with the incoming line fixing unit 200; a terminal block unit 400, the terminal block unit 400 being electrically connected to the first circuit board assembly 300; the inductance unit 500 is disposed in the second cavity 120, the inductance unit 500 is electrically connected to the first circuit board assembly 300 through the wiring board unit 400, the cabinet 100 is divided into the first cavity 110 and the second cavity 120, wherein the first cavity 110 is a sealed cavity, the second cavity 120 is a heat dissipation cavity, the first circuit board assembly 300 is disposed in the first cavity 110, so that the electronic components disposed on the first circuit board assembly 300 are prevented from being damaged by water, and since the inductance unit 500 is an electronic component with a higher heat generation amount, the inductance unit 500 is disposed in the heat dissipation cavity to separately dissipate heat from the inductance unit 500, the heat dissipation effect is better, and meanwhile, the incoming wire fixing unit 200 realizes the function of concentrating external cables when the external cables are connected to the microgrid controller, thereby preventing the external cables from entering the microgrid controller to be disordered, the leads 430 connected to the inductance unit 500 and the first circuit board assembly 300 are concentrated and fixed together through the wiring board unit 400, and then electrically connected to the first circuit board through the wiring board unit 400, so that the wires 430 connected between the inductance unit 500 and the first circuit board assembly 300 are collectively fixed at one position, and the wires 430 inside the microgrid controller are prevented from being messed.

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1.

Referring to fig. 1 to 7, a microgrid controller according to an embodiment of the present invention includes: the cabinet 100, the incoming line fixing unit 200, the first circuit board assembly 300, the terminal block unit 400, and the inductance unit 500.

In this embodiment, please refer to fig. 1 to 5, the cabinet 100 is provided with a first cavity 110 and a second cavity 120, the first cavity 110 is a sealed cavity, and the second cavity 120 is a heat dissipation cavity, for example, the first cavity 110 and the second cavity 120 may be two cavities disposed at the front and back of the cabinet 100, the sealed cavity, i.e., the first cavity 110, is sealed to perform the waterproof and dustproof functions, the heat dissipation cavity, i.e., the heat dissipation assembly is disposed in the second cavity 120 to achieve the heat dissipation effect, and a portion of the cabinet 100 corresponding to the second cavity 120 may be provided with a plurality of heat dissipation through holes.

In this embodiment, please refer to fig. 1, the incoming line fixing unit 200 is disposed in the first cavity 110, the incoming line fixing unit 200 is used for connecting with an external cable, specifically, the incoming line fixing unit 200 is used for uniformly fixing cables externally connected to the inside of the cabinet body 100 at a specific position, and the incoming line fixing unit 200 may be fixed on the cabinet body 100 by screws.

Further, referring to fig. 6, the incoming line fixing unit 200 includes: the connector comprises an incoming line fixing piece 210 and a wiring terminal 220, wherein the wiring terminal 220 is arranged on the incoming line fixing piece 210, and the wiring terminal 220 is used for being connected with a first circuit board assembly 300 and an external cable so as to enable the first circuit board assembly 300 to be electrically connected with the external cable, specifically, the wiring terminal 220 is an accessory product for realizing electrical connection, and the industry is divided into the category of connectors. With higher and higher industrial automation degree and stricter and more accurate industrial control requirements, the use amount of the wiring terminal gradually increases. With the development of the electronic industry, the use range of the connecting terminal is more and more, and the types of the connecting terminal are more and more. The most widely used hardware terminal, nut terminal, spring terminal and the like besides the PCB terminal, the nut terminal can be selected as the wiring terminal 220 in the embodiment, before the product leaves the factory, the first circuit board assembly 300 is connected with the wiring terminal 220 in advance, after the product is received by a user, the user only needs to connect an external cable to the wiring terminal 220, the internal cable does not need to be changed, the installation and use process of the user is simplified, and meanwhile, the messy wire body when the external cable enters the cabinet body 100 is avoided.

In this embodiment, referring to fig. 1, a first circuit board assembly 300 is disposed in the first cavity 110, the first circuit board assembly 300 is electrically connected to the incoming line fixing unit 200, and the first circuit board assembly 300 is a carrier for carrying and connecting electronic components that enable the microgrid controller to operate.

In this embodiment, referring to fig. 1, a wiring board unit 400 is electrically connected to a first circuit board assembly 300, and the wiring board unit 400 is used for uniformly concentrating wires 430 connected between an inductance unit 500 and the first circuit board assembly 300 at a specific position to prevent the wires 430 from being messy, specifically, since the inductance unit 500 is generally provided with a plurality of inductance units, the wires 430 drawn out by the inductance units 500 are more and easily messy, if the inductance units are directly connected to the first circuit board assembly 300, the wires are easily intertwined to cause messy, and the wires 430 are firstly connected to the wiring board unit 400 to be fixed, so that the wires 430 can be uniformly positioned at a position to avoid messy.

Further, referring to FIG. 7, patch panel unit 400 includes: the second circuit board assembly 410 and a plurality of threaded seats 420, the threaded seats 420 are fixedly connected to the second circuit board assembly 410, the threaded seats 420 are electrically connected with the second circuit board assembly 410, and the threaded seats 420 are in threaded connection with screws 421; wherein, the inductance unit 500 is connected with the screw seat 420 through the conducting wire 430, the first end of the conducting wire 430 is provided with the conducting ring 431, the screw 421 fixes the conducting ring 431 on the screw seat 420, wherein the screw seat 420 is electrically connected with the second circuit board assembly 410, the conducting wire 430 is installed on the screw seat 420 to realize the electrical connection of the conducting wire 430 and the second circuit board assembly 410, the first end of the conducting wire 430 is provided with the conducting ring 431, the screw 421 fixes the conducting ring 431 on the screw seat 420, it can be understood that, the conducting ring 431 should have a fixing through hole, the screw 421 passes through the fixing through hole and is in threaded connection with the screw seat 420, when the screw 421 is screwed, the screw 421 fixes the conducting ring 431 on the screw seat 420, thereby fixing the conducting wire 430 on the second circuit board assembly 410, wherein the number of the screw seat 420 can be matched with the conducting wire 430, the plurality of conducting wires 430 are uniformly fixed on the screw seat 420 of the second circuit board assembly 410 through the screw 421, when the wire bodies are messy due to the fact that the wires 430 interfere with each other, when equipment is maintained, if a certain wire 430 needs to be detached or installed, only the screw 421 corresponding to the wire 430 needs to be screwed, and maintenance is more convenient.

In this embodiment, referring to fig. 2 to 3, the inductance unit 500 is disposed in the second cavity 120, and the inductance unit 500 is electrically connected to the first circuit board assembly 300 through the wiring board unit 400, it can be understood that the inductance unit 500 is an energy storage element, an original model of the inductance unit 500 is a cylindrical coil wound by an electric wire, when a current is conducted through the coil, a magnetic flux is generated in the coil and energy is stored, and the inductance unit 500 has a large volume and a large heat generation amount, so the inductance unit 500 is disposed in the second cavity 120 isolated from the first cavity 110 to dissipate heat of the inductance unit 500, and the inductance unit 500 can be connected to the first circuit board assembly 300 through a through hole, thereby ensuring normal operation of the inductance unit 500, wherein a waterproof adhesive may be disposed at a connection position between the inductance unit 500 and the through hole, thereby ensuring sealing performance of the first cavity 110.

Further, inductance unit 500 surface covers has the heat-conducting glue to form the encapsulating inductance, in the encapsulating inductance shell was located to the encapsulating inductance, the encapsulating inductance shell was fixed in first cavity 110 with the encapsulating inductance, the heat-conducting glue had still played certain waterproof effect except playing effectual heat derivation to inductance unit 500 and played radiating effect, and the encapsulating inductance shell plays the effect of fixing inductance unit 500 in second cavity 120.

Further, referring to fig. 1, the cabinet body 100 is provided with a waterproof cable connector 900, the waterproof cable connector 900 is communicated with the first cavity 110, and when the waterproof cable connector 900 is used, an external cable is connected to the first cavity 110, and meanwhile, water is prevented from entering the connection between the external cable and the first cavity 110 when the external cable is connected to the first cavity 110, so that the sealing performance is ensured.

Further, referring to fig. 2 and 5, a first heat dissipation fan 600 is disposed in the second cavity 120, the first heat dissipation fan 600 is used for dissipating heat of the inductance unit 500, and the first heat dissipation fan 600 generates wind force in the second cavity 120 to drive hot air in the second cavity 120 to flow to the outside of the cabinet 100, thereby achieving a heat dissipation effect.

Preferably, referring to fig. 4, the second cavity 120 is provided with: a support portion 121 and a heat dissipation fan fixing member 122, wherein the heat dissipation fan fixing member 122 penetrates the cabinet 100, enters the second cavity 120, and is slidably connected to the support portion 121, the first heat dissipation fan 600 is mounted on the heat dissipation fan fixing member 122, specifically, the heat dissipation fan fixing member 122 is used for fixing and mounting the first heat dissipation fan 600, the cabinet 100 should be provided with an opening for the heat dissipation fan fixing member 122 to penetrate, the opening is arranged on a side surface of the cabinet 100, the heat dissipation fan fixing member 122 penetrates into the cabinet 100 from the opening, and is slidably connected to the support portion 121, wherein the heat dissipation fan fixing member 122 can be directly placed on the support portion 121, when the heat dissipation fan fixing member 122 is pushed, the heat dissipation fan fixing member 122 slides on the support portion 121, or the support portion 121 comprises a linear guide rail, the heat dissipation fan fixing member 122 is provided with a connecting member matched with the linear guide rail, and the heat dissipation fan fixing member 122 is connected to the support portion 121 through the linear guide rail, certainly, the cooling fan fixing member 122 and the supporting portion 121 may also be connected in other sliding manners, which is not limited herein, by installing the first cooling fan 600 on the cooling fan fixing member 122, and then passing the cooling fan fixing member 122 through the cabinet body 100 and slidably connecting with the supporting portion 121, when the first cooling fan 600 is disassembled and installed, only the cooling fan fixing member 122 needs to slide in and out along the supporting portion 121, and then the first cooling fan 600 is repaired and disassembled on the cooling fan fixing member 122, so that the first cooling fan 600 is simply and efficiently disassembled.

Preferably, referring to fig. 5, the IGBT module 310 is disposed on the first circuit board assembly 300, the cabinet 100 is disposed with a connection through hole 130 for communicating the first cavity 110 with the second cavity 120, the IGBT module 310 is disposed at a position where the connection through hole 130 is matched, the second cavity 120 is disposed with a heat sink 700, the heat sink 700 covers the second connection through hole 130, the heat sink 700 is disposed at one side of the first heat dissipation fan 600 where air is introduced or exhausted, it can be understood that the IGBT module 310 is a modular semiconductor product formed by bridging and packaging an IGBT (insulated gate bipolar transistor) and an FWD (freewheeling diode) through a specific circuit, the packaged IGBT module is directly applied to a frequency converter, an UPS uninterruptible power supply, and the like, the IGBT module 310 generally generates a large amount of heat, the heat sink 700 directly dissipates the heat of the IGBT module 310 through the connection through hole 130, thereby effectively ensuring the heat dissipation effect of the IGBT module 310, and the heat sink 700 covers the connection through hole 130, and water can be prevented from entering the first cavity 110 from the connecting through hole 130, preferably, waterproof glue can be arranged at the connecting part of the radiator 700 and the connecting through hole 130, the radiator 700 can be an air-cooled radiator, and the first cooling fan 600 takes away heat of the radiator 700 to realize a cooling effect.

In an embodiment, referring to fig. 1 and fig. 3, the first cavity 110 has a first opening 1110 and a second opening 1120 disposed up and down, wherein a first cover 1111 is disposed at the first opening 1110, the first cover 1111 is used for covering the first opening 1110, a first sealing tape 1112 is disposed between the first opening 1110 and the first cover 1111, and the first circuit board assembly 300 is disposed at a position matching the first opening 1110; a second cover 1121 is disposed at the second opening 1120, the second cover 1121 is used for covering the second opening 1120, a second sealing strip 1122 is disposed between the second opening 1120 and the second cover 1121, the incoming line fixing unit 200 is disposed at a position matching the second opening 1120, wherein the first opening 1110 corresponds to a position within the first cavity 110 for placing the first circuit board assembly 300, while the location of the second opening 1120 with respect to the first cavity 110 may be used for placing the inlet wire fixing unit 200, when a user connects wires from the outside to the first cavity 110, the user only needs to open the second cover 1121 to install the first cover from the second opening 1120, and the first cover 1111 of the first opening 1110 does not need to be opened, so that the user is effectively prevented from mistakenly touching the first circuit board assembly 300 in the first opening 1110 when connecting wires from the outside, meanwhile, foreign matters or water entering from the first opening 1110 to damage the first circuit board assembly 300 during external wiring is avoided, so that the stability of the equipment is better.

Preferably, referring to fig. 3, the display panel 1113 is disposed on the first cover 1111, the display panel 1113 is electrically connected to the first circuit board assembly 300, and the display panel 1113 is used for displaying the status of the device, and since the first cover 1111 does not need to be opened during use or installation of external cables, the display panel 1113 is disposed on the first cover 1111 more stably and is not damaged due to frequent detachment.

In an embodiment, referring to fig. 1, a second heat dissipation fan 800 is disposed in the first cavity 110, the second heat dissipation fan 800 is used for dissipating heat from a heat generating component inside the first cavity 110, and the second heat dissipation fan 800 is used for making air in the first cavity 110 flow, because the first circuit board assembly 300 and the electronic component inside the first cavity 110 also generate a certain amount of heat during operation, the second heat dissipation fan 800 makes air in the first cavity 110 flow, thereby achieving a certain heat dissipation effect.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention without departing from the spirit or scope of the embodiments of the invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to encompass such modifications and variations.

Claims

1. A microgrid controller, comprising:

2. The microgrid controller of claim 1, wherein a first heat dissipation fan is disposed in the second cavity, the first heat dissipation fan being configured to dissipate heat from the inductance unit.

3. The microgrid controller of claim 2, wherein the second cavity has disposed therein:

a support portion;

the heat dissipation fan fixing piece penetrates through the cabinet body to enter the second cavity and is in sliding connection with the supporting portion, and the first heat dissipation fan is installed on the heat dissipation fan fixing piece.

4. The microgrid controller according to claim 2, characterized in that an IGBT module is disposed on the first circuit board assembly, the cabinet body is provided with a connecting through hole for communicating the first cavity with the second cavity, the IGBT module is located at a position where the connecting through hole is matched, a heat sink is disposed in the second cavity, the heat sink covers the second connecting through hole, and the heat sink is disposed on an air inlet side or an air outlet side of the first heat dissipation fan.

5. The microgrid controller of claim 1, wherein the first cavity is provided with a first opening and a second opening disposed one above the other, wherein,

6. The microgrid controller of claim 5, wherein a display panel is disposed on the first cover body, and the display panel is electrically connected to the first circuit board assembly.

7. The microgrid controller of claim 1, wherein the incoming line fixing unit comprises:

an incoming line fixing piece;

8. The microgrid controller of claim 1, wherein the patch panel unit comprises:

a second circuit board assembly;

9. The microgrid controller of claim 1, wherein an outer surface of the inductance unit is covered with a thermally conductive glue to form a glue-filled inductance, the glue-filled inductance being disposed within a glue-filled inductance housing, the glue-filled inductance housing securing the glue-filled inductance within the first cavity.

10. The microgrid controller of claim 1, wherein a second heat dissipation fan is disposed in the first cavity, and the second heat dissipation fan is used for dissipating heat from a heat generating element inside the first cavity.