CN113644103A - 显示设备 - Google Patents
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- Publication number
- CN113644103A CN113644103A CN202110918618.6A CN202110918618A CN113644103A CN 113644103 A CN113644103 A CN 113644103A CN 202110918618 A CN202110918618 A CN 202110918618A CN 113644103 A CN113644103 A CN 113644103A
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- CN
- China
- Prior art keywords
- display device
- layer
- sensor
- disposed
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
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- CDZGJSREWGPJMG-UHFFFAOYSA-N copper gallium Chemical compound [Cu].[Ga] CDZGJSREWGPJMG-UHFFFAOYSA-N 0.000 description 1
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- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
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- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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Abstract
本公开关于一种显示设备。该显示设备具有一显示区,其中显示设备包括:一基板;一驱动层,设至于该基板上;一显示介质层,设至于该驱动层上;以及一传感器,设至于该基板下,其中于该显示设备的一法线方向上,该传感器与该显示区重叠。
Description
本公开为分案申请,母案申请号为201910037642.1,申请日为2019年1月11日,发明名称为:显示设备。
技术领域
本公开关于一种显示设备;尤指一种具有传感器的显示设备。
背景技术
随着电子装置的技术进步,电子装置朝向更多功能、更轻薄的方向发展。例如,目前显示设备市场主流为薄型显示设备。
时下的显示设备不仅需要有显示功能,还必须具有例如触控或辨识等其他功能。此外,为制造具有高屏占比的显示设备,则必须将外部传感器嵌在显示设备的显示区中。因此,在不减少传感器的精准度或分辨率、以及不影响显示设备的功能的前提下,如何整合显示设备以及传感器将会是待解的问题。
发明内容
本公开提供一种显示设备,具有一显示区,其中显示设备包括:一基板;一驱动层,设至于该基板上;一显示介质层,设至于该驱动层上;以及一传感器,设至于该基板下,其中于该显示设备的一法线方向上,该传感器与该显示区重叠。
其他新颖技术特征将参照附图,于下文详述之,以明确表示本公开。
附图说明
图1为本公开的实施例1的显示设备的俯视图。
图2为本公开的实施例1的显示设备的剖面图。
图3为本公开的实施例2的显示设备的剖面图。
图4为本公开的实施例3的显示设备的剖面图。
图5为本公开的实施例4的显示设备的剖面图。
图6为本公开的实施例5的显示设备的剖面图。
图7为本公开的实施例6的显示设备的剖面图。
图8为本公开的实施例7的显示设备的剖面图。
图9为本公开的实施例8的显示设备的剖面图。
图10为本公开的实施例9的显示设备的剖面图。
图11为本公开的实施例10的显示设备的剖面图。
图12为本公开的实施例11的显示设备的剖面图。
图13为传感器和支撑件不重叠的显示设备的剖面图。
图14为传感器和支撑件重叠的显示设备的剖面图。
【符号说明】
驱动层11
基板111
第一半导体层113
栅极绝缘层114
第一栅极层115
第一源-漏极层116
绝缘层117
钝化层118
第一钝化层1181
第二钝化层1182
第三钝化层1183
钝化层119
显示介质层12
第一电极121
发光层122
第二电极123
画素定义层13
支撑件14
主体部14a
底部14b
第一配向层151
第二配向膜152
封装层17
传感器2
第二半导体层211
第二栅极层212
第二源-漏极层213
第二遮光层214
触控感测层3
第一触控电极31
第二触控电极32
第一绝缘层33
第二绝缘层34
对向基板411
表面411a
第一遮光层412
开口4121
滤光层413
覆盖层414
功能层5
保护基板6
显示区AA
非显示区NON-AA
发光区E
感测区S
具体实施方式
以下参照附图说明本公开的实施方式,以明确阐释前述和其他技术内容、特征、和功效。通过特定实施例的说明,本领域的技术人员可进一步明了本公开采取的技术手段和功效,以达成前述揭露目的。另,本说明书所揭露的技术可为本领域的技术人员理解并且实施,在不悖离本公开概念的前提下,任何实质相同的变更或改良均可被权利要求所涵盖。
此外,本说明书和权利要求所提及的序数,例如「第一」、「第二」等,仅用于说明主张的组件;而非意指、或表示主张的组件具有任何执行次序,亦非于一主张的组件和另一主张的组件之间的次序、或制程方法的步骤次序。该些序数的使用仅用来使具有某命名的一请求组件得以和另一具有相同命名的请求组件能作出清楚区分。
此外,本说明书和权利要求所提及的位置,例如「之上」、「上」、或「上方」,可指直接接触另一组件,或可指非直接接触另一组件。再者,本说明书和权利要求所提及的位置,例如「之下」、「下」、或「下方」,可指直接接触另一组件,或可指非直接接触另一组件。
此外,本公开的不同实施例的技术特征可彼此组合,以形成另一实施例。
实施例1
图1是本实施例的显示设备的俯视图,揭示显示设备的部分显示区。本实施例的显示设备具有一非显示区NON-AA和一显示区AA,显示区AA包括:一支撑件14,设置于显示区AA;以及多个传感器2,设置于显示区AA。于此,多个传感器2设置于显示区AA的一部分(接近图1底部)上。但,该些传感器的设置位置并不限于图1所示。本公开的另一实施例中,该些传感器2可设置于显示设备的显示区AA的一部分或显示区AA的全部。本公开进一步的实施例中,该些传感器2可随机地或平均地设置于显示设备的显示区AA。
如图1所示,该些传感器2在显示设备的法线方向上和支撑件14不重叠。于此,显示设备的法线方向垂直于一基板111的表面的方向。
图2是本实施例的显示设备的剖面图,沿图1中L1-L1’线的剖面。为简化附图,图2并无揭示触控电极31,32。
如图2所示,本实施例的显示设备为一有机发光二极管(OLED)显示设备。本实施例的显示设备包括:一基板111;一驱动层11,设置于基板111上;一显示介质层12,设置于驱动层11上;以及一支撑件14,设置于显示介质层12上。
详细而言,本实施例的显示设备包括:一基板111;一缓冲层112,设置于基板111上;一第一半导体层113,设置于缓冲层112上;一栅极绝缘层114,设置于第一半导体层113上;一第一栅极层115,设置于栅极绝缘层114上并且对应于第一半导体层113;一绝缘层117,设置于第一栅极层115上;一第一源-漏极层116,设置于绝缘层117上并且电性连接第一半导体层113;以及一钝化层118,设置于第一源-漏极层116上。第一半导体层113、第一栅极层115、和第一源-漏极层116形成一晶体管TFT。本实施例中,驱动层11包括:第一半导体层113、栅极绝缘层114、第一栅极层115、第一源-漏极层116、绝缘层117、和钝化层118。但,本公开的晶体管TFT和驱动层11的结构不限于图2所示,可依据实际需求而更改。例如,本实施例中,晶体管TFT是一顶栅极晶体管;但于本公开的另一实施例中,晶体管TFT可为底栅极晶体管或双栅极(double gate or dual gate)晶体管。
本实施例中,一传感器2于形成驱动层11时同时形成。本公开的传感器2具有一晶体管结构,包括:一第二半导体层211;一第二栅极层212,对应于第二半导体层211;以及一第二源-漏极层213,电性连接第二半导体层211。因此本实施例中,传感器2设置于基板111上并且与晶体管TFT相邻。本实施例中,传感器2是一顶栅极晶体管。本公开的另一实施例中,传感器2可为一底栅极晶体管或双栅极晶体管。于本公开进一步实施例中,及传感器2并非晶体管,而可具有其他结构(例如,光二极管(photodiode)),只要可达成信号感测的目的即可。传感器2的例示可为生物辨识传感器例如指纹传感器、虹膜传感器、视网膜传感器、脸部辨识器、血管传感器、声传感器、动作传感器、手势传感器、或DNA传感器;但本公开不限于此。
于此,基板111可为石英基板、玻璃基板、塑料基板、或其他可挠性基板或膜。若基板111是塑料基板或其他可挠性基板或膜,则可获得可挠性显示设备。此外,缓冲层112和栅极绝缘层114的材料可为氧化硅、氮氧化硅、氮化硅、或其组合。进一步地,第一栅极层115、第一源-漏极层116、第二栅极层212、和第二源-漏极层213的材料可为金属(例如,铜(Cu)、铝(Al)、钛(Ti)、铬(Cr)、钼(Mo)、或其合金,或前述材料的组合)或其他电极材料。再者,第一半导体层113和第二半导体层211的材料分别可为非晶硅、多晶硅例如低温多晶硅(LTPS)、或氧化物半导体例如氧化铟镓锌(IGZO)。但本公开不限于此。
如图2所示,一钝化层118设置于第一源-漏极层116上。钝化层118的材料可为,例如,氧化硅、氮氧化硅、氮化硅、氧化铝、树脂、聚合物、光阻材料、或其组合;但本公开不限于此。
再者,一显示介质层12形成于钝化层118上。本实施例中,显示介质层12可为自发光层,例如有机发光二极管。有机发光二极管包括:一第一电极121、一发光层122及一第二电极123。其中,第一电极121电性连接晶体管TFT。一画素定义层13设置于第一电极121上并且具有一开口,以显露第一电极121。发光层122设置于开口并且电性连接第一电极121。第二电极123设置于画素定义层13上并且通过开口电性连接发光层122。画素定义层13的开口定义OLED的一发光区E。一支撑件14设置于画素定义层13上。支撑件14在基板111的法线方向与发光区E不重叠。于此,第一电极121是一反射电极,以及反射电极的材料可为银(Ag)、铝(Al)、或其他具有高反光特性的材料。第二电极123是一透明电极,透明电极的材料可为透明导电氧化物,例如氧化铟锡(ITO)、氧化铟锌(IZO)、氧化铟锌锡(ITZO)、氧化铜镓锌(IGZO)、或氧化铝锌(AZO)。但本公开不限于此。
此外,一支撑件14设置于画素定义层13上。支撑件14的材料可为树脂、聚合物、光阻材料、或其组合;但本公开不限于此。
如图1和图2所示,本实施例的显示设备中,传感器2于法线方向上与支撑件14不重叠,该法线方向垂直于基板111表面的方向。特别是,传感器2包括一感测区S,支撑件14于法线方向上与感测区S不重叠。
若支撑件14与传感器2重叠,支撑件14可能影响或改变来自显示设备的上侧至传感器2的入射光路径,并且降低传感器2的分辨率。因此,本实施例中,传感器2与支撑件14不重叠,以解决前述问题。
如图1所示,本实施例中,显示区AA包括多个发光区E,传感器于法线方向上与发光区E不重叠。特别是,如图2所示,本实施例的OLED显示设备中,显示介质层12包括OLED,其中OLED中的第一电极121是一反射电极,以及传感器2(特定而言,感测区S)于法线方向上与第一电极121不重叠。因为第一电极121为反射电极,若传感器2于法线方向上与第一电极121重叠,则会因第一电极121的阻挡使得被传感器2侦测的信号减少。
实施例2
图3是实施例2的显示设备的剖面图。本实施例的显示设备与实施例1的显示设备相似,其差异在于,本实施例的显示设备是一液晶(LCD)显示设备。
如图3所示,本实施例的驱动层11和传感器2与实施例1所示相似,故于此不再重述。
如图3所示,驱动层11设置于基板111上,以及一第一钝化层1181设置于第一源-漏极层116上。本实施例的显示设备另包括:一第一电极121,设置于第一钝化层1181上;一第二钝化层1182,设置于第一电极121上;一第二电极123,设置于第二钝化层1182上;以及一第三钝化层1183,设置于第二电极123上。本实施例中,第二电极123电性连接晶体管TFT。本实施例中,第一电极121和第二电极123形成电场,驱动广视角(FFS)液晶显示设备的显示功能。于本公开另一实施例,第一电极121而非第二电极123电性连接该晶体管TFT。此外,本实施例中,LCD装置为水平配向(homogenous aligned)。于本公开另一实施例,显示设备可为垂直配向(vertical aligned)的LCD装置,其中第二电极123设置于一对向基板411上。
于此,第一钝化层1181、第二钝化层1182、和第三钝化层1183的材料各自可为,例如,氧化硅、氮氧化硅、氮化硅、氧化铝、树脂、聚合物、光阻材料、或其组合。此外,第一电极121及/或第二电极123是透明电极,透明电极的材料可为透明导电氧化物,例如ITO、IZO、ITZO、IGZO、或AZO。但本公开不限于此。
如图3所示,本实施例的显示设备包括:一对向基板411,具有面对基板111的一表面411a;一第一遮光层412,设置于对向基板411的表面411a上,其中第一遮光层412具有多个开口;一彩色滤光层413,设置于第一遮光层412的开口;以及一覆盖层414,设置于彩色滤光层413上。第一遮光层412的每一开口各自定义一发光区E。第一遮光层412可为黑色矩阵,以及覆盖层414的材料可为树脂、聚合物、光阻材料、或其组合。
此外,一第一配向层151设置于基板111的第三钝化层1183上,一第二配向层152设置于对向基板411的覆盖层414上,两者对组后,支撑件14和显示介质层12设置于第一配向层151和第二配向膜152之间。于此,显示介质层12是液晶层。
与实施例1相似,本实施例的显示设备的传感器2在基板111的法线方向上与发光区E不重叠。支撑件14在基板111的法线方向上与发光区E不重叠。因此,显示设备的开口率不被传感器2所影响。此外,由于传感器2设置于第一遮光层412下,故传感器2可接收近红外光、红外光信号、或其他信号,而可见光则可被第一遮光层412遮蔽。
实施例3
图4是本实施例的显示设备的剖面图。本实施例的显示设备与实施例2的显示设备相似,其差异在于传感器的位置。
本实施例中,显示设备的传感器2在基板111的法线方向上与发光区E重叠。因此,传感器2可接收可见光、近红外光、红外光信号、或其他信号。于一实施例,传感器2可对应红色或绿色树脂的彩色滤光层413设置,彩色滤光层413可减少部分波段的入射光被传感器2接收而造成干扰;但本公开不限于此。
实施例4
图5是本实施例的显示设备的剖面图。本实施例的显示设备与实施例2的显示设备相似,其差异说明如下。
本实施例中,第一遮光层412具有一开口4121。传感器2与开口4121于法线方向上重叠,但支撑件14与开口4121于法线方向上不重叠。此外,传感器2包括一感测区S,开口4121与感测区S于法线方向上重叠,以及支撑件14与感测区S于法线方向上不重叠。若第一遮光层412具有开口4121,则可见光可照射至传感器2。传感器2可接收可见光、近红外光、红外光信号、或其他信号。
此外,实施例2中,传感器2的结构是一具有顶栅极结构的晶体管。本实施例中,传感器2的结构是一具有底栅极结构的晶体管。
再者,本实施例的显示设备另包括:一第二遮光层214,设置于传感器2和基板111之间,其中第二遮光层214与开口4121于法线方向上重叠,以遮蔽背光发出的光线穿过开口4121而产生一光点。或者第二遮光层214与感测区S于法线方向上重叠,可减少背光发出的光线照射到感测区S而产生噪声。
实施例5
图6是本实施例的显示设备的剖面图。本实施例的显示设备与实施例2的显示设备相似,其差异说明如下。
如图6所示,本实施例的驱动层11和传感器2与实施例2所示相似,故不再重述。
如图6所示,一第一钝化层1181设置于第一源-漏极层116上。一彩色滤光层413设置于第一钝化层1181上。一钝化层119设置于彩色滤光层413上。一第一电极121设置于钝化层119上。一第二钝化层1182设置于第一电极121上。一第二电极123设置于第二钝化层1182上并且电性连接晶体管TFT。于此,钝化层119的材料可为,例如,树脂、聚合物、光阻材料、或其组合;但本公开不限于此。
因此,本实施例中,彩色滤光层413并非设置于对向基板411上,而是设置于形成有晶体管TFT的基板111上。故,本实施例的显示设备是一数组上彩色滤光层(COA)液晶显示设备。
实施例6
图7是本实施例的显示设备的剖面图。本实施例的显示设备与实施例5的显示设备相似,其差异说明如下。
本实施例中,一第一遮光层412设置于第一钝化层1181和钝化层119之间。因此,第一遮光层412并非设置于对向基板411上,而是设置于形成有晶体管TFT的基板111上。故,本实施例的显示设备一数组上黑色矩阵层(BOA)液晶显示设备。
前述实施例仅揭露支撑件和传感器之间的相对位置。以下实施例中,则揭露传感器和触控电极之间的相对位置。
实施例7
图8是本实施例的显示设备的剖面图,其中揭露沿图1中L2-L2’线的剖面。实施例1揭示的OLED显示设备于本实施例中说明。
本实施例中,一封装层17设置于显示介质层12和画素定义层13上。封装层17之材料可为树脂、聚合物、光阻材料、或其组合;但本公开不限于此。
如图8所示,本实施例的显示设备另包括:一第一触控电极31,设置于封装层17上;一第一绝缘层33,设置于第一触控电极31上;一第二触控电极32,设置于第一绝缘层33上;以及一第二绝缘层34,设置于第二触控电极32上。于此,第一绝缘层33和第二绝缘层34的材料可为,例如,氧化硅、氮氧化硅、氮化硅、氧化铝、树脂、聚合物、光阻材料、或其组合;但本公开不限于此。第一触控电极31和第二触控电极32的材料可为金属(特别是,不透明导电金属),例如铜(Cu)或银(Ag);但本公开不限于此。于此,第一触控电极31可为驱动电极(Tx),并且第二触控电极32可为感测电极(Rx);反之亦然。
如图1和图8所示,第一触控电极31和第二触控电极32设置于显示设备的显示区AA。若第一触控电极31和第二触控电极32的材料为金属,自显示设备上侧的入射光可被第一触控电极31和第二触控电极32遮蔽。传感器2的设置须尽量避免与第一触控电极31和第二触控电极32于基板111的法线方向上重叠,以改善感测的分辨率。
此外,如图2和图8所示,驱动层11包括:一晶体管TFT,以及传感器2设置于基板111上并且与晶体管TFT相邻。
实施例8
图9是本实施例的显示设备的剖面图。本实施例的显示设备与实施例7的显示设备相似,其差异在于传感器的位置。
本实施例中,显示设备另包括:一触控感测层3,设置于显示介质层12上,其中触控感测层3包括第一触控电极31和第二触控电极32,以及传感器2设置于显示介质层12上并且与第一触控电极31相邻。于本公开的另一实施例,传感器可与第二触控电极32相邻。
实施例9
图10是本实施例的显示设备的剖面图。本实施例的显示设备与实施例7的显示设备相似,其差异在于传感器的位置。
本实施例中,显示设备另包括:一触控感测层3,设置于显示介质层12上;以及一保护基板6,设置于触控感测层3上;其中传感器2设置于触控感测层3和保护基板6之间。于此,保护基板6可为上盖玻璃、偏光板或其他膜层,但本公开不限于此。
特别是,本实施例中,显示设备另包括:一功能层5,设置于触控感测层3和保护基板6之间,其中传感器2设置于功能层5中。功能层5的例示可包括:光学透明黏着剂、胶带或其他黏着材料、偏光板、抗眩光膜或其他膜层等;但本公开不限于此。
实施例10
图11是本实施例的显示设备的剖面图。本实施例的显示设备与实施例7的显示设备相似,其差异在于传感器的位置。
本实施例中,传感器2设置于基板111下。换言之,传感器2设置于基板111的一表面上,此表面是相对于基板111与显示介质层12相邻的另一面,也就是基板111较远离显示介质层12的表面。
如图8至11所示,实施例7至10中,传感器2与第一触控电极31、第二触控电极32、和发光区E不重叠。
实施例11
图12是本实施例的显示设备的剖面图。本实施例的显示设备与实施例7的显示设备相似,其差异在于触控电极的类型。
本实施例中,显示设备另包括:一第一触控电极31和一第二触控电极32,设置于显示设备的显示区AA,其中第一触控电极31和第二触控电极32可为透明导电氧化物,例如ITO、IZO、ITZO、IGZO、或AZO。但本公开不限于此。于此,第一触控电极31可为驱动电极(Tx),并且第二触控电极32可为感测电极(Rx);反之亦然。
由于第一触控电极31和第二触控电极32为透明导电氧化物并具有高透明度,传感器2可于显示设备的法线方向与第一触控电极31及/或第二触控电极32重叠。
前述实施例中,支撑件14具有一规则外形。但本公开不限于此。本公开的其他实施例中,支撑件14可具有锥状外形,其不同部份具有不同厚度。
于下文,图13和图14是用于说明如何定义具有锥状外形的支撑件与传感器重叠或不重叠。
图13是显示设备的剖面图,揭示传感器与支撑件不重叠的情况;图14是显示设备的剖面图,揭示传感器与支撑件重叠的情况。图13和图14的显示设备的结构与图3所示相似,不再重述。
当支撑件具有锥状外形,支撑件14可定义为具有一主体部14a和一底部14b,其中底部14b具有一高度H1,高度H1为底部14b的最大高度,高度H1为支撑件14的整体厚度H的15%(H1=15% x H),支撑件14小于或等于高度H1的部分为底部14b,而支撑件14其他部份则为主体部14a。
本公开的支撑件14可为透明。支撑件14的底部14b仍可具有良好透明度。但支撑件14的主体部14a,由于相对于底部14b具有较大厚度,因而逐渐变为半透明。若支撑件14的底部14b与传感器2(特别是感测区S)重叠,如图13所示,则底部14b对于自显示设备上侧的入射光的影响可能不显著,因此较不会影响感测分辨率。但若传感器2与支撑件14的主体部14a重叠,如图14所示,入射光可能大多被影响或改变路径,故可能会影响传感器2的分辨率,造成模糊影像。因此,本公开中,传感器2必须与支撑件14的主体部14a不重叠。
前述实施例仅揭露OLED显示设备和LCD显示设备,但本公开不限于此。于本公开的其他实施例中,显示介质可包括:量子点(QD)、量子点发光二极管(QDLED或QLED)、荧光分子、磷光分子、无机发光二极管(LED)、次毫米微发光二极管(mini LED)、微发光二极管(micro LED)、或其他显示介质;但本公开不限于此。
再者,前述实施例仅揭露内嵌式(On-cell)触控显示设备,但本公开不限于此。于本公开其他实施例中,依据触控电极位置的不同,显示设备可为内嵌式(in-cell)触控显示设备、外挂式(out-cell)触控显示设备或混合式(hybrid)触控显示设备。
前述本公开的任何实施例可形成的显示设备或触控显示设备可用于任何已知需要显示屏幕的电子装置,例如显示器、移动电话、笔记本电脑、摄影机、照相机、播音器、行动导航、电视等任何显示图像的电子装置。
虽于本说明书中,本公开以前述实施例揭露,但在不悖离本公开概念和权利要求范围的前提下,均可进行任何变更或改良。
Claims (9)
1.一种显示设备,具有一显示区,其中该显示设备包括:
一基板;
一驱动层,设至于该基板上;
一显示介质层,设至于该驱动层上;以及
一传感器,设至于该基板下,其中于该显示设备的一法线方向上,该传感器与该显示区重叠。
2.如权利要求1所述的显示设备,其特征在于,该显示区包括一发光区,其中该传感器于该显示设备的该法线方向上与该发光区重叠。
3.如权利要求1所述的显示设备,其特征在于,该显示区包括一发光区,其中该传感器于该显示设备的该法线方向上与该发光区不重叠。
4.如权利要求1所述的显示设备,其特征在于,还包括:一触控电极,设置于该显示介质层上;其中,该传感器于该显示设备的该法线方向上与该触控电极重叠。
5.如权利要求1所述的显示设备,其特征在于,还包括:一触控电极,设置于该显示介质层上;其中,该传感器于该显示设备的该法线方向上与该触控电极不重叠。
6.如权利要求1所述的显示设备,其特征在于,还包括:一对向基板;一第一遮光层,设置于该对向基板上;其中,该第一遮光层具有一开口,该传感器于该显示设备的该法线方向上与该开口重叠。
7.如权利要求1所述的显示设备,其特征在于,还包括:一第一遮光层,设置于该基板上;其中,该第一遮光层具有一开口,该传感器于该显示设备的该法线方向上与该开口重叠。
8.如权利要求1所述的显示设备,其特征在于,还包括:一支撑件,且该显示区包括一发光区,其中该支撑件于该显示设备的该法线方向上与该发光区不重叠。
9.如权利要求1所述的显示设备,其特征在于,该显示介质层包含一自发光层。
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US20240365638A1 (en) | 2024-10-31 |
PH12019000037A1 (en) | 2019-09-02 |
US20190245011A1 (en) | 2019-08-08 |
CN110120401B (zh) | 2021-08-31 |
US20210217819A1 (en) | 2021-07-15 |
CN110120401A (zh) | 2019-08-13 |
US12063838B2 (en) | 2024-08-13 |
US20230109621A1 (en) | 2023-04-06 |
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