CN113640555A - Array type film probe card and test module thereof - Google Patents
Array type film probe card and test module thereof Download PDFInfo
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- CN113640555A CN113640555A CN202010391464.5A CN202010391464A CN113640555A CN 113640555 A CN113640555 A CN 113640555A CN 202010391464 A CN202010391464 A CN 202010391464A CN 113640555 A CN113640555 A CN 113640555A
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- 239000000523 sample Substances 0.000 title claims abstract description 69
- 238000012360 testing method Methods 0.000 title claims abstract description 25
- 239000010409 thin film Substances 0.000 claims abstract description 46
- 239000010408 film Substances 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 6
- 238000001514 detection method Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses an array type film probe card and a test module thereof, wherein the test module comprises a bearing unit, a plurality of vertical probes positioned on the bearing unit, an elastic pad arranged on the bearing unit and a film sheet. The thin film sheet comprises a carrier, a plurality of signal lines and a plurality of conductive bumps, wherein the carrier is partially arranged on the elastic pad, the signal lines are arranged on the carrier, and the conductive bumps are respectively formed on the signal lines. The plurality of conductive bumps are arranged in an annular shape, one end of each of the plurality of vertical probes is positioned on the inner side of the plurality of conductive bumps, and the one end of each of the plurality of vertical probes and the tail end of each of the plurality of conductive bumps are arranged in a coplanar manner. Accordingly, an array type detection point is formed by the arrangement of the plurality of conductive bumps and the plurality of vertical probes, so that the application and test range of the array type film probe card are effectively expanded.
Description
Technical Field
The present invention relates to a probe card, and more particularly, to an array type thin film probe card and a test module thereof.
Background
When the conventional film probe card is tested by pressing a plurality of annularly arranged conductive bumps against a Device Under Test (DUT), the conventional film probe card is only suitable for peripheral test and cannot be applied to array test.
The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.
Disclosure of Invention
Embodiments of the present invention provide an array type thin film probe card and a test module thereof, which can effectively overcome the defects possibly generated by the conventional thin film probe card.
The embodiment of the invention discloses an array type film probe card, which comprises: an adapter plate; the bearing unit is arranged on the adapter plate; a plurality of vertical probes positioned on the bearing unit; the elastic pad is arranged on the bearing unit so that the bearing unit is clamped between the elastic pad and the adapter plate; and a thin film sheet defining an outer block, an inner block having a step difference with the outer block in a height direction, and an extension block connecting the outer block and the inner block; wherein, the film sheet contains: the carrier is at least partially arranged on the elastic pad at the part of the inner block, and at least partially arranged on the adapter plate at the part of the carrier at the outer block; the signal lines are arranged on the carrier, and at least part of the signal lines in the signal lines are electrically coupled with the adapter plate; the conductive bumps are positioned in the inner block and respectively formed on the signal lines, and the conductive bumps are arranged in a ring shape; one end of each vertical probe is positioned at the inner side of each conductive bump, one end of each vertical probe and the tail end of each conductive bump are arranged in a coplanar manner, and the other end of each vertical probe is connected and electrically coupled with the adapter plate.
Preferably, a plurality of grooves are formed at the carrier of the inner block, so that the carrier forms a plurality of actuating sections in the inner block, and the signal lines of the inner block are respectively located on the actuating sections; the film sheet comprises a plurality of independent cylinders arranged between the plurality of actuating sections and the elastic pad, and the independent cylinders respectively correspond to the plurality of conductive bumps along the height direction so as to enable the part of the carrier positioned in the inner block to be in a stepped structure.
Preferably, when any one of the conductive bumps and the corresponding independent cylinder are orthographically projected to a plane along the height direction, a projection area formed by the conductive bump is located within an outer contour of the projection area formed by the independent cylinder.
Preferably, a central axis of any one of the conductive bumps overlaps a central axis of the corresponding independent barrel and is parallel to the height direction.
Preferably, any one of the independent cylinders has a supporting height in the height direction, and any one of the conductive bumps has a protruding height in the height direction, and the supporting height is not less than the protruding height and not more than five times the protruding height.
Preferably, the signal lines, the conductive bumps, and the independent cylinders are made of the same material, and a circumferential side edge of each of the independent cylinders is exposed in the air.
Preferably, each conductive bump comprises a claw-shaped metal structure electrically coupled to the corresponding signal line and an elastic body located inside the claw-shaped metal structure; in each conductive bump, the claw-shaped metal structure can be elastically deformed by pressing the elastic body.
Preferably, the array type membrane probe card further comprises at least one coaxial connector mounted on the adapter plate, the plurality of signal lines of the membrane sheet comprise at least one high-frequency signal line, and a portion of the at least one high-frequency signal line located in the outer block is connected to the at least one coaxial connector.
The embodiment of the invention also discloses a test module of the array type film probe card, which comprises: a bearing unit; a plurality of vertical probes positioned on the bearing unit; the elastic cushion is arranged on the bearing unit; and a thin film sheet defining an outer block, an inner block having a step difference with the outer block in a height direction, and an extension block connecting the outer block and the inner block; wherein, the film sheet contains: the carrier is arranged on the elastic pad at the part of the inner block; a plurality of signal lines disposed on the carrier; and
the conductive bumps are positioned in the inner block and respectively formed on the signal lines, and the conductive bumps are arranged in a ring shape; one end of each vertical probe is positioned at the inner side of each conductive bump, and the one end of each vertical probe and the tail end of each conductive bump are arranged in a coplanar manner.
Preferably, a plurality of grooves are formed at the carrier of the inner block, so that the carrier forms a plurality of actuating sections in the inner block, and the signal lines of the inner block are respectively located on the actuating sections; the film sheet comprises a plurality of independent cylinders arranged between the plurality of actuating sections and the elastic pad, and the plurality of independent cylinders respectively correspond to the plurality of conductive bumps along the height direction so as to enable the part of the carrier positioned in the inner block to be in a stepped structure; wherein a central axis of any conductive bump is overlapped with a central axis of the corresponding independent cylinder and is parallel to the height direction; when any conductive bump and the independent cylinder corresponding to the conductive bump are orthographically projected to a plane along the height direction, a projection area formed by the conductive bump is positioned in the outer contour of the projection area formed by the independent cylinder.
In summary, the array type thin film probe card and the test module thereof disclosed in the embodiments of the present invention form an array type of test points by the arrangement of the plurality of conductive bumps and the plurality of vertical probes, so as to effectively expand the application and test range of the array type thin film probe card.
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.
Drawings
Fig. 1 is a schematic perspective view of an array type thin film probe card according to an embodiment of the invention.
Fig. 2 is a schematic sectional view along the sectional line II-II of fig. 1.
Fig. 3 is a schematic perspective view of a thin film sheet (e.g., conductive bumps and corresponding portions) of an array type thin film probe card according to a second embodiment of the invention.
Fig. 4 is a schematic perspective view of an array type thin film probe card according to a third embodiment of the invention.
Fig. 5 is a bottom view of fig. 4.
Fig. 6 is a perspective view of the elastic pad and the thin film of fig. 4.
FIG. 7 is a perspective view of the elastic pad and the thin film of FIG. 4 from another perspective.
Fig. 8 is a schematic sectional view along the sectional line VIII-VIII of fig. 4.
Fig. 9 is an enlarged view of a portion IX in fig. 8.
Detailed Description
The following description is provided for the embodiments of the array type thin film probe card and the test module thereof according to the present disclosure, and those skilled in the art will understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
[ example one ]
Referring to fig. 1 and 2, the present embodiment discloses an array type thin film probe card 100, which includes an adapter plate 1(space transformer), a carrier unit 2 disposed on the adapter plate 1, at least one coaxial connector 3 mounted on the adapter plate 1, a plurality of vertical probes 4 positioned on the carrier unit 2, an elastic pad 5 disposed on the carrier unit 2, and a thin film 6 partially disposed on the elastic pad 5. The supporting unit 2, the plurality of vertical probes 4, the elastic pad 5, and the thin film 6 may also be collectively referred to as a testing module in this embodiment, and the testing module may also be applied separately (for example, sold) or used in combination with other components, which is not limited herein.
In the present embodiment, the carrying unit 2 is disposed at a substantially central portion of the interposer 1, and at least one of the coaxial connectors 3 is located outside the carrying unit 2. At least one of the coaxial connectors 3 may be disposed through the interposer 1 or disposed on a surface of the interposer 1 according to design requirements.
In addition, the carrying unit 2 is illustrated as a guide plate assembly (e.g., the guide plate assembly includes an upper guide plate, a lower guide plate, and a partition plate clamped between the upper guide plate and the lower guide plate) in the embodiment, but the invention is not limited thereto. It should be noted that the specific configurations of the vertical probes 4 and the supporting unit 2 can be adjusted according to design requirements, and the invention is not limited thereto.
The elastic pad 5 is made of a material or a structure that can be restored to its original shape after being compressed and deformed, and the elastic pad 5 is made of an insulating material such as a silicone pad in the embodiment, but the invention is not limited thereto. Wherein, the elastic pad 5 is disposed on the carrying unit 2, and the periphery of the elastic pad 5 is aligned with the periphery of the carrying unit 2 in this embodiment; that is, the carrying unit 2 is clamped between the adapter plate 1 and the elastic pad 5 in this embodiment. Furthermore, the elastic pad 5 is annular in the present embodiment, and the plurality of vertical probes 4 pass through the inner side of the elastic pad 5.
The thin film sheet 6 defines an outer block 6a, an inner block 6b stepped in a height direction H from the outer block 6a, and an extension block 6c connecting the outer block 6a and the inner block 6 b. In the present embodiment, the inner block 6b is located and sized corresponding to the elastic pad 5, and the extension block 6c connects the outer block 6a and the inner block 6b in an inclined manner.
The film sheet 6 includes a carrier 61 in a sheet shape, a plurality of signal lines 62 disposed on the carrier 61, and a plurality of conductive bumps 63 respectively disposed on the plurality of signal lines 62. The carrier 61 is preferably made of an insulating material, and the portion of the carrier 61 located in the inner block 6b is at least partially disposed on the elastic pad 5, while the portion of the carrier 61 located in the outer block 6a is at least partially disposed on the interposer 1.
A plurality of signal lines 62 are formed on the carrier 61, and each signal line 62 extends from the outer block 6a to the inner block 6b, and each signal line 62 may be linear or irregular, which is not limited herein.
In the present embodiment, the plurality of signal lines 62 of the thin film sheet 6 includes at least one high-frequency signal line 621, and a portion of the at least one high-frequency signal line 621 located in the outer block 6a is connected to at least one coaxial connector 3, so that the array type thin film probe card 100 can stably and accurately transmit high-frequency signals through the cooperation between the high-frequency signal line 621 and the coaxial connector 3. The connection between the high-frequency signal line 621 and the coaxial connector 3 may be a horizontal connection (not shown) or a vertical connection (e.g. fig. 2) according to design requirements, which is not limited herein.
Furthermore, at least a portion of the signal lines 62 in the plurality of signal lines 62 are electrically coupled to the interposer 1. In this embodiment, the signal lines 62 other than the high-frequency signal line 621 are electrically coupled to the interposer 1, and the electrical coupling between the signal lines 62 and the interposer 1 may be soldering, pressing, connector engagement, or spring contact, but the invention is not limited thereto.
The conductive bumps 63 are all located in the inner block 6b and are arranged in a ring shape, and the conductive bumps 63 are respectively formed on the signal lines 62. In the present embodiment, each conductive bump 63 is integrally connected to the corresponding signal line 62; that is, each conductive bump 63 and the corresponding signal line 62 are made of the same material. More specifically, each of the conductive bumps 63 is a tapered metal structure in the embodiment, and the tapered metal structure may be in a shape of a cone, a pyramid, a truncated cone, or a truncated pyramid, which is not limited herein.
In addition, one end (e.g., the bottom end in fig. 2) of the plurality of vertical probes 4 is located inside the plurality of conductive bumps 63, and the one end of the plurality of vertical probes 4 and the end of the plurality of conductive bumps 63 are disposed in a coplanar manner (e.g., the coplanar arrangement allows a reasonable tolerance range), and the other end (e.g., the top end in fig. 2) of the plurality of vertical probes 4 is connected and electrically coupled to the interposer 1.
Accordingly, the plurality of conductive bumps 63 of the thin film sheet 6 and the plurality of vertical probes 4 together form an array type probing point, thereby effectively expanding the application and testing range of the array type thin film probe card 100.
[ example two ]
Please refer to fig. 3, which is a second embodiment of the present invention, and this embodiment is similar to the first embodiment, so the same parts of the two embodiments are not described again, and the differences between this embodiment and the first embodiment are roughly described as follows:
in the present embodiment, each conductive bump 63 includes a claw-shaped metal structure 631 electrically coupled to the corresponding signal line 62, and an elastic body 632 (e.g., silicone or foam) located inside the claw-shaped metal structure 631. In each conductive bump 63, the claw-shaped metal structure 631 can elastically deform by pressing on the elastic body 632, so that the conductive bump 63 can more stably abut against the object to be tested.
[ third example ]
Please refer to fig. 4 to 9, which are third embodiments of the present invention, and the present embodiment is similar to the first and second embodiments, so the same parts of the above embodiments are not described again, and the differences between the present embodiment and the first and second embodiments are generally described as follows:
in the present embodiment, as shown in fig. 4 and fig. 5, the carrier 61 may be formed into a single-sheet or multi-sheet structure according to design requirements, and a plurality of grooves 612 are formed at the carrier 61 portion of the inner block 6b, so that the carrier 61 forms a plurality of actuating segments 611 in the inner block 6 b. In more detail, each of the trenches 612 formed in the carrier 61 extends from the inner block 6b to the extension block 6c in the present embodiment; that is, each of the actuating segments 611 is located in the inner block 6b and the extension block 6c, but the invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, each of the grooves 612 formed in the carrier 61 may also extend from the inner block 6b to the outer block 6a, so that each of the actuating segments 611 is located in the inner block 6b, the extending block 6c, and the outer block 6 a.
Furthermore, as shown in fig. 5 to 7, the portions of the signal lines 62 located in the inner block 6b are respectively located on the actuating segments 611. It should be further noted that the signal lines 62 located in the inner block 6b are located on the actuating segments 611 one by one in the present embodiment, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the signal lines 62 located in the inner block 6b may be located on the actuating segments 611 in a many-to-one manner.
In the present embodiment, the thin film sheet 6 further includes a plurality of independent cylinders 64 disposed between the plurality of actuating segments 611 and the elastic pad 5, and the plurality of independent cylinders 64 respectively correspond to the plurality of conductive bumps 63 along the height direction H, so that the portion of the carrier 61 located in the inner block 6b is in a step-like structure. Wherein the plurality of independent cylinders 64 are arranged at intervals, and a ring side edge of each independent cylinder 64 is exposed in the air; in other words, the side edge of each individual cylinder 64 forms a gap G with the stepped portion of the carrier 61.
Further, the independent cylinder 64 may be made of an insulating material or a conductive material (e.g., metal); in the present embodiment, the material of the signal lines 62, the conductive bumps 63, and the independent cylinders 64 are preferably the same, so as to facilitate the production of the film sheet 6. The independent cylinder 64 may be made of copper metal exposed in the atmosphere, so as to ensure a low contact resistance during testing (e.g., the copper metal is coated with an anti-oxidation material).
In addition, in order to provide the membrane sheet 6 with a better performance, the structure of the independent cylinder 64 may have at least one of the following conditions, but the invention is not limited thereto. As shown in fig. 8 and 9, a central axis C of any one of the conductive bumps 63 overlaps a central axis C of the corresponding independent cylinder 64 and is parallel to the height direction H. Furthermore, each of the independent cylinders 64 has a supporting height H64 in the height direction H, and each of the conductive bumps 63 has a protruding height H63 in the height direction H, and the supporting height H64 is not less than the protruding height H63 and not more than five times the protruding height H63. In addition, when any one of the conductive bumps 63 and the corresponding independent cylinder 64 are orthographically projected to a plane along the height direction H, a projection area formed by the conductive bump 63 is located within an outer contour of the projection area formed by the independent cylinder 64.
Accordingly, when any one of the conductive bumps 63 is pressed, the array type thin film probe card 100 can only press the corresponding independent cylinder 64 through the corresponding signal line 62 and the corresponding actuating segment 611 (that is, different conductive bumps 63 are not interlocked by the carrier 61), so that the array type thin film probe card 100 can reduce the interlock between the conductive bumps 63, so that the conductive bumps 63 are uniformly stressed and can stably abut against the metal pads of the object to be tested. Further, the arrayed thin film probe card 100 can have a wide test area (or distribution range of the plurality of conductive bumps 63).
[ technical effects of embodiments of the present invention ]
In summary, in the array type thin film probe card and the testing module thereof disclosed in the embodiments of the present invention, the plurality of conductive bumps and the plurality of vertical probes together form an array type detecting point, so as to effectively expand the application and testing range of the array type thin film probe card. In the array type thin film probe card disclosed in the embodiment of the invention, the claw-shaped metal structure in each conductive bump can be elastically deformed by pressing the elastic body, so that the conductive bump can be more stably abutted against the object to be measured.
In addition, the array type film probe card disclosed by the embodiment of the invention can only press the corresponding independent cylinder through the corresponding signal line and the actuating section when any conductive bump is pressed, so that the array type film probe can reduce the linkage among a plurality of conductive bumps, so that the stress of the conductive bumps is more uniform, and the conductive bumps can more stably abut against a plurality of metal pads of the object to be detected. Furthermore, the array type thin film probe can also enable the testing area (or the distribution range of the plurality of conductive bumps) to be wider.
The disclosure is only a preferred embodiment of the invention and should not be taken as limiting the scope of the invention, which is defined by the appended claims.
Claims (10)
1. An array type thin film probe card, comprising:
an adapter plate;
the bearing unit is arranged on the adapter plate;
a plurality of vertical probes positioned on the bearing unit;
the elastic pad is arranged on the bearing unit so that the bearing unit is clamped between the elastic pad and the adapter plate; and
a thin film sheet defining an outer block, an inner block having a step difference in a height direction with the outer block, and an extension block connecting the outer block and the inner block; wherein, the film sheet includes:
the part of the carrier positioned on the inner block is at least partially arranged on the elastic pad, and the part of the carrier positioned on the outer block is at least partially arranged on the adapter plate;
a plurality of signal lines disposed on the carrier, wherein at least some of the signal lines are electrically coupled to the interposer; and
a plurality of conductive bumps positioned in the inner block and respectively formed on the plurality of signal lines, wherein the plurality of conductive bumps are arranged in a ring shape;
one end of each of the plurality of vertical probes is located at the inner side of the corresponding conductive bump, the one end of each of the plurality of vertical probes and the tail end of each of the plurality of conductive bumps are arranged in a coplanar manner, and the other end of each of the plurality of vertical probes is connected and electrically coupled to the corresponding adapter plate.
2. The array type thin film probe card of claim 1, wherein a plurality of grooves are formed at the portion of the carrier located at the inner block, so that the carrier forms a plurality of active sections at the inner block, and portions of a plurality of signal lines located at the inner block are respectively located at the plurality of active sections; the thin film sheet comprises a plurality of independent cylinders arranged between the actuating sections and the elastic cushion, and the independent cylinders respectively correspond to the conductive bumps along the height direction, so that the part of the carrier positioned in the inner block is in a stepped structure.
3. The array type thin film probe card of claim 2, wherein when any one of the conductive bumps and the corresponding independent cylinder are orthographically projected to a plane along the height direction, a projected area formed by the conductive bump is located within an outer contour of the projected area formed by the independent cylinder.
4. The array type thin film probe card of claim 2, wherein a central axis of any one of the conductive bumps is overlapped with a central axis of the corresponding independent cylinder and is parallel to the height direction.
5. The array type thin film probe card of claim 2, wherein any one of the independent cylinders has a supporting height in the height direction, and any one of the conductive bumps has a protruding height in the height direction, and the supporting height is not less than the protruding height and not more than five times the protruding height.
6. The array type thin film probe card of claim 2, wherein the signal lines, the conductive bumps, and the individual cylinders are made of the same material, and a circumferential side edge of each of the individual cylinders is exposed to air.
7. The array type thin film probe card of claim 1, wherein each of the conductive bumps comprises a claw-shaped metal structure electrically coupled to the corresponding signal line and an elastic body located inside the claw-shaped metal structure; in each conductive bump, the claw-shaped metal structure can be elastically deformed by pressing the elastic body.
8. The array type thin film probe card of claim 1, further comprising at least one coaxial connector mounted on the interposer, wherein the plurality of signal lines of the thin film sheet comprise at least one high frequency signal line, and a portion of the at least one high frequency signal line located in the outer block is connected to the at least one coaxial connector.
9. A test module of an array type thin film probe card, comprising:
a bearing unit;
a plurality of vertical probes positioned on the bearing unit;
the elastic pad is arranged on the bearing unit; and
a thin film sheet defining an outer block, an inner block having a step difference in a height direction with the outer block, and an extension block connecting the outer block and the inner block; wherein, the film sheet includes:
the carrier is arranged on the elastic pad at the position of the inner block;
a plurality of signal lines disposed on the carrier; and
a plurality of conductive bumps located in the inner block and respectively formed on the plurality of signal lines,
the conductive bumps are arranged in a ring shape;
one end of each of the plurality of vertical probes is positioned at the inner side of each of the plurality of conductive bumps, and the one end of each of the plurality of vertical probes and the tail end of each of the plurality of conductive bumps are arranged in a coplanar manner.
10. The testing module of the array type thin film probe card of claim 9, wherein the portion of the carrier located in the inner block is formed with a plurality of grooves, so that the carrier forms a plurality of active sections in the inner block, and the portions of the plurality of signal lines located in the inner block are respectively located on the plurality of active sections; wherein the thin film sheet comprises a plurality of independent cylinders arranged between the plurality of actuating sections and the elastic pad, and the plurality of independent cylinders respectively correspond to the plurality of conductive bumps along the height direction, so that the part of the carrier located in the inner block is in a stepped structure; wherein a central axis of any one of the conductive bumps is overlapped with a central axis of the corresponding independent cylinder and is parallel to the height direction; when any one of the conductive bumps and the independent cylinder corresponding to the conductive bump are orthographically projected to a plane along the height direction, a projection area formed by the conductive bump is positioned within the outer contour of the projection area formed by the independent cylinder.
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| CN202010391464.5A CN113640555B (en) | 2020-05-11 | 2020-05-11 | Array type thin film probe card and test module thereof |
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| CN202010391464.5A CN113640555B (en) | 2020-05-11 | 2020-05-11 | Array type thin film probe card and test module thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114200280A (en) * | 2021-11-29 | 2022-03-18 | 强一半导体（苏州）有限公司 | Film probe card and probe head thereof |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0962776A2 (en) * | 1998-06-02 | 1999-12-08 | Advantest Corporation | Probe card suitable for inspection of multi-pin devices |
| JP2000174078A (en) * | 1998-12-08 | 2000-06-23 | Advantest Corp | Probe card and its manufacturing method |
| TW200513650A (en) * | 2004-12-31 | 2005-04-16 | Min-Chang Dong | Micro-electromechanical probe circuit film, method for making the same and applications thereof |
| KR100638087B1 (en) * | 2006-01-06 | 2006-10-24 | (주) 마이크로프랜드 | Manufacturing method and structure of tensible beam for probe card |
| US20070089551A1 (en) * | 2005-09-30 | 2007-04-26 | Sv Probe Ptd. Ltd. | Cantilever probe structure for a probe card assembly |
| CN101329365A (en) * | 2007-06-21 | 2008-12-24 | 均扬电子有限公司 | Probe clip and combined assembly method |
| US20090072851A1 (en) * | 2007-09-13 | 2009-03-19 | Touchdown Technologies, Inc. | Multi-Pivot Probe Card For Testing Semiconductor Devices |
| US20090096473A1 (en) * | 2007-10-16 | 2009-04-16 | Compal Electronics, Inc. | Testing probe and electrical connection method using the same |
| US20170074902A1 (en) * | 2015-09-15 | 2017-03-16 | Yokowo Co., Ltd. | Contact unit and inspection jig |
| US20190187178A1 (en) * | 2017-12-18 | 2019-06-20 | Yokowo Co., Ltd. | Inspection jig |
| CN110716071A (en) * | 2018-07-13 | 2020-01-21 | 中华精测科技股份有限公司 | High-frequency probe card device and crimping module and support thereof |
| CN110716122A (en) * | 2018-07-13 | 2020-01-21 | 中华精测科技股份有限公司 | High-frequency probe card device and signal transmission module thereof |
| CN110927416A (en) * | 2018-09-19 | 2020-03-27 | 中华精测科技股份有限公司 | Probe card testing device and testing device |
-
2020
- 2020-05-11 CN CN202010391464.5A patent/CN113640555B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0962776A2 (en) * | 1998-06-02 | 1999-12-08 | Advantest Corporation | Probe card suitable for inspection of multi-pin devices |
| JP2000174078A (en) * | 1998-12-08 | 2000-06-23 | Advantest Corp | Probe card and its manufacturing method |
| TW200513650A (en) * | 2004-12-31 | 2005-04-16 | Min-Chang Dong | Micro-electromechanical probe circuit film, method for making the same and applications thereof |
| US20070089551A1 (en) * | 2005-09-30 | 2007-04-26 | Sv Probe Ptd. Ltd. | Cantilever probe structure for a probe card assembly |
| KR100638087B1 (en) * | 2006-01-06 | 2006-10-24 | (주) 마이크로프랜드 | Manufacturing method and structure of tensible beam for probe card |
| CN101329365A (en) * | 2007-06-21 | 2008-12-24 | 均扬电子有限公司 | Probe clip and combined assembly method |
| US20090072851A1 (en) * | 2007-09-13 | 2009-03-19 | Touchdown Technologies, Inc. | Multi-Pivot Probe Card For Testing Semiconductor Devices |
| US20090096473A1 (en) * | 2007-10-16 | 2009-04-16 | Compal Electronics, Inc. | Testing probe and electrical connection method using the same |
| US20170074902A1 (en) * | 2015-09-15 | 2017-03-16 | Yokowo Co., Ltd. | Contact unit and inspection jig |
| US20190187178A1 (en) * | 2017-12-18 | 2019-06-20 | Yokowo Co., Ltd. | Inspection jig |
| CN110716071A (en) * | 2018-07-13 | 2020-01-21 | 中华精测科技股份有限公司 | High-frequency probe card device and crimping module and support thereof |
| CN110716122A (en) * | 2018-07-13 | 2020-01-21 | 中华精测科技股份有限公司 | High-frequency probe card device and signal transmission module thereof |
| CN110927416A (en) * | 2018-09-19 | 2020-03-27 | 中华精测科技股份有限公司 | Probe card testing device and testing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114200280A (en) * | 2021-11-29 | 2022-03-18 | 强一半导体（苏州）有限公司 | Film probe card and probe head thereof |
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| CN113640555B (en) | 2023-11-10 |
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