CN113636195B - Packaging box for embedded intelligent chip - Google Patents
Packaging box for embedded intelligent chip Download PDFInfo
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- CN113636195B CN113636195B CN202110807832.4A CN202110807832A CN113636195B CN 113636195 B CN113636195 B CN 113636195B CN 202110807832 A CN202110807832 A CN 202110807832A CN 113636195 B CN113636195 B CN 113636195B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/32—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed at least two layers being foamed and next to each other
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D55/00—Accessories for container closures not otherwise provided for
- B65D55/02—Locking devices; Means for discouraging or indicating unauthorised opening or removal of closure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
- B65D81/07—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using resilient suspension means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
- B65D81/107—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/02—Organic
- B32B2266/0214—Materials belonging to B32B27/00
- B32B2266/025—Polyolefin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/41—Opaque
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/80—Packaging reuse or recycling, e.g. of multilayer packaging
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Buffer Packaging (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a packaging box for an embedded intelligent chip, which comprises a packaging box body and a cavity arranged in the packaging box body, wherein a damping component is arranged at the bottom of the cavity, the top of the damping component is fixedly arranged on a supporting plate, a first chip positioning layer is fixedly arranged above the supporting plate, at least two groups of second chip positioning layers are arranged above the first chip positioning layer in an equidistant array manner, the second chip positioning layers are arranged in the cavity in a sliding manner, two groups of limiting plates are symmetrically arranged on the inner wall of the cavity respectively, the packaging box body comprises an upper box and a lower box, a cross-shaped positioning groove and a cross-shaped bulge are arranged in two corresponding groups of arc handles respectively, the first chip positioning layer and the second chip positioning layer are arranged in the packaging box, and U-shaped grooves are arranged in the first chip positioning layer and the second chip positioning layer to position and surround contact pins which are externally connected around the embedded chip, so that the contact pins are effectively protected.
Description
Technical Field
The invention belongs to the technical field of intelligent chips, and particularly relates to a packaging box for an embedded intelligent chip.
Background
The embedded system on chip is called SOC for short, has extremely high comprehensiveness, and realizes a complex system by applying hardware description languages such as VHDL and the like in a silicon chip. Users do not need to draw a huge and complicated circuit board like the traditional system design, connect and weld a little by little, only need to use accurate language, synthesize the time sequence design and call the standard of various general processors in the device library directly, then can deliver to the chip manufacturer to produce directly after the emulation. Because most of system components are in the system, the whole system is simple, the volume and the power consumption of the system are reduced, the reliability of the system is improved, and the design production efficiency is improved.
The periphery of the existing embedded chip is provided with externally connected contact pins, the contact pins are very small in diameter and very thin and inconvenient to protect and store, the periphery of the existing bearing box is provided with a hard shell, and the contact pins are easily damaged due to shaking in the transportation and carrying processes.
Therefore, the packaging box for the embedded intelligent chip is provided to solve the problems in the prior art, so that the embedded chip is packaged by utilizing the first chip positioning layer and the second chip positioning layer, and pins for external connection around the embedded chip are protected.
Disclosure of Invention
The invention aims to provide a packaging box for an embedded intelligent chip, and aims to solve the problems that in the prior art, pins are externally connected around the existing embedded chip, the diameter of each pin is very small, the pins are also very thin and are inconvenient to protect and store, and the pins are easily damaged due to shaking in the transportation and carrying processes because the periphery of the existing box is a hard shell.
In order to achieve the purpose, the invention adopts the following technical scheme:
a packaging box for an embedded intelligent chip comprises a packaging box body and a cavity formed in the packaging box body, wherein a damping component is arranged at the bottom of the cavity, the top of the damping component is fixedly installed on a supporting plate, a first chip positioning layer is fixedly installed above the supporting plate, at least two groups of second chip positioning layers are arrayed above the first chip positioning layer at equal intervals, and the second chip positioning layers are installed in the cavity in a sliding mode;
the packaging box body comprises an upper box and a lower box, two groups of arc-shaped handles are symmetrically arranged on the outer walls of the upper box and the lower box, and a cross-shaped positioning groove and a cross-shaped bulge are respectively formed in the two corresponding groups of arc-shaped handles;
an encapsulation film roll is arranged on one side of the outer wall of the lower box and comprises a roller and a thin film, the roller is rotatably arranged outside the lower box, and the thin film is annularly wound on the surface of the roller;
a sponge strip is fixedly mounted on one side, away from the packaging film roll, of the outer wall of the lower box, a blade is arranged in the sponge strip, a pressing strip is fixedly mounted on one side of the upper box, the mounting positions of the pressing strip and the sponge strip are matched, the thicknesses of the pressing strip and the sponge strip are equal, and a groove matched with the blade is formed in the pressing strip;
the first chip positioning layer comprises a first supporting plate and a chip fixing layer fixedly arranged in the first supporting plate, the chip fixing layer comprises a PET (polyethylene terephthalate) protective film layer, a shading adhesive tape layer and a polypropylene shading and damping foam layer, the thickness of the shading adhesive tape layer is 0.06mm, and the first supporting plate is fixedly connected with the supporting plate through a bolt;
the second chip positioning layer comprises a second supporting plate and a chip fixing layer fixedly arranged in the second supporting plate, supporting blocks are symmetrically arranged on the inner wall of the cavity, and the two groups of supporting blocks are respectively matched with the first supporting plate and the second supporting plate;
shock-absorbing component is provided with four groups, shock-absorbing component includes hollow stay tube, slip post and damping spring, four groups slip post fixed mounting in backup pad bottom four corners, and the slip post other end slidable mounting in hollow stay tube, hollow stay tube bottom fixed mounting is in the cavity bottom, damping spring fixed connection just cup joints between hollow stay tube and slip post in backup pad and cavity between the bottom.
Preferably, the lug plates are symmetrically arranged on one side of the outer wall of the lower box, the end shafts at the two ends of the roller are rotatably arranged in the lug plates, a notch is formed in one side above the lug plates, and the opening width of the notch is larger than the diameter of the end shafts at the two ends of the roller.
Preferably, the polypropylene shading and damping foam layer comprises two groups of foam layers and an acrylic adhesive layer, the two groups of foam layers are fixedly connected through the acrylic adhesive layer, and the acrylic adhesive layer is also arranged between the polypropylene shading and damping foam layer and the PET protective film layer.
Preferably, a square embedding opening is formed in the chip fixing layer, and U-shaped notches are formed in four sides of the square embedding opening at equal intervals.
The invention has the technical effects and advantages that: compared with the prior art, the packaging box for the embedded intelligent chip has the following advantages that:
1. according to the invention, the packaging box is provided with the upper box and the lower box, both the upper box and the lower box can package the embedded chip, the packaging space of the packaging box is increased, the cross-shaped bulge and the cross-shaped clamping groove are matched, the upper box and the lower box are clamped, and the connecting structure is convenient to use;
2. according to the invention, the first chip positioning layer and the second chip positioning layer are arranged in the packaging box, and the U-shaped grooves are arranged in the first chip positioning layer and the second chip positioning layer to position and surround the pins which are used for external connection and arranged around the embedded chip of the embedded chip, so that the pins are effectively protected;
3. according to the invention, the first chip positioning layer is connected to the inner bottom surface of the cavity through the damping assembly, so that the damage to the chip caused by vibration generated by shaking of the packaging box is reduced, and the possibility of damage of a contact pin is reduced.
Drawings
FIG. 1 is a schematic perspective view of an upper case according to the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a cross-sectional front view of the lower case of the present invention;
FIG. 4 is an enlarged view of portion A of FIG. 3 according to the present invention;
FIG. 5 is a schematic sectional view of the upper case bead portion according to the present invention;
FIG. 6 is a schematic cross-sectional view of a chip mounting layer according to the present invention.
In the figure: 1. packaging the box body; 101. putting the box on; 102. a box is lowered; 2. a cavity; 201. a support block; 3. a shock absorbing assembly; 301. a hollow support tube; 302. a sliding post; 303. a damping spring; 4. a support plate; 5. a first chip positioning layer; 501. a first pallet; 502. a chip fixing layer; 5021. a PET protective film layer; 5022. a light-shielding adhesive tape layer; 5023. a polypropylene shading and damping foam layer; 5024. a square inlay port; 5025. a U-shaped notch; 6. a second chip positioning layer; 601. a second pallet; 8. an arc-shaped handle; 9. a cross-shaped positioning groove; 11. packaging the film roll; 1101. a roller; 1102. a film; 1103. an ear plate; 1104. a notch; 12. a sponge strip; 13. a blade; 14. layering; 15. and (4) a groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a packaging box for an embedded intelligent chip as shown in figures 1-6, which comprises a packaging box body 1 and a cavity 2 arranged in the packaging box body 1, wherein the bottom of the cavity 2 is provided with a shock absorption component 3, the shock absorption component 3 is provided with four groups, the shock absorption component 3 comprises a hollow supporting tube 301, a sliding column 302 and a shock absorption spring 303, the four groups of sliding columns 302 are fixedly arranged at four corners of the bottom of a supporting plate 4, the other end of the sliding column 302 is slidably arranged in the hollow supporting tube 301, the bottom of the hollow supporting tube 301 is fixedly arranged on the inner bottom surface of the cavity 2, the shock absorption spring 303 is fixedly connected between the supporting plate 4 and the inner bottom surface of the cavity 2 and is sleeved between the hollow supporting tube 301 and the sliding column 302, and the cavity 2 is filled in an upper box 101 and a lower box 102, so that the shock absorption component 3 is arranged in the upper box 101 and the lower box 102, the damage to the chip caused by the vibration generated by the shaking of the packaging box body 1 is reduced, and the possibility of the damage of a contact pin is also reduced.
The top of the damping component 3 is fixedly arranged on a support plate 4, a first chip positioning layer 5 is fixedly arranged above the support plate 4, at least two groups of second chip positioning layers 6 are arranged above the first chip positioning layer 5 in an equidistant array mode, the second chip positioning layers 6 are slidably arranged in the cavity 2, two groups of support blocks 201 are symmetrically arranged on the inner wall of the cavity 2 respectively, and the space between the first chip positioning layer 5 and the two groups of second chip positioning layers 6 is limited by the support blocks 201;
the packaging box body 1 comprises an upper box 101 and a lower box 102, two groups of arc-shaped handles 8 are symmetrically arranged on the outer walls of the upper box 101 and the lower box 102, cross-shaped positioning grooves 9 and cross-shaped protrusions are respectively formed in the two corresponding groups of arc-shaped handles 8, a packaging film roll 11 is arranged on one side of the outer wall of the lower box 102, the chip is subjected to dustproof protection by utilizing the packaging film roll 11, and the telecommunication connection relation of the chip can be influenced by chip dust collection; the packaging film roll 11 comprises a roller 1101 and a film 1102, the roller 1101 is rotatably installed outside a lower box 102, the film 1102 is annularly wound on the surface of the roller 1101, ear plates 1103 are symmetrically installed on one side of the outer wall of the lower box 102, end shafts at two ends of the roller 1101 are rotatably installed in the ear plates 1103, a notch 1104 is formed in one side above the ear plates 1103, the opening width of the notch 1104 is larger than the diameter of end shafts at two ends of the roller 1101, a sponge strip 12 is fixedly installed on one side, away from the packaging film roll 11, of the outer wall of the lower box 102, a blade 13 is arranged in the sponge strip 12, a pressing strip 14 is fixedly installed on one side of the upper box 101, the mounting positions of the pressing strip 14 and the sponge strip 12 are matched, the thicknesses of the pressing strip 14 and the sponge strip 12 are equal, a groove 15 matched with the blade 13 is formed in the pressing strip 14, when the packaging film roll is used, after all embedded chips are installed in the upper box 101 and the lower box 102, before the upper box 101 and the lower box 102 are combined, the film roll 14 is firstly pulled out to be laid on the lower box 102, the opening of the upper box 101 and the lower box is tightly pressed, so that the film roll 1102 is tightly pressed to be tightly combined with the lower box 102, and the dust-proof film roll can be tightly combined.
The first chip positioning layer 5 comprises a first supporting plate 501 and a chip fixing layer 502 fixedly installed in the first supporting plate 501, the chip fixing layer 502 comprises a PET protective film layer 5021, a shading adhesive tape layer 5022 and a polypropylene shading and damping foam layer 5023, the thickness of the shading adhesive tape layer 5022 is 0.06mm, the first supporting plate 501 and a supporting plate 4 are fixedly connected through a bolt, the polypropylene shading and damping foam layer 5023 comprises two groups of foam layers and an acrylic adhesive layer, the two groups of foam layers are fixedly connected through the acrylic adhesive layer, an acrylic adhesive layer is also arranged between the polypropylene shading and damping foam layer 5023 and the PET protective film layer 5021, a square embedding opening 5024 is formed in the chip fixing layer 502, the four sides of the square embedding opening 5024 are all provided with U-shaped openings 5025 in equal intervals, the second chip positioning layer 6 comprises a second supporting plate 601 and a chip fixing layer 502 fixedly installed in the second supporting plate 601, supporting blocks 201 are symmetrically installed on the inner wall of the cavity 2, the supporting blocks 201 are respectively matched with the first supporting plate and the second supporting plate 601, the second supporting plate 501 supports the chip fixing layer 501, and at least three groups of chip supporting plates 601 and at least three groups of chip packaging boxes can be accommodated in the chip packaging box.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still make modifications to the technical solutions described in the foregoing embodiments, or make equivalent substitutions and improvements to part of the technical features of the foregoing embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The utility model provides a packaging box for embedded intelligent chip, includes packaging box body (1) and sets up cavity (2) in packaging box body (1), its characterized in that: the bottom of the cavity (2) is provided with a damping component (3), the top of the damping component (3) is fixedly arranged on a supporting plate (4), a first chip positioning layer (5) is fixedly arranged above the supporting plate (4), at least two groups of second chip positioning layers (6) are arranged above the first chip positioning layer (5) in an equidistant array mode, and the second chip positioning layers (6) are slidably arranged in the cavity (2);
the packaging box body (1) comprises an upper box (101) and a lower box (102), two groups of arc-shaped handles (8) are symmetrically arranged on the outer walls of the upper box (101) and the lower box (102), and a cross-shaped positioning groove (9) and a cross-shaped bulge are respectively formed in the two corresponding groups of arc-shaped handles (8);
an encapsulating film roll (11) is arranged on one side of the outer wall of the lower box (102), the encapsulating film roll (11) comprises a roller (1101) and a thin film (1102), the roller (1101) is rotatably installed outside the lower box (102), and the thin film (1102) is annularly wound on the surface of the roller (1101);
a sponge strip (12) is fixedly installed on one side, far away from the packaging film roll (11), of the outer wall of the lower box (102), a blade (13) is arranged in the sponge strip (12), a pressing strip (14) is fixedly installed on one side of the upper box (101), the mounting positions of the pressing strip (14) and the sponge strip (12) are arranged in a matching mode, the thicknesses of the pressing strip (14) and the sponge strip (12) are equal, and a groove (15) matched with the blade (13) is formed in the pressing strip (14);
the first chip positioning layer (5) comprises a first supporting plate (501) and a chip fixing layer (502) fixedly installed in the first supporting plate (501), the chip fixing layer (502) comprises a PET protective film layer (5021), a shading adhesive tape layer (5022) and a polypropylene shading and damping foam layer (5023), the thickness of the shading adhesive tape layer is 0.06mm, and the first supporting plate (501) is fixedly connected with the supporting plate (4) through bolts;
the second chip positioning layer (6) comprises a second supporting plate (601) and a chip fixing layer (502) fixedly arranged in the second supporting plate (601), supporting blocks (201) are symmetrically arranged on the inner wall of the cavity (2), and the two groups of supporting blocks (201) are respectively matched with the first supporting plate (501) and the second supporting plate (601);
shock-absorbing component (3) are provided with four groups, shock-absorbing component (3) are including hollow stay tube (301), slip post (302) and damping spring (303), four groups slip post (302) fixed mounting in backup pad (4) bottom four corners, and slip post (302) other end slidable mounting in hollow stay tube (301), bottom fixed mounting in cavity (2) is in hollow stay tube (301), damping spring (303) fixed connection just cup joints between hollow stay tube (301) and slip post (302) in backup pad (4) and cavity (2) between the bottom.
2. A package for an embedded smart chip according to claim 1, wherein: ear plate (1103) are installed to box (102) outer wall one side symmetry down, the end axle at roller (1101) both ends rotates and installs in ear plate (1103), breach (1104) are seted up to ear plate (1103) top one side, the opening width of breach (1104) is greater than the diameter of roller (1101) both ends end axle.
3. A package for an embedded smart chip according to claim 1, wherein: the polypropylene shading and damping foam layer (5023) comprises two groups of foam layers and an acrylic adhesive layer, the two groups of foam layers are fixedly connected through the acrylic adhesive layer, and the acrylic adhesive layer is also arranged between the polypropylene shading and damping foam layer (5023) and the PET protective film layer (5021).
4. A package for an embedded smart chip according to claim 1, wherein: a square embedding opening (5024) is formed in the chip fixing layer (502), and U-shaped groove openings (5025) are formed in four sides of the square embedding opening (5024) at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110807832.4A CN113636195B (en) | 2021-07-16 | 2021-07-16 | Packaging box for embedded intelligent chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110807832.4A CN113636195B (en) | 2021-07-16 | 2021-07-16 | Packaging box for embedded intelligent chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113636195A CN113636195A (en) | 2021-11-12 |
| CN113636195B true CN113636195B (en) | 2023-04-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110807832.4A Active CN113636195B (en) | 2021-07-16 | 2021-07-16 | Packaging box for embedded intelligent chip |
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| CN (1) | CN113636195B (en) |
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| JP2013252868A (en) * | 2012-06-05 | 2013-12-19 | Mitsubishi Electric Corp | Packaging box |
| CN206827159U (en) * | 2017-05-27 | 2018-01-02 | 路玛特株式会社 | Can be multilayer laminated be used for load show film seal box |
| CN208521914U (en) * | 2018-04-27 | 2019-02-19 | 深圳市芯连芯时代科技有限公司 | A kind of stacking type semiconductor chip package |
| CN210192200U (en) * | 2019-07-10 | 2020-03-27 | 深圳世纪稳特电子有限公司 | Chip with good fixity packing |
| CN211195694U (en) * | 2019-10-30 | 2020-08-07 | 怀化学院 | Gouache color palette with good sealing effect |
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