CN208521914U - A kind of stacking type semiconductor chip package - Google Patents
A kind of stacking type semiconductor chip package Download PDFInfo
- Publication number
- CN208521914U CN208521914U CN201820619266.8U CN201820619266U CN208521914U CN 208521914 U CN208521914 U CN 208521914U CN 201820619266 U CN201820619266 U CN 201820619266U CN 208521914 U CN208521914 U CN 208521914U
- Authority
- CN
- China
- Prior art keywords
- shell
- fixedly connected
- sliding
- link block
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of stacking type semiconductor chip packages, including first shell, the right side of the first shell is fixedly connected with the second link block, the lower surface of second link block is fixedly connected with the upper surface of the first sliding block, first sliding block is arranged in the first sliding groove that the first link block upper surface opens up, the left side of first link block is fixedly connected on the right side of second shell, and the side of the first sliding block is connected with sliding sleeve.The stacking type semiconductor chip package, pass through the cooperation between the first link block, first sliding groove, the first sliding block, the second link block, nut, bolt, first through hole, the second through-hole, sliding sleeve, slide bar, second spring, handle, rotating device, second sliding slot, the second sliding block, limiting slot and connector, so as to improve the leakproofness between first shell and second shell, improve its leakproofness can influence of the pre- dust protection to chip body, so as to extend the service life of chip body.
Description
Technical field
The utility model relates to chip packing-body technical field, specially a kind of stacking type semiconductor chip package.
Background technique
The shell for installing semiconductor integrated circuit chip plays placement, fixation, sealing, protection chip and enhancing electric heating
The effect of performance, but also be link up the chip interior world and external circuit bridge --- the contact on chip is connected with conducting wire
Onto the pin of package casing, these pins establish connection with other devices further through the conducting wire in printed board.Therefore, encapsulation pair
CPU and other LSI integrated circuits all play an important role.
A kind of capsulation body of semiconductor ship of high reliability and low cost is disclosed according to national patent CN204348705U, is adopted
It uses general circuit board material as raw material, is fabricated to pipe cap and pedestal, graphic making uses mature circuit board machining process,
Low in cost, bottom is grounded using plated-through hole, and is filled up hole using disk mesoporous technique, reaches the mesh of sealing
, guarantee passing through for HAST, have the drawback that heat dissipation effect be not it is highly desirable, using common air-flow cool-down method, no
It only will increase the volume of capsulation body of semiconductor ship, can also generate the experience effect of stronger noise effect user, pass through air-flow
Ventilation hole certainly will will be opened up in the outer surface of semiconductor chip by carrying out cooling, but can reduce its sealing effect, influence semiconductor core
The using effect of piece, the design of capsulation body of semiconductor ship are divided into two parts, and small volume be easy to cause part to lose
It loses.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of stacking type semiconductor chip package, solves
Heat dissipation effect be not it is highly desirable, using common air-flow cool-down method, not only will increase the volume of capsulation body of semiconductor ship,
The experience effect that stronger noise effect user can also be generated, carrying out cooling by air-flow certainly will will be in the appearance of semiconductor chip
Face opens up ventilation hole, but can reduce its sealing effect, influences the using effect of semiconductor chip, and capsulation body of semiconductor ship is set
The problem of score is two parts, and small volume be easy to cause part to lose.
(2) technical solution
To achieve the above object, the utility model provides the following technical solutions: a kind of stacking type semiconductor chip package,
Including first shell, the right side of the first shell is fixedly connected with the second link block, the lower surface of second link block
It is fixedly connected with the upper surface of the first sliding block, the first sliding groove that the first link block upper surface opens up is arranged in first sliding block
Interior, the left side of first link block is fixedly connected on the right side of second shell, and the side of first sliding block is connected with
Sliding sleeve, is socketed with slide bar in the sliding sleeve, and the right end of the slide bar passes through the second through-hole that the first link block right side opens up simultaneously
It is fixedly connected with the left side of handle.
The outer surface of the slide bar is socketed with second spring, the right side of one end of the second spring and the first link block
It is fixedly connected, the other end of the second spring is fixedly connected with the left side of handle, the lower surface clamping of first sliding block
Have a nut, the nut inner thread is connected with bolt, and the bottom end of bolt pass through that first sliding groove interior lower surface opens up the
One through-hole and the lower surface for extending to the first link block, the left side of the first shell are fixedly connected with connector, the company
The lower surface of fitting is fixedly connected with the upper surface of rotating device, and rotating device is located at what third link block upper surface opened up
In limiting slot.
The lower surface of the rotating device is fixedly connected on the upper surface of the second sliding block, and second sliding block is slidably connected at
In the second sliding slot that limiting slot interior lower surface opens up, the right side of the third link block is fixedly connected on a left side for second shell
Side, and the lower surface of first shell and the upper surface of second shell overlap joint, the first shell and second shell inner wall
Two sides offer several spherical grooves, and two opposite inside of spherical groove are provided with metal ball, and two metals
The opposite side of ball is fixedly connected to elastic device, and one end similar in two elastic devices connects by the way that chip body is fixed
It connects.
Preferably, the elastic device includes telescopic rod, and the outer surface of the telescopic rod is socketed with the first spring, described to stretch
One end of contracting bar and the first spring is fixedly connected with the side of chip body, the other end and gold of the telescopic rod and the first spring
The side for belonging to ball is fixedly connected.
Preferably, the rotating device includes two fixed blocks, and the lower surface of two fixed blocks is fixedly connected with the
The upper surface of two sliding blocks, and the opposite face of two fixed blocks is connected with bearing, and two bearing inner sleeves are connected to shaft, described turn
The upper surface of axis is fixedly connected with the lower surface of connector.
Preferably, the second sliding slot is T-shaped, and second sliding block is T-shaped.
Preferably, the side and lower surface of the second shell are provided with several welding pins, the first shell
Heat pipe is provided with the front of second shell.
Preferably, the shape of the connector is L-type, and the size of the connector is less than the size of limiting slot.
(3) beneficial effect
The utility model provides a kind of stacking type semiconductor chip package, have it is following the utility model has the advantages that
(1), the stacking type semiconductor chip package is connected by the first link block, first sliding groove, the first sliding block, second
Connect block, nut, bolt, first through hole, the second through-hole, sliding sleeve, slide bar, second spring, handle, rotating device, second sliding slot,
Cooperation between two sliding blocks, limiting slot and connector, when the upper surface point of the lower surface and second shell that need to make first shell
From when, people can be with rotating bolt, and installation is fixed by using a nut, not only in and the small volume of chip body
The work difficulty for reducing people also reduces the production cost of producer, and then people can push first shell to slide to the left,
Sliding sleeve is driven to separate with slide bar during second link block is mobile, consequently facilitating first shell is rotated by the center of circle of shaft, people
Can also be moved right by pull handle and separate sliding sleeve with slide bar, the shape of second sliding slot and the second sliding block is T word
Shape, so as to prevent first shell sidesway during sliding, so as to play the role of protect chip body, first
Shell connects into an entirety by connector and second shell, can not only prevent first shell loss, be also convenient for people couple
The utility model is safeguarded that, so as to improve the leakproofness between first shell and second shell, improving its leakproofness can
Influence with pre- dust protection to chip body, so as to extend the service life of chip body.
(2), the stacking type semiconductor chip package, by elastic device, metal ball, spherical groove, first shell and
Cooperation between second shell, chip body are fixed on two opposite spherical grooves by elastic device and metal ball combination
It is interior, and multiple groups spherical groove is offered in first shell and second shell, people can be according to the working performance of chip body
The distance between its is adjusted, so as to provide a better running space for chip body.
(3), the stacking type semiconductor chip package, by the way that heat pipe is arranged, heat pipe has the function of heat dissipation, by using
Heat pipe radiates, and so as to avoid radiating using flabellum, can not only reduce the volume of the utility model, can be with
The noise that the utility model generates is reduced, so as to increase the experience effect of people, and the utility model is compact-sized, design
Rationally, practical.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure that the utility model is faced；
Fig. 2 is the structural schematic diagram that the utility model is faced；
Fig. 3 is the structural schematic diagram of the utility model rotating device side view；
Fig. 4 is the schematic diagram of the section structure of the utility model second sliding slot side view.
In figure: 1 first shell, 2 second shells, 3 welding pins, 4 chip bodies, 5 elastic devices, 51 telescopic rods, 52
One spring, 6 metal balls, 7 spherical grooves, 8 first through hole, 9 bolts, 10 nuts, 11 first link blocks, 12 second through-holes, 13
Hand, 14 second springs, 15 slide bars, 16 sliding sleeves, 17 first sliding blocks, 18 first sliding grooves, 19 second link blocks, 20 connectors, 21 limits
Position slot, 22 rotating devices, 221 bearings, 222 shafts, 223 fixed blocks, 23 third link blocks, 24 second sliding slots, 25 second sliding blocks,
26 heat pipes.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figs 1-4, the utility model provides a kind of technical solution: a kind of stacking type semiconductor chip package, packet
Include first shell 1, the right side of first shell 1 is fixedly connected with the second link block 19, the lower surface of the second link block 19 and the
The upper surface of one sliding block 17 is fixedly connected, and by the second link block 19 of setting and the first sliding block 17, first shell 1 is in second shell
The first sliding block 17 is driven to slide when 2 upper surface slide in first sliding groove 18, so as to prevent first shell 1 mobile
Sidesway occurs in the process, so as to play the role of protecting chip body 4, the first sliding block 17 is arranged on the first link block 11
In the first sliding groove 18 that surface opens up, the left side of the first link block 11 is fixedly connected on the right side of second shell 2, and first is sliding
The side of block 17 is connected with sliding sleeve 16, and slide bar 15 is socketed in sliding sleeve 16, by setting slide bar 15 and sliding sleeve 16, pushes first shell
Body 1 slides to the left, drives sliding sleeve 16 to separate with slide bar 15 during the second link block 19 is mobile, consequently facilitating first shell 1
It is center of circle rotation with shaft 222, so as to improve the sealing performance of the utility model, the right end of slide bar 15 passes through the first connection
The second through-hole 12 that 11 right side of block opens up simultaneously is fixedly connected with the left side of handle 13.
The outer surface of slide bar 15 is socketed with second spring 14, the right side of one end of second spring 14 and the first link block 11
It is fixedly connected, the other end of second spring 14 is fixedly connected with the left side of handle 13, by the way that second spring 14, the second bullet is arranged
Spring 14 has the function of resetting, so as to pull slide bar 15 to slide to the left in sliding sleeve 16, so as to improve first shell 1
With the fixed effect between second shell 2, the lower surface of the first sliding block 17 is connected with nut 10, and 10 internal screw thread of nut is connected with spiral shell
Bolt 9, and the bottom end of bolt 9 passes through the first through hole 8 that opens up of 18 interior lower surface of first sliding groove and extends to the first link block
11 lower surface is consolidated by setting nut 10 and bolt 9, the small volume of chip body 4 by using a nut 10
Dingan County's dress, not only reduces the work difficulty of people, also reduces the production cost of producer, the left side of first shell 1 is fixed
It is connected with connector 20, the shape of connector 20 is L-type, and the size of connector 20 is less than the size of limiting slot 21, passes through setting
Connector 20, first shell 1 connect into an entirety by connector 20 and second shell 2, can not only prevent first shell 1
It loses, is also convenient for people and the utility model is safeguarded, it is close between first shell 1 and second shell 2 so as to improve
Feng Xing, improve its leakproofness can influence of the pre- dust protection to chip body 4, so as to extend chip body 4 use the longevity
Life, the lower surface of connector 20 are fixedly connected with the upper surface of rotating device 22, and rotating device 22 includes two fixed blocks 223,
And the lower surface of two fixed blocks 223 is fixedly connected in the upper surface of the second sliding block 25, and the opposite face of two fixed blocks 223
It is connected with bearing 221, and is socketed with shaft 222 in two bearings 221, the upper surface of shaft 222 and the following table of connector 20
Face is fixedly connected, and by the way that rotating device 22 is arranged, first shell 1 is center of circle rotation with shaft 222, is not only convenient for people to this reality
It is safeguarded with novel, the loss of first shell 1 can also be prevented, and rotating device 22 is located at 23 upper surface of third link block and opens
If limiting slot 21 in.
The lower surface of rotating device 22 is fixedly connected on the upper surface of the second sliding block 25, and the second sliding block 25 is slidably connected at limit
In the second sliding slot 24 that opens up of position 21 interior lower surface of slot, second sliding slot 24 be it is T-shaped, the second sliding block 25 be it is T-shaped, by setting
Set second sliding slot 24 and the second sliding block 25, the shape of second sliding slot 24 and the second sliding block 25 be it is T-shaped, so as to prevent
One shell 1 sidesway during sliding, so as to play the role of protecting chip body 4, the right side of third link block 23
Face is fixedly connected on the left side of second shell 2, and the lower surface of first shell 1 and the upper surface of second shell 2 overlap, the
The side and lower surface of two shells 2 are provided with several welding pins 3, and the front of first shell 1 and second shell 2 is respectively provided with
There is heat pipe 26, by setting heat pipe 26, is radiated by using heat pipe 26, so as to avoid radiating using flabellum,
The volume that the utility model can not only be reduced can also reduce the noise of the utility model generation, so as to increase people
Experience effect, the two sides of 2 inner wall of first shell 1 and second shell offer several spherical grooves 7, and two are opposite
Spherical groove 7 in be provided with metal ball 6, and two opposite sides of metal ball 6 are fixedly connected to elastic device 5, bullet
Property device 5 include telescopic rod 51, the outer surface of telescopic rod 51 is socketed with the first spring 52, the one of telescopic rod 51 and the first spring 52
End is fixedly connected with the side of chip body 4, the fixed company of the other end of telescopic rod 51 and the first spring 52 and the side of metal ball 6
It connects, by the way that elastic device 5 is arranged, chip body 4 is fixed on two opposite balls by elastic device 5 and the combination of metal ball 6
In connected in star 7, and multiple groups spherical groove 7 is offered in first shell 1 and second shell 2, people can be according to chip body 4
Working performance the distance between its is adjusted, so as to provide a better running space, and two for chip body 4
One end similar in a elastic device 5 is fixedly connected by chip body 4.
In use, when needing to make the first when the inside of first shell 1 and second shell 2 carries out chip ontology 4
The lower surface of one shell 1 is separated with the upper surface of second shell 2, and people with rotating bolt 9 and can be such that bolt 9 divides with nut 10
From then people can push first shell 1 to slide to the left, drive sliding sleeve 16 and slide bar during the second link block 19 is mobile
15 separation, consequently facilitating first shell 1 is center of circle rotation with shaft 222, people can also be moved right by pull handle 13
Separate sliding sleeve 16 with slide bar 15, people can select unfolding mode, second sliding slot 24 with working environment according to the present utility model
Shape with the second sliding block 25 be it is T-shaped, so as to prevent sidesway during sliding of first shell 1, so as to
Play the role of protecting chip body 4, chip body 4 combined by elastic device 5 and metal ball 6 be fixed on two it is opposite
In spherical groove 7, and multiple groups spherical groove 7 is offered in first shell 1 and second shell 2, people can be according to chip sheet
The distance between its is adjusted in the working performance of body 4, and chip body 4 can generate heat in the process of running, and heat pipe 26, which has, to be dissipated
The effect of heat can not only reduce the volume of the utility model so as to avoid radiating using flabellum, can also reduce
The noise that the utility model generates, so as to increase the experience effect of people.
It can to sum up obtain, (1), the stacking type semiconductor chip package, pass through the first link block 11, first sliding groove 18,
One sliding block 17, the second link block 19, nut 10, bolt 9, first through hole 8, the second through-hole 12, sliding sleeve 16, slide bar 15, the second bullet
Cooperation between spring 14, handle 13, rotating device 22, second sliding slot 24, the second sliding block 25, limiting slot 21 and connector 20, when
When the lower surface for making first shell 1 being needed to separate with the upper surface of second shell 2, people can be with rotating bolt 9, and chip body
4 small volume is fixed installation by using a nut 10, not only reduces the work difficulty of people, also reduce
The production cost of producer, then people can push first shell 1 to slide to the left, drive during the second link block 19 is mobile
Sliding sleeve 16 is separated with slide bar 15, consequently facilitating first shell 1 is center of circle rotation with shaft 222, people can also be by pulling handle
Hand 13, which moves right, separates sliding sleeve 16 with slide bar 15, the shape of second sliding slot 24 and the second sliding block 25 be it is T-shaped, so as to
To prevent sidesway during sliding of first shell 1, so as to play the role of protecting chip body 4, first shell 1 is logical
It crosses connector 20 and second shell 2 connects into an entirety, the loss of first shell 1 can not only be prevented, be also convenient for people to this
Utility model is safeguarded that, so as to improve the leakproofness between first shell 1 and second shell 2, improving its leakproofness can
Influence with pre- dust protection to chip body 4, so as to extend the service life of chip body 4.
(2), the stacking type semiconductor chip package passes through elastic device 5, metal ball 6, spherical groove 7, first shell
Cooperation between 1 and second shell 2, chip body 4 combined by elastic device 5 and metal ball 6 be fixed on two it is opposite
In spherical groove 7, and multiple groups spherical groove 7 is offered in first shell 1 and second shell 2, people can be according to chip sheet
The distance between its is adjusted in the working performance of body 4, so as to provide a better running space for chip body 4.
(3), the stacking type semiconductor chip package, by the way that heat pipe 26 is arranged, heat pipe 26 has the function of heat dissipation, passes through
It is radiated using heat pipe 26, so as to avoid radiating using flabellum, can not only reduce the volume of the utility model,
The noise of the utility model generation can also be reduced, so as to increase the experience effect of people, and the utility model structure is tight
It gathers, design is rationally, practical.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of stacking type semiconductor chip package, including first shell (1), it is characterised in that: the first shell (1)
Right side is fixedly connected with the second link block (19), the lower surface of second link block (19) and the upper table of the first sliding block (17)
Face is fixedly connected, and the first sliding block (17) setting is in the first sliding groove (18) that the first link block (11) upper surface opens up, institute
The left side for stating the first link block (11) is fixedly connected on the right side of second shell (2), the side of first sliding block (17)
It is connected with sliding sleeve (16), is socketed with slide bar (15) in the sliding sleeve (16), the right end of the slide bar (15) passes through the first link block
(11) right side opens up the second through-hole (12) is simultaneously fixedly connected with the left side of handle (13)；
The outer surface of the slide bar (15) is socketed with second spring (14), one end of the second spring (14) and the first link block
(11) right side is fixedly connected, and the other end of the second spring (14) is fixedly connected with the left side of handle (13), described
The lower surface of first sliding block (17) is connected with nut (10), and nut (10) internal screw thread is connected with bolt (9), and bolt
(9) bottom end passes through the first through hole (8) that first sliding groove (18) interior lower surface opens up and extends to the first link block (11)
The left side of lower surface, the first shell (1) is fixedly connected with connector (20), the lower surface of the connector (20) with turn
The upper surface of dynamic device (22) is fixedly connected, and rotating device (22) is located at the limit that third link block (23) upper surface opens up
In slot (21)；
The lower surface of the rotating device (22) is fixedly connected on the upper surface of the second sliding block (25), and second sliding block (25) is sliding
Dynamic to be connected in the second sliding slot (24) that limiting slot (21) interior lower surface opens up, the right side of the third link block (23) is solid
Surely it is connected to the left side of second shell (2), and the upper surface of the lower surface of first shell (1) and second shell (2) overlaps,
The two sides of the first shell (1) and second shell (2) inner wall offer several spherical grooves (7), and two opposite
Spherical groove (7) in be provided with metal ball (6), and two opposite sides of metal ball (6) are fixedly connected with flexible dress
It sets (5), and one end similar in two elastic devices (5) is fixedly connected by chip body (4).
2. a kind of stacking type semiconductor chip package according to claim 1, it is characterised in that: the elastic device
It (5) include telescopic rod (51), the outer surface of the telescopic rod (51) is socketed with the first spring (52), the telescopic rod (51) and
One end of one spring (52) is fixedly connected with the side of chip body (4), the telescopic rod (51) and the first spring (52) it is another
One end is fixedly connected with the side of metal ball (6).
3. a kind of stacking type semiconductor chip package according to claim 1, it is characterised in that: the rotating device
It (22) include two fixed blocks (223), and the lower surface of two fixed blocks (223) is fixedly connected in the upper of the second sliding block (25)
Surface, and the opposite face of two fixed blocks (223) is connected with bearing (221), and is socketed with shaft in two bearings (221)
(222), the upper surface of the shaft (222) is fixedly connected with the lower surface of connector (20).
4. a kind of stacking type semiconductor chip package according to claim 1, it is characterised in that: the second sliding slot
(24) to be T-shaped, second sliding block (25) is T-shaped.
5. a kind of stacking type semiconductor chip package according to claim 1, it is characterised in that: the second shell
(2) side and lower surface is provided with several welding pins (3), the front of the first shell (1) and second shell (2)
It is provided with heat pipe (26).
6. a kind of stacking type semiconductor chip package according to claim 1, it is characterised in that: the connector (20)
Shape be L-type, the size of the connector (20) is less than the size of limiting slot (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820619266.8U CN208521914U (en) | 2018-04-27 | 2018-04-27 | A kind of stacking type semiconductor chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820619266.8U CN208521914U (en) | 2018-04-27 | 2018-04-27 | A kind of stacking type semiconductor chip package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208521914U true CN208521914U (en) | 2019-02-19 |
Family
ID=65342143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820619266.8U Expired - Fee Related CN208521914U (en) | 2018-04-27 | 2018-04-27 | A kind of stacking type semiconductor chip package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208521914U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113636195A (en) * | 2021-07-16 | 2021-11-12 | 极研(福建)信息科技有限公司 | Packaging box for embedded intelligent chip |
-
2018
- 2018-04-27 CN CN201820619266.8U patent/CN208521914U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113636195A (en) * | 2021-07-16 | 2021-11-12 | 极研(福建)信息科技有限公司 | Packaging box for embedded intelligent chip |
| CN113636195B (en) * | 2021-07-16 | 2023-04-18 | 极研(福建)信息科技有限公司 | Packaging box for embedded intelligent chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208521914U (en) | A kind of stacking type semiconductor chip package | |
| CN112181095A (en) | Computer mainframe who possesses heat dissipation function | |
| CN105664464A (en) | Volleyball feeding device | |
| CN209297232U (en) | A kind of movable cabinet | |
| CN209374865U (en) | A kind of knob hardware buckle | |
| CN204226229U (en) | Integrated electric centrifugal blower | |
| CN207308004U (en) | A kind of good paint grinder mill that radiates | |
| CN107806304A (en) | A kind of attachment structure for the electronic strut guide rod of automobile tail gate and bulb | |
| CN208889964U (en) | A kind of dust-proof damping slot of computer | |
| CN208547785U (en) | A kind of liquid crystal display die set test board | |
| CN208673264U (en) | A kind of radiator | |
| CN208262384U (en) | A kind of Novel structure high speed headstock | |
| CN113504816A (en) | Computer machine case that radiating effect is good | |
| CN208241998U (en) | A kind of chip mounter nozzle unit | |
| CN212305773U (en) | Plug-in type multilayer circuit board | |
| CN108966586A (en) | The high electric power overhaul cabinet shell of radiating efficiency | |
| CN206602257U (en) | A kind of absorption type rotates wiring board | |
| CN210599419U (en) | Single-stage vertical compressor | |
| CN209026003U (en) | Lockable globe joint | |
| CN207806730U (en) | A kind of work head | |
| CN209648637U (en) | A kind of modified portable barcode scanning gun | |
| CN206259528U (en) | A kind of high current cage band spring socket | |
| CN207321770U (en) | A kind of casing easy to heat dissipation | |
| CN109114100A (en) | Lockable globe joint | |
| CN209007272U (en) | A kind of regular size metal parts surface processing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190219 Termination date: 20210427 |