CN113635169A - Burr trimming mechanism and polishing device - Google Patents
Burr trimming mechanism and polishing device Download PDFInfo
- Publication number
- CN113635169A CN113635169A CN202110912594.3A CN202110912594A CN113635169A CN 113635169 A CN113635169 A CN 113635169A CN 202110912594 A CN202110912594 A CN 202110912594A CN 113635169 A CN113635169 A CN 113635169A
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- base
- polishing
- burr
- burr trimming
- mounting
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- 238000005498 polishing Methods 0.000 title claims abstract description 123
- 230000007246 mechanism Effects 0.000 title claims abstract description 72
- 238000009966 trimming Methods 0.000 title claims abstract description 70
- 238000000227 grinding Methods 0.000 claims description 67
- 239000007788 liquid Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 abstract description 12
- 239000010980 sapphire Substances 0.000 abstract description 12
- 239000000758 substrate Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 description 4
- 230000008439 repair process Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/04—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of metal, e.g. skate blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention relates to the technical field of deburring, and discloses a burr trimming mechanism and a polishing device, wherein the burr trimming mechanism comprises a base and a burr trimming body arranged on the base, the burr trimming body is provided with a burr trimming surface, and the burr trimming surface comprises: the base is set to be capable of driving the burr trimming body to reciprocate on the surface to be trimmed so that the burr trimming surface grinds burrs of the surface to be trimmed. Through set up above-mentioned burr in burnishing device and repairment the mechanism, can grind the burr of the polishing dish among the burnishing device, the scratch wearing and tearing of treating the polishing piece when having significantly reduced the polishing dish and treating the polishing piece like sapphire substrate wafer and carrying out polishing operation from this.
Description
Technical Field
The invention relates to the technical field of deburring, in particular to a deburring mechanism and a polishing device.
Background
The mechanical parts can generate burrs during machining processes such as cutting, casting, die forging, welding extrusion and the like. The presence of burrs directly affects the quality of the product, and therefore, it is necessary to remove the burrs from the machine parts.
Taking the production of a sapphire substrate wafer as an example, polishing is an important link in the processing process of the sapphire substrate wafer, and in the actual processing process, the sapphire substrate wafer can be polished by using a polishing disc, so that the purpose of grinding and thinning the sapphire substrate wafer can be achieved.
Currently, polishing disks are primarily made from resin. In order to improve the thinning effect of the polishing disk, a metal disk is used instead of the polishing disk made of resin. However, the metal plate may generate burrs during the preparation process, thereby scratching the sapphire substrate wafer.
Disclosure of Invention
The invention aims to provide a burr trimming mechanism which is provided with a burr trimming body, wherein the burr trimming body can reciprocate under the driving of a base to grind burrs on a surface to be trimmed.
In order to achieve the above object, an aspect of the present invention provides a burr trimming mechanism including a base and a burr trimming body provided on the base, the burr trimming body having a burr trimming surface, wherein: the base is set to be capable of driving the burr trimming body to reciprocate on the surface to be trimmed so that the burr trimming surface grinds burrs of the surface to be trimmed.
Above-mentioned technical scheme is repaiied wholly through setting up the burr on the base to make the base can drive the burr and repair whole reciprocating motion in treating the face of repairing, thereby can make the burr repair holistic burr repair face can grind the burr of treating the repair face.
Preferably, the burr trimming body includes an annular grinding ring provided to the base, and a surface of the grinding ring facing away from the base is formed as the burr trimming surface, wherein: the base is set to be capable of driving the grinding ring to reciprocate on the surface to be trimmed so that the burr trimming surface grinds burrs of the surface to be trimmed.
Preferably, the grinding ring comprises a plurality of grinding blocks which jointly enclose to form the grinding ring, and a gap is arranged between the adjacent grinding blocks, wherein: the faces of the plurality of grinding blocks facing away from the base together form the burr trimming face.
Preferably, the base is a metal piece; and/or
The base is annular.
Preferably, the grinding ring is a ceramic piece.
Preferably, the thickness of the grinding ring is 0.2-0.4 times of the thickness of the base; and/or
The ratio of the inner diameter of the grinding ring to the outer diameter of the grinding ring is as follows: and (0.70-0.95) the outer diameter is 1.
Preferably, said deburring mechanism includes a connecting assembly defining said base to a surface to be mounted, said connecting assembly including a connecting rod connecting said base and said surface to be mounted; and/or
The base can be connected with a rotating mechanism, and the rotating mechanism can drive the base to rotate in the surface to be trimmed.
A second aspect of the present invention provides a polishing apparatus having disposed therein; the invention provides a burr trimming mechanism. The burr trimming mechanism provided by the invention is arranged in the polishing device, so that burrs of a polishing disc in the polishing device can be ground, and the scratch and abrasion of a workpiece to be polished when the polishing disc polishes the workpiece to be polished, such as a sapphire substrate wafer, are greatly reduced.
Preferably, the polishing apparatus includes:
a polishing disk;
the mounting body can receive a piece to be polished, and is arranged opposite to the polishing disk; and
the rotating mechanism comprises a rotating shaft connected with the mounting body, the rotating shaft is perpendicular to the mounting body, and the rotating shaft can drive the mounting body to rotate on the polishing disc so as to polish the piece to be polished; wherein: the base is connected to the mounting body.
Preferably, the polishing disc comprises a polishing disc main body and an accommodating groove arranged on the surface of the polishing disc main body facing the mounting body, the accommodating groove can accommodate polishing liquid, and the accommodating groove is in a spiral shape in the radial direction of the polishing disc.
Preferably, the base is annular, the base is sleeved outside the mounting body and connected to the mounting body, the burr trimming body includes an annular grinding ring disposed on a surface of the base facing the polishing pad, and a surface of the grinding ring facing away from the base forms the burr trimming surface.
Preferably, the grinding ring comprises a plurality of grinding blocks which jointly enclose to form the grinding ring, and a gap is arranged between the adjacent grinding blocks, wherein: the faces of the plurality of grinding blocks facing away from the base together form the burr trimming face.
Preferably, the mounting body includes a mounting plate connected to the rotating shaft and a receiving plate provided on a surface of the mounting plate facing the polishing plate, the receiving plate being capable of receiving the member to be polished, the mounting plate being provided with a through hole extending in a thickness direction of the mounting plate;
burnishing device includes ejection mechanism, ejection mechanism including insert locate the ejecting rod of through-hole, set up in the mounting panel the mount pad and articulate through the articulated shaft in the operating parts of mount pad, the articulated shaft is on a parallel with the quotation of mounting panel, wherein: the operating piece is in a flat lying state separated from the ejecting rod, and rotates around the hinge shaft after being pulled so that the end part of the operating piece, which is far away from the stressed end, presses the ejecting rod to enable the ejecting rod to move towards the bearing disc and eject the bearing disc.
Drawings
Fig. 1 is a partial structural schematic view of a polishing apparatus according to a preferred embodiment of the present invention, in which a burr dressing mechanism according to a preferred embodiment of the present invention is provided;
fig. 2 is a schematic view of the entire structure of an ejection mechanism of the polishing apparatus shown in fig. 1;
FIG. 3 is a front view schematic diagram of a preferred embodiment flash trimming mechanism of the present invention;
fig. 4 is a schematic diagram of a partial side view of the flash trimming mechanism of fig. 3.
Description of the reference numerals
10-a burr trimming mechanism; 12-a base; 14-integrally trimming burrs; 140-grinding ring; 142-a grinding block; 144-gap; 16-a connecting assembly; 160-a mounting block; 162-a connecting rod; 20-a polishing device; 24-a mounting body; (ii) a 26-a rotation mechanism; 28-an ejection mechanism; 280-ejector pin; 282-a mounting base; 284-an operator; 286-pull rod.
Detailed Description
In the present invention, the use of directional terms such as "upper, lower, left and right" in the absence of a contrary explanation generally means that the directions shown in the drawings and the practical application are considered to be the same, and "inner and outer" mean the inner and outer of the outline of the component.
The invention provides a burr trimming mechanism, the burr trimming mechanism 10 comprises a base 12 and a burr trimming body 14 arranged on the base 12, the burr trimming body 14 is provided with a burr trimming surface, wherein: the base 12 is arranged to drive the burr trimming body 14 to reciprocate on the surface to be trimmed so that the burr trimming surface can grind burrs on the surface to be trimmed, and it can be understood that in the process of trimming burrs, the burr trimming surface can face the surface to be trimmed with burrs, and the base 12 can drive the burr trimming body 14 to rotate in the surface to be trimmed so that burrs on the surface to be trimmed can be ground; in addition, as shown in fig. 1, the base 12 may be configured to be capable of being connected to a rotating mechanism, the rotating mechanism may be capable of driving the base 12 to perform a rotating motion in the surface to be trimmed, an axis of a rotating shaft of the rotating mechanism may be perpendicular to the base 12, and thus, the base 12 may perform a rotating motion around the axis of the rotating shaft, where the rotating mechanism may be a component capable of driving a member to be polished to rotate in the polishing apparatus, and thus it can be further understood that when the deburring mechanism 10 is applied to the polishing apparatus 20, a top surface of a polishing disc of the polishing apparatus 20 may be the surface to be trimmed, and details about the polishing apparatus will be described later, and will not be described herein again. The whole 14 is trimmed by the burrs arranged on the base 12, and the base 12 can drive the whole 14 to reciprocate in the surface to be trimmed, so that the burr trimming surface of the whole 14 can grind and remove the burrs on the surface to be trimmed. It should be noted that the deburring mechanism 10 is particularly suitable for deburring a polishing disk of a polishing apparatus to remove burrs from the polishing disk.
As shown in fig. 3 and 4 in combination, the deburring unit 14 may include a grinding ring 140 disposed on the base 12, the grinding ring 140 may be ring-shaped, and a surface of the grinding ring 140 facing away from the base 12 may be formed as a deburring surface, wherein: the base 12 can be configured to drive the grinding ring 140 to reciprocate in the surface to be trimmed so that the burr trimming surface grinds off burrs of the surface to be trimmed, for example, the base 12 can be configured to drive the grinding ring 140 to rotate in the surface to be trimmed. Through setting up grinding ring 140, not only can grind the burr of treating the face of repaieing, can reduce the burr moreover and repaire the whole 14 and treat the area of contact between the face of repaieing, reducible burr from this repaiies the whole 14 and treats the friction between the face of repaieing to the probability that the face of repairing appears bulging deformation has been reduced. The grinding ring 140 may be a ceramic member, that is, the grinding ring 140 may be made of a ceramic material, so that the wear resistance of the grinding ring 140 may be improved, and the surface to be repaired may not be damaged substantially when the burr is removed.
It should be noted that, when the burr of the surface to be trimmed is removed, a liquid such as a polishing liquid may be applied to the surface to be trimmed to reduce friction between the burr trimming body 14 and the surface to be trimmed.
The grinding ring 140 may include a plurality of grinding blocks 142, the plurality of grinding blocks 142 may be enclosed together to form the grinding ring 140, a gap 144 may be disposed between adjacent grinding blocks 142, the gap 144 may be used for a liquid such as a polishing liquid to pass through to ensure that the polishing liquid is uniformly distributed on the surface to be modified, wherein: the faces of the plurality of abrading blocks 142 facing away from the base 12 may collectively be formed as a burr trimming face. The grinding block 142 may be fastened to the base 12 by fasteners such as bolts.
To ensure the overall strength of burr trimming mechanism 10, base 12 may be a metal piece, for example, base 12 may be a stainless steel piece; in addition, the base 12 may be annular, which is convenient for the base 12 to be installed, for example, the base 12 may be sleeved outside a mounting disc that is connected to the rotating mechanism and can receive the polishing object, so that when the rotating mechanism drives the mounting disc to rotate, the base 12 may be driven to rotate at the same time, and in addition, the mounting disc will be described later, and will not be described herein again.
In addition, the thickness of the grinding ring 140 may be 0.2 times to 0.4 times the thickness of the base 12, which may allow the burr trimming mechanism 10 to be of reasonable size to facilitate installation and use of the burr trimming mechanism 10. Further, the ratio of the inner diameter of the grinding ring 140 to the outer diameter of the grinding ring 140 is the inner diameter: the outer diameter (0.70-0.95):1, so that the burr trimming surface of the grinding ring 140 has a reasonable trimming area, the burr removing effect is ensured, the friction area is reduced as much as possible, and the probability of expansion deformation of the surface to be trimmed is further reduced.
As shown in fig. 1, a connecting assembly 16 may be provided that is capable of defining the base 12 to a surface to be mounted, that is, the connecting assembly 16 may define the base 12 to the surface to be mounted, and the surface to be mounted may be connected to the rotating mechanism, thereby enabling connection of the base 12 to the rotating mechanism so that the rotating mechanism brings the base 12 into rotational motion, for example, when the deburring mechanism 10 is applied to the polishing apparatus 20, the base 12 may be defined to a mounting plate by the connecting assembly 16, it being understood that the surface of the mounting plate facing away from the polishing plate may be the surface to be mounted, wherein: the connecting assembly 16 may include a connecting rod 162 connecting the base 12 and the surface to be mounted, wherein both ends of the connecting rod 162 may be fastened to the base 12 and the surface to be mounted, respectively, by corresponding fasteners such as bolts.
In addition, to facilitate mounting of the connecting rod 162 to the base 12, a mounting block 160 may be provided on the base 12, and a mounting hole may be provided on the base 12, such that a fastener may pass through the connecting rod 162 and the mounting hole to define a respective end of the connecting rod 162 to the mounting block 160.
The invention provides a polishing device, and a polishing device 20 is provided with the burr trimming mechanism 10 provided by the invention. By providing the burr trimming mechanism 10 provided by the present invention in the polishing apparatus 20, burrs of the polishing pad in the polishing apparatus 20 can be removed, thereby greatly reducing the scratching and abrasion of the polishing pad to the member to be polished such as a sapphire substrate wafer when the polishing pad performs a polishing operation on the member to be polished. In addition, the rotating mechanism of the polishing device 20 can drive the burr trimming mechanism 10 to rotate, so that the existing components of the polishing device 20 can drive the burr trimming mechanism 10 to reciprocate, and the structure of the whole device is simple.
As shown in fig. 1, the polishing apparatus 20 may include a polishing disk, a mounting body 24, and a rotating mechanism 26. Wherein the polishing disk can be configured to rotate around the central axis of the polishing disk 22 for better polishing of the workpiece to be polished, it can be understood that a rotating shaft can be provided on the polishing disk 22, and the axis of the rotating shaft can be perpendicular to the polishing disk 22; the mounting body 24 can be configured to receive a member to be polished, when the member to be polished is a sapphire substrate wafer, the sapphire substrate wafer can be attached to the surface of the mounting body 24 facing the polishing disk 22, and the mounting body 24 can be arranged opposite to the polishing disk 22; the rotating mechanism 26 may include a rotating shaft connected to the mounting body 24, and in addition, a sleeve may be sleeved outside the rotating shaft to effectively protect the rotating shaft, the rotating shaft may be perpendicular to the mounting body 24, and the rotating shaft can drive the mounting body 24 to rotate on the polishing disc 22 to polish the workpiece to be polished; wherein: the base 12 can be connected to the mounting body 24, and the base 12 can be connected to the mounting body 24 by the connecting assembly 16, as the connection method is described in detail in the foregoing, and will not be described again. Among other things, the polishing disc 22 may be a metal member such as a copper member.
In addition, a telescopic mechanism such as an air cylinder can be disposed on the rotating mechanism 26, and the telescopic mechanism can drive the rotating mechanism 26 to move along the axial direction of the rotating shaft, so that the mounting body 24 can move towards the polishing disk, and thus, the mounting body 24 can be conveniently provided with a piece to be polished. When the workpiece to be polished needs to be polished, the workpiece to be polished can be assembled on the surface of the mounting body 24 facing the polishing disk; afterwards, the telescopic mechanism can drive the mounting body 24 to move towards the polishing disk, and after the mounting body 24 moves to a proper position, the rotating mechanism 26 drives the mounting body 24 to rotate on the polishing disk, so that the polishing operation can be performed on the workpiece to be polished, and the surface of the workpiece to be polished, which faces towards the polishing disk, is formed into a smooth surface.
The polishing dish can include the polishing dish main part and set up in the holding recess of the face of the orientation installation body 24 of polishing dish main part, and the holding recess can hold the polishing solution, through spreading the polishing solution to the holding recess in, can treat that the polishing piece carries out better polishing to make the polishing piece be difficult by the wearing and tearing fish tail, can also improve polishing efficiency simultaneously, the holding recess can be in the form of spiraling along the radial direction of polishing dish. Wherein the polishing solution can be an aqueous or oily suspension containing solid particles. It should be noted that, the polishing solution can be introduced into the accommodating groove through the pipeline, and under the rotation action of the polishing disk, the polishing solution can be uniformly distributed in the spiral accommodating groove.
The base 12 may be annular, the base 12 may be sleeved outside the mounting body 24, the base 12 may be connected to the mounting body 24, the deburring unit 14 may include an annular polishing ring 140 disposed on a surface of the base 12 facing the polishing platen, and a surface of the polishing ring 140 facing away from the base 12 may be a deburring surface. By sleeving the annular base 12 outside the mounting body 24, the rotating mechanism 26 of the polishing apparatus 20 can drive the base 12 to rotate so that the grinding ring 140 can grind off burrs of the polishing disc.
Preferably, the grinding ring 140 may include a plurality of grinding blocks 142, the plurality of grinding blocks 142 may collectively enclose to form the grinding ring 140, a gap 144 may be disposed between adjacent grinding blocks 142, the gap 144 may allow polishing liquid to pass through, so that the polishing liquid can be uniformly distributed on the polishing disk, the gap 144 may be disposed without substantially affecting the uniformity of the distribution of the polishing liquid, wherein: the faces of the plurality of abrading blocks 142 facing away from the base 12 may collectively be formed as a burr trimming face. The plurality of gaps 144 may be evenly distributed along the circumference of the grinding ring 140.
For the convenience of treating the assembly of polishing piece, the installation body 24 can be including connecting in the mounting disc of rotation axis and setting up in the dish of accepting of the face of the orientation polishing dish of mounting disc, it can be connected with the mounting disc joint to accept the dish, for example can set up the draw-in groove on the mounting disc, and can set up the joint boss that can block the draw-in groove on accepting the dish, it can accept to treat polishing piece to accept the dish, when treating polishing piece for sapphire substrate wafer, sapphire substrate wafer can laminate in accepting the dish, the mounting disc can be provided with the through-hole that extends along the thickness direction of mounting disc. The polishing apparatus 20 may include an ejection mechanism 28 such that the catch tray is ejected by the ejection mechanism 28 to separate the catch tray from the mounting tray.
As shown in fig. 1 and 2, the ejection mechanism 28 may include an ejection rod 280 inserted into the through hole, a mounting base 282 disposed on the mounting plate, and an operating member 284 hinged to the mounting base 282 through a hinge shaft, specifically, the mounting base 282 may include a pair of mounting bodies spaced apart from each other and facing each other, both ends of the hinge shaft may be respectively connected to the pair of mounting bodies, the hinge shaft may be disposed parallel to a plate surface of the mounting plate, the operating member 284 may be sleeved on the hinge shaft and rotate around the hinge shaft, a first end of the operating member 284 may be located above the ejection rod 280, a second end of the operating member 284 may be rotated by a tensile force, and the operating member 242 may have a plate shape, wherein: the operating member 284 may be configured to have a flat lying state separated from the eject lever 280 and to rotate about the hinge axis upon being pulled such that an end portion, i.e., a first end, of the operating member 284 remote from the force-receiving end presses the eject lever 280 to move the eject lever 280 toward and eject the tray. It is understood that when the operation member 284 is in the lying state, the operation member 284 cannot be in contact with the ejector bar 280, that is, the operation member 284 does not apply a pressing force to the ejector bar 280; when it is desired to eject the tray using the eject lever 280, a pulling force may be applied to a first end of the operating member 284 to rotate the operating member 284 about the hinge axis, and during the rotation, a second end of the operating member 284 may touch the eject lever 280 and apply a pressing force to the eject lever 280, at which time the eject lever 280 moves toward the tray to eject the tray, thereby separating the tray from the mounting tray.
To facilitate the application of a pulling force to the operating member 284, a pull rod 286 can be provided on the operating member 284, and the pulling force can be applied to the operating member 284 by the pull rod 286, wherein the pull rod 286 can be vertically disposed on the operating member 284.
The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, numerous simple modifications can be made to the technical solution of the invention, including combinations of the individual specific technical features in any suitable way. The invention is not described in detail in order to avoid unnecessary repetition. Such simple modifications and combinations should be considered within the scope of the present disclosure as well.
Claims (12)
1. Burr trimming mechanism, its characterized in that, burr trimming mechanism (10) include base (12) and set up in the whole (14) is repaiied to the burr of base (12), the whole (14) is repaiied to the burr has burr trimming surface, wherein: the base (12) is set to be capable of driving the burr trimming body (14) to reciprocate on a surface to be trimmed so that burrs on the surface to be trimmed are ground by the burr trimming surface.
2. The deburring mechanism of claim 1, wherein the deburring body (14) comprises an annular grinding ring (140) provided to the base (12), a face of the grinding ring (140) facing away from the base (12) being formed as the deburring face, wherein: the base (12) is arranged to drive the grinding ring (140) to reciprocate on the surface to be trimmed so that the burr trimming surface grinds burrs of the surface to be trimmed.
3. The burr trimming mechanism of claim 2, wherein the grinding ring (140) comprises a plurality of grinding blocks (142), the plurality of grinding blocks (142) collectively enclosing to form the grinding ring (140), a gap (144) being provided between adjacent grinding blocks (142), wherein: the surfaces of the plurality of grinding blocks (142) facing away from the base (12) jointly form the burr trimming surface.
4. The burr trimming mechanism according to claim 2, characterized in that the base (12) is a metal piece; and/or
The base (12) is annular.
5. The burr trimming mechanism of claim 2, characterized in that the grinding ring (140) is a ceramic piece.
6. The burr trimming mechanism according to claim 1, characterized in that the thickness of the grinding ring (140) is 0.2-0.4 times the thickness of the base (12); and/or
The ratio of the inner diameter of the grinding ring (140) to the outer diameter of the grinding ring (140) is the inner diameter: and (0.70-0.95) the outer diameter is 1.
7. The burr trimming mechanism according to any of claims 1 to 6, characterized in that the burr trimming mechanism (10) comprises a connecting assembly (16) which defines the base (12) to a surface to be mounted, the connecting assembly (16) comprising a connecting rod (162) which connects the base (12) and the surface to be mounted; and/or
The base (12) can be connected with a rotating mechanism, and the rotating mechanism can drive the base (12) to rotate in the surface to be trimmed.
8. A polishing apparatus, characterized in that a burr dressing mechanism (10) according to claim 1 is provided in the polishing apparatus (20).
9. The polishing apparatus according to claim 8, wherein the polishing apparatus (20) comprises:
a polishing disk;
the polishing device comprises a mounting body (24), wherein the mounting body (24) can receive a piece to be polished, and the mounting body (24) is arranged opposite to the polishing disk; and
the rotating mechanism (26) comprises a rotating shaft connected to the mounting body (24), the rotating shaft is perpendicular to the mounting body (24), and the rotating shaft can drive the mounting body (24) to rotate on the polishing disk so as to polish the piece to be polished; wherein: the base (12) is connected to the mounting body (24).
10. The polishing apparatus according to claim 9, wherein the polishing disk includes a polishing disk main body and a receiving groove provided on a surface of the polishing disk main body facing the mounting body (24), the receiving groove being capable of receiving polishing liquid, the receiving groove being spiral in a radial direction along the polishing disk.
11. The polishing apparatus according to claim 10, wherein the base (12) is ring-shaped, the base (12) is fitted to an outer portion of the mounting body (24), and the base (12) is attached to the mounting body (24), the deburring unit (14) includes a ring-shaped polishing ring (140) provided on a surface of the base (12) facing the polishing platen, a surface of the polishing ring (140) facing away from the base (12) is formed as the deburring surface;
preferably, the grinding ring (140) comprises a plurality of grinding blocks (142), the grinding blocks (142) collectively enclose the grinding ring (140), and a gap (144) is arranged between adjacent grinding blocks (142), wherein: the surfaces of the plurality of grinding blocks (142) facing away from the base (12) jointly form the burr trimming surface.
12. The polishing apparatus according to any one of claims 9 to 11, wherein the mounting body (24) comprises a mounting plate attached to the rotating shaft and a receiving plate provided on a surface of the mounting plate facing the polishing plate, the receiving plate being capable of receiving the member to be polished, the mounting plate being provided with a through hole extending in a thickness direction of the mounting plate;
the polishing device (20) comprises an ejection mechanism (28), wherein the ejection mechanism (28) comprises an ejection rod (280) inserted into the through hole, a mounting base (282) arranged on the mounting disc, and an operating part (284) hinged to the mounting base (282) through a hinge shaft, the hinge shaft is parallel to the disc surface of the mounting disc, and the ejection rod is characterized in that: the operating member (284) is separated from the ejecting rod (280) in a lying state and rotates around the hinge shaft after being subjected to a pulling force, so that the end of the operating member (284) far away from the force-bearing end presses the ejecting rod (280) to enable the ejecting rod (280) to move towards the bearing disc and eject the bearing disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110912594.3A CN113635169A (en) | 2021-08-10 | 2021-08-10 | Burr trimming mechanism and polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110912594.3A CN113635169A (en) | 2021-08-10 | 2021-08-10 | Burr trimming mechanism and polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113635169A true CN113635169A (en) | 2021-11-12 |
Family
ID=78420384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110912594.3A Pending CN113635169A (en) | 2021-08-10 | 2021-08-10 | Burr trimming mechanism and polishing device |
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| CN (1) | CN113635169A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101022921A (en) * | 2004-07-26 | 2007-08-22 | 英特尔公司 | Method and apparatus for conditioning a polishing pad |
| TWI287485B (en) * | 2006-05-09 | 2007-10-01 | Powerchip Semiconductor Corp | Retaining ring with dresser for CMP |
| CN105977011A (en) * | 2016-07-04 | 2016-09-28 | 徐萍 | Stable transformer mounting structure and transformer device assembly |
| CN108555700A (en) * | 2018-05-16 | 2018-09-21 | 福建北电新材料科技有限公司 | A kind of polishing process of silicon carbide wafer |
| CN208084106U (en) * | 2018-03-13 | 2018-11-13 | 上海致领半导体科技发展有限公司 | A kind of finishing ring for polishing grinding equipment |
| CN110340742A (en) * | 2019-07-18 | 2019-10-18 | 浙江科惠医疗器械股份有限公司 | A kind of double rubbing head polishing processing devices of bioceramic spherical surface |
| CN112077743A (en) * | 2020-09-24 | 2020-12-15 | 上海新昇半导体科技有限公司 | Polishing pad dresser, polishing apparatus and method |
| CN212683566U (en) * | 2020-05-14 | 2021-03-12 | 中环领先半导体材料有限公司 | Novel polishing head for polishing machine and jig thereof |
| CN213562025U (en) * | 2020-09-18 | 2021-06-29 | 广东金意陶陶瓷集团有限公司 | Grinding disc for polishing surface of ceramic tile and polishing machine |
-
2021
- 2021-08-10 CN CN202110912594.3A patent/CN113635169A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101022921A (en) * | 2004-07-26 | 2007-08-22 | 英特尔公司 | Method and apparatus for conditioning a polishing pad |
| TWI287485B (en) * | 2006-05-09 | 2007-10-01 | Powerchip Semiconductor Corp | Retaining ring with dresser for CMP |
| CN105977011A (en) * | 2016-07-04 | 2016-09-28 | 徐萍 | Stable transformer mounting structure and transformer device assembly |
| CN208084106U (en) * | 2018-03-13 | 2018-11-13 | 上海致领半导体科技发展有限公司 | A kind of finishing ring for polishing grinding equipment |
| CN108555700A (en) * | 2018-05-16 | 2018-09-21 | 福建北电新材料科技有限公司 | A kind of polishing process of silicon carbide wafer |
| CN110340742A (en) * | 2019-07-18 | 2019-10-18 | 浙江科惠医疗器械股份有限公司 | A kind of double rubbing head polishing processing devices of bioceramic spherical surface |
| CN212683566U (en) * | 2020-05-14 | 2021-03-12 | 中环领先半导体材料有限公司 | Novel polishing head for polishing machine and jig thereof |
| CN213562025U (en) * | 2020-09-18 | 2021-06-29 | 广东金意陶陶瓷集团有限公司 | Grinding disc for polishing surface of ceramic tile and polishing machine |
| CN112077743A (en) * | 2020-09-24 | 2020-12-15 | 上海新昇半导体科技有限公司 | Polishing pad dresser, polishing apparatus and method |
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