CN112077743A - Polishing pad dresser, polishing apparatus and method - Google Patents
Polishing pad dresser, polishing apparatus and method Download PDFInfo
- Publication number
- CN112077743A CN112077743A CN202011015642.0A CN202011015642A CN112077743A CN 112077743 A CN112077743 A CN 112077743A CN 202011015642 A CN202011015642 A CN 202011015642A CN 112077743 A CN112077743 A CN 112077743A
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- Prior art keywords
- polishing
- diamond
- mounting substrate
- head
- pad
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Abstract
The invention provides a polishing pad dresser, a polishing device and a polishing method. The polishing pad dresser comprises a driving device, a mounting substrate, a diamond dressing head, a hairbrush, an elastic connecting piece and a controller, wherein the mounting substrate comprises a first surface, the diamond dressing head is arranged on the first surface of the mounting substrate, and the hairbrush is arranged on the first surface of the mounting substrate through the elastic connecting piece; the driving device is connected with the mounting substrate and the controller and used for applying pressure to the mounting substrate under the control of the controller, and the expansion degree of the elastic connecting piece changes along with the change of the pressure, so that the height of the hairbrush relative to the diamond trimming head is changed, and different trimming purposes are achieved. By adopting the invention, the diamond trimming head or the hairbrush can be flexibly switched according to the requirement in the polishing operation process, thereby being beneficial to improving the polishing effect and improving the polishing efficiency.
Description
Technical Field
The invention relates to the field of silicon wafer preparation, in particular to a polishing pad dresser, polishing equipment and a polishing method.
Background
Pad conditioners/dressers are devices used to improve the surface condition of polishing pads in the polishing of silicon wafers. Currently, pad conditioners are mainly of two types, brush and diamond. The brush type polishing pad mainly plays a role in cleaning the polishing pad, has small abrasion consumption on the polishing pad, has small influence on the uniformity of a polishing process, and is mainly used for a soft polishing pad; the diamond type mainly plays a role in improving the roughness of the polishing pad, has a certain cleaning effect, has large abrasion consumption on the polishing pad, has large influence on the uniformity of a polishing process, and is mainly used for hard polishing pads.
However, the currently mainstream polishing apparatus is only provided with a group of polishing pad dresser base and a swing arm for each polishing pad, that is, only one type of polishing pad dresser can be selected, and the simultaneous use or the alternate use of a brush type and a diamond type cannot be realized, so that the effects of cleaning and roughness improvement cannot be achieved.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a pad dresser, a polishing apparatus and a method thereof, which are used to solve the problems that the existing polishing apparatus is only equipped with a single type of dresser, and cannot realize simultaneous or alternate use of a brush type dresser and a diamond type dresser, resulting in a constant use, and cannot achieve the effects of cleaning and roughness improvement.
To achieve the above and other related objects, the present invention provides a pad dresser comprising: the diamond trimming head is arranged on the first surface of the mounting substrate, and the hairbrush is arranged on the first surface of the mounting substrate through the elastic connecting piece; the driving device is connected with the mounting substrate and the controller and used for applying pressure to the mounting substrate under the control of the controller, and the expansion degree of the elastic connecting piece changes along with the change of the pressure, so that the height of the hairbrush relative to the diamond trimming head is changed, and different trimming purposes are achieved.
Optionally, the diamond dressing head is a hollow ring, and the brush is located inside the diamond dressing head.
Optionally, the drive means comprises one of a pneumatic cylinder and an electric cylinder.
Optionally, the pad conditioner further comprises a base, the mounting substrate further comprises a second surface opposite the first surface, and the base is coupled to the second surface of the mounting substrate.
Optionally, the polishing pad dresser further comprises an adjusting arm, wherein the adjusting arm is connected with the base and electrically connected with the driving device and the controller, so that the position of the polishing pad dresser can be adjusted through the adjusting arm under the control of the controller.
Optionally, the polishing pad dresser further comprises a rotating device, wherein the rotating device is connected with the diamond dressing head and/or the brush and is used for driving the diamond dressing head and/or the brush to rotate.
Optionally, when the pressure is less than the critical pressure, the lower surface of the brush is lower than the lower surface of the diamond dressing head and contacts with the polishing pad to clean the polishing pad; when the pressure is larger than or equal to the critical pressure, the lower surface of the brush and the lower surface of the diamond dressing head are both contacted with the polishing pad, so that the polishing pad is dressed.
Optionally, the resilient connection is a spring.
The present invention also provides a polishing apparatus including the polishing pad dresser as set forth in any one of the above aspects.
The invention also provides a polishing method which is carried out according to the polishing equipment in any scheme, wherein the polishing method comprises the step of switching the diamond trimming head and the hairbrush in the polishing process so as to realize different polishing requirements on the surface of the polishing pad.
As described above, the polishing pad dresser, polishing apparatus and method of the present invention have the following advantageous effects: through the improved structural design, the diamond trimming head and the hairbrush are arranged on the polishing pad dresser at the same time, so that the diamond trimming head or the hairbrush can be flexibly switched according to the requirement in the polishing operation process, for example, higher pressure is set at the beginning stage of silicon wafer polishing to ensure that the diamond trimming head works and obtains more suitable roughness, and lower pressure is set at the ending stage of silicon wafer polishing to ensure that only the hairbrush works, so that better cleanliness can be obtained under the condition of not consuming the polishing pad. The device of the invention has simple structure and very convenient use. The invention is beneficial to improving the polishing effect and improving the polishing efficiency.
Drawings
FIG. 1 is a schematic diagram of a pad conditioner according to the present invention.
FIG. 2 is a schematic view showing the relationship between the diamond conditioning head and the brush of FIG. 1.
Fig. 3 and 4 are schematic views showing the state of fig. 1 under different pressures.
Description of the element reference numerals
11 base
12 mounting substrate
12a first surface
12b second surface
13 Diamond finishing head
14 hairbrush
15 elastic connecting piece
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
Please refer to fig. 1 to 4. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and changes or modifications of the relative relationship may be made without substantial technical changes.
As shown in fig. 1 and 2, the present invention provides a pad dresser comprising: the diamond trimming head comprises a driving device (not shown), a mounting substrate 12, a diamond trimming head 13, a brush 14, an elastic connecting piece 15 and a controller (not shown), wherein the mounting substrate 12 comprises a first surface 12a, the diamond trimming head 13 is arranged on the first surface 12a of the mounting substrate 12, the brush 14 is arranged on the first surface 12a of the mounting substrate 12 through the elastic connecting piece 15, namely one end of the elastic connecting piece 15 is connected with the first surface 12a of the mounting substrate 12, the other end of the elastic connecting piece 15 is connected with the brush 14, bristles of the brush 14 extend in a direction departing from the elastic connecting piece 15, and preferably, a distance is reserved between the brush 14 and the diamond trimming head 13 so as to ensure that the brush 14 and the diamond trimming head do not interfere with each other during working; the driving device is connected with the mounting substrate 12 and a controller, the driving device applies pressure to the mounting substrate 12 under the control of the controller, and the degree of expansion and contraction of the elastic connecting piece 15 changes along with the change of the pressure, so that the height of the brush 14 relative to the diamond trimming head 13 is changed, and different trimming purposes are achieved. For example, when the pad has a large roughness, the diamond dressing head 13 is required to be used, the elastic connection member 15 is contracted to make the lower surface of the brush 14 higher than the lower surface of the diamond dressing head 13, and when the diamond dressing head 13 is not required, the elastic connection member 15 is naturally extended to make the lower surface of the brush 14 lower than the lower surface of the diamond dressing head 13 (of course, the distance between the pad dresser and the pad is usually adjusted in this process). Through the improved structural design, the diamond trimming head and the hairbrush are arranged on the polishing pad dresser at the same time, so that the diamond trimming head or the hairbrush can be flexibly switched according to the requirement in the polishing operation process, and the roughness of the surface of the polishing pad meets different polishing requirements of an object to be polished. For example, at the beginning stage of silicon wafer polishing, higher pressure is set, so that the diamond trimming head works to obtain more suitable roughness, and at the ending stage of silicon wafer polishing, lower pressure is set, so that only the hairbrush works, and better cleanliness can be obtained under the condition of not consuming the polishing pad. The invention has simple structure and convenient use. The invention is beneficial to improving the polishing effect and improving the polishing efficiency.
Illustratively, the diamond dressing head 13 is hollow and ring-shaped, the brush 14 is located inside the diamond dressing head 13 (the elastic connecting member 15 is correspondingly located inside the diamond dressing head 13), that is, in the middle of the diamond dressing head 13, the brush head surface of the brush 14 is preferably a circular surface, and the positional relationship between the brush 14 and the diamond dressing head 13 is shown in fig. 2.
As an example, the driving means includes one of a cylinder and an electric cylinder.
Illustratively, the pad dresser further includes a base 11, the mounting substrate 12 further includes a second surface 12b opposite the first surface 12a, and the base 11 is coupled to the second surface 12b of the mounting substrate 12. Specifically, the base 11 and the mounting substrate 12 may be connected and fixed by a plurality of screws, so that corresponding screw holes are provided on the base 11 and the mounting substrate 12, and the size, thickness, number and positions of the screw holes, and the like of the mounting substrate 12 and the base 11 may be flexibly set according to requirements, which is not strictly limited in this embodiment.
The concrete structure of the diamond dressing head 13 can be set as required, and generally includes a fixed disk and a plurality of diamonds uniformly distributed (planted) on the fixed disk, and the diamond planting process can be realized according to the existing mainstream diamond dresser manufacturing mode, and is not limited in this embodiment. Similarly, the bristle setting of the brush 14 can be performed in a conventional manner, and the embodiment is not limited thereto.
By way of example, said elastic connection 15 comprises, but is not limited to, a spring, but preferably a spring. The number of the elastic connecting members 15 may be one or more, for example, 2, and 2 of the elastic connecting members 15 are symmetrically connected to both ends of the brush 14 to ensure that the brush 14 is in a horizontal state during the compression or extension of the elastic connecting members 15. The type of the elastic connection 15, for example a spring, is adapted to the pressure that can be provided by the drive.
Illustratively, the pad dresser further includes an adjustment arm (not shown) coupled to the base 11 and electrically connected to a driving device (e.g., the driving device or another separately configured driving device) and a controller, so that the position of the pad dresser is adjusted by the adjustment arm under the control of the controller. In one example, the adjustment arm comprises a support arm and a slide rail that slides on the support arm, the slide rail being connected to a drive device, the base 11 being connected to the slide rail such that the base 11 is movable along the support arm under the drive of the drive device, thereby changing the relative position of the diamond conditioning head 13 and the brush 14 with respect to the polishing pad to be polished. In another example, the adjusting arm is a telescopic arm, or the adjusting arm may be a rotatable arm, which is not limited in this embodiment.
Illustratively, the pad dresser further includes a rotating device (not shown) connected to the diamond dresser head 13 and/or the brush 14 for rotating the diamond dresser head 13 and/or the brush 14, and the polishing effect can be further improved by the rotating operation during the polishing operation.
As an example, when the pressure is less than the critical pressure, the lower surface of the brush is lower than the lower surface of the diamond dressing head and contacts with the polishing pad to clean the polishing pad; when the pressure is greater than or equal to the critical pressure, the lower surface of the brush and the lower surface of the diamond dressing head are both in contact with the polishing pad to dress the polishing pad, for example, the roughness of the polishing pad is increased by the diamond dressing head, wherein the critical pressure is a pressure value at which the diamond region of the polishing pad dresser just contacts the polishing pad, and the critical pressure is generally determined according to parameters such as the type of the elastic connecting piece, the distance between the brush and the polishing pad, and the like.
In order to make the technical solution and advantages of the present invention more clear, the following description is made of an exemplary operation of the pad dresser of the present invention with reference to the accompanying drawings.
First, under initial no-pressure, the pad dresser is in a suspended state, and neither the diamond dresser head 13 nor the lower surface of the brush 14 contacts the pad (refer to fig. 1);
the pressure value at which the diamond conditioning head 13 of the pad dresser has just contacted the polishing pad is defined as the critical pressure, e.g., 3.5 pounds;
when the pressure of the whole device is set to be 2 pounds to 3 pounds by the controller, the polishing pad dresser is pressed down to a certain degree under the action of the driving device, and as the diamond dressing head 13 and the hairbrush 14 have a certain height difference, only the hairbrush 14 contacts with the polishing pad (specifically referring to the state of figure 3), the elastic connecting piece 15 is compressed to a certain degree, the diamond dressing head 13 does not contact with the polishing pad, and the hairbrush 14 starts the cleaning operation of the polishing pad;
when the pressure of the whole device is set to be more than 4 pounds by the controller, the polishing pad dresser continues to press down, the elastic connecting piece 15 is further compressed, the diamond dressing head 13 starts to contact with the polishing pad (refer to fig. 4 specifically), and the diamond dressing head 13 also starts to perform polishing pad dressing operation;
after the corresponding polishing operation is completed, the pad dresser is removed from the polishing pad, the pressure of the elastic connecting piece 15 is released, the elastic connecting piece 15 is restored to the initial state, and the pad dresser is restored to the suspended state.
Of course, the above-described process is merely exemplary. Importantly, the polishing pad dresser can flexibly switch the diamond polishing head and the hairbrush according to requirements in the polishing operation process, thereby being beneficial to improving the polishing effect and improving the polishing efficiency.
The present invention also provides a polishing apparatus, which includes the pad dresser according to any one of the above-mentioned aspects, and of course, the polishing apparatus further includes a polishing pad, a polishing head, a polishing slurry supply device, etc., and the polishing apparatus of this embodiment is the same as the prior art except for using the pad dresser according to the above-mentioned aspect, and since the content of this portion is well known to those skilled in the art, it will not be developed in detail. The polishing equipment is suitable for polishing various products with high requirements on polishing flatness, including but not limited to semiconductor wafers, solar silicon wafers and the like.
The invention also provides a polishing method which is carried out according to the polishing equipment in any scheme, and the polishing method comprises the step of switching the diamond trimming head and the hairbrush in the polishing process so as to realize different polishing requirements on the surface of the polishing pad, thereby realizing different polishing requirements on an object to be polished. For example, at the beginning stage of silicon wafer polishing, higher pressure is set, so that the diamond trimming head starts to work to obtain more proper roughness; then, silicon chip polishing gets into the final phase, set up lower pressure, make only brush work, then can be under the condition that does not consume the polishing pad, obtain better cleanliness factor, or also can set up lower pressure earlier, so that the brush is worked earlier and is tentatively cleaned, later increase pressure so that diamond trimming head work is in order to obtain higher roughness on the polishing pad surface, and as required, diamond trimming head and brush can alternate operation many times, so that treat that the polishing thing reaches final required polishing effect. Of course, the polishing method is not limited to polishing silicon wafers, and may also be used in other polishing environments requiring high surface flatness, and is not limited in this embodiment.
In summary, the present invention provides a polishing pad dresser, a polishing apparatus and a polishing method. The polishing pad dresser driving device comprises a polishing pad dresser driving device, a mounting substrate, a diamond dressing head, a hairbrush, an elastic connecting piece and a controller, wherein the mounting substrate comprises a first surface, the diamond dressing head is arranged on the first surface of the mounting substrate, and the hairbrush is arranged on the first surface of the mounting substrate through the elastic connecting piece; the driving device is connected with the mounting substrate and the controller and used for applying pressure to the mounting substrate under the control of the controller, and the expansion degree of the elastic connecting piece changes along with the change of the pressure, so that the height of the hairbrush relative to the diamond trimming head is changed, and different trimming purposes are achieved. Through the improved structural design, the diamond trimming head and the hairbrush are arranged on the polishing pad dresser at the same time, so that the diamond trimming head or the hairbrush can be flexibly switched according to requirements in the polishing operation process, the polishing effect is improved, and the polishing efficiency is improved. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A polishing pad dresser, comprising: the diamond trimming head is arranged on the first surface of the mounting substrate, and the hairbrush is arranged on the first surface of the mounting substrate through the elastic connecting piece; the driving device is connected with the mounting substrate and the controller so as to apply pressure to the mounting substrate under the control of the controller, and the expansion degree of the elastic connecting piece changes along with the change of the pressure, so that the height of the hairbrush relative to the diamond trimming head is changed, and different trimming purposes are realized.
2. The pad conditioner of claim 1 wherein said diamond conditioning head is in the form of a hollow ring and said brush is located inside said diamond conditioning head.
3. The pad conditioner of claim 1 wherein said drive means comprises one of a pneumatic cylinder and an electric cylinder.
4. The pad conditioner of claim 1 further comprising a base, said mounting substrate further comprising a second surface opposite said first surface, said base being attached to said mounting substrate second surface.
5. The pad conditioner of claim 4 further comprising an adjustment arm coupled to said base and electrically coupled to a drive device and a controller for adjusting a position of said pad conditioner via said adjustment arm under control of said controller.
6. The pad conditioner of claim 1 further comprising a rotating means coupled to said diamond conditioning head and/or said brush for rotating said diamond conditioning head and/or said brush.
7. The pad dresser of claim 1, wherein the lower surface of the brush is below the lower surface of the diamond conditioner head and in contact with the polishing pad when the pressure is less than a threshold pressure to clean the polishing pad; when the pressure is larger than or equal to the critical pressure, the lower surface of the brush and the lower surface of the diamond dressing head are both contacted with the polishing pad, so that the polishing pad is dressed.
8. The pad conditioner of claim 1 wherein said resilient coupling is a spring.
9. A polishing apparatus characterized by comprising the polishing pad dresser according to any one of claims 1 to 8.
10. A method of polishing, carried out in accordance with the polishing apparatus of claim 9, comprising switching the diamond conditioning head and brush during polishing to achieve different polishing needs on the polishing pad surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011015642.0A CN112077743A (en) | 2020-09-24 | 2020-09-24 | Polishing pad dresser, polishing apparatus and method |
| TW109146462A TW202212058A (en) | 2020-09-24 | 2020-12-28 | Polishing conditioner, polishing apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011015642.0A CN112077743A (en) | 2020-09-24 | 2020-09-24 | Polishing pad dresser, polishing apparatus and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112077743A true CN112077743A (en) | 2020-12-15 |
Family
ID=73738896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011015642.0A Pending CN112077743A (en) | 2020-09-24 | 2020-09-24 | Polishing pad dresser, polishing apparatus and method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112077743A (en) |
| TW (1) | TW202212058A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113635169A (en) * | 2021-08-10 | 2021-11-12 | 江苏吉星新材料有限公司 | Burr trimming mechanism and polishing device |
| WO2023126760A1 (en) * | 2021-12-31 | 2023-07-06 | 3M Innovative Properties Company | Pad conditioning disk with compressible circumferential layer |
| CN116872090A (en) * | 2023-09-07 | 2023-10-13 | 北京特思迪半导体设备有限公司 | Dressing disk and device for polishing wafer |
| CN117718821A (en) * | 2024-02-07 | 2024-03-19 | 华海清科股份有限公司 | Wafer grinding post-processing system, device and method and wafer thinning equipment |
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| JPH08148453A (en) * | 1994-11-24 | 1996-06-07 | Sumitomo Metal Ind Ltd | Wafer retainer |
| WO1999041038A1 (en) * | 1998-02-11 | 1999-08-19 | Applied Materials, Inc. | Groove cleaning device for chemical-mechanical polishing |
| JP2001121402A (en) * | 1999-10-29 | 2001-05-08 | Applied Materials Inc | Conditioning disc |
| US6386963B1 (en) * | 1999-10-29 | 2002-05-14 | Applied Materials, Inc. | Conditioning disk for conditioning a polishing pad |
| CN202825547U (en) * | 2012-10-11 | 2013-03-27 | 中芯国际集成电路制造(北京)有限公司 | Grinding pad finishing plate |
| US20180297170A1 (en) * | 2017-04-18 | 2018-10-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for cmp pad conditioning |
| CN110948392A (en) * | 2018-09-26 | 2020-04-03 | 坎纳钻石技术有限责任公司 | Multi-zone pad conditioning disk |
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2020
- 2020-09-24 CN CN202011015642.0A patent/CN112077743A/en active Pending
- 2020-12-28 TW TW109146462A patent/TW202212058A/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH08148453A (en) * | 1994-11-24 | 1996-06-07 | Sumitomo Metal Ind Ltd | Wafer retainer |
| WO1999041038A1 (en) * | 1998-02-11 | 1999-08-19 | Applied Materials, Inc. | Groove cleaning device for chemical-mechanical polishing |
| JP2001121402A (en) * | 1999-10-29 | 2001-05-08 | Applied Materials Inc | Conditioning disc |
| US6386963B1 (en) * | 1999-10-29 | 2002-05-14 | Applied Materials, Inc. | Conditioning disk for conditioning a polishing pad |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113635169A (en) * | 2021-08-10 | 2021-11-12 | 江苏吉星新材料有限公司 | Burr trimming mechanism and polishing device |
| WO2023126760A1 (en) * | 2021-12-31 | 2023-07-06 | 3M Innovative Properties Company | Pad conditioning disk with compressible circumferential layer |
| CN116872090A (en) * | 2023-09-07 | 2023-10-13 | 北京特思迪半导体设备有限公司 | Dressing disk and device for polishing wafer |
| CN116872090B (en) * | 2023-09-07 | 2023-11-14 | 北京特思迪半导体设备有限公司 | Dressing disk and device for polishing wafer |
| CN117718821A (en) * | 2024-02-07 | 2024-03-19 | 华海清科股份有限公司 | Wafer grinding post-processing system, device and method and wafer thinning equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202212058A (en) | 2022-04-01 |
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Application publication date: 20201215 |