CN113634579A - Waste circuit board disassembling method and device - Google Patents

Abstract

The invention discloses a method and a device for disassembling a waste circuit board. The device comprises a box body, a feed inlet gate valve, a high-temperature pulse valve, a pressure pump, a heat exchanger, a pressure sensor, a second pipeline exhaust port, an air purifier, an air suction pump, an observation window, a temperature sensor, a box body exhaust port, a discharge port gate valve, a circuit board component collecting box, a soldering tin liquid discharge valve, a soldering tin liquid collecting box, a buffer strip, a separation sieve plate, a transmission mechanism, a base, a vibrating plate, a motor, a heat preservation layer and an electric heating rod. The temperature is controlled by an electric heating method, and the required disassembling force and advancing power are provided for the circuit board in a mode of combining the vibrating plate, the high-temperature high-pressure pulse gas and the separating sieve plate, so that the soldering tin liquid and the electronic components are guaranteed to efficiently fall off from the circuit board and smoothly discharge. The invention has the advantages of compact structure, high circuit board dismounting efficiency, low equipment energy consumption, low maintenance cost and no environmental pollution, and is suitable for industrial application.

Description

Waste circuit board disassembling method and device

Technical Field

The invention belongs to the technical field of industrial waste treatment and resource regeneration, and particularly relates to a method and a device for disassembling a waste circuit board.

Background

As is well known, electronic products are used as a miniature of the rapid development of modern technologies, which brings great changes to the life style of consumers, and people prefer to use the electronic products with update iteration. The recycling of electronic waste, especially circuit boards, as an indispensable component of electronic products, is increasing in the amount of waste. The data shows that the worldwide electronic product garbage is 2000- & lt5000 million tons per year, and the electronic product garbage is increased at the rate of 3% -8% per year. By the end of 2018, China has 1.5 million electric product garbage treated every year, wherein the number of the electric product garbage treated by the electric product garbage treatment machine is 7269, the number of the electric product garbage treated by the electric product garbage treatment machine is 2953, the number of the electric product garbage treated by the electric product garbage treatment machine is 1653, the number of the electric product garbage treated by the electric product garbage treatment machine is 2334, and the number of the electric product garbage treated by the electric product garbage treatment machine is 956 is extremely large.

The waste circuit board has extremely high resource, and contains various nonferrous metals and rare and precious metals. For example, 1t of waste circuit board contains 99.99% purity gold reaching 80-1500g, 130kg copper, 40kg lead, 20kg nickel and 10kg antimony, thus having extremely high resource recovery value. On the other hand, the waste circuit boards have potential environmental hazards, for example, the waste circuit boards also contain heavy metals such as lead, chromium, cadmium, mercury and the like, and if the waste circuit boards are not treated or disposed properly, the environmental hazards can be caused. Therefore, the reasonable recycling of the waste circuit boards has very important significance for the cyclic utilization of metal resources and the environmental protection.

At present, the recovery of metal resources from waste circuit boards is a hot spot in research and application at home and abroad, and the disassembly of the waste circuit boards is the first step of resource treatment of the waste circuit boards and is also a crucial step. Currently, the mainstream technology for disassembling the waste circuit board is divided into two methods, namely physical disassembling and chemical disassembling. The physical decomposition method, such as using liquid (such as diesel oil) as heating medium, infrared heating, open fire heating iron plate, etc., can bring about the problem of secondary environmental pollution. The chemical disassembling method, for example, adopts a certain reagent (such as concentrated nitric acid) or a certain mixed reagent with a certain concentration to corrode the solder of the connecting element and the circuit board substrate, and has the advantages of long flow, high requirement on corrosion resistance of equipment, serious secondary environmental pollution and high cost. Therefore, it is necessary to develop an efficient and environment-friendly automatic disassembling device and method for waste circuit boards to realize automatic disassembling and separating of circuit board substrates and components.

The dismounting device disclosed in the Chinese patent "a dismounting device and a dismounting method of a waste circuit board" (CN112719503A) comprises a vibration box, a feed inlet gate valve, a high-temperature pulse valve, an air inlet, an air injection pipe, an air bag, an air heater, an air storage tank, an air compressor, an air outlet, an air suction pump, an air purifier, a discharge outlet gate valve, a circuit board component collecting box, a soldering tin liquid discharge valve, a soldering tin liquid collecting box, a buffer belt, a separation sieve plate, a vibrator, a spring, a vibration bottom plate, a buffer bulge, a base flat plate, an electric heating rod, a heat preservation layer and a temperature sensor. The temperature is controlled by an electric heating method, and the required disassembling force and advancing power are provided for the circuit board in a mode of combining the vibrating plate, the high-temperature high-pressure pulse gas and the separating sieve plate, so that the soldering tin liquid and the electronic components are guaranteed to efficiently fall off from the circuit board and smoothly discharge. The vibration box has the advantages of compact structure, uniform heating of the circuit board, high utilization rate of workshop space, treatment of the circuit board in a closed environment, cyclic utilization of waste gas after purification treatment, no pollution to the environment and suitability for large-scale industrial application, but the vibration box vibrates integrally, so that the power consumption is huge, the vibration box is extremely easy to damage in a long-time vibration process, the subsequent maintenance cost is improved, and meanwhile, the hearing is greatly damaged due to huge noise generated by the vibration of equipment.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention aims to provide a method and a device for disassembling a waste circuit board.

The invention provides a waste circuit board disassembling device which is compact in structure, high in circuit board disassembling efficiency, low in working energy consumption, stable in equipment performance, low in maintenance cost, low in noise in the working process, capable of recycling exhaust gas after purification, free of pollution to the environment and suitable for industrial application.

The purpose of the invention is realized by at least one of the following technical solutions.

The invention provides a waste circuit board disassembling device which comprises a box body, an air injection device, a heating device, a vibrating device, a separating sieve plate, a circuit board component collecting box and a soldering tin liquid collecting box; the gas spraying device is connected with the box body, the heating device is connected with the box body, the vibrating device is connected with the box body, and the vibrating device is connected with the separation sieve plate; the circuit board component collecting box and the soldering tin liquid collecting box are detachably connected with the bottom of the box body respectively.

Preferably, the top end of the circuit board component collecting box is provided with a discharge hole gate valve.

Preferably, the bottom of the soldering tin liquid collecting box is provided with a soldering tin liquid discharge valve.

Further, the gas injection device comprises a heat exchanger, a booster pump and a gas injection pipe; the heat exchanger is connected with a booster pump, and the booster pump is connected with an air injection pipe; the box body is provided with an observation window, a feed inlet and a box body exhaust port, and the bottom of the box body is provided with a solder liquid discharge port and a circuit board component discharge port; the separation sieve plate is located above a solder liquid discharge port, a buffer belt is arranged at the top end of the solder liquid discharge port, and the buffer belt is made of spring steel.

Preferably, the separation sieve plate is positioned right above the solder liquid discharge port, and the projection area of the separation sieve plate on the horizontal plane is larger than that of the solder liquid discharge port on the horizontal plane.

Further, the feeding hole is provided with a feeding hole gate valve; the air outlet of the box body is connected with the air inlet of the air purifier through a first pipeline, and the first pipeline is provided with an air suction pump; the air purifier's gas vent passes through the second pipeline and is connected with heat exchanger, the second pipeline is provided with the gas vent that accesss to the external world, is provided with the valve on the gas vent of second pipeline.

Furthermore, the gas injection pipe is provided with a high-temperature pulse valve, the tail end of the gas injection pipe is provided with a slit nozzle, the width of a slit of the slit nozzle is 0.05-1mm, and the depth of the slit nozzle is 2-10 mm; the vertical distance between the slit nozzle and the vibrating plate is 5-60 mm.

Preferably, the slit nozzle has the same width as that of the vibration plate, and is located directly above the vibration plate.

Further, the heating device comprises an electric heating rod, and the electric heating rod is arranged on the inner wall of the box body.

Further, the vibration device comprises a motor, a vibration plate and a transmission mechanism; the motor is connected with a vibrating plate through a transmission mechanism, the vibrating plate is arranged in the box body, and one end of the vibrating plate is connected with the separating sieve plate.

Preferably, the vibrating plate and the separating screen plate are of a rigid integral structure. When the vibrating plate works, the box body does not vibrate.

Further, the vibration plate is connected with a bottom plate of the box body through a spring; when the waste circuit board disassembling device works, the height of one end, connected with the separation sieve plate, of the vibrating plate is lower than that of the other end, not connected with the separation sieve plate, of the vibrating plate; the surface of the vibrating plate is provided with a buffer bulge; baffles are arranged on two sides of the vibrating plate.

Preferably, the vibrating plate and the baffle plate are made of the same material.

Furthermore, the periphery of the box body is provided with a heat insulation layer, and a pressure sensor and a temperature sensor are arranged in the box body; the bottom of the box body is provided with a base.

The disassembling method provided by the invention comprises the following steps: in a sealed box body for heating and insulating air medium, waste circuit boards are placed on a vibrating plate in the box body from a charging opening, the vibrating plate is continuously heated and heated until soldering tin is melted, the waste circuit board components and the melted soldering tin are continuously separated from the waste circuit boards under the vibration action of the vibrating plate, and meanwhile, the high-temperature high-pressure pulse gas accelerates the separation process; the soldering tin liquid is discharged from the filtering holes of the separating sieve plate and deposited in the soldering tin liquid collecting box, and the electronic components and the circuit board correspondingly fall into the circuit board component collecting box.

The invention provides a method for disassembling a waste circuit board by using a waste circuit board disassembling device, which specifically comprises the following steps:

(1) opening a heating device to preheat air in the box body, simultaneously opening a heat exchanger to preheat gas, then adjusting the inclination angle of a vibrating plate to enable one end, which is not connected with a separation sieve plate, of the vibrating plate to be higher than one end, which is connected with the separation sieve plate, adding the waste circuit board into the box body of the waste circuit board disassembling device through a feed inlet after the temperature of the box body meets the working condition requirement, placing the waste circuit board on the vibrating plate to be subjected to heating treatment, simultaneously spraying high-temperature high-pressure gas to the waste circuit board through a gas spraying device, moving the waste circuit board to a discharge end along with the vibration of the vibrating plate, continuously heating the waste circuit board on the vibrating plate until soldering tin is molten, separating electronic components and the molten soldering tin on the waste circuit board from the waste circuit board under the vibration action of the vibrating plate, and simultaneously, hot-air high-temperature high-pressure pulse gas is used for hot-spraying the circuit board, therefore, the process is accelerated, the soldering tin liquid is discharged through the filter holes of the separation sieve plate and deposited in the soldering tin liquid collecting box, and the electronic components and the circuit board after disassembly treatment fall into the circuit board component collecting box;

(2) the exhaust port of the box body is opened, high-temperature and high-pressure gas is discharged, the gas is purified by the air purifier (purified and dedusted), is guided into the heat exchanger and is heated into hot air required by working conditions, the hot air is introduced into the pressure pump, is pressurized by the pressure pump and then enters the box body through the gas injection pipe again to form gas recycling, and after the waste circuit board is disassembled, the gas in the box body is treated by the air purifier and then is discharged to the outside.

Further, the temperature of the heating treatment in the step (1) is 200-.

Further, the temperature of the high-temperature high-pressure gas in the step (1) is 200-.

Preferably, the angle adjustment of the vibrating plate in the step (1) can be realized by adjusting the inclination angle of the base of the box body on the one hand, and can be realized by directly adjusting the inclination angle of the vibrating plate on the other hand.

Preferably, the vibration mode of the vibration plate in the step (1) is mechanical vibration or ultrasonic vibration.

Preferably, the high-temperature high-pressure gas in the step (1) is purified air.

Preferably, the method for adding the waste circuit boards into the box body of the waste circuit board disassembling device in the step (1) is automatic feeding or manual feeding.

Compared with the prior art, the invention has the following advantages and beneficial effects:

(1) when the waste circuit board disassembling device works, only mechanical vibration or ultrasonic vibration is applied to the vibrating plate, the box body does not need to vibrate, and the power consumption of the device is greatly reduced on the premise that the soldering tin separation effect is the same;

(2) when the waste circuit board disassembling device works, the vibration parts are only the spring, the vibration plate and the separation sieve plate, and the rest parts do not vibrate, so that the stability of equipment is improved, the service life is longer, and the maintenance cost is lower;

(3) the waste circuit board disassembling device provided by the invention limits the width of the gas ejector pipe, the gap distance of the nozzle and the distance between the gas and the circuit board after leaving the nozzle, improves the efficiency of separating solder of the ejected gas, saves the consumption of high-temperature and high-pressure gas, and realizes the purposes of energy conservation and emission reduction;

(4) the waste circuit board disassembling device provided by the invention is provided with the observation window, so that the working condition in the box body can be observed at any time, the operation is convenient, and the accident can be prevented;

(5) according to the waste circuit board disassembling device provided by the invention, in the working process, only the vibration plate vibrates and the box body does not vibrate, so that the generated noise is less, and the noise treatment requirement specified by the national environmental standard GB1234-90 is met.

Drawings

Fig. 1 is a schematic structural diagram of a waste circuit board disassembling device in an embodiment of the present invention.

Fig. 2 is a schematic view of the vibrating plate structure when it is horizontally placed.

Fig. 3 is a top view of fig. 2.

Fig. 4 is a schematic view of the vibrating plate structure when it is placed obliquely.

Fig. 5 is a top view of fig. 4.

FIG. 6 is a first schematic view of a vibrating plate according to embodiment 6.

FIG. 7 is a second schematic view of the vibrating plate according to embodiment 6.

FIG. 8 is a schematic view showing a third structure of a vibration plate in example 6.

Fig. 1 includes: a box body 1; a high-temperature pulse valve 2; a pressure pump 3; a gas lance 4; a heat exchanger 5; a pressure sensor 6; the exhaust port 7 of the second duct; an air cleaner 8; a getter pump 9; an observation window 10; a temperature sensor 11; a tank exhaust port 12; a discharge port gate valve 13; a circuit board component collecting box 14; a solder liquid discharge valve 15; a soldering tin liquid collecting box 16; a buffer belt 17; a separation sieve plate 18; a spring 19; a transmission mechanism 20; a base 21; a vibrating plate 22; a motor 23; an insulating layer 24; an electric heating rod 25; a feedwell gate valve 26.

Fig. 2 includes: a vibrating plate 22; an isolation fence 22-1; the sieve plate 18 is separated.

Fig. 4 includes: a vibrating plate 22; an isolation fence 22-1; the sieve plate 18 is separated.

Fig. 6 includes: a vibrating plate 22; a baffle 27; the sieve plate 18 is separated.

Fig. 7 includes: a vibrating plate 22; a baffle 27; the sieve plate 18 is separated.

Fig. 8 includes: a vibrating plate 22; a baffle 27; the sieve plate 18 is separated.

Detailed Description

The following examples are presented to further illustrate the practice of the invention, but the practice and protection of the invention is not limited thereto. It is noted that the processes described below, if not specifically described in detail, are all realizable or understandable by those skilled in the art with reference to the prior art. The reagents or apparatus used are not indicated to the manufacturer, and are considered to be conventional products available by commercial purchase.

The waste circuit board is heated and desoldered in a mode of combining electric heating and high-temperature high-pressure pulse gas injection, and hot air flows in the box body 1, so that the temperature inside the box body 1 is uniformly distributed. The waste circuit boards enter the vibrating plate 22 in the box body 1 through the feed inlet gate valve 26 and move to the discharge end along with the vibration of the vibrating plate 22; the motor 23 drives the vibrating plate 22 to vibrate through the transmission mechanism, so that the waste circuit board continuously performs jigging motion from the feed inlet to the discharge outlet, and the melting of soldering tin and the continuous falling of components from the circuit board are realized; under the blowing action of the hot air of the air injection pipe 4, the melting and blowing of the soldering tin and the separation of components are accelerated. After passing through the separation sieve plate 18, the melted and desoldered tin solution passes through the separation sieve plate and falls into the tin solution collection box 16, and the separated mixture of the substrate and the electronic component falls into the circuit board component collection box 14 through the separation sieve plate 18; the waste heat air is discharged from an exhaust port 12 of the box body, is introduced into an air purifier 8 through an air suction pump 9 for purification and dust removal, and is heated into hot air required by working conditions through a heat exchanger 5 after purification and dust removal; the hot air is introduced into the pressurizing pump 3, is pressurized into high-temperature and high-pressure gas and then is introduced into the gas injection pipe 4, so that the recycling of the hot air is realized. The feed inlet and the discharge outlet both adopt a double-layer sealing gate valve structure, so that the sealing property of the box body 1 is ensured; the automatic disassembling full process is carried out in a sealed environment, the disassembling efficiency is high, the power consumption is low, the operation cost is low, the environment is not polluted, and the method is suitable for industrial application.

Example 1

Referring to fig. 1, the waste circuit board disassembling device comprises a box body 1, an air injection device, a heating device, a vibration device, a separation sieve plate 18, a circuit board component collecting box 14 and a soldering tin liquid collecting box 16; the air injection device is connected with the box body 1, the heating device is connected with the box body 1, the vibration device is connected with the box body 1, and the vibration device is connected with the separation sieve plate 18; the circuit board component collecting box 14 and the soldering tin liquid collecting box 16 are detachably connected with the bottom of the box body 1 respectively.

And a discharge port gate valve 13 is arranged at the top end of the circuit board component collecting box 14. The bottom of the soldering tin liquid collecting box 16 is provided with a soldering tin liquid discharge valve 15.

The gas injection device comprises a heat exchanger 5, a booster pump 3 and a gas injection pipe 4; the heat exchanger 5 is connected with a booster pump 3, and the booster pump 3 is connected with an air injection pipe 4; the box body 1 is provided with an observation window 10, a feed inlet and a box body exhaust port 12, and the bottom of the box body 1 is provided with a solder liquid discharge port and a circuit board component discharge port; the separation sieve plate 18 is positioned above the solder liquid discharge port, a buffer belt 17 is arranged at the top end of the solder liquid discharge port, and the buffer belt is made of spring steel.

The separation sieve plate 18 is positioned right above the solder liquid discharge port, and the projection area of the separation sieve plate 18 on the horizontal plane is larger than that of the solder liquid discharge port.

The feed inlet is provided with a feed inlet gate valve 26; the box body exhaust port 12 is connected with an air inlet of the air purifier 8 through a first pipeline, and a suction pump 9 is arranged on the first pipeline; the gas vent of air purifier 8 is connected with heat exchanger 5 through the second pipeline, the second pipeline is provided with the gas vent that leads to the external world, is provided with the valve on the gas vent 7 of second pipeline.

Preferably, the feed inlet gate valve 26 is a double-layer sealing gate valve, and the opening and closing time of the double-layer sealing gate valve is 3-8 s.

Further preferably, the feed inlet gate valve 26 is a double-layer sealing gate valve, and the opening and closing time of the double-layer sealing gate valve is 5 s.

The gas injection pipe 4 is provided with a high-temperature pulse valve 2, the tail end of the gas injection pipe 4 is provided with a slit nozzle, the width of a slit of the slit nozzle is 0.05-1mm, and the depth of the slit nozzle is 2-10 mm; the vertical distance between the slit nozzle and the vibration plate 22 is 5-60 mm.

The width of the slit nozzle is the same as the width of the vibrating plate 22, and the slit nozzle is located directly above the vibrating plate 22.

The heating device comprises an electric heating rod 25, and the electric heating rod 25 is arranged on the inner wall of the box body 1.

The vibration device comprises a motor 23, a vibration plate 22 and a transmission mechanism 20; the motor 23 is connected to a vibrating plate 22 via a transmission mechanism 20, the vibrating plate 22 is disposed inside the box 1, and one end of the vibrating plate 22 is connected to the separation screen 18.

The diameter of the mesh of the separation sieve plate 18 is 3-5 mm;

preferably, the mesh diameter of the separation screen deck 18 is 3 mm;

the vibrating plate 22 is connected with the bottom plate of the box body 1 through a spring 19; when the waste circuit board disassembling device works, the height of the end, connected with the separation sieve plate 18, of the vibrating plate 22 is lower than that of the end, not connected with the separation sieve plate 18, of the vibrating plate; the surface of the vibrating plate 22 is provided with a buffer bulge, and the height of the buffer bulge is 0.5mm-4 mm; the buffering protrusions are in a sawtooth shape, a rectangular block shape or a spherical shape;

preferably, the buffering protrusions are spherical;

baffles (isolation fenders) 22-1 are arranged on both sides of the vibrating plate 22.

The vibrating plate 22 and the separating screen plate 18 are of a rigid integral structure. The cabinet 1 does not vibrate while the vibration plate 22 operates. The diaphragm 22 and the baffle 22-1 are made of the same material.

The periphery of the box body 1 is provided with a heat insulation layer 24, and a pressure sensor 6 and a temperature sensor 11 are arranged in the box body 1; the bottom of box 1 is provided with base 21, box 1 sets up observation window 10.

The waste circuit board disassembling device described in this embodiment specifically includes:

as shown in fig. 1, a feed inlet gate valve 26 is arranged at a feed inlet, a discharge outlet gate valve 13 is arranged at the top end of a circuit board component collecting box, the feed inlet gate valve 26 and the discharge outlet gate valve 13 are both double-layer sealing gate valves, and the opening and closing time is 3-8s, preferably 5 s; the circuit board component collecting box 14 and the soldering tin liquid collecting box 16 are respectively detachably connected with the bottom of the box body 1, a soldering tin liquid discharge valve 15 is arranged at the bottom of the soldering tin liquid collecting box 16, a buffer strip 17 is arranged above the soldering tin liquid collecting box 16, and the buffer strip 17 is made of spring steel, so that the elastic connection between the soldering tin liquid collecting box 16 and the separating sieve plate 18 is ensured; the box body 1 is provided with a box body exhaust port 12; the upper end of the gas injection pipe 4 is provided with a high-temperature pulse valve 2; a spring 19 is arranged above the bottom plate in the box body 1, and a vibrating plate 22 is arranged on the upper part of the spring 19; the surface of the vibrating plate 22 is provided with buffering protrusions, the height of the buffering protrusions is 0.5mm-4mm, the buffering protrusions are in a sawtooth shape, a rectangular block shape or a spherical shape, and the optimal shape is a spherical shape; the mesh of the separation sieve plate 18 is 3-5mm, preferably 3 mm. The vibrating plate 22 has a lower height at the end connected to the separating screen 18 than at the end not connected to the separating screen 18, and is adjusted in two ways: the first way is to adjust the base 21 so that the left end of the base 21 is higher than the right end, the base 21 drives the whole box body 1 to incline, so that the vibrating plate 22 inclines, and the structural schematic diagram of the vibrating plate 22 is shown in fig. 2, 3, 4 and 5; the second method is to directly adjust the vibrating plate 22 so that the height of the end of the vibrating plate 22 connected to the separation sieve plate 18 is lower than the end not connected to the separation sieve plate, so that the vibrating plate 22 is tilted, and the structural diagram of the vibrating plate 22 is shown in fig. 4; adjusting the optimal horizontal direction inclination angle within the range of 0-3 degrees through tests according to different types and quantities of waste circuit board raw materials; 4 temperature sensors 11 and 2 pressure sensors 6 are arranged in the box body 1; the box body 1 is externally wrapped by a heat-insulating layer 24 with the thickness of 50-100 mm; the electric heating rods 25 are equidistantly and uniformly distributed in the box body 1 at the interval of 100-200mm, the electric heating rods 25 are fixed in the wall of the box body 1, and the heating temperature of the electric heating rods 25 is 0-290 ℃; the included angle between the gas nozzle 4 and the horizontal direction is adjustable within the range of 0-180 degrees, the vertical distance between the slit nozzle and the circuit board is 5-60mm, the temperature of the gas sprayed by the gas nozzle 4 is 250 +/-10 ℃, and the pressure of the gas is 0.2-0.4 MPa.

Example 2

The method for disassembling the waste circuit board by adopting the waste circuit board disassembling device comprises the following steps:

the left end of the adjustment base 21 is higher than the right end so that the horizontal inclination angle of the vibration plate 22 is 0.3 °. Starting the heating rod 25, the heat exchanger 5, the air suction pump 9 and the pressure pump 3 to preheat the box body 1; when the internal temperature of the box body 1 reaches 250 ℃, starting the motor 23 and starting feeding, enabling the waste circuit boards to fall onto the vibrating plate 22 with the horizontal inclination angle of 0.3 DEG from the feeding hole through the feeding hole gate valve 26 by automatic feeding or manual feeding, wherein the opening and closing time of the feeding hole gate valve 26 is 3s, and the waste circuit boards jiggle to the discharging end along with the vibration of the vibrating plate 22; meanwhile, the soldering tin and the components continuously fall off from the waste circuit board; the high-temperature high-pressure pulse gas of the gas ejector 4 carries out hot air blowing on the circuit board, the temperature of the gas ejected by the gas ejector 4 is 250 ℃, the pressure intensity is 0.4MPa, and the vertical distance between the slit nozzle and the circuit board is 5mm, so that the melting and desoldering of soldering tin and the falling of components are accelerated; the mixture of the substrate and the electronic component enters the area of the separation sieve plate 18, the soldering tin liquid passes through the separation sieve plate 18 and falls into the soldering tin liquid collecting box 16, and the mixture of the substrate and the electronic component after separation falls into the circuit board component collecting box 14 through the separation sieve plate 18; the waste heat air is exhausted from an exhaust port 12 of the box body, the exhausted waste heat air is introduced into an air purifier 8 through an air suction pump 9 for purification and dust removal, and after purification and dust removal, the waste heat air is heated into hot air required by the working condition through a heat exchanger 5; the hot air is introduced into the pressurizing pump 3, is pressurized into high-temperature and high-pressure gas and then is introduced into the gas spraying pipe 4, so that the recycling of the hot air is realized, the energy and the operation cost are saved, and the pollution to the environment is reduced.

Example 3

The method for disassembling the waste circuit board by adopting the waste circuit board disassembling device comprises the following steps:

the left end of the vibration plate 22 is adjusted to be higher than the right end so that the horizontal inclination angle of the vibration plate 22 is 0.5 °. Starting the electric heating rod 25, the heat exchanger 5, the air suction pump 9 and the pressure pump 3 to preheat the box body 1; when the internal temperature of the box body 1 reaches 250 ℃, starting the motor 23 and starting feeding, enabling the waste circuit boards to fall onto the vibrating plate 22 with the horizontal inclination angle of 0.5 DEG from the feeding hole through the feeding hole gate valve 26 by automatic feeding or manual feeding, wherein the opening and closing time of the feeding hole gate valve 26 is 3s, and the waste circuit boards jiggle to the discharging end along with the vibration of the vibrating plate 22; meanwhile, the soldering tin and the components continuously fall off from the waste circuit board; the high-temperature high-pressure pulse gas of the gas ejector 4 carries out hot air blowing on the circuit board, the temperature of the gas ejected by the gas ejector 4 is 248 ℃, the pressure intensity is 0.4MPa, and the vertical distance between the slit nozzle and the circuit board is 30mm, so that the melting and desoldering of soldering tin and the falling of components are accelerated; the mixture of the substrate and the electronic component enters the area of the separation sieve plate 18, the soldering tin liquid passes through the separation sieve plate 18 and falls into the soldering tin liquid collecting box 16, and the mixture of the substrate and the electronic component after separation falls into the circuit board component collecting box 14 through the separation sieve plate 18; the waste heat air is exhausted from an exhaust port 12 of the box body, the exhausted waste heat air is introduced into an air purifier 8 through an air suction pump 9 for purification and dust removal, and after purification and dust removal, the waste heat air is heated into hot air required by the working condition through a heat exchanger 5; the hot air is introduced into the pressurizing pump 3, is pressurized into high-temperature and high-pressure gas and then is introduced into the gas spraying pipe 4, so that the recycling of the hot air is realized, the energy and the operation cost are saved, and the pollution to the environment is reduced.

Example 4

The method for disassembling the waste circuit board by adopting the waste circuit board disassembling device comprises the following steps:

the left end of the vibration plate 22 is adjusted to be higher than the right end so that the horizontal inclination angle of the vibration plate 22 is 0.7 °. Starting the electric heating rod 25, the heat exchanger 5, the air suction pump 9 and the pressure pump 3 to preheat the box body 1; when the internal temperature of the box body 1 reaches 250 ℃, starting the motor 23 and starting feeding, enabling the waste circuit boards to fall onto the vibrating plate 22 with the horizontal inclination angle of 0.7 DEG from the feeding hole through the feeding hole gate valve 26 by automatic feeding or manual feeding, wherein the opening and closing time of the feeding hole gate valve 26 is 3s, and the waste circuit boards jiggle to the discharging end along with the vibration of the vibrating plate 22; meanwhile, the soldering tin and the components continuously fall off from the waste circuit board; the high-temperature high-pressure pulse gas of the gas ejector 4 carries out hot air blowing on the circuit board, the temperature of the gas ejected by the gas ejector 4 is 252 ℃, the pressure intensity is 0.4MPa, and the vertical distance between the slit nozzle and the circuit board is 60mm, so that the melting and desoldering of soldering tin and the falling of components are accelerated; the mixture of the substrate and the electronic component enters the area of the separation sieve plate 18, the soldering tin liquid passes through the separation sieve plate 18 and falls into the soldering tin liquid collecting box 16, and the mixture of the substrate and the electronic component after separation falls into the circuit board component collecting box 14 through the separation sieve plate 18; the waste heat air is exhausted from an exhaust port 12 of the box body, the exhausted waste heat air is introduced into an air purifier 8 through an air suction pump 9 for purification and dust removal, and after purification and dust removal, the waste heat air is heated into hot air required by the working condition through a heat exchanger 5; the hot air is introduced into the pressurizing pump 3, is pressurized into high-temperature and high-pressure gas and then is introduced into the gas spraying pipe 4, so that the recycling of the hot air is realized, the energy and the operation cost are saved, and the pollution to the environment is reduced.

Example 5

The method for disassembling the waste circuit board by adopting the waste circuit board disassembling device comprises the following steps:

the left end of the adjustment base 21 is higher than the right end so that the horizontal inclination angle of the vibration plate 22 is 3 °. Starting the electric heating rod 25, the heat exchanger 5, the air suction pump 9 and the pressure pump 3 to preheat the box body 1; when the internal temperature of the box body 1 reaches 250 ℃, starting the motor 23 and starting feeding, enabling the waste circuit boards to fall onto the vibrating plate 22 with the horizontal inclination angle of 3 degrees from the feeding hole through the feeding hole gate valve 26 by automatic feeding or manual feeding, wherein the opening and closing time of the feeding hole gate valve 26 is 3s, and the waste circuit boards jiggle to the discharging end along with the vibration of the vibrating plate 22; meanwhile, the soldering tin and the components continuously fall off from the waste circuit board; the high-temperature high-pressure pulse gas of the gas ejector 4 carries out hot air blowing on the circuit board, the temperature of the gas ejected by the gas ejector 4 is 252 ℃, the pressure intensity is 0.4MPa, and the vertical distance between the slit nozzle and the circuit board is 60mm, so that the melting and desoldering of soldering tin and the falling of components are accelerated; the mixture of the substrate and the electronic component enters the area of the separation sieve plate 18, the soldering tin liquid passes through the separation sieve plate 18 and falls into the soldering tin liquid collecting box 16, and the mixture of the substrate and the electronic component after separation falls into the circuit board component collecting box 14 through the separation sieve plate 18; the waste heat air is exhausted from an exhaust port 12 of the box body, the exhausted waste heat air is introduced into an air purifier 8 through an air suction pump 9 for purification and dust removal, and after purification and dust removal, the waste heat air is heated into hot air required by the working condition through a heat exchanger 5; the hot air is introduced into the pressurizing pump 3, is pressurized into high-temperature and high-pressure gas and then is introduced into the gas spraying pipe 4, so that the recycling of the hot air is realized, the energy and the operation cost are saved, and the pollution to the environment is reduced.

Example 6

The method for disassembling the waste circuit board by adopting the waste circuit board disassembling device comprises the following steps:

referring to fig. 7, a controllable opening and closing type baffle plate 27 is mounted on the inclined vibrating plate, and the baffle plate 27 has a function of blocking the circuit board from moving toward the vibrating screen plate 18 when closed. Adjusting the left end of the vibrating plate 22 to be higher than the right end so that the horizontal inclination angle of the vibrating plate 22 is 2 degrees, closing the baffle plate 27 (making the baffle plate 27 vertical to the vibrating plate and the baffle plate 27 vertical to the isolation barrier plate on the vibrating plate), starting the electric heating rod 25, the heat exchanger 5, the air suction pump 9 and the pressure pump 3, and preheating the box body 1; when the internal temperature of the box body 1 reaches 250 ℃, starting the motor 23 and starting feeding, enabling the waste circuit boards to fall onto the vibrating plate 22 with the horizontal inclination angle of 2 degrees through the feeding hole by automatic feeding or manual feeding through the feeding hole gate valve 26, wherein the stacking form of the circuit boards can be a disordered form (figure 6) or a vertical side-by-side form (figure 7 or figure 8), the opening and closing time of the feeding hole gate valve 26 is 3s, and the waste circuit boards vibrate up and down along with the vibration of the vibrating plate 22; meanwhile, the soldering tin and the components continuously fall off from the waste circuit board; the high-temperature high-pressure pulse gas of the gas ejector 4 carries out hot air blowing on the circuit board, the temperature of the gas ejected by the gas ejector 4 is 252 ℃, the pressure intensity is 0.4MPa, and the vertical distance between the slit nozzle and the circuit board is 60mm, so that the melting and desoldering of soldering tin and the falling of components are accelerated; after the vibration time reaches 10 minutes, the baffle 27 is opened, so that the mixture of the substrate and the electronic components continuously enters the area of the separation sieve plate 18, the soldering tin liquid passes through the separation sieve plate 18 and falls into the soldering tin liquid collection box 16 after passing through the separation sieve plate 18, and the mixture of the substrate and the electronic components after separation falls into the circuit board component collection box 14 after passing through the separation sieve plate 18; the waste heat air is exhausted from an exhaust port 12 of the box body, the exhausted waste heat air is introduced into an air purifier 8 through an air suction pump 9 for purification and dust removal, and after purification and dust removal, the waste heat air is heated into hot air required by the working condition through a heat exchanger 5; the hot air is introduced into the pressurizing pump 3, is pressurized into high-temperature and high-pressure gas and then is introduced into the gas spraying pipe 4, so that the recycling of the hot air is realized, the energy and the operation cost are saved, and the pollution to the environment is reduced.

The following table 1 is a statistical table of the inclination of the vibrating plate, the vibrating time and the disassembling rate when disassembling the embodiments. It was experimentally confirmed (as shown in table 1) that, in example 2, the component removal rate was 19.4 times higher than that of CN112719503A, compared to the case where the vibration base plate was inclined at 3 ° in CN112719503A, under the condition where the inclination angle of the vibration plate 22 was 0.3 °. In example 6, when the inclination angle of the diaphragm 22 was 2 °, the component removal rate was 19.8 times that of CN112719503A, compared with the inclination angle of the vibrating base plate in CN112719503A being 3 °. In the disassembling apparatus of the above embodiments, the vibration plate is made of stainless steel, the mass of the vibration plate is 30KG, and the rated power of the motor is 7.5 KW.

TABLE 1

The above examples are only preferred and inferior embodiments of the present invention, which are only illustrative and not restrictive, and those skilled in the art should fall within the scope of the present invention.

Claims (10)

1. A method for disassembling a waste circuit board is characterized by comprising the following steps:

(1) opening a heating device to preheat air in a box body, simultaneously opening a heat exchanger to preheat gas, then adjusting the inclination angle of a vibrating plate to enable one end, which is not connected with a separating sieve plate, of the vibrating plate to be higher than one end, which is connected with the separating sieve plate, adding the waste circuit board into the box body of the waste circuit board disassembling device after the temperature of the box body meets the working condition requirement, placing the waste circuit board on the vibrating plate, heating the waste circuit board, simultaneously spraying high-temperature and high-pressure gas to the waste circuit board through a gas spraying device, separating electronic components and molten soldering tin on the waste circuit board from the waste circuit board under the vibration action of the vibrating plate, discharging and depositing soldering tin liquid in a soldering tin liquid collecting box through filter holes of the separating sieve plate, and enabling the electronic components and the disassembled circuit board to fall into the circuit board component collecting box;

(2) and opening an exhaust port of the box body, exhausting high-temperature and high-pressure gas, introducing the gas into the heat exchanger for heating after the gas is purified by the air purifier, pressurizing the gas by the pressurizing pump, and then re-entering the box body through the gas injection pipe to form gas circulation.

2. The method for disassembling the waste circuit board as recited in claim 1, wherein the temperature of the heating treatment in the step (1) is 200-.

3. A waste circuit board disassembling device is characterized by comprising a box body, an air injection device, a heating device, a vibrating device, a separating sieve plate, a circuit board component collecting box and a soldering tin liquid collecting box; the gas spraying device is connected with the box body, the heating device is connected with the box body, the vibrating device is connected with the box body, and the vibrating device is connected with the separation sieve plate; the circuit board component collecting box and the soldering tin liquid collecting box are detachably connected with the bottom of the box body respectively.

4. The disassembly device for waste circuit boards as claimed in claim 3, wherein the gas injection device comprises a heat exchanger, a pressure pump and a gas injection pipe; the heat exchanger is connected with a booster pump, and the booster pump is connected with an air injection pipe; the box body is provided with an observation window, a feed inlet and a box body exhaust port, and the bottom of the box body is provided with a solder liquid discharge port and a circuit board component discharge port; the separation sieve plate is located above a solder liquid discharge port, a buffer belt is arranged at the top end of the solder liquid discharge port, and the buffer belt is made of spring steel.

5. The waste circuit board disassembling device according to claim 4, wherein the feed inlet is provided with a feed inlet gate valve; the air outlet of the box body is connected with the air inlet of the air purifier through a first pipeline, and the first pipeline is provided with an air suction pump; the air purifier's gas vent passes through the second pipeline and is connected with heat exchanger, the second pipeline is provided with the gas vent that accesss to the external world, is provided with the valve on the gas vent of second pipeline.

6. The disassembling device for waste circuit boards according to claim 4, wherein the gas injection pipe is provided with a high-temperature pulse valve, the tail end of the gas injection pipe is provided with a slit nozzle, the slit width of the slit nozzle is 0.05-1mm, and the depth of the slit nozzle is 2-10 mm; the vertical distance between the slit nozzle and the vibrating plate is 5-60 mm.

7. The disassembly device for waste circuit boards as claimed in claim 3, wherein the heating device comprises an electric heating rod, and the electric heating rod is arranged on the inner wall of the box body.

8. The disassembling device for waste circuit boards according to claim 3, wherein the vibrating device comprises a motor, a vibrating plate, and a transmission mechanism; the motor is connected with a vibrating plate through a transmission mechanism, the vibrating plate is arranged in the box body, and one end of the vibrating plate is connected with the separating sieve plate.

9. The disassembling device for waste circuit boards according to claim 8, wherein the vibrating plate is connected with a bottom plate of the box body through a spring; when the waste circuit board disassembling device works, the height of one end, connected with the separation sieve plate, of the vibrating plate is lower than that of the other end, not connected with the separation sieve plate, of the vibrating plate; the surface of the vibrating plate is provided with a buffer bulge; baffles are arranged on two sides of the vibrating plate.

10. The waste circuit board disassembling device according to claim 3, wherein an insulating layer is arranged around the box body, and a pressure sensor and a temperature sensor are arranged in the box body; the bottom of the box body is provided with a base; the box body is provided with an observation window.

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