CN113628960B - 一种蓝宝石模板上GaN单晶衬底高温激光剥离装置及剥离方法 - Google Patents
一种蓝宝石模板上GaN单晶衬底高温激光剥离装置及剥离方法 Download PDFInfo
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- CN113628960B CN113628960B CN202110855731.4A CN202110855731A CN113628960B CN 113628960 B CN113628960 B CN 113628960B CN 202110855731 A CN202110855731 A CN 202110855731A CN 113628960 B CN113628960 B CN 113628960B
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000013078 crystal Substances 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 title claims abstract description 32
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 29
- 239000010980 sapphire Substances 0.000 title claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 79
- 238000003384 imaging method Methods 0.000 claims abstract description 28
- 230000008569 process Effects 0.000 claims abstract description 18
- 238000005286 illumination Methods 0.000 claims abstract description 8
- 238000012544 monitoring process Methods 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims description 18
- 238000012545 processing Methods 0.000 claims description 12
- 238000007493 shaping process Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 241001270131 Agaricus moelleri Species 0.000 claims description 4
- 230000001276 controlling effect Effects 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims description 2
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims 1
- 229910001634 calcium fluoride Inorganic materials 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 33
- 229910002601 GaN Inorganic materials 0.000 description 32
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910004261 CaF 2 Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02376—Carbon, e.g. diamond-like carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
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Priority Applications (1)
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CN202110855731.4A CN113628960B (zh) | 2021-07-28 | 2021-07-28 | 一种蓝宝石模板上GaN单晶衬底高温激光剥离装置及剥离方法 |
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CN202110855731.4A CN113628960B (zh) | 2021-07-28 | 2021-07-28 | 一种蓝宝石模板上GaN单晶衬底高温激光剥离装置及剥离方法 |
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CN113628960A CN113628960A (zh) | 2021-11-09 |
CN113628960B true CN113628960B (zh) | 2024-03-22 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100991720B1 (ko) * | 2010-09-10 | 2010-11-03 | 유병소 | 레이저 가공장치용 빔 정형 모듈 |
CN101882578A (zh) * | 2009-05-08 | 2010-11-10 | 东莞市中镓半导体科技有限公司 | 固体激光剥离和切割一体化设备 |
CN101879657A (zh) * | 2009-05-08 | 2010-11-10 | 东莞市中镓半导体科技有限公司 | 固体激光剥离设备和剥离方法 |
CN109148369A (zh) * | 2018-10-15 | 2019-01-04 | 保定中创燕园半导体科技有限公司 | 一种加热激光剥离设备 |
CN109888065A (zh) * | 2019-02-28 | 2019-06-14 | 保定中创燕园半导体科技有限公司 | 一种利用加热激光剥离方法制作图形化蓝宝石衬底的方法 |
CN112378776A (zh) * | 2020-11-10 | 2021-02-19 | 厦门大学 | 热防护材料热-力-氧-激光多场耦合地面测试系统 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101740331B (zh) * | 2008-11-07 | 2012-01-25 | 东莞市中镓半导体科技有限公司 | 利用固体激光器无损剥离GaN与蓝宝石衬底的方法 |
-
2021
- 2021-07-28 CN CN202110855731.4A patent/CN113628960B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101882578A (zh) * | 2009-05-08 | 2010-11-10 | 东莞市中镓半导体科技有限公司 | 固体激光剥离和切割一体化设备 |
CN101879657A (zh) * | 2009-05-08 | 2010-11-10 | 东莞市中镓半导体科技有限公司 | 固体激光剥离设备和剥离方法 |
KR100991720B1 (ko) * | 2010-09-10 | 2010-11-03 | 유병소 | 레이저 가공장치용 빔 정형 모듈 |
CN109148369A (zh) * | 2018-10-15 | 2019-01-04 | 保定中创燕园半导体科技有限公司 | 一种加热激光剥离设备 |
CN109888065A (zh) * | 2019-02-28 | 2019-06-14 | 保定中创燕园半导体科技有限公司 | 一种利用加热激光剥离方法制作图形化蓝宝石衬底的方法 |
CN112378776A (zh) * | 2020-11-10 | 2021-02-19 | 厦门大学 | 热防护材料热-力-氧-激光多场耦合地面测试系统 |
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Effective date of registration: 20240618 Address after: Smart Sensor (Jinan) Innovation Center 5-70, No. 1001 Hushan North Road, Caishi Street, Jinan Area, China (Shandong) Pilot Free Trade Zone, Jinan City, Shandong Province, 250000 Patentee after: Jinan Jingxin Investment Partnership Enterprise (Limited Partnership) Country or region after: China Address before: No. 27, mountain Dana Road, Ji'nan City, Shandong, Shandong Patentee before: SHANDONG University Country or region before: China |
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Effective date of registration: 20240626 Address after: Smart Sensor (Jinan) Innovation Center 5-70, No. 1001 Hushan North Road, Caishi Street, Jinan Area, China (Shandong) Pilot Free Trade Zone, Jinan City, Shandong Province, 250000 Patentee after: Shandong Jinggallium Semiconductor Co.,Ltd. Country or region after: China Address before: Smart Sensor (Jinan) Innovation Center 5-70, No. 1001 Hushan North Road, Caishi Street, Jinan Area, China (Shandong) Pilot Free Trade Zone, Jinan City, Shandong Province, 250000 Patentee before: Jinan Jingxin Investment Partnership Enterprise (Limited Partnership) Country or region before: China |
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