CN113628820B - Alloy chip resistor and preparation method thereof - Google Patents
Alloy chip resistor and preparation method thereof Download PDFInfo
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- CN113628820B CN113628820B CN202110918331.3A CN202110918331A CN113628820B CN 113628820 B CN113628820 B CN 113628820B CN 202110918331 A CN202110918331 A CN 202110918331A CN 113628820 B CN113628820 B CN 113628820B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
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Abstract
The invention discloses an alloy chip resistor, which comprises a side electrode, a terminal electrode, a resistor body, a radiating fin, a protective layer and an insulating heat conduction layer, wherein the side electrode is arranged on the side electrode; the electrode area is structurally characterized in that the inner electrode and the resistance electrode are connected in parallel, when the resistor is electrified, the resistance of the electrode area is greatly reduced, the interference of the resistance electrode on the resistance value is reduced, the measurement precision of the resistance value is improved, and the resistance yield of a low-resistance product is greatly improved. The invention also provides a preparation method of the alloy patch resistor.
Description
Technical Field
The invention belongs to a resistor and a manufacturing method thereof, and particularly relates to a preparation method of a high-precision alloy chip resistor and the resistor obtained by the preparation method.
Background
The accurate sampling resistor is indispensable electronic components in the circuit, and along with the development of lithium cell and brushless motor technique, the effect of sampling resistor is more and more important, and the effect of sampling resistor is when the electric current through sampling resistor changes, and the voltage at sampling resistor both ends changes promptly, feeds back to IC to discern corresponding signal, the precision of resistance value is higher, and is more accurate to the voltage signal of feedback, and the electric current of output is more stable. With the development of lithium batteries, it is required that the internal resistance of the circuit is smaller and better to reduce the loss of the battery, and the resistance is more important for the lithium battery protection circuit and the brushless motor driving circuit, and certainly, the resistance value is smaller and smaller, and the influence of the factors of the electrodes on the precision of the resistance value is larger. The accuracy of the resistance measurement becomes higher and higher.
When the resistance value measurement is carried out on the high-power precise chip resistor structure in the prior art by adopting a four-wire measurement method, the resistance of the resistance electrode can be brought into the resistance value, so that the difference exists between the measured resistance value and the resistance value welded to a PCB (printed Circuit Board) by an actual user, the difference is large in the proportion of the low-resistance value section, the difference is particularly prominent, on one hand, the yield is lost, and on the other hand, the resistance value precision of the user is increased.
Disclosure of Invention
The invention aims to: the invention provides a novel alloy chip resistor, which solves the technical problem that the resistance value of a resistance electrode is overlarge to influence the precision of the whole resistance value in the prior art.
The invention also provides a technical scheme of the preparation method of the alloy chip resistor.
In order to overcome the defects in the prior art, the alloy chip resistor provided by the invention can adopt the following technical scheme:
an alloy chip resistor comprises a middle resistor, resistor electrodes connected to two ends of the middle resistor, inner electrodes positioned in the resistor electrodes, and a bottom electrode connected below the resistor electrodes; the end cap electrode comprises an end electrode positioned below the bottom electrode and a side electrode positioned on the outer side surface of the bottom electrode; the side surface of the resistance electrode is provided with an inward concave opening, and the inner electrode is arranged in the opening; the inner electrode and the resistance electrode are simultaneously electrically connected with the bottom electrode to form a parallel connection relation of the inner electrode and the resistance electrode; and the resistivity of the internal electrodes is lower than that of the resistive electrodes.
Has the advantages that: in the technical scheme provided by the invention, the inner electrode and the resistance electrode are simultaneously electrically connected with the bottom electrode to form a parallel connection relation; and the resistivity of the inner electrode is lower than that of the resistance electrode, so that the resistance value of the resistance electrode area is reduced, the resistance value of the resistance electrode area cannot cause great influence on the precision of the whole resistance value, and the measurement precision of the resistance is improved.
The technical scheme is as follows: the invention provides a preparation method of an alloy chip resistor, which comprises the following steps:
the method comprises the following steps:
step one, providing a resistance alloy sheet;
step two, making set patterns on the resistance alloy sheet and the heat dissipation sheet through exposure, development and etching;
forming a protective layer in a set area printed on the resistance alloy sheet and the radiating fin;
forming a bottom electrode and an inner electrode by electroplating;
fifthly, repairing the resistance of the obtained resistance alloy sheet in a laser cutting or mechanical mode;
step six, covering a secondary protective layer on the surface of the obtained product;
step seven, performing primary segmentation along the Y direction of the end face electrode;
eighthly, performing secondary division along the X direction vertical to the end face electrode;
and step nine, electroplating the electrode area and the side area of the obtained product to form a terminal electrode and a side electrode.
Drawings
Fig. 1 is a schematic diagram of a resistor structure in the chip resistor according to the present invention;
FIG. 2 is a schematic cross-sectional view of an alloy chip resistor according to the present invention;
FIG. 3 is a schematic diagram of the current path and the integrated resistance calculation of the resistor of the present invention;
FIG. 4 is a schematic structural view of an intermediate product obtained in step two of the production process of the present invention;
FIG. 5 is a schematic view showing another structure of an intermediate product obtained in step two of the production process of the present invention;
FIG. 6 is a schematic structural diagram of an intermediate product obtained in step three of the production method of the present invention;
FIG. 7 is a schematic diagram showing the X-direction and Y-direction of the cuts of the seventh and eighth steps of the production method of the present invention;
fig. 8 is a schematic structural view of the heat sink of the present invention.
Detailed Description
Example one
Referring to fig. 1 and 2, the present invention provides an alloy chip resistor, which includes an intermediate resistor 11, resistor electrodes 9 connected to two ends of the intermediate resistor 11, inner electrodes 6 located in the resistor electrodes, a bottom electrode 8 connected below the resistor electrodes, end cap electrodes, an insulating heat conduction layer 3, a heat sink 2, and a protection layer 4. The end cap electrode comprises a terminal electrode 5 located below the bottom electrode 8 and a side electrode 7 located outside the bottom electrode. The side of the resistance electrode 9 is provided with an inwardly recessed opening in which the inner electrode 6 is mounted. And the position of the internal electrode 6 is set at the middle position in the width direction of the resistance electrode 9. The inner electrode 6 and the resistance electrode 9 are electrically connected with the bottom electrode 8 at the same time to form a parallel connection relationship; and the resistivity of the internal electrode 6 is lower than that of the resistance electrode 9. In the present embodiment, the intermediate resistor 11 is integrally formed with the resistor electrodes 9 positioned at both ends of the intermediate resistor 11, and the width of the intermediate resistor 11 is smaller than the width of the resistor electrodes 9. The insulating heat conduction layer 3 covers the middle resistor 11, the resistor electrode 9 and the inner electrode 6 at the same time. The radiating fins 2 cover the insulating heat conduction layer 3. In this embodiment, the material of the inner electrode 6 is selected from copper, silver, aluminum or gold, etc. with a relatively low resistivity; the number of the inner electrodes provided for each resistance electrode is at least 1. The length of the internal electrode 6 is equivalent to the width of the resistance electrode 9, and both ends of the internal electrode 6 are flush with both long-side edges of the resistance electrode 9. The width D of the internal electrode is less than 1/2 of the width D of the resistance electrode. As shown in fig. 2 and 8, the number of the heat dissipation fins 2 is even, and the fins are aligned with each other, and an insulation groove 10 for improving heat conduction is left in the middle.
In the present invention, the internal electrode 6 is provided in parallel with the resistance electrode 9, so that the resistivity at the position of the resistance electrode 9 is reduced. As shown in FIG. 3, the current flow direction in this embodiment may substantially result in the combined resistance R =2R1+2R2+2R3+ R0; wherein R0 is the resistance of the middle resistor 11, R1 is the resistance of the terminal electrode 5, R2 is the resistance of the bottom electrode 8, and R3 is the resistance of the inner electrode 6 and the resistance alloy 9 connected in parallel. The R3 internal electrode is made of copper, and the resistivity at 20 ℃ is 0.0172 omega.
As a comparative example, when the internal electrode 6 was not provided, that is, only the resistance value of the resistance alloy 9 was set to R4, the resistance value of the resistance alloy 9 was set. Comparing the two results, R1 and R2 are both low resistance copper electrodes, the resistance is relatively small, and the remaining resistance R4 and R3 are compared, wherein the resistance at 20 ℃ is 0.43 omega.m, which is explained by the R4 resistance electrode being manganin; because the resistivity of the manganin is 25 times of that of the copper, R4=25 rho L/(1.6 rho L/d) =15.6 rho L/d, the R inner electrode = rho L/(0.2 rho d) =5 rho L/d, R3=3.78 rho L/d can be obtained, and the resistance R3 after parallel connection is about 0.24 times of R4, the resistance of the resistance electrode area is greatly reduced, and the measurement accuracy of the resistance is improved.
The second embodiment:
the embodiment provides a technical scheme of an optional preparation method of the high-precision alloy chip resistor in the first embodiment, and the method comprises the following steps:
s1, preparing an insulating heat conduction layer 3, attaching a resistance alloy sheet 1 and a radiating fin 2 to the upper surface and the lower surface of the insulating heat conduction layer 3 through viscose, enabling the resistance alloy sheet 1, the radiating fin 2 and the insulating heat conduction layer 3 to be fully attached, enabling no air bubbles in the middle, and solidifying the viscose through heating and pressurizing to ensure that the resistance alloy sheet 1 and the insulating heat conduction layer 3 have certain bonding strength; the number of the radiating fins 2 is even, every two radiating fins are arranged in an aligned mode, and an insulating groove 10 used for improving heat conduction is reserved in the middle;
s2, forming a layer of photosensitive material of 10-30 um on the surface of the product obtained in the step S1 through an exposure, development and etching process, wherein the photosensitive material is epoxy resin or silica gel, and is exposed through 365nm ultraviolet light, and when patterns are manufactured through exposure alignment, the patterns on the upper surface and the lower surface are ensured to have certain symmetry, so that the appearance of the cut product meets the requirements; the photosensitive material receiving light is polymerized, and the photosensitive material not receiving light adopts 0.8-1.2 wt% of sodium carbonate weak alkaline solution, and then the exposed base material is etched and removed by the etching solution of ferric trichloride and hydrochloric acid with the concentration of 40-42 Baume degrees; a set pattern is made on the resistance alloy sheet 1, as shown in fig. 4, other similar patterns can be made, and as shown in fig. 5, the inner electrode is arranged in the middle of the resistance electrode; the set pattern comprises a resistive area and a resistive electrode area 9 to be plated, as shown in fig. 1; making a pattern of heat sink fins on the back side, as shown in fig. 8;
s3, covering the whole protective layer 4 on the surface of the product obtained in the step two in a printing mode, making a strip-shaped graph of the protective layer 4 in an exposure and development mode, wherein the protective layer 4 is preferably an epoxy resin layer or a silica gel layer, curing at the high temperature of 100-200 ℃, hardening the protective layer 4, forming good combination with the resistance alloy sheet 1 and the radiating fin 2, and protecting the area of the resistance alloy sheet 1 of the product without gaps and redundant air as shown in figure 6;
s4, electroplating is carried out on the protective uncovered area of the product obtained in the step three in an electroplating mode to form an inner electrode 6 and a bottom electrode 8, and good electric connection among the inner electrode, the bottom electrode and a resistance electrode is ensured;
s5, trimming the resistance of the product obtained in the fourth laser cutting step in any one of the left side and the right side of the resistance alloy 1 to enable the resistance value to reach a target value range; the laser cutting power is 5-30W, the cutting speed is 10-100 mm/s, the auxiliary gas is nitrogen, and the diameter of the nozzle is 0.3-3 mm; the resistance trimming graph is ensured in the middle area of the upper part and the lower part and does not deviate from the alloy sheet;
s6, covering a protective layer on the surface of the product obtained in the step five in a printing mode, making a strip-shaped graph of the protective layer 4 in an exposure and development mode, wherein the protective layer 4 is preferably an epoxy resin layer or a silica gel layer, and curing at the high temperature of 100-200 ℃ to harden the protective layer 4, so that the exposed area of the repaired resistor is completely covered, and the area of the resistor alloy sheet 1 of the product is protected;
s7, performing primary segmentation on the product obtained in the step six along the direction of the bottom electrode 5 to obtain strips, wherein the segmentation direction comprises two vertical directions, for convenience of description, a direction parallel to the direction of the resistor bottom electrode 5 is defined as a Y direction, and the other direction is an X direction; as shown in fig. 7;
and S8, performing secondary division on the product obtained in the step 7 in the direction (X direction) vertical to the side electrode 7, so that the product on the substrate is separated into single products.
And S9, electrifying, electroplating the bottom electrode area and the side area of the product obtained in the step eight, and slowly closing the insulating heat-conducting layer between the upper surface and the lower surface along with the increase of the thickness to form an integral side electrode 7 and a terminal electrode 5, namely forming a single high-precision chip resistor.
The above modes of operation do not have absolute precedence. For example, in S1, the resistance alloy sheet 1 and the heat sink 2 may be patterned, and then the two are overlapped and bonded together through some alignment points, and it is also necessary to ensure that the bonding portion in the middle has no air bubbles, and then the adhesive is cured by heating and pressurizing to ensure that the resistance alloy sheet 1 and the insulating and heat conducting layer 3 have a certain bonding strength.
Example three:
the embodiment provides a technical scheme of another optional preparation method of the high-precision alloy chip resistor in the first embodiment, and the method comprises the following steps:
s1, preparing an insulating heat conduction layer 3, attaching a resistance alloy sheet 1 and a radiating fin 2 to the upper surface and the lower surface of the insulating heat conduction layer 3 through viscose, enabling the resistance alloy sheet 1, the radiating fin 2 and the insulating heat conduction layer 3 to be fully attached, enabling no air bubbles in the middle, and solidifying the viscose through heating and pressurizing to ensure that the resistance alloy sheet 1 and the insulating heat conduction layer 3 have certain bonding strength; the number of the radiating fins 2 is even, every two radiating fins are arranged in an aligned mode, and an insulating groove 10 used for improving heat conduction is reserved in the middle;
s2, forming a layer of photosensitive material of 10-30 um on the surface of the product obtained in the S1 through an exposure, development and etching process, wherein the photosensitive material is epoxy resin or silica gel, and is exposed through 365nm ultraviolet light, and when patterns are manufactured through exposure alignment, the patterns on the upper surface and the lower surface are ensured to have certain symmetry, so that the appearance of the cut product meets the requirements; the photosensitive material receiving light is polymerized, the photosensitive material not receiving light adopts 0.8-1.2 wt% of sodium carbonate weak alkaline solution, and the exposed base material is etched and removed by etching solution of ferric trichloride and hydrochloric acid with the concentration of 40-42 Baume degrees; a set pattern is made on the resistance alloy sheet 1, as shown in fig. 4, other similar patterns can be made, and as shown in fig. 5, the inner electrode is arranged in the middle of the resistance electrode; the set pattern comprises a resistive area and a resistive electrode area 9 to be plated, as shown in fig. 1; making a pattern of heat sink fins on the back side, as shown in fig. 8;
s3, covering the whole protective layer 4 on the surface of the product obtained in the step two in a printing mode, making a strip-shaped graph of the protective layer 4 in an exposure and development mode, wherein the protective layer 4 is preferably an epoxy resin layer or a silica gel layer, and is cured at the high temperature of 100-200 ℃ to harden the protective layer 4, so that the protective layer 4 is well combined with the resistance alloy sheet 1 and the radiating fin 2, no gap exists between the protective layer and the resistance alloy sheet 1, no redundant air exists, and the area of the resistance alloy sheet 1 of the product is protected, as shown in FIG. 6;
s4, printing a layer of low-resistivity slurry in an area, to be formed, of the inner electrode of the product obtained in the step two in a printing mode, preferably, selecting silver paste as the slurry for filling the inner electrode, and optionally selecting copper paste, aluminum paste and the like, and solidifying the slurry to obtain a low-resistance inner electrode 6;
s5, electroplating is carried out on the protective uncovered area of the product obtained in the step three in an electroplating mode to form a bottom electrode 8, and good electric connection among the inner electrode, the bottom electrode and the resistance electrode is ensured;
s5, trimming resistance in any one side area of the left side and the right side of the resistance alloy 1 through the product obtained in the laser cutting step IV to enable the resistance value to reach a target value range; the power of laser cutting is 5-30 watts, the cutting speed is 10-100 mm/s, the auxiliary gas is nitrogen, and the diameter of a nozzle is 0.3-3 mm; the resistance trimming graph is ensured in the middle area of the upper part and the lower part and does not deviate from the alloy sheet;
s6, covering a protective layer on the surface of the product obtained in the step five in a printing mode, making a strip-shaped graph of the protective layer 4 in an exposure and development mode, wherein the protective layer 4 is preferably an epoxy resin layer or a silica gel layer, and curing at the high temperature of 100-200 ℃ to harden the protective layer 4, so that the exposed area of the repaired resistor is completely covered, and the area of the resistor alloy sheet 1 of the product is protected;
s7, performing primary segmentation on the product obtained in the step six along the direction of the bottom electrode 5 to obtain strips, wherein the segmentation direction comprises two vertical directions, for convenience of description, a direction parallel to the direction of the resistor bottom electrode 5 is defined as a Y direction, and the other direction is an X direction; as shown in fig. 7;
and S8, performing secondary division on the product obtained in the step 7 in the direction (X direction) vertical to the side electrode 7, so that the product on the substrate is separated into single products.
And S9, electrifying, electroplating the bottom electrode area and the side area of the product obtained in the step eight, and slowly closing the insulating heat-conducting layer between the upper surface and the lower surface along with the increase of the thickness to form an integral side electrode 7 and a terminal electrode 5, namely forming a single high-precision chip resistor.
The above operation modes do not have absolute precedence order. For example, in S1, a pattern may be formed on the resistance alloy sheet 1 and the heat sink sheet 2, and then the two are overlapped and bonded together through some alignment points, and it is also necessary to ensure that the bonding portion in the middle has no air bubbles, and then the adhesive is cured by heating and pressurizing, so as to ensure that the resistance alloy sheet 1 and the insulating and heat conducting layer 3 have a certain bonding strength.
Claims (10)
1. An alloy chip resistor, which is characterized in that: comprises a middle resistor, resistance electrodes (9) connected with two ends of the middle resistor, an inner electrode (6) positioned in the resistance electrodes, and a bottom electrode (8) connected below the resistance electrodes; the end cap electrode is also arranged and comprises an end electrode (5) positioned below the bottom electrode (8) and a side electrode (7) positioned on the outer side surface of the bottom electrode;
the side surface of the resistance electrode is provided with an inward concave opening, and the inner electrode is arranged in the opening; the inner electrode and the resistance electrode are simultaneously electrically connected with the bottom electrode to form a parallel connection relation of the inner electrode and the resistance electrode; and the resistivity of the internal electrodes is lower than that of the resistive electrodes.
2. The alloy patch resistor of claim 1, wherein: the material of the inner electrode is selected from copper, silver, aluminum or gold.
3. The alloy patch resistor according to claim 1 or 2, wherein: the number of the inner electrodes provided per resistive electrode is at least 1.
4. The alloy patch resistor of claim 1, wherein: the position of the inner electrode is set at the middle position of the resistance electrode in the width direction.
5. The alloy patch resistor of claim 1, wherein: the length of the internal electrode is equivalent to the width of the resistance electrode, and the two ends of the internal electrode are flush with the two long edges of the resistance electrode.
6. The alloy patch resistor of claim 5, wherein: the width D of the internal electrode is less than 1/2 of the width D of the resistance electrode.
7. The alloy patch resistor of claim 1, wherein: the resistor further comprises an insulating heat conduction layer (3) and radiating fins (2), wherein the insulating heat conduction layer covers the middle resistor, the resistor electrode and the inner electrode at the same time; the radiating fins cover the insulating heat conduction layer.
8. The alloy patch resistor of claim 7, wherein: the number of the radiating fins is even, the radiating fins are arranged in pairs, and an insulating groove (10) for improving heat conduction is reserved in the middle;
9. a method for preparing the alloy chip resistor as claimed in any one of claims 1 to 8, which comprises the following steps:
step one, providing a resistance alloy sheet;
step two, making set patterns on the resistance alloy sheet and the heat dissipation sheet through exposure, development and etching;
forming a protective layer in a set area printed on the resistance alloy sheet and the radiating fin;
forming a bottom electrode and an inner electrode through electroplating;
fifthly, repairing the resistance of the obtained resistance alloy sheet in a laser cutting or mechanical mode;
step six, covering a secondary protective layer on the surface of the obtained product;
step seven, performing primary segmentation along the Y direction of the end face electrode;
eighthly, performing secondary division along the X direction vertical to the end face electrode;
and step nine, electroplating the electrode area and the side area of the obtained product to form a terminal electrode and a side electrode.
10. The method of claim 9, wherein: and in the first step, the resistance alloy sheet, the radiating fins and the insulating heat-conducting layer are attached and then the second step is carried out.
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