CN113621936A - Working method of vacuum pump system in vacuum coating and vacuum pump system - Google Patents

Working method of vacuum pump system in vacuum coating and vacuum pump system Download PDF

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Publication number
CN113621936A
CN113621936A CN202111184329.4A CN202111184329A CN113621936A CN 113621936 A CN113621936 A CN 113621936A CN 202111184329 A CN202111184329 A CN 202111184329A CN 113621936 A CN113621936 A CN 113621936A
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CN
China
Prior art keywords
gas
pump body
vacuum
process chamber
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111184329.4A
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Chinese (zh)
Inventor
刘祥
宋维聪
封拥军
郑倪明
罗傢蛴
崔世甲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bitong Semiconductor Equipment Suzhou Co ltd
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Bitong Semiconductor Equipment Suzhou Co ltd
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Publication date
Application filed by Bitong Semiconductor Equipment Suzhou Co ltd filed Critical Bitong Semiconductor Equipment Suzhou Co ltd
Priority to CN202111184329.4A priority Critical patent/CN113621936A/en
Publication of CN113621936A publication Critical patent/CN113621936A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Abstract

The invention relates to a working method of a vacuum pump system in vacuum coating and the vacuum pump system, wherein the vacuum pump system comprises a process cavity, a pump body, a protective air source and a compressed air source, and the working method comprises the following steps: s10: acquiring the working state of the process chamber, executing S20 when the process chamber is in the working state, and executing S30 when the process chamber is in the non-working state; s20: the protective gas source is communicated with the pump body, so that the protective gas enters the pump body; s30: the compressed air source and the pump body are communicated to make the compressed air enter the pump body. The invention realizes that proper gas is introduced into the vacuum pump in time by judging the working state of the process chamber, thereby saving the cost.

Description

Working method of vacuum pump system in vacuum coating and vacuum pump system
Technical Field
The invention relates to the technical field of vacuum coating, in particular to a working method of a vacuum pump system in vacuum coating and the vacuum pump system.
Background
In semiconductor vacuum equipment, in particular chemical vapor deposition equipment, a process chamber is kept in a vacuum state at all times. During the coating process, the unreacted gas is pumped into the waste gas processor by the vacuum pump for processing. In the whole chemical vapor deposition process, the total gas utilization rate is less than 10%, and a large amount of unreacted gas is discharged. When the waste gas is exhausted to the outlet of the vacuum pump, the pressure will rise to 600 Pa, the temperature will decrease to about 100 ℃, and O2The concentration increased rapidly. The exhaust gas contains SiH4、H2、N2And NH3And the gas in the waste gas reacts with each other or the inner wall of the exhaust pipe to generate powder to block the vacuum pump, so that the vacuum pump is blocked or corroded, the alarm of the main machine table is caused, and the product is scrapped. Therefore, the vacuum pump needs to be protected by introducing a protective gas such as nitrogen.
Fig. 1 shows a schematic diagram of a vacuum pump in the prior art, which includes a gas input end 101, a pump body 102, a gas output end 103, and a shielding gas input end 104, where the gas input end 101 is communicated with a process chamber; when the vacuum pump works, the process gas in the process cavity is sucked into the pump body 102 through the gas input end 101, the shielding gas enters the pump body 102 through the shielding gas input end 104, and the shielding gas and the process gas are mixed in the pump body 102 and then are discharged from the gas output end 103 together. However, in such an arrangement, the shielding gas is continuously introduced into the shielding gas input end 104 regardless of whether the process chamber is in the process of coating, otherwise the vacuum pump is easily damaged due to too low gas flow rate or is easily locked due to deposited products. However, the continuous introduction of protective gas increases the cost of the equipment.
Therefore, how to reduce the use cost of the shielding gas as much as possible on the premise of ensuring the continuous and normal operation of the vacuum pump is a problem to be solved urgently by those skilled in the art.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is to overcome the defect of continuous use of the shielding gas in the prior art, and provide a working method of a vacuum pump system in vacuum coating and a vacuum pump system, so as to realize timely introduction of a suitable gas into a vacuum pump, so as to reduce the use cost of the shielding gas on the premise of ensuring the reliability of the equipment.
In order to solve the technical problem, the invention provides a working method of a vacuum pump system in vacuum coating, wherein the vacuum pump system comprises a process cavity, a pump body, a protective air source and a compressed air source, and the working method comprises the following steps:
s10: acquiring the working state of the process chamber, executing S20 when the process chamber is in the working state, and executing S30 when the process chamber is in the non-working state;
s20: the protective gas source is communicated with the pump body, so that the protective gas enters the pump body;
s30: the compressed air source and the pump body are communicated to make the compressed air enter the pump body.
In one embodiment of the present invention, the method further comprises the following steps:
and detecting the gas flow entering the pump body, and controlling the total flow of the gas introduced into the pump body to be not less than the lowest flow of the pump body according to the gas flow.
In one embodiment of the present invention, the detected gas flow rate is a process gas flow rate flowing from the process chamber into the pump body, and the flow rate of the protective gas is controlled to satisfy a preset ratio of the process gas to the protective gas.
In one embodiment of the present invention, in step S10, the gas type flowing into the pump body from the process chamber is detected, and the operating state of the process chamber is determined according to the gas type.
In one embodiment of the present invention, in step S10, an electrical signal of the process chamber controller is collected, and the operating state of the process chamber is determined according to the electrical signal.
The vacuum pump system comprises a pump body, wherein the pump body is communicated with a process cavity through a first gas input end, the pump body is communicated with a protective gas source through a second gas input end, the pump body is connected with a gas output end, the working method adopts the working method, the vacuum pump system further comprises a state detector for detecting the state of the process cavity, the pump body is communicated with a compressed air source through a third gas input end, the second gas input end and the third gas input end are communicated with a gas switching module, the gas switching module is communicated with the pump body through a fourth gas input end, and the state detector is electrically connected with the gas switching module.
In one embodiment of the present invention, the status detector is a gas detector, and the gas detector is disposed at the first gas input end.
In one embodiment of the invention, the state detector is a signal collector electrically connected to a controller of the process chamber.
In one embodiment of the present invention, a flow meter is connected to the pump body, and a flow control module is disposed at the fourth gas input end and electrically connected to the flow meter.
In one embodiment of the invention, the flow meter is mounted at the first gas input.
Compared with the prior art, the technical scheme of the invention has the following advantages:
the working method of the vacuum pump system is simple to operate, and proper protective gas is selected to be introduced into the vacuum pump according to the state of the process chamber, so that the use of nitrogen or other inert protective gas is reduced, and the cost is saved;
according to the vacuum pump system, the working state of the process cavity is judged, so that proper gas is introduced into the vacuum pump in time, the flow meter is utilized to realize the proper introduction of protective gas, the working condition of the pump body is ensured, and the cost is saved.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference is now made to the following detailed description of the embodiments of the present disclosure taken in conjunction with the accompanying drawings, in which
FIG. 1 is a prior art schematic;
FIG. 2 is a flow chart of a method of operation of the present invention;
FIG. 3 is a flow chart of an embodiment of a method of operation of the present invention;
FIG. 4 is a schematic view of a vacuum pumping system of the present invention.
The specification reference numbers indicate: 101. a gas input; 102. a pump body; 103. a gas output end; 104. a shielding gas input end;
201. a first gas input; 202. a pump body; 203. a gas output end; 204. a fourth gas input; 205. a second gas input; 206. a third gas input; 207. a gas switching module; 208. a flow control module; 209. a gas detector; 210. a flow meter.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Referring to fig. 2, a flow chart of a method for operating a vacuum pump system in vacuum deposition according to the present invention is shown. In the working method of the invention, the vacuum pump system comprises a process cavity, a pump body 202, a protective air source and a compressed air source, and comprises the following steps:
s10: acquiring the working state of the process chamber, executing S20 when the process chamber is in the working state, and executing S30 when the process chamber is in the non-working state; when the process chamber works, process gas enters the pump body 202, and in order to prevent the process gas from damaging the pump body 202, a protective gas source needs to feed protective gas into the pump body 202; when the process chamber is not operating, to prevent the pump body 202 from idling, the shielding gas source also needs to introduce shielding gas into the pump body 202 to ensure that the flow rate input into the pump body 202 is greater than the minimum flow rate of the pump body 202. The protective gas is usually nitrogen or inert gas, which is costly, and the protective gas is introduced when no process gas enters the pump body 202, which causes cost waste.
S20: communicating a shielding gas source with the pump body 202 to allow shielding gas to enter the pump body 202; at this time, since the process gas enters the pump body 202, the pump body 202 needs to be protected by introducing the protection gas.
S30: communicating the source of compressed air with the pump body 202 allows compressed air to enter the pump body 202. At this time, no process gas enters the pump body 202, so that only the pump body 202 is required to be ensured not to idle, the lowest flow of the pump body 202 can be met by introducing cheap compressed air, the working condition of the pump body 202 is ensured, the stability of the equipment is improved, and the cost is saved.
Further, referring to fig. 3, a flowchart of an embodiment of the working method of the present invention is shown. Because the gas that lets in the pump body 202 needs to satisfy the minimum flow requirement of the pump body 202, the gas flow is low excessively, can cause the damage to the pump body 202, and the gas flow is too high causes gaseous waste. In order to know the gas flow condition, the present embodiment further includes a step of detecting the gas flow entering the pump body 202, and controlling the total flow of the gas introduced into the pump body 202 to be not less than the minimum flow of the pump body 202 according to the gas flow. Specifically, the flow rate of each gas is directly detected by the flow meter 210, and the output flow rate of the pump body 202, that is, the total flow rate flowing into the pump body 202 may be detected. In this embodiment, to reduce the number of flowmeters 210, and thus reduce the cost, the gas flow detected by the flowmeters 210 is set as the process gas flow flowing into the pump body 202 from the process chamber. The minimum flow rate of the pump 202 is known, and the process gas flows out after sputtering, and when the flow rate of the process gas is known, the amount of protective gas or compressed air still needs to be introduced. When the process chamber is in a working state, the pump body 202 is damaged by the process gas, so that a certain proportional relation exists between the process gas and the protective gas, the lowest flow of the protective gas can be obtained by directly detecting the flow of the process gas, and the flow control module 208 can control the flow of the protective gas to meet the preset proportion of the process gas and the protective gas; the introduction of shielding gas is increased when the total flow rate of the process gas and the shielding gas is less than the minimum flow rate of the pump body 202 while the process gas and the shielding gas are in a proportional relationship. When the process chamber is in a non-operating state and the flow meter 210 detects no flow, the flow control module 208 directly controls to introduce the compressed air with a flow not less than the lowest flow of the pump 202. By the method, the protective gas can be introduced into the pump body in a proper amount at a proper time, so that the use of the protective gas is reduced, the use amounts of the protective gas and the compressed air are strictly controlled, the protective effect on the pump body is ensured, the use of the gas is optimized, and the use cost of the gas is further saved.
Further, in step S10, the type of gas flowing into the pump 202 is detected, and the operating state of the process chamber is determined based on the type of gas. In this embodiment, the gas detector 209 is used to detect a predetermined process gas, such as SiH4、NH3、NF3、N2O, the process chamber is in a working state, and protective gas is introduced into the pump body 202; otherwise, the process chamber is in a non-operating state, and dry compressed air is introduced into the pump body 202. The state of the process chamber is determined by detecting the gas type, so that the risk of damage to the pump body 202 caused by residual gas is reliably reduced, and the operation reliability is further improved.
In other embodiments of the present invention, in step S10, an electrical signal of the process chamber controller may be collected, and the operating state of the process chamber may be determined according to the electrical signal. The signal acquisition can be carried out through a signal acquisition device, and the signal acquisition device can be arranged at a proper position according to requirements. By the mode, the working state of the process cavity can be acquired more directly and accurately, and the implementation is convenient. Of course, the working state of the process chamber can be obtained in other manners, and the technical effect of the invention can be achieved as long as the working state of the process chamber can be obtained.
According to the technical scheme, on one hand, the protective gas is introduced into the pump body timely and properly, the cost of the protective gas is saved, on the other hand, the working state of the process cavity is obtained in a mode of acquiring signals or detecting the process gas, manual operation is avoided, similarly, the protective gas and the compressed air can be automatically switched through the gas switching module or other modes, full-automatic control can be achieved, and the control of the vacuum pump system is stably and efficiently achieved.
Fig. 4 is a schematic view of a vacuum pump system in vacuum coating according to the present invention. The vacuum pump system of the present invention comprises a pump body 202, wherein the pump body 202 is used for vacuumizing the process chamber and maintaining the vacuum state of the process chamber. Specifically, the pump body 202 is communicated with the process chamber through a first gas input end 201, the pump body 202 is communicated with a protective gas source through a second gas input end 205, and the pump body 202 is connected with a gas output end 203. When the pump body 202 works, gas in the process chamber is pumped through the first gas input end 201, the protective gas source is pumped through the second gas input end 205, and the pumped gas is output through the gas output end 203 by the pump body 202. In order to realize the switching of the gas, in this embodiment, the pump body 202 is communicated with a compressed air source through a third gas input end 206, the second gas input end 205 and the third gas input end 206 are communicated with a gas switching module 207, and the gas switching module 207 is communicated with the pump body 202 through a fourth gas input end 204. When the process chamber is in a working state, the pump body 202 is damaged by the gas in the process chamber, so the gas switching module 207 blocks the third gas input end 206, the second gas input end 205 is communicated with the pump body 202 through the fourth gas input end 204, and the mixed gas of the process gas and the protective gas is introduced into the pump body 202. When the process chamber is in a non-working state, since no process gas which can damage the pump body 202 is introduced, protective gas is not required to be introduced, in order to ensure normal operation of the pump body 202, cheap compressed air can be introduced into the pump body 202, and at this time, the gas switching module 207 blocks the second gas input end 205, so that the third gas input end 206 is communicated with the pump body 202 through the fourth gas input end 204. The gas switching module 207 in this embodiment may be a solenoid valve that controls the passage. In order to detect the working state of the process chamber, the vacuum pump system is provided with a state detector for detecting the state of the process chamber, and the state detector is electrically connected with the gas switching module 207. The vacuum pump system can introduce proper gas into the vacuum pump in time, so that the use cost of protective gas is reduced on the premise of ensuring the reliability of equipment.
Further, since the pump body 202 has the lowest flow rate, when the flow rate of the shielding gas introduced into the pump body 202 is small, the flow rate of the mixed gas of the process gas and the shielding gas does not meet the requirement of the lowest flow rate of the pump body 202, and the pump body 202 may be damaged, and when the flow rate of the shielding gas introduced into the pump body 202 is large, the flow rate of the mixed gas of the process gas and the shielding gas exceeds the requirement of the lowest flow rate of the pump body 202, and the shielding gas is wasted. Therefore, in this embodiment, the first gas input end 201 is provided with a flow meter 210, the fourth gas input end 204 is provided with a flow control module 208, and the flow control module 208 is electrically connected with the flow meter 210. The flow meter 210 monitors the flow rate of the process gas introduced into the pump body 202, when the process chamber is in a working state, the flow rate of the second gas input end 205 is determined according to a preset process gas flow rate-protective gas flow rate relation, and the flow rate control module 208 adjusts the flow rate of the protective gas to ensure that the amount of the protective gas is enough to protect the pump body 202; in addition, when the total flow rate of the process gas flow rate and the shielding gas flow rate is less than the minimum flow rate of the pump block 202, the flow rate of the shielding gas should be such that the total flow rate of the first gas input 201 and the second gas input 205 is greater than or equal to the minimum flow rate of the pump block 202; i.e., the flow of the shielding gas, should be ensured at the same time to be sufficient to protect the pump body 202 and to have a total flow greater than or equal to the minimum flow of the pump body 202.
Fig. 4 is a schematic diagram of an embodiment of the present invention. In this embodiment, the state detector is a gas detector 209, and the gas detector 209 is disposed at the first gas input end 201. The gas detector 209 detects the type of gas introduced into the pump 202, such as a predetermined process gas, e.g., SiH4、NH3、NF3、N2And O, the process chamber is in a working state, otherwise, the process chamber is in a non-working state.
During operation, when the process chamber is in an operating state, the process gas is sucked by the pump body 202, the gas detector 209 located at the first gas input end 201 detects a preset process gas, the gas switching module 207 is controlled, the gas switching module 207 blocks the third gas input end 206, and the second gas input end 205 is communicated with the pump body 202; the flow control module 208 adjusts the flow of the shielding gas entering the pump body 202 from the second gas input 205 in real time according to the gas flow measured by the flow meter 210, so that the flow of the shielding gas meets the requirement of protecting the pump body 202, and the total flow entering the pump body 202 is not less than the minimum flow of the pump body 202.
When the process chamber is switched to a non-working state, the gas detection module does not detect the process gas, the gas switching module 207 is controlled, the gas switching module 207 blocks the second gas input end 205, the third gas input end 206 is communicated with the pump body 202, so that dry compressed air enters the pump body 202 instead of inert shielding gas, and the total flow input into the pump body 202 is always not less than the lowest flow of the pump body 202 under the control of the flow meter 210 and the flow control module 208. And repeating the actions again until the process chamber enters a working state, so as to realize the switching of the protective gas.
In a second embodiment of the present invention, the state detector may also be a signal collector, and the signal collector is electrically connected to the controller of the process chamber.
When the gas switching device works, the signal collector collects a working signal sent by a controller of the process cavity, the process cavity is in a working state, the gas switching module 207 is controlled, the gas switching module 207 blocks the third gas input end 206, and the second gas input end 205 is communicated with the pump body 202; the flow control module 208 adjusts the flow of the shielding gas entering the pump body 202 from the second gas input 205 in real time according to the gas flow measured by the flow meter 210, so that the flow of the shielding gas meets the requirement of protecting the pump body 202, and the total flow entering the pump body 202 is not less than the minimum flow of the pump body 202.
The signal collector collects that a controller of the process chamber does not send a working signal, the process chamber is in a non-working state, the gas switching module 207 is controlled, the gas switching module 207 blocks the second gas input end 205, the third gas input end 206 is communicated with the pump body 202, dry compressed air enters the pump body 202 instead of inert protective gas, and the total flow input into the pump body 202 is always not less than the lowest flow of the pump body 202 under the control of the flow meter 210 and the flow control module 208. And repeating the actions again until the process chamber enters a working state, so as to realize the switching of the protective gas.
In other embodiments of the present invention, the state detector may also be other devices, as long as the working state of the process chamber can be obtained, the technical effects of the present invention can be achieved.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims (10)

1. A working method of a vacuum pump system in vacuum coating is characterized in that the vacuum pump system comprises a process cavity, a pump body, a protective air source and a compressed air source, and comprises the following steps:
s10: acquiring the working state of the process chamber, executing S20 when the process chamber is in the working state, and executing S30 when the process chamber is in the non-working state;
s20: the protective gas source is communicated with the pump body, so that the protective gas enters the pump body;
s30: the compressed air source and the pump body are communicated to make the compressed air enter the pump body.
2. The method of claim 1, wherein the vacuum pump system comprises: also comprises the following steps:
and detecting the gas flow entering the pump body, and controlling the total flow of the gas introduced into the pump body to be not less than the lowest flow of the pump body according to the gas flow.
3. The method of claim 2, wherein the vacuum pump system comprises: the detected gas flow is the process gas flow flowing into the pump body from the process cavity, and the flow of the protective gas is controlled to meet the preset ratio of the process gas to the protective gas.
4. The method of claim 1, wherein the vacuum pump system comprises: in step S10, the type of gas flowing into the pump body from the process chamber is detected, and the operating state of the process chamber is determined according to the type of gas.
5. The method of claim 1, wherein the vacuum pump system comprises: in step S10, an electrical signal of the process chamber controller is collected, and the operating state of the process chamber is determined by the electrical signal.
6. A vacuum pump system in vacuum coating, comprising a pump body, wherein the pump body is communicated with a process cavity through a first gas input end, the pump body is communicated with a protective gas source through a second gas input end, the pump body is connected with a gas output end, the working method of any one of claims 1 to 5 is adopted, the vacuum pump system further comprises a state detector for detecting the state of the process cavity, the pump body is communicated with a compressed air source through a third gas input end, the second gas input end and the third gas input end are communicated with a gas switching module, the gas switching module is communicated with the pump body through a fourth gas input end, and the state detector is electrically connected with the gas switching module.
7. The vacuum pumping system in vacuum coating according to claim 6, wherein: the state detector is a gas detector, and the gas detector is arranged at the first gas input end.
8. The vacuum pumping system in vacuum coating according to claim 6, wherein: the state detector is a signal collector which is electrically connected with the controller of the process chamber.
9. The vacuum pumping system in vacuum coating according to claim 6, wherein: the pump body is connected with a flowmeter, the fourth gas input end is provided with a flow control module, and the flow control module is electrically connected with the flowmeter.
10. A vacuum pumping system in vacuum coating according to claim 9, wherein: the flow meter is mounted to the first gas input.
CN202111184329.4A 2021-10-12 2021-10-12 Working method of vacuum pump system in vacuum coating and vacuum pump system Pending CN113621936A (en)

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CN202111184329.4A CN113621936A (en) 2021-10-12 2021-10-12 Working method of vacuum pump system in vacuum coating and vacuum pump system

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Application Number Priority Date Filing Date Title
CN202111184329.4A CN113621936A (en) 2021-10-12 2021-10-12 Working method of vacuum pump system in vacuum coating and vacuum pump system

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CN113621936A true CN113621936A (en) 2021-11-09

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040107897A1 (en) * 2002-12-05 2004-06-10 Seung-Hwan Lee Atomic layer deposition apparatus and method for preventing generation of solids in exhaust path
US20050081786A1 (en) * 2003-10-15 2005-04-21 Kubista David J. Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
CN105121698A (en) * 2013-04-04 2015-12-02 爱德华兹有限公司 Vacuum pumping and abatement system
CN106255828A (en) * 2014-05-01 2016-12-21 阿特利耶博世股份有限公司 Pumping method in pumping system and vacuum pump system
WO2018088771A1 (en) * 2016-11-09 2018-05-17 고려대학교 산학협력단 X-ray fluorescence analysis atomic layer deposition apparatus and x-ray fluorescence analysis atomic layer deposition method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040107897A1 (en) * 2002-12-05 2004-06-10 Seung-Hwan Lee Atomic layer deposition apparatus and method for preventing generation of solids in exhaust path
US20050081786A1 (en) * 2003-10-15 2005-04-21 Kubista David J. Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
CN105121698A (en) * 2013-04-04 2015-12-02 爱德华兹有限公司 Vacuum pumping and abatement system
CN106255828A (en) * 2014-05-01 2016-12-21 阿特利耶博世股份有限公司 Pumping method in pumping system and vacuum pump system
WO2018088771A1 (en) * 2016-11-09 2018-05-17 고려대학교 산학협력단 X-ray fluorescence analysis atomic layer deposition apparatus and x-ray fluorescence analysis atomic layer deposition method

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Application publication date: 20211109