CN113615049B - Coil body, stator, rotary machine, method for manufacturing coil body, and printed wiring board - Google Patents
Coil body, stator, rotary machine, method for manufacturing coil body, and printed wiring board Download PDFInfo
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- CN113615049B CN113615049B CN201980094372.6A CN201980094372A CN113615049B CN 113615049 B CN113615049 B CN 113615049B CN 201980094372 A CN201980094372 A CN 201980094372A CN 113615049 B CN113615049 B CN 113615049B
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/04—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
- H02K3/26—Windings characterised by the conductor shape, form or construction, e.g. with bar conductors consisting of printed conductors
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Abstract
A printed wiring board (1) constituting a coil body (42), wherein the surface of a wiring pattern formed on one surface is covered with an insulating layer, and the surface of a wiring pattern formed on the other surface is not covered with an insulating layer, the printed wiring board comprising: a wiring pattern forming region (1a) having wiring patterns formed on both one surface and the other surface; and a wiring pattern non-formation region (1b) in which no wiring pattern is formed on both the one surface and the other surface. The wiring pattern unformed region (1b) has at least one of a 1 st wiring pattern unformed region and a 2 nd wiring pattern unformed region, the 1 st wiring pattern unformed region is arranged at an end portion which becomes a winding starting portion of the printed wiring board (1) in the circumferential direction of the printed wiring board (1) molded into a cylindrical shape and has a length larger than or equal to an inner circumference of the coil body (42) in the circumferential direction, and the 2 nd wiring pattern unformed region is arranged at an end portion which becomes a winding ending portion of the printed wiring board (1) in the circumferential direction and has a length larger than or equal to an outer circumference of the coil body in the circumferential direction.
Description
Technical Field
The present invention relates to a coil body, a stator, a rotary machine, a method for manufacturing the coil body, and a printed wiring board using the printed wiring board on which a wiring pattern is formed.
Background
Conventionally, a coil body used for a stator of a rotary machine has been known in which a printed wiring board on which a wiring pattern is formed is wound a plurality of times and molded into a cylindrical shape. Patent document 1 discloses a coil body including a stator coil of a spindle motor. The coil body disclosed in patent document 1 is formed into a cylindrical shape by winding a 1 st sheet-like coil and a 2 nd sheet-like coil laminated with a sheet-like insulating material interposed therebetween. The 1 st sheet coil and the 2 nd sheet coil are formed with spiral printed patterns at a plurality of locations on both surfaces of a so-called flexible printed wiring board made of a base film of a polyimide film or the like.
Patent document 1: japanese Kokai publication Sho-62-84370
Disclosure of Invention
However, according to the coil body disclosed in patent document 1, since the printed pattern is exposed on the inner and outer circumferential surfaces of the coil body, in order to ensure insulation in the inner and outer circumferential surfaces of the coil body, an insulation treatment such as impregnation with varnish or molding treatment with resin is separately required, which causes a problem that the manufacturing process becomes complicated.
The present invention has been made in view of the above circumstances, and an object of the present invention is to obtain a coil body that can ensure insulation only by winding without requiring extra work and additional material, and can be wound at high density while preventing thickening of the winding.
In order to solve the above-described problems and achieve the object, a coil body according to the present invention includes a printed wiring board having a plurality of wiring patterns formed in a spiral shape on one surface and the other surface facing away from each other in a strip-shaped insulating substrate, and the coil body is formed in a cylindrical shape having a plurality of layers by winding the printed wiring board a plurality of times. The printed wiring board has a wiring pattern formation region where wiring patterns are formed on both one surface and the other surface, and a wiring pattern non-formation region where wiring patterns are not formed on both one surface and the other surface. The wiring pattern unformed region has at least one of a 1 st wiring pattern unformed region and a 2 nd wiring pattern unformed region, the 1 st wiring pattern unformed region is provided at an end portion which becomes a winding start portion of the printed wiring board in a circumferential direction of the printed wiring board molded into a cylindrical shape and has a length greater than or equal to an inner circumference of the coil body in the circumferential direction, and the 2 nd wiring pattern unformed region is provided at an end portion which becomes a winding end portion of the printed wiring board in the circumferential direction and has a length greater than or equal to an outer circumference of the coil body in the circumferential direction.
ADVANTAGEOUS EFFECTS OF INVENTION
The coil body according to the present invention has the effect of obtaining a coil body that is wound at high density while securing insulation by winding and preventing thickening of winding without requiring extra work and additional material.
Drawings
Fig. 1 is a perspective view of a rotary machine according to embodiment 1 of the present invention.
Fig. 2 is a view of the rotary machine according to embodiment 1 of the present invention, as viewed along the central axis.
Fig. 3 is a schematic view of a coil body according to embodiment 1 of the present invention as viewed along a central axis.
Fig. 4 is a main part sectional view of the printed wiring board according to embodiment 1 of the present invention.
Fig. 5 is a plan view of the printed wiring board according to embodiment 1 of the present invention.
Fig. 6 is a diagram showing 1 wiring pattern formed in a spiral shape functioning as a coil in embodiment 1 of the present invention.
Fig. 7 is a cross-sectional view of an insulating substrate showing a modification of the insulating substrate of the printed wiring board according to embodiment 1 of the present invention.
Fig. 8 is a plan view showing the reinforcing material cloth of the insulating substrate shown in fig. 7.
Fig. 9 is a schematic view of a coil body according to a modification of the coil body according to embodiment 1 of the present invention, as viewed along the center axis.
Fig. 10 is a schematic view of a coil body according to a modification of the coil body according to embodiment 1 of the present invention, as viewed along a central axis.
Fig. 11 is a flowchart showing a method of manufacturing the coil body shown in fig. 2.
Detailed Description
Hereinafter, a coil body, a stator, a rotary machine, a method of manufacturing the coil body, and a printed wiring board according to embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the embodiment.
Embodiment 1.
Fig. 1 is a perspective view of a rotary machine 30 according to embodiment 1 of the present invention. The rotary machine 30 includes: a cylindrical stator 40; and a rotor 50 provided inside the stator 40 and rotatable about the central axis C of the stator 40. Although not shown in fig. 1, the rotary machine 30 includes a housing that houses the stator 40 and the rotor 50.
Fig. 2 is a view of the rotary machine 30 according to embodiment 1 of the present invention, as viewed along the central axis C. The stator 40 has a core 41 and a coil body 42. The core 41 is formed in a cylindrical shape to cover the outer peripheral side of the stator 40. The iron core 41 is formed of a conductor. The coil body 42 is formed in a cylindrical shape and housed inside the stator 40. The inner peripheral surface of the core 41 abuts against the outer peripheral surface of the coil body 42.
Fig. 3 is a schematic view of the coil body 42 according to embodiment 1 of the present invention as viewed along the center axis C. The coil body 42 has the printed wiring board 1, and the printed wiring board 1 is wound a plurality of times and molded into a cylindrical shape having a plurality of layers. The printed wiring board 1 is in a sheet shape before being molded into a cylindrical shape. The printed wiring board 1 is provided with a wiring pattern 3 described later. Fig. 3 shows an example in which the printed wiring board 1 is wound 2 times and molded into a cylindrical shape. The coil body 42 is formed by winding a plurality of times, and the printed wiring board 1 is stacked in the radial direction of the printed wiring board 1 molded in a cylindrical shape to form a plurality of layers. The cross-sectional shape of the coil body 42 when cut through a plane perpendicular to the central axis C may be a circular shape or a polygonal shape. In the following description, the radial direction of the printed wiring board 1 molded in a cylindrical shape is simply referred to as the radial direction.
Fig. 4 is a main portion sectional view of the printed wiring board 1 according to embodiment 1 of the present invention. Fig. 5 is a plan development view of the printed wiring board 1 according to embodiment 1 of the present invention. In fig. 5, the direction indicated by the arrow Y is the direction along the central axis C, and the direction indicated by the arrow X is the circumferential direction of the printed wiring board 1. In the following description, the circumferential direction of the printed wiring board 1 molded in a cylindrical shape is simply referred to as the circumferential direction. In the following description of the printed wiring board 1 after the planar development, a term in the circumferential direction is sometimes used for convenience. Fig. 3 shows a printed wiring board 1 which is formed into a cylindrical shape by winding the area where the wiring pattern 3 is formed 2 times, that is, 2 revolutions.
In the printed wiring board 1, a plurality of wiring patterns 3 formed in a spiral shape and having a conductive property are arranged in a circumferential direction on both surfaces of a strip-shaped insulating substrate 2 made of an insulating material. In the printed wiring board 1, an insulating layer 4 for insulating the wiring pattern 3 from the outside is formed as a surface layer on only one surface of the insulating substrate 2. The surface layer may in other words be the uppermost layer located uppermost. That is, the printed wiring board 1 has the wiring pattern 3 and the insulating layer 4 laminated on one surface 2a of the insulating substrate 2, and has only the wiring pattern 3 on the other surface 2b of the insulating substrate 2. The one surface 2a and the other surface 2b are surfaces facing away from each other. Therefore, the surface of the wiring pattern 3 formed on the one surface 2a of the printed wiring board 1 is covered with the insulating layer 4, and the surface of the wiring pattern 3 formed on the other surface 2b is not covered with the insulating layer 4.
As the insulating substrate 2, an insulating substrate applicable to a general printed wiring board can be used. A flexible substrate and a rigid substrate are exemplified as a representative printed wiring board. Specifically, the flexible substrate is exemplified by polyester, polyimide, and a liquid crystal copolymer. Examples of the rigid substrate include paper phenol, paper epoxy resin, glass composite, glass epoxy resin, and Teflon (registered trademark). The film thickness of the insulating substrate 2 is not particularly limited as long as the printed wiring board 1 can be easily wound when the coil body 42 is formed, and is preferably in the range of 5 μm to 1mm in general.
The insulating layer 4 is made of an insulating material, and a solder resist layer is generally used. The insulating layer 4 has a function of insulating the wiring pattern 3 from the outside and a function of protecting the wiring pattern from dust, and moisture. The wiring pattern 3 may be covered with a protective film such as a gold plating layer to protect the wiring pattern 3 from mechanical disturbance such as impact or disturbance due to an environment such as moisture.
The layers of the wound printed wiring board 1 are bonded by an adhesive layer made of an adhesive 12 for bonding the wound printed wiring board 1 to each other. As the adhesive 12, a sheet-like adhesive or a liquid adhesive made of an insulating material is used. The adhesive 12 is disposed on one or both surfaces of the coil body 42, and bonds the printed wiring boards 1 after winding.
The adhesive 12 can ensure adhesion between the printed wiring boards 1 after winding in the coil body 42 formed by winding a plurality of times. In addition, the adhesive 12 can ensure insulation between the printed wiring boards 1 wound in the coil body 42. When adhesive 12 is disposed on the outer peripheral surface, insulation between coil body 42 and core 41 can be ensured. The adhesive 12 may be the entire area or a part of one surface of the coil body 42, or the entire area or a part of both surfaces. The larger the area of the adhesive 12 is, the more reliably the adhesiveness and insulation between the printed wiring boards 1 after winding can be ensured.
Further, the adhesive 12 can also be used as the insulating layer 4.
The sheet-like adhesive is not particularly limited as long as it is an adhesive that hardens. Typical examples of the sheet-shaped adhesive include a UV curable adhesive, a thermosetting adhesive, a melamine adhesive in which a plurality of sheets are stacked on each other, and a thermal adhesive. Examples of the UV curable adhesive include an epoxy adhesive and an acrylic adhesive. Examples of the thermosetting adhesive include an epoxy resin adhesive, an acrylic adhesive, a mixed adhesive of an epoxy resin and an acrylic resin, and a polyimide adhesive. Examples of the melphalan-based adhesive include an epoxy-based adhesive and an acrylic-based adhesive. Examples of the thermal adhesive include olefin adhesives and polyester adhesives.
The sheet-like adhesive may be used alone, or a plurality of kinds may be used simultaneously.
The liquid adhesive is not particularly limited as long as it is an adhesive that hardens. Typical examples of the liquid adhesive include a solvent type adhesive, a water type adhesive, a hot melt adhesive, an elastic adhesive, a thermosetting reactive adhesive, and a pressure sensitive adhesive. The solvent-based adhesive includes a rubber-based adhesive and a resin-based adhesive. Examples of the rubber adhesive include chloroprene rubber adhesives, styrene butadiene rubber adhesives, nitrile rubber adhesives, and natural rubber adhesives. Examples of the resin adhesive include vinyl chloride resin adhesives, vinyl acetate resin adhesives, acrylic resin adhesives, and urethane resin adhesives. Examples of the aqueous adhesive include water-soluble adhesives, emulsion adhesives, and latex adhesives.
Examples of the hot melt adhesive include thermoplastic elastomer hot melt adhesives and Ethylene Vinyl Acetate Copolymer (EVA) hot melt adhesives. Examples of the elastic adhesive include a silicon adhesive, a modified silicon adhesive, and a urethane adhesive. Examples of the thermosetting reactive adhesive include thermosetting epoxy adhesives, photo-curing epoxy adhesives, polyurethane adhesives, urea adhesives, melamine adhesives, phenol adhesives, anaerobic acrylic adhesives, second-generation acrylic adhesives, photo-curing acrylic adhesives, and cyanoacrylate adhesives. Examples of the pressure-sensitive adhesive include acrylic adhesives, rubber adhesives, and silicon adhesives.
The liquid adhesive may be used alone, or a plurality of types may be used simultaneously.
The wiring pattern 3 is composed of three phases of U-phase, V-phase, and W-phase. Specifically, the wiring pattern 3 is formed by sequentially arranging a U-phase first phase pattern 5, a V-phase second phase pattern 6, and a W-phase third phase pattern 7. The adjacent wiring patterns 3 are electrically insulated from each other. The printed wiring board 1 is formed by arranging n sets of the first phase pattern 5, the second phase pattern 6, and the third phase pattern 7, which are wiring patterns 3 corresponding to three phases, as one set. Further, n is a natural number of 1 or more.
In the printed wiring board 1 molded in a cylindrical shape, the first phase pattern 5, the second phase pattern 6, and the third phase pattern 7 are formed in the same number in each layer of the printed wiring board 1. In addition, the first phase patterns 5 formed in the respective layers coincide with each other in center when viewed in the radial direction. This may also be put in other words, the center of the first phase pattern 5 formed in the layer on the inner peripheral side and the center of the first phase pattern 5 formed in the layer on the outer peripheral side coincide when viewed in the radial direction. The centers of the second phase patterns 6 formed in the respective layers and the centers of the third phase patterns 7 formed in the respective layers also overlap with each other when viewed in the radial direction. The wiring patterns 3 that overlap when viewed in the radial direction are electrically connected to each other at their ends. The printed wiring board 1 is molded into a cylindrical shape, and thus the wiring pattern 3 functions as a coil of the stator 40.
The printed wiring board 1 is formed with a terminal connection portion 11 projecting in a direction along the central axis C. The terminal connection portion 11 is provided with a terminal of the wiring pattern 3. As shown in fig. 1, in a state where the printed wiring board 1 is molded into a cylindrical shape, the terminal connecting portion 11 also projects in a direction along the central axis C. A power supply line, not shown, is connected to the end of the wiring pattern 3 provided on the protruding portion, whereby power can be supplied to the wiring pattern 3. Since the wiring patterns 3 formed in the respective layers are electrically connected to each other, if the terminal of the wiring pattern 3 formed in any layer is provided in the terminal connecting portion 11, power can be supplied to the wiring patterns 3 formed in all the layers.
In addition, the printed wiring board 1 has: a wiring pattern forming region 1a in which a wiring pattern 3 is formed; and a wiring pattern non-formation region 1b constituted only by the insulating substrate 2 on which the wiring patterns 3 are not formed on both the one surface 2a and the other surface 2 b.
The wiring pattern non-formation region 1b is provided at an end portion in the circumferential direction of the winding start portion of the insulating substrate 2 in a band shape in the coil body 42. The wiring pattern non-formation region 1b provided at an end portion in the circumferential direction of the winding start portion of the insulating substrate 2 in the coil body 42 is a 1 st wiring pattern non-formation region, and has a length in the circumferential direction which is greater than or equal to the inner circumference of the coil body 42. Thus, the inner peripheral surface of the coil body 42 is constituted only by the wiring pattern non-formation region 1 b. That is, only the wiring pattern non-formation region 1b is exposed on the inner peripheral surface of the coil body 42, and the wiring pattern formation region 1a is not exposed. The inner peripheral surface of coil body 42 is formed only by wiring pattern non-formed region 1b, and insulation from rotor 50 arranged on the inner peripheral side of coil body 42 can be ensured.
A coil body is conceived which is formed by winding a printed wiring board, which does not have the wiring pattern non-formation area 1b but is constituted only by the wiring pattern formation area 1a, a plurality of times so that the surface having the insulating layer 4 as the uppermost layer becomes the outer peripheral surface, and molding the wound body into a cylindrical shape. Since the outer peripheral surface of the coil body is formed of the insulating layer 4, insulation can be secured between the core 41 adjacent to the outer peripheral side of the coil body 42. However, since the wiring pattern 3 is exposed on the inner peripheral surface of the coil body 42, insulation from the rotor 50 disposed on the inner peripheral side of the coil body 42 cannot be secured. In this case, in order to ensure insulation of the inner peripheral surface of the coil body, it is necessary to separately perform an insulation treatment such as impregnation with varnish or molding treatment with resin, which complicates the manufacturing process and increases the cost of the coil body.
In contrast, the coil body 42 is a coil body formed in a cylindrical shape by winding the printed wiring board 1 having the wiring pattern non-formation region 1b and the wiring pattern formation region 1a plurality of times so that the surface having the insulating layer 4 as the uppermost layer becomes the outer peripheral surface. Since the outer peripheral surface of the coil body 42 is formed of the insulating layer 4, insulation can be secured between the core 41 adjacent to the outer peripheral side of the coil body 42. In the coil body 42, the inner peripheral surface of the coil body 42 is formed only by the wiring pattern non-formation region 1b, and thus insulation from the rotor 50 disposed on the inner peripheral side of the coil body 42 can be ensured.
Therefore, the coil body 42 has a structure in which the printed wiring board 1 having the wiring patterns 3 formed on both surfaces of the insulating substrate 2 and the insulating layer 4 formed only on the uppermost layer on one surface side of the insulating substrate 2 is wound a plurality of times and molded into a cylindrical shape, and insulation from the outside is secured between the inner peripheral surface and the outer peripheral surface of the coil body 42. The coil body 42 does not need to be subjected to an insulation treatment such as impregnation with varnish or molding treatment with a resin for ensuring insulation in the inner peripheral surface, and therefore, the manufacturing process is simple and no increase in cost due to the insulation treatment occurs. Further, since the coil body 42 is not subjected to a surface coating treatment such as a molding treatment, the winding is prevented from becoming thick, and the printed wiring board 1 can be wound in the thickness direction of the coil body 42 at a high density. That is, the coil body 42 can be formed by winding the printed wiring board 1 without requiring extra work and additional material, and can be formed by winding the coil body 42 at a low cost and a high density while preventing the coil body from being thickened while ensuring insulation between the inner peripheral surface and the outer peripheral surface of the coil body 42 from the outside.
Returning to fig. 5, the printed wiring board 1 has a copper pattern 9, which is a metal pattern not electrically connected to the wiring pattern 3, in a region adjacent to the long side 1c of the printed wiring board 1. That is, the printed wiring board 1 has the copper pattern 9 that is not electrically connected to the wiring pattern 3 in a region adjacent to a side along the circumferential direction of the printed wiring board 1 molded in a cylindrical shape. The copper pattern 9 is provided to improve the rigidity of the printed wiring board 1 when the printed wiring board 1 is wound to form the coil body 42, thereby facilitating the operation of winding the printed wiring board 1.
The copper pattern 9 is provided in a region corresponding to the wiring patterns 3 in the circumferential direction of the printed wiring board 1 at least in a region adjacent to the long side 1c in order to improve the rigidity of the printed wiring board 1. The copper pattern 9 is preferably provided in the entire area corresponding to the wiring pattern 3 in the circumferential direction of the printed wiring board 1 in the area adjacent to the long side 1 c. In addition, the copper pattern 9 is more preferably provided in the entire wiring pattern formation area 1a in the circumferential direction of the printed wiring board 1 in the area adjacent to the long side 1 c.
The copper pattern 9 may not be provided in the wiring pattern non-formation region 1 b.
The copper pattern 9 may be formed as a part of the coil body 42 and may be left in the coil body 42. In the case where the copper pattern 9 is not required as the coil body 42, it may be removed after the coil body 42 is formed. In the case where the copper pattern 9 is removed after the coil body 42 is formed, the folding line 10 is added to the insulating layer 4 disposed between the copper pattern 9 and the wiring pattern 3 as shown in fig. 5. The thickness, length, and interval of the folding line 10 are not particularly limited as long as the copper pattern 9 and the wiring pattern 3 can be separated from each other.
Fig. 6 is a diagram showing 1 wiring pattern 3 formed in a spiral shape and functioning as a coil in embodiment 1 of the present invention. In the in-plane direction of the printed wiring board 1, a copper pattern 8, which is a metal pattern not electrically connected to the wiring pattern 3, is provided in a region inside the inner periphery of the wiring pattern 3 functioning as a coil. The copper pattern 8 may be a continuous single pattern or may be a divided pattern divided into a plurality of patterns.
When the copper pattern 8 is a divided pattern, the size and shape of each divided pattern are not particularly limited. The copper patterns 8 provided on the plurality of wiring patterns 3 do not need to have the same size or the same shape. That is, the copper patterns 8 provided on the plurality of wiring patterns 3 may be all the same pattern, some of the copper patterns may be the same pattern, or all the copper patterns may be different patterns.
The wiring pattern 3 of the copper pattern 8 is provided in the inner region of the inner periphery, and the printed wiring board 1 may include 1 or more copper patterns 8 provided in all the wiring patterns 3. The copper pattern 8 has an effect of improving the electrical characteristics of the rotary machine 30 by controlling the influence of iron loss of the rotary machine 30, copper loss of the rotary machine 30, and the like, in addition to improving the rigidity of the printed wiring board 1.
Fig. 7 is a cross-sectional view of an insulating substrate 71 showing a modification of the insulating substrate 2 of the printed wiring board 1 according to embodiment 1 of the present invention. Fig. 8 is a plan view showing the reinforcing material cloth 73 of the insulating substrate 71 shown in fig. 7. The insulating substrate 71 includes: a base portion 72, which is a main structural portion; and a reinforcing material cloth 73 provided inside the base portion 72 for improving the rigidity of the insulating substrate 71.
The reinforcing material cloth 73 has a belt-like shape in the in-plane direction of the insulating substrate 71, similarly to the belt-like insulating substrate 71. The in-plane direction of the reinforcing material cloth 73 and the in-plane direction of the insulating substrate 71 are parallel to each other. In the reinforcing material cloth 73, the reinforcing rod-like fiber bundles 74 are arranged in a lattice shape in the in-plane direction of the reinforcing material cloth 73.
When the printed wiring board 1 is wound a plurality of times, a force applied in the longitudinal direction of the printed wiring board 1 is stronger than a force applied in the short-side direction of the printed wiring board 1. Therefore, in order to reinforce the mechanical strength of the printed wiring board 1 in the longitudinal direction, the angle α formed between the longitudinal direction of the fiber bundle 74a extending in the longitudinal direction of the tape-shaped insulating substrate 71 and the longitudinal direction of the insulating substrate 71 in the in-plane direction of the insulating substrate 71 by the reinforcing-material cloth 73 is set to be less than 45 degrees. That is, in the in-plane direction of the reinforcing material cloth 73, the angle formed by the longitudinal direction of the fiber bundle 74a extending in the longitudinal direction of the belt-shaped reinforcing material cloth 73 and the longitudinal direction of the reinforcing material cloth 73 is set to be less than 45 degrees in the reinforcing material cloth 73. The number of the fiber bundles 74a extending in the longitudinal direction of the insulating substrate 71 in the in-plane direction of the insulating substrate 71 is set to be equal to or greater than the number of the fiber bundles 74b extending in the short-side direction of the insulating substrate 71. That is, the number of the fiber bundles 74a extending in the longitudinal direction of the reinforcing material cloth 73 in the in-plane direction of the reinforcing material cloth 73 is set to be equal to or greater than the number of the fiber bundles 74b extending in the short-side direction of the reinforcing material cloth 73.
As the reinforcing-material cloth 73, a reinforcing-material cloth applicable to a general printed wiring board can be used. Typical examples of the reinforcing material cloth include glass cloth, alumina cloth, and silica cloth. The reinforcing material cloth 73 may be used alone, or a mixture of plural kinds may be used.
In the rotary machine 30 described above, since the outer peripheral surface of the coil body 42 is formed of the insulating layer 4, insulation can be secured between the core 41 adjacent to the outer peripheral side of the coil body 42.
In the rotary machine 30, the wiring pattern non-formation region 1b is provided at an end portion in the circumferential direction of the winding start portion of the insulating substrate 2 in the coil body 42, which is formed in a band shape. The wiring pattern non-formation region 1b has a length in the circumferential direction equal to or longer than the inner circumference of the coil body 42. Thus, the inner peripheral surface of the coil body 42 is constituted only by the wiring pattern non-formation region 1b, and therefore insulation can be secured from the rotor 50 disposed on the inner peripheral side of the coil body 42.
Therefore, the coil body 42 of the rotary machine 30 ensures insulation between the inner peripheral surface and the outer peripheral surface of the coil body 42 and the outside, and the characteristics of the rotary machine 30 can be improved.
Fig. 9 is a schematic view of a coil body 42a, which is a modification of the coil body 42 according to embodiment 1 of the present invention, as viewed along the center axis C. The coil body 42a is different from the coil body 42 in that it has a printed wiring board 61 formed into a cylindrical shape by winding a plurality of times. The coil body 42a is a coil body formed in a cylindrical shape by winding a printed wiring board 61 having a wiring pattern non-formation area 1b and a wiring pattern formation area 1a plurality of times so that the uppermost surface of the insulating layer 4 becomes the inner circumferential surface. The laminated structure of the wiring pattern formation area 1a in the printed wiring board 61 is the same as that of the printed wiring board 1.
The printed wiring board 61 is provided with a wiring pattern non-formation region 1b at an end portion in the circumferential direction of a winding end portion of the insulating substrate 2 which is formed in a strip shape in the coil body 42 a. The wiring pattern non-formation region 1b provided at an end portion in the circumferential direction of the winding end portion of the insulating substrate 2 in the coil body 42a is a 2 nd wiring pattern non-formation region, and has a length in the circumferential direction which is greater than or equal to the outer circumference of the coil body 42 a. Thus, the outer peripheral surface of the coil body 42a is constituted only by the wiring pattern non-formation region 1 b. That is, only the wiring pattern non-formation region 1b is exposed on the outer peripheral surface of the coil body 42a, and the wiring pattern formation region 1a is not exposed.
Since the inner peripheral surface of the coil body 42a configured as described above is formed of the insulating layer 4, insulation from the rotor 50 disposed on the inner peripheral side of the coil body 42a can be ensured. In the coil body 42a, the outer peripheral surface of the coil body 42a is formed only by the area 1b where the wiring pattern is not formed, and therefore insulation can be secured between the iron core 41 adjacent to the outer peripheral side of the coil body 42 a.
Therefore, the coil body 42a has a structure in which the printed wiring board 61 having the wiring patterns 3 formed on both surfaces of the insulating substrate 2 and the insulating layer 4 formed only on the uppermost layer on one surface side of the insulating substrate 2 is wound a plurality of times and molded into a cylindrical shape, and insulation from the outside is secured in the inner peripheral surface and the outer peripheral surface of the coil body 42 a. The coil body 42a does not require a varnish impregnation process or a molding process with a resin to ensure insulation in the outer peripheral surface of the coil body 42a, and the manufacturing process is simple. Further, since the coil body 42a is not subjected to a surface coating process such as a molding process, winding thickening is prevented, and the printed wiring board 61 can be wound in the thickness direction of the coil body 42a at high density. That is, the coil body 42a can ensure insulation between the inner peripheral surface and the outer peripheral surface of the coil body 42a from the outside by simply winding the printed wiring board 61 without requiring extra work and additional material, and can realize a coil body wound at high density while preventing the winding from becoming thick.
Fig. 10 is a schematic view of a coil body 42b, which is a modification of the coil body 42 according to embodiment 1 of the present invention, as viewed along the center axis C. The coil body 42b is different from the coil body 42 in that it has a printed wiring board 62 formed into a cylindrical shape by winding a plurality of times. The coil body 42b is a coil body formed into a cylindrical shape by winding a printed wiring board 62 having the wiring pattern non-formation areas 1ba and 1bb and the wiring pattern formation area 1a plurality of times. The laminated structure of the wiring pattern formation area 1a in the printed wiring board 62 is the same as that of the printed wiring board 1.
The printed wiring board 62 is provided with a wiring pattern non-formation region 1ba at an end portion in the circumferential direction of a winding start portion of the insulating substrate 2 in a band shape in the coil body 42 b. The wiring pattern unformed region 1ba has a length in the circumferential direction which is greater than or equal to the inner circumference of the coil body 42 b. Thus, the inner peripheral surface of the coil body 42b is constituted only by the wiring pattern non-formation region 1 ba. That is, only the wiring pattern non-formation region 1ba is exposed on the inner peripheral surface of the coil body 42b, and the wiring pattern formation region 1a is not exposed.
The printed wiring board 62 is provided with a wiring pattern non-formation region 1bb at an end portion in the circumferential direction of a winding end portion of the insulating substrate 2 in a band shape in the coil body 42 b. The wiring pattern non-formation region 1bb has a length in the circumferential direction that is greater than or equal to the outer periphery of the coil body 42 b. Thus, the outer peripheral surface of the coil body 42b is constituted only by the wiring pattern non-formation region 1 bb. That is, only the wiring pattern non-formation region 1bb is exposed on the outer peripheral surface of the coil body 42b, and the wiring pattern formation region 1a is not exposed.
Since the inner peripheral surface of the coil body 42b configured as described above is configured by the wiring pattern unformed region 1ba, insulation from the rotor 50 arranged on the inner peripheral side of the coil body 42b can be ensured. In the coil body 42b, the outer peripheral surface of the coil body 42b is formed only by the wiring pattern non-formed region 1bb, and therefore insulation can be secured between the iron core 41 adjacent to the outer peripheral side of the coil body 42 b.
Therefore, in any of the case where the coil body 42b is formed by winding the printed wiring board 62 a plurality of times so that the surface with the insulating layer 4 as the uppermost layer becomes the inner peripheral surface and the case where the coil body 42b is formed by winding the printed wiring board 62 a plurality of times so that the surface with the insulating layer 4 as the uppermost layer becomes the outer peripheral surface and the case where the coil body is formed as the tube shape, insulation between the inner peripheral surface and the outer peripheral surface of the coil body 42b from the outside is ensured.
As described above, the coil body 42 according to embodiment 1 does not require extra work or additional material, and can ensure insulation by winding only, and can realize a coil body that is wound at high density while preventing thickening of winding. In the rotary machine 30 according to embodiment 1, the insulating layer 4 is disposed only on the uppermost layer on one side of the coil body 42, and insulation can be secured even by winding a plurality of times. That is, according to the rotary machine 30 of embodiment 1, the inner peripheral surface and the outer peripheral surface of the coil body 42, which is formed by winding the printed wiring board 1 having the wiring patterns 3 formed on both surfaces thereof, a plurality of times, can be insulated. Thus, according to the rotary machine 30 of embodiment 1, the characteristics of the rotary machine 30 can be improved.
In embodiment 2, a method for manufacturing a coil body will be described. Fig. 11 is a flowchart showing a method of manufacturing the coil body 42 shown in fig. 2.
First, in step S10, the printed wiring board 1 is formed. The method of forming the wiring pattern 3 on the insulating substrate 2 is not particularly limited. In a general method for forming the wiring pattern 3, a copper layer is formed on the insulating substrate 2, and electroless plating and electric plating of copper are performed. Then, a resist layer was formed, and the copper layer was patterned using this resist layer as a mask to obtain a spiral wiring pattern 3. Further, a solder resist layer may be formed as the insulating layer 4 on the wiring pattern 3, thereby protecting the wiring pattern 3 from dust, and moisture and ensuring insulation.
The wiring patterns 3 are formed on both sides of the printed wiring board 1. When the first phase pattern 5, the second phase pattern 6, and the third phase pattern 7 are formed on both surfaces of the printed wiring board 1, the wiring patterns 3 of different phases need to be formed in a shape that does not intersect with each other. When the wiring patterns 3 of different phases intersect, a material that takes insulation into consideration may be provided between the wiring patterns 3.
In step S20, the adhesive 12 is disposed on the planar printed wiring board 1. When the printed wiring board 1 is wound and molded into a cylindrical shape, a step of disposing the adhesive 12 on one side or both sides of the printed wiring board 1 and providing an adhesive layer is performed. That is, one side or both sides of the printed wiring board 1 are covered with a sheet-shaped adhesive or a liquid adhesive. The printed wiring board 1 and the adhesive 12 may or may not be bonded. The portion of the printed wiring board 1 covered with the sheet-like adhesive or the liquid adhesive may be the entire surface or a part of one or both sides of the printed wiring board 1.
Then, in step S30, the printed wiring board 1 is wound into a roll shape a plurality of times and molded into a cylindrical shape. Then, in step S40, the adhesive 12 is cured by curing at room temperature, curing by heating, curing by light, or curing by moisture in accordance with the type of the adhesive 12, thereby forming the cylindrical coil body 42.
When viewed in the radial direction of the printed wiring board 1 molded in a cylindrical shape, the wiring patterns 3 formed in the respective layers after winding are overlapped with each other, and the wiring patterns 3 formed in the respective layers are electrically connected to each other. The stator 40 is obtained by inserting the coil body 42 into the core 41 disposed on the outer periphery of the coil body 42, and bonding or adhering the coil body 42 to the core 41. The order of the steps can be changed arbitrarily.
The configurations described in the above embodiments are only examples of the contents of the present invention, and the techniques of the embodiments may be combined with each other or with other known techniques, and some of the configurations may be omitted or modified without departing from the scope of the present invention.
Description of the reference numerals
1 printed wiring board, 1a wiring pattern forming area, 1b, 1ba, 1bb wiring pattern non-forming area, 1C long side, 2, 71 insulating substrate, 2a one side, 2b other side, 3 wiring pattern, 4 insulating layer, 5 first phase pattern, 6 second phase pattern, 7 third phase pattern, 8, 9 copper pattern, 10 folded wire, 11 terminal connection part, 12 adhesive, 30 rotary machine, 40 stator, 41 iron core, 42a, 42b coil body, 50 rotor, 61, 62 printed wiring board, 72 base body, 73 reinforcing material cloth, 74a, 74b fiber bundle, C center axis.
Claims (14)
1. A coil body having a printed wiring board in which a plurality of wiring patterns are formed in a spiral shape on one surface and the other surface facing away from each other in a strip-shaped insulating substrate, the coil body being formed by winding the printed wiring board a plurality of times to form a cylindrical shape having a plurality of layers,
the coil body is characterized in that,
wherein the surface of the wiring pattern formed on the one surface is covered with an insulating layer, and the surface of the wiring pattern formed on the other surface is not covered with an insulating layer,
the printed wiring board has a wiring pattern forming region in which the wiring patterns are formed on both the one surface and the other surface, and a wiring pattern non-forming region in which the wiring patterns are not formed on both the one surface and the other surface,
the wiring pattern unformed region has at least one of a 1 st wiring pattern unformed region and a 2 nd wiring pattern unformed region, the 1 st wiring pattern unformed region is provided at an end portion which becomes a winding start portion of the printed wiring board in a circumferential direction of the printed wiring board molded into the cylindrical shape and has a length in the circumferential direction which is greater than or equal to an inner circumference of the coil body, and the 2 nd wiring pattern unformed region is provided at an end portion which becomes a winding end portion of the printed wiring board in the circumferential direction and has a length in the circumferential direction which is greater than or equal to an outer circumference of the coil body.
2. Coil body according to claim 1,
the plurality of layers are bonded by an adhesive.
3. Coil body according to claim 2,
the adhesive is a sheet adhesive or a liquid adhesive.
4. Coil body according to claim 3,
the insulating layer is the sheet adhesive or the liquid adhesive.
5. Coil body according to one of claims 1 to 4,
a region adjacent to the side in the circumferential direction in the printed wiring board has a metal pattern that is not electrically connected to the wiring pattern.
6. Coil body according to claim 5,
the metal pattern is a single pattern or a divided pattern divided into a plurality of patterns.
7. Coil body according to one of claims 1 to 6,
the insulating substrate has a reinforcing material cloth having a fiber bundle therein, the reinforcing material cloth having an in-plane direction parallel to the in-plane direction of the insulating substrate,
the reinforcing material cloth is arranged in the in-plane direction of the insulating substrate, and an angle formed between the longitudinal direction of the fiber bundle extending in the longitudinal direction of the insulating substrate and the longitudinal direction of the insulating substrate is less than 45 degrees,
the number of the fiber bundles extending in the longitudinal direction of the insulating substrate in the in-plane direction of the insulating substrate is equal to or greater than the number of the fiber bundles extending in the short-side direction of the insulating substrate.
8. A stator, comprising:
the coil body of any one of claims 1 to 7; and
and a core having a cylindrical shape surrounding an outer periphery of the coil body, an inner peripheral surface of the core being in contact with an outer peripheral surface of the coil body.
9. A rotary machine characterized by comprising:
the stator of claim 8; and
a rotor rotatably provided inside the stator.
10. A method for manufacturing a coil body according to claim 1, comprising:
disposing an adhesive on the planar printed wiring board;
winding the printed wiring board to form a cylindrical shape; and
hardening the adhesive.
11. A printed wiring board for use in a coil body formed by winding the printed wiring board a plurality of times to form a cylindrical shape having a plurality of layers,
the printed wiring board is characterized in that,
a plurality of spiral wiring patterns are formed on one surface and the other surface of the strip-shaped insulating substrate facing away from each other,
a surface of the wiring pattern formed on the one surface is covered with an insulating layer, and a surface of the wiring pattern formed on the other surface is not covered with an insulating layer,
having a wiring pattern forming region in which the wiring patterns are formed on both the one surface and the other surface, and a wiring pattern non-forming region in which the wiring patterns are not formed on both the one surface and the other surface,
the wiring pattern unformed region has at least one of a 1 st wiring pattern unformed region and a 2 nd wiring pattern unformed region, the 1 st wiring pattern unformed region is provided at an end portion which becomes a winding start portion of the printed wiring board in a circumferential direction of the printed wiring board molded into the cylindrical shape and has a length in the circumferential direction which is greater than or equal to an inner circumference of the coil body, and the 2 nd wiring pattern unformed region is provided at an end portion which becomes a winding end portion of the printed wiring board in the circumferential direction and has a length in the circumferential direction which is greater than or equal to an outer circumference of the coil body.
12. The printed wiring board of claim 11,
a region adjacent to the side in the circumferential direction in the printed wiring board has a metal pattern that is not electrically connected to the wiring pattern.
13. The printed wiring board of claim 12,
the metal pattern is a single pattern or a divided pattern divided into a plurality of patterns.
14. The printed wiring board of any one of claims 11 to 13,
the insulating substrate has a reinforcing material cloth having a fiber bundle therein, the reinforcing material cloth having an in-plane direction parallel to the in-plane direction of the insulating substrate,
the reinforcing material cloth is arranged in the in-plane direction of the insulating substrate, and an angle formed by the longitudinal direction of the fiber bundle extending in the longitudinal direction of the insulating substrate and the longitudinal direction of the insulating substrate is less than 45 degrees,
the number of the fiber bundles extending in the longitudinal direction of the insulating substrate is greater than or equal to the number of the fiber bundles extending in the short-side direction of the insulating substrate in the in-plane direction of the insulating substrate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/013453 WO2020194627A1 (en) | 2019-03-27 | 2019-03-27 | Coil body, stator, rotating machine, coil body manufacturing method, and printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113615049A CN113615049A (en) | 2021-11-05 |
| CN113615049B true CN113615049B (en) | 2022-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980094372.6A Active CN113615049B (en) | 2019-03-27 | 2019-03-27 | Coil body, stator, rotary machine, method for manufacturing coil body, and printed wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6644206B1 (en) |
| CN (1) | CN113615049B (en) |
| WO (1) | WO2020194627A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023042671A (en) * | 2021-09-15 | 2023-03-28 | イビデン株式会社 | Coil substrate, coil substrate for motor, and motor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60167307A (en) * | 1984-02-09 | 1985-08-30 | Matsushita Electric Ind Co Ltd | Manufacture of printed coil |
| JPS6284370U (en) * | 1985-11-18 | 1987-05-29 | ||
| JPH11275792A (en) * | 1998-03-20 | 1999-10-08 | Mitsubishi Materials Corp | Air-core flat coil and its manufacturing method |
| US6278205B1 (en) * | 1999-07-20 | 2001-08-21 | U.S. Philips Corpration | Electric motor with connector element on foil-shaped insulating substrate |
| JP2011087437A (en) * | 2009-10-19 | 2011-04-28 | Shicoh Engineering Co Ltd | Method of manufacturing coreless armature, and coreless armature |
| WO2018193618A1 (en) * | 2017-04-21 | 2018-10-25 | 三菱電機株式会社 | Coil body, stator, rotating machine, and coil body manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2834736A1 (en) * | 2011-04-11 | 2012-10-18 | Allied Motion Technologies Inc. | Flexible winding for an electric motor and method of producing |
-
2019
- 2019-03-27 CN CN201980094372.6A patent/CN113615049B/en active Active
- 2019-03-27 WO PCT/JP2019/013453 patent/WO2020194627A1/en active Application Filing
- 2019-03-27 JP JP2019553581A patent/JP6644206B1/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60167307A (en) * | 1984-02-09 | 1985-08-30 | Matsushita Electric Ind Co Ltd | Manufacture of printed coil |
| JPS6284370U (en) * | 1985-11-18 | 1987-05-29 | ||
| JPH11275792A (en) * | 1998-03-20 | 1999-10-08 | Mitsubishi Materials Corp | Air-core flat coil and its manufacturing method |
| US6278205B1 (en) * | 1999-07-20 | 2001-08-21 | U.S. Philips Corpration | Electric motor with connector element on foil-shaped insulating substrate |
| JP2011087437A (en) * | 2009-10-19 | 2011-04-28 | Shicoh Engineering Co Ltd | Method of manufacturing coreless armature, and coreless armature |
| WO2018193618A1 (en) * | 2017-04-21 | 2018-10-25 | 三菱電機株式会社 | Coil body, stator, rotating machine, and coil body manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6644206B1 (en) | 2020-02-12 |
| WO2020194627A1 (en) | 2020-10-01 |
| JPWO2020194627A1 (en) | 2021-04-30 |
| CN113615049A (en) | 2021-11-05 |
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