JP6644206B1 - Coil body, stator, rotating machine, method of manufacturing coil body, and printed wiring board - Google Patents

Abstract

The printed wiring board (1) constituting the coil body (42) has a surface of a wiring pattern formed on one surface covered with an insulating layer and a surface of a wiring pattern formed on the other surface covered with an insulating layer. A wiring pattern forming region (1a) having wiring patterns formed on both surfaces of one surface and the other surface, and a wiring pattern non-forming region (1b) having no wiring pattern formed on both surfaces of the one surface and the other surface. Have. The region (1b) where the wiring pattern is not formed is provided at an end portion of the cylindrical printed wiring board (1) where winding of the printed wiring board (1) starts in the circumferential direction, and the coil body (42) is formed in the circumferential direction. ), A first wiring pattern unformed region having a length equal to or longer than the inner circumference, and a length longer than the outer circumference of the coil body in the circumferential direction, provided at the end where the winding of the printed wiring board (1) ends in the circumferential direction. And at least one of the second wiring pattern non-formed regions having the thickness.

Description

  The present invention relates to a coil body, a stator, a rotating machine, a method of manufacturing a coil body, and a printed wiring board using a printed wiring board on which a wiring pattern is formed.

  2. Description of the Related Art Conventionally, it is known that a printed wiring board on which a wiring pattern is formed is wound a plurality of times and formed into a cylindrical shape to be used as a coil body used for a stator of a rotating machine. Patent Literature 1 discloses a coil body constituting a stator coil of a spindle motor. The coil body disclosed in Patent Document 1 is formed into a cylindrical shape by winding a laminate of a first sheet coil and a second sheet coil with a sheet-shaped insulating material interposed therebetween. In the first sheet coil and the second sheet coil, spiral print patterns are formed at a plurality of positions on both sides of a so-called flexible printed wiring board made of a base film of a polyimide film or the like.

Japanese Utility Model Publication No. 62-84370

  However, according to the coil body disclosed in Patent Document 1, since the printed pattern is exposed on the inner and outer peripheral surfaces of the coil body, it is necessary to secure insulation on the inner and outer peripheral surfaces of the coil body. In addition, there is another problem that an insulating process such as varnish impregnation or a molding process using a resin is separately required, which complicates the manufacturing process.

  The present invention has been made in view of the above, and does not require extra labor and additional materials. The purpose is to gain.

  In order to solve the above-described problems and achieve the object, a coil body according to the present invention is directed to a printed wiring board in which a plurality of spiral wiring patterns are formed on one side and the other side of a strip-shaped insulating substrate. And a tubular coil formed by winding the printed wiring board a plurality of times and having a plurality of layers. In the printed wiring board, the surface of the wiring pattern formed on one surface is covered with an insulating layer, and the surface of the wiring pattern formed on the other surface is not covered with the insulating layer. It has a wiring pattern formation region where a pattern is formed, and a wiring pattern non-formation region where a wiring pattern is not formed on both surfaces of one surface and the other surface. The non-wiring pattern forming area is provided at an end portion of the cylindrical printed wiring board where winding of the printed wiring board starts in the circumferential direction, and has a length equal to or longer than the inner circumference of the coil body in the circumferential direction. And a second wiring pattern non-formed area provided at the end of the printed wiring board in the circumferential direction at the end of winding and having a length equal to or longer than the outer circumference of the coil body in the circumferential direction. Has at least one.

  Advantageous Effects of Invention The coil body according to the present invention has an effect that a coil body that is wound at a high density while preventing insulation from being thickened while securing insulation by simply winding is obtained without requiring extra labor and additional material. .

1 is a perspective view of a rotating machine according to a first embodiment of the present invention. FIG. 2 is a view of the rotating machine according to the first embodiment of the present invention when viewed along a central axis. FIG. 2 is a schematic view of the coil body according to the first embodiment of the present invention as viewed along a central axis. FIG. 3 is a cross-sectional view of a main part of the printed wiring board according to the first embodiment of the present invention. FIG. 1 is an exploded plan view of a printed wiring board according to a first embodiment of the present invention. The figure which shows one wiring pattern formed in the spiral shape which functions as a coil in Embodiment 1 of this invention. Sectional drawing which shows the insulation board which is a modification of the insulation board of the printed wiring board concerning Embodiment 1 of this invention. FIG. 7 is a plan view showing a reinforcing cloth of the insulating substrate shown in FIG. 7. FIG. 2 is a schematic view of a coil body as a modification of the coil body according to the first embodiment of the present invention, viewed along a central axis. FIG. 2 is a schematic view of a coil body as a modification of the coil body according to the first embodiment of the present invention, viewed along a central axis. 2 is a flowchart showing a method of manufacturing the coil body shown in FIG.

  Hereinafter, a coil body, a stator, a rotating machine, a method of manufacturing a coil body, and a printed wiring board according to an embodiment of the present invention will be described in detail with reference to the drawings. The present invention is not limited by the embodiment.

Embodiment 1 FIG.
FIG. 1 is a perspective view of the rotating machine according to the first embodiment of the present invention. The rotating machine 30 includes a cylindrical stator 40 and a rotor 50 provided inside the stator 40 and rotatable about a central axis C of the stator 40. Although not shown in FIG. 1, the rotating machine 30 includes a case that houses the stator 40 and the rotor 50.

  FIG. 2 is a diagram of the rotating machine 30 according to the first embodiment of the present invention when viewed along a center axis C. The stator 40 includes a core 41 and a coil body 42. The core 41 has a tubular shape and covers the outer peripheral side of the stator 40. The core 41 is formed of a conductor. The coil body 42 is housed inside the stator 40 in a tubular shape. The inner peripheral surface of the core 41 is in contact with the outer peripheral surface of the coil body 42.

  FIG. 3 is a schematic diagram of the coil body 42 according to the first embodiment of the present invention when viewed along the central axis C. The coil body 42 includes the printed wiring board 1 which is wound a plurality of times and formed into a tubular shape having a plurality of layers. The printed wiring board 1 has a sheet shape before being formed into a tubular shape. Further, a wiring pattern 3 described later is formed on the printed wiring board 1. FIG. 3 shows an example in which the printed wiring board 1 is wound twice and formed into a cylindrical shape. By winding the coil body 42 a plurality of times, the printed wiring board 1 becomes a plurality of layers and overlaps in the radial direction of the printed wiring board 1 formed into a cylindrical shape. The cross-sectional shape of the coil body 42 when cut along a plane perpendicular to the central axis C may be a circular shape or a polygonal shape. In the following description, the radial direction of the printed wiring board 1 formed into a tubular shape is also simply referred to as the radial direction.

  FIG. 4 is a cross-sectional view of a main part of the printed wiring board 1 according to the first embodiment of the present invention. FIG. 5 is a developed plan view of the printed wiring board 1 according to the first embodiment of the present invention. In FIG. 5, the direction along arrow Y is the direction along center axis C, and the direction indicated by arrow X is the circumferential direction of printed wiring board 1. In the following description, the circumferential direction of the printed wiring board 1 formed into a tubular shape is simply referred to as the circumferential direction. Hereinafter, also in the description of the printed wiring board 1 that is developed in a plane, the term in the circumferential direction may be used for convenience. FIG. 3 shows the printed wiring board 1 which is formed into a tubular shape by performing two turns on the region where the wiring pattern 3 is formed, that is, by winding two turns.

  In the printed wiring board 1, a plurality of conductive wiring patterns 3 formed in a spiral shape are formed on both sides of a strip-shaped insulating substrate 2 made of an insulating material and arranged in the circumferential direction. Further, the printed wiring board 1 has an insulating layer 4 for insulating the wiring pattern 3 from the outside as a surface layer on only one surface of the insulating substrate 2. The surface layer can be referred to as the uppermost layer located at the top. That is, the printed wiring board 1 is formed by laminating the wiring pattern 3 and the insulating layer 4 on one surface 2a of the insulating substrate 2, and forming only the wiring pattern 3 on the other surface 2b of the insulating substrate 2. I have. The one surface 2a and the other surface 2b are surfaces facing each other. Therefore, in the printed wiring board 1, the surface of the wiring pattern 3 formed on one surface 2a is covered with the insulating layer 4, and the surface of the wiring pattern 3 formed on the other surface 2b is not covered with the insulating layer 4.

  As the insulating substrate 2, an insulating substrate applicable to a general printed wiring board can be used. A typical example of a printed wiring board is a flexible board and a rigid board. Specifically, examples of the flexible substrate include polyester, polyimide, and liquid crystal polymer. Examples of the rigid substrate include paper phenol, paper epoxy, glass composite, glass epoxy, and Teflon (registered trademark). The thickness of the insulating substrate 2 is not particularly limited as long as the printed wiring board 1 can be easily wound in forming the coil body 42, and generally, the thickness is preferably in a range of 5 μm to 1 mm.

  The insulating layer 4 is made of an insulating material, and generally a solder resist is used. The insulating layer 4 has a role of insulating the wiring pattern 3 from the outside and a role of protection from dust, dust and moisture. By covering the wiring pattern 3 with a protective film such as gold plating, the wiring pattern 3 may be protected from disturbances caused by the environment such as moisture or mechanical disturbances such as impacts.

  Each layer of the plurality of layers of the wound printed wiring board 1 is bonded by an adhesive layer made of an adhesive 12 for bonding between the wound printed wiring boards 1. As the adhesive 12, a sheet adhesive or a liquid adhesive made of an insulating material is used. The adhesive 12 is arranged on one side or both sides of the coil body 42 and adheres between the wound printed wiring boards 1.

  The adhesive 12 can secure the adhesiveness between the wound printed wiring boards 1 in the coil body 42 formed by winding a plurality of times. Further, the adhesive 12 can ensure insulation between the wound printed wiring boards 1 in the coil body 42. Furthermore, when the adhesive 12 is arranged on the outer peripheral surface, insulation between the coil body 42 and the core 41 can be ensured. The adhesive 12 may be an entire area or a part of one surface of the coil body 42, or may be an entire area or a part of both surfaces. As the arrangement area of the adhesive 12 is larger, the adhesiveness and insulation between the wound printed wiring boards 1 can be more reliably secured.

  Further, the adhesive 12 can be used as the insulating layer 4.

  The sheet adhesive is not particularly limited as long as it can be cured. Representative examples of the sheet-like adhesive include a UV-curable adhesive, a thermosetting adhesive, a honeymoon-based adhesive used by laminating a plurality of sheets, and a thermal-adhesive adhesive. Examples of the UV curing adhesive include an epoxy adhesive and an acrylic adhesive. Examples of the thermosetting adhesive include an epoxy adhesive, an acrylic adhesive, a hybrid epoxy and acrylic adhesive, and a polyimide adhesive. Examples of the honeymoon adhesive include an epoxy adhesive and an acrylic adhesive. Examples of the thermal adhesive include an olefin adhesive and a polyester adhesive.

  The sheet adhesive may be used alone, or a plurality of types may be used at the same time.

  The liquid adhesive is not particularly limited as long as it can be cured. Representative liquid adhesives include solvent-based adhesives, aqueous adhesives, hot-melt adhesives, elastic adhesives, thermosetting reactive adhesives, and pressure-sensitive adhesives. The solvent type adhesive includes a rubber adhesive and a resin adhesive. Examples of the rubber adhesive include a chloroprene rubber adhesive, a styrene butadiene rubber adhesive, a nitrile rubber adhesive, and a natural rubber adhesive. Examples of the resin adhesive include a vinyl chloride resin adhesive, a vinyl acetate resin adhesive, an acrylic resin adhesive, and a urethane resin adhesive. Examples of the aqueous adhesive include a water-soluble adhesive, an emulsion adhesive, and a latex adhesive.

  Examples of the hot melt adhesive include a thermoplastic elastomer hot melt adhesive and an ethylene vinyl acetate copolymer (EVA) hot melt adhesive. Examples of the elastic adhesive include a silicone adhesive, a modified silicone adhesive, and a silylated urethane adhesive. Thermosetting reactive adhesives include thermosetting epoxy adhesives, photocurable epoxy adhesives, urethane adhesives, urea adhesives, melamine adhesives, phenolic adhesives, and anaerobic acrylic adhesives Agents, second-generation acrylic adhesives, photocurable acrylic adhesives, and cyanoacrylate adhesives. Examples of the pressure-sensitive adhesive include an acrylic adhesive, a rubber adhesive, and a silicone adhesive.

  The liquid adhesive may be used alone, or a plurality of types may be used at the same time.

  The wiring pattern 3 is composed of three phases of U phase, V phase and W phase. Specifically, the wiring pattern 3 is formed by sequentially arranging a U-phase first phase pattern 5, a V-phase second phase pattern 6, and a W-phase third phase pattern 7. Adjacent wiring patterns 3 are electrically insulated. The printed wiring board 1 includes three sets of wiring patterns 3, that is, a first phase pattern 5, a second phase pattern 6, and a third phase pattern 7, which are arranged in n sets. Note that n is a natural number of 1 or more.

  In the printed wiring board 1 formed in a cylindrical shape, the first phase pattern 5, the second phase pattern 6, and the third phase pattern 7 are formed on each layer of the printed wiring board 1 so as to have the same number. Also, when viewed along the radial direction, the centers of the first phase patterns 5 formed on the respective layers match. This is when the center of the first phase pattern 5 formed on the inner layer and the center of the first phase pattern 5 formed on the outer layer match when viewed in the radial direction. Can be paraphrased. The centers of the second phase patterns 6 formed in each layer and the centers of the third phase patterns 7 formed in each layer also overlap when viewed along the radial direction. The wiring patterns 3 overlapping when viewed along the radial direction are electrically connected to each other at their ends. The wiring pattern 3 functions as a coil of the stator 40 by forming the printed wiring board 1 into a tubular shape.

  The printed wiring board 1 is formed with a terminal connection portion 11 protruding in a direction along the central axis C. The end of the wiring pattern 3 is provided in the terminal connection portion 11. As shown in FIG. 1, even when the printed wiring board 1 is formed in a cylindrical shape, the terminal connection portions 11 protrude in a direction along the central axis C. Power can be supplied to the wiring pattern 3 by connecting a power supply line (not shown) to the end of the wiring pattern 3 provided at the projecting portion. Since the wiring patterns 3 formed in each layer are electrically connected to each other, if the terminal of the wiring pattern 3 formed in any layer is provided in the terminal connection portion 11, the wiring patterns 3 formed in all layers are formed. Power can be supplied to the wiring pattern 3.

  The printed wiring board 1 includes a wiring pattern forming region 1a in which the wiring pattern 3 is formed, and a wiring pattern including only the insulating substrate 2 in which the wiring pattern 3 is not formed on both surfaces of one surface 2a and the other surface 2b. And an unformed region 1b.

  The wiring pattern non-formed region 1b is provided at an end along the circumferential direction of the coil body 42 where winding of the belt-shaped insulating substrate 2 starts. The wiring pattern non-formed area 1b provided at the end of the coil body 42 along the circumferential direction where winding of the insulating substrate 2 starts is the first wiring pattern unformed area, and the coil pattern 42 of the coil body 42 in the circumferential direction. It has a length longer than the inner circumference. Thus, the inner peripheral surface of the coil body 42 is constituted only by the wiring pattern unformed region 1b. That is, only the wiring pattern unformed region 1b is exposed on the inner peripheral surface of the coil body 42, and the wiring pattern forming region 1a is not exposed. Since the inner peripheral surface of the coil body 42 is constituted only by the wiring pattern unformed region 1b, it is possible to ensure insulation from the rotor 50 disposed on the inner peripheral side of the coil body 42.

  A printed wiring board constituted only by the wiring pattern forming region 1a without the wiring pattern unformed region 1b is wound into a tubular shape by winding a plurality of times such that the surface on which the insulating layer 4 is the uppermost layer is the outer peripheral surface. Assume a molded coil body. Since the outer peripheral surface of the coil body is constituted by the insulating layer 4, insulation from the core 41 adjacent to the outer peripheral side of the coil body 42 can be ensured. However, since the wiring pattern 3 is exposed on the inner peripheral surface of the coil body 42, insulation from the rotor 50 disposed on the inner peripheral side of the coil body 42 cannot be ensured. In this case, in order to secure insulation on the inner peripheral surface of the coil body, an insulation treatment such as varnish impregnation or molding with a resin is additionally required, which complicates the manufacturing process and reduces the cost of the coil body. Get higher.

  On the other hand, the coil body 42 includes a plurality of printed wiring boards 1 each including the wiring pattern unformed region 1b and the wiring pattern forming region 1a such that the surface on which the insulating layer 4 is the uppermost layer is the outer peripheral surface. It is a coil body that is formed into a cylindrical shape by winding. Since the outer peripheral surface of the coil body 42 is formed of the insulating layer 4, insulation from the core 41 adjacent to the outer peripheral side of the coil body 42 can be ensured. Furthermore, since the coil body 42 has the inner peripheral surface of the coil body 42 formed only of the wiring pattern non-formed area 1b, insulation from the rotor 50 disposed on the inner peripheral side of the coil body 42 is ensured. Becomes possible.

  Therefore, the coil body 42 is formed by winding the printed wiring board 1 in which the wiring pattern 3 is formed on both surfaces of the insulating substrate 2 and the insulating layer 4 is formed only on the uppermost layer on one side of the insulating substrate 2 a plurality of times. Insulation between the inner peripheral surface and the outer peripheral surface of the coil body 42 from the outside is ensured. The coil body 42 does not require insulation treatment such as varnish impregnation or resin molding to secure insulation on the inner peripheral surface, the manufacturing process is simple, and there is no increase in cost due to the insulation treatment. . Since the coil body 42 is not subjected to a surface coating process such as a molding process, the coil body 42 is prevented from being thickened, and the printed wiring board 1 can be wound at a high density in the thickness direction of the coil body 42. Have been. That is, the coil body 42 does not require extra labor and additional material, and is simply wound around the printed wiring board 1 to secure insulation between the inner peripheral surface and the outer peripheral surface of the coil body 42 from the outside, thereby increasing the thickness. And a coil body wound at high density can be realized at low cost.

  Returning to FIG. 5, the printed wiring board 1 includes a copper pattern 9 which is a metal pattern that is not electrically connected to the wiring pattern 3 in a region adjacent to the long side 1c of the printed wiring board 1. That is, the printed wiring board 1 includes a copper pattern 9 that is not electrically connected to the wiring pattern 3 in a region adjacent to a side along the circumferential direction of the printed wiring board 1 formed into a cylindrical shape. The copper pattern 9 is provided to increase the rigidity of the printed wiring board 1 when forming the coil body 42 by winding the printed wiring board 1 and to facilitate the work of winding the printed wiring board 1.

  In order to increase the rigidity of the printed wiring board 1, the copper pattern 9 is provided at least in a region adjacent to the long side 1 c in a region corresponding to between the wiring patterns 3 in the circumferential direction of the printed wiring board 1. The copper pattern 9 is preferably provided in all regions corresponding to the wiring pattern 3 in the circumferential direction of the printed wiring board 1 in a region adjacent to the long side 1c. Further, it is more preferable that the copper pattern 9 is provided in the entire area of the wiring pattern forming area 1a in the circumferential direction of the printed wiring board 1 in the area adjacent to the long side 1c.

  Note that the copper pattern 9 may not be provided in the wiring pattern unformed region 1b.

  The copper pattern 9 may be formed as a part of the coil body 42 and finally left on the coil body 42. The copper pattern 9 may be removed after the formation of the coil body 42 if it is not necessary for the coil body 42. When the copper pattern 9 is removed after the formation of the coil body 42, the perforations 10 may be formed in the insulating layer 4 disposed between the copper pattern 9 and the wiring pattern 3 as shown in FIG. Good. The thickness, length, and interval of the perforations 10 are not particularly limited as long as the copper pattern 9 and the wiring pattern 3 can be separated.

  FIG. 6 shows one spirally formed wiring pattern 3 functioning as a coil according to the first embodiment of the present invention. In the in-plane direction of the printed wiring board 1, a copper pattern 8, which is a metal pattern not electrically connected to the wiring pattern 3, is provided in a region inside the inner periphery of the wiring pattern 3 functioning as a coil. The copper pattern 8 may be a continuous single pattern or a divided pattern divided into a plurality.

  When the copper pattern 8 is a divided pattern, the size and shape of each divided pattern are not particularly limited. Also, the individual copper patterns 8 provided on the plurality of wiring patterns 3 need not all have the same size or the same shape. That is, the individual copper patterns 8 provided on the plurality of wiring patterns 3 may be all the same pattern, some may be the same pattern, or all may be different patterns.

  Further, the number of the wiring patterns 3 in which the copper pattern 8 is provided in the region inside the inner periphery may be one or more in the printed wiring board 1, and may be provided in all the wiring patterns 3. The copper pattern 8 has the effect of increasing the rigidity of the printed wiring board 1 and also improving the electrical characteristics of the rotating machine 30 by controlling the effects of iron loss of the rotating machine 30 and copper loss of the rotating machine 30.

  FIG. 7 is a sectional view showing an insulating substrate 71 which is a modification of the insulating substrate 2 of the printed wiring board 1 according to the first embodiment of the present invention. FIG. 8 is a plan view showing a reinforcing member cloth 73 of the insulating substrate 71 shown in FIG. The insulating substrate 71 includes a base portion 72 as a main component, and a reinforcing material cloth 73 provided inside the base portion 72 to increase the rigidity of the insulating substrate 71.

  The reinforcing material cloth 73 has a belt-like shape in the in-plane direction of the insulating substrate 71, similarly to the belt-like insulating substrate 71. The in-plane direction of the reinforcing material cloth 73 and the in-plane direction of the insulating substrate 71 are parallel to each other. In the reinforcing member cloth 73, reinforcing rod-shaped fiber bundles 74 are arranged in a lattice shape in the in-plane direction of the reinforcing member cloth 73.

  When the printed wiring board 1 is wound a plurality of times, the force applied in the long side direction of the printed wiring board 1 is stronger than the force applied in the short side direction of the printed wiring board 1. For this reason, in order to reinforce the mechanical strength in the long side direction of the printed wiring board 1, the reinforcing material cloth 73 is formed of a fiber bundle 74 a extending in the long side direction of the strip-shaped insulating substrate 71 in the in-plane direction of the insulating substrate 71. And the long side direction of the insulating substrate 71 make an angle α of less than 45 degrees. That is, in the in-plane direction of the reinforcing material cloth 73, the reinforcing material cloth 73 is formed by the longitudinal direction of the fiber bundle 74 a extending in the long side direction of the belt-shaped reinforcing material cloth 73 and the long side direction of the reinforcing material cloth 73. The angle is less than 45 degrees. In the in-plane direction of the insulating substrate 71, the number of fiber bundles 74a extending in the long side direction of the insulating substrate 71 is equal to or greater than the number of fiber bundles 74b extending in the short side direction of the insulating substrate 71. That is, in the in-plane direction of the reinforcing material cloth 73, the number of fiber bundles 74a extending in the long side direction of the reinforcing material cloth 73 is equal to or greater than the number of fiber bundles 74b extending in the short side direction of the reinforcing material cloth 73.

  As the reinforcing material cloth 73, a reinforcing cloth applicable to a general printed wiring board can be used. Typical reinforcing material cloths include glass cloth, alumina cloth, silica cloth and the like. The reinforcing material cloth 73 may be used alone or in combination of a plurality of types.

  In the rotating machine 30 described above, since the outer peripheral surface of the coil body 42 is formed by the insulating layer 4, insulation from the core 41 adjacent to the outer peripheral side of the coil body 42 can be ensured.

  Further, in the rotating machine 30, a wiring pattern non-formed region 1b is provided at an end of the coil body 42 along the circumferential direction where winding of the belt-shaped insulating substrate 2 starts. The wiring pattern unformed region 1b has a length equal to or longer than the inner circumference of the coil body 42 in the circumferential direction. Thus, since the inner peripheral surface of the coil body 42 is constituted only by the wiring pattern non-formed area 1b, it is possible to ensure insulation from the rotor 50 arranged on the inner peripheral side of the coil body 42.

  Therefore, the coil body 42 of the rotating machine 30 has insulation between the inner peripheral surface and the outer peripheral surface of the coil body 42 and the outside, and the characteristics of the rotating machine 30 can be improved.

  FIG. 9 is a schematic view of a coil body 42a, which is a modification of the coil body 42 according to the first embodiment of the present invention, as viewed along a center axis C. The coil body 42a differs from the coil body 42 in that the coil body 42a is provided with a printed wiring board 61 formed into a cylindrical shape by winding a plurality of times. The coil body 42a is formed by winding a printed wiring board 61 having a wiring pattern unformed region 1b and a wiring pattern forming region 1a a plurality of times so that the surface on which the insulating layer 4 is the uppermost layer becomes the inner peripheral surface. It is a coil body formed in a shape. The laminated structure of the wiring pattern forming region 1 a in the printed wiring board 61 is the same as that of the printed wiring board 1.

  The printed wiring board 61 is provided with a wiring pattern unformed region 1b at an end of the coil body 42a along the circumferential direction where winding of the band-shaped insulating substrate 2 ends. The wiring pattern non-formed area 1b provided at the end of the coil body 42a along the circumferential direction at the end of winding of the insulating substrate 2 is a second wiring pattern unformed area, and the coil pattern 42a is formed in the circumferential direction. It has a length longer than the outer circumference. Thus, the outer peripheral surface of the coil body 42a is constituted only by the wiring pattern non-formed region 1b. That is, only the wiring pattern unformed region 1b is exposed on the outer peripheral surface of the coil body 42a, and the wiring pattern forming region 1a is not exposed.

  Since the inner peripheral surface of the coil body 42a thus configured is constituted by the insulating layer 4, it is possible to ensure insulation from the rotor 50 disposed on the inner peripheral side of the coil body 42a. Further, since the outer peripheral surface of the coil body 42a is formed only of the wiring pattern unformed region 1b, the coil body 42a can ensure insulation from the core 41 adjacent to the outer peripheral side of the coil body 42a.

  Therefore, the coil body 42a is formed into a tubular shape by winding the printed wiring board 61 in which the wiring pattern 3 is formed on both surfaces of the insulating substrate 2 and the uppermost layer on only one side of the insulating substrate 2 is the insulating layer 4 a plurality of times. It has a molded configuration, and insulation between the inner and outer peripheral surfaces of the coil body 42a from the outside is ensured. The coil body 42a does not require a process such as varnish impregnation or resin molding in order to ensure insulation on the outer peripheral surface of the coil body 42a, and the manufacturing process is simple. Since the coil body 42a is not subjected to a surface coating process such as a molding process, the coil body 42a is prevented from being thickened, and the printed wiring board 61 can be wound with high density in the thickness direction of the coil body 42a. Have been. In other words, the coil body 42a does not require extra labor and additional material, and is simply wound around the printed wiring board 61 to secure insulation between the inner peripheral surface and the outer peripheral surface of the coil body 42a from the outside. And a coil body wound at a high density can be realized.

  FIG. 10 is a schematic view of a coil body 42b, which is a modification of the coil body 42 according to the first embodiment of the present invention, as viewed along a center axis C. The coil body 42b is different from the coil body 42 in that the coil body 42b includes a printed wiring board 62 wound in a plurality of turns and formed into a cylindrical shape. The coil body 42b is a coil body formed by winding a printed wiring board 62 having a wiring pattern unformed area 1b and a wiring pattern forming area 1a a plurality of times into a cylindrical shape. The laminated structure of the wiring pattern forming region 1 a on the printed wiring board 62 is the same as that of the printed wiring board 1.

  The printed wiring board 62 is provided with a wiring pattern unformed region 1ba at an end of the coil body 42b along the circumferential direction where winding of the belt-shaped insulating substrate 2 starts. The wiring pattern unformed region 1ba has a length equal to or longer than the inner circumference of the coil body 42b in the circumferential direction. Thus, the inner peripheral surface of the coil body 42b is constituted only by the wiring pattern non-formed area 1ba. That is, only the wiring pattern unformed region 1ba is exposed on the inner peripheral surface of the coil body 42b, and the wiring pattern forming region 1a is not exposed.

  The printed wiring board 62 is provided with a wiring pattern non-formed area 1bb at an end of the coil body 42b along the circumferential direction where winding of the belt-shaped insulating substrate 2 ends. The wiring pattern unformed region 1bb has a length equal to or longer than the outer circumference of the coil body 42b in the circumferential direction. Thereby, the outer peripheral surface of the coil body 42b is constituted only by the wiring pattern non-formed area 1bb. That is, only the wiring pattern unformed region 1bb is exposed on the outer peripheral surface of the coil body 42b, and the wiring pattern forming region 1a is not exposed.

  Since the coil body 42b thus configured has an inner peripheral surface formed by the wiring pattern non-formed region 1ba, it is possible to ensure insulation from the rotor 50 disposed on the inner peripheral side of the coil body 42b. Becomes Further, since the outer peripheral surface of the coil body 42b is constituted only by the wiring pattern unformed region 1bb, the coil body 42b can ensure insulation from the core 41 adjacent to the outer peripheral side of the coil body 42b.

  Therefore, the coil body 42b is formed by winding the printed wiring board 62 a plurality of times so that the surface on which the insulating layer 4 is the uppermost layer becomes the inner peripheral surface and forming it into a cylindrical shape. In any of the cases where the printed wiring board 62 is formed by winding a plurality of times so as to form a cylindrical shape so that the surface on which the layer 4 is the uppermost layer is the outer peripheral surface, the coil body 42b Insulation from the outside on the inner peripheral surface and the outer peripheral surface is ensured.

  As described above, the coil body 42 according to the first embodiment does not require any extra labor and additional material, and is simply wound to secure insulation, and to be wound at a high density while preventing thickening. The body can be realized. In the rotating machine 30 according to the first embodiment, the insulation can be secured even if the insulating layer 4 is disposed on the uppermost layer of only one surface of the coil body 42 and is wound a plurality of times. That is, according to the rotating machine 30 according to the first embodiment, the insulation on the inner peripheral surface and the outer peripheral surface of the coil body 42 configured by winding the printed wiring board 1 having the wiring pattern 3 formed on both surfaces plural times is improved. It is possible. Thereby, according to the rotating machine 30 according to the first embodiment, there is an effect that the characteristics of the rotating machine 30 can be improved.

Embodiment 2 FIG.
In a second embodiment, a method for manufacturing a coil body will be described. FIG. 11 is a flowchart showing a method of manufacturing the coil body 42 shown in FIG.

  First, in step S10, the printed wiring board 1 is formed. The method for forming the wiring pattern 3 on the insulating substrate 2 is not particularly limited. In a general method for forming the wiring pattern 3, a copper layer is formed on the insulating substrate 2, and electroless plating and electrolytic plating of copper are performed. Thereafter, a resist is formed, and the copper layer is patterned using the resist as a mask to obtain a spiral wiring pattern 3. Further, a solder resist may be formed as the insulating layer 4 on the wiring pattern 3 to protect the wiring pattern 3 from dust, dirt, and moisture, and to secure insulation.

  The wiring patterns 3 are formed on both sides of the printed wiring board 1. When forming each of the first phase pattern 5, the second phase pattern 6, and the third phase pattern 7 on both sides of the printed wiring board 1, it is necessary to form the wiring patterns 3 of different phases so that they do not intersect with each other. . When the wiring patterns 3 of different phases cross each other, a material in consideration of insulation may be provided between the wiring patterns 3.

  In step S20, a step of arranging the adhesive 12 on the planar printed wiring board 1 is performed. When the printed wiring board 1 is wound and formed into a cylindrical shape, a step of disposing an adhesive 12 on one or both sides of the printed wiring board 1 and providing an adhesive layer is performed. That is, one or both sides of the printed wiring board 1 are covered with a sheet adhesive or a liquid adhesive. The printed wiring board 1 and the adhesive 12 may or may not be bonded. The portion of the printed wiring board 1 covered with the sheet adhesive or the liquid adhesive may be the whole or a part of one side or both sides of the printed wiring board 1.

  Thereafter, in step S30, a process of winding the printed wiring board 1 into a roll a plurality of times to form a tubular shape is performed. Thereafter, in step S40, the adhesive 12 is cured by room temperature curing, heat curing, light curing, or moisture curing in accordance with the type of the adhesive 12, thereby forming the cylindrical coil body 42.

  When viewed along the radial direction of the printed wiring board 1 formed into a cylindrical shape, the wiring patterns 3 formed on each of the plurality of wound layers overlap with each other, and the wiring formed on each of the plurality of layers is overlapped. The patterns 3 are electrically connected. The stator 40 is obtained by inserting the coil body 42 into the core 41 arranged on the outer peripheral portion of the coil body 42 and bonding or sticking the coil body 42 and the core 41 together. The order of each step can be arbitrarily changed.

  The configurations shown in the above embodiments show an example of the content of the present invention, and the technologies of the embodiments can be combined with each other, or can be combined with another known technology. However, a part of the configuration may be omitted or changed without departing from the gist of the present invention.

  DESCRIPTION OF SYMBOLS 1 Printed wiring board, 1a Wiring pattern forming area, 1b, 1ba, 1bb Wiring pattern non-forming area, 1c Long side, 2,71 insulating substrate, 2a one surface, 2b other surface, 3 wiring pattern, 4 insulating layer, 5 first Phase pattern, 6 second phase pattern, 7 third phase pattern, 8, 9 copper pattern, 10 perforation, 11 terminal connection, 12 adhesive, 30 rotating machine, 40 stator, 41 core, 42, 42a, 42b Coiled body, 50 rotor, 61, 62 printed wiring board, 72 base, 73 reinforcing cloth, 74, 74a, 74b fiber bundle, C central axis.

Claims (14)

A printed wiring board in which a plurality of spiral wiring patterns are formed on one surface facing the other side and the other surface of the belt-shaped insulating substrate, and the printed wiring board is formed into a tubular shape having a plurality of layers by being wound a plurality of times. Coil body,
The printed wiring board,
The surface of the wiring pattern formed on the one surface is covered with an insulating layer and the surface of the wiring pattern formed on the other surface is not coated with an insulating layer,
A wiring pattern forming region in which the wiring pattern is formed on both surfaces of the one surface and the other surface, and a wiring pattern unformed region in which the wiring pattern is not formed on both surfaces of the one surface and the other surface; ,
The wiring pattern non-formed area is provided at an end of the cylindrical printed wiring board where winding of the printed wiring board is started in a circumferential direction, and is longer than an inner circumference of the coil body in the circumferential direction. A first wiring pattern unformed region having a length, and a second length provided at an end of the printed wiring board in the circumferential direction at the end of winding and having a length equal to or longer than the outer circumference of the coil body in the circumferential direction. Having at least one of a wiring pattern unformed region,
A coil body characterized by the above. The plurality of layers are adhered by an adhesive,
The coil body according to claim 1, wherein: The adhesive is a sheet adhesive or a liquid adhesive,
The coil body according to claim 2, characterized in that: The insulating layer is the sheet-like adhesive or the liquid adhesive,
The coil body according to claim 3, wherein: A metal pattern that is not electrically connected to the wiring pattern in a region adjacent to a side along the circumferential direction of the printed wiring board,
The coil body according to any one of claims 1 to 4, characterized in that: The metal pattern is a single pattern or a divided pattern divided into a plurality,
The coil body according to claim 5, characterized in that: The insulating substrate includes a reinforcing material cloth having a fiber bundle in which an in-plane direction is parallel to an in-plane direction of the insulating substrate,
The reinforcing material cloth,
In the in-plane direction of the insulating substrate, an angle formed by a longitudinal direction of the fiber bundle extending in a long side direction of the insulating substrate and a long side direction of the insulating substrate is less than 45 degrees,
In the in-plane direction of the insulating substrate, the number of the fiber bundles extending in the long side direction of the insulating substrate is equal to or more than the number of the fiber bundles extending in the short side direction of the insulating substrate,
The coil body according to any one of claims 1 to 6, wherein: A coil body according to any one of claims 1 to 7,
A core having a cylindrical inner peripheral surface surrounding the outer periphery of the coil body and in contact with the outer peripheral surface of the coil body;
A stator comprising: A stator according to claim 8,
A rotor rotatably provided inside the stator,
A rotating machine. It is a manufacturing method of the coil body of Claim 1, Comprising:
Placing an adhesive on the planar printed wiring board;
Winding the printed wiring board and forming it into a tubular shape,
Curing the adhesive,
A method for manufacturing a coil body, comprising: A printed wiring board used for a coil body formed into a tubular shape having a plurality of layers by winding the printed wiring board a plurality of times,
A plurality of spiral wiring patterns are formed on the opposite surface and the other surface of the strip-shaped insulating substrate,
The surface of the wiring pattern formed on the one surface is covered with an insulating layer and the surface of the wiring pattern formed on the other surface is not coated with an insulating layer,
A wiring pattern forming region in which the wiring pattern is formed on both surfaces of the one surface and the other surface, and a wiring pattern unformed region in which the wiring pattern is not formed on both surfaces of the one surface and the other surface; ,
The wiring pattern non-formed area is provided at an end portion of the cylindrical printed wiring board where winding of the printed wiring board starts in the circumferential direction, and is longer than the inner circumference of the coil body in the circumferential direction. A first wiring pattern unformed region having a length, and a second length provided at an end of the printed wiring board in the circumferential direction at the end of winding and having a length equal to or longer than the outer circumference of the coil body in the circumferential direction. Having at least one of a wiring pattern unformed region,
A printed wiring board characterized by the above. A metal pattern that is not electrically connected to the wiring pattern in a region adjacent to a side along the circumferential direction of the printed wiring board,
The printed wiring board according to claim 11, wherein: The metal pattern is a single pattern or a divided pattern divided into a plurality,
The printed wiring board according to claim 12, wherein: The insulating substrate includes a reinforcing material cloth having a fiber bundle in which an in-plane direction is parallel to an in-plane direction of the insulating substrate,
The reinforcing material cloth,
In the in-plane direction of the insulating substrate, an angle formed by a longitudinal direction of the fiber bundle extending in a long side direction of the insulating substrate and a long side direction of the insulating substrate is less than 45 degrees,
In the in-plane direction of the insulating substrate, the number of the fiber bundles extending in the long side direction of the insulating substrate is equal to or greater than the number of the fiber bundles extending in the short side direction of the insulating substrate,
The printed wiring board according to any one of claims 11 to 13, wherein:

Images