CN113611639A - Semiconductor wafer corrosion device - Google Patents
Semiconductor wafer corrosion device Download PDFInfo
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- CN113611639A CN113611639A CN202111181434.2A CN202111181434A CN113611639A CN 113611639 A CN113611639 A CN 113611639A CN 202111181434 A CN202111181434 A CN 202111181434A CN 113611639 A CN113611639 A CN 113611639A
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- wafer
- moving
- block
- corrosive liquid
- rotating shaft
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Abstract
The invention discloses a semiconductor wafer etching device which comprises a shell, wherein an etching liquid tank and a cleaning tank are arranged in the shell, etching liquid and cleaning liquid are respectively filled in the etching liquid tank and the cleaning tank, a rotating mechanism is arranged in the etching liquid tank and penetrates through the liquid level of the etching liquid, the rotating mechanism drives a wafer to enter the etching liquid for etching, a clamping and moving mechanism is arranged at the upper part in the shell and is used for clamping a wafer after etching is finished and then moving the wafer to the interior of the cleaning tank for cleaning. The device is through setting up balanced module in slewing mechanism for the wafer of the inside centre gripping of elastic block contacts for the whole and the corrosive liquid level of lower surface at the in-process that gets into the corrosive liquid, avoids the wafer to have the time difference at the time that gets into the corrosive liquid of the in-process coplanar of getting into the corrosive liquid, thereby guarantees that the damage layer gets rid of thickness evenly.
Description
Technical Field
The invention relates to the technical field of wafer corrosion, in particular to a semiconductor wafer corrosion device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape of the wafer is circular, after the semiconductor silicon wafer is thinned and ground, a mechanical damage layer, mainly silicon, is formed on the surface of the silicon wafer and needs to be removed before polishing, the mechanical damage layer is removed by adopting alkali liquor corrosion in the prior art, and the thickness uniformity of the corrosion damage layer directly influences TTV in geometric parameters and physicochemical test results, and even influences the production of the subsequent working procedures.
The Chinese patent No. CN201510420064.1 discloses a large-size grinding wafer surface corrosion device, which comprises: a support leg, a recovery tank, a sucker bracket, a sucker and a liquid bearing part. The recycling tank is provided with a guide rail, a vacuum control switch and a waste liquid discharge port; a vacuum pumping pipeline is arranged in the sucker bracket; the liquid bearing portion includes: the slider, the pillar, the crossbeam, the guide rail roof beam, the movable plate, the acidizing fluid holds the groove, clear water holds the groove, flowing back control flap, liquid holds groove fixing bolt, the device is through placing the wafer on the sucking disc when using, it can realize the corruption and the washing to the wafer to transfer flowing back control flap again, but in wafer corruption and cleaning process, inside corrosive liquid and the washing liquid fall into the accumulator of below behind the wafer, can't carry out reuse many times, cause the waste of resource, furthermore, hold the groove and clear water through control acidizing fluid and hold the groove and corrode and wash in the wafer top location, but it is even to accomplish each department to corrode in the corrosion process, get rid of inhomogeneous if the damage layer thickness, seriously influence wafer product quality.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a semiconductor wafer etching device which has the advantages of uniform removal thickness of a damaged layer, consistent etching time of each wafer, repeated utilization of etching solution and cleaning solution and the like, and solves the problems that the etching solution and the cleaning solution can not be used for multiple times and the removal thickness of the damaged layer of the wafer is uniform.
(II) technical scheme
In order to solve the technical problems that the corrosive liquid and the cleaning liquid cannot be used for multiple times and the removal thickness of the damaged layer of the wafer is uniform, the invention provides the following technical scheme: the utility model provides a semiconductor wafer corrosion device, the device is including the shell, the shell internal fixation is provided with the baffle, the draw-in groove has been seted up on baffle upper portion, the joint has the fixture block in the draw-in groove, fixture block upper portion is provided with the sponge, and the sponge is used for absorbing the corrosive liquids that the wafer removed the in-process drippage, the baffle both sides are provided with the corrosive liquids case respectively and wash the case, the corrosive liquids case with wash incasement portion and be equipped with corrosive liquids and washing liquid respectively, corrosive liquids incasement portion is provided with slewing mechanism, and slewing mechanism runs through the setting at the corrosive liquids liquid level, slewing mechanism drives the wafer and gets into the corrosive liquids inside and corrode, upper portion is provided with centre gripping moving mechanism in the shell, centre gripping moving mechanism is used for the centre gripping to corrode the wafer of accomplishing then remove extremely wash incasement portion and wash.
Preferably, the rotating mechanism comprises a linkage module and a balance module, the linkage module is used for driving the rotating mechanism to integrally rotate, and the balance module is used for balancing the wafer inside the rotating mechanism and controlling the plane of the wafer to uniformly enter the corrosive liquid.
Preferably, the linkage module is arranged in the corrosion liquid tank in a penetrating manner, and comprises a first rotating shaft and a second rotating shaft, the first rotating shaft is located at the outer end of the shell and is fixedly provided with a first driving part, a first belt pulley and a second belt pulley are respectively fixedly arranged between the first rotating shaft and the second rotating shaft, a belt is connected between the second belt pulley and the first belt pulley in a transmission manner, the first driving part is used for driving the first rotating shaft to rotate, and the belt drives the second rotating shaft to move in the same direction and at the same speed as the first rotating shaft so as to drive the wafer on the second rotating shaft to move at the same speed.
Preferably, the plurality of balance modules are uniformly arranged on the side surface of the belt, each balance module comprises two support blocks, the two support blocks are arranged at corresponding positions on two sides of the belt, opposite side surfaces of the two support blocks are connected with rotating rings, the rotating rings constantly keep the state that the plane of the circular ring is parallel to the horizontal plane, and elastic blocks are fixedly arranged in the rotating rings and used for fixing the wafer.
Preferably, the clamping and moving mechanism comprises a moving module, the moving module comprises two supporting plates, the two supporting plates are symmetrical about the center of the corrosive liquid tank, supporting blocks are fixedly arranged at two ends of the lower surface of each supporting plate respectively, a screw rod is rotatably connected in each supporting block, a second driving piece is fixedly connected to one end of each screw rod, and the second driving piece is used for driving the screw rod to rotate.
Preferably, the screw rod is located between the two support blocks, a moving block is in threaded connection with the screw rod, a moving platform is fixedly connected to the moving block, guide rails are arranged on two sides of each support plate respectively, the upper end of the moving platform is arranged on the guide rails in a sliding mode, and the screw rod drives the moving block and the moving platform to translate in the rotating process.
Preferably, centre gripping moving mechanism is still including the centre gripping module, the centre gripping module is including the connecting rod, the connecting rod rotates to be connected the moving platform lower surface, the connecting rod with the moving platform links to each other the end fixing and is provided with driven gear, the moving platform lower surface is located connecting rod one side is rotated and is connected with the driving gear, the fixed third axis of rotation that is provided with in driving gear side, just the third axis of rotation with driven gear meshes mutually, the fixed third driving piece that is provided with of driving gear lower extreme, the third driving piece is used for the drive the third axis of rotation rotates, indirectly drives connecting rod switching direction.
Preferably, the fixed upper fixed plate that is provided with of connecting rod lower extreme, the upper fixed plate lower surface is connected with the bottom plate through the telescopic link, bottom plate lower surface fixedly connected with storage frame, storage frame lower extreme fixedly connected with ring, be provided with the light ring piece in the ring, the storage frame the ring with the cooperation of light ring piece is saved the wafer inside the storage frame, just be provided with the magnet piece on the ring.
Preferably, a fixed cylinder is fixedly arranged at the position, corresponding to each rotating ring, on the outer side of the belt, a spring is arranged in the fixed cylinder, a magnet is fixedly arranged at the upper end of the spring, the magnet attracts a magnet block arranged on the ring, a wafer fixed in the elastic block is pushed upwards, and the aperture block is used for clamping the wafer into the storage frame for storage.
Preferably, two ends of the side surface of the shell are respectively provided with a discharge hopper, and the positions of the discharge hoppers correspond to the positions of the two screws.
(III) advantageous effects
Compared with the prior art, the invention provides a semiconductor wafer etching device which has the following beneficial effects:
1. this semiconductor wafer corrosion device through set up the etchant solution case simultaneously in the shell inside and wash the case for the wafer washs immediately after corroding, then from going out hopper eduction gear, avoids the wafer not wash and brings into the etchant solution follow-up device inside and cause the pollution, in addition, be provided with between etchant solution case and washing case and dismantle the sponge, utilize the sponge to absorb the etchant solution that the wafer removed the in-process drippage, avoid the etchant solution to drop in the inside damage shell of shell.
2. This semiconductor wafer corrosion device, through balanced module, this module changes the ring and keeps the state that the ring plane is parallel with the horizontal plane constantly in the use, make the wafer of the inside centre gripping of elastic block contact for the whole and the corrosive liquid level of lower surface at the in-process that gets into the corrosive liquid, then get into inside the corrosive liquid, avoid the wafer to have the time difference at the time that gets into the corrosive liquid in-process coplanar of getting into the corrosive liquid, thereby it is even to guarantee that the damage layer gets rid of thickness, in addition, the setting up of elastic block makes things convenient for the wafer that the centre gripping size distinguishes a little, the suitability of improvement device.
3. This semiconductor wafer corrosion device stores the wafer that corrodes the completion through setting up the storage frame, utilizes the storage frame to store the wafer, and the not utilization stereoplasm grip block carries out the centre gripping to the wafer, avoids the too big wearing and tearing that produce the wafer side of clamping-force, and need not consider the concrete shape of wafer, as long as the size accords with all can utilize the storage frame to store, improves the suitability of device.
4. According to the semiconductor wafer corrosion device, the wafers are clamped in the balance modules which are uniformly arranged on the belt, and the belt drives the wafers to regularly move, so that the corrosion time of the wafers in each balance module in the corrosion liquid is the same, and the shapes of the wafers are kept consistent.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic illustration of the location of the corrosion fluid tank and the cleaning tank within the housing of the present invention;
FIG. 3 is a schematic view of the internal structure of the corrosion liquid tank of the present invention;
FIG. 4 is an enlarged view of the invention at A;
FIG. 5 is a schematic diagram of a balancing module according to the present invention;
FIG. 6 is a schematic view of the internal structure of the fixing cylinder according to the present invention;
FIG. 7 is a schematic structural diagram of a clamping and moving mechanism according to the present invention;
FIG. 8 is an enlarged view of the invention at B;
fig. 9 is an enlarged view of the present invention at C.
In the figure: 1. a housing; 2. a partition plate; 3. a card slot; 4. a clamping block; 5. a corrosive liquid tank; 6. a first rotating shaft; 7. a second rotating shaft; 8. a second pulley; 9. a first pulley; 10. a belt; 11. a support block; 12. a rotating ring; 13. an elastic block; 14. a fixed cylinder; 15. a spring; 16. a magnet; 20. a first driving member; 21. a cleaning tank; 22. a support plate; 23. a support block; 24. a screw; 25. a second driving member; 26. a moving block; 27. a mobile platform; 28. a guide rail; 29. a connecting rod; 30. a driven gear; 31. a driving gear; 32. a third rotating shaft; 33. a third driving member; 34. an upper fixing plate; 35. a telescopic rod; 36. a lower fixing plate; 37. a storage frame; 38. a circular ring; 39. an aperture block; 40. a discharge hopper.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-9, a semiconductor wafer etching apparatus comprises a housing 1, a partition plate 2 fixed in the housing 1, a slot 3 formed on the upper portion of the partition plate 2, a block 4 clamped in the slot 3, a sponge disposed on the upper portion of the block 4 for absorbing the etchant dripping during the wafer moving process, and preventing the etchant from dropping into the housing 1 to damage the housing 1, an etchant tank 5 and a cleaning tank 21 disposed on both sides of the partition plate 2, the etchant tank 5 and the cleaning tank 21 containing etchant and cleaning liquid, respectively, a rotating mechanism disposed in the etchant tank 5, and the rotating mechanism penetrates through the liquid level of the corrosive liquid, drives the wafer to enter the corrosive liquid for corrosion, and a clamping and moving mechanism is arranged at the upper part in the shell 1 and is used for clamping the corroded wafer and then moving the corroded wafer into the cleaning box 21 for cleaning.
Further, the rotating mechanism comprises a linkage module and a balance module, the linkage module is used for driving the rotating mechanism to integrally rotate, the balance module is used for balancing the wafer inside the rotating mechanism, the plane of the wafer is controlled to uniformly enter corrosive liquid, an operator places the wafer into the balance module, then the linkage module is used for driving the belt 10 inside the balance module to rotate, and then the wafer inside the balance module on the side face of the belt 10 is driven to enter the corrosive liquid for corrosion.
Furthermore, a linkage module is arranged in the corrosive liquid tank 5 in a penetrating manner, the linkage module comprises a first rotating shaft 6 and a second rotating shaft 7, the first rotating shaft 6 is positioned at the outer end part of the shell 1 and is fixedly provided with a first driving piece 20, a first belt pulley 9 and a second belt pulley 8 are respectively and fixedly arranged between the first rotating shaft 6 and the second rotating shaft 7, a belt 10 is connected between the second belt pulley 8 and the first belt pulley 9 in a transmission manner, the first driving piece 20 is used for driving the first rotating shaft 6 to rotate, in the using process of the device, the first driving piece 20 is controlled to be opened, the first driving piece 20 drives the first rotating shaft 6 to rotate, and then the belt 10 drives the second rotating shaft 7 to move in the same direction and at the same speed as the first rotating shaft 6, so as to drive the wafer on the second rotating shaft to move regularly, namely, the wafers in each balance module are corroded in the corrosion liquid for the same time, so that the shapes of the wafers are kept consistent.
Further, a plurality of balance modules are uniformly arranged on the side surface of the belt 10, each balance module comprises two support blocks 11, the two support blocks 11 are arranged at corresponding positions on two sides of the belt 10, the opposite side surfaces of the two support blocks 11 are rotatably connected with rotating rings 12, the rotating rings 12 constantly keep the circular plane parallel to the horizontal plane, elastic blocks 13 are fixedly arranged inside the rotating rings 12, the elastic blocks 13 are used for fixing wafer wafers, the balance modules move along with the belt 10 in the rotating process of the belt 10, the upper plane and the lower plane of the rotating rings 12 are both in a state parallel to the horizontal plane in the moving process of the balance modules, so that the wafer clamped inside the elastic blocks 13 is in contact with the liquid surface of the corrosive liquid as the whole lower surface in the process of entering the corrosive liquid and then enters the interior of the corrosive liquid, and the time difference of the time when the wafer enters the corrosive liquid on the same plane in the process of entering the corrosive liquid is avoided, therefore, the thickness of the damaged layer is uniform, in addition, the elastic block 13 is convenient to clamp the wafer with slightly different sizes, and the applicability of the device is improved.
Further, the clamping and moving mechanism comprises a moving module, the moving module comprises two supporting plates 22, the two supporting plates 22 are symmetrical about the center of the corrosive liquid tank 5, supporting blocks 23 are respectively and fixedly arranged at two ends of the lower surface of each supporting plate 22, a screw 24 is rotatably connected in the two supporting blocks 23, a second driving piece 25 is fixedly connected to one end of each screw 24, the second driving piece 25 is used for driving the screw 24 to rotate, when a corroded wafer exists in the clamping module, the second driving piece 25 is controlled to be opened, the screw 24 is driven to rotate through the second driving piece 25, and then the screw 24 is driven to move the wafer through the screw 24 and is in threaded connection with the screw.
Further, the screw rod 24 is located between the two supporting blocks 23 and is in threaded connection with a moving block 26, a moving platform 27 is fixedly connected onto the moving block 26, guide rails 28 are respectively arranged on two sides of the supporting plates 22, the upper end of the moving platform 27 is slidably arranged on the guide rails 28, the screw rod 24 is driven by a second driving piece 25 to rotate, and the moving block 26 is in threaded connection with the screw rod 24, so that the moving block 26 is driven to translate in the rotating process of the screw rod 24, the moving platform 27 fixedly connected with the moving block 26 is driven to translate, a connecting rod 29 below the moving platform 27 is driven to translate, wafers are moved from the upper side of the etching liquid tank 5 to the inside of the cleaning tank 21 to be cleaned, the wafers are cleaned after the etching is finished, and the wafers are prevented from being cleaned and brought into a subsequent device with the etching liquid to cause pollution.
Furthermore, the clamping moving mechanism further comprises a clamping module, the clamping module comprises a connecting rod 29, the connecting rod 29 is rotatably connected to the lower surface of the moving platform 27, a driven gear 30 is fixedly arranged at the end of the connecting rod 29 connected with the moving platform 27, a driving gear 31 is rotatably connected to the lower surface of the moving platform 27 at one side of the connecting rod 29, a third rotating shaft 32 is fixedly arranged on the side surface of the driving gear 31, the third rotating shaft 32 is meshed with the driven gear 30, a third driving member 33 is fixedly arranged at the lower end of the driving gear 31, the third driving member 33 is controlled to be opened, the third rotating shaft 32 and the driving gear 31 on the side surface are driven to rotate by the third driving member 33, the driven gear 30 is driven to rotate in the rotating process of the driving gear 31 due to the meshing of the driven gear 30 and the driving gear 31, and then the connecting rod 29 fixedly arranged in the driven gear 30 is driven to change direction, the third driving member 33 is a servo motor, and can drive the third rotating shaft 32 to rotate in the reverse direction, and the third rotating shaft 32 rotates 90 degrees in the process of rotating in one direction, so that the direction of the connecting rod 29 is only shifted 90 degrees.
Furthermore, an upper fixing plate 34 is fixedly arranged at the lower end of the connecting rod 29, a lower fixing plate 36 is connected to the lower surface of the upper fixing plate 34 through a telescopic rod 35, a storage frame 37 is fixedly connected to the lower surface of the lower fixing plate 36, a ring 38 is fixedly connected to the lower end of the storage frame 37, an aperture block 39 is arranged in the ring 38, the storage frame 37, the ring 38 and the aperture block 39 are matched to store the wafer in the storage frame 37, and a magnet block is arranged on the ring 38, during the process of clamping the wafer, firstly, the lower end of the connecting rod 29 is required to correspond to the position of the wafer clamped on the belt 10, the belt 10 is in a stop rotation state during the clamping process, then, the telescopic rod 35 is controlled to extend, so as to drive the lower fixing plate 36 to move downwards, furthermore, during the downward movement of the clamping module, the aperture block 39 is in an open state, and when the lower surface of the ring 38 is in contact with the upper surface of the elastic block 13, the telescopic rod 35 is extended continuously, when the upper surface of the ring 38 is positioned at the lower part of the lower surface of the wafer, the aperture block 39 is contracted, the wafer is put into the storage frame 37, the storage frame 37 is used for storing the wafer instead of clamping the wafer by using a hard clamping block, the phenomenon that the side surface of the wafer is abraded due to overlarge clamping force is avoided, the specific shape of the wafer is not considered, the storage frame 37 can be used for storing as long as the size is consistent, and the applicability of the device is improved.
Furthermore, a fixed cylinder 14 is fixedly arranged at the outer side of the belt 10 corresponding to each rotating ring 12, a spring 15 is arranged in the fixed cylinder 14, a magnet 16 is fixedly arranged at the upper end of the spring 15, the magnet 16 is attracted with a magnet block arranged on the ring 38, the wafer fixed in the elastic block 13 is pushed upwards, the wafer is clamped in the storage frame 37 by the aperture block 39 for storage, as the clamping module approaches the balancing module, the magnets on the ring 38 attract the magnets 16, causing the magnets 16 to approach the ring 38, i.e., upward movement, and supports the wafer during the upward movement of the magnet 16, and drives the wafer out of the elastic block 13 into the upper corresponding storage frame 37, and then closes the aperture block 39 to store the wafer in the storage frame 37, and, in addition, during the closing of the aperture block 39, the plane of the aperture block 39 is located below the wafer and above the magnet 16.
Furthermore, two ends of the side surface of the shell 1 are respectively provided with a discharge hopper 40, the positions of the discharge hoppers 40 correspond to the positions of the two screws 24, after the wafer is cleaned, the clamping moving module moves the wafer to the position above the discharge hopper 40, then the aperture block 39 is opened to enable the wafer to fall into the discharge hopper 40, and then the discharging device performs subsequent work.
The working principle is as follows: when the device is used, firstly, an operator puts a wafer into the elastic block 13 at the upper side of the belt 10 far away from the end part of the cleaning box 21, then controls the first driving piece 20 to be opened, the first driving piece 20 drives the first rotating shaft 6 to rotate, then the belt 10 drives the second rotating shaft 7 to move at the same speed and in the same direction as the first rotating shaft 6, and simultaneously drives the balancing module on the belt 10 to move, in the moving process of the balancing module, the upper plane and the lower plane of the rotating ring 12 are both in a state parallel to the horizontal plane, so that when the belt 10 drives the balancing module to enter corrosive liquid, the whole lower surface of the wafer is in contact with the liquid surface of the corrosive liquid, then the wafer enters the corrosive liquid to be corroded, then the wafer moves in the corrosive liquid along with the belt 10, after the corrosion is finished, the wafer moves to the upper part of the corrosive liquid tank 5 and the lower part of the clamping and moving mechanism along with the belt 10, and then controls the first driving piece 20 to be closed, the belt 10 stops rotating.
The expansion rod 35 is controlled to extend, so that the lower fixing plate 36 and the storage frame 37, the ring 38 and the aperture block 39 on the lower portion of the lower fixing plate are driven to move downwards, in the process, the aperture block 39 is in an open state, in addition, when the ring 38 gradually approaches the balance module, the magnet block on the ring 38 is attracted with the magnet 16, so that the magnet 16 gradually approaches the ring 38, namely moves upwards, in the process of moving the magnet 16 upwards, when the lower surface of the ring 38 is in contact with the upper surface of the elastic block 13, the expansion rod 35 is continuously extended, and when the upper surface of the ring 38 is located on the lower surface of the wafer and on the upper portion of the magnet 16, the aperture block 39 is contracted, so that the wafer is stored in the storage frame 37.
The third driving member 33 is controlled to open, the third rotating shaft 32 and the driving gear 31 on the side surface thereof are driven to rotate by the third driving member 33, the driven gear 30 is driven to rotate during the rotation of the driving gear 31 due to the engagement of the driven gear 30 and the driving gear 31, and then the connecting rod 29 fixedly arranged in the driven gear 30 is driven to rotate 90 degrees, and the rotated connecting rod 29 is closer to the cleaning tank 21 than before.
Control second driving piece 25 and open, drive screw rod 24 through second driving piece 25 and rotate, because movable block 26 and 24 threaded connection of screw rod, so rotate the in-process at screw rod 24 and drive movable block 26 translation, then drive the translation of movable platform 27 with movable block 26 fixed connection, and then drive connecting rod 29 of movable platform 27 lower part and carry out the translation, after the translation is to washing case 21 top, control telescopic link 35 extends to the lower extreme and stretches into and wash in the washing liquid of washing case 21 inside, after finishing washing, shorten telescopic link 35, then utilize second driving piece 25 to continue to drive connecting rod 29 and remove, after the wafer washs and accomplishes, centre gripping removal module removes the wafer to a hopper 40 top, then open light ring piece 39 and make the wafer fall into out hopper 40, then the eduction gear carries out follow-up work.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A semiconductor wafer etching apparatus, comprising: the device comprises a shell (1), a clapboard (2) is fixedly arranged in the shell (1), a clamping groove (3) is arranged at the upper part of the clapboard (2), a clamping block (4) is clamped in the clamping groove (3), sponge is arranged at the upper part of the clamping block (4) and is used for absorbing corrosive liquid dripped in the moving process of the wafer,
the two sides of the partition plate (2) are respectively provided with a corrosive liquid box (5) and a cleaning box (21), the corrosive liquid box (5) and the cleaning box (21) are respectively internally provided with corrosive liquid and cleaning liquid, the corrosive liquid box (5) is internally provided with a rotating mechanism, the rotating mechanism penetrates through the liquid level of the corrosive liquid, the rotating mechanism drives the wafer to enter the corrosive liquid for corrosion,
a clamping moving mechanism is arranged at the upper part in the shell (1), and is used for clamping the corroded wafer and then moving the corroded wafer into the cleaning box (21) for cleaning;
the rotating mechanism comprises a linkage module and a balance module,
the linkage module is used for driving the rotating mechanism to integrally rotate,
the balance module is used for balancing the wafer in the rotating mechanism and controlling the plane of the wafer to uniformly enter the corrosive liquid.
2. The semiconductor wafer etching apparatus as set forth in claim 1, wherein: the linkage module is arranged in the corrosive liquid tank (5) in a penetrating mode and comprises a first rotating shaft (6) and a second rotating shaft (7), the first rotating shaft (6) is located at the outer end of the shell (1) and is fixedly provided with a first driving piece (20), a first belt pulley (9) and a second belt pulley (8) are fixedly arranged between the first rotating shaft (6) and the second rotating shaft (7) respectively, a belt (10) is connected between the second belt pulley (8) and the first belt pulley (9) in a transmission mode, the first driving piece (20) is used for driving the first rotating shaft (6) to rotate, and the second rotating shaft (7) is driven by the belt (10) to move at the same speed and in the same direction as that of the first rotating shaft (6) so as to drive wafers on the first rotating shaft to move at the same speed.
3. The semiconductor wafer etching apparatus as set forth in claim 2, wherein: the plurality of balance modules are uniformly arranged on the side face of the belt (10), each balance module comprises two support blocks (11), the two support blocks (11) are arranged at corresponding positions on two sides of the belt (10), the opposite side faces of the two support blocks (11) are connected with rotating rings (12), the rotating rings (12) constantly keep the state that the plane of the circular ring is parallel to the horizontal plane, elastic blocks (13) are fixedly arranged inside the rotating rings (12), and the elastic blocks (13) are used for fixing the wafer.
4. The semiconductor wafer etching apparatus as set forth in claim 3, wherein: the clamping and moving mechanism comprises a moving module, the moving module comprises two supporting plates (22), the two supporting plates (22) are symmetrical about the center of the corrosive liquid tank (5), the two ends of the lower surface of each supporting plate (22) are respectively and fixedly provided with a supporting block (23), a screw rod (24) is rotatably connected in each supporting block (23), a second driving piece (25) is fixedly connected to one end of each screw rod (24), and the second driving piece (25) is used for driving the screw rods (24) to rotate.
5. The semiconductor wafer etching apparatus as set forth in claim 4, wherein: the screw rod (24) is located threaded connection has movable block (26) between two supporting blocks (23), fixedly connected with moving platform (27) on moving block (26), backup pad (22) both sides are provided with guide rail (28) respectively, just moving platform (27) upper end slides and sets up on guide rail (28), screw rod (24) rotate the in-process drive move block (26) with moving platform (27) translation.
6. The semiconductor wafer etching apparatus as set forth in claim 5, wherein: centre gripping moving mechanism is still including the centre gripping module, the centre gripping module is including connecting rod (29), connecting rod (29) rotate to be connected moving platform (27) lower surface, connecting rod (29) with moving platform (27) link to each other end fixing and are provided with driven gear (30), moving platform (27) lower surface is located connecting rod (29) one side is rotated and is connected with driving gear (31), driving gear (31) side is fixed and is provided with third axis of rotation (32), just third axis of rotation (32) with driven gear (30) mesh mutually, driving gear (31) lower extreme is fixed and is provided with third driving piece (33), third driving piece (33) are used for the drive third axis of rotation (32) rotate, indirectly drive connecting rod (29) conversion direction.
7. The apparatus as set forth in claim 6, wherein: the fixed upper fixed plate (34) that is provided with of connecting rod (29) lower extreme, upper fixed plate (34) lower surface is connected with bottom plate (36) through telescopic link (35), bottom plate (36) lower surface fixed connection has storage frame (37), storage frame (37) lower extreme fixedly connected with ring (38), be provided with light ring piece (39) in ring (38), storage frame (37) ring (38) with light ring piece (39) cooperation is saved the wafer inside storage frame (37), just be provided with the magnet piece on ring (38).
8. The semiconductor wafer etching apparatus as set forth in claim 7, wherein: the outer side of the belt (10) is fixedly provided with a fixed cylinder (14) at a position corresponding to each rotating ring (12), a spring (15) is arranged in the fixed cylinder (14), a magnet (16) is fixedly arranged at the upper end of the spring (15), the magnet (16) is attracted with a magnet block arranged on the ring (38), a wafer fixed in the elastic block (13) is pushed upwards, and the wafer is clamped in the storage frame (37) by the diaphragm block (39) for storage.
9. The semiconductor wafer etching apparatus as set forth in claim 4, wherein: two ends of the side surface of the shell (1) are respectively provided with a discharge hopper (40), and the positions of the discharge hoppers (40) correspond to the positions of the two screws (24).
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| CN113611639B (en) | 2021-12-07 |
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