CN113604847A - Electric connector and electronic equipment with same - Google Patents
Electric connector and electronic equipment with same Download PDFInfo
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- CN113604847A CN113604847A CN202110997922.4A CN202110997922A CN113604847A CN 113604847 A CN113604847 A CN 113604847A CN 202110997922 A CN202110997922 A CN 202110997922A CN 113604847 A CN113604847 A CN 113604847A
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- 238000007747 plating Methods 0.000 claims abstract description 201
- 238000000576 coating method Methods 0.000 claims abstract description 56
- 239000011248 coating agent Substances 0.000 claims abstract description 55
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229910052737 gold Inorganic materials 0.000 claims abstract description 55
- 239000010931 gold Substances 0.000 claims abstract description 55
- 238000005260 corrosion Methods 0.000 claims abstract description 44
- 230000007797 corrosion Effects 0.000 claims abstract description 29
- 230000037452 priming Effects 0.000 claims abstract description 25
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- 229910052802 copper Inorganic materials 0.000 claims description 43
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 24
- 239000002253 acid Substances 0.000 claims description 20
- 239000003513 alkali Substances 0.000 claims description 15
- 229910052763 palladium Inorganic materials 0.000 claims description 12
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 239000002585 base Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000005253 cladding Methods 0.000 claims description 4
- 229910003803 Gold(III) chloride Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 239000002987 primer (paints) Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 abstract description 161
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 36
- 239000000758 substrate Substances 0.000 abstract description 33
- 229910052759 nickel Inorganic materials 0.000 abstract description 18
- 239000002344 surface layer Substances 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 206010020751 Hypersensitivity Diseases 0.000 abstract description 6
- 208000026935 allergic disease Diseases 0.000 abstract description 5
- 230000007815 allergy Effects 0.000 abstract description 5
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000011159 matrix material Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 210000004243 sweat Anatomy 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 4
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910000570 Cupronickel Inorganic materials 0.000 description 2
- 229910000929 Ru alloy Inorganic materials 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 208000030961 allergic reaction Diseases 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electric connector, which comprises an electric connector substrate, and a priming coating and an anticorrosive coating which are sequentially covered outside the electric connector substrate, wherein the priming coating comprises a trivalent gold coating as an innermost layer, and the anticorrosive coating comprises a rhodium ruthenium coating as a surface layer. By applying the electric connecting piece provided by the invention, the binding force with the electric connecting piece matrix is improved through the trivalent gold plating layer, so that the plating layer is more stable and is not easy to fall off. And the trivalent gold plating layer is used for replacing the traditional nickel plating layer, so that the risk of nickel allergy caused when the electric connecting piece is in contact with the skin is avoided. The rhodium ruthenium plating layer has extremely strong electrolytic corrosion resistance and extremely high surface hardness, provides continuous protection for the inner plating layer, and can also provide excellent wear resistance. In addition, the rhodium ruthenium plating layer has strong oxidation resistance, and the good conductivity of the electric connector is guaranteed. The invention also discloses electronic equipment with the electric connector, and the electronic equipment also has the technical effects.
Description
Technical Field
The invention relates to the technical field of corrosion prevention of electronic equipment, in particular to an electric connector and electronic equipment.
Background
With the diversified development of consumer electronics products, especially smart watches, true wireless bluetooth headsets and bracelet products are more and more diversified, the electrical connector matched with the smart watches is also complicated in appearance structure, in order to control the electrical connection cost, the electrical connector with a complicated structure usually adopts an MIM (metal injection molding) process convenient for molding, and the raw material corresponding to the electrical connector is usually stainless steel. However, for the continuous popularization of intelligent wearable devices, especially TWS earphones, smart watches and hand rings, the products are in contact with human skin frequently and for a long time, and inevitably can be contaminated with a large amount of human sweat. When the electric connector with sweat is charged, the electrolytic reaction can happen probably, so that the surface of the stainless steel needs to be plated for protection.
The common plating layers are copper plating and gold plating, white copper tin plating and gold plating, copper plating and rhodium ruthenium plating, nickel plating and the like. However, copper plating + gold plating, cupronickel tin plating + gold plating cannot resist electrolytic corrosion; the plating layer of the electroplated copper and rhodium ruthenium has poor bonding force with stainless steel, and the plating layer is easy to fall off; the nickel-based plating layer applied to the exposed electric connecting piece is easy to cause the excessive release of nickel, and causes the allergic reaction of users.
In summary, how to effectively solve the problems of poor using effect of the electrical connector and the like is a problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, a first object of the present invention is to provide an electrical connector, the electrical connector having a structure designed to effectively solve the problem of poor use effect of the electrical connector, and a second object of the present invention is to provide an electronic device including the electrical connector.
In order to achieve the first object, the invention provides the following technical scheme:
the utility model provides an electric connector, includes the electric connector base member and cover in proper order in prime coating and anticorrosive coating outside the electric connector base member, prime coating includes the trivalent gold cladding material as the inlayer, anticorrosive coating includes the rhodium ruthenium cladding material as the surface course.
Preferably, in the above electrical connector, the trivalent gold plating layer is AuCl3And hydrochloric acid.
Preferably, in the above electrical connector, the priming plating layer further includes an alkali copper plating layer and an acid copper plating layer, which are sequentially disposed outside the trivalent gold plating layer.
Preferably, in the above electrical connector, the acid copper plating layer is formed by CuSO4Plating layer formed by plating with the plating solution, the alkaliThe copper plating layer is made of Cu (CN)2Plating the formed plating layer by the plating solution.
Preferably, in the electrical connector, the thickness of the trivalent gold plating layer is 0.1 to 0.5 micrometer, the thickness of the alkali copper plating layer is 2 to 10 micrometers, and the thickness of the acid copper plating layer is 2 to 10 micrometers.
Preferably, in the above electrical connector, the anti-corrosion plating layer further includes an intermediate anti-corrosion plating layer located between the primer plating layer and the surface layer.
Preferably, in the electrical connector, the intermediate corrosion-resistant plating layer includes a copper-tin-zinc plating layer, a pure palladium plating layer and a gold plating layer, which are sequentially disposed from inside to outside.
Preferably, in the electrical connector, the Cu-Sn-Zn plating layer includes, by mass, 60% to 70% of Cu, 25% to 40% of Sn, and 1% to 5% of Zn.
Preferably, in the electrical connector, the gold plating layer is a plating layer formed by electroplating using an AuCN plating solution.
The electric connector provided by the invention comprises an electric connector substrate, a priming coating and an anti-corrosion coating. The electric connector comprises an electric connector substrate, a priming coating and an anticorrosive coating, wherein the priming coating and the anticorrosive coating sequentially cover the electric connector substrate, the priming coating comprises a trivalent gold coating serving as an innermost layer, and the anticorrosive coating comprises a rhodium ruthenium coating serving as a surface layer.
By applying the electric connector provided by the invention, the priming coating and the anti-corrosion coating are sequentially arranged outside the electric connector substrate, the priming coating is provided with the trivalent gold coating serving as the innermost layer, and the trivalent gold coating can effectively break an oxide layer on the surface of the electric connector substrate, so that gold is better attached to the surface of the electric connector substrate and is bonded with the substrate metal, the bonding force with the electric connector substrate is further improved, and the coating is more stable and is not easy to fall off. And the trivalent gold plating layer is used for replacing the traditional nickel plating layer, so that the risk of nickel allergy caused when the electric connecting piece is in contact with the skin is avoided. The anti-corrosion coating comprises a rhodium ruthenium coating as a surface layer, the rhodium ruthenium alloy has extremely strong electrolytic corrosion resistance and extremely high surface hardness which can reach 800HV, and electrolytic reaction occurs at the anode: such as 2Cl-1-2e-1→Cl2The high hardness of the rhodium ruthenium layer makes it possible to obtain a high hardness when the gas is generatedIs not easy to be stripped, provides continuous protection for the coating of the inner layer and also can provide excellent wear resistance. In addition, the rhodium ruthenium plating layer has strong oxidation resistance, does not react with aqua regia at normal temperature, and ensures good conductivity of the electric connector. In conclusion, the electric connector provided by the application has excellent corrosion resistance, stable conductivity, good bonding force with the substrate and good use effect.
In order to achieve the second object, the present invention also provides an electronic device including any one of the above electrical connectors. Since the above-mentioned electrical connector has the above-mentioned technical effects, the electronic device having the electrical connector should also have corresponding technical effects.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of an electrical connector according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of an electrical connector of a comparative example;
FIG. 3 is a state diagram of the embodiment of FIG. 1 before testing;
FIG. 4 is a corresponding post-test state diagram of FIG. 3;
FIG. 5 is a state diagram before testing of the comparative example shown in FIG. 2;
fig. 6 is a state diagram after the test corresponding to fig. 5.
The drawings are numbered as follows:
the electric connector comprises an electric connector substrate 100, a priming plating layer 200, an intermediate corrosion-resistant plating layer 300, a trivalent gold plating layer 210, an alkali copper plating layer 220, an acid copper plating layer 230, a copper tin zinc plating layer 310, a pure palladium plating layer 320, a gold plating layer 330 and a rhodium ruthenium plating layer 400;
the electric connector comprises an electric connector substrate 001, an impact nickel coating 002, a nickel coating 003 and a gold coating 004.
Detailed Description
The embodiment of the invention discloses an electric connector which has excellent corrosion resistance, stable conductivity and good bonding force with a substrate.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The electrical connector provided by the invention comprises an electrical connector substrate 100, a priming plating layer 200 and an anti-corrosion plating layer. The electric connector can be a spring Pin (Pogopin), a charging Pin (Pin), a charging base, a charging spring plate and other electric connection structures.
The structure of the electrical connector substrate 100 may refer to the prior art, such as a charging Pin structure, and is not described herein again.
The priming coating 200 and the anti-corrosion coating are sequentially covered outside the electric connector substrate 100, that is, the priming coating 200 is covered outside the electric connector substrate 100, and the anti-corrosion coating is covered outside the priming coating 200. The primer plating layer 200 is mainly used to improve the bonding force with the electrical connector substrate 100, and may be a single-layer structure or a multi-layer composite structure. The primer plating layer 200 includes a trivalent gold plating layer 210 as an innermost layer, that is, the trivalent gold plating layer 210 is used to connect with the electrical connector substrate 100, and the trivalent gold plating layer 210 is used to promote the bonding force with the electrical connector substrate 100.
The anti-corrosion coating is mainly used for providing an anti-corrosion effect, and can be of a single-layer structure or a multi-layer composite structure. The anti-corrosion plating layer comprises a rhodium ruthenium plating layer 400 as a surface layer, and the rhodium ruthenium plating layer 400 as the surface layer has extremely strong electrolytic corrosion resistance. Specifically, the rhodium ruthenium plating 400 can have a thickness of 0.2 to 1.2 microns.
The electric connector provided by the invention is applied, the priming plating layer 200 and the anti-corrosion plating layer are sequentially arranged outside the electric connector substrate 100, and the priming plating layerThe bottom plating layer 200 is provided with a trivalent gold plating layer 210 serving as an innermost layer, and the trivalent gold plating layer 210 can effectively break an oxide layer on the surface of the electric connector substrate 100, so that better gold is attached to the surface of the electric connector substrate 100 and is bonded with the substrate metal, the bonding force with the electric connector substrate 100 is further improved, and the plating layer is more stable and is not easy to fall off. And the traditional nickel plating layer is replaced by the trivalent gold plating layer 210, so that the risk of nickel allergy caused when the electric connecting piece is in contact with the skin is avoided. The anti-corrosion coating comprises a rhodium ruthenium coating 400 as a surface layer, the rhodium ruthenium alloy has extremely strong electrolytic corrosion resistance and extremely high surface hardness which can reach 800HV, and electrolytic reaction occurs at the anode: such as 2Cl-1-2e-1→Cl2When gas generation reaction is carried out, the rhodium ruthenium layer has high hardness, so that the rhodium ruthenium layer is not easy to strip, the continuous protection is provided for the coating of the inner layer, and meanwhile, the excellent wear resistance can be provided. In addition, the rhodium ruthenium plating layer 400 has strong oxidation resistance, does not react with aqua regia at normal temperature, and ensures good conductivity of the electric connector. In conclusion, the electric connector provided by the application has excellent corrosion resistance, stable conductivity, good bonding force with the substrate and good use effect.
Specifically, the trivalent gold plating layer 210 is AuCl3And hydrochloric acid. The trivalent gold plating layer 210 is adopted to replace an impact nickel electroplating solution, so that an oxide layer on the surface of the electric connector substrate 100 can be effectively broken, taking the electric connector substrate 100 made of stainless steel as an example, the oxide layer on the surface of the stainless steel can be effectively broken, gold is attached to the surface of the stainless steel and is bonded with iron element metal, and the bonding force is improved. The trivalent gold plating layer 210 may be formed by electroplating using other plating solutions, as necessary.
Further, the primer plating layer 200 further includes an alkali copper plating layer 220 and an acid copper plating layer 230, which are sequentially disposed outside the trivalent gold plating layer 210. The combination of the alkaline copper plating 220 and the acid copper plating 230 is beneficial to reducing the surface roughness of the priming plating 200, balancing the surface potential difference of the priming plating 200 and enabling the plating to be attached more densely.
Wherein the alkali copper plating layer 220 is formed using Cu (CN)2Plating the formed plating layer by the plating solution. Firstly electroplating an alkali copper coating outside the trivalent gold coating 210220, Cu (CN) is used as the alkali copper2The plating solution, CN-ion, has chemical activation, so that the copper layer is excellently bonded with the gold layer.
The acid copper plating layer 230 is CuSO4Plating the formed plating layer by the plating solution. Electroplating an acid copper plating layer 230 outside the alkali copper plating layer 220, wherein the acid copper is CuSO4The plating solution has uniform and compact deposition of acid copper, and can effectively improve the surface brightness and compactness. Other corresponding compounds or combinations of compounds may be used for the acid copper plating layer 230 and the alkali copper plating layer 220 as desired, and are not described herein again.
The combination of the trivalent gold plating layer 210, the alkali copper plating layer 220 and the acid copper plating layer 230 is used as the priming plating layer 200, so that the bonding force with the electric connector base body 100 is enhanced, the surface roughness is reduced, the whole plating layer is more compact, the traditional nickel plating layer priming mode is abandoned, and the risk of nickel allergy caused by exposure of charging pins and the like of a bracelet, a watch and an earphone when the charging pins and the like contact with the skin is avoided by adopting a nickel-free plating layer structure.
Specifically, the thickness of the trivalent gold plating layer 210 is 0.1-0.5 micron, the thickness of the alkali copper plating layer 220 is 2-10 micron, and the thickness of the acid copper plating layer 230 is 2-10 micron. The thickness of each plating layer is controlled within the range, so that the cost and the binding force can be considered, and the plating layer has excellent corrosion resistance.
In the above embodiment, the corrosion-resistant plating layer further includes an intermediate corrosion-resistant plating layer 300 between the primer plating layer 200 and the top layer. By providing the intermediate corrosion-resistant plating layer 300, the overall corrosion resistance is increased. So that the finish continues to provide corrosion resistance even in the event of damage or the like.
Specifically, the intermediate corrosion-resistant plating layer 300 includes a copper-tin-zinc plating layer 310, a pure palladium plating layer 320, and a gold plating layer 330, which are sequentially disposed from inside to outside. The copper tin zinc plating layer 310 can provide a good bonding force with the priming plating layer 200, and can also provide a good bonding force with the pure palladium plating layer 320, that is, the copper tin zinc plating layer 310, the pure palladium plating layer 320 and the gold plating layer 330 are used as the intermediate corrosion-resistant plating layer 300, so that an excellent bonding force can be realized, and the reliability of the whole plating layer is ensured. And the chemical property of the gold plating layer 330 is particularly stable, so that the inner plating layer is protected from being oxidized, meanwhile, the invasion of acid and alkali corrosive substances is prevented, and the overall comprehensive corrosion resistance is improved. The palladium plating layer has a strong corrosion resistance, and still has a strong corrosion resistance after the gold plating layer 330 is damaged by local corrosion. Pure palladium plating 320 also balances the potential difference between copper and gold for the case of acid copper plating 230 for primer plating 200.
The copper-tin-zinc plating layer 310 contains, by mass, 60% -70% of Cu, 25% -40% of Sn, and 1% -5% of Zn. I.e., contains a large amount of copper, which can achieve metallic bonding with copper in the acid copper plating layer 230 of the primer plating layer 200, improving the bonding force. And the metal bonding between the pure palladium plating layer 320 and the copper tin zinc plating layer 310 can be obviously improved by heat treatment at 200 ℃/1h after electroplating.
Specifically, the gold plating layer 330 is a plating layer formed by electroplating using an AuCN plating solution. Namely, the plating solution of the gold plating layer 330 is the chemical activation of aurous cyanide (AuCN), CN-, which can promote the metal bonding of gold and palladium plating layer, thereby improving the bonding force.
Specifically, the thickness of the copper-tin-zinc plating layer 310 is 2 to 5 micrometers, the thickness of the pure palladium plating layer 320 is 0.4 to 0.9 micrometers, and the thickness of the gold plating layer 330 is 0.3 to 1 micrometer. The thickness of each plating layer is controlled within the range, so that the cost and the binding force can be considered, and the plating layer has excellent corrosion resistance.
A specific example is described below in comparison with a conventional electrical connector structure as a comparative example.
In one embodiment, please refer to fig. 1, in which fig. 1 is a schematic structural diagram of an electrical connector according to an embodiment of the present invention. In this embodiment, a priming plating layer 200, an intermediate corrosion-resistant plating layer 300 and a surface layer are sequentially electroplated on the surface of the electrical connector substrate 100, wherein the priming plating layer 200 adopts a structure from inside to outside of a trivalent gold plating layer 210+ an alkali copper plating layer 220+ an acid copper plating layer 230, the intermediate corrosion-resistant plating layer 300 adopts a structure from inside to outside of a copper tin zinc plating layer 310+ a pure palladium plating layer 320+ a gold plating layer 330, and the surface layer adopts a rhodium ruthenium plating layer 400. The material of the electrical connector substrate 100 is stainless steel.
In a comparative example, please refer to fig. 2, fig. 2 is a schematic structural diagram of an electrical connector of the comparative example. In the comparative example, the surface of the electric connector substrate 001 was plated with the strike nickel plating layer 002, the nickel plating layer 003, and the gold plating layer 004 in this order.
The electrical connectors of the above examples and comparative examples were subjected to an electrolytic corrosion resistance test, specifically in the form of a charging Pin, with the following test procedures:
s1: dropping one drop of sweat, about 0.05ml, on the surface of the charged Pin;
s2: charging the charging Pin for 20 min;
s3: taking out and wiping residual sweat on the surface of the charging Pin, and observing the state of the charging Pin by using a CCD (charge coupled device);
the above steps S1-S3 are taken as a loop, and the loop of 15 is repeated. Wherein the sweat is far east standard sweat, acidic pH is 4.7, and alkaline pH is 9.5. The charging current was 50mA, and the voltage was 5V. The positive and negative electrode spacing was 4.5 mm.
Referring to FIGS. 3-6, FIG. 3 is a state diagram of the embodiment of FIG. 1 before testing; FIG. 4 is a corresponding post-test state diagram of FIG. 3; FIG. 5 is a state diagram before testing of the comparative example shown in FIG. 2; fig. 6 is a state diagram after the test corresponding to fig. 5. It can be seen that the electrical connection of the embodiment shown in fig. 1 of the present application has no obvious change, and the charging function is normal. Compared with the prior art, the electric connector of the battery pack is seriously corroded, and the charging function cannot be normally performed. In conclusion, the combination mode of the plating layers enables the electric connecting piece to obtain excellent electrolytic corrosion resistance, good binding force with a substrate and stable conductivity, and meanwhile, the environmental protection risk that the nickel release exceeds the standard when the traditional nickel plating layer is applied to consumer electronic appearance pieces is avoided.
Based on the electrical connector provided in the above embodiment, the invention further provides an electronic device including the electrical connector in any one of the above embodiments. Since the electronic device employs the electrical connector in the above embodiment, please refer to the above embodiment for the beneficial effect of the electronic device.
When the electric connector is applied to products such as watches, bracelets, TWS earphones and the like, the electric connector can be suitable for electric connectors which are more complex in structure and formed by stainless steel MIM, excellent coating binding force can be provided, and coatings are not easy to fall off; the electric connector is suitable for a worse wearing environment, such as when a large amount of sweat is generated during a large amount of sports, outdoor rainy days or when the washed surface of a user is soaked in water, the plating layer provides excellent electrolytic corrosion resistance; the coating can be suitable for being worn frequently and used everyday, and the scratch and the abrasion of the surface coating can be greatly reduced by the high-hardness coating; in addition, the nickel-free coating structure enables a user to wear the clothing more healthily and prevent allergy.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides an electric connector which characterized in that, including electric connector base member (100) and cover in proper order in priming coating (200) and anticorrosive coating outside electric connector base member (100), priming coating (200) include as the tervalence gold cladding material (210) of inlayer, anticorrosive coating includes rhodium ruthenium cladding material (400) as the surface course.
2. The electrical connector of claim 1, wherein said metallic trivalent gold plating (210) is applied using AuCl3And hydrochloric acid.
3. The electrical connector of claim 1, wherein said primer plating (200) further comprises an alkali copper plating (220) and an acid copper plating (230) disposed in sequence over said trivalent gold plating (210).
4. Electrical connector according to claim 3, characterized in that said acid copper plating (230) is a CuSO plating4A plating layer formed by electroplating with a plating solution, wherein the alkali copper plating layer (220) is formed by using Cu (CN)2Plating the formed plating layer by the plating solution.
5. The electrical connector of claim 3, wherein said layer of trivalent gold plating (210) has a thickness of 0.1-0.5 microns, said layer of alkaline copper plating (220) has a thickness of 2-10 microns, and said layer of acid copper plating (230) has a thickness of 2-10 microns.
6. Electrical connection according to any of claims 1 to 5, characterized in that said anti-corrosion coating further comprises an intermediate anti-corrosion coating (300) between said primer coating (200) and said top coating.
7. Electrical connector according to claim 6, characterized in that said intermediate corrosion-resistant plating (300) comprises, in sequence from inside to outside, a copper tin zinc plating (310), a pure palladium plating (320) and a gold plating (330).
8. The electrical connector according to claim 7, characterized in that said copper tin zinc plating (310) comprises, in mass percent, 60% to 70% of Cu, 25% to 40% of Sn, 1% to 5% of Zn.
9. The electrical connector of claim 7, wherein said gold plating (330) is a plating formed by electroplating using an AuCN plating solution.
10. An electronic device comprising an electrical connector according to any of claims 1 to 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110997922.4A CN113604847A (en) | 2021-08-27 | 2021-08-27 | Electric connector and electronic equipment with same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110997922.4A CN113604847A (en) | 2021-08-27 | 2021-08-27 | Electric connector and electronic equipment with same |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN206204445U (en) * | 2016-11-30 | 2017-05-31 | 东莞普瑞得五金塑胶制品有限公司 | A kind of special coating |
CN110504574A (en) * | 2019-08-27 | 2019-11-26 | 问问智能信息科技有限公司 | A kind of charging contact structure and preparation method thereof |
CN212848950U (en) * | 2020-06-30 | 2021-03-30 | 北京小米移动软件有限公司 | Electric connector and mobile terminal |
CN213124789U (en) * | 2020-11-02 | 2021-05-04 | 歌尔科技有限公司 | Electric connector with coating structure and electronic product |
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2021
- 2021-08-27 CN CN202110997922.4A patent/CN113604847A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206204445U (en) * | 2016-11-30 | 2017-05-31 | 东莞普瑞得五金塑胶制品有限公司 | A kind of special coating |
CN110504574A (en) * | 2019-08-27 | 2019-11-26 | 问问智能信息科技有限公司 | A kind of charging contact structure and preparation method thereof |
CN212848950U (en) * | 2020-06-30 | 2021-03-30 | 北京小米移动软件有限公司 | Electric connector and mobile terminal |
CN213124789U (en) * | 2020-11-02 | 2021-05-04 | 歌尔科技有限公司 | Electric connector with coating structure and electronic product |
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