CN215579154U - Conductive terminal, electric connector and electronic equipment - Google Patents

Abstract

The application discloses a conductive terminal, an electric connector and electronic equipment. The conductive terminal includes: the terminal comprises a terminal body, a copper alloy plating layer and a protective layer. The terminal body is plated with the copper alloy plating layer, and the protective layer is plated on one side of the copper alloy plating layer, which is far away from the terminal body. Through the mode, the copper alloy plating layer is adopted to replace the nickel plating layer to serve as the priming, so that the conductive terminal does not contain the nickel plating layer in the plating process, and the risk of nickel release does not exist.

Description

Conductive terminal, electric connector and electronic equipment

Technical Field

The present disclosure relates to the field of conductive terminal manufacturing technologies, and in particular, to a conductive terminal, an electrical connector, and an electronic device.

Background

The electrical connector plays a significant role in the conventional electronic devices, wherein the conductive terminals in the electrical connector provide charging and data transmission functions for the electronic devices.

The current conductive terminal can be plated with one or more layers of nickel on the surface, and the nickel plating has the advantages that: the surface of the conductive terminal can be uniform and flat, the plating thickness of the conductive terminal is basically the same, and the grooves, blind holes and gaps can be filled; meanwhile, the nickel layer has good stability, and the nickel exposed in the air can form a stable surface layer on the surface of the nickel layer, so that the nickel layer has certain protection capability.

However, nickel plating involves a risk of nickel release, and nickel element is absorbed by the skin directly or after a long time contact with the skin, thereby causing allergy in some individuals, such as dermatitis. This phenomenon may particularly occur when wearable electronic devices, such as bluetooth headsets, smartwatches, smartbands, further increase the contact time of skin and nickel when wearable electronic devices are worn for a long time, increasing the risk of nickel release.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application mainly solved provides conductive terminal, electric connector and electronic equipment, can avoid nickel release risk.

In order to solve the technical problem, the application adopts a technical scheme that: a conductive terminal is provided, which comprises a terminal body, a copper alloy plating layer and a protective layer. The terminal body is plated with the copper alloy plating layer, and the protective layer is plated on one side of the copper alloy plating layer, which is far away from the terminal body.

In order to solve the above technical problem, another technical solution adopted by the present application is: an electrical connector is provided, including a housing and a conductive terminal provided by the present application. The shell is provided with a containing cavity, and the conductive terminals are arranged in the containing cavity.

In order to solve the above technical problem, the present application adopts another technical solution: an electronic device is provided, which includes the electrical connector provided by the present application and a circuit board electrically connected with the electrical connector.

The beneficial effect of this application is: different from the situation of the prior art, the plating layer of the conductive terminal provided by the application is plated with a copper alloy plating layer, and replaces a nickel plating layer to be used as a substrate plating layer of the conductive terminal. The copper alloy plating layer can fill and level up the surface of the conductive terminal, and the risk of nickel release does not exist. Meanwhile, the outer side of the copper alloy plating layer is plated with a protective layer, so that the conductive terminal can be further protected.

Drawings

FIG. 1 is a schematic front view of an embodiment of an electronic device of the present application;

FIG. 2 is a schematic diagram of a back side structure of an embodiment of the electronic device of the present application;

FIG. 3 is a schematic diagram of an exploded view of an embodiment of the electronic device of the present application;

FIG. 4 is a schematic structural view of an embodiment of the electrical connector of the present application;

FIG. 5 is a schematic view of a plating layer structure of the conductive terminal according to the first embodiment of the present application;

FIG. 6 is a schematic view of a plating layer structure of a second embodiment of the conductive terminal of the present application;

FIG. 7 is a schematic view of a plating layer structure of a conductive terminal according to a third embodiment of the present application;

FIG. 8 is a schematic diagram of a plating layer structure of a fourth embodiment of the conductive terminal of the present application

FIG. 9 is a schematic diagram of a plating layer structure of a fifth embodiment of the conductive terminal of the present application

FIG. 10 is a schematic view of a plating layer structure of a conductive terminal according to a sixth embodiment of the present invention

FIG. 11 is a schematic diagram of a plating layer structure of a conductive terminal according to a seventh embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, mechanism, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, mechanisms, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The application provides embodiments of an electronic device, an electrical connector and a conductive terminal, wherein the electronic device may be a Smart Phone (Smart Phone), a PDA (Personal Digital Assistant or tablet Computer), a PC (Personal Computer or Computer), a massager, or an intelligent wearable device such as a Smart Watch (Smart Watch), a Smart bracelet (Smart bridge), a TWS True Wireless bluetooth headset (True Wireless Stereo), etc. The electrical connector is an input/output (I/O) device of the electronic device, and the electronic device can perform functions such as charging and discharging, data exchange and the like through the electrical connector. The conductive terminals are input/output (I/O) ports in the electrical connector.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic front structure diagram of an embodiment of an electronic device of the present application, and fig. 2 is a schematic back structure diagram of the embodiment of the electronic device of the present application, in this embodiment, an electronic device 10 is a smart watch, a front surface of the electronic device 10 is a display interaction end, and a back surface of the electronic device 10 is provided with an electrical connector 11.

Referring to fig. 3, fig. 3 is a schematic diagram of an explosion structure of an embodiment of an electronic device 10 according to the present application, where the electronic device includes, but is not limited to: electric connector 11, watchcase 12, watchband 13, circuit board 14, battery 15, back lid 16. The electrical connector 11 is an input/output (I/O) device of the electronic device 10, and the electronic device 10 can perform functions such as charging and discharging, data exchange, and the like through the electrical connector. The electrical connector 11 is electrically connected to the circuit board 14 and the battery 15, and the electrical connector 11 can charge the battery 15 by an external charger (not shown).

In the present embodiment, the electrical connector 11 is an input/output (I/O) device in the electronic device 10, and in other embodiments, the electrical connector may also be a charger interface, for example, and may specifically be a device for implementing data transmission, such as a universal serial bus C-Type (USB Type-C) connector or a Lightning (Lightning) connector.

In this embodiment, the circuit board 14 and the battery 15 are accommodated in a groove of the watch case 12, the back cover 16 covers an opening of the groove of the watch case 12, the electrical connector 11 is disposed in the back cover 16, one end of the electrical connector 11 is electrically connected to the circuit board 14, and the other end is exposed to the outside. When the user wears the electronic device 10, the front surface of the electronic device faces the user and the back surface of the electronic device is attached to the wrist. In long-term wear, the back of the electronic device 10 needs to be in close proximity to the skin, thereby allowing the electrical connector 11 to be in contact with the skin for a long period of time. In the prior art, a conductive port in an electric connector usually contains nickel, so that the risk of nickel release exists, and the intelligent watch can be harmful to skin after being worn for a long time. The electrical connector 11 provided in the present application does not contain nickel element and has no risk of nickel, and please refer to the following description of the electrical connector and the conductive terminal embodiments in the electrical connector.

Referring further to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of the electrical connector of the present application. The electrical connector 11 includes a conductive terminal 100 and a housing 110, wherein the conductive terminal 100 is mounted in the housing 110. The housing 120 is made of an insulating material, the housing 120 is provided with a receiving cavity 111, and the conductive terminal 100 is disposed in the receiving cavity 111. The conductive terminal 100 is an input/output (I/O) port of the electrical connector 11, the conductive terminal 100 can transmit electrical energy, and the conductive terminal 100 is electrically contacted with an external device to realize data transmission.

Optionally, the electrical connector 11 may include two or more conductive terminals 100 to improve transmission efficiency.

Alternatively, the conductive terminal 100 may be a conductive cylinder as shown in fig. 4, or may be a pin terminal, a PCB terminal, a hardware terminal, a nut terminal, a spring terminal, etc., and a person skilled in the art may adjust the shape or model of the conductive terminal 100 according to actual needs.

Further, an external charger (not shown) needs to be in direct contact with the outer surface of the conductive terminal 100 to realize data transmission after power is turned on, and the contact position needs to be capable of generating electrical connection, so that the material of the conductive terminal 100 needs to be metal.

In practical use, the conductive terminal 100 is usually exposed to air, and the outer surface of the conductive terminal 100 may not only chemically react with sweat, moisture in air, oxygen, nitrogen, etc., but also be worn by external force. Therefore, in the present embodiment, the surface of the conductive terminal 100 is plated with the metal plating layer, which not only protects the conductive terminal 100 from the external environment, but also ensures the conductive performance of the conductive terminal 100 to be good.

Referring to fig. 5, fig. 5 is a schematic view of a plating layer structure of the conductive terminal according to the first embodiment of the present application. The conductive terminal 100 includes a terminal body 101, a copper alloy plating layer 102, and a protection layer 103. The material of the terminal body 101 may be copper, silver, aluminum or their alloys. In this embodiment and the following embodiments, a detailed description will be given of a case where the terminal body 101 is made of copper metal. In addition, in the present embodiment and the following embodiments, the plating layer is prepared by an electroplating process. Electroplating is a process of plating a layer of other metals or alloys on the surface of a metal by utilizing the electrolysis principle, the processing cost of electroplating is not high, and the prepared plating layer is stable. During electroplating, the plating metal or other insoluble materials are used as an anode, the workpiece to be plated is used as a cathode, the electroplating solution is the electrolyte solution of the metal to be plated, and cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer.

In the embodiment, the terminal body 101 is made of copper material, and if no other metal layer is plated on the conductive terminal body 101, the terminal body 101 is oxidized to form verdigris (Cu2(OH)2CO3), thereby reducing the conductivity of the conductive terminal 100. Therefore, in order to improve the corrosion resistance and wear resistance of the conductive terminal 100 and prolong the service life, in the present embodiment, the surface of the terminal body 101 is plated with the copper alloy plating layer 102 and the protective layer 103. The copper alloy plating layer 102 is plated on the surface of the terminal body 101 as a primer, so that the color of copper after heating is prevented from being displayed, defects and blind holes on the surface of the terminal body 101 are filled, and the plating thickness is kept uniform.

In the prior art, a nickel layer is usually plated as a primer layer on the surface of the terminal body 101, so that the plating layer is uniformly distributed. However, nickel is at risk of releasing nickel, and skin may develop allergic reactions when exposed to nickel for a long period of time. In the present embodiment, the copper alloy plating layer 102 is used as the nickel substitute plating layer.

Alternatively, the copper alloy plating 102 in the present application may be a copper tin zinc plating, which is a plating containing a ternary alloy of copper tin zinc. Wherein the content of copper can be selected from 50-55%, the content of tin can be selected from 25-30%, the content of zinc can be selected from 15-20%, and the content ratio of copper, tin and zinc can be adjusted to change the performance and appearance of the copper-tin-zinc plating layer. The copper-tin-zinc plating layer has good filling degree, lower porosity, good wear resistance, good corrosion resistance, good high-temperature resistance and the like. Meanwhile, the cu-sn-zn plating layer has excellent conductivity to ensure that the conductive terminal 100 has a better transmission power rate and a lower transmission loss. Of course, in other embodiments, the copper alloy plating layer 102 may be copper-tin alloy, copper-zinc alloy, or other nickel-substituted copper alloy.

Optionally, the thickness of the copper alloy plating layer 102 is 1 to 5 μm, and may be selected from 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, and 5 μm.

The protection layer 103 is plated on a side of the copper alloy plating layer 102 away from the terminal body 101, and is used for improving the strength of the conductive terminal 100, preventing the conductive terminal 100 from being corroded, oxidized and worn, and preventing other plating layers in the protection layer 103 from diffusing outwards.

In this embodiment, the plating layer of the conductive terminal 100 does not use a nickel plating layer as a priming layer, but uses a copper alloy plating layer 102 as a nickel-substituted priming layer, and the copper alloy plating layer 102 not only can make the plating layer thickness on the outer surface of the terminal body 101 uniform, but also can effectively avoid the risk of nickel release.

In some embodiments, the protective layer 103 may include a platinum plating layer, a palladium plating layer, a rhodium plating layer, and a ruthenium plating layer, but the platinum plating layer, the palladium plating layer, the rhodium plating layer, and the ruthenium plating layer are all noble metal plating layers and are expensive to manufacture.

Therefore, in the second embodiment of the conductive terminal of the present application, as shown in fig. 6, the protection layer 103 includes a palladium plating layer 1031 and a platinum plating layer 1032 in addition to the first embodiment. The platinum plating layer 1032 is plated on the side of the copper alloy plating layer 102 away from the terminal body 101, and the palladium plating layer 1031 is plated on the side of the platinum plating layer 1032 away from the copper alloy plating layer 102. The platinum plating layer 1032 has high chemical stability, and can effectively improve the corrosion resistance of the conductive terminal 100; the platinum plating layer 1032 has good sealing performance and no pores, and the copper alloy plating layer 102 can be prevented from contacting with the outside air by being plated on one side of the copper alloy plating layer 102. The palladium plating layer 1031 is an outermost diffusion barrier layer, and can block the diffusion of the inner layer metal to the outside and prevent copper leakage. Meanwhile, the palladium plating layer 1031 and the platinum plating layer 1032 can effectively protect the inner layer metal from being abraded. In addition, the palladium plating layer 1031 and the platinum plating layer 1032 have low resistivity and high conductivity, are excellent electrical contact materials, and can be used as an electrical contact layer of the outer layer of the conductive terminal 100.

Further, in daily use, the conductive terminal 100 may be subject to electrolytic corrosion. When the conductive terminal 100 is applied with a power supply, the oxidizing ions with high electrode potential are reduced by discharging at the cathode, and the more active metal with low electrode potential in the anode region loses electrons and is oxidized into cations to be separated from the surface of the material to form anode corrosion. The palladium plating layer 1031 and the platinum plating layer 1032 can prevent external ions from entering the inner copper alloy plating layer 102 or the terminal body 101, prevent internal atoms from outward heat migration, reduce the electrolytic corrosion speed and improve the performance of resisting electrolytic corrosion.

Optionally, the thickness of the palladium plating layer 1031 is 0.1-1.5 μm, and optionally 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1.0 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm.

Optionally, the thickness of the platinum plating layer 1032 is 0.1 to 1.5 μm, and may be 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1.0 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm.

In the present embodiment, the protective layer 103 includes a palladium plating layer 1031 and a platinum plating layer 1032, and the palladium plating layer 1031 and the platinum plating layer 1032 can improve the corrosion resistance and the physical strength of the conductive terminal 100. The protective layer 103 does not contain a rhodium plating layer and a ruthenium plating layer, and a platinum plating layer and a palladium plating layer are adopted to replace a rhodium plating layer and a ruthenium plating layer noble metal plating layer, so that the same effect is achieved, the cost for preparing the conductive terminal 100 can be greatly reduced, and the requirement for saving the production cost is met. Therefore, the conductive terminal 100 of the present embodiment not only has good physical and chemical properties, but also is simple to manufacture and low in cost.

In a third embodiment of the conductive terminal of the present application, as shown in fig. 7, the protection layer 103 includes a palladium plating layer 1031 and a platinum plating layer 1032 in addition to the first embodiment. The palladium plating layer 1031 is plated on the side of the copper alloy plating layer 102 far away from the terminal body 101, the platinum plating layer 1032 is plated on the side of the palladium plating layer 1031 far away from the copper alloy plating layer 102, and the thickness of the palladium plating layer 1031 or the platinum plating layer 1032 can be selected to be 0.1-1.5 μm. Similar to the second embodiment, the conductive terminal 100 in this embodiment also has good corrosion resistance and wear resistance, and the protective layer 103 does not contain a rhodium plating layer or a ruthenium plating layer, and is simple to manufacture and low in cost.

Referring to fig. 8, fig. 8 is a schematic diagram of a plating layer structure of a fourth embodiment of the conductive terminal of the present application. On the basis of the first embodiment, the protective layer comprises at least 1 palladium plating 1031 and at least 2 platinum plating 1032. One platinum plating layer 1032 is plated on the side of the copper alloy plating layer 102 away from the terminal body 101, the other platinum plating layer 1032 is plated on the outermost side, and the one palladium plating layer 1031 is plated in the middle of the two platinum plating layers 1032. The thickness of each palladium plating layer 1031 or platinum plating layer 1032 is selected to be 0.1-1.5 μm.

In this embodiment, compared with the second embodiment, a platinum plating layer 1032 is added on the outer side of the palladium plating layer 1031. The conductive terminal 100 with the two platinum plating layers 1032 has better electrolytic corrosion resistance than the conductive terminal 100 with only one platinum plating layer, the multiple metal plating layers are filled up with each other, so that the occurrence of gaps can be further reduced, and the protective layer 103 is more compact, therefore, the conductive terminal 100 of the embodiment has better corrosion resistance. Moreover, the protective layer 103 in this embodiment does not contain a rhodium plating layer or a ruthenium plating layer, which reduces the cost.

Of course, in other embodiments, the protection layer 103 may further include more platinum plating layers 1032 to improve the corrosion resistance and wear resistance of the conductive terminals, and one skilled in the art may increase the number of platinum plating layers 1032 or adjust the plating order in the protection layer 103 as needed.

With reference to fig. 9, fig. 9 is a schematic diagram of a plating layer structure of the conductive terminal according to the fifth embodiment of the present application. On the basis of the first embodiment, the protective layer comprises at least 2 palladium platings 1031 and at least 1 platinum platings 1032. One palladium plating layer 1031 is plated on the side of the copper alloy plating layer 102 far away from the terminal body 101, the other palladium plating layer 1031 is plated on the outermost side, and the one platinum plating layer 1032 is plated in the middle of the two palladium plating layers 1031. The thickness of each palladium plating layer 1031 or platinum plating layer 1032 is selected to be 0.1-1.5 μm.

In this embodiment, compared with the third embodiment, a palladium plating layer 1031 is added on the outer side of the platinum plating layer 1032. The palladium plating layer 1031 on the innermost layer (close to the copper alloy plating layer 102) can prevent the outward heat migration of internal atoms, the palladium plating layer 1031 on the outermost layer can prevent external ions from entering the protective layer 103, and the 2-layer palladium plating layer 1031 and the platinum plating layer 1032 can also fill up each other, so that the compactness of the protective layer 103 is improved. Therefore, the conductive terminal 100 of the present embodiment also has better corrosion resistance, does not contain a rhodium plating layer or a ruthenium plating layer, and reduces the cost.

Of course, in other embodiments, the protection layer may also include more platinum plating layers 1032, and in combination with the above embodiments, one skilled in the art may add the palladium plating layer 1031 or the platinum plating layer 1032, or change the plating sequence of the layers of the protection layer 103 to increase the corrosion resistance and the wear resistance of the conductive terminal 100, which is not exhaustive herein.

Referring to fig. 10, fig. 10 is a schematic diagram of a plating layer structure of a sixth embodiment of the conductive terminal of the present application. In addition to the first embodiment, a primer plating layer 104 may be additionally provided between the terminal body 101 and the copper alloy plating layer 102. The bottom plating layer 104 is plated on the surface of the terminal body 101, and the bottom plating layer 104 is usually made of the same material as the terminal body 101, so in the case of the terminal body 101 of the present embodiment, the bottom plating layer 104 includes a copper plating layer.

The bottom plating layer 104 is used for filling up defects and gaps of the terminal body 101, increasing the adhesion capability of the copper alloy plating layer 102, and improving the bonding force between the copper alloy plating layer 102 and the terminal body 101. In other embodiments of the present application, a primer plating layer 104 may be additionally provided between the terminal body 101 and the copper alloy plating layer 102 to improve the bonding force between the plating layers.

Optionally, the thickness of the bottom plating layer 104 may be 2 to 5 μm, and may be selected from 2 μm, 2.4 μm, 2.5 μm, 2.8 μm, 3.0 μm, 3.3 μm, 3.5 μm, 3.7 μm, 4.3 μm, 4.5 μm, 4.8 μm, and 5.0 μm.

In order to further enhance the bonding force between the layers, in a seventh embodiment of the conductive terminal of the present application, as shown in fig. 11, the plating layer of the conductive terminal 100 further includes a transition layer 105 based on the first embodiment or the sixth embodiment. The transition layer 105 may be provided between the copper alloy plating layer 102 and the base plating layer 104, or between the copper alloy plating layer 102 and the protective layer 103, and in fig. 11, a transition layer 105 is plated between the copper alloy plating layer 102 and the base plating layer 104, and between the copper alloy plating layer 102 and the protective layer 103, respectively.

The transition layer 105 serves to enhance the bonding force between the plating layers because there is some internal stress between the plating layers, which affects the adhesion between the plating layers. The transition layer 105 is plated between different plating layers, so that internal stress between the plating layers can be buffered or reduced, cracks can be prevented from occurring between the plating layers, and the transition layer 105 can further enhance the corrosion resistance of the conductive terminal 100.

Alternatively, the transition layer 105 may be one of a silver plating layer, a silver alloy layer, a gold plating layer, and a gold alloy layer. Gold, silver or their alloys have good ductility and can better buffer or reduce internal stress between electroplated layers.

In addition to this embodiment, in other embodiments of the present application, a transition layer 105 may be plated between each electroplated layer to improve the bonding force between different electroplated layers.

In summary, the present application provides a conductive terminal, an electrical connector and an electronic device, which have the following beneficial effects: the electroplating process is adopted, the process is simple, and the cost of the preparation material is low; the copper alloy is used for replacing nickel to serve as a bottoming layer of the conductive terminal, so that the nickel release risk can be effectively avoided; the protective layer without rhodium and ruthenium plating layers is used, so that the inner plating layer can be protected, and the production cost can be reduced; the plating layers of the conductive terminals are tightly combined, and the conductive terminals have good strength.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.

Claims (10)

1. An electrically conductive terminal, comprising:

a terminal body;

a copper alloy plating layer plated on the terminal body; and

and the protective layer is plated on one side of the copper alloy plating layer, which is far away from the terminal body.

2. The electrically conductive terminal of claim 1, further comprising an undercoat layer between the terminal body and the copper alloy plating layer, the undercoat layer comprising a copper plating layer.

3. An electrically conductive terminal as claimed in claim 2,

the thickness of the bottom plating layer is 2-5 mu m, and the thickness of the copper alloy plating layer is 1-5 mu m.

4. An electrically conductive terminal as claimed in claim 2,

a transition layer is arranged between the copper alloy plating layer and the protective layer and/or between the bottom plating layer and the copper alloy plating layer;

the transition layer comprises a silver plating or silver alloy layer or gold plating or gold alloy layer.

5. An electrically conductive terminal as claimed in claim 1,

the protective layer comprises a platinum plating layer and a palladium plating layer;

the platinum plating layer is plated on one side, far away from the terminal body, of the copper alloy plating layer, and the palladium plating layer is plated on one side, far away from the copper alloy plating layer, of the platinum plating layer; or

The palladium plating layer is plated on one side, far away from the terminal body, of the copper alloy plating layer, and the platinum plating layer is formed on one side, far away from the copper alloy plating layer, of the palladium plating layer.

6. An electrically conductive terminal as claimed in claim 1,

the protective layer at least comprises 1 platinum plating layer and 2 palladium plating layers, and the platinum plating layer is positioned between the 2 palladium plating layers; or

The protective layer at least comprises 2 layers of platinum plating layers and 1 layer of palladium plating layer, and the palladium plating layer is positioned between the 2 layers of platinum plating layers.

7. An electrically conductive terminal according to claim 5 or 6,

the thickness of the platinum coating is 0.1-1.5 mu m, and the thickness of the palladium coating is 0.1-1.5 mu m.

8. An electrically conductive terminal as claimed in claim 1, wherein the copper alloy coating comprises a copper tin zinc alloy coating.

9. An electrical connector, comprising:

the shell is provided with an accommodating cavity; and

the conductive terminal as claimed in claims 1 to 8, wherein the conductive terminal is disposed in the receiving cavity.

10. An electronic device, comprising:

an electrical connector as in claim 9; and

a circuit board electrically connected with the electrical connector.

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