CN113602815A - IC Tray feeding and recycling device and method - Google Patents
IC Tray feeding and recycling device and method Download PDFInfo
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- CN113602815A CN113602815A CN202110988070.2A CN202110988070A CN113602815A CN 113602815 A CN113602815 A CN 113602815A CN 202110988070 A CN202110988070 A CN 202110988070A CN 113602815 A CN113602815 A CN 113602815A
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- 238000004064 recycling Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 128
- 210000000078 claw Anatomy 0.000 claims abstract description 91
- 238000011084 recovery Methods 0.000 claims abstract description 61
- 230000033001 locomotion Effects 0.000 claims abstract description 51
- 230000005540 biological transmission Effects 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 238000012360 testing method Methods 0.000 abstract description 7
- 238000012423 maintenance Methods 0.000 abstract description 3
- 230000003028 elevating effect Effects 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
- B65G37/02—Flow-sheets for conveyor combinations in warehouses, magazines or workshops
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G57/00—Stacking of articles
- B65G57/02—Stacking of articles by adding to the top of the stack
- B65G57/03—Stacking of articles by adding to the top of the stack from above
- B65G57/035—Stacking of articles by adding to the top of the stack from above with a stepwise downward movement of the stack
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G59/00—De-stacking of articles
- B65G59/02—De-stacking from the top of the stack
Abstract
The invention discloses an IC Tray feeding and recycling device and method, which comprises a base, a Tray feeding area, a Tray loading area and a Tray recycling area, wherein the Tray feeding area comprises a feeding Tray lifting mechanism, a feeding Tray bin, a suction claw support, a vacuum suction claw, a suction claw Z-axis movement mechanism and a suction claw X-axis movement mechanism; the tray loading area comprises an X-axis linear transmission mechanism, a Y-axis linear transmission mechanism and a tray working platform; the tray recovery area comprises a recovery tray lifting mechanism and a recovery tray bin; the tray loading area is located between the tray feeding area and the tray recovery area. The invention has high efficiency, high quality and stable performance. And the occupied space is small, the maintenance cost is low, and the test production efficiency is high.
Description
Technical Field
The invention relates to an IC Tray feeding and recycling device and method, and belongs to the technical field of semiconductor/industrial automation.
Background
ICTRAY translates into Chinese and is an IC tray or an electronic chip tray, which is a packaging tray used by semiconductor packaging and testing enterprises for chip (IC) packaging and testing. The tray that uses above electronic chip product and electronic component mostly has the tray of punching press type production, the fashioned tray of plastic uptake in addition, and the use of this kind of tray is all in order to prevent that the product from protecting the touching mutually, and protection product production can not be harmd with the transportation process, possesses simultaneously and prevents static, and effect such as high temperature resistant has played the fine guard action to electronic chip. In addition, recycling and producing these plastic pallets can maximize the use of the value of the raw materials, and respond to the government-proposed policy of recycling economy, and are the best way to solve the problem of environmental pollution. The plastic trays and the like are prevented from being released to the public places to the maximum extent, and are reused after being reprocessed or used as recycled materials in other similar products. Therefore, in the manufacturing process of electronic chips, semiconductor sealing and testing enterprises use IC trays as carriers in a large quantity for preventing static electricity, resisting high temperature, preventing collision and the like of the chip products, and carry out production and transportation on the electronic chip products, supply and recovery of the IC Tray and other production processes, so that efficient and convenient production equipment and use methods are provided, and the quality and the production efficiency of the chip products are directly limited.
The traditional method adopts the manual work to put into the workstation with single IC Tray, and after the chip product was filled the Tray, carry out artifical recovery and take away the Tray. In order to replace manpower, some semi-automatic transportation and recovery by various devices are not efficient generally. The defects and shortcomings of the prior art are mainly shown as follows: firstly, the production management cost of human personnel; secondly, the quality of the product changes along with human factors, and the quality is unstable; thirdly, the product testing and production process is complex, a large amount of transportation, transfer and storage are needed, and the occupied space is large; fourthly, the production efficiency of product testing is low, and the method belongs to a semi-automatic production mode. Fifthly, the transportation and recovery production equipment has more types, and the equipment maintenance cost is increased.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects in the prior art, the invention provides the feeding and recycling equipment and method for the IC Tray, which are equipment and a method for realizing the automatic feeding of the IC Tray in the production process of IC chip products and carrying out the production processes such as automatic Tray recycling and the like after the Tray is filled with the IC chip products.
The technical scheme is as follows: in order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a IC Tray feed recovery plant, includes base, Tray feed district, Tray charge space, Tray recovery area, wherein:
tray feed district includes feed tray elevating system, feed tray feed bin, inhales claw support, vacuum and inhales the claw, inhales claw Z axle motion, inhales claw X axle motion, feed tray elevating system's stiff end and base fixed connection, and feed tray elevating system's drive end and feed tray feed bin fixed connection. The vacuum chuck is characterized in that the chuck support is fixedly arranged on the base, the chuck X-axis movement mechanism is arranged on the chuck support, the chuck Z-axis movement mechanism is arranged on the chuck X-axis movement mechanism, and the vacuum chuck is arranged on the chuck Z-axis movement mechanism.
The tray charging area comprises an X-axis linear transmission mechanism, a Y-axis linear transmission mechanism and a tray working platform, the X-axis linear transmission mechanism is installed on the base, the Y-axis linear transmission mechanism is installed on the X-axis linear transmission mechanism, and the tray working platform is installed on the Y-axis linear transmission mechanism.
The tray recovery area comprises a recovery tray lifting mechanism and a recovery tray bin, the fixed end of the recovery tray lifting mechanism is fixedly connected with the base, and the driving end of the recovery tray lifting mechanism is fixedly connected with the recovery tray bin.
The tray loading area is located between the tray feeding area and the tray recovery area.
Preferably: the automatic feeding device comprises an electrical control system, wherein the electrical control system is electrically connected with a feeding tray lifting mechanism, a vacuum suction claw, a suction claw Z-axis motion mechanism, a suction claw X-axis motion mechanism, an X-axis linear transmission mechanism, a Y-axis linear transmission mechanism and a recovery tray lifting mechanism respectively.
Preferably: the number of the IC Tray storage bins for storing the IC Tray is 10-20.
An IC Tray feeding and recovering method comprises the following steps:
step 1, an IC Tray is put into a feeding Tray bin.
And 2, lifting the feeding tray bin to the position below the vacuum suction claw through the feeding tray lifting mechanism.
And 3, firstly, setting the initial position of the X-axis movement mechanism of the suction claw, so that the vacuum suction claw is positioned right above the feed tray bin. And starting a Z-axis motion mechanism of the suction claw to descend the vacuum suction claw until the vacuum suction claw is contacted with the IC Tray. The vacuum system was started and the IC Tray was sucked by the vacuum chuck. Then the Z-axis motion mechanism of the suction claw is lifted back, and the vacuum suction claw takes the IC Tray away from the feeding Tray bin. And secondly, adjusting a cylinder of a suction claw X-axis movement mechanism of the suction claw X-axis movement mechanism to work, enabling an IC Tray adsorbed by a vacuum suction claw of the suction claw Z-axis movement mechanism to do linear movement along the X axis to the right side, moving the vacuum suction claw and the IC Tray together to the upper part of a Tray working platform, descending the suction claw Z-axis movement mechanism until the IC Tray contacts with the Tray working platform, deflating the vacuum suction claw, placing the IC Tray on the Tray working platform, and driving the vacuum suction claw to return to the initial position by the suction claw X-axis movement mechanism.
And 4, the equipment control system gives loading position information, the servo motors of the X-axis linear transmission mechanism and the Y-axis linear transmission mechanism work, the Tray working platform with the IC Tray is moved to a loading position, the IC Tray is loaded at the loading position, after the IC Tray is fully loaded, the loaded IC Tray is moved to a recovery Tray bin through the X-axis linear transmission mechanism and the Y-axis linear transmission mechanism, and then the X-axis linear transmission mechanism and the Y-axis linear transmission mechanism return to the initial position.
And 5, moving the IC Tray full of materials to the position below the recovery Tray bin by the operation of the servo motors of the X-axis linear transmission mechanism and the Y-axis linear transmission mechanism, sequentially moving the recovery Tray bin downwards to recover the IC Tray full of materials under the operation of the servo motor of the recovery Tray lifting mechanism until the recovery Tray bin is full, and manually taking away the IC Tray from the full recovery Tray bin.
Compared with the prior art, the invention has the following beneficial effects:
the invention has high efficiency, high quality and stable performance. The production management cost of manpower personnel is reduced, and the equipment maintenance cost is reduced. The quality of the product does not change along with human factors, so that the quality is not stable. Does not need a large amount of transportation and transfer storage, and reduces the occupied space. The product testing production efficiency is high, and the product is stable. Through automatic feeding and recovery of the IC Tray, the production process of the IC chip is realized, the production is efficient and convenient, and the electronic chip is well protected.
Drawings
FIG. 1 is a flow chart of the structure of the present invention.
Fig. 2 is a schematic diagram of the principle of the present invention.
Fig. 3 is a first perspective view of the present invention.
Fig. 4 is a second perspective view of the present invention.
Fig. 5 is a front view of the first perspective view.
Fig. 6 is a top view of the first perspective view.
FIG. 7 is a schematic view of the structure of the tray feeding area of the present invention.
Fig. 8 is a flow chart of the operation of the present invention.
Detailed Description
The present invention is further illustrated by the following description in conjunction with the accompanying drawings and the specific embodiments, it is to be understood that these examples are given solely for the purpose of illustration and are not intended as a definition of the limits of the invention, since various equivalent modifications will occur to those skilled in the art upon reading the present invention and fall within the limits of the appended claims.
An IC Tray feeding and recycling device is shown in figures 1-7 and comprises a base 1, a Tray feeding area 2, a Tray loading area 3, a Tray recycling area 4 and an electrical control system 5, wherein:
as shown in fig. 7, the Tray feeding area 2 includes a feeding Tray lifting mechanism 21, a feeding Tray bin 22, a claw-sucking support, a vacuum claw 6, a claw-sucking Z-axis moving mechanism 23, and a claw-sucking X-axis moving mechanism 24, and the number of IC Tray storage in the feeding Tray bin 22 is 10-20. The stiff end and the base 1 fixed connection of feed tray elevating system 21, and the drive end and the feed tray feed bin 22 fixed connection of feed tray elevating system 21, feed tray elevating system 21 can go up and down the removal with feed tray feed bin 22. The suction claw support is fixedly arranged on the base 1, the suction claw X-axis movement mechanism 24 is arranged on the suction claw support, the suction claw Z-axis movement mechanism 23 is arranged on the suction claw X-axis movement mechanism 24, the vacuum suction claw 6 is arranged on the suction claw Z-axis movement mechanism 23, the vacuum suction claw 6 moves along the Z axis (up-down lifting) through the suction claw Z-axis movement mechanism 23, and the vacuum suction claw 6 moves along the X axis (left-right) through the suction claw X-axis movement mechanism 24.
Tray charge space 3 includes X axle straight line drive mechanism 31, Y axle straight line drive mechanism 32, tray work platform 33, X axle straight line drive mechanism 31 is installed on base 1, Y axle straight line drive mechanism 32 is installed on X axle straight line drive mechanism 31, tray work platform 33 is installed on Y axle straight line drive mechanism 32, removes tray work platform 33 along following X axle (controlling) through X axle straight line drive mechanism 31, removes tray work platform 33 along following Y axle (front and back) through Y axle straight line drive mechanism 32.
The tray recovery area 4 comprises a recovery tray lifting mechanism 41 and a recovery tray bin 42, the fixed end of the recovery tray lifting mechanism 41 is fixedly connected with the base 1, the driving end of the recovery tray lifting mechanism 41 is fixedly connected with the recovery tray bin 42, and the recovery tray bin 42 is lifted and moved by the recovery tray lifting mechanism 41.
The tray loading area 3 is positioned between the tray feeding area 2 and the tray recovery area 4.
The electric control system 5 is respectively electrically connected with the feeding tray lifting mechanism 21, the vacuum suction claw 6, the suction claw Z-axis movement mechanism 23, the suction claw X-axis movement mechanism 24, the X-axis linear transmission mechanism 31, the Y-axis linear transmission mechanism 32 and the recovery tray lifting mechanism 41.
An IC Tray supply recycling method, as shown in fig. 8, includes the following steps:
in step 1, an IC Tray is placed in the supply Tray magazine 22.
And 2, lifting the feeding tray bin 22 to the position below the vacuum suction claw 6 through the feeding tray lifting mechanism 21.
In step 3, first, the initial position of the X-axis movement mechanism 24 of the suction claw is set so that the vacuum suction claw 6 is positioned right above the feed pallet magazine 22. The cylinder of the suction claw Z-axis movement mechanism 23 works to make the vacuum suction claw 6 vertically move downwards linearly until the vacuum suction claw 6 contacts with the IC Tray. The vacuum system is started, and the IC Tray is sucked by the vacuum chuck 6. The gripper Z-axis motion 23 then lifts back and the vacuum gripper 6 takes the IC Tray off the supply Tray magazine 22. Then, the suction claw X-axis movement mechanism 24 is adjusted, the cylinder of the suction claw X-axis movement mechanism 24 works, so that the IC Tray adsorbed by the vacuum suction claw 6 of the suction claw Z-axis movement mechanism 23 moves linearly along the X axis to the right side, the vacuum suction claw 6 and the IC Tray are moved to the upper side of the Tray working platform 33 together, the suction claw Z-axis movement mechanism 23 descends until the IC Tray contacts with the Tray working platform 33, the vacuum suction claw 6 deflates, and the IC Tray is placed on the Tray working platform 33. The IC Tray is placed on the Tray working platform 33, and the vacuum suction claw 6 is driven by the suction claw Z-axis movement mechanism 23 to return to the initial position to wait for next Tray taking.
And 4, the equipment control system gives loading position information, servo motors of the X-axis linear transmission mechanism 31 and the Y-axis linear transmission mechanism 32 work, the Tray working platform 33 with the IC Tray is moved to a loading position, the IC Tray is loaded at the loading position, after the IC Tray is fully loaded, the filled IC Tray is moved to a recovery Tray bin 42 through the X-axis linear transmission mechanism 31 and the Y-axis linear transmission mechanism 32, and then the X-axis linear transmission mechanism 31 and the Y-axis linear transmission mechanism 32 return to the initial position.
And step 5, moving the IC Tray full of the IC Tray to the position below the recovery Tray bin 42 by the operation of the servo motors of the X-axis linear transmission mechanism 31 and the Y-axis linear transmission mechanism 32, and enabling the recovery Tray bin 42 to move downwards to recover the IC Tray full of the IC Tray in sequence under the operation of the servo motor of the recovery Tray lifting mechanism 41 until the recovery Tray bin 42 is full, and manually taking away the IC Tray from the full recovery Tray bin 42.
According to the invention, the vacuum suction claw is used for grabbing the tray in the feeding tray bin 22 of the tray feeding area, the tray is placed on the tray working platform 33, the tray working platform 33 transfers the tray to the loading working area for chip loading, and when the loading of chip products on the tray is finished, the tray is transferred to the tray receiving area for tray recovery. 10-20 empty Tray discs can be put into the bin at one time, and after the Tray is filled with the IC chip products, the IC chip products are automatically recovered in sequence.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.
Claims (4)
1. The utility model provides a IC Tray feed recovery plant which characterized in that: including base (1), tray feed area (2), tray charge space (3), tray recovery area (4), wherein:
the tray feeding area (2) comprises a feeding tray lifting mechanism (21), a feeding tray bin (22), a claw absorbing support, a vacuum claw absorbing, a claw absorbing Z-axis movement mechanism (23) and a claw absorbing X-axis movement mechanism (24), wherein the fixed end of the feeding tray lifting mechanism (21) is fixedly connected with the base (1), and the driving end of the feeding tray lifting mechanism (21) is fixedly connected with the feeding tray bin (22); the suction claw support is fixedly arranged on the base (1), the suction claw X-axis movement mechanism (24) is arranged on the suction claw support, the suction claw Z-axis movement mechanism (23) is arranged on the suction claw X-axis movement mechanism (24), and the vacuum suction claw is arranged on the suction claw Z-axis movement mechanism (23);
the tray loading area (3) comprises an X-axis linear transmission mechanism (31), a Y-axis linear transmission mechanism (32) and a tray working platform (33), the X-axis linear transmission mechanism (31) is installed on the base (1), the Y-axis linear transmission mechanism (32) is installed on the X-axis linear transmission mechanism (31), and the tray working platform (33) is installed on the Y-axis linear transmission mechanism (32);
the tray recovery area (4) comprises a recovery tray lifting mechanism (41) and a recovery tray bin (42), the fixed end of the recovery tray lifting mechanism (41) is fixedly connected with the base (1), and the driving end of the recovery tray lifting mechanism (41) is fixedly connected with the recovery tray bin (42);
the tray loading area (3) is positioned between the tray feeding area (2) and the tray recovery area (4).
2. The IC Tray supply recycling apparatus according to claim 1, wherein: the vacuum suction claw recovery device comprises an electrical control system (5), wherein the electrical control system (5) is electrically connected with a feeding tray lifting mechanism (21), a vacuum suction claw, a suction claw Z-axis movement mechanism (23), a suction claw X-axis movement mechanism (24), an X-axis linear transmission mechanism (31), a Y-axis linear transmission mechanism (32) and a recovery tray lifting mechanism (41) respectively.
3. The IC Tray supply recycling apparatus according to claim 2, wherein: the number of the IC Tray storage bins (22) for storing the IC Tray is 10-20.
4. A feed recovery method based on the IC Tray feed recovery apparatus of claim 1, comprising the steps of:
step 1, an IC Tray is put into a feeding Tray bin (22);
step 2, a feeding tray bin (22) is lifted to the position below the vacuum suction claw through a feeding tray lifting mechanism (21);
step 3, firstly, setting the initial position of the X-axis movement mechanism (24) of the suction claw, so that the vacuum suction claw is positioned right above the feed tray bin (22); starting a Z-axis motion mechanism (23) of the suction claw to descend the vacuum suction claw until the vacuum suction claw is contacted with the IC Tray; starting a vacuum system, and adsorbing the IC Tray by using a vacuum suction claw; then a Z-axis motion mechanism (23) of a suction claw rises back, and the vacuum suction claw takes the IC Tray away from a feeding Tray bin (22); secondly, adjusting a cylinder of a suction claw X-axis movement mechanism (24) to work, enabling an IC Tray adsorbed by a vacuum suction claw of the suction claw Z-axis movement mechanism to do linear movement along the right side of the X axis, moving the vacuum suction claw and the IC Tray to the upper side of a Tray working platform (33) together, descending a suction claw Z-axis movement mechanism (23) until the IC Tray is contacted with the Tray working platform (33), deflating the vacuum suction claw, placing the IC Tray on the Tray working platform (33), and driving the vacuum suction claw (6) to return to the initial position by the suction claw X-axis movement mechanism (24);
step 4, the equipment control system gives loading position information, the servo motors of the X-axis linear transmission mechanism (31) and the Y-axis linear transmission mechanism (32) work, the Tray working platform with the IC Tray is moved to a loading position, the IC Tray is loaded at the loading position, after the IC Tray is fully loaded, the filled IC Tray is moved to a recovery Tray bin (42) through the X-axis linear transmission mechanism (31) and the Y-axis linear transmission mechanism (32), and then the X-axis linear transmission mechanism (31) and the Y-axis linear transmission mechanism (32) return to the initial position;
and 5, moving the IC Tray full of the materials to the position below a recovery Tray bin (42) through the work of servo motors of the X-axis linear transmission mechanism (31) and the Y-axis linear transmission mechanism (32), sequentially enabling the recovery Tray bin (42) to move downwards to recover the IC Tray full of the materials under the work of the servo motor of the recovery Tray lifting mechanism (41) until the recovery Tray bin (42) is full of the materials, and manually taking away the IC Tray from the recovery Tray bin (42) after the full materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110988070.2A CN113602815A (en) | 2021-08-26 | 2021-08-26 | IC Tray feeding and recycling device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110988070.2A CN113602815A (en) | 2021-08-26 | 2021-08-26 | IC Tray feeding and recycling device and method |
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| Publication Number | Publication Date |
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| CN113602815A true CN113602815A (en) | 2021-11-05 |
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| CN202110988070.2A Pending CN113602815A (en) | 2021-08-26 | 2021-08-26 | IC Tray feeding and recycling device and method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060081479A (en) * | 2005-01-07 | 2006-07-13 | (주)제이티 | Device for transfering tray |
| CN101018723A (en) * | 2005-05-17 | 2007-08-15 | 平田机工株式会社 | Apparatus for carrying in/out substrate and method for carrying in/out substrate |
| CN210010209U (en) * | 2019-05-10 | 2020-02-04 | 珠海市科迪电子科技有限公司 | Automatic feeding equipment |
| CN211643483U (en) * | 2020-01-16 | 2020-10-09 | 智汇轩田智能系统(杭州)有限公司 | Quick and automatic taking and placing system for fixed-point feeding tray |
| CN212075429U (en) * | 2020-04-10 | 2020-12-04 | 苏州科诺机器人有限责任公司 | Automatic loading and unloading device from material frame to Tray disc |
| CN212402350U (en) * | 2020-05-12 | 2021-01-26 | 昆山希盟自动化科技有限公司 | Material collecting equipment |
-
2021
- 2021-08-26 CN CN202110988070.2A patent/CN113602815A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060081479A (en) * | 2005-01-07 | 2006-07-13 | (주)제이티 | Device for transfering tray |
| CN101018723A (en) * | 2005-05-17 | 2007-08-15 | 平田机工株式会社 | Apparatus for carrying in/out substrate and method for carrying in/out substrate |
| CN210010209U (en) * | 2019-05-10 | 2020-02-04 | 珠海市科迪电子科技有限公司 | Automatic feeding equipment |
| CN211643483U (en) * | 2020-01-16 | 2020-10-09 | 智汇轩田智能系统(杭州)有限公司 | Quick and automatic taking and placing system for fixed-point feeding tray |
| CN212075429U (en) * | 2020-04-10 | 2020-12-04 | 苏州科诺机器人有限责任公司 | Automatic loading and unloading device from material frame to Tray disc |
| CN212402350U (en) * | 2020-05-12 | 2021-01-26 | 昆山希盟自动化科技有限公司 | Material collecting equipment |
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Application publication date: 20211105 |
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