CN113601388A - Grinding equipment and manufacturing process of Mini LED chip - Google Patents
Grinding equipment and manufacturing process of Mini LED chip Download PDFInfo
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- CN113601388A CN113601388A CN202110760523.6A CN202110760523A CN113601388A CN 113601388 A CN113601388 A CN 113601388A CN 202110760523 A CN202110760523 A CN 202110760523A CN 113601388 A CN113601388 A CN 113601388A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 230000007306 turnover Effects 0.000 claims description 15
- 238000004140 cleaning Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000005498 polishing Methods 0.000 abstract description 53
- 239000012530 fluid Substances 0.000 abstract description 2
- 230000000903 blocking effect Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/06—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by liquid or gas pressure only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The application discloses grinding equipment and a manufacturing process of a Mini LED chip, and relates to the technical field of Mini LED chips, the grinding efficiency of batch semiconductor substrates is improved, the grinding equipment comprises a grinding table, a grinding pad rotationally connected to the grinding table, and a conveying pipe arranged above the grinding pad and used for conveying grinding fluid, wherein a lifting mechanism used for driving the grinding head to move up and down is arranged above the grinding table, a mounting groove in a circular structure is formed in the grinding table, a motor used for driving the grinding pad to rotate is installed in the mounting groove, an inserting block in a polygonal structure is arranged at the end part of an output shaft of the motor, positioning rods are coaxially arranged on the upper surface and the lower surface of the grinding pad, an inserting block in a polygonal structure is arranged at the end part of the positioning rod, and an inserting groove for inserting the inserting block to be inserted is formed at the end part of the output shaft of the motor; the periphery of the grinding pad is coaxially and rotatably connected with a support ring. This application is effectual has improved the efficiency of polishing of semiconductor substrate in batches.
Description
Technical Field
The application relates to the technical field of Mini LED chips, in particular to grinding equipment and a manufacturing process of a Mini LED chip.
Background
With the rapid development of the Mini LED chip technology, the Mini LED chip has begun to be applied to ultra-large screen high definition display, such as commercial fields of monitoring and commanding, high definition broadcasting, high-end cinema, medical diagnosis, advertisement display, conference exhibition, office display, virtual reality, and the like. The Mini LED chip mainly comprises a substrate and a plurality of LED array units which are arranged on the surface of the substrate and are mutually isolated through grooves. In the manufacturing process of the Mini LED chip, the substrate needs to be thinned to the required thickness through chemical mechanical polishing equipment.
Chinese patent application No. CN201310156820.5 in the related art discloses a chemical mechanical polishing apparatus, comprising: the polishing head can relatively slide relative to the polishing pad, the relative sliding direction is parallel to a first linear direction, and the port is used for providing polishing liquid between the polishing pad and the semiconductor substrate on the polishing head.
With respect to the related art in the above, the inventors consider that: after the polishing of the semiconductor substrates is completed, the polishing of the next semiconductor substrate can be performed only after the polishing pad is cleaned by workers, so that the polishing efficiency of the semiconductor substrates in batches is influenced.
Disclosure of Invention
In order to improve the polishing efficiency of batch semiconductor substrates, the application provides grinding equipment and a manufacturing process of Mini LED chips.
In a first aspect, the present application provides a grinding apparatus for a Mini LED chip, which adopts the following technical scheme:
a grinding device for a Mini LED chip comprises a grinding table, a grinding pad rotationally connected to the grinding table, a grinding head arranged above the grinding pad in a lifting mode, and a conveying pipe used for conveying grinding fluid, wherein a mounting groove in a circular structure is formed in the grinding table, a motor used for driving the grinding pad to rotate is mounted in the mounting groove, positioning rods are coaxially arranged on the upper surface and the lower surface of the grinding pad, inserting blocks in a polygonal structure are arranged at the end portions of the positioning rods, and inserting grooves used for inserting the inserting blocks are formed in the end portions of output shafts of the motor; the periphery of the grinding pad is coaxially and rotatably connected with a support ring;
the grinding table is provided with a turnover mechanism for turning over the grinding pad, the turnover mechanism comprises two supporting blocks arranged on the outer side of the supporting ring, and the two supporting blocks are symmetrically arranged by taking the axis of the supporting ring as a center; the grinding table is provided with two supporting plates extending along the axis direction of the mounting groove at the edge of the mounting groove, and the two supporting plates are symmetrically arranged by taking the axis of the mounting groove as a center; connecting rods in a cuboid structure are connected in the two supporting blocks in a sliding mode, the connecting rods extend out of one ends, far away from the supporting rings, of the supporting blocks, and gears are coaxially fixed on the outer peripheral sides of the connecting rods; one side, close to the two supporting plates, of each supporting plate is provided with a connecting groove extending along the axis direction of the mounting groove, a baffle is vertically arranged in each connecting groove, a turning cavity for the gear to move upwards is formed between each baffle and the bottom of each connecting groove, and a reset cavity for the gear to move downwards is formed between each baffle and the notch of each connecting groove; gaps for the gear to pass through are reserved between the baffle and the upper and lower groove walls of the connecting groove;
a rack for meshing a gear is arranged on the wall of one side of the overturning cavity, the rack extends along the height direction of a connecting groove, a limiting groove matched with the connecting rod and used for inserting the connecting rod is formed in the bottom of the connecting groove, the limiting groove extends along the height direction of a supporting plate, limiting holes penetrating through the upper end and the lower end of the baffle plate along the height direction of the supporting plate are formed in the baffle plate, the connecting rod penetrates through the limiting holes, and the connecting rod can rotate in the limiting holes;
the supporting block is internally provided with an elastic part which acts on the connecting rod all the time to provide driving force for the connecting rod to move towards the direction of the limiting groove; when the gear abuts against the upper groove wall of the connecting groove, the elastic piece can drive the connecting rod to be inserted into the limiting groove, and the gear enters the reset cavity; when the gear meshed with the rack moves to abut against the upper groove wall of the connecting groove, the support ring and the grinding pad are turned for 180 degrees together;
the outer peripheral side of the connecting rod is also provided with a fixing ring, and the bottom of the connecting groove is provided with a fixing groove for inserting the fixing ring when the connecting rod is abutted against the lower groove wall of the connecting groove; an operating rod is arranged at one end, far away from the support rings, of the connecting rod, a through groove which is communicated with the limiting groove and used for the operating rod to extend out is formed in one side, far away from the two support plates, of the connecting rod, and the through groove extends along the height direction of the connecting groove; and a cleaning mechanism used for cleaning the end surface of one side of the grinding pad close to the bottom of the mounting groove is arranged in the mounting groove.
By adopting the technical scheme, when the next substrate needs to be ground, a worker presses the operating rod towards the direction of the support ring to enable the fixing ring to be separated from the fixing groove and enable the gear to enter the turnover cavity, then the operating rod is moved upwards to enable the splicing block to be separated from the splicing groove and the support ring to be separated from the notch of the mounting groove, the gear and the rack are meshed at the moment, the gear and the connecting rod are driven to rotate in the moving process to enable the support ring to be turned over, when the support ring finishes 180-degree turnover, the gear is abutted against the upper end groove wall of the connecting groove, the elastic part pushes the gear to enter the reset cavity at the moment, the connecting rod is inserted into the limiting groove to be limited, the support ring can be reset into the mounting groove in a horizontal state, the fixing ring is clamped into the fixing groove under the action of the elastic part, the turnover of the grinding pad is finished, and the lower end surface of the grinding pad can be cleaned by virtue of the cleaning mechanism, the next overturning use of the grinding pad is facilitated, and the grinding efficiency of the batch semiconductor substrates is effectively improved.
Optionally, a water retaining disc is horizontally arranged in the mounting groove, a through hole for the output shaft of the motor to pass through is formed in the middle of the water retaining disc, and a rotary sealing ring is arranged between the output shaft of the motor and the through hole; the cleaning mechanism comprises a spraying pipe arranged on the upper end face of the water retaining disc and extending along the axis direction of the water retaining disc, a plurality of spray heads facing the grinding pad are arranged on the spraying pipe, and a drain pipe is connected to the groove wall of the mounting groove close to one end of the water retaining disc.
Through adopting above-mentioned technical scheme, when wasing the grinding pad, spray water to the grinding pad through the shower nozzle to through the rotation of grinding pad self, carry out holistic washing, the cleaning process is comparatively convenient to the grinding pad.
Optionally, a sliding block is arranged at one end of the connecting rod, which is far away from the operating rod, a sliding groove for the sliding connection of the sliding block is formed at one end of the supporting block, which is far away from the supporting ring, the elastic part is a spring installed in the sliding groove, one end of the spring abuts against the groove bottom of the sliding groove, and the other end of the spring abuts against the sliding block; and the sliding support block is also internally provided with a limiting structure for preventing the sliding block from separating from the sliding groove.
Through adopting above-mentioned technical scheme, adopt the spring as elastic component, have simple structure, the stable advantage of atress.
Optionally, the limiting structure comprises a limiting ring fixed at the notch of the sliding groove.
Through adopting above-mentioned technical scheme, the spacing ring can prevent that the slider breaks away from the spout under the effect of spring.
Optionally, the middle part circumference of support ring inboard is provided with annular protruding edge, the periphery side of grinding pad is seted up and is supplied annular protruding edge to rotate the annular of connecting.
Optionally, the two ends of the annular protrusion in the axis direction are respectively embedded with a resistance reducing ball which is abutted against the groove wall of the annular groove.
Through adopting above-mentioned technical scheme, the frictional resistance between annular protruding edge and the annular can be reduced in the setting of drag reduction ball.
Optionally, the thickness of the support ring in the axial direction is greater than the thickness of the polishing pad in the axial direction, and a reservoir is formed between the inner peripheral wall of the support ring and the end face of the polishing pad.
Through adopting above-mentioned technical scheme, the utilization ratio of lapping liquid can be improved to the setting of reservoir.
Optionally, a support frame is arranged on the grinding table, an air cylinder is vertically arranged at the upper end of the support frame, the end of a piston rod of the air cylinder is rotatably connected with the middle of the grinding head, a reinforcing plate is vertically connected to the outer peripheral side of a piston rod of the air cylinder, a bearing is fixed to the outer peripheral side of the positioning rod, a positioning hole matched with the bearing is formed in one end, away from the piston rod of the air cylinder, of the reinforcing plate, and when the grinding head presses the semiconductor substrate against the grinding pad, the hole wall of the positioning hole abuts against the outer ring of the bearing.
Through adopting above-mentioned technical scheme, the stability when grinding head rotates can be improved in the setting of gusset plate.
In a second aspect, the present application provides a manufacturing process of a Mini LED chip, which adopts the following technical scheme:
the method comprises the following steps:
the method comprises the following steps: preparing a support film with a sticky surface;
step two: manufacturing a substrate;
step three: thinning the substrate, and pressing the manufactured substrate on a grinding pad through a grinding head for grinding to obtain the substrate with the required thickness;
step four: transferring the substrate to a support film;
step five: and cutting to obtain single Mini LED chips, and thus finishing the manufacture of the Mini LED chips.
In summary, the present application includes at least one of the following benefits:
1. the polishing efficiency of the batch semiconductor substrates is effectively improved;
2. the arrangement of the liquid storage tank can improve the utilization rate of the grinding liquid.
Drawings
FIG. 1 is a schematic view of the overall structure of the present embodiment;
FIG. 2 is a schematic cross-sectional view of the embodiment embodying an electric motor;
FIG. 3 is an exploded view of the present embodiment embodying the annular flange;
FIG. 4 is a cross-sectional view of the support ring of the present embodiment;
fig. 5 is an enlarged schematic view at B in fig. 4 of the present embodiment;
FIG. 6 is an enlarged schematic view at A in FIG. 2 of the present embodiment;
FIG. 7 is a schematic structural view of the embodiment embodying the supporting plate;
fig. 8 is a schematic sectional view of the support plate of the present embodiment.
Description of reference numerals: 1. a grinding table; 2. a polishing pad; 3. a grinding head; 4. a delivery pipe; 5. mounting grooves; 6. a motor; 7. positioning a rod; 8. an insertion block; 9. inserting grooves; 11. a cylinder; 12. a support frame; 13. a reinforcing plate; 14. a bearing; 15. positioning holes; 16. a ring groove; 17. a support ring; 18. an annular convex edge; 19. a drag reducing ball; 20. a support block; 21. a support plate; 22. a connecting rod; 23. a slider; 24. a chute; 25. a spring; 26. a limiting ring; 27. a gear; 28. a rack; 29. connecting grooves; 30. a baffle plate; 31. a turnover cavity; 32. a reset chamber; 33. a limiting hole; 34. a limiting groove; 35. an operating lever; 36. a through groove; 37. a fixing ring; 38. fixing grooves; 39. a water retaining disc; 40. a drain pipe; 41. a shower pipe; 42. and (4) a spray head.
Detailed Description
The present application is described in further detail below with reference to the attached drawings.
The embodiment of the application discloses grinding equipment for a Mini LED chip. Referring to fig. 1 and 2, the polishing apparatus includes a polishing table 1, a polishing pad 2 rotatably connected to the polishing table 1, a polishing head 3 disposed above the polishing pad 2 in a lifting manner, and a delivery pipe 4 for delivering a polishing liquid, wherein the polishing pad 2 has a disc-shaped structure. When polishing the substrate, the polishing head 3 is driven to move toward the lower polishing pad 2, so that the substrate is pressed against the polishing pad 2, and the substrate is polished by the rotation of the polishing pad 2.
Referring to fig. 2 and 3, the middle part of the upper end surface of the grinding table 1 is provided with a mounting groove 5 in a circular structure; the bottom of the mounting groove 5 is provided with a motor 6, and an output shaft of the motor 6 can drive the grinding pad 2 to rotate. Specifically, the upper and lower end faces of the polishing pad 2 are coaxially provided with positioning rods 7, and the positioning rods 7 are cylindrical. The tip of locating lever 7 is provided with the grafting piece 8 that is the rectangle structure, and the inserting groove 9 with the grafting piece 8 adaptation is seted up to the output shaft tip of motor 6, and grafting piece 8 can insert in inserting groove 9 for motor 6 drives grinding pad 2 and rotates.
Referring to fig. 1 and 2, a supporting frame 12 is arranged above the grinding table 1, a vertically arranged cylinder 11 is fixed at the upper end of the supporting frame 12, a piston rod of the cylinder 11 penetrates through the supporting frame 12 and vertically extends downwards, and one end of the piston rod of the cylinder 11 is rotatably connected with the middle part of the grinding head 3 through a bearing 14. In order to improve the stability of the piston rod of the air cylinder 11, a reinforcing plate 13 is welded or fixed by screws on the outer side of the piston rod of the air cylinder 11, a bearing 14 is also fixed on the outer peripheral side of the positioning rod 7, and a positioning hole 15 matched with the bearing 14 on the positioning rod 7 is formed in one end, away from the piston rod of the air cylinder 11, of the reinforcing plate 13. When the polishing head 3 presses the substrate against the polishing pad 2, the positioning hole 15 passes through the positioning rod 7 and the inside of the positioning hole 15 abuts against the outer ring of the bearing 14, thereby improving the stability of the piston rod of the cylinder 11.
Referring to fig. 2, the polishing table 1 is provided with a turnover mechanism for turning over the polishing pad 2, and the mounting groove 5 is provided with a cleaning mechanism for cleaning the polishing pad 2. When polishing the next substrate, the worker can rotate the polishing pad 2, so that the lower end face and the upper end face of the polishing pad 2 are exchanged, and then the next substrate can be polished; in the process of polishing the next substrate, the cleaning mechanism can also clean the lower end surface of the polishing pad 2 so as to facilitate the next use of turning over the polishing pad 2.
Referring to fig. 3 and 4, a support ring 17 is coaxially rotatably connected to the peripheral side of the polishing pad 2. Specifically, the outer periphery of the polishing pad 2 is provided with a ring groove 16, and the inner side of the support ring 17 is circumferentially provided with an annular convex edge 18 rotatably connected in the ring groove 16. In order to reduce the friction between the annular convex edge 18 and the annular groove 16, a plurality of resistance reducing balls 19 are uniformly embedded in the circumferential direction of two end faces of the annular convex edge 18 in the axial direction, and the resistance reducing balls 19 at the two ends of the annular convex edge 18 are respectively abutted against the upper groove wall and the lower groove wall of the annular groove 16.
Referring to fig. 3 and 4, in order to reduce the loss of the polishing liquid, the thickness of the supporting ring 17 in the axial direction thereof is greater than the thickness of the polishing pad 2, so that a liquid storage tank is formed between the supporting ring 17 and the end surface of the polishing pad 2, thereby improving the utilization rate of the polishing liquid.
Referring to fig. 2 and 3, the turnover mechanism includes two support blocks 20 disposed outside the support ring 17. The two support blocks 20 are arranged symmetrically about the axis of the support ring 17. The edge that grinding table 1 is located the notch of mounting groove 5 is provided with two backup pads 21, and two backup pads 21 use the axis of mounting groove 5 to set up as central symmetry, and two backup pads 21 are parallel to each other and vertical direction extends.
Further, referring to fig. 5, a connecting rod 22 having a rectangular parallelepiped structure is slidably connected to each of the two support blocks 20, and the connecting rod 22 extends from one end of the support block 20 away from the support ring 17. Specifically, one end of the connecting rod 22 is provided with a slider 23, one end of the support block 20, which is away from the support ring 17, is provided with a sliding groove 24 extending along the axis direction of the support ring 17, the slider 23 is slidably connected in the sliding groove 24, an elastic part for driving the connecting rod 22 to extend out of the sliding groove 24 is further arranged in the sliding groove 24, the elastic part is a spring 25, one end of the spring 25 abuts against the groove bottom of the sliding groove 24, and the other end of the spring abuts against the slider 23. Under the effect of no external force, the spring 25 can drive the sliding block 23 to move towards the direction of the notch of the sliding groove 24, the notch of the sliding groove 24 is in interference clamping connection with a limiting ring 26, and the limiting ring 26 forms a limiting structure for preventing the sliding block 23 from being separated from the sliding groove 24.
Referring to fig. 5 and 6, a gear 27 is welded on the outer periphery of the middle portion of the connecting rod 22, connecting grooves 29 for moving the gear 27 are respectively formed on the sides of the two support plates 21 close to each other, and the connecting grooves 29 extend along the height direction of the support plates 21. A baffle 30 is vertically provided at the middle of the coupling groove 29. The baffle 30 separates the connecting slot 29 into a flip cavity 31 and a reset cavity 32, namely, the flip cavity 31 is positioned between the baffle 30 and the notch of the connecting slot 29, and the reset cavity 32 is positioned between the bottom of the connecting slot 29 and the baffle 30. The baffle 30 and the connecting groove 29 are provided with a gap between the upper and lower groove walls for the gear 27 to pass through, the baffle 30 is provided with a limiting hole 33 which penetrates through the upper and lower ends of the baffle 30 along the height direction of the supporting plate 21, and the connecting rod 22 can pass through the limiting hole 33 and can rotate in the limiting hole 33. When the gear 27 moves to the upper groove wall of the connecting groove 29, the gear 27 can enter the reset chamber 32 under the action of the spring 25. The groove bottom of the connecting groove 29 is provided with a limiting groove 34 matched with the connecting rod 22, and the limiting groove 34 extends along the height direction of the supporting plate 21. When the connecting rod 22 is inserted into the stopper groove 34, the connecting rod 22 may stop rotating.
Referring to fig. 6 and 7, a cavity wall on one side of the turnover cavity 31 is provided with a rack 28 for engaging with the gear 27, and the rack 28 extends along the height direction of the connecting groove 29. When the support ring 17 moves upwards to separate the plug-in block 8 from the plug-in groove 9 and the support ring 17 is just separated from the notch of the mounting groove 5, the gear 27 is meshed with the rack 28, at this time, the support ring 17 moves upwards continuously, the support ring 17 starts to rotate, when the gear 27 reaches the upper groove wall, the support ring 17 finishes 180-degree turnover, the gear 27 enters the reset cavity 32 under the action of the spring 25, and meanwhile, the connecting rod 22 is inserted into the limit groove 34. It is noted here that when a portion of the gear 27 is separated from the rack 28, a portion of the connecting rod 22 has been inserted into the stopper groove 34 for stopper. The gear 27 is then moved back into the mounting groove 5 along the reset chamber 32. during the downward movement of the gear 27, the limiting groove 34 prevents the connecting rod 22 from rotating, so that the polishing pad 2 is returned to the mounting groove 5 in a horizontal state.
Referring to fig. 7 and 8, in order to facilitate the worker to move the support ring 17 upward, an operating rod 35 extending in the axial direction of the connecting rod 22 is screwed to one end of the connecting rod 22 away from the slider 23, and the operating rod 35 is cylindrical and has a diameter smaller than the cross-sectional width of the connecting rod 22. One side of the two support plates 21 away from each other is provided with a through groove 36 communicated with the limiting groove 34, and one end of the operating rod 35 extends out of the support plates 21 from the through groove 36.
Referring to fig. 6 and 8, a fixing ring 37 is provided on the outer peripheral side of the connecting rod 22 between the gear 27 and the operating rod 35, and a fixing groove 38 communicating with the stopper groove 34 is opened at the lower end of the groove bottom of the connecting groove 29. When the support ring 17 is restored to the installation groove 5, the fixing ring 37 and the fixing groove 38 are in the same axial position, and at this time, the spring 25 can continuously push the connecting rod 22 to move, so that the fixing ring 37 is clamped into the fixing groove 38, and the support ring 17 is fixed.
Referring to fig. 2, a water blocking disc 39 is horizontally arranged in the mounting groove 5, the motor 6 is positioned below the water blocking disc 39, a through hole for the output shaft of the motor 6 to pass through is formed in the middle of the water blocking disc 39, and a rotary sealing ring is arranged between the through hole and the output shaft of the motor 6 and used for preventing liquid from passing below the water blocking disc 39.
Referring to fig. 2, the cleaning mechanism includes a shower pipe 41 installed on the water blocking plate 39, one end of the shower pipe 41 is connectable to an external water pump, the shower pipe 41 extends along a diameter direction of the water blocking plate 39, and a plurality of nozzles 42 facing the direction of the polishing pad 2 are disposed on the shower pipe 41 at equal intervals, and are used for spraying a cleaning solution on the lower end surface of the polishing pad 2 to clean the lower end surface of the polishing pad 2. The wall of the mounting groove 5 near one end of the water retaining disc 39 is connected with a drain pipe 40. The cleaned liquid can be discharged out of the mounting groove 5 through the drain pipe 40.
The implementation principle of the grinding equipment for the Mini LED chip in the embodiment of the application is as follows:
when the next substrate is polished, the air cylinder 11 drives the polishing head 3 to move upwards, then the worker presses the two operating rods 35 towards the supporting block 20, so that the gear 27 enters the turnover cavity 31, then the operating rods 35 are moved upwards, so that the gear 27 is meshed with the rack 28, so that the gear 27 drives the supporting ring 17 to rotate in the moving process, when the supporting disk is turned over by 180 degrees and the gear 27 reaches the upper groove wall of the connecting groove 29, the gear 27 enters the reset cavity 32 under the action of the spring 25, the connecting rod 22 is inserted into the limiting groove 34, then the operating rods 35 are moved downwards, so that the supporting ring 17 is installed back into the mounting groove 5, at the moment, the fixing ring 37 and the fixing groove 38 are in opposite positions, and under the action of the spring 25, the fixing ring 37 enters the fixing groove 38 again, so that the grinding pad 2 is turned over and fixed, and when the water pump is started, the spray head 42 on the spray pipe 41 sprays high-pressure water to the grinding pad 2, thereby cleaning the grinding pad 2 and facilitating the next overturning use of the grinding pad 2.
The embodiment of the application also discloses a manufacturing process of the Mini LED chip. The method comprises the following steps:
the method comprises the following steps: preparing a support film with a sticky surface;
step two: manufacturing a substrate;
step three: thinning the substrate, and pressing the manufactured substrate on a grinding pad 2 through a grinding head 3 for grinding to obtain the substrate with the required thickness;
step four: transferring the substrate to a support film;
step five: and cutting to obtain single Mini LED chips, and thus finishing the manufacture of the Mini LED chips.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (9)
1. The utility model provides a grinding device of Mini LED chip, includes grinding table (1), rotates grinding pad (2) of connecting on grinding table (1), goes up and down to set up in grinding head (3) of grinding pad (2) top and be used for carrying conveyer pipe (4) of lapping liquid, its characterized in that: the grinding table (1) is provided with a mounting groove (5) with a circular structure, a motor (6) for driving the grinding pad (2) to rotate is mounted in the mounting groove (5), positioning rods (7) are coaxially arranged on the upper surface and the lower surface of the grinding pad (2), an insertion block (8) with a polygonal structure is arranged at the end part of each positioning rod (7), and an insertion groove (9) for inserting the insertion block (8) is formed in the end part of an output shaft of the motor (6); the peripheral side of the grinding pad (2) is coaxially and rotatably connected with a support ring (17);
the grinding table (1) is provided with a turnover mechanism for turning over the grinding pad (2), the turnover mechanism comprises two supporting blocks (20) arranged on the outer side of the supporting ring (17), and the two supporting blocks (20) are symmetrically arranged by taking the axis of the supporting ring (17) as the center; two supporting plates (21) extending along the axial direction of the mounting groove (5) are arranged at the edge of the grinding table (1) positioned on the mounting groove (5), and the two supporting plates (21) are symmetrically arranged by taking the axial direction of the mounting groove (5) as a center; connecting rods (22) in a cuboid structure are connected in the two supporting blocks (20) in a sliding mode, the connecting rods (22) extend out from one ends, far away from the supporting rings (17), of the supporting blocks (20), and gears (27) are coaxially fixed on the outer peripheral sides of the connecting rods (22); one side, close to each other, of each of the two support plates (21) is provided with a connecting groove (29) extending along the axial direction of the mounting groove (5), a baffle (30) is vertically arranged in each connecting groove (29), a turnover cavity (31) for the gear (27) to move upwards is formed between each baffle (30) and the bottom of each connecting groove (29), and a reset cavity (32) for the gear (27) to move downwards is formed between each baffle (30) and the notch of each connecting groove (29); gaps for the gear (27) to pass through are reserved between the baffle (30) and the upper and lower groove walls of the connecting groove (29);
a rack (28) used for being meshed with a gear (27) is arranged on the cavity wall of one side of the turnover cavity (31), the rack (28) extends along the height direction of the connecting groove (29), a limiting groove (34) which is matched with the connecting rod (22) and used for inserting the connecting rod (22) is formed in the groove bottom of the connecting groove (29), the limiting groove (34) extends along the height direction of the supporting plate (21), limiting holes (33) penetrating through the upper end and the lower end of the baffle (30) along the height direction of the supporting plate (21) are formed in the baffle (30), the connecting rod (22) penetrates through the limiting holes (33), and the connecting rod (22) can rotate in the limiting holes (33);
an elastic piece is arranged in the supporting block (20), and acts on the connecting rod (22) all the time to provide driving force for the connecting rod (22) to move towards the direction of the limiting groove (34); when the gear (27) is abutted against the upper groove wall of the connecting groove (29), the elastic piece can drive the connecting rod (22) to be inserted into the limiting groove (34), and the gear (27) enters the reset cavity (32); when the gear (27) engaged with the rack (28) moves to be against the upper groove wall of the connecting groove (29), the supporting ring (17) and the grinding pad (2) are turned 180 degrees together;
a fixing ring (37) is further arranged on the outer peripheral side of the connecting rod (22), and a fixing groove (38) for inserting the fixing ring (37) when the connecting rod (22) is abutted against the lower groove wall of the connecting groove (29) is formed in the groove bottom of the connecting groove (29); an operating rod (35) is arranged at one end, far away from the support ring (17), of the connecting rod (22), a through groove (36) which is communicated with the limiting groove (34) and used for extending out of the operating rod (35) is formed in one far away side of the two support plates (21), and the through groove (36) extends along the height direction of the connecting groove (29); and a cleaning mechanism used for cleaning the end surface of one side of the grinding pad (2) close to the bottom of the mounting groove (5) is arranged in the mounting groove (5).
2. The grinding apparatus for Mini LED chips as defined in claim 1, wherein: a water retaining disc (39) is horizontally arranged in the mounting groove (5), a through hole for an output shaft of the motor (6) to penetrate through is formed in the middle of the water retaining disc (39), and a rotary sealing ring is arranged between the output shaft of the motor (6) and the through hole; the cleaning mechanism comprises a spraying pipe (41) which is arranged on the upper end surface of the water retaining disc (39) and extends along the axial direction of the water retaining disc (39), a plurality of spray heads (42) facing the grinding pad (2) are arranged on the spraying pipe (41), and a drain pipe (40) is connected to the groove wall of one end, close to the water retaining disc (39), of the mounting groove (5).
3. The grinding apparatus for Mini LED chips as defined in claim 1, wherein: a sliding block (23) is arranged at one end, away from the operating rod (35), of the connecting rod (22), a sliding groove (24) for the sliding connection of the sliding block (23) is formed in one end, away from the supporting ring (17), of the supporting block (20), the elastic piece is a spring (25) installed in the sliding groove (24), one end of the spring (25) is abutted to the groove bottom of the sliding groove (24), and the other end of the spring (25) is abutted to the sliding block (23); and a limiting structure for preventing the sliding block (23) from being separated from the sliding groove (24) is further arranged in the supporting block (20).
4. The grinding apparatus for Mini LED chips as defined in claim 3, wherein: the limiting structure comprises a limiting ring (26) fixed at the notch of the sliding groove (24).
5. The grinding apparatus for Mini LED chips as defined in claim 1, wherein: the middle part circumference of support ring (17) inboard is provided with annular protruding edge (18), annular (16) that supply annular protruding edge (18) to rotate the connection are seted up to the periphery side of grinding pad (2).
6. The grinding apparatus for Mini LED chips as defined in claim 5, wherein: and resistance reducing balls (19) which are propped against the groove wall of the ring groove (16) are embedded at the two ends of the annular convex edge (18) in the axial direction.
7. The grinding apparatus for Mini LED chips as defined in claim 6, wherein: the thickness of the axis direction of the support ring (17) is greater than the thickness of the axis direction of the grinding pad (2), and a liquid storage tank is formed between the inner peripheral wall of the support ring (17) and the end face of the grinding pad (2).
8. The grinding apparatus for Mini LED chips as defined in claim 1, wherein: the grinding table is characterized in that a supporting frame (12) is arranged on the grinding table (1), an air cylinder (11) is vertically arranged at the upper end of the supporting frame (12), the end portion of a piston rod of the air cylinder (11) is rotatably connected with the middle of the grinding head (3), a reinforcing plate (13) is vertically connected to the outer peripheral side of the piston rod of the air cylinder (11), a bearing (14) is fixed to the outer peripheral side of the positioning rod (7), a positioning hole (15) matched with the bearing (14) is formed in one end, far away from the piston rod of the air cylinder (11), of the reinforcing plate (13), when the grinding head (3) presses a semiconductor substrate against the grinding pad (2), the hole wall of the positioning hole (15) is abutted to the outer ring of the bearing (14).
9. A process for manufacturing a Mini LED chip, comprising the equipment for manufacturing a Mini LED chip according to any one of claims 1 to 8, wherein: the method comprises the following steps:
the method comprises the following steps: preparing a support film with a sticky surface;
step two: manufacturing a substrate;
step three: thinning the substrate, and pressing the manufactured substrate on a grinding pad (2) through a grinding head (3) for grinding to obtain the substrate with the required thickness;
step four: transferring the substrate to a support film;
step five: and cutting to obtain single Mini LED chips, and thus finishing the manufacture of the Mini LED chips.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110760523.6A CN113601388B (en) | 2021-07-06 | 2021-07-06 | Grinding equipment and manufacturing process of Mini LED chip |
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| CN202110760523.6A CN113601388B (en) | 2021-07-06 | 2021-07-06 | Grinding equipment and manufacturing process of Mini LED chip |
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| CN113601388B CN113601388B (en) | 2022-07-12 |
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Cited By (1)
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| CN114734319A (en) * | 2022-03-20 | 2022-07-12 | 林小花 | Semiconductor material processing system and method |
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| CN113601388B (en) | 2022-07-12 |
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