CN113597099A - Control method for improving warping of laminated board with aluminum-based mixed-pressure structure and PCB - Google Patents
Control method for improving warping of laminated board with aluminum-based mixed-pressure structure and PCB Download PDFInfo
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- CN113597099A CN113597099A CN202110654386.8A CN202110654386A CN113597099A CN 113597099 A CN113597099 A CN 113597099A CN 202110654386 A CN202110654386 A CN 202110654386A CN 113597099 A CN113597099 A CN 113597099A
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 121
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 121
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000007731 hot pressing Methods 0.000 claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 claims abstract description 32
- 238000003825 pressing Methods 0.000 claims abstract description 32
- 239000002253 acid Substances 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000010931 gold Substances 0.000 claims abstract description 8
- 229910052737 gold Inorganic materials 0.000 claims abstract description 8
- 238000012360 testing method Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000008685 targeting Effects 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004576 sand Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims description 2
- 230000008602 contraction Effects 0.000 abstract description 3
- 238000007654 immersion Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 238000003475 lamination Methods 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Abstract
The invention discloses a control method for improving warping of a laminated board with an aluminum-based mixed-pressure structure, which comprises the steps of optimizing a laminated structure, wherein the thickness ratio of core board dielectric layers in an aluminum-based core board to an inner core board is more than or equal to 10: 1; manufacturing an inner-layer core board; manufacturing an aluminum-based part, namely pre-hot-pressing the aluminum base for 1 time after the aluminum base is cut; pressing, namely pressing the inner core plate and the aluminum base together by adopting a vacuum laminator; flattening the board, and flattening by using a board flattening machine after pressing; performing X-Ray target shooting; grinding the ceramic; manufacturing an outer layer circuit; acid etching; resistance welding; a character; gold immersion; E-T testing; CNC shape; inspecting a finished product; the aluminum base and inner core plates with preset thicknesses are selected, so that the whole PCB is lighter and thinner, the warpage of the PCB is reduced, and the high-pressure resistance requirement of the PCB can be met, the high-temperature press (200 ℃) is used for hot pressing for 1 time in advance, the thermal stability of the aluminum base is improved, the variation of expansion and contraction of the aluminum base hot pressing is reduced, and the requirement of a client on the high flatness of a product is met.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board), in particular to a control method for improving warping of a laminated board with an aluminum-based mixed-compression structure and a PCB.
Background
At present, an automobile power module product mainly takes a thick copper core plate pressing aluminum-based structure as a main part, and realizes quick heat conduction of the product according to supporting surface copper, hole copper, a high-heat-conduction bonding sheet and a metal aluminum base, and because the metal aluminum base and the copper core plate are two materials with different physical properties, when the product is pressed at high temperature, expansion and contraction changes are inconsistent, plate warping exceeds the standard (warping degree is more than or equal to 1.5 percent), the product flatness is influenced, and the product has potential influence on the subsequent patch quality of a client.
Disclosure of Invention
Therefore, there is a need for a method for improving warpage control of an al-based hybrid laminated board and a PCB.
A control method for improving the warping of a laminated board with an aluminum-based mixed-pressure structure comprises
S1, optimizing a laminated structure, selecting aluminum-based core plates and inner core plates with preset thicknesses and hardness, and enabling the thickness ratio of core plate dielectric layers in the aluminum-based core plates and the inner core plates to be more than or equal to 10: 1;
s2, manufacturing an inner-layer core board;
s3, manufacturing an aluminum-based component, and pre-hot-pressing the aluminum base for 1 time after the aluminum base is cut;
s4, pressing, namely pressing the inner core plate and the aluminum base plate together by using a vacuum laminator;
s5, flattening the board, flattening with a board flattening machine;
s6, X-Ray targeting;
s7, grinding the ceramic;
s8, manufacturing an outer layer circuit;
s9, acid etching;
s10, solder resist;
s11, characters;
s12, depositing gold;
s13, testing by E-T;
s14, CNC shape;
and S15, checking the finished product.
In one embodiment, the thickness of the core plate dielectric layer is less than or equal to 0.15 mm.
In one embodiment, the ratio of the thicknesses of the aluminum-based and core dielectric layers is 15: 1.
In one embodiment, the method for manufacturing the inner core board in S2 includes:
firstly, cutting an inner layer;
secondly, drilling holes;
thirdly, copper deposition;
step four, VCP copper;
fifthly, checking;
sixthly, plugging holes with resin;
step seven, grinding the ceramic;
eighth, pasting a dry film;
ninth, manufacturing an inner layer circuit;
tenth step, acid etching;
step ten, inner layer corrosion detection;
step ten, browning.
In one embodiment, the method for manufacturing the aluminum-based component comprises the following steps:
firstly, aluminum-based cutting;
secondly, aluminum base pre-hot pressing treatment;
thirdly, drilling a positioning hole;
fourthly, grinding by using a sand belt;
fifthly, chemical coarsening;
and sixthly, cleaning a finished product.
In one embodiment, the thickness of the core dielectric layer is 0.1 mm.
In one embodiment, the pre-hot pressing of the aluminum base includes a conventional hot pressing method and a rapid hot pressing method.
In one embodiment, the parameters of the conventional hot pressing method are: the temperature of the furnace is 140 ℃, the heating rate is 1.8-2.2 ℃/min, the pressure is 30 kg-40 kg/cm2, the temperature is kept at 200 ℃ and the pressing is more than or equal to 60 min.
In one embodiment, the parameters of the rapid hot pressing method are as follows: the temperature of the furnace is 160-200 ℃, the heating rate is 5-10 ℃/min, the pressure is 30 kg-40 kg/cm2, and the temperature is kept at 200 ℃ and pressed for 20 min.
The PCB obtained by the control method for improving the warping of the aluminum-based mixed-pressing structure laminated board comprises an aluminum-based core board and an inner-layer core board, wherein the aluminum-based core board and the inner-layer core board are pressed through prepregs, the inner-layer core board comprises a core board dielectric layer, and the thickness ratio of the aluminum-based core board dielectric layer to the core board dielectric layer is larger than or equal to 10: 1.
According to the control method for improving the warping of the aluminum-based mixed-pressure structure laminated board, the aluminum-based core board and the inner core board with preset thicknesses are selected, the thickness ratio of the core board dielectric layers in the aluminum-based core board and the inner core board is larger than or equal to 10:1, the whole PCB can be made lighter and thinner, the warping of the board can be reduced, the high-pressure resistance requirement of the PCB can be met, meanwhile, the aluminum-based with preset hardness can be selected to meet the pressing requirement, after the aluminum-based is cut, the aluminum-based is pre-hot-pressed for 1 time at the high temperature of 200 ℃, the thermal stress is released, the thermal stability of the aluminum-based is improved, and the variation of the expansion and shrinkage of the aluminum-based hot pressing is reduced; and finally, leveling by using a warping leveling machine, further improving the warping degree of the board surface, ensuring that the warping degree of the board surface of the PCB is less than or equal to 0.75 percent, and meeting the requirement of a client on high flatness of the product.
Drawings
FIG. 1 is a flow chart of a control method for improving the warpage of an aluminum-based mixed-pressing structural laminated board according to the present invention;
FIG. 2 is a flow chart of inner core board manufacturing for the control method for improving the warpage of the aluminum-based mixed-pressure structural laminated board according to the invention;
FIG. 3 is a flow chart of the aluminum-based component manufacturing process of the method for improving the control of the warpage of the aluminum-based mixed-pressing structural laminated plate according to the present invention;
fig. 4 is a schematic structural diagram of a PCB board of the method for improving control of warpage of an al-based hybrid laminated board according to the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In a PCB applied to an automotive power module, there is a high requirement on high voltage resistance of the PCB, so that it is required that the core dielectric layers 210 in the aluminum base 100 and the inner core 200 of the PCB are thicker and better, but in order to control warpage of the PCB, the core dielectric layers 210 are required to be thinner and better, so through a large number of researches and experiments, the thickness ratio of the core dielectric layers 210 in the aluminum base 100 and the inner core 200 is determined, which can meet the high voltage resistance requirement of the PCB and control warpage of the PCB within a standard range.
As shown in FIG. 1, a control method for improving the warping of a laminated plate with an aluminum-based mixed-pressing structure comprises the following steps
S1, optimizing a laminated structure, selecting an aluminum base 100 and an inner core plate 200 with preset thickness and hardness, and enabling the thickness ratio of the core plate dielectric layers 210 in the aluminum base 100 and the inner core plate 200 to be more than or equal to 10: 1;
s2, manufacturing an inner-layer core board;
s3, manufacturing an aluminum-based component, namely, pre-hot-pressing 100 aluminum bases for 1 time after the aluminum bases are cut;
s4, pressing, namely pressing the inner core plate 200 and the aluminum base 100 together by a vacuum laminator;
s5, flattening the board, flattening with a board flattening machine;
s6, X-Ray targeting;
s7, grinding the ceramic;
s8, manufacturing an outer layer circuit;
s9, acid etching;
s10, solder resist;
s11, characters;
s12, depositing gold;
s13, testing by E-T;
s14, CNC shape;
and S15, checking the finished product.
In one embodiment, the thickness of the core dielectric layer 210 is less than or equal to 0.15 mm.
In one embodiment, the ratio of the thicknesses of the aluminum-based 100 and core dielectric layer 210 is 15: 1.
As shown in fig. 2, in one embodiment, the method for manufacturing the inner core board 200 in S2 includes:
firstly, cutting an inner layer;
secondly, drilling, namely drilling the inner core board 200 according to the project MI file;
thirdly, depositing copper, and carrying out metallization treatment on the hole wall;
step four, VCP copper, adopting VCP equipment to electroplate and thicken surface copper and hole copper and meet the copper thickness control requirement of a customer;
fifthly, checking;
sixthly, plugging holes in the inner blind holes with resin, so that excessive loss of PP glue during lamination is prevented from affecting the lamination reliability of the thick copper;
step seven, grinding the ceramic;
eighth, pasting a dry film;
ninth, inner layer circuit manufacturing, namely pasting dry films on two sides of an inner layer core plate, and then transferring inner layer patterns according to engineering circuit files;
tenth step, acid etching;
step ten, inner layer etching, inner layer acid etching and removing the protective dry film to obtain a complete inner layer graph;
step ten, browning.
As shown in fig. 3, in one embodiment, the method for manufacturing the aluminum-based component includes:
firstly, aluminum-based cutting;
secondly, aluminum base pre-hot pressing treatment;
thirdly, drilling a positioning hole;
fourthly, grinding by using a sand belt;
fifthly, chemical coarsening;
and sixthly, cleaning a finished product.
In one embodiment, the core dielectric layer 210 has a thickness of 0.1 mm.
In one embodiment, the pre-hot pressing the aluminum base 100 includes a conventional hot pressing method and a rapid hot pressing method.
In one embodiment, the parameters of the conventional hot pressing method are: the temperature of the furnace is 140 ℃, the heating rate is 1.8-2.2 ℃/min, the pressure is 30-40kg/cm2, the temperature is kept at 200 ℃ and the pressing is more than or equal to 60 min.
In one embodiment, the parameters of the rapid hot pressing method are as follows: the temperature of the furnace is 160-200 ℃, the heating rate is 5-10 ℃/min, the pressure is 30-40kg/cm2, and the temperature is kept at 200 ℃ and pressed for 20 min.
As shown in fig. 4, the PCB obtained by the method for improving the control of the warpage of the aluminum-based composite laminated board comprises an aluminum base 100 and an inner core board 200, wherein the aluminum base 100 and the inner core board 200 are laminated by a prepreg, the inner core board 200 comprises a core board dielectric layer 210, and the thickness ratio of the aluminum base 100 to the core board dielectric layer 210 is greater than or equal to 10: 1.
Example 1: a control method for improving the warping of a laminated board with an aluminum-based mixed-pressure structure comprises
S1, optimizing a laminated structure, selecting an aluminum base 100 and an inner core plate 200 with preset thickness and hardness, and enabling the thickness ratio of the core plate dielectric layers 210 in the aluminum base 100 and the inner core plate 200 to be 10: 1;
s2, manufacturing an inner-layer core board;
s3, manufacturing an aluminum-based component, namely, after cutting an aluminum base 100, pre-hot-pressing the aluminum base 100 for 1 time by adopting a conventional hot-pressing method; the parameters of the conventional hot pressing method are: the temperature of the furnace is 140 ℃, the heating rate is 1.8-2.2 ℃/min, the pressure is 30 kg-40 kg/cm2, the temperature is kept at 200 ℃ and the pressing is more than or equal to 60 min.
S4, pressing, namely pressing the inner core plate 200 and the aluminum base 100 together by a vacuum laminator;
s5, flattening the board, flattening with a board flattening machine;
s6, X-Ray targeting;
s7, grinding the ceramic;
s8, manufacturing an outer layer circuit, namely manufacturing the outer layer circuit on the surface of the laminated PCB;
s9, acid etching, wherein the copper surface without the protection of the anti-corrosion layer on the PCB is etched by acid solution;
s10, solder resist, wherein the Printed Circuit Board (PCB) after being pressed is subjected to solder resist treatment by using ink;
s11, characters are filled in the laminated PCB;
s12, depositing gold, namely directly depositing gold on the copper sheet;
s13, testing by E-T, and testing the laminated PCB;
s14, CNC shape, putting the laminated PCB into a routing machine, and routing a finished product according to the designed shape size;
and S15, inspecting the finished product, and detecting the appearance of the PCB after lamination.
In this way, the control method for improving the warping of the aluminum-based mixed-compression structure laminated board selects the aluminum-based core board and the inner core board with preset thicknesses, the thickness ratio of the core board dielectric layers in the aluminum-based core board and the inner core board is 10:1, the whole PCB can be made thinner, the warping of the board can be reduced, the high-pressure resistance requirement of the PCB can be met, meanwhile, the aluminum-based with preset hardness can be selected to meet the laminating requirement, after the aluminum-based is cut, the aluminum-based is hot-pressed for 1 time by a high-temperature press (200 ℃), the thermal stress is released, the thermal stability of the aluminum-based is improved, and the variation of the hot-pressing shrinkage of the aluminum-based is reduced; and finally, leveling by using a warping leveling machine, further improving the warping degree of the board surface, ensuring that the warping degree of the board surface of the PCB is less than or equal to 0.75 percent, and meeting the requirement of a client on high flatness of the product.
Further, the aluminum base 100 uses a harder alloy aluminum material, such as 5052/6061.
Example 2: a control method for improving the warping of a laminated board with an aluminum-based mixed-pressure structure comprises
S1, optimizing a laminated structure, selecting an aluminum base 100 and an inner core plate 200 with preset thickness and hardness, and enabling the thickness ratio of the core plate dielectric layers 210 in the aluminum base 100 and the inner core plate 200 to be 15: 1;
s2, manufacturing an inner-layer core board;
s3, manufacturing an aluminum-based component, namely, pre-hot-pressing the aluminum-based 100 for 1 time by adopting a quick hot-pressing method after the aluminum-based 100 is cut; the parameters of the rapid hot pressing method are as follows: the temperature of the furnace is 160-200 ℃, the heating rate is 5-10 ℃/min, the pressure is 30 kg-40 kg/cm2, and the temperature is kept at 200 ℃ and pressed for 20 min.
S4, pressing, namely pressing the inner core plate 200 and the aluminum base 100 together by a vacuum laminator;
s5, flattening the board, flattening with a board flattening machine;
s6, X-Ray targeting;
s7, grinding the ceramic;
s8, manufacturing an outer layer circuit, namely manufacturing the outer layer circuit on the surface of the laminated PCB;
s9, acid etching, wherein the copper surface without the protection of the anti-corrosion layer on the PCB is etched by acid solution;
s10, solder resist, wherein the Printed Circuit Board (PCB) after being pressed is subjected to solder resist treatment by using ink;
s11, characters are filled in the laminated PCB;
s12, depositing gold, namely directly depositing gold on the copper sheet;
s13, testing by E-T, and testing the laminated PCB;
s14, CNC shape, putting the laminated PCB into a routing machine, and routing a finished product according to the designed shape size;
and S15, inspecting the finished product, and detecting the appearance of the PCB after lamination.
In this way, the control method for improving the warping of the aluminum-based mixed-compression structure laminated board selects the aluminum-based core board and the inner core board with preset thicknesses, the thickness ratio of the core board dielectric layers in the aluminum-based core board and the inner core board is 15:1, the whole PCB can be made thinner, the warping of the board can be reduced, the high-pressure resistance requirement of the PCB can be met, meanwhile, the aluminum-based with preset hardness can be selected to meet the laminating requirement, after the aluminum-based is cut, the aluminum-based is quickly hot-pressed for 1 time by a high-temperature press (200 ℃), the thermal stress is released, the thermal stability of the aluminum-based is improved, and the variation of the aluminum-based hot-pressing shrinkage is reduced; and finally, leveling by using a warping leveling machine, further improving the warping degree of the board surface, ensuring that the warping degree of the board surface of the PCB is less than or equal to 0.75 percent, and meeting the requirement of a client on high flatness of the product.
Further, after the aluminum base 100 is cut, the aluminum base 100 is subjected to hot pressing treatment in a rapid hot pressing mode, the hot pressing time is shortened, the production efficiency is guaranteed, meanwhile, the thermal stress of the plate is fully released, the thermal stability of the aluminum base 100 is improved, the secondary hot pressing expansion and contraction change of the aluminum base is reduced, the hot pressing time is shortened from conventional 3H to 1H, and the hot pressing efficiency is improved.
Further, the prepreg is a highly thermally conductive adhesive sheet.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A control method for improving warping of a laminated board with an aluminum-based mixed-pressure structure is characterized by comprising the following steps: comprises that
S1, optimizing a laminated structure, selecting aluminum-based core plates and inner core plates with preset thicknesses and hardness, and enabling the thickness ratio of core plate dielectric layers in the aluminum-based core plates and the inner core plates to be more than or equal to 10: 1;
s2, manufacturing an inner-layer core board;
s3, manufacturing an aluminum-based component, and pre-hot-pressing the aluminum base for 1 time after the aluminum base is cut;
s4, pressing, namely pressing the inner core plate and the aluminum base plate together by using a vacuum laminator;
s5, flattening the board, flattening with a board flattening machine;
s6, X-Ray targeting;
s7, grinding the ceramic;
s8, manufacturing an outer layer circuit;
s9, acid etching;
s10, solder resist;
s11, characters;
s12, depositing gold;
s13, testing by E-T;
s14, CNC shape;
and S15, checking the finished product.
2. The control method for improving the warpage of the aluminum-based mixed-pressing structural laminated plate as claimed in claim 1, wherein: the thickness of the core plate dielectric layer is less than or equal to 0.15 mm.
3. The control method for improving the warpage of the aluminum-based mixed-pressing structural laminated plate as claimed in claim 1, wherein: the thickness ratio of the aluminum-based core plate dielectric layer to the core plate dielectric layer is 15: 1.
4. The control method for improving the warpage of the aluminum-based mixed-pressing structural laminated plate as claimed in claim 1, wherein: the method for manufacturing the inner-layer core board in the S2 comprises the following steps:
firstly, cutting an inner layer;
secondly, drilling holes;
thirdly, copper deposition;
step four, VCP copper;
fifthly, checking;
sixthly, plugging holes with resin;
step seven, grinding the ceramic;
eighth, pasting a dry film;
ninth, manufacturing an inner layer circuit;
tenth step, acid etching;
step ten, inner layer corrosion detection;
step ten, browning.
5. The control method for improving the warpage of the aluminum-based mixed-pressing structural laminated plate as claimed in claim 1, wherein: the method for manufacturing the aluminum-based component comprises the following steps:
firstly, aluminum-based cutting;
secondly, aluminum base pre-hot pressing treatment;
thirdly, drilling a positioning hole;
fourthly, grinding by using a sand belt;
fifthly, chemical coarsening;
and sixthly, cleaning a finished product.
6. The control method for improving the warpage of the aluminum-based mixed-pressing structural laminated plate as claimed in claim 2, wherein: the thickness of the core plate dielectric layer is 0.1 mm.
7. The control method for improving the warpage of the aluminum-based mixed-pressing structural laminated plate as claimed in claim 1, wherein:
the pre-hot pressing of the aluminum base includes a conventional hot pressing method and a rapid hot pressing method.
8. The control method for improving the warpage of the aluminum-based mixed-pressing structural laminated plate as claimed in claim 7, wherein:
the parameters of the conventional hot pressing method are as follows: the temperature of the furnace is 140 ℃, the heating rate is 1.8-2.2 ℃/min,
the pressure is 30 kg-40 kg/cm2, the temperature is kept at 200 ℃ and the pressing is more than or equal to 60 min.
9. The control method for improving the warpage of the aluminum-based mixed-pressing structural laminated plate as claimed in claim 7, wherein: the parameters of the rapid hot pressing method are as follows: the temperature of the furnace is 160-200 ℃, the heating rate is 5-10 ℃/min, the pressure is 30 kg-40 kg/cm2, and the temperature is kept at 200 ℃ and pressed for 20 min.
10. The PCB obtained by the method for improving the warpage of the aluminum-based mixed-pressing structure laminated board according to any one of claims 1 to 9, is characterized in that: the PCB comprises an aluminum base and an inner core board, wherein the aluminum base and the inner core board are pressed through prepregs, the inner core board comprises a core board dielectric layer, and the thickness ratio of the aluminum base to the core board dielectric layer is larger than or equal to 10: 1.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115348737A (en) * | 2022-08-12 | 2022-11-15 | 江苏迪飞达电子有限公司 | Preparation method of double-sided thick copper-aluminum-based mixed pressing plate |
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| CN104254196A (en) * | 2014-09-19 | 2014-12-31 | 江西景旺精密电路有限公司 | Asymmetric copper thickness double-sided aluminum substrate and processing method thereof |
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| CN107484356A (en) * | 2017-08-01 | 2017-12-15 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of the sandwich aluminium base of thick copper |
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| CN104254196A (en) * | 2014-09-19 | 2014-12-31 | 江西景旺精密电路有限公司 | Asymmetric copper thickness double-sided aluminum substrate and processing method thereof |
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| CN106507595A (en) * | 2017-01-05 | 2017-03-15 | 深圳诚和电子实业有限公司 | There is the PCB warpage flatening method of separate lines and pad |
| CN106852031A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of mixed-compression board of three layers of HDI plates and aluminium base and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115348737A (en) * | 2022-08-12 | 2022-11-15 | 江苏迪飞达电子有限公司 | Preparation method of double-sided thick copper-aluminum-based mixed pressing plate |
| CN115348737B (en) * | 2022-08-12 | 2023-09-26 | 江苏迪飞达电子有限公司 | Preparation method of double-sided thick copper-aluminum-based mixed pressing plate |
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| CN113597099B (en) | 2022-05-03 |
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Denomination of invention: A control method for improving the warping of aluminum based hybrid laminated structures and PCB boards Effective date of registration: 20231113 Granted publication date: 20220503 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: HUIZHOU KING BROTHER CIRCUIT TECHNOLOGY Co.,Ltd. Registration number: Y2023980065305 |