CN113597086A - Transmission circuit board and manufacturing method thereof - Google Patents

Transmission circuit board and manufacturing method thereof Download PDF

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Publication number
CN113597086A
CN113597086A CN202010367841.1A CN202010367841A CN113597086A CN 113597086 A CN113597086 A CN 113597086A CN 202010367841 A CN202010367841 A CN 202010367841A CN 113597086 A CN113597086 A CN 113597086A
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layer
circuit
substrate
transmission
copper
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CN202010367841.1A
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Chinese (zh)
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CN113597086B (en
Inventor
沈芾云
韦文竹
何明展
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Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
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Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
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Priority to CN202010367841.1A priority Critical patent/CN113597086B/en
Priority to US17/036,563 priority patent/US11259405B2/en
Publication of CN113597086A publication Critical patent/CN113597086A/en
Priority to US17/573,847 priority patent/US11765818B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A transmission circuit board is divided into a bending area, a first transmission area and a second transmission area; further comprising: a flexible substrate layer; the inner layer circuit layer is formed on the base material layer and comprises a signal circuit and a grounding circuit; a first cover film layer formed on the signal line of the bending region; first and second dielectric layers formed on the inner layer circuit layer and the base material layer of the first and second transmission regions; first and second outer circuit layers formed on the first and second dielectric layers, the first and second outer circuit layers being electrically connected to the ground circuit, respectively; second and third cover film layers formed on the first and second outer circuit layers; a first shielding layer formed on the second and first cover film layers; the first shielding layer is electrically connected with the first outer layer circuit layer; and a second shielding layer formed on the third covering film layer and the substrate layer located in the bending region. The invention also relates to a manufacturing method of the transmission circuit board. The transmission line board provided by the invention has good dynamic bending capability and long service life.

Description

Transmission circuit board and manufacturing method thereof
Technical Field
The invention relates to the field of circuit boards, in particular to a transmission circuit board and a manufacturing method thereof.
Background
With the development of wearable electronics, the circuit board requires higher flexibility to meet the demands of activities of various parts of the body. Meanwhile, the coming of the 5G era makes the requirements of the industry on the frequency and efficiency of wireless transmission higher, and how to meet the dual requirements of deflection and high-speed transmission becomes a hot door for the research and development of circuit boards.
The existing transmission line adopts a strip line design, a signal line of the transmission line runs through a middle layer, two sides of the signal line are grounding layers, and blind holes or through holes are designed at two ends of the transmission line to guide the signal line to an outer layer to form a signal terminal. The thicker the thickness of the transmission line is, the less the signal of the signal line is lost in high-frequency transmission. However, with the increase of the thickness, the transmission line no longer has the ability of dynamic bending, and is difficult to be applied to wearing products which need dynamic bending and have life requirements.
Disclosure of Invention
In view of the above, the present invention provides a transmission line with good dynamic bending capability and long service life.
In addition, it is necessary to provide a method for manufacturing the transmission line.
A transmission circuit board is divided into a bending area, a first transmission area and a second transmission area, wherein the first transmission area and the second transmission area are positioned on two sides of the bending area; the transmission line board includes: the substrate layer is flexible; the inner layer circuit layer is formed on one surface of the substrate layer and comprises at least one signal circuit and at least two grounding circuits formed on two sides of the inner layer circuit layer; a first cover film layer formed on the signal line in the bending region; a first dielectric layer and a second dielectric layer respectively formed on the inner layer circuit layer and the base material layer in the first transmission region and the second transmission region; at least two third conductive columns are formed in the first dielectric layer, and the third conductive columns are made of copper paste or metal conductive paste containing at least two of copper, tin, silver and bismuth; a first outer layer circuit layer and a second outer layer circuit layer respectively formed on the first dielectric layer and the second dielectric layer, the first outer layer circuit layer and the second outer layer circuit layer being electrically connected to the ground circuit, respectively; a second covering film layer and a third covering film layer respectively formed on the first outer layer circuit layer and the second outer layer circuit layer; a first shielding layer formed on the second covering film layer and the first covering film layer; the first shielding layer is electrically connected with the first outer layer circuit layer; and the second shielding layer is formed on the third covering film layer and the substrate layer positioned in the bending area, and the second shielding layer is electrically connected with the second outer layer circuit layer.
Further, the structure of the first shielding layer is the same as that of the second shielding layer; the first shielding layer comprises two end parts which are formed on the second covering film layer and are electrically connected with the first outer layer circuit layer, a bottom part which is formed on the first covering film layer and two connecting parts which are used for connecting the two end parts and the bottom part.
Further, at a position of a difference between the second cover film layer and the first cover film layer, a part of the first dielectric layer flows onto the first cover film layer to form a first overflow part, and the first overflow part is filled in a first space formed by the first cover film layer and the first dielectric layer; and part of the adhesive layer of the second covering film layer flows to the first covering film layer to form two first adhesive overflowing parts, two connecting parts of the first shielding layer are attached to the first adhesive overflowing parts, and the first adhesive overflowing parts are attached to the first overflowing parts.
Furthermore, at the offset between the third cover film layer and the substrate layer located in the bending region, a part of the second dielectric layer flows onto the substrate layer to form a second overflow part, and the second overflow part is filled in a second space formed by the substrate layer and the second dielectric layer; part of the glue layer of the third covering film layer flows to the base material layer to form two second glue overflowing parts; the connecting part of the second shielding layer is attached to the second glue overflowing part, and the second glue overflowing part is attached to the second glue overflowing part.
Furthermore, the transmission circuit board further comprises at least two copper columns embedded in the base material, and the copper columns are located in the first transmission area and the second transmission area; the at least two grounding circuits are respectively and electrically connected with one ends of the at least two copper columns; at least two first conductive columns are formed in the first dielectric layer, one end of one first conductive column is electrically connected with the first outer layer circuit layer, and the other end of the one first conductive column is electrically connected with one grounding circuit; at least two second conductive columns are formed in the second dielectric layer, one end of each second conductive column is connected with the second outer-layer conductive circuit layer, and the other end of each second conductive column is electrically connected with one copper column; the first conductive column and the second conductive column are made of copper paste or metal conductive paste containing at least two of copper, tin, silver and bismuth.
Furthermore, the first outer circuit layer further includes at least two signal terminals, and two ends of each signal circuit are electrically connected to the two signal terminals through one third conductive pillar.
A method for manufacturing the transmission line board includes: providing an inner layer circuit substrate, wherein the inner layer circuit substrate is divided into a bending area, a first transmission area and a second transmission area which are positioned on two sides of the bending area; the inner-layer circuit substrate comprises a flexible substrate layer and an inner-layer circuit layer formed on the substrate layer, and the inner-layer circuit layer comprises at least one signal circuit and grounding circuits positioned on two opposite sides of the signal circuit; pressing a first cover film layer on the signal circuit in the bending area; pressing a first outer layer circuit substrate and a second outer layer circuit substrate on two sides of the inner layer circuit substrate respectively; the first outer layer circuit substrate comprises a first dielectric layer formed on the inner layer circuit layer positioned in the first transmission area and the second transmission area and a first outer layer circuit layer formed on the first dielectric layer; the second outer layer circuit substrate comprises a second outer layer circuit layer formed on the base material layer in the first transmission area and the second transmission area; the first outer layer circuit layer and the second outer layer circuit layer are electrically connected with the grounding circuit respectively; laminating a second covering film layer and a third covering film layer on the first outer layer circuit layer and the second outer layer circuit layer respectively; and forming a first shielding layer on the second covering film layer and the first covering film layer, and attaching a second shielding layer on the third covering film layer and the base material layer.
Further, the structure of the first shielding layer is the same as that of the second shielding layer; the first shielding layer comprises two end parts which are formed on the second covering film layer and are electrically connected with the first outer layer circuit layer, a bottom part which is formed on the first covering film layer and two connecting parts which are used for connecting the two end parts and the bottom part; at the offset of the second covering film layer and the first covering film layer, part of the first dielectric layer flows onto the first covering film layer to form a first overflow part, and the first overflow part is filled in a first space formed by the first covering film layer and the first dielectric layer; and part of the adhesive layer of the second covering film layer flows to the first covering film layer to form two first adhesive overflowing parts, two connecting parts of the first shielding layer are attached to the first adhesive overflowing parts, and the first adhesive overflowing parts are attached to the first overflowing parts.
Further, the method for manufacturing the inner-layer circuit substrate comprises the following steps: providing a double-sided copper-clad substrate, wherein the double-sided copper-clad substrate comprises a substrate layer, a first copper foil layer and a second copper foil layer, and the first copper foil layer and the second copper foil layer are formed on two opposite surfaces of the substrate layer; the second copper foil layer is sunken towards the first copper foil layer to form at least two first blind holes penetrating through the second copper foil layer and the substrate layer, and the at least two first blind holes are positioned in the first transmission area and the second transmission area; forming at least two copper columns in the at least two first blind holes respectively through selective electroplating; manufacturing the first copper foil layer to form an inner circuit layer and etching the second copper foil layer to expose the substrate layer; the copper column is opposite to the grounding circuit; the copper column protrudes out of the base material layer or is flush with the base material layer.
Further, the method for manufacturing the first outer layer circuit substrate includes: providing a single-sided copper-clad substrate, wherein the single-sided copper-clad substrate comprises a first dielectric layer and a third copper foil layer formed on the first dielectric layer; d of the first dielectric layerfValue less than D of the substrate layerfA value; manufacturing the third copper foil layer to form a first outer layer circuit layer, wherein the first outer layer circuit layer comprises at least two signal terminals and at least one outer layer circuit, and the outer layer circuit comprises at least two grounding terminals; forming at least two second blind holes and at least two fourth blind holes penetrating through the first dielectric layer on the first dielectric layer respectively, wherein one second blind hole is opposite to one grounding terminal, and one fourth blind hole is opposite to one signal terminal; filling a copper paste or a metal conductive paste containing at least two of copper, tin, silver and bismuth into the second blind hole and the fourth blind hole to form a first conductive column and a third conductive column respectively; and forming a through groove penetrating through the first dielectric layer and the first outer layer circuit layer by recessing the first dielectric layer to the first outer layer circuit layer, wherein the through groove is positioned in the bending area, and the edge of the through groove corresponds to the boundary between the first transmission area and the bending area and between the bending area and the second transmission area.
The invention provides a transmission circuit board and a manufacturing method thereof, wherein 1) a flexible material is adopted as a substrate layer, a bending area is arranged between a first transmission area and a second transmission area, a first outer layer circuit area and a second outer layer circuit area are formed on an inner layer circuit layer and the substrate layer which are positioned in the first transmission area and the second transmission area in an increasing mode, and the bending area of the transmission circuit board only comprises a first covering film layer, an inner layer circuit layer and the substrate layer, so that the transmission circuit board has good dynamic bending capability, and the service life of the transmission circuit board is further prolonged. 2) First and second shielding layers electrically connected with the first and second outer layer circuit layers are formed on the first and second outer layer circuit layers respectively, and the first and second shielding layers are formed on the first covering film layer and the base material layer in the bending area respectively, so that the first and second shielding layers are grounded while playing a role in shielding, thereby avoiding signal backflow and improving shielding effect.
Drawings
Fig. 1 is a cross-sectional view of a double-sided copper-clad substrate according to a first embodiment of the present invention.
Fig. 2 is a cross-sectional view of the double-sided copper-clad substrate shown in fig. 1 after at least two first blind holes are formed therein.
Fig. 3 is a cross-sectional view after forming a copper pillar within the first blind via shown in fig. 2.
Fig. 4 is a cross-sectional view of the first copper foil layer shown in fig. 3 after an inner circuit layer is formed and the second copper foil layer is etched to form an inner circuit substrate.
Fig. 5 is a cross-sectional view of the inner layer circuit substrate in the bending region shown in fig. 4 after a first cover film layer is formed thereon.
Fig. 6 is a cross-sectional view of the inner-layer circuit substrate positioned in the first transmission area and the second transmission area shown in fig. 5 after the first outer-layer circuit substrate and the second outer-layer circuit substrate are respectively pressed on the inner-layer circuit substrate.
Fig. 7 is a cross-sectional view of a single-sided copper-clad substrate for producing the first outer-layer wiring board shown in fig. 5 according to the present invention.
Fig. 8 is a cross-sectional view of the third copper foil layer shown in fig. 7 after a first outer circuit layer is formed.
Fig. 9 is a cross-sectional view of the first dielectric layer shown in fig. 8 after at least two second blind vias and at least two third blind vias are formed.
Fig. 10 is a cross-sectional view after forming the first conductive pillar and the third conductive pillar in the second blind hole and the fourth blind hole, respectively, and forming a through groove penetrating through the first dielectric layer and the first outer circuit layer.
Fig. 11 is a cross-sectional view of the first and second outer circuit substrates shown in fig. 6 laminated with a second and third cover film, respectively.
Fig. 12 is a cross-sectional view of the transmission line board formed by forming the first and second shielding layers on the second and third cover film layers shown in fig. 10.
Description of the main elements
Figure BDA0002477119020000061
Figure BDA0002477119020000071
Figure BDA0002477119020000081
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
In order to further explain the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be made on the specific implementation, structure, features and effects of the transmission circuit board and the manufacturing method thereof provided by the present invention with reference to the accompanying drawings 1-12 and the preferred implementation. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-12, the present invention provides a method for manufacturing a transmission line board 100, comprising the steps of:
in step S1, referring to fig. 1-4, an inner circuit substrate 110 is provided.
The inner circuit substrate 110 is divided into a bending region 101, and a first transmission region 102 and a second transmission region 103 located at two sides of the bending region 101. The lengths of the first transmission region 102 and the second transmission region 103 are greater than the length of the bending region 101.
The inner circuit board 110 includes a flexible substrate layer 11 and an inner circuit layer 16 formed on the substrate layer 11. The inner wiring layer 16 includes at least one signal wiring 161 and at least two ground wirings 162 located on opposite sides of the signal wiring 161. The ground line 162 is electrically insulated from the signal line 161. In this embodiment, the signal line 161 is located in the bending region 101, the first transmission region 102 and the second transmission region 103, and the ground line 162 is located in the first transmission region 102 and the second transmission region 103. At least two first blind holes 14 corresponding to the grounding circuit 162 are formed in the substrate layer 11, and copper columns 15 are formed in the first blind holes 14. One end of the copper column 15 is electrically contacted with the grounding circuit 162, and the other end of the copper column is flush with or protrudes out of the surface of the substrate layer 11 far away from the inner layer circuit layer 16, and the surface of the substrate layer 11 far away from the inner layer circuit layer 16.
The material of the substrate layer 11 is one of Polyimide (PI), Modified Polyimide (MPI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), Polyethylene (PE), Teflon (Teflon), liquid crystal polymer (liquid crystal polymer, LCP), polyvinyl chloride (PVC), ABF (Ajinomoto Build-up Film), and the like. Preferably, the material of the substrate layer 11 is PI or MPI.
Specifically, the method for manufacturing the inner circuit substrate 110 includes:
first, referring to fig. 1, a double-sided copper-clad substrate 10 is provided. Specifically, the double-sided copper-clad substrate 10 includes a substrate layer 11 having flexibility, a first copper foil layer 12, and a second copper foil layer 13. The substrate layer 11 includes a first surface 111 and a second surface 112 opposite to the first surface 111, the first copper foil layer is formed on the first surface 111, and the second copper foil layer 13 is formed on the second surface 112.
Next, referring to fig. 2, at least two first blind holes 14 penetrating through the second copper foil layer 13 and the substrate layer 11 are formed by recessing the second copper foil layer 13 to the first copper foil layer 12, and the at least two first blind holes 14 are located in the first transmission region 102 and the second transmission region 103.
Referring to fig. 3, at least two copper pillars 15 are formed in at least two of the first blind vias 14, respectively, by selective plating; and
the first copper foil layer 12 is manufactured to form an inner circuit layer 16, and the second copper foil layer 13 is etched away, so that the substrate layer 11 is exposed. The copper pillar 15 is electrically contacted with the grounding circuit 162 and protrudes from the second surface 112 of the substrate layer 11 or is flush with the second surface 112 of the substrate layer 11. In this embodiment, the second surface 112 of the copper pillar 15, which is away from the inner layer circuit layer 16, is flush.
The inner circuit layer 16 is formed by fabricating the first copper foil layer 12 through an image transfer process.
In step S2, referring to fig. 5, a first cover film 21 is laminated on the inner circuit layer 16 of the inner circuit substrate 110 in the bending region 101 to overcome the fracture of the cover film caused by the step difference in the bending region 101.
In step S3, please refer to fig. 6, a first outer layer circuit substrate 310 and a second outer layer circuit substrate 320 are respectively laminated on the opposite surfaces of the inner layer circuit substrate 110 in the first transmission region 102 and the second transmission region 103.
The first outer circuit substrate 310 includes a first dielectric layer 31 and a first outer circuit layer 33 formed on the first dielectric layer 31. The first dielectric layer 31 is formed on the inner wiring layer 16 within the first transfer region 102 and the second transfer region 103.
The first outer layer circuit layer 33 includes at least two signal terminals 331 and at least one first outer layer circuit 332, and the first outer layer circuit 332 includes at least one ground terminal 3321. The signal terminal 331 is electrically insulated from the ground terminal 3321. The signal terminal 331 can be used for component mounting, connection with other circuit boards or antennas, and the like. The ground terminal 3321 may be used for grounding.
During the pressing process, the first dielectric layer 31 partially flows onto the first cover film 21 in the bending region 101, so as to form a first overflow portion 311 at the difference between the first dielectric layer 31 and the first cover film 21. In the present embodiment, the first overflow part 311 has a right triangle shape.
At least two second blind holes 312 and at least two fourth blind holes 313 are formed in the first dielectric layer 31, one fourth blind hole 313 is opposite to one signal terminal 321, and one second blind hole 313 is opposite to one ground terminal 3211. At least two first conductive pillars 314 and at least two third conductive pillars 315 are respectively formed in at least two of the second blind holes 312 and at least two of the fourth blind holes 313. The ground line 162 is electrically connected to the ground terminal 3321 through the first conductive pillar 314. Each of the signal lines 161 is electrically connected to the signal terminal 331 through two of the third conductive pillars 315.
The first conductive pillar 314 and the third conductive pillar 315 are made of copper paste or metal conductive paste containing at least two of copper, tin, silver, and bismuth.
The second outer-layer wiring substrate 320 includes a second dielectric layer 34 formed on the base material layer 11 in the first transmission region 102 and the second transmission region 103, and a second outer-layer wiring layer 35 formed on the second dielectric layer 34.
During the lamination process, the second dielectric layer 34 partially flows onto the substrate layer 11 located in the bending region 101, so as to form a second overflow portion 341 at the difference between the second dielectric layer 34 and the substrate layer 11. In the present embodiment, the second overflow portion 341 has a right triangle shape.
At least two fourth blind holes 342 are formed in the second dielectric layer 34, and the positions of the fourth blind holes 342 are opposite to the positions of the first blind holes 14. The fourth blind hole 342 is filled with a second conductive pillar 343, and one end of the second conductive pillar 343 is electrically contacted with the copper pillar 15.
The first dielectric layer 31 and the second dielectric layer 34 are made of at least one of Liquid Crystal Polymer (LCP), Polytetrafluoroethylene (PTFE), Modified Polyimide (MPI), and other thermoplastic materials.
D of the first dielectric layer 31 and the second dielectric layer 34fD value less than the base material layer 11fThe value is obtained.
Specifically, referring to fig. 7-10, the method for manufacturing the first outer layer circuit substrate 310 includes:
first, referring to fig. 7, a single-sided copper-clad substrate 30 is provided. The single-sided copper-clad substrate 30 includes a first dielectric layer 31 and a third copper foil layer 32 formed on the first dielectric layer 31.
Next, referring to fig. 8, the third copper foil layer 32 is fabricated to form a first outer circuit layer 33.
Referring to fig. 9, at least two second blind vias 312 and at least two fourth blind vias 313 penetrating through the first dielectric layer 31 are formed on the first dielectric layer 31, one second blind via 312 is opposite to one ground terminal 3321, and one fourth blind via 313 is opposite to one signal terminal 331.
Then, referring to fig. 10, a copper paste or a metal conductive paste containing at least two of copper, tin, silver, and bismuth is filled in the second blind via 312 and the fourth blind via 313 to form a first conductive pillar 314 and a third conductive pillar 315 respectively, and the first dielectric layer 31 is recessed toward the first outer circuit layer 33 to form a through groove 316 penetrating the first dielectric layer 31 and the first outer circuit layer 33, wherein the through groove 316 is located in the bending region 101, and an edge of the through groove 316 corresponds to boundaries between the first transmission region 102 and the bending region 101 and between the bending region 101 and the second transmission region 103.
In step S4, referring to fig. 11, a second cover film 41 is laminated on the first outer circuit layer 33, and a third cover film 42 is laminated on the second outer circuit layer 35.
In the present embodiment, the second cover film layer 41 and the third cover film layer 42 each protrude to a length of 0.1 to 0.4 μm from a step formed between the first cover film layer 21 and the base material layer 11 located in the bending region 101.
In the process of pressing, the glue layer of the second cover film layer 41 will flow onto the first cover film layer 21, so that two first glue overflow portions 414 formed by glue layer overflow are formed at the difference between the second cover film layer 41 and the first cover film layer 21. The first glue overflow portion 414 is attached to the first overflow portion 311 and the first cover film layer 21. The adhesive layer of the third cover film layer 42 flows to the substrate layer 11 in the bending region 101, so that two second adhesive overflow portions 421 formed by the adhesive layer overflowing are formed at the offset between the third cover film layer 42 and the substrate layer 11 in the bending region 101. The second overflow part 421 is attached to the second overflow part 341 and the substrate layer 11.
At least two first openings 411, at least one third opening 412 and at least one fourth opening 413 are formed on the second covering film 41. One of the at least two first openings 411 and the third opening 412 are located in the first transmission region 102, and the other of the at least two first openings 411 and the fourth opening 413 are located in the second transmission region 103. At least two of the signal terminals 331 and at least two of the ground terminals 3321 are exposed from at least two of the first openings 411, respectively. A portion of the first outer layer wire 332 is exposed from the third opening 412 and the fourth opening 413, respectively.
At least one fifth opening 422 and at least one sixth opening 423 are formed on the third cover film 42, wherein the fifth opening 422 is located in the first transmission region 102, and the sixth opening 423 is located in the second transmission region 103.
In step S5, referring to fig. 11, a solder mask layer 51 is formed on the ground terminal 3321, and a nickel layer 52 is formed on the signal terminal 331, the first outer layer circuit 332 exposed from the third opening 412 and the fourth opening 413, and the second outer layer circuit layer 35 exposed from the fifth opening 422 and the sixth opening 423.
Step S6, please refer to fig. 12, a first shielding layer 60 is formed on the second cover film layer 41 and the first cover film layer 21, and a second shielding layer 70 is formed on the third cover film layer 42 and the substrate layer 11 located in the bending region 101, the first shielding layer 60 is electrically connected to the first outer layer circuit 332, and the second shielding layer 70 is electrically connected to the second outer layer circuit layer 35, so as to obtain the transmission line board 100.
The first shielding layer 60 includes two end portions 61, a bottom portion 62, and two connecting portions 63 respectively connecting the two end portions 61 and the bottom portion 62. The two end portions 61 are formed on the second cover film layer 41 and electrically connected to the first outer layer lines 332, respectively, the bottom portion 62 is formed on the first cover film layer 21, and the connecting portion 63 is attached to the first glue overflow portion 414.
Wherein the structure of the second shielding layer 70 is the same as that of the first shielding layer 60. The connection portion of the second shielding layer 70 is attached to the second glue overflow portion 421.
Specifically, both end portions 61 of the first shielding layer 60 are electrically connected to the first outer layer wiring 332 exposed from the third opening 412 and the fourth opening 413, respectively, and both end portions of the second shielding layer 70 are electrically connected to the second outer layer wiring 35 exposed from the fifth opening 422 and the sixth opening 423, respectively.
Referring to fig. 12, the present invention further provides a transmission line board 100, wherein the transmission line board 100 is divided into a bending region 101, and a first transmission region 102 and a second transmission region 103 located at two sides of the bending region 101. The transmission line board 100 includes an inner-layer circuit substrate 110, a first cover film layer 21 formed on the inner-layer circuit substrate 110 in the bending region 101, a first outer-layer circuit substrate 310 and a second outer-layer circuit substrate 320 respectively formed on opposite surfaces of the inner-layer circuit substrate 110, a second cover film layer 41 and a third cover film layer 42 respectively formed on the first outer-layer circuit substrate 310 and the second outer-layer circuit substrate 320, a first shielding layer 60 formed on the first cover film layer 21 and the second cover film layer 41, and a second shielding layer 70 formed on the third cover film layer 42 and the substrate layer 11 in the bending region 101. The first shielding layer 60 and the second shielding layer 70 are electrically connected to the first outer layer circuit board 310 and the second outer layer circuit board 320, respectively.
The inner circuit board 110 includes a flexible substrate layer 11 and an inner circuit layer 16 formed on the substrate layer 11. The inner wiring layer 16 includes at least one signal wiring 161 and at least two ground wirings 162 located on opposite sides of the signal wiring 161. The ground line 162 is electrically insulated from the signal line 161. In this embodiment, the signal line 161 is located in the bending region 101, the first transmission region 102 and the second transmission region 103, and the ground line 162 is located in the first transmission region 102 and the second transmission region 103. At least two first blind holes 14 corresponding to the grounding circuit 162 are formed in the substrate layer 11. copper columns 15 are formed in the first blind holes 14. One end of the copper column 15 is electrically contacted with the grounding circuit 162, and the other end of the copper column is flush with or protrudes out of the surface of the substrate layer 11 far away from the inner layer circuit layer 16, and the surface of the substrate layer 11 far away from the inner layer circuit layer 16.
Wherein the first cover film layer 21 is formed on the signal line 161 in the bending region 101.
The first outer circuit substrate 310 includes a first dielectric layer 31 and a first outer circuit layer 33 formed on the first dielectric layer 31. The first dielectric layer 31 is formed on the inner wiring layer 16 within the first transfer region 102 and the second transfer region 103.
The first outer layer circuit layer 33 includes at least two signal terminals 331 and at least one first outer layer circuit 332, and the first outer layer circuit 332 includes at least one ground terminal 3321. The signal terminal 331 is electrically insulated from the ground terminal 3321. The signal terminal 331 can be used for component mounting, connection with other circuit boards or antennas, and the like. The ground terminal 3321 may be used for grounding.
During the pressing process, the first dielectric layer 31 partially flows onto the first cover film 21 in the bending region 101, so as to form a first overflow portion 311 at the difference between the first dielectric layer 31 and the first cover film 21. In the present embodiment, the first overflow part 311 has a right triangle shape.
At least two second blind holes 312 and at least two fourth blind holes 313 are formed in the first dielectric layer 31, one fourth blind hole 313 is opposite to one signal terminal 321, and one second blind hole 313 is opposite to one ground terminal 3211. At least two first conductive pillars 314 and at least two third conductive pillars 315 are respectively formed in at least two of the second blind holes 312 and at least two of the fourth blind holes 313. The ground line 162 is electrically connected to the ground terminal 3321 through the first conductive pillar 314. Each of the signal lines 161 is electrically connected to the signal terminal 331 through two of the third conductive pillars 315.
The first conductive pillar 314 and the third conductive pillar 315 are made of copper paste or metal conductive paste containing at least two of copper, tin, silver, and bismuth.
The second outer-layer wiring substrate 320 includes a second dielectric layer 34 formed on the base material layer 11 in the first transmission region 102 and the second transmission region 103, and a second outer-layer wiring layer 35 formed on the second dielectric layer 34.
During the lamination process, the second dielectric layer 34 partially flows onto the substrate layer 11 located in the bending region 101, so as to form a second overflow portion 341 at the difference between the second dielectric layer 34 and the substrate layer 11. In the present embodiment, the second overflow portion 341 has a right triangle shape.
At least two fourth blind holes 342 are formed in the second dielectric layer 34, and the positions of the fourth blind holes 342 are opposite to the positions of the first blind holes 14. The fourth blind hole 342 is filled with a second conductive pillar 343, and one end of the second conductive pillar 343 is electrically contacted with the copper pillar 15.
The first dielectric layer 31 and the second dielectric layer 34 are made of at least one of Liquid Crystal Polymer (LCP), Polytetrafluoroethylene (PTFE), Modified Polyimide (MPI), and other thermoplastic materials.
D of the first dielectric layer 31 and the second dielectric layer 34fD value less than the base material layer 11fThe value is obtained.
The second cover film layer 41 is formed on the first outer wiring layer 33, and the third cover film layer 42 is formed on the second outer wiring layer 35.
In the present embodiment, the second cover film layer 41 and the third cover film layer 42 each protrude to a length of 0.1 to 0.4 μm from a step formed between the first cover film layer 21 and the base material layer 11 located in the bending region 101.
In the process of pressing, the glue layer of the second cover film layer 41 will flow onto the first cover film layer 21, so that two first glue overflow portions 414 formed by glue layer overflow are formed at the difference between the second cover film layer 41 and the first cover film layer 21. The first glue overflow portion 414 is attached to the first overflow portion 311 and the first cover film layer 21. The adhesive layer of the third cover film layer 42 flows to the substrate layer 11 in the bending region 101, so that two second adhesive overflow portions 421 formed by the adhesive layer overflowing are formed at the offset between the third cover film layer 42 and the substrate layer 11 in the bending region 101. The second overflow part 421 is attached to the second overflow part 341 and the substrate layer 11. The first overflow part 311 and the first glue overflow part 414 are matched to solve the problem of poor filling of the first shielding layer caused by a high offset, so as to solve the problem of fracture of the first shielding layer. The second overflow portion 341 and the second glue overflow portion 421 cooperate to solve the problem of poor filling of the second shielding layer due to the height difference, thereby solving the problem of fracture of the second shielding layer.
At least two first openings 411, at least one third opening 412 and at least one fourth opening 413 are formed on the second covering film 41. One of the at least two first openings 411 and the third opening 412 are located in the first transmission region 102, and the other of the at least two first openings 411 and the fourth opening 413 are located in the second transmission region 103. At least two of the signal terminals 331 and at least two of the ground terminals 3321 are exposed from at least two of the first openings 411, respectively. A portion of the first outer layer wire 332 is exposed from the third opening 412 and the fourth opening 413, respectively.
At least one fifth opening 422 and at least one sixth opening 423 are formed on the third cover film 42, wherein the fifth opening 422 is located in the first transmission region 102, and the sixth opening 423 is located in the second transmission region 103.
A solder mask layer 51 is further formed on the ground terminal 3321, and a nickel layer 52 is further formed on the signal terminal 331, the first outer layer wire 332 exposed from the third opening 412 and the fourth opening 413, and the second outer layer wire layer 35 exposed from the fifth opening 422 and the sixth opening 423.
The first shielding layer 60 includes two end portions 61, a bottom portion 62, and two connecting portions 63 respectively connecting the two end portions 61 and the bottom portion 62. The two end portions 61 are formed on the second cover film layer 41 and electrically connected to the first outer layer lines 332, respectively, the bottom portion 62 is formed on the first cover film layer 21, and the connecting portion 63 is attached to the first glue overflow portion 414.
The first shielding layer 60 includes a conductive layer (not shown), and in this embodiment, the thickness of the conductive layer is controlled to be 0.1 to 0.5 mm.
Wherein the structure of the second shielding layer 70 is the same as that of the first shielding layer 60. The connection portion of the second shielding layer 70 is attached to the second glue overflow portion 421. The second shielding layer 70 is directly attached to the substrate layer 11 in the bending region 101, but is not attached to a covering film layer attached to the substrate layer 11 in the bending region 101, so that the thickness of the bending region 101 can be reduced, and bending is facilitated.
Specifically, both end portions 61 of the first shielding layer 60 are electrically connected to the first outer layer wiring 332 exposed from the third opening 412 and the fourth opening 413, respectively, and both end portions of the second shielding layer 70 are electrically connected to the second outer layer wiring 35 exposed from the fifth opening 422 and the sixth opening 423, respectively.
The invention provides a transmission circuit board and a manufacturing method thereof, wherein 1) a flexible material is adopted as a substrate layer, a bending area is arranged between a first transmission area and a second transmission area, a first outer layer circuit area and a second outer layer circuit area are formed on an inner layer circuit layer and the substrate layer which are positioned in the first transmission area and the second transmission area in an increasing mode, and the bending area of the transmission circuit board only comprises a first covering film layer, an inner layer circuit layer and the substrate layer, so that the transmission circuit board has good dynamic bending capability, and the service life of the transmission circuit board is further prolonged. 2) First and second shielding layers electrically connected with the first and second outer layer circuit layers are formed on the first and second outer layer circuit layers respectively, and the first and second shielding layers are formed on the first covering film layer and the base material layer in the bending area respectively, so that the first and second shielding layers are grounded while playing a role in shielding, thereby avoiding signal backflow and improving shielding effect. 3) The embedded copper columns (conductive materials) in the substrate layer in the first and second transmission regions can resist bending. 4) The first and second shielding layers are respectively attached to the first and second glue overflowing portions formed by the glue layers of the second and third covering film layers, so that the problem of poor filling of the first and second shielding layers caused by a height-to-height difference can be solved, and the problem of breakage of the first and second shielding layers is solved.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A transmission circuit board is characterized in that the transmission circuit board is divided into a bending area, a first transmission area and a second transmission area, wherein the first transmission area and the second transmission area are positioned on two sides of the bending area; the transmission line board includes:
the substrate layer is flexible;
the inner layer circuit layer is formed on one surface of the substrate layer and comprises at least one signal circuit and at least two grounding circuits formed on two sides of the inner layer circuit layer;
a first cover film layer formed on the signal line in the bending region;
a first dielectric layer and a second dielectric layer respectively formed on the inner layer circuit layer and the base material layer in the first transmission region and the second transmission region; at least two third conductive columns are formed in the first dielectric layer, and the third conductive columns are made of copper paste or metal conductive paste containing at least two of copper, tin, silver and bismuth; a first outer layer circuit layer and a second outer layer circuit layer respectively formed on the first dielectric layer and the second dielectric layer, the first outer layer circuit layer and the second outer layer circuit layer being electrically connected to the ground circuit, respectively;
a second covering film layer and a third covering film layer respectively formed on the first outer layer circuit layer and the second outer layer circuit layer;
a first shielding layer formed on the second covering film layer and the first covering film layer; the first shielding layer is electrically connected with the first outer layer circuit layer; and
and the second shielding layer is formed on the third covering film layer and the substrate layer positioned in the bending area, and is electrically connected with the second outer layer circuit layer.
2. The transmission line board of claim 1, wherein the structure of the first shield layer is the same as the structure of the second shield layer; the first shielding layer comprises two end parts which are formed on the second covering film layer and are electrically connected with the first outer layer circuit layer, a bottom part which is formed on the first covering film layer and two connecting parts which are used for connecting the two end parts and the bottom part.
3. The transmission line board of claim 2, wherein at a break between the second cover film layer and the first cover film layer, a portion of the first dielectric layer flows onto the first cover film layer to form a first overflow portion, and the first overflow portion is filled in a first space formed by the first cover film layer and the first dielectric layer; and part of the adhesive layer of the second covering film layer flows to the first covering film layer to form two first adhesive overflowing parts, two connecting parts of the first shielding layer are attached to the first adhesive overflowing parts, and the first adhesive overflowing parts are attached to the first overflowing parts.
4. The transmission line board of claim 2, wherein at a difference between the third cover film layer and the substrate layer located in the bending region, a portion of the second dielectric layer flows onto the substrate layer to form a second overflow portion, and the second overflow portion is filled in a second space formed by the substrate layer and the second dielectric layer; part of the glue layer of the third covering film layer flows to the base material layer to form two second glue overflowing parts; the connecting part of the second shielding layer is attached to the second glue overflowing part, and the second glue overflowing part is attached to the second glue overflowing part.
5. The transmission line board of claim 1, further comprising at least two copper posts embedded within the substrate, the copper posts being located within the first transmission region and the second transmission region; the at least two grounding circuits are respectively and electrically connected with one ends of the at least two copper columns; at least two first conductive columns are formed in the first dielectric layer, one end of one first conductive column is electrically connected with the first outer layer circuit layer, and the other end of the one first conductive column is electrically connected with one grounding circuit; at least two second conductive columns are formed in the second dielectric layer, one end of each second conductive column is connected with the second outer-layer conductive circuit layer, and the other end of each second conductive column is electrically connected with one copper column; the first conductive column and the second conductive column are made of copper paste or metal conductive paste containing at least two of copper, tin, silver and bismuth.
6. The transmission line board of claim 1, wherein the first outer layer circuit layer further comprises at least two signal terminals, and two ends of each signal circuit are electrically connected to the two signal terminals through one third conductive pillar.
7. A method of manufacturing a transmission line board according to any one of claims 1 to 6, comprising:
providing an inner layer circuit substrate, wherein the inner layer circuit substrate is divided into a bending area, a first transmission area and a second transmission area which are positioned on two sides of the bending area; the inner-layer circuit substrate comprises a flexible substrate layer and an inner-layer circuit layer formed on the substrate layer, and the inner-layer circuit layer comprises at least one signal circuit and grounding circuits positioned on two opposite sides of the signal circuit;
pressing a first cover film layer on the signal circuit in the bending area;
pressing a first outer layer circuit substrate and a second outer layer circuit substrate on two sides of the inner layer circuit substrate respectively; the first outer layer circuit substrate comprises a first dielectric layer formed on the inner layer circuit layer positioned in the first transmission area and the second transmission area and a first outer layer circuit layer formed on the first dielectric layer; the second outer layer circuit substrate comprises a second outer layer circuit layer formed on the base material layer in the first transmission area and the second transmission area; the first outer layer circuit layer and the second outer layer circuit layer are electrically connected with the grounding circuit respectively;
laminating a second covering film layer and a third covering film layer on the first outer layer circuit layer and the second outer layer circuit layer respectively; and
and forming a first shielding layer on the second covering film layer and the first covering film layer, and attaching a second shielding layer on the third covering film layer and the base material layer.
8. The method of manufacturing a transmission line board according to claim 7, wherein the structure of the first shield layer is the same as the structure of the second shield layer; the first shielding layer comprises two end parts which are formed on the second covering film layer and are electrically connected with the first outer layer circuit layer, a bottom part which is formed on the first covering film layer and two connecting parts which are used for connecting the two end parts and the bottom part; at the offset of the second covering film layer and the first covering film layer, part of the first dielectric layer flows onto the first covering film layer to form a first overflow part, and the first overflow part is filled in a first space formed by the first covering film layer and the first dielectric layer; and part of the adhesive layer of the second covering film layer flows to the first covering film layer to form two first adhesive overflowing parts, two connecting parts of the first shielding layer are attached to the first adhesive overflowing parts, and the first adhesive overflowing parts are attached to the first overflowing parts.
9. The method of manufacturing a transmission line board according to claim 7, wherein the method of manufacturing the inner-layer circuit substrate includes:
providing a double-sided copper-clad substrate, wherein the double-sided copper-clad substrate comprises a substrate layer, a first copper foil layer and a second copper foil layer, and the first copper foil layer and the second copper foil layer are formed on two opposite surfaces of the substrate layer;
the second copper foil layer is sunken towards the first copper foil layer to form at least two first blind holes penetrating through the second copper foil layer and the substrate layer, and the at least two first blind holes are positioned in the first transmission area and the second transmission area;
forming at least two copper columns in the at least two first blind holes respectively through selective electroplating; and
manufacturing the first copper foil layer to form an inner circuit layer and etching the second copper foil layer to expose the substrate layer; the copper column is opposite to the grounding circuit; the copper column protrudes out of the base material layer or is flush with the base material layer.
10. The method of manufacturing a transmission line board according to claim 9, wherein the method of manufacturing the first outer layer circuit substrate includes:
providing a single-sided copper-clad substrate, wherein the single-sided copper-clad substrate comprises a first dielectric layer and a third copper foil layer formed on the first dielectric layer; d of the first dielectric layerfValue less than D of the substrate layerfA value;
manufacturing the third copper foil layer to form a first outer layer circuit layer, wherein the first outer layer circuit layer comprises at least two signal terminals and at least one outer layer circuit, and the outer layer circuit comprises at least two grounding terminals;
forming at least two second blind holes and at least two fourth blind holes penetrating through the first dielectric layer on the first dielectric layer respectively, wherein one second blind hole is opposite to one grounding terminal, and one fourth blind hole is opposite to one signal terminal;
filling a copper paste or a metal conductive paste containing at least two of copper, tin, silver and bismuth into the second blind hole and the fourth blind hole to form a first conductive column and a third conductive column respectively; and
and the first dielectric layer is sunken towards the first outer layer circuit layer to form a through groove penetrating through the first dielectric layer and the first outer layer circuit layer, the through groove is positioned in the bending area, and the edge of the through groove corresponds to the boundary between the first transmission area and the bending area and between the bending area and the second transmission area.
CN202010367841.1A 2020-04-30 2020-04-30 Transmission circuit board and manufacturing method thereof Active CN113597086B (en)

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US17/573,847 US11765818B2 (en) 2020-04-30 2022-01-12 Method for manufacturing transmission circuit board

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