CN113594011B - Anode target disk for X-ray tube, method of manufacturing the same, and X-ray tube - Google Patents
Anode target disk for X-ray tube, method of manufacturing the same, and X-ray tube Download PDFInfo
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- CN113594011B CN113594011B CN202110962222.1A CN202110962222A CN113594011B CN 113594011 B CN113594011 B CN 113594011B CN 202110962222 A CN202110962222 A CN 202110962222A CN 113594011 B CN113594011 B CN 113594011B
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 255
- 239000007787 solid Substances 0.000 claims abstract description 74
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- 238000000034 method Methods 0.000 claims description 12
- 230000002708 enhancing effect Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000000155 melt Substances 0.000 claims description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 abstract description 6
- 238000005304 joining Methods 0.000 description 44
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- 230000002787 reinforcement Effects 0.000 description 16
- 238000005219 brazing Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/08—Anodes; Anti cathodes
- H01J35/10—Rotary anodes; Arrangements for rotating anodes; Cooling rotary anodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/08—Anodes; Anti cathodes
- H01J35/10—Rotary anodes; Arrangements for rotating anodes; Cooling rotary anodes
- H01J35/101—Arrangements for rotating anodes, e.g. supporting means, means for greasing, means for sealing the axle or means for shielding or protecting the driving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/18—Assembling together the component parts of electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/08—Targets (anodes) and X-ray converters
- H01J2235/083—Bonding or fixing with the support or substrate
- H01J2235/084—Target-substrate interlayers or structures, e.g. to control or prevent diffusion or improve adhesion
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- X-Ray Techniques (AREA)
Abstract
The embodiment of the application discloses an anode target disk for an X-ray tube, a manufacturing method thereof and the X-ray tube, wherein the anode target disk comprises a base body and a base; the base or the matrix is provided with a connection enhancement surface; the connection enhancement surface comprises a first groove carving area and a plurality of solder placing areas, and the solder placing areas are used for placing solid solder; the solder placement areas are arranged at intervals along the circumferential direction of the anode target disk, and the first grooving areas are arranged between two adjacent solder placement areas; a plurality of first grooves are formed in the first groove region, and extend along the circumferential direction of the anode target disk; the base body and the base are connected through the solid solder.
Description
Technical Field
The present disclosure relates to the field of X-ray devices, and more particularly, to an anode target disk for an X-ray tube, a method of manufacturing the anode target disk, and an X-ray tube.
Background
The X-ray tube comprises a vacuum tube, a cathode filament and an anode target disk which are arranged in the vacuum tube. The cathode filament is used for generating electron beams which are directed to the anode target disk, and the surface of the anode target disk converts the kinetic energy of the electron beams to the anode target disk into high-frequency electromagnetic waves, namely X rays. The anode target disk may generally include a substrate (e.g., a metal substrate) and a pedestal. The metal matrix generates X-rays when bombarded by electrons from the cathode filament, and the mount is used for heat dissipation. The anode target disk is an important component of an X-ray tube, which requires rotation in a high temperature environment when the X-ray tube is in operation.
Therefore, in order to ensure the working stability of the X-ray tube, how to improve the connection stability of the base body and the base of the anode target disk is a technical problem to be solved in the art.
Disclosure of Invention
One of the embodiments of the present application provides an anode target disk for an X-ray tube comprising a base and a pedestal; the base or the matrix is provided with a connection enhancement surface; the connection enhancement surface comprises a first groove carving area and a plurality of solder placing areas, and the solder placing areas are used for placing solid solder; the solder placement areas are arranged at intervals along the circumferential direction of the anode target disk, and the first groove carving areas are arranged between any two adjacent solder placement areas; a plurality of first grooves are formed in the first groove region, and extend along the circumferential direction of the anode target disk; the base body and the base are connected through the solid solder.
In some embodiments, the solder placement area is provided with a plurality of first grooves.
In some embodiments, a through hole is provided on the base and/or the substrate, and an opening of the through hole is located on the connection enhancing surface.
In some embodiments, the first grooved region and the plurality of solder placement regions are arranged as an annular region having a center coincident with a center of the connection enhancement face, the annular region disposed around the opening.
In some embodiments, the anode target disk further comprises a dam structure disposed along an edge of the opening and/or along an outer edge of the connection enhancement face.
In some embodiments, the connection enhancement face further comprises a second scored area; the second grooving area is annular, and a plurality of second grooving areas are arranged on the second grooving area; at least one second notch in the plurality of second notches is annular and extends along the circumference of the second notch area; the second grooved region is disposed around the annular region.
In some embodiments, the connection enhancement face further comprises a third grooved region; the third grooving area is annular, and a plurality of third grooving areas are arranged on the third grooving area; at least one third notch in the plurality of third notches is annular and extends along the circumference of the third notch area; the first grooving area and the solder placement areas are arranged into an annular area, and the center of the annular area coincides with the center of the connection reinforcing surface; the third grooved region is disposed around the opening, and the annular region is disposed around the third grooved region.
In some embodiments, the anode target disk further comprises a fourth grooved region, the fourth grooved region being annular; a plurality of fourth grooves are formed in the fourth groove region; at least one fourth notch in the plurality of fourth notches is annular and extends along the circumferential direction of the fourth notch area; the fourth grooved region is disposed around the annular region.
In some embodiments, the total area of the first score zone, the third score zone, and the fourth score zone is greater than or equal to 40% of the area of the reinforcing land.
In some embodiments, at least two of the plurality of solder placement areas are equal in area.
In some embodiments, a plurality of the solder placement regions are equally spaced along the circumference of the anode target disk.
In some embodiments, the connection enhancement is circular; at least one solder placing area in the plurality of solder placing areas is in a fan shape, and the circle center of the fan shape is coincident with the circle center of the connection reinforcing surface.
Another embodiment of the present application provides an X-ray tube comprising an anode target disk according to any one of the claims herein.
A further embodiment of the present application provides a method for manufacturing an anode target disk, which is used for manufacturing the anode target disk according to any one of the technical schemes in the present specification; the manufacturing method comprises the following steps: placing solid solder in the solder placement region of the anode target disk; heating the solid solder, the substrate, and the base such that the solid solder melts; wherein the melted solid solder flows to the first score groove area and along the plurality of first score grooves to connect the substrate and the base.
A further embodiment of the present application provides a braze structure comprising a first portion and a second portion, the first portion having a joining enhancement surface for joining the first portion with the second portion; the connection enhancement surface comprises a first groove carving area and a plurality of solder placing areas, and the solder placing areas are used for placing solid solder; the solder placement areas are arranged at intervals along the circumferential direction of the anode target disk, and the first groove carving areas are arranged between any two adjacent solder placement areas; a plurality of first grooves are formed in the first groove region, and extend along the circumferential direction of the anode target disk; the first portion and the second portion are connected by the solid state solder.
According to the anode target disk for the X-ray tube, a first groove region and a plurality of solder placement regions are arranged on the connection enhancement surface of the substrate or the base, the solder placement regions are used for placing solid solder, and the first groove region can comprise a plurality of first groove sub-regions. The first score zone is provided with a first score for wicking the liquid solder to make the connection between the first part and the second part more stable. The first groove region is arranged between the two solder placement regions, so that the first groove region can receive the solid solder melted in the solder placement regions, the liquid solder melted in the solid state can flow along the first groove, the gas in the first groove can be gradually discharged in the flowing process of the liquid solder, and the discharge of the gas in the first groove is not easy to be blocked by the solder, so that the generation of air holes is reduced. And because the solder placement area is specially arranged, the solid solder is not easy to obstruct the discharge of the gas in the first notch. The plurality of first score grooves of the first score groove region can further increase the welding area, so that the stability of the brazing structure is further improved.
Drawings
The present specification will be further elucidated by way of example embodiments, which will be described in detail by means of the accompanying drawings. The embodiments are not limiting, in which like numerals represent like structures, wherein:
FIG. 1 is a schematic structural view of an exemplary braze structure shown in accordance with some embodiments of the present disclosure;
FIG. 2 is a schematic structural view of an exemplary anode target disk shown in accordance with some embodiments of the present description;
FIG. 3 is a schematic illustration of the structure of a connection enhancement face according to some embodiments of the present disclosure;
FIG. 4 is a schematic illustration of the structure of a connection enhancement face according to some embodiments of the present disclosure;
FIG. 5 is a schematic illustration of the structure of a connection enhancement face according to some embodiments of the present disclosure;
FIG. 6 is a schematic illustration of a structure of a connection enhancement face according to some embodiments of the present disclosure;
FIG. 7 is a schematic cross-sectional view of a first score groove shown according to some embodiments of the present disclosure;
fig. 8 is a flow chart of a method of manufacturing an anode target disk according to some embodiments of the present description.
Reference numerals illustrate: 1000. a braze structure; 1100. a first portion; 1200. a second portion; 2000. an anode target plate; 2100. a base; 2200. a base; 2300. connecting the reinforcing surfaces; 2310. a first grooved region; 2350. a solder placement area; 2311. a first grooving; 2320. a second grooved region; 2321. a second grooving; 2330. a third grooved region; 2331. third grooving; 2340. a fourth grooved region; 2341. fourth grooving; 2400. a through hole; 2410. an opening; 2500. a boss; 3000. solid solder; 4000. an anode rotor.
Detailed Description
In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some examples or embodiments of the present specification, and it is possible for those of ordinary skill in the art to apply the present specification to other similar situations according to the drawings without inventive effort. Unless otherwise apparent from the context of the language or otherwise specified, like reference numerals in the figures refer to like structures or operations.
As used in this specification and the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus.
A flowchart is used in this specification to describe the operations performed by the system according to embodiments of the present specification. It should be appreciated that the preceding or following operations are not necessarily performed in order precisely. Rather, the steps may be processed in reverse order or simultaneously. Also, other operations may be added to or removed from these processes.
Brazing is a common welding method in the modern industry. Soldering is to heat a solid solder (brazing filler metal) lower than the melting point of a soldering member to the melting temperature of the solid solder simultaneously with the soldering member so that the solid solder melts into a liquid solder, and the liquid solder can fill the gap of a soldering work piece so that the soldering work pieces are connected. Vacuum brazing is an operation in the brazing technology, wherein solder can be placed between parts to be welded (such as two parts), then the solder and the parts to be brazed are placed into a vacuum heating chamber for heating, and the solder and the parts to be welded after temperature rising can be prevented from being oxidized by air or burning through heating in the vacuum heating chamber. In some embodiments, to make the connection between the solder parts more stable, a notch may be provided on the connection enhancing surface of one or more of the solder parts, and solid solder may be provided on the surface of the notch during the soldering operation, so that the melted solder in a liquid state may flow into the notch, and the notch is beneficial for the liquid solder to be drawn in by capillary action and fill the gap between the solder parts, thereby ensuring an effective connection between the solder parts. However, since the solid solder is placed on the notch groove, air in the notch groove may not be discharged after the solid solder is melted and air holes occur at the weld joint, which may result in an undesirable increase in the reliability of the connection between the welded parts.
The embodiment of the application provides a brazing structure. The braze structure includes at least two portions, e.g., a first portion and a second portion. The first score zone and the plurality of solder placement zones may be disposed on a connection enhancement surface of one of the at least two portions. The solder placing area is used for placing solid solder. The first score zone may comprise a plurality of first score zone. The plurality of solder placement regions may be spaced apart along the circumference of the anode target disk (e.g., in the direction indicated by arrow B in fig. 3-6), and the plurality of first score line sub-regions may also be spaced apart along the circumference of the anode target disk. A first score line (e.g., a first score line sub-region of the first score line zone) may be disposed between any two adjacent solder placement regions. The first score zone (e.g., a plurality of first score sub-areas of the first score zone) is provided with a first score for wicking the liquid solder to make the connection between the first part and the second part more stable. The first score groove extends along a circumferential direction of the anode target disc. The first portion and the second portion may be connected by solid state solder. By disposing the first score groove region (for example, one first score groove sub-region of the first score groove region) between the two solder placement regions, the first score groove region can receive the solid solder after the solder placement regions are melted (i.e., the solder which is basically in a liquid state after the solid solder is melted), the liquid solder can flow along the first score groove, the gas in the first score groove can be gradually discharged during the flowing process of the liquid solder, and the discharge of the gas in the first score groove is not easy to be blocked by the solder, so that the generation of air holes is reduced. And because the solder placement area is specially arranged, the solid solder is not easy to obstruct the discharge of the gas in the first notch. The plurality of first score grooves of the first score groove region can further increase the welding area, so that the stability of the brazing structure is further improved. In some embodiments, the braze structure may be an anode target disk of an X-ray tube. In some embodiments, the braze structure may be a carbide bit, a drill bit, a heat exchanger, microwave waveguide components, an electronic vacuum device, or the like. In some embodiments, the braze structure may be used for vacuum brazing.
Fig. 1 is a schematic structural view of an exemplary braze structure 1000 shown in accordance with some embodiments of the present disclosure. As shown in fig. 1, the braze structure 1000 may include a first portion 1100 and a second portion 1200. The first portion 1100 has a joining enhancement surface 2300 for joining the first portion 1100 to the second portion 1200. As shown in other portions of this specification (e.g., fig. 2-6 and the descriptions thereof), the joining enhancement surface 2300 can include a first score groove region 2310 and a plurality of solder placement regions 2350. The solder placement region 2350 is used to place solid solder 3000, and a plurality of solder placement regions 2350 may be arranged at intervals along the circumferential direction of the anode target disk (for example, the direction indicated by arrow B in fig. 3 to 6). That is, adjacent two solder placement areas 2350 are spaced apart along the axial direction of the anode target disk. A first grooved region 2310 is provided between two adjacent solder placement regions 2350. For example, a first score line of first score line 2310. The first score line 2310 has a plurality of first score lines 2311, and at least one first score line 2311 of the plurality of first score lines 2311 may extend along a circumferential direction of the anode target disc (e.g., a direction indicated by an arrow B in fig. 3-6) such that the melted solid solder 3000 (i.e., the solder in a substantially liquid state after the solid solder 3000 is melted) flows from the solder placement area 2350 into the first score line 2310 to form a connection between the first portion 1100 and the second portion 1200. The melted solid solder 3000 may flow within the first score groove 2311 such that the gas within the first score groove 2311 may be vented. The first portion 1100 and the second portion 1200 may be connected by solid solder 3000. It will be appreciated that the first portion 1100 and the second portion 1200 may be connected by solid solder 3000 (e.g., solid solder that resolidifies after melting) after the solder that has melted to a liquid state solidifies again to a solid state.
In some embodiments, depending on the particular shape of the solid state solder 3000, at least a portion of the solid state solder 3000 may also be placed on the first score groove region 2310. For example only, when solid solder 3000 is placed on solder placement area 2350, a portion of solid solder 3000 may be placed onto first grooved area 2310 beyond the edge of solder placement area 2350.
The first portion 1100 and the second portion 1200 each have a connection surface thereon for connection, wherein the connection surface on the first portion 1100 serves as a connection reinforcing surface 2300 for reinforcing the connection strength, and the first score line 2310 provided on the connection reinforcing surface 2300 can reinforce the connection strength between the first portion 1100 and the second portion 1200, so that the connection therebetween is more stable. The joining enhancement surface 2300 can be understood as the surface of the first portion 1100 opposite the second portion 1200 when the first portion 1100 and the second portion 1200 are joined. After melted solid solder 3000 flows from solder placement area 2350 into first score-groove area 2310, it may enter first score-groove 2311. The melted solid solder 3000, the first portion 1100, and the second portion 1200 may be cooled such that the liquid solder solidifies to form a connection between the first portion 1100 and the second portion 1200. For further description of the first recessed area 2310 and the solder placement area 2350, please refer to the relevant contents of fig. 2-6.
In some embodiments, the braze structure may be an anode target disk 2000 (see fig. 2) for an X-ray tube. Because the working environment for manufacturing the anode target disk 2000 has a high temperature and needs to rotate at a high speed during use, the connection between the components (such as the base 2100 and the base 2200) of the anode target disk 2000 can be realized by using brazing, so that the connection reliability of the components of the anode target disk 2000 can be ensured, and the anode target disk 2000 works stably and has a long service life. For a specific structural description of the anode target disk 2000, please refer to fig. 2.
In some embodiments, the first portion 1100 may include one of the base 2200 and the base 2100, and the second portion 1200 may include the other of the base 2200 and the base 2100. In some embodiments, first portion 1100 may include base 2200, that is, connection enhancing surface 2300 is disposed on base 2200. The base 2200 is convenient to process grooves (e.g., the first grooves 2311), and can improve the processing efficiency of the anode target disc 2000. In some embodiments, the first portion 1100 may include the substrate 2100, that is, the connection enhanced surface 2300 may be provided only on the substrate 2100. For specific materials of the base 2100 and the base 2200, please refer to the following.
In some embodiments, both base 2100 and base 2200 may be cylindrical, such as cylindrical, elliptical, etc. At this time, the joining reinforcing surface 2300 may be circular or elliptical, or a part thereof. The axes of the base 2100 and the base 2200 may be (substantially) coincident, and the base 2100 and the base 2200 may be rotatable about the axes of the base 2100 and the base 2200 during operation of the X-ray tube. Herein, "substantially" is used to describe a feature (e.g., substantially coincident) and means that the deviation from the feature is less than a threshold. The threshold may be an absolute value (e.g., 1 cm, 5 mm), or a relative value (e.g., 10% of its radius, 5% when the substrate is a circle).
Fig. 2 is a schematic diagram of an exemplary anode target disk 2000, according to some embodiments of the present description. As shown in fig. 2, the anode target disk 2000 may include a base 2100 and a pedestal 2200. The base 2200 or the base 2100 has a connection reinforcing surface 2300 thereon. When the joining enhancement surface 2300 is positioned on the base 2200, the joining enhancement surface 2300 can be understood as a surface of the base 2200 for joining with the base 2100. When the joining enhancement surface 2300 is positioned on the base 2100, the joining enhancement surface 2300 can be understood as a surface of the base 2100 for joining with the base 2200.
In some embodiments, when the joining enhancement surface 2300 is disposed on the base 2200, the base 2200 may be provided with a through-hole 2400, and the opening 2410 of the through-hole 2400 may be located on the joining enhancement surface 2300. The through hole 2400 may be passed through by the anode rotor 4000 of the X-ray tube to enable the anode target disk 2000 to be mounted to the X-ray tube and to enable the anode target disk 2000 to rotate with the anode rotor 4000.
As shown elsewhere in the specification (e.g., fig. 3-6 and the descriptions thereof), the connection enhancement surface 2300 of the anode target disk 2000 can include a first score groove region 2310 and a plurality of solder placement regions 2350. A plurality of solder placement areas 2350 may be used to place solid solder 3000. The first grooved region 2310 is used for flowing the melted liquid solder. First score groove 2310 may provide a plurality of first score grooves 2311 to increase a welding area and facilitate venting, thereby improving welding stability of base 2200 and substrate 2100. For a specific description of the relative positions between the first scribe line 2310 and the solder placement area 2350 and the arrangement of the first scribe line 2311 on the corresponding first scribe line 2310, please refer to fig. 3-6.
In some embodiments, two ends of at least one first score groove 2311 of the plurality of first score grooves 2311 are respectively located at edges of two adjacent solder placement areas 2350, so that the melted solid solder 3000 flows into the first score groove 2311 of the first score groove 2310 from the solder placement areas 2350 to form a connection between the substrate 2100 and the base 2200.
In some embodiments, the first score region 2310 may include a plurality of first score regions, and one first score region may be disposed between any two adjacent solder placement regions 2350. In some embodiments, two ends of at least one first score groove 2311 of the plurality of first score grooves 2311 are respectively located at edges of two adjacent solder placement areas 2350, so that the two ends of the first score groove 2311 can conveniently receive the liquid solder.
It is understood that the annular shape of the annular region may include a circular shape, a triangular shape, a rectangular shape, a hexagonal shape, an irregular shape, and the like. In the present application, the ring shape may include an inner edge and an outer edge surrounding the inner edge. The shape of the annular inner and outer edges may be the same. For example, the inner edge and the outer edge of the ring may be both circular, and the ring is a circular ring; for another example, the inner and outer edges of the ring shape may be hexagonal, and the ring shape is a hexagonal ring shape. The shape of the annular inner and outer edges may be different. For example, the annular inner edge may be circular and the annular outer edge may be rectangular.
In some embodiments, when the first score region 2310 has a plurality of first score sub-regions, a number of first score grooves 2311 may be spaced apart along a radial direction (e.g., a direction indicated by an arrow a in fig. 3-6) of the anode target disc 2000 in each first score sub-region. That is, two adjacent first grooves 2311 on the first grooved region 2310 are spaced apart in the radial direction of the anode target disc 2000. The radial direction of the annular region may also be the radial direction of the anode target disk 2000.
In some embodiments, the first score-groove 2310 and the plurality of solder-bearing regions 2350 are arranged in an annular region with a center that coincides with the center of the joining enhancement surface 2300, with an inner edge of the first score-groove 2310 (e.g., an inner edge of each first score-groove sub-region) and an inner edge of each solder-bearing region 2350 of the plurality of solder-bearing regions 2350 being located on an inner ring of the annular region; the outer edge of the first score groove region 2310 (e.g., the inner edge of each first score groove sub-region) and the outer edge of each of the plurality of solder placement regions 2350 are located on the outer ring of the annular region.
In some embodiments, the connection enhancing surface 2300 may be circular and the solder placement area 2350 may be a sector of a circle. The center of the fan-shaped solder placement 2350 may coincide with the center of the connecting stiffener 2300. In some embodiments, each of the plurality of first score line sub-regions of the first score line 2310 may be sector-shaped. At this time, the annular region in which the first groove region 2310 and the plurality of solder placement regions 2350 are arranged may be in a circular ring shape. In some embodiments, the connection enhanced surface 2300 may take on other shapes. For example, the connection enhanced surface 2300 may be rectangular and the solder placement area 2350 may be rectangular. In some embodiments, each of the plurality of first score line sub-regions of the first score line 2310 may be rectangular. At this time, the annular region in which the first grooved region 2310 and the plurality of solder placement regions 2350 are arranged may be a rectangular annular shape (i.e., the inner ring and the outer ring are both rectangular annular shapes).
In some embodiments, to prevent liquid solder from running off at the edges of the joining reinforcement surface 2300 (e.g., at the openings 2410 or at the outer edges of the joining reinforcement surface 2300), a dam structure is provided on the joining reinforcement surface 2300. The baffle structure may be disposed along an edge of the opening 2410 and/or the baffle structure may be disposed along an outer edge of the joining reinforcement surface 2300. In some embodiments, as shown in fig. 2-5, the baffle structure may be a boss 2500 secured to the joining enhancement surface 2300, the boss 2500 may be disposed along an edge of the opening 2410 (as shown in fig. 3 or 4), and/or along an outer edge of the joining enhancement surface 2300 (as shown in fig. 5). In other embodiments, the baffle structure may be a baffle removably attached to the joining reinforcement surface 2300, the baffle may be disposed along an edge of the opening 2410, and/or along an outer edge of the joining reinforcement surface 2300. After the brazing operation is completed, the baffle may be removed. The dam structure may prevent liquid solder from escaping from the opening 2410 or the outside edge of the joining enhancement surface 2300, thereby ensuring that sufficient solder is available for joining the base 2100 and the base 2200.
In some embodiments, base 2200 may comprise graphite. The first notch 2311 is easily formed in the base 2200 made of graphite, and thus the productivity of the anode target disc 2000 can be effectively improved. In other embodiments, base 2200 may also include oxygen-free copper. In some embodiments, the substrate 2100 may be a metal substrate 2100. In some embodiments, the substrate 2100 may include a refractory metal. Refractory metals generally refer to rare metal monomers or metal alloys having a relatively high melting point (e.g., a melting point greater than 1650 ℃). Refractory metals typically include tungsten, molybdenum, niobium, tantalum, vanadium, zirconium, rhenium, hafnium, tantalum-tungsten alloys, molybdenum-titanium-zirconium alloys, and the like. Molybdenum-titanium-zirconium alloy (TZM) refers to an aluminum alloy containing 0.4 to 0.6% (wt) of titanium, 0.08 to 0.12% (wt) of zirconium and 0.02 to 0.03% (wt) of carbon.
In some embodiments, a plurality of first grooves 2311 are also provided on the solder placement area 2350. In some embodiments, the first notch 2311 on the solder placement 2350 may be configured in a similar manner as the first notch 2311 on the first notch 2310. In some embodiments, two ends of each first notch 2311 on the solder placement area 2350 may be connected to one end of the first notch 2311 of two adjacent first notch areas 2310, respectively. In some embodiments, the first score groove 2311 may be a circular ring extending entirely along the circumferential direction of the anode target disc 2000, that is, the first score groove 2311 on the first score groove 2310 and the first score groove 2311 on the solder placement area 2350 may be continuous. By providing the first notch 2311 in the solder placement area 2350 as well, the first notch 2311 in the first notch area 2310 is continuous with the first notch 2311 in the solder placement area 2350, the first notch 2311 in the connection reinforcing surface 2300 can be easily processed, and thus the processing efficiency of the connection reinforcing surface 2300 can be improved.
In some embodiments, the solder placement area 2350 may be a smooth surface. In some embodiments, the surface roughness Ra of the solder placement 2350 may be less than or equal to 6.3. In some embodiments, the surface roughness Ra of the solder placement 2350 is less than or equal to 3.2. In some embodiments, the surface roughness criteria described above may be achieved by setting the machining mode. Through setting up the surface roughness Ra that district 2350 was put to the solder, can make the solder put district 2350 comparatively smooth to make solder put district 2350 and solder piece surface and can laminate as far as possible, can avoid in the brazing process solder piece surface and solder put and put because of having more holes between district 2350 and form the gas pocket.
Fig. 3 is a schematic structural view of a joining reinforcement member 2300 according to some embodiments of the present disclosure. First score line 2310 may include a plurality of first score line sub-regions. As shown in fig. 3, the plurality of first score groove sub-regions and the plurality of solder placement regions 2350 may be arranged at intervals along the circumferential direction of the anode target disk 2000 (e.g., the direction indicated by arrow B in fig. 3). As shown in fig. 3, the annular region in which the first score-groove region 2310 and the plurality of solder placement regions 2350 described above are arranged may be disposed around the opening 2410. A first scribe line sub-region of the plurality of first scribe line sub-regions of the first scribe line region 2310 is disposed between two adjacent solder placement regions 2350. Both ends of the first score groove 2311 of the first score groove subregion are located at edges of the adjacent two solder placement regions 2350, respectively.
Fig. 4 is a schematic structural view of a joining reinforcement surface 2300 according to some embodiments of the present disclosure. As shown in FIG. 4, the joining enhancement surface 2300 can further include a second score region 2320. The second engraved region 2320 may be annular. Second score regions 2320 are provided with a plurality of second scores 2321. At least one second score 2321 of the plurality of second scores 2321 is annular and extends along a circumferential direction of the second score region 2320 (e.g., a direction indicated by an arrow B in fig. 4, which is also a circumferential direction of the anode target disk 2000). The first grooved region 2310 and the plurality of solder placement regions 2350 are arranged in an annular region disposed around the opening 2410, and the second grooved region 2320 may be disposed around the annular region. The liquid solder may flow from the edge of the outer ring of the solder placement region 2350 located in the annular region into the second engraved region 2320 and may flow along the second engraved region 2321 within the second engraved region 2320.
In some embodiments, the shape of the inner ring of the second grooved region 2320 may match the shape of the outer ring of the annular region in which the solder placement region 2350 is located. For example, when the annular region outer ring is circular, the annular region outer ring and the inner ring of the second engraved region 2320 are concentric circles. For another example, when the outer ring of the annular region is rectangular, the inner ring of the second engraved region 2320 is rectangular in shape. In some embodiments, a plurality of second score grooves 2321 are spaced apart from each other on second score groove region 2320 from the inside out. For example, the second scribe area 2320 is in a circular shape, the plurality of second scribe areas 2321 may be arranged at intervals on the second scribe area 2320 along a radial direction of the second scribe area 2320 (for example, a direction indicated by an arrow a in fig. 4), and at least one second scribe area 2321 of the plurality of second scribe areas 2321 extends along a circumferential direction of the second scribe area 2320.
Because the second score 2321 on the second score region 2320 extends circumferentially of the second score region 2320, the second score 2321 may effectively block the liquid solder from spilling over the connection enhanced face 2300 from the outside edge of the connection enhanced face 2300 from inside-out, thereby preventing the liquid solder from running off the edge of the solder placement region 2350 (the outer ring of the annular region) directly on the connection enhanced face 2300. In addition, the liquid solder may flow along the second score 2321 such that the liquid solder may be more evenly distributed on the connection enhanced face 2300.
It is appreciated that the shape and size of the second score line 2321 may be similar to the shape and size of the first score line 2311, for a related description of the shape and size of the second score line 2321, see below for a related description of the first score line 2311. By providing the second engraved regions 2320, the flow of the liquid solder can be optimized, not only the area of the region provided with the engraved regions can be effectively increased, but also the solder loss can be prevented, and meanwhile, the liquid solder can be more uniformly distributed on the connection reinforcing surface 2300, so that the connection strength of the base 2200 and the substrate 2100 can be effectively improved.
Fig. 5 is a schematic structural view of a joining reinforcement surface 2300 according to some embodiments of the present disclosure. As shown in FIG. 5, the joining enhancement surface 2300 can further include a third scored area 2330. The third grooved region 2330 may have a ring shape. The third grooving region 2330 is provided with a plurality of third grooving 2331. At least one third score groove 2331 of the plurality of third score grooves 2331 is annular and extends along the circumference of the third score groove region 2330 (e.g., the direction indicated by arrow B in fig. 5, which is also the circumference of the anode target disk 2000). The third grooved region 2330 is disposed around the opening 2410, and an annular region in which the first grooved region 2310 and the plurality of solder placement regions 2350 are arranged is disposed around the outside of the third grooved region 2330. The liquid solder may flow from the edge of the inner ring of the solder placement region 2350 at the annular region into the third grooved region 2330 and along the third grooves 2331 on the third grooved region 2330.
In some embodiments, the shape of the inner ring of third grooved region 2330 may match the shape of opening 2410. For example, when the opening 2410 is circular, the shape of the inner ring of the third grooved region 2330 is circular. In some embodiments, the shape of the outer ring of the third grooved region 2330 may match the shape of the inner ring of the annular region in which the solder placement region 2350 is located. For example, when the outer ring of the annular region is circular in shape, the outer ring of the annular region and the outer ring of the third grooved region 2330 are concentric circles. In some embodiments, a plurality of third score grooves 2331 are spaced apart from each other inside to outside on second score groove region 2320. For example, the third score line 2330 may have a circular ring shape, a plurality of third score lines 2331 may be spaced apart on the third score line 2330 along a radial direction (e.g., a direction indicated by an arrow a in fig. 5) of the third score line 2330, and the plurality of third score lines 2331 may extend along a circumferential direction of the third score line 2330.
Since the third notch 2331 on the third notch 2330 extends along the circumference of the third notch 2330, the third notch 2331 can effectively prevent the liquid solder from overflowing from the opening 2410 from outside to inside on the connection reinforcing surface 2300, and in the case where the through-hole 2400 is provided on the base 2200 and/or the base 2100, the third notch 2331 can prevent the liquid solder from running off from the edge (inner ring of the annular region) of the solder placement region 2350 directly on the connection reinforcing surface 2300. In addition, the liquid solder may flow along the third score groove 2331 so that the liquid solder may be more evenly distributed on the connection enhanced surface 2300.
It is appreciated that the shape and size of the third notch 2331 may be similar to the shape and size of the first notch 2311, for a related description of the shape and size of the third notch 2331, see below for a related description of the first notch 2311. By providing the third grooved region 2330, the flow of the liquid solder can be optimized, which effectively increases the area of the region where the grooves are provided, thereby preventing solder loss, and at the same time, the liquid solder can be more uniformly distributed on the connection reinforcing surface 2300, thereby effectively improving the connection strength of the base 2200 and the base 2100.
In some embodiments, where only the first score line 2310 is provided on the joining reinforcement surface 2300, the baffle structure (e.g., boss 2500) may be provided along the edge of the opening 2410 and/or along the outer edge of the joining reinforcement surface 2300 (only boss 2500 is shown provided along the edge of the opening 2410 in fig. 3). In some embodiments, when the first score line 2310 and the second score line 2320 are provided on the connection-enhancing surface 2300, a material blocking structure may be provided along an edge of a side of the annular region where the solder placement region 2350 is provided that is remote from the second score line 2320 in order to avoid loss of liquid solder from the inner edge of the solder placement region 2350. For example, as shown in fig. 4, when the second engraved region 2320 is circumferentially disposed outside the annular region where the solder placement region 2350 is provided, a stopper structure (e.g., boss 2500) may be disposed along the edge of the opening 2410. In some embodiments, when the first notch 2310 and the third notch 2330 are provided on the connection enhancing surface 2300, a material blocking structure may be provided along an edge of a side of the annular region where the solder placement region 2350 is provided, which is away from the third notch 2330, in order to avoid the liquid solder from being lost from an outer edge of the solder placement region 2350. For example, as shown in fig. 5, when the third score line 2320 is disposed circumferentially outside the opening 2410 and the annular region provided with the solder placement region 2350 is disposed circumferentially outside the third score line 2330, a material blocking structure (e.g., boss 2500) may be disposed along the outer edge of the connection enhancing surface 2300.
FIG. 6 is a schematic structural view of a joining reinforcement member 2300 according to some embodiments of the present disclosure. As shown in fig. 6, in some embodiments, where the anode target disk 2000 includes a third grooved region 2330, the anode target disk 2000 may further include a fourth grooved region 2340. The fourth grooved region 2340 may have a ring shape. The fourth grooving region 2340 is provided with a plurality of fourth grooving 2341. At least one fourth score groove 2341 of the plurality of fourth score grooves 2341 is annular and extends along the circumferential direction of the fourth score groove region 2340 (for example, the direction indicated by an arrow B in fig. 6, which is also the circumferential direction of the anode target disk 2000). The fourth grooved region 2340 may be disposed around the first grooved region 2310 and an annular region where the plurality of solder placement regions 2350 are arranged. The fourth grooving region 2340 has a similar shape, arrangement and effect to the second grooving region 2320, and please refer to the relevant content of the second grooving region 2320.
In some embodiments, when one or more score regions are provided on the joining reinforcement surface 2300, the total area of the one or more score regions may be greater than or equal to 40% of the area of the joining reinforcement surface 2300. For example, when only the first score region 2310 is provided on the joining reinforcement surface 2300, the area of the first score region 2310 may be greater than or equal to 40% of the area of the joining reinforcement surface 2300. For another example, when the joining enhancement layer 2300 is provided with the first score region 2310 and the second score region 2320, the sum of the areas of the first score region 2310 and the second score region 2320 is greater than or equal to 40% of the area of the joining enhancement layer 2300. For another example, when the joining enhancement layer 2300 is provided with the first score line 2310 and the third score line 2330, the sum of the areas of the first score line 2310 and the third score line 2330 is greater than or equal to 40% of the area of the joining enhancement layer 2300. For another example, when the first score line 2310, the third score line 2330, and the fourth score line 2340 are provided on the joining enhancement surface 2300, the sum of the areas of the first score line 2311, the third score line 2330, and the fourth score line 2340 is greater than or equal to 40% of the area of the joining enhancement surface 2300. By providing the area of the region (including the first score region 2310, the second score region 2320, the third score region 2330, and/or the fourth score region 2340) having the score (the first score 2311, the second score 2321, the third score 2331, and/or the fourth score 2341), capillary action to the liquid solder can be generated or increased, and connection stability of the base 2200 and the base 2100 can be effectively increased.
In some embodiments, in order to enable a more uniform distribution of the liquid solder on the connection enhanced surface 2300 after flowing, the areas of at least two solder placement areas 2350 of the plurality of solder placement areas 2350 may be set equal. For example, the areas of the plurality of solder placement areas 2350 are all equal. In some embodiments, the areas of at least two first score line sub-areas in the first score line 2310 may be equal. For example, the areas of the plurality of first score line sub-areas may be equal. In some embodiments, the area of each of the plurality of solder placement regions 2350 may be equal to the area of each of the plurality of first score groove sub-regions.
In some embodiments, the plurality of solder placement areas 2350 are equally spaced. That is, the central axes (shown as dashed line e and dashed line f in fig. 3) of any two adjacent solder placement regions 2350 are opposite to each other. For example, when the number of solder placement areas 2350 is 3, the angle between the central axes of any two adjacent solder placement areas 2350 may be 120 °. For another example, when the number of solder placement areas 2350 is 4, the angle between the central axes of any two adjacent solder placement areas 2350 may be 90 °.
In some embodiments, the width of each first score groove 2311 of the plurality of first score grooves 2311 as shown in fig. 3-6 is set such that the spacing distance between any adjacent two first score grooves 2311 in the radial direction of the brazing structure 1000 (e.g., the direction of arrow a in fig. 3-6) is equal. Similarly, the width of each second score 2321 of the plurality of second scores 2321 is set such that the spacing distance between any adjacent two second scores 2321 in the radial direction of the brazing structure 1000 (for example, the direction shown by arrow a in fig. 4) is equal; the width of each third score groove 2331 of the plurality of third score grooves 2331 is set such that the spacing distance between any adjacent two third score grooves 2331 in the radial direction (for example, the direction indicated by arrow a in fig. 5) of the brazing structure 1000 is equal; the width of each fourth score groove 2341 of the plurality of fourth score grooves 2341 is set such that the distance between any adjacent two fourth score grooves 2341 in the radial direction (for example, the direction indicated by the arrow a in fig. 6) of the brazing structure 1000 is equal. By such an arrangement, the first score line 2311, the second score line 2321, the third score line 2331 and/or the fourth score line 2341 may be more evenly distributed on the connection enhanced surface 2300, thereby more evenly distributing solder on the connection enhanced surface 2300.
Fig. 7 is a schematic cross-sectional view of a first score groove shown in accordance with some embodiments of the present disclosure. As shown in fig. 7, in some embodiments, at least one of the plurality of first grooves 2311 may be a V-groove in order to improve the processing efficiency. A V-groove may be understood as a cross section of the first notch 2311 (a cross section along a direction perpendicular to the length direction of the first notch 2311) is V-shaped. In some embodiments, a cross-section (a cross-section along a direction perpendicular to a length direction of the first score groove 2311) of at least one first score groove 2311 of the plurality of first score grooves 2311 may be a U-shaped groove, a trapezoid, an inverted trapezoid, or the like. The above description about the cross-sectional arrangement of at least one first score line 2311 of the plurality of first score lines 2311 is also applicable to the cross-sectional arrangement of at least one second score line 2321 of the plurality of second score lines 2321, the cross-sectional arrangement of at least one third score line 2331 of the plurality of third score lines 2331, and the cross-sectional arrangement of at least one fourth score line 2341 of the plurality of fourth score lines 2341, which will not be repeated.
In some embodiments, as shown in FIG. 7, the depth c of each first score groove 2311 of the plurality of first score grooves 2311 is 0.1mm to 0.5mm. In this specification, the depth of the first score groove 2311 may refer to a maximum distance (distance c as shown in fig. 7) of the upper end opening of the first score groove 2311 to the bottom of the first score groove 2311. If the depth of the first grooves 2311 is too shallow, the capillary action may not be sufficiently remarkable, which is disadvantageous for stable connection of the base 2200 with the base 2100, and if the depth of the first grooves 2311 is too deep, which may affect the flow of the liquid solder, by setting the depth of each first groove 2311 to the above range, it is possible to ensure both strong capillary action and smooth flow of the liquid solder in the first grooves 2311. The above description about the depth setting of each first score line 2311 of the plurality of first score lines 2311 is also applicable to the depth setting of each second score line 2321 of the plurality of second score lines 2321, the depth setting of each third score line 2331 of the plurality of third score lines 2331, and the depth setting of each fourth score line 2341 of the plurality of fourth score lines 2341, and will not be repeated.
In some embodiments, the width d of each first score groove 2311 of the plurality of first score grooves 2311 is 0.1mm to 0.5mm. In this specification, the width of one first notch 2311 refers to the distance between both side edges at the upper end opening of the first notch 2311 (distance d as shown in fig. 7). If the width of the first notch 2311 is too large, capillary action may be reduced, which is disadvantageous in that liquid solder flows into the first notch 2311, and thus, in that the base 2200 is disadvantageous in stable connection with the base 2100. If the width of the first notch 2311 is too small, it may in turn affect the flow of liquid solder within the first notch 2311. By setting the width of each first score groove 2311 to the above range, it is possible to ensure both sufficient capillary action and smooth flow of the liquid solder in the first score groove 2311. The above description about the width setting of each first score line 2311 of the plurality of first score lines 2311 is also applicable to the width setting of each second score line 2321 of the plurality of second score lines 2321, the width setting of each third score line 2331 of the plurality of third score lines 2331, and the width setting of each fourth score line 2341 of the plurality of fourth score lines 2341, which will not be repeated.
The embodiment of the application also provides an X-ray tube, which comprises the anode target disc 2000 in any technical scheme, and the anode target disc 2000 is used for stabilizing the work of the X-ray tube and prolonging the service life.
The embodiment of the present application also provides a manufacturing method 8000 of an anode target plate, which can be used for manufacturing the anode target plate 2000 in any of the above-mentioned technical schemes. As shown in fig. 8, the manufacturing method 8000 may include the steps of:
In step 8100, solid solder 3000 is placed in the solder placement region 2350 of the anode target disk 2000.
In some embodiments, the solder placement area 2350 is covered by solid solder 3000. That is, the solid solder 3000 may fill the solder placement area 2350. In some embodiments, the shape of the solid solder 3000 conforms to the shape of the solder placement area 2350. In some embodiments, the area of the solid solder 3000 is the same as the area of the solder placement area 2350.
It is appreciated that the shape of the solid solder 3000 conforming to the shape of the solder footprint 2350 may be the same or substantially the same shape of the solid solder 3000 as the shape of the solder footprint 2350. In some embodiments, the area of the solid solder 3000 may be the same or substantially the same as the area of the solder placement area 2350.
At step 8200, at least one of solid solder 3000, base 2100, and base 2200 is heated such that solid solder 3000 melts. Wherein the melted solid solder 3000 flows at least to the first score groove 2310 and along the plurality of first score grooves 2311 to connect the base 2100 and the base 2200.
In some embodiments, the solid solder 3000 may be directly heated such that the solid solder 3000 melts. In other embodiments, the substrate 2100 and/or base 2200 may be heated, and the heated substrate 2100 and/or base 2200 may be capable of transferring heat to the solid solder 3000 to cause the solid solder 3000 to melt. In still other embodiments, solid solder 3000, matrix 2100, and base 2200 may be heated together to cause solid solder 3000 to melt. In some embodiments, the temperature of the heating may be determined based on the selection of a particular solder. For example, when the solder is a manganese-based solder or a nickel-based solder, the heating temperature may be greater than 450 ℃ (e.g., 500 ℃,600 ℃, etc.).
In some embodiments, after solid solder 3000, matrix 2100, and base 2200 are heated, melted solid solder 3000, matrix 2100, and base 2200 may be incubated to enhance capillary action. The time to hold may be determined based on the size of the parts being brazed, for example, longer holding times may be used when the parts being brazed are larger. In some embodiments, the incubation time may be 35min to 70min.
At step 8300, melted solid solder 3000, substrate 2100, and base 2200 are cooled to form a connection between substrate 2100 and base 2200.
During the heating process of step 8200, interdiffusion of elements occurs between the melted solid solder 3000 and the substrate 2100 and between the melted solid solder 3000 and the base 2200, and during the cooling process of step 8300, the melted solid solder 3000 gradually solidifies again, so that the substrate 2100 and the base 2200 are stably connected.
In some embodiments, cooling the melted solid solder 3000, the substrate 2100, and the base 2200 may be accomplished by air cooling the three.
While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations to the present disclosure may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this specification, and therefore, such modifications, improvements, and modifications are intended to be included within the spirit and scope of the exemplary embodiments of the present invention.
Meanwhile, the specification uses specific words to describe the embodiments of the specification. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the present description. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the present description may be combined as suitable.
Likewise, it should be noted that in order to simplify the presentation disclosed in this specification and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure does not imply that the subject matter of the present description requires more features than are set forth in the claims. Indeed, less than all of the features of a single embodiment disclosed above.
In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments are modified in some examples by the modifier "about," approximately, "or" substantially. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the number allows for a 20% variation. Accordingly, in some embodiments, numerical parameters set forth in the specification and claims are approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and parameters set forth herein are approximations that may be employed in some embodiments to confirm the breadth of the range, in particular embodiments, the setting of such numerical values is as precise as possible.
Each patent, patent application publication, and other material, such as articles, books, specifications, publications, documents, etc., referred to in this specification is incorporated herein by reference in its entirety. Except for application history documents that are inconsistent or conflicting with the content of this specification, documents that are currently or later attached to this specification in which the broadest scope of the claims to this specification is limited are also. It is noted that, if the description, definition, and/or use of a term in an attached material in this specification does not conform to or conflict with what is described in this specification, the description, definition, and/or use of the term in this specification controls.
Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments of this specification. Other variations are possible within the scope of this description. Thus, by way of example, and not limitation, alternative configurations of embodiments of the present specification may be considered as consistent with the teachings of the present specification. Accordingly, the embodiments of the present specification are not limited to only the embodiments explicitly described and depicted in the present specification.
Claims (13)
1. An anode target disk for an X-ray tube, comprising a base (2100) and a pedestal (2200); a connection reinforcing surface (2300) is provided on the base (2200) or on the base body (2100);
The connection enhancing surface (2300) includes a first grooved region (2310) and a plurality of solder placement regions (2350), the plurality of solder placement regions (2350) for placing solid solder (3000); the solder placement areas (2350) are arranged at intervals along the circumferential direction of the anode target disk (2000), and the first grooving area (2310) is arranged between two adjacent solder placement areas (2350); the plurality of solder placement areas (2350) have smooth surfaces;
A plurality of first grooves (2311) are formed in the first groove region (2310), and the plurality of first grooves (2311) extend along the circumferential direction of the anode target disc (2000); -said base (2100) and said base (2200) being connected by means of said solid solder (3000);
The first notch area (2310) generates capillary action on the solid solder (3000) melted in the solder placement area (2350), the melted solid solder (3000) flows along the first notch (2311), and gas in the first notch (2311) is gradually discharged in the flowing process.
2. Anode target disk according to claim 1, characterized in that a through-hole (2400) is provided in the base (2200) and/or in the base body (2100), and that the opening (2410) of the through-hole is located on the connection-enhancing surface (2300).
3. The anode target disk of claim 2, wherein the first grooved region (2310) and the plurality of solder placement regions (2350) are arranged as an annular region having a center coincident with a center of the connection enhancement face (2300), the annular region being disposed around the opening (2410).
4. The anode target disk of claim 3, further comprising a dam structure disposed along an edge of the opening (2410) and/or along an outer edge of the connection enhancement face (2300).
5. The anode target disk of claim 3, wherein the connection enhancement surface (2300) further comprises a second grooved region (2320); the second grooving region (2320) is annular, and a plurality of second grooving (2321) are arranged on the second grooving region (2320); at least one second score groove (2321) of the plurality of second score grooves (2321) is annular and extends along the circumference of the second score groove region (2320);
the second grooved region (2320) is disposed around the annular region.
6. The anode target disk of claim 2, wherein the connection enhancement face (2300) further comprises a third grooved region (2330); the third grooving region (2330) is annular, and a plurality of third grooving (2331) are arranged on the third grooving region (2330); at least one third score (2331) of the plurality of third score (2331) is annular and extends circumferentially of the third score zone (2330);
The first grooved region (2310) and the plurality of solder placement regions (2350) are arranged as an annular region, the center of which coincides with the center of the connection enhancing surface (2300); the third grooved region (2330) is disposed around the opening (2410), and the annular region is disposed around the third grooved region (2330).
7. The anode target disk of claim 6, further comprising a fourth grooved region (2340), the fourth grooved region (2340) being annular; a plurality of fourth grooves (2341) are formed in the fourth groove region (2340); at least one fourth score groove (2341) of the plurality of fourth score grooves (2341) is annular and extends along the circumference of the fourth score groove region (2340);
the fourth grooved region (2340) is disposed around the annular region.
8. The anode target disk of claim 7, wherein a total area of the first grooved region (2310), the third grooved region (2330) and the fourth grooved region (2340) is greater than or equal to 40% of an area of the connection-enhancing surface (2300).
9. The anode target disk of any of claims 1-8, wherein at least two solder placement areas (2350) of the plurality of solder placement areas (2350) are equal in area.
10. The anode target disk of any of claims 1-8, wherein a plurality of said solder placement areas (2350) are equally spaced along the circumference of the anode target disk (2000).
11. The anode target disk according to any one of claims 1 to 8, wherein the connection enhancing surface (2300) is circular; at least one solder placing area (2350) in the plurality of solder placing areas (2350) is in a fan shape, and the circle center of the fan shape is coincident with the circle center of the connection enhancing surface (2300).
12. An X-ray tube, characterized by comprising an anode target disk (2000) according to any of claims 1-11.
13. A method of manufacturing an anode target disk, characterized by being used for manufacturing an anode target disk (2000) according to any one of claims 1-11;
the manufacturing method comprises the following steps:
-placing solid solder (3000) in the solder placement region (2350) of the anode target disk (2000);
Heating the solid solder (3000), the base (2100), and the base (2200) such that the solid solder (3000) melts; wherein the melted solid solder (3000) flows to the first score groove region (2310) and along the plurality of first score grooves (2311) to connect the base body (2100) and the base (2200).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110962222.1A CN113594011B (en) | 2021-08-20 | 2021-08-20 | Anode target disk for X-ray tube, method of manufacturing the same, and X-ray tube |
| US17/821,183 US20230059451A1 (en) | 2021-08-20 | 2022-08-21 | Brazing structure, brazing method, and x-ray tube |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110962222.1A CN113594011B (en) | 2021-08-20 | 2021-08-20 | Anode target disk for X-ray tube, method of manufacturing the same, and X-ray tube |
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| CN113594011A CN113594011A (en) | 2021-11-02 |
| CN113594011B true CN113594011B (en) | 2024-08-02 |
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| CN208548335U (en) * | 2018-07-25 | 2019-02-26 | 思柯拉特医疗科技（苏州）有限公司 | A kind of high heat dissipation medical X-ray tube of internal cooling ball bearing |
| CN208551254U (en) * | 2017-12-22 | 2019-03-01 | 广东美的生活电器制造有限公司 | Heat-conducting plate, heat-generating disc and heating vessel |
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| JP3410220B2 (en) * | 1994-07-22 | 2003-05-26 | 株式会社不二工機 | Electric flow control valve |
| AU2003268462A1 (en) * | 2002-09-03 | 2004-03-29 | Parker Medical, Inc. | Multiple grooved x-ray generator |
| JP2004292233A (en) * | 2003-03-26 | 2004-10-21 | Matsushita Electric Works Ltd | Brazing method of ceramics and metal |
| JP2010244712A (en) * | 2009-04-01 | 2010-10-28 | Toshiba Hokuto Electronics Corp | Magnetron |
| CN204946855U (en) * | 2015-08-18 | 2016-01-06 | 上海宏精医疗器械有限公司 | A kind of New X ray tube rotating anode arrangement |
| CN110556278A (en) * | 2019-08-14 | 2019-12-10 | 安泰天龙钨钼科技有限公司 | Rotary anode target for X-ray tube, preparation method and target assembly |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005174989A (en) * | 2003-12-08 | 2005-06-30 | Meidensha Corp | Vacuum capacitor |
| CN208551254U (en) * | 2017-12-22 | 2019-03-01 | 广东美的生活电器制造有限公司 | Heat-conducting plate, heat-generating disc and heating vessel |
| CN208548335U (en) * | 2018-07-25 | 2019-02-26 | 思柯拉特医疗科技（苏州）有限公司 | A kind of high heat dissipation medical X-ray tube of internal cooling ball bearing |
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