CN113582702A - Aluminum nitride ceramic composite material for electronic packaging and preparation method thereof - Google Patents
Aluminum nitride ceramic composite material for electronic packaging and preparation method thereof Download PDFInfo
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Abstract
The invention discloses an aluminum nitride ceramic composite material for electronic packaging and a preparation method, belonging to the technical field of composite materials for electronic packaging, and comprising the following steps: the preparation method comprises the steps of mixing aluminum nitride powder, aluminum oxide powder and nitriding jumping powder, adding absolute ethyl alcohol into the mixed powder, grinding and heating to obtain mixed slurry, wherein the grinding time is 20-30min, drying the mixed slurry in a dryer, grinding a block obtained after drying into powder, adding a sintering aid, an adhesive and a plasticizer to obtain a mixed material, adding the mixed material into a sintering furnace, introducing nitrogen into the sintering furnace for high-temperature sintering, and matching the aluminum nitride with the aluminum oxide and the nitriding jumping to generate a residual stress field due to thermal expansion mismatch, so that the thermal conductivity of the ceramic composite material is improved, the toughness of the ceramic composite material is enhanced, and the strength of the ceramic composite material is effectively improved.
Description
Technical Field
The invention relates to the technical field of aluminum nitride ceramic composite materials, in particular to an aluminum nitride ceramic composite material for electronic packaging and a preparation method thereof.
Background
As integrated circuits become the strategic industry in the country, many semiconductor materials have been researched and developed, and aluminum nitride is undoubtedly one of the most promising semiconductor materials. In recent years, many enterprises have recognized that aluminum nitride is a research hotspot and a market hotspot, and the aluminum nitride is a ceramic material with excellent comprehensive performance, and the research dates back to over a hundred years, the aluminum nitride is discovered by f.berger and a.geuhter in 1862, and is synthesized for the first time by j.w.mallets in 1877, but there is no practical application for more than 100 years later, and the aluminum nitride is only used as a nitrogen fixing agent as a fertilizer. Because aluminum nitride is a covalent compound, the aluminum nitride is difficult to sinter due to small self-diffusion coefficient and high melting point, and the aluminum nitride ceramic cannot be successfully prepared for the first time by people until the 50 th century of 20 th, and can be used as a refractory material for smelting pure iron, aluminum and aluminum alloy. Since the 70 s of the 20 th century, along with the continuous and deep research, the preparation process of the aluminum nitride is mature day by day, and the application range of the aluminum nitride is expanded continuously. Especially, since the 21 st century, with the rapid development of microelectronic technology, electronic complete machines and electronic components are developing in the direction of miniaturization, lightening, integration, high reliability, high power output and the like, and more complex devices put higher demands on heat dissipation of substrates and packaging materials, thereby further promoting the vigorous development of the aluminum nitride industry.
The aluminum nitride ceramic composite material is widely used for electronic packaging, and the existing aluminum nitride ceramic composite material has poor physical properties, is easy to damage and has a short service life.
Disclosure of Invention
The invention aims to provide an aluminum nitride ceramic composite material for electronic packaging and a preparation method thereof, so as to solve the problems of easy damage and short service life caused by poor physical properties of the conventional aluminum nitride ceramic composite material in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: an aluminum nitride ceramic composite material for electronic packaging is prepared from the following raw materials in parts by weight:
88-94 parts of aluminum nitride, 13-15 parts of aluminum oxide, 8-12 parts of azotized sodium carbonate, 3-5 parts of sintering aid, 2-4 parts of adhesive and 1-3 parts of plasticizer.
Preferably, the aluminum nitride ceramic raw material for electronic packaging is prepared from the following components in parts by weight:
88 parts of aluminum nitride, 13 parts of aluminum oxide, 8 parts of nitriding bungee, 3 parts of sintering aid, 2 parts of adhesive and 1 part of plasticizer.
Preferably, the aluminum nitride ceramic raw material for electronic packaging is prepared from the following components in parts by weight:
91 parts of aluminum nitride, 14 parts of aluminum oxide, 10 parts of nitriding bungee, 4 parts of sintering aid, 3 parts of adhesive and 2 parts of plasticizer.
Preferably, the aluminum nitride ceramic raw material for electronic packaging is prepared from the following components in parts by weight:
94 parts of aluminum nitride, 15 parts of aluminum oxide, 12 parts of bunge nitride, 5 parts of sintering aid, 4 parts of adhesive and 3 parts of plasticizer.
Preferably, the sintering aid is calcium oxide, the adhesive is polyvinyl alcohol, and the plasticizer is diisooctyl phthalate.
A method for preparing an aluminum nitride ceramic composite material for electronic packaging comprises the following steps:
s1: grinding aluminum nitride, aluminum oxide and azotization into powder;
s2: mixing the aluminum nitride powder, the aluminum oxide powder and the nitrided trampoline powder obtained in step S1, adding absolute ethyl alcohol to the mixed powder, grinding and heating to obtain mixed slurry;
s3: putting the mixed slurry into a dryer for drying, then grinding the dried block into powder, and adding a sintering aid, an adhesive and a plasticizer to obtain a mixture;
s4: and (4) adding the mixture obtained in the step S3 into a sintering furnace, introducing nitrogen into the sintering furnace for high-temperature sintering, and cooling the mixture to obtain the aluminum nitride ceramic composite material.
Preferably, in the step S2, the grinding and the heating are performed simultaneously, the time is 20-30min, and the heating temperature is 50-60 ℃.
Preferably, in the step S4, the sintering temperature of the mixture material added into the sintering furnace is 1700-1800 ℃, the nitrogen flow pressure is 0.3-0.4MPa, and the sintering time is 4-6 h.
Compared with the prior art, the invention has the beneficial effects that:
1) by matching the aluminum nitride with the aluminum oxide and the aluminum nitride, a residual stress field is generated due to thermal expansion mismatch, the thermal conductivity of the aluminum nitride ceramic composite material is improved, the toughness of the aluminum nitride ceramic composite material is enhanced, the strength of the aluminum nitride ceramic composite material is effectively improved, the physical performance of the aluminum nitride ceramic composite material is improved, the damage probability of the aluminum nitride ceramic composite material is reduced, and the service life of the aluminum nitride ceramic composite material is prolonged;
2) the preparation method of the aluminum nitride ceramic composite material for electronic packaging has simple operation steps, is convenient to realize and is convenient for processing and manufacturing the aluminum nitride ceramic composite material.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like, indicate orientations or positional relationships for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The invention provides a technical scheme that: an aluminum nitride ceramic composite material for electronic packaging is prepared from the following raw materials in parts by weight:
88-94 parts of aluminum nitride, 13-15 parts of aluminum oxide, 8-12 parts of azotized sodium carbonate, 3-5 parts of sintering aid, 2-4 parts of adhesive and 1-3 parts of plasticizer.
The sintering aid is calcium oxide, the adhesive is polyvinyl alcohol, and the plasticizer is diisooctyl phthalate.
A method for preparing an aluminum nitride ceramic composite material for electronic packaging comprises the following steps:
s1: grinding aluminum nitride, aluminum oxide and azotization into powder;
s2: mixing the aluminum nitride powder, the aluminum oxide powder and the nitrided trampoline powder obtained in step S1, adding absolute ethyl alcohol to the mixed powder, grinding and heating to obtain mixed slurry;
s3: putting the mixed slurry into a dryer for drying, then grinding the dried block into powder, and adding a sintering aid, an adhesive and a plasticizer to obtain a mixture;
s4: and (4) adding the mixture obtained in the step S3 into a sintering furnace, introducing nitrogen into the sintering furnace for high-temperature sintering, and cooling the mixture to obtain the aluminum nitride ceramic composite material.
In the step S2, grinding and heating are carried out simultaneously, the time is 20-30min, and the heating temperature is 50-60 ℃.
In the step S4, the sintering temperature of the mixture added into the sintering furnace is 1700-1800 ℃, the nitrogen flow pressure is 0.3-0.4MPa, and the sintering time is 4-6 h.
Example 1:
taking 88g of aluminum nitride, 13g of aluminum oxide, 8g of bunge nitride, 3g of sintering aid, 2g of adhesive and 1g of plasticizer, grinding the aluminum nitride, the aluminum oxide and the bunge nitride into powder, mixing the obtained aluminum nitride powder, aluminum oxide powder and bunge nitride powder, adding absolute ethyl alcohol into the mixed powder, grinding and heating the mixed powder and the absolute ethyl alcohol at a mass ratio of 3: 1, grinding and heating the mixture for 30min at 50 ℃ to obtain mixed slurry, drying the mixed slurry in a dryer, grinding the dried block into powder, adding the sintering aid, the adhesive and the plasticizer into the mixed powder, adding the mixed material into a sintering furnace, introducing nitrogen into the sintering furnace for high-temperature sintering, adding the mixed material into the sintering furnace at a sintering temperature of 1800 ℃ and under a nitrogen flow pressure of 0.4MPa, the sintering time is 6h, and the aluminum nitride ceramic composite material is cooled.
Example 2:
taking 91g of aluminum nitride, 14g of aluminum oxide, 10g of bunge nitride, 4g of sintering aid, 3g of adhesive and 2g of plasticizer, grinding the aluminum nitride, the aluminum oxide and the bunge nitride into powder, mixing the obtained aluminum nitride powder, aluminum oxide powder and bunge nitride powder, adding absolute ethyl alcohol into the mixed powder, grinding and heating the mixed powder and the absolute ethyl alcohol at a mass ratio of 3: 1, grinding and heating the mixture for 30min at 50 ℃ to obtain mixed slurry, drying the mixed slurry in a dryer, grinding the dried block into powder, adding the sintering aid, the adhesive and the plasticizer into the mixed powder, adding the mixed material into a sintering furnace, introducing nitrogen into the sintering furnace for high-temperature sintering, adding the mixed material into the sintering furnace at a sintering temperature of 1800 ℃ and under a nitrogen flow pressure of 0.4MPa, the sintering time is 6h, and the aluminum nitride ceramic composite material is cooled.
Example 3:
taking 94g of aluminum nitride, 15g of aluminum oxide, 12g of bunge nitride, 5g of sintering aid, 4g of adhesive and 3g of plasticizer, grinding the aluminum nitride, the aluminum oxide and the bunge nitride into powder, mixing the obtained aluminum nitride powder, aluminum oxide powder and bunge nitride powder, adding absolute ethyl alcohol into the mixed powder, grinding and heating the mixed powder and the absolute ethyl alcohol at a mass ratio of 3: 1, grinding and heating at the same time for 30min at a heating temperature of 50 ℃ to obtain mixed slurry, drying the mixed slurry in a dryer, grinding the dried block into powder, adding the sintering aid, the adhesive and the plasticizer into the mixed material, adding nitrogen into a sintering furnace for high-temperature sintering, adding the mixed material into the sintering furnace at a sintering temperature of 1800 ℃ and under a nitrogen flow pressure of 0.4MPa, the sintering time is 6h, and the aluminum nitride ceramic composite material is cooled.
The specific parameters of the final aluminum nitride ceramic composite material obtained in examples 1-3 are as follows:
the aluminum nitride is matched with the aluminum oxide and the aluminum nitride, and a residual stress field is generated due to thermal expansion mismatch, so that the thermal conductivity of the aluminum nitride ceramic composite material is improved, the toughness of the aluminum nitride ceramic composite material is enhanced, and the strength of the aluminum nitride ceramic composite material is effectively improved, so that the physical property of the aluminum nitride ceramic composite material is improved, the damage probability of the aluminum nitride ceramic composite material is reduced, and the service life of the aluminum nitride ceramic composite material is prolonged.
While there have been shown and described the fundamental principles and essential features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. An aluminum nitride ceramic composite material for electronic packaging is characterized in that: the aluminum nitride ceramic raw material for electronic packaging is prepared from the following components in parts by weight:
88-94 parts of aluminum nitride, 13-15 parts of aluminum oxide, 8-12 parts of azotized sodium carbonate, 3-5 parts of sintering aid, 2-4 parts of adhesive and 1-3 parts of plasticizer.
2. The aluminum nitride ceramic composite material for electronic packaging according to claim 1, wherein: the aluminum nitride ceramic raw material for electronic packaging is prepared from the following components in parts by weight:
88 parts of aluminum nitride, 13 parts of aluminum oxide, 8 parts of nitriding bungee, 3 parts of sintering aid, 2 parts of adhesive and 1 part of plasticizer.
3. The aluminum nitride ceramic composite material for electronic packaging according to claim 1, wherein: the aluminum nitride ceramic raw material for electronic packaging is prepared from the following components in parts by weight:
91 parts of aluminum nitride, 14 parts of aluminum oxide, 10 parts of nitriding bungee, 4 parts of sintering aid, 3 parts of adhesive and 2 parts of plasticizer.
4. The aluminum nitride ceramic composite material for electronic packaging according to claim 1, wherein: the aluminum nitride ceramic raw material for electronic packaging is prepared from the following components in parts by weight:
94 parts of aluminum nitride, 15 parts of aluminum oxide, 12 parts of bunge nitride, 5 parts of sintering aid, 4 parts of adhesive and 3 parts of plasticizer.
5. The aluminum nitride ceramic composite material for electronic packaging according to claim 1, wherein: the sintering aid is calcium oxide, the adhesive is polyvinyl alcohol, and the plasticizer is diisooctyl phthalate.
6. A method for preparing the aluminum nitride ceramic composite material for electronic packaging according to any one of claims 1 to 5, wherein: the method comprises the following steps:
s1: grinding aluminum nitride, aluminum oxide and azotization into powder;
s2: mixing the aluminum nitride powder, the aluminum oxide powder and the nitrided trampoline powder obtained in step S1, adding absolute ethyl alcohol to the mixed powder, grinding and heating to obtain mixed slurry;
s3: putting the mixed slurry into a dryer for drying, then grinding the dried block into powder, and adding a sintering aid, an adhesive and a plasticizer to obtain a mixture;
s4: and (4) adding the mixture obtained in the step S3 into a sintering furnace, introducing nitrogen into the sintering furnace for high-temperature sintering, and cooling the mixture to obtain the aluminum nitride ceramic composite material.
7. The method of manufacturing an aluminum nitride ceramic composite material for electronic packaging according to claim 6, wherein: in the step S2, grinding and heating are carried out simultaneously, the time is 20-30min, and the heating temperature is 50-60 ℃.
8. The method of manufacturing an aluminum nitride ceramic composite material for electronic packaging according to claim 6, wherein: in the step S4, the sintering temperature of the mixture added into the sintering furnace is 1700-1800 ℃, the nitrogen flow pressure is 0.3-0.4MPa, and the sintering time is 4-6 h.
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| CN110372392A (en) * | 2019-07-02 | 2019-10-25 | 无锡元核芯微电子有限责任公司 | A kind of sintering method of ceramic substrate |
| CN112456981A (en) * | 2020-12-10 | 2021-03-09 | 山东鹏程陶瓷新材料科技有限公司 | Al (aluminum)2O3-BN complex phase ceramic and preparation method thereof |
| CN112939607A (en) * | 2021-02-05 | 2021-06-11 | 福建华清电子材料科技有限公司 | High-thermal-conductivity aluminum nitride ceramic and preparation method thereof |
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2021
- 2021-08-12 CN CN202110951958.9A patent/CN113582702A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5688450A (en) * | 1994-12-21 | 1997-11-18 | Hughes Aircraft Company | Method of making an electronic package structure utilizing aluminum nitride/aluminum composite material |
| CN103819196A (en) * | 2013-12-30 | 2014-05-28 | 莱鼎电子材料科技有限公司 | Modified aluminum nitride ceramic substrate and production method thereof |
| CN104402480A (en) * | 2014-10-30 | 2015-03-11 | 苏州莱特复合材料有限公司 | Aluminum nitride ceramic composite material and preparation method thereof |
| CN105948759A (en) * | 2016-06-08 | 2016-09-21 | 山东鹏程陶瓷新材料科技有限公司 | Aluminum nitride ceramic substrate prepared through vacuum hot-pressing sintering method and preparation method of aluminum nitride ceramic substrate |
| CN106938935A (en) * | 2017-04-26 | 2017-07-11 | 南通博泰美术图案设计有限公司 | Modified aluminium nitride ceramic substrate and its production method |
| CN107311666A (en) * | 2017-05-23 | 2017-11-03 | 福建华清电子材料科技有限公司 | The shaping of low-temperature co-fired ceramic substrate and sintering method |
| CN110372392A (en) * | 2019-07-02 | 2019-10-25 | 无锡元核芯微电子有限责任公司 | A kind of sintering method of ceramic substrate |
| CN112456981A (en) * | 2020-12-10 | 2021-03-09 | 山东鹏程陶瓷新材料科技有限公司 | Al (aluminum)2O3-BN complex phase ceramic and preparation method thereof |
| CN112939607A (en) * | 2021-02-05 | 2021-06-11 | 福建华清电子材料科技有限公司 | High-thermal-conductivity aluminum nitride ceramic and preparation method thereof |
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