CN113573481A - All-organic transparent flexible printed circuit and preparation method thereof - Google Patents
All-organic transparent flexible printed circuit and preparation method thereof Download PDFInfo
- Publication number
- CN113573481A CN113573481A CN202110832124.6A CN202110832124A CN113573481A CN 113573481 A CN113573481 A CN 113573481A CN 202110832124 A CN202110832124 A CN 202110832124A CN 113573481 A CN113573481 A CN 113573481A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- flexible printed
- organic transparent
- transparent flexible
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 22
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 19
- 239000007864 aqueous solution Substances 0.000 claims abstract description 15
- 238000005530 etching Methods 0.000 claims abstract description 10
- -1 polydimethylsiloxane Polymers 0.000 claims description 22
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 13
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 13
- 239000000243 solution Substances 0.000 claims description 13
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 12
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N dimethyl sulfoxide Natural products CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 12
- 238000003698 laser cutting Methods 0.000 claims description 12
- 239000002033 PVDF binder Substances 0.000 claims description 11
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 11
- 239000002322 conducting polymer Substances 0.000 claims description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 7
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 6
- 239000001569 carbon dioxide Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 5
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 claims description 4
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 4
- 239000013307 optical fiber Substances 0.000 claims description 4
- 239000000600 sorbitol Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 2
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical group [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 claims description 2
- 239000003431 cross linking reagent Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000011161 development Methods 0.000 abstract description 7
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 230000010354 integration Effects 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract description 3
- 239000003344 environmental pollutant Substances 0.000 abstract description 3
- 238000002834 transmittance Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000005265 energy consumption Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000002912 waste gas Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000002351 wastewater Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229960002796 polystyrene sulfonate Drugs 0.000 description 1
- 239000011970 polystyrene sulfonate Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000000233 ultraviolet lithography Methods 0.000 description 1
- 238000001392 ultraviolet--visible--near infrared spectroscopy Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Abstract
The invention discloses a full organic transparent flexible printed circuit and a preparation method thereof, wherein the preparation method comprises the following steps: preparing a mask or a mask, then carrying out vacuum ultraviolet light etching by the mask method or the mask method to obtain the flexible printed circuit substrate etched with the printed circuit, selectively depositing by a water-soluble conductive polymer aqueous solution, and roasting under an infrared lamp to obtain the all-organic transparent flexible printed circuit. The invention utilizes the conductive polymer with good light transmission to prepare the all-organic transparent flexible printed circuit, and effectively solves the problems that the prior art can not meet the requirements of development of a flexible transparent device with high integration level, generates a large amount of environmental pollutants, consumes high energy and the like.
Description
Technical Field
The invention belongs to the technical field of printed circuit preparation, and particularly relates to a full-organic transparent flexible printed circuit and a preparation method thereof.
Background
A Flexible Printed Circuit (FPC), which is a printed Circuit board prepared based on a Flexible insulating substrate and having high integration, light weight, thin thickness, and good flexibility. Due to the characteristic that the flexible wearable electronic device can be bent and transferred freely in three-dimensional space, the flexible wearable electronic device is widely applied to the development of small microelectronic devices and flexible wearable electronic devices. However, with the vigorous development of the internet of things equipment and technology and the continuous expansion of the application field of the flexible electronic equipment, more detailed application requirements also put higher demands on the development of the flexible printed circuit technology. For example, the existing flexible printed circuit technology cannot meet the development of a flexible transparent device with high integration. In addition, the existing production process of the flexible printed circuit comprises the processes of electroplating, etching, gold and nickel deposition, surface treatment and the like, the process flow is complex, the energy consumption is high, and a large amount of waste acid, waste gas, waste water and the like which are harmful to the environment can be generated in the process. Therefore, it is urgent to develop a flexible printed circuit manufacturing technology that satisfies the emerging application field and is more environmentally friendly.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the all-organic transparent flexible printed circuit and the preparation method thereof, the all-organic transparent flexible printed circuit is prepared by using the conductive polymer with good light transmittance, and the problems that the development of a flexible transparent device with high integration level, the generation of a large amount of environmental pollutants, high energy consumption and the like cannot be met in the prior art are effectively solved.
In order to achieve the purpose, the technical scheme adopted by the invention for solving the technical problems is as follows: the preparation method of the all-organic transparent flexible printed circuit is provided, and comprises the following steps:
(1) the method comprises the steps of printing a flexible circuit to be printed on a substrate, cutting and hollowing the circuit to be printed through carbon dioxide laser cutting or optical fiber laser cutting, cleaning and airing to obtain a mask plate; or coating 1-10mL of polymer solution on a flexible printed circuit substrate, drying at 50-70 ℃ for 2-8h or vacuum curing at 70-90 ℃ for 1-3h, then printing a flexible circuit to be printed, milling and removing a mask of the circuit to be printed by carbon dioxide laser cutting or fiber laser cutting, cleaning and airing to obtain the flexible printed circuit substrate containing the pattern mask of the printed circuit;
(2) clamping the cleaned flexible printed circuit substrate between the mask obtained in the step (1) and the base plate, then irradiating for 1-3h under vacuum ultraviolet light with the wavelength of 185nm, and then removing the mask and the base plate to obtain the flexible printed circuit substrate etched with the printed circuit; or irradiating the flexible printed circuit substrate containing the printed circuit pattern mask obtained in the step (1) for 1-3h under vacuum ultraviolet light with the wavelength of 185nm, and then removing the mask to obtain the flexible printed circuit substrate etched with the printed circuit;
(3) and (3) dipping the flexible printed circuit substrate etched with the printed circuit obtained in the step (2) in a water-soluble conducting polymer aqueous solution, or dropwise adding the water-soluble conducting polymer aqueous solution to the vacuum ultraviolet light etching area of the flexible printed circuit substrate etched with the printed circuit obtained in the step (2), and then roasting the flexible printed circuit substrate under a 1300nm infrared lamp for 5-10min to obtain the all-organic transparent flexible printed circuit.
Further, the method also comprises the following steps: (4) and (4) coating and curing the polydimethylsiloxane layer on the all-organic transparent flexible printed circuit obtained in the step (3), and repeating the steps (2) to (3) to obtain the multilayer all-organic transparent flexible printed circuit.
Further, in the step (1), the substrate is a metal plate, a hard plastic plate or a glass sheet.
Further, the metal plate is aluminum, copper, iron, nickel, cobalt and common alloys thereof, and the hard plastic plate is polystyrene, polyethylene, polypropylene, polymethyl methacrylate, polycarbonate, nylon, polydimethylsiloxane and the like.
Further, in the step (1), when the optical fiber is cut by laser, the light source type is 1064nm infrared laser, 532nm green laser or 355nm ultraviolet laser.
In the step (1), the polymer solution is coated on the flexible printed circuit substrate by blade coating, the gap of the blade is 100-.
Further, the polymer solution is a polyvinylidene fluoride system, a polyurethane system or a polydimethylsiloxane system.
Further, the polyvinylidene fluoride system is N-methyl pyrrolidone solution of polyvinylidene fluoride with the concentration of 8-12 wt%; the polyurethane system is N-methyl pyrrolidone solution of polyurethane with the concentration of 12-15 wt%; the polydimethylsiloxane system is polydimethylsiloxane and a cross-linking agent SYGARDTM184 in a mass ratio of 10: 1.
Further, selecting a polyvinylidene fluoride system or a polyurethane system, and drying at the temperature of 50-70 ℃ for 2-8 h; when a polydimethylsiloxane system is selected, vacuum curing is carried out for 1-3h at the temperature of 70-90 ℃.
Further, the flexible printed circuit board is polyimide, polymethyl methacrylate, polycarbonate, polydimethylsiloxane, or polyethylene terephthalate.
Further, in the step (3), the first component in the water-soluble conducting polymer aqueous solution is poly (3, 4-ethylenedioxythiophene) and poly (p-methyl benzene sulfonic acid) aqueous solution, and the concentration is 1-1.5 wt%; the second component is dimethyl sulfoxide, glycol, sorbitol or chloroplatinic acid, wherein the concentrations of the dimethyl sulfoxide, the glycol and the sorbitol are 1-5 wt%, and the concentration of the chloroplatinic acid is 0.02-0.04 mol/L.
The method comprises the steps of firstly preparing a mask or a mask, then carrying out vacuum ultraviolet light etching by the mask method or the mask method to obtain the flexible printed circuit substrate etched with the printed circuit, selectively depositing by a water-soluble conducting polymer aqueous solution, and roasting under an infrared lamp to obtain the all-organic transparent flexible printed circuit.
The all-organic transparent flexible printed circuit is prepared by the preparation method of the all-organic transparent flexible printed circuit.
In summary, the invention has the following advantages:
1. the invention uses conductive polymer with good light transmission to prepare all organic transparent flexible printed circuit, such as Poly 3, 4-ethylenedioxythiophene Poly (p-methyl-benzenesulfonic acid) (Poly (3, 4-ethylene dioxythiophene): Polystyrene sulfonate, PEDOT: PSS) to replace inorganic and metal materials in the prior flexible printed circuit technology to construct all organic transparent flexible printed circuit conductive path, uses Vacuum Ultraviolet (VUV) mask etching technology to construct flexible printed circuit conductive path with any structure in cooperation with water-soluble conductive polymer, and has simple preparation process, no waste water, waste gas and waste acid discharge in the whole course, and extremely low energy consumption, thereby effectively solving the problems that the development of high-integration flexible transparent device, large amount of environmental pollutants and high energy consumption can not be satisfied in the prior art.
2. Compared with the traditional flexible printed circuit preparation process flow, the all-organic transparent flexible printed circuit provided by the application does not generate any waste water, waste acid or waste gas in the preparation process, the zero emission of the preparation process is really realized, the whole process is simpler, and the energy consumption is extremely low.
3. The existing flexible printed circuit conductive path is made of precious metal, and is high in preparation cost and difficult to recover. Meanwhile, metal does not have light transmission, so that the existing flexible printed circuit does not have good light transmission capability, cannot be completely transparent and cannot be directly integrated into a flexible transparent electronic device. The materials used for drawing the flexible printed circuit conductive path in the application are all conductive polymers with excellent conductive property and good light transmission property, and meanwhile, the polymers are low in cost, free of biotoxicity and free of toxic and side effects on environment and organisms.
Drawings
FIG. 1 is a schematic diagram of a method for making an all-organic transparent flexible printed circuit;
FIG. 2 is a schematic view of a flexible printed circuit mask method vacuum UV lithography assembly;
FIG. 3 is a schematic diagram of a mask vacuum UV lithography assembly for flexible printed circuits;
FIG. 4 illustrates the adhesion of a transparent water-soluble conductive polymer to the surface of various flexible printed circuit boards;
FIG. 5 shows the hydrophilicity and hydrophobicity of the surface of a material of a polyethylene terephthalate substrate under different vacuum ultraviolet etching durations;
FIG. 6 shows the hydrophilicity and hydrophobicity of the surface of a polyimide substrate under different vacuum ultraviolet etching durations;
FIG. 7 shows the transmittance of different wavelengths of light for a transparent flexible printed circuit of flexible polymethyl methacrylate substrate.
Detailed Description
Example 1
An all-organic transparent flexible printed circuit, the preparation method comprises the following steps:
(1) the flexible circuit to be printed is printed on a copper substrate, the circuit to be printed is cut and hollowed out through carbon dioxide laser cutting, and the circuit to be printed is cleaned and dried to obtain a mask plate;
(2) clamping the cleaned flexible printed circuit substrate between the mask obtained in the step (1) and the bottom plate, then irradiating for 2h under vacuum ultraviolet light with the wavelength of 185nm, and then removing the mask and the bottom plate to obtain the flexible printed circuit substrate etched with the printed circuit;
(3) and (3) soaking the flexible printed circuit substrate etched with the printed circuit obtained in the step (2) in a water-soluble conducting polymer aqueous solution, and then roasting for 7min under a 1300nm infrared lamp to obtain the all-organic transparent flexible printed circuit. The first component in the water-soluble conducting polymer aqueous solution is poly 3, 4-ethylenedioxythiophene and poly-p-methyl benzene sulfonic acid aqueous solution, and the concentration is 1 wt%; the second component is dimethyl sulfoxide, wherein the concentration of the dimethyl sulfoxide is 2 wt%.
Example 2
An all-organic transparent flexible printed circuit, the preparation method comprises the following steps:
(1) coating 8mL of polymer solution on a flexible printed circuit substrate, drying at 60 ℃ for 6h, then printing a flexible circuit to be printed, milling and removing a mask of the circuit to be printed by carbon dioxide laser cutting or optical fiber laser cutting, cleaning and airing to obtain the flexible printed circuit substrate containing a printed circuit pattern mask; the polymer solution is a polyvinylidene fluoride system, and the polyvinylidene fluoride system is an N-methyl pyrrolidone solution of polyvinylidene fluoride with the concentration of 10 wt%;
(2) irradiating the flexible printed circuit substrate containing the printed circuit pattern mask obtained in the step (1) for 2 hours under vacuum ultraviolet light with the wavelength of 185nm, and then removing the mask to obtain the flexible printed circuit substrate etched with the printed circuit;
(3) and (3) dropwise adding the water-soluble conductive polymer water solution into the vacuum ultraviolet light etching area of the flexible printed circuit substrate etched with the printed circuit obtained in the step (2), and then placing the flexible printed circuit substrate under a 1300nm infrared lamp for roasting for 8min to obtain the all-organic transparent flexible printed circuit. The first component in the water-soluble conducting polymer aqueous solution is poly 3, 4-ethylenedioxythiophene and poly-p-methyl benzene sulfonic acid aqueous solution, and the concentration is 1.2 wt%; the second component is dimethyl sulfoxide, wherein the concentration of the dimethyl sulfoxide is 3 wt%.
Examples of the experiments
By adopting the preparation method (mask method) shown in example 1 of the present invention, 5 different all-organic transparent flexible printed circuits (five-contact printed circuits) were prepared according to table 1, wherein the schematic diagram of vacuum ultraviolet lithography thereof is shown in fig. 2, and the adhesion condition of the transparent water-soluble conductive polymer on the surface of the all-organic transparent flexible printed circuits obtained from different flexible printed circuit substrates is shown in fig. 4, wherein a is polyethylene terephthalate, and b is polyimide.
TABLE 1 statistical tables of the preparation
As can be seen from FIG. 4, both polymethyl methacrylate and polyethylene terephthalate can be used in the preparation of the all-organic transparent flexible printed circuit of the present invention.
Furthermore, the etching effect of vacuum ultraviolet on different flexible printed circuit substrates (polyethylene terephthalate and polyimide) is expressed by the water contact angle of the substrate surface at different treatment times, as shown in fig. 5 and 6, respectively. As can be seen from fig. 5 and 6, the hydrophilicity of all substrates improved dramatically with the processing time, and this characterization allows for optimal photolithography time data.
The light transmittance of the flexible printed circuit is characterized by using UV-Vis-NIR spectral data (see figure 7), and the result shows that under the condition that the substrate is polyethylene terephthalate and the thickness of the printed circuit is 3 mu m, the device still has 50% of light transmittance in a visible light wave band, the obtained all-organic flexible printed circuit has good light transmittance, and simultaneously, the thickness of the printed circuit layer is further reduced to obtain better light transmittance, while the light transmittance of the traditional flexible printed circuit taking metal as a conductive path is 0%.
While the present invention has been described in detail with reference to the illustrated embodiments, it should not be construed as limited to the scope of the present patent. Various modifications and changes may be made by those skilled in the art without inventive step within the scope of the appended claims.
Claims (10)
1. A preparation method of an all-organic transparent flexible printed circuit is characterized by comprising the following steps:
(1) the method comprises the steps of printing a flexible circuit to be printed on a substrate, cutting and hollowing the circuit to be printed through carbon dioxide laser cutting or optical fiber laser cutting, cleaning and airing to obtain a mask plate; or coating 1-10mL of polymer solution on a flexible printed circuit substrate, drying at 50-70 ℃ for 2-8h or vacuum curing at 70-90 ℃ for 1-3h, then printing a flexible circuit to be printed, milling and removing a mask of the circuit to be printed by carbon dioxide laser cutting or fiber laser cutting, cleaning and airing to obtain the flexible printed circuit substrate containing the pattern mask of the printed circuit;
(2) clamping the cleaned flexible printed circuit substrate between the mask obtained in the step (1) and the base plate, then irradiating for 1-3h under vacuum ultraviolet light with the wavelength of 185nm, and then removing the mask and the base plate to obtain the flexible printed circuit substrate etched with the printed circuit; or irradiating the flexible printed circuit substrate containing the printed circuit pattern mask obtained in the step (1) for 1-3h under vacuum ultraviolet light with the wavelength of 185nm, and then removing the mask to obtain the flexible printed circuit substrate etched with the printed circuit;
(3) and (3) dipping the flexible printed circuit substrate etched with the printed circuit obtained in the step (2) in a water-soluble conducting polymer aqueous solution, or dropwise adding the water-soluble conducting polymer aqueous solution to the vacuum ultraviolet light etching area of the flexible printed circuit substrate etched with the printed circuit obtained in the step (2), and then roasting the flexible printed circuit substrate under a 1300nm infrared lamp for 5-10min to obtain the all-organic transparent flexible printed circuit.
2. The method for preparing an all-organic transparent flexible printed circuit according to claim 1, further comprising the steps of: (4) and (4) coating and curing the polydimethylsiloxane layer on the all-organic transparent flexible printed circuit obtained in the step (3), and repeating the steps (2) to (3) to obtain the multilayer all-organic transparent flexible printed circuit.
3. The method for preparing an all-organic transparent flexible printed circuit according to claim 1, wherein in the step (1), the substrate is a metal plate, a rigid plastic plate or a glass sheet.
4. The method for preparing an all-organic transparent flexible printed circuit according to claim 1, wherein in the step (1), the light source is 1064nm infrared laser, 532nm green laser or 355nm ultraviolet laser during the fiber laser cutting.
5. The method of manufacturing an all-organic transparent flexible printed circuit according to claim 1, wherein the polymer solution is a polyvinylidene fluoride system, a polyurethane system or a polydimethylsiloxane system.
6. The method of manufacturing a fully organic transparent flexible printed circuit according to claim 5, wherein the polyvinylidene fluoride system is an N-methylpyrrolidone solution of polyvinylidene fluoride with a concentration of 8-12 wt%; the polyurethane system is an N-methyl pyrrolidone solution of polyurethane with the concentration of 12-15 wt%; the polydimethylsiloxane system is polydimethylsiloxane and a cross-linking agent SYGARDTM184 in a mass ratio of 10: 1.
7. The method for preparing an all-organic transparent flexible printed circuit according to claim 5, wherein, when a polyvinylidene fluoride system or a polyurethane system is selected, the drying treatment is carried out at a temperature of 50-70 ℃ for 2-8 h; when a polydimethylsiloxane system is selected, vacuum curing is carried out for 1-3h at the temperature of 70-90 ℃.
8. The method of claim 1, wherein the flexible printed circuit substrate is polyimide, polymethylmethacrylate, polycarbonate, polydimethylsiloxane or polyethylene terephthalate.
9. The method for preparing an all-organic transparent flexible printed circuit according to claim 1, wherein in the step (3), the first component in the aqueous solution of the water-soluble conductive polymer is poly 3, 4-ethylenedioxythiophene: poly (p-toluenesulfonate) aqueous solution with a concentration of 1 to 1.5 wt%; the second component is dimethyl sulfoxide, glycol, sorbitol or chloroplatinic acid, wherein the concentrations of the dimethyl sulfoxide, the glycol and the sorbitol are 1-5 wt%, and the concentration of the chloroplatinic acid is 0.02-0.04 mol/L.
10. An all-organic transparent flexible printed circuit manufactured by the method for manufacturing an all-organic transparent flexible printed circuit according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110832124.6A CN113573481A (en) | 2021-07-22 | 2021-07-22 | All-organic transparent flexible printed circuit and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110832124.6A CN113573481A (en) | 2021-07-22 | 2021-07-22 | All-organic transparent flexible printed circuit and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113573481A true CN113573481A (en) | 2021-10-29 |
Family
ID=78166414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110832124.6A Pending CN113573481A (en) | 2021-07-22 | 2021-07-22 | All-organic transparent flexible printed circuit and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113573481A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050048228A1 (en) * | 2003-08-26 | 2005-03-03 | Eastman Kodak Company | Patterning of electrically conductive layers by ink printing methods |
| CN105280840A (en) * | 2014-07-09 | 2016-01-27 | Tcl集团股份有限公司 | Flexible transparent electrode and manufacturing method thereof |
| CN108428495A (en) * | 2018-03-22 | 2018-08-21 | 中山大学 | A kind of touch screen transparent electrode print process preparation method of no etching technics |
| CN113054058A (en) * | 2021-03-16 | 2021-06-29 | 哈尔滨工业大学 | Ultraviolet lithography method for patterning and etching PEDOT (Poly ethylene glycol Ether-butyl ether) -PSS (Poly styrene) transparent electrode on flexible hydrophobic substrate |
| CN113077937A (en) * | 2021-03-25 | 2021-07-06 | 惠州深格光电科技有限公司 | Processing technology of flexible transparent conductive film |
-
2021
- 2021-07-22 CN CN202110832124.6A patent/CN113573481A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050048228A1 (en) * | 2003-08-26 | 2005-03-03 | Eastman Kodak Company | Patterning of electrically conductive layers by ink printing methods |
| CN105280840A (en) * | 2014-07-09 | 2016-01-27 | Tcl集团股份有限公司 | Flexible transparent electrode and manufacturing method thereof |
| CN108428495A (en) * | 2018-03-22 | 2018-08-21 | 中山大学 | A kind of touch screen transparent electrode print process preparation method of no etching technics |
| CN113054058A (en) * | 2021-03-16 | 2021-06-29 | 哈尔滨工业大学 | Ultraviolet lithography method for patterning and etching PEDOT (Poly ethylene glycol Ether-butyl ether) -PSS (Poly styrene) transparent electrode on flexible hydrophobic substrate |
| CN113077937A (en) * | 2021-03-25 | 2021-07-06 | 惠州深格光电科技有限公司 | Processing technology of flexible transparent conductive film |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6210781B1 (en) | Method for photoselective seeding and metallization of three-dimensional materials | |
| US7834274B2 (en) | Multi-layer printed circuit board and method for fabricating the same | |
| JP2008022002A (en) | Manufacturing method for printed-circuit board | |
| US10104771B1 (en) | Method for making a circuit board | |
| CN105960103B (en) | A kind of manufacturing method of PCB embedded type circuit | |
| CN101080146A (en) | A method for making L2 blind hole of high-density interconnection circuit board | |
| TW201224123A (en) | Polymer etchant and method of using same | |
| KR102315267B1 (en) | Method of forming a metal layer and method of manufacturing a substrate having such metal layer | |
| CN106993378A (en) | A kind of pcb board selective surface handling process | |
| KR20130030494A (en) | Plating pattern and method of manufacturing the same | |
| CN103260361B (en) | A kind of HDI outer-layer circuit negative film processing method | |
| WO2008005736A1 (en) | Flexible circuit | |
| CN113573481A (en) | All-organic transparent flexible printed circuit and preparation method thereof | |
| CN103338596A (en) | Manufacturing method of whole addition circuit board without photoresist | |
| US7754623B2 (en) | Apparatus for forming film hole | |
| CN103874339A (en) | Manufacturing method of teflon high-frequency circuit board | |
| KR20090103605A (en) | Method for manufacturing printed circuit board | |
| JP2007523255A (en) | Etched polycarbonate film | |
| Youn et al. | Selective Cu patterning on polyimide using UV surface treatment and electroless plating | |
| KR20060132380A (en) | Method of preparing pattern on circuit board and circuit board prepared by using the same | |
| CN105282989A (en) | Manufacturing method of windowed rigid-flex PCB | |
| JP5639465B2 (en) | Method for producing metal pattern | |
| KR102279623B1 (en) | Manufacturing Method of Flexible Circuit Board Using Master Mold with Fine Pattern | |
| KR100730294B1 (en) | Production method of photo lithography by self-assembling, the circuit by this method, and application of the circuit | |
| JP2011071406A (en) | Method of forming multistaged resin structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211029 |