CN113568483B - Radiating assembly and server - Google Patents
Radiating assembly and server Download PDFInfo
- Publication number
- CN113568483B CN113568483B CN202110843863.5A CN202110843863A CN113568483B CN 113568483 B CN113568483 B CN 113568483B CN 202110843863 A CN202110843863 A CN 202110843863A CN 113568483 B CN113568483 B CN 113568483B
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- heat
- soft board
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses a heat dissipation assembly, which comprises a soft board and a heat conduction piece, wherein the soft board surrounds the heat source piece and a main board, the soft board comprises a first soft board and a second soft board, the first soft board and the second soft board are arranged in a layered manner, and the heat conduction piece passes through the space between the first soft board and the second soft board. One part of the heat conducting member is in contact with the heat source member, and the other part is in direct contact with the heat sink. Because the heat conducting piece is in direct contact with the radiator, the heat resistance surface through which heat passes is less, so that the heat generated by the heat source piece can be timely transferred to the radiator, and the failure of the computing chip can be avoided. In addition, the layered arrangement of the soft board main body and the soft board cover body ensures that one part of the heat conducting piece is contacted with the heat source piece and the other part of the heat conducting piece is directly contacted with the radiator, the protection effect of the soft board on the computing chip is not affected, and the soft board main body and the soft board cover body enclose the computing chip inside and tightly enclose the computing chip, so that effective protection is formed. The invention also discloses a server.
Description
Technical Field
The present invention relates to the field of server heat dissipation, and more particularly, to a heat dissipation assembly and a server.
Background
In order to prevent the data in the computing chip from being stolen and leaked by illegal personnel, the computing chip can be wrapped by the FPC soft board, so that the computing chip is protected. The FPC flexible board is internally covered with encrypted conducting lines, when the lines are damaged by external force, the conducting lines can transmit signals to the computing chip, and the computing chip can automatically destroy internal confidential data, so that the function of preventing data leakage is achieved. Meanwhile, the conducting circuit inside the FPC soft board can transmit signals to the alarm, and the alarm can give an alarm.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a computing chip and a heat sink according to an embodiment of the prior art. The computing chip includes a PCB main board 100 and a heat source member 200. The FPC flexible board 500 is enclosed outside the PCB main board 100 and the heat source member 200. As can be seen from fig. 1, the FPC board 500 is in direct contact with the heat sink 600, the side of the FPC board 500 facing away from the heat sink 600 is provided with the heat conductive member 400, the side of the heat conductive member 400 facing away from the FPC board 500 is provided with the copper block 300, the copper block 300 is in direct contact with the heat source member 200, and the copper block 300 has a function of uniform temperature. The heat of the heat source member 200 is firstly transferred to the heat conductive member 400 through the copper block 300, then transferred to the FPC film 500 through the heat conductive member 400, and finally transferred to the heat sink 600 through the FPC film 500. Obviously, in the heat transfer process, the contact thermal resistance surface is more, and the thermal resistance coefficient is large, so that the heat transfer efficiency is reduced, and the heat of the PCB main board cannot be timely transferred into the radiator, so that the failure of the computing chip is likely to be caused.
Disclosure of Invention
The invention aims to reduce thermal resistance, improve heat transfer efficiency and avoid failure of a computing chip. In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides a radiating assembly, includes soft board and heat conduction spare, the soft board surrounds outside heat source spare and mainboard, the soft board includes first soft board and second soft board, first soft board with the second soft board is along follow the direction layering arrangement of heat source spare to radiator, the heat conduction spare is followed first soft board with pass between the second soft board, a part of heat conduction spare with heat source spare contact, another part with the radiator direct contact.
Preferably, one of the first flexible board and the second flexible board is a flexible board main body, the other one of the first flexible board and the second flexible board is a flexible board cover body, the flexible board main body is surrounded outside the heat source piece and the main board, the flexible board cover body, the heat conducting piece and the flexible board main body are sequentially arranged along the direction from the radiator to the heat source piece, the flexible board main body is provided with an opening, the flexible board cover body is opposite to the opening, the heat conducting piece is positioned between the flexible board cover body and the flexible board main body, one part of the heat conducting piece is in direct contact with the radiator, and the other part of the heat conducting piece is positioned in the opening and is in contact with the heat source piece.
Preferably, the flexible board main body is in communication connection with the main board through a first signal connector, and the flexible board cover body is in communication connection with the main board through a second signal connector.
Preferably, the soft board cover body has a flange facing the soft board main body, the flange is disposed around the opening, and the heat conductive member passes through the flange.
Preferably, a copper block is arranged on one surface of the soft board cover body facing the soft board main body, the copper block is opposite to the opening, one part of the heat conducting piece is embedded in the radiator, and the other part of the heat conducting piece is embedded in the copper block.
Preferably, the radiator is provided with a groove matched with the soft board cover body and the copper block.
Preferably, the soft board main body is glued on the radiator, and the soft board cover body is glued in the groove.
Preferably, the flexible board main body includes a main board and a sealing board, the sealing board is far away from the radiator relative to the main board, the main board has a folded edge bent towards the sealing board, and the sealing board is buckled on the folded edge so as to wrap the heat source component and the main board.
The invention also discloses a server, which comprises a heat dissipation assembly, wherein the heat dissipation assembly is any one of the heat dissipation assemblies.
From the above technical solution, it can be seen that the heat conducting member functions to transfer heat. One part of the heat conducting member is in contact with the heat source member, and the other part is in direct contact with the heat sink. Because the heat conducting piece is in direct contact with the radiator, the heat resistance surface through which heat passes is less, and the thermal resistance coefficient is smaller, so that the heat generated by the heat source piece can be timely transferred to the radiator, and the failure of the computing chip can be avoided.
In addition, the layered arrangement of the soft board main body and the soft board cover body ensures that one part of the heat conducting piece is contacted with the heat source piece and the other part of the heat conducting piece is directly contacted with the radiator, the protection effect of the soft board on the computing chip is not affected, the computing chip is surrounded by the soft board main body and the soft board cover body, and the surrounding is tighter, so that effective protection is formed.
Drawings
In order to more clearly illustrate the solution of the embodiments of the present invention, the following description will briefly explain the drawings needed to be used in the embodiments, it being evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a heat dissipating assembly according to an embodiment of the prior art;
FIG. 2 is a plan view of a flexible printed circuit board according to an embodiment of the prior art;
FIG. 3 is a schematic structural diagram of a heat dissipating assembly according to an embodiment of the present invention;
FIG. 4 is an enlarged view of a portion of the middle portion of the bottom portion of FIG. 3;
FIG. 5 is a plan view of the heat conducting member, the flexible board main body, and the radiator base plate from the view angle A-A in FIG. 3;
fig. 6 is a plan view of the heat conductive member, the flexible board main body, and the flexible board cover body in A-A direction of fig. 3.
Wherein 100 is a PCB main board, 200 is a heat source piece, 300 is a copper block, 400 is a heat conducting piece, 500 is an FPC soft board, 600 is a radiator and a tin through hole 700;
1 is a main board, 2 is a heat source piece, 3 is a heat conduction piece, 4 is a soft board main body, 5 is a soft board cover body, 6 is a second signal connector, 7 is a radiator, and 8 is a first signal connector.
Detailed Description
The invention discloses a heat radiation component which can reduce thermal resistance and improve heat transfer efficiency so as to avoid failure of a computing chip. The invention also discloses a server.
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
The invention discloses a heat dissipation assembly, which comprises a heat conduction member 3 and a flexible board. The computing chip specifically includes a heat source member 2 and a main board 1. The flexible board is typically an FPC flexible board, and the main board 1 is a PCB main board. The soft board surrounds outside the computing chip, namely surrounds outside the heat source component 2 and the main board 1, and protects the main board 1. The flexible board comprises a first flexible board and a second flexible board. The first and second flexible boards are layered in a direction from the heat source member to the heat sink. The heat conducting member 3 serves to transfer heat, and the heat conducting member 3 may be a heat pipe. The heat conductive member 3 passes between the first and second flexible boards. One part of the heat conductive member 3 is in contact with the heat source member 2, and the other part is in direct contact with the heat sink 7. Because the heat conducting piece 3 is in direct contact with the radiator 7, the heat passing through the heat resistance surface is less, and the heat resistance coefficient is smaller, so that the heat generated by the heat source piece 2 can be timely transferred to the radiator 7, and the failure of the computing chip can be avoided.
Referring to fig. 4 to 6, a specific arrangement of the flexible board and the heat conductive member 3 will be described as follows: one of the first flexible board and the second flexible board is a flexible board main body 4, and the other is a flexible board cover body 5. The flexible board main body 4 and the flexible board cover body 5 are arranged in layers. The flexible board main body 4 surrounds the computing chip, namely, the heat source member 2 and the main board 1. Along the direction of keeping away from radiator 7, arranged in proper order soft board lid 5, heat conduction spare 3, hose main part. The flexible board main body 4 and the flexible board cover 5 are not located in the same layer, but are layered, and the flexible board main body 4 is distant from the heat sink 7 with respect to the flexible board cover 5. The soft board main body 4 is provided with an opening, and the soft board cover body 5 faces the opening. The heat conductive member 3 is located between the flexible board cover 5 and the flexible board main body 4. The heat conductive member 3 extends in the lateral direction. A portion of the heat conductive member 3 is located between the flexible board body 4 and the heat sink 7, and the portion of the heat conductive member 3 is in direct contact with the heat sink 7. The other part of the heat conducting member 3 is located in the opening, and the heat source member 2 located in the hose body can be brought into contact with the heat conducting member 3 at the opening.
In fig. 5, there are two heat conducting members 3, and the right half of the left heat conducting member 3 is in direct contact with the heat sink 7, and the left half of the right heat conducting member 3 is in direct contact with the heat sink 7. In fig. 6, the right half of the left heat conductive member 3 is shielded by the flexible board body 4, i.e., the right half of the left heat conductive member 3 is located at the back of the flexible board body 4, in direct contact with the heat sink 7. The left half of the right heat conducting member 3 is shielded by the flexible board body 4, i.e., the left half of the right heat conducting member 3 is located at the back of the flexible board body 4 and is in direct contact with the heat sink 7.
The flexible board main body 4 and the flexible board cover 5 are arranged in layers, and the flexible board cover 5 is not fastened to the opening of the flexible board main body 4. The size of the hose cover 5 is slightly larger than the size of the opening. The soft board cover 5 can cover the opening if the soft board cover 5 is moved to the opening. By this arrangement, it is possible to secure a closed enclosure around the computing chip from the periphery, and thus it is possible to protect the computing chip from theft.
The flexible board main body 4 is in communication connection with the main board 1 through the first signal connector 8, and the flexible board cover body 5 is in communication connection with the main board 1 through the second signal connector 6. If the flexible board body 4 is damaged, the flexible board body 4 transmits a self-destruction instruction to the main board 1 through the first signal connector 8. If the flexible board cover 5 is damaged, the flexible board cover 5 sends a self-destruction instruction to the main board 1 through the second signal connector 6.
In order to improve the sealing performance of the computing chip surrounding, the invention also provides the following steps: the soft board cover 5 is turned over in a direction toward the soft board main body 4 or in a direction away from the heat sink 7. The flanging is characterized in that the flanging is arranged around the opening on the soft board main body 4, so that a gap between the soft board main body 4 and the soft board cover body 5 is plugged, the sealing performance for surrounding the computing chip is improved, and the protection effect of the soft board on the main board 1 is enhanced.
The invention also provides a copper block (not shown in the figure), the copper block is positioned between the soft board main body 4 and the soft board cover body 5, the copper block is arranged on the soft board cover body 5, the heat conducting piece 3 is embedded in the copper block, and the copper block and the heat conducting piece 3 are jointly contacted with the heat source piece 2. The copper block has the function of uniform temperature, and the surface area of the copper block is larger than that of the heat conducting piece 3, so that the copper block can transfer as much heat of the heat source piece 2 to the heat conducting piece 3 as possible, and the heat conducting piece 3 transfers the heat to the radiator 7.
A part of the heat conductive member 3 is embedded in the copper block, and the other part is embedded in the heat sink 7.
It should be noted that, since the thermal resistance at the opening of the flexible board main body 4 includes the copper block, the heat conducting member 3 and the flexible board cover 5, the thermal resistance at the opening of the flexible board is larger, and the other part of the heat conducting member 3 is directly contacted with the heat sink 7, and the thermal resistance is smaller, so after the heat source member 2 transfers the heat to the heat conducting member 3, the heat is transferred to both sides along the heat conducting member 3, and then is transferred to the heat sink 7, as shown in fig. 3.
Based on the consideration of the compact structure concept, the invention also makes the following design: grooves are arranged on the radiator 7, and the soft board cover body 5 and the copper block are positioned in the grooves. After the soft board cover 5 and the copper block are put into the groove, the surface of the copper block is flush with the surface of the radiator 7. The heat conducting member 3 is a flat member, and a part of the heat conducting member 3 is embedded in the copper block, and the other part is embedded in the radiator 7.
The soft board main body 4 specifically includes a main body board and a sealing board. The seal plate is remote from the heat sink relative to the body plate. The main body plate is provided with a folded edge which is folded towards the sealing plate, and the sealing plate is buckled on the folded edge, so that a box-packed structure is formed, and the heat source piece 2 and the main plate 1 are enclosed.
Referring to fig. 2, in the prior art, since the thermal resistance is relatively large, in order to improve the heat transfer efficiency, a plurality of solder vias are processed on the flexible board, and then solder is infiltrated into the solder vias, thereby increasing the thermal conductivity. But the processing of multiple via holes can complicate the processing process. In addition, since the flexible board is provided with a plurality of conductive circuits, the aperture of the solder passing hole is limited, so that the solder paste permeability cannot be ensured, and the heat transfer efficiency cannot be ensured.
Compared with the prior art, the heat conducting piece 3 is in direct contact with the radiator 7, so that the heat resistance in heat transfer is smaller, the heat transfer efficiency is higher, and therefore, the heat transfer efficiency is not increased by solder paste, and then, a solder hole is not required to be processed on the soft board, thereby greatly simplifying the processing procedure.
The invention also discloses a server, which comprises a heat dissipation assembly, and particularly, the heat dissipation assembly is any one of the heat dissipation assemblies. The heat dissipation assembly has the above effects, and the server having the heat dissipation assembly also has the above effects, so the description thereof is omitted.
The invention also discloses a heat dissipation method of the computing chip, which is characterized in that one part of the heat conduction piece 3 is contacted with the heat source piece 2, and the other part is directly contacted with the heat radiator 7. Therefore, the thermal resistance contact surface can be reduced, the thermal resistance coefficient is reduced, and the heat transfer efficiency is improved.
In order to enable the heat conductive member 3 to be in direct contact with the heat sink 7 while also ensuring the sealing of the soft board to the computing chip enclosure, the heat dissipation method in the present invention further includes: the flexible board is divided into a flexible board main body 4 and a flexible board cover body 5, the flexible board main body 4 is far away from the radiator 7 relative to the flexible board cover body 5, an opening is arranged on the flexible board main body 4, the flexible board cover body 5 is opposite to the opening, the heat conducting piece 3 is arranged between the flexible board main body 4 and the flexible board cover body 5, one part of the heat conducting piece 3 is in direct contact with the radiator 7, and the other part of the heat conducting piece is positioned in the opening and is in contact with the heat source piece 2.
In the invention, the soft board main body 4 and the soft board cover body 5 are arranged in a layered manner, so that not only is a part of the heat conducting piece 3 contacted with the heat source piece 2 and the other part of the heat conducting piece is directly contacted with the radiator 7, but also the protection effect of the soft board on the computing chip is not influenced, and the computing chip is enclosed inside by the soft board main body 4 and the soft board cover body 5, and the enclosed space is tighter, thereby forming effective protection.
Finally, it is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. The heat dissipation assembly comprises a soft board and a heat conduction piece, wherein the soft board is surrounded outside a heat source piece and a main board, and is characterized in that the soft board comprises a first soft board and a second soft board, the first soft board and the second soft board are layered along the direction from the heat source piece to a radiator, the heat conduction piece passes through the space between the first soft board and the second soft board, one part of the heat conduction piece is in contact with the heat source piece, and the other part of the heat conduction piece is in direct contact with the radiator;
one of the first soft board and the second soft board is a soft board main body, the other one of the first soft board and the second soft board is a soft board cover body, the soft board main body is surrounded outside the heat source piece and the main board, the soft board cover body, the heat conducting piece and the soft board main body are sequentially arranged along the direction from the radiator to the heat source piece, the soft board main body is provided with an opening, the soft board cover body is opposite to the opening, the heat conducting piece is positioned between the soft board cover body and the soft board main body, one part of the heat conducting piece is in direct contact with the radiator, and the other part of the heat conducting piece is positioned in the opening and is in contact with the heat source piece;
the soft board main body is in communication connection with the main board through a first signal connector, and the soft board cover body is in communication connection with the main board through a second signal connector.
2. The heat dissipating assembly of claim 1, wherein the flexible board cover has a flange facing the flexible board body, the flange being disposed around the opening, the heat conducting member passing through the flange.
3. The heat dissipating assembly of claim 1, wherein a copper block is disposed on a surface of the soft board cover facing the soft board main body, the copper block faces the opening, and a part of the heat conducting member is embedded in the heat sink, and another part of the heat conducting member is embedded in the copper block.
4. A heat dissipating assembly according to claim 3, wherein said heat sink is provided with grooves adapted to said flexible board cover and said copper block.
5. The heat dissipating assembly of claim 4, wherein said flexible board body is glued to said heat sink and said flexible board cover is glued within said recess.
6. The heat dissipating assembly of claim 1, wherein the flexible board body comprises a body plate and a sealing plate, the sealing plate being remote from the heat sink relative to the body plate, the body plate having a hem folded toward the sealing plate, the sealing plate being snap-fit over the hem to enclose the heat source and the motherboard.
7. A server comprising a heat sink assembly, wherein the heat sink assembly is as claimed in any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110843863.5A CN113568483B (en) | 2021-07-26 | 2021-07-26 | Radiating assembly and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110843863.5A CN113568483B (en) | 2021-07-26 | 2021-07-26 | Radiating assembly and server |
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| CN113568483A CN113568483A (en) | 2021-10-29 |
| CN113568483B true CN113568483B (en) | 2023-07-14 |
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| CN202110843863.5A Active CN113568483B (en) | 2021-07-26 | 2021-07-26 | Radiating assembly and server |
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| JPH07182069A (en) * | 1993-12-22 | 1995-07-21 | Hitachi Ltd | Cooling structure for electronic device |
| US5959839A (en) * | 1997-01-02 | 1999-09-28 | At&T Corp | Apparatus for heat removal using a flexible backplane |
| CN1819185A (en) * | 2004-09-03 | 2006-08-16 | 斯塔克特克集团有限公司 | Die module system and method |
| WO2016107133A1 (en) * | 2014-12-29 | 2016-07-07 | 中兴通讯股份有限公司 | Directly thermally conductive rigid-flexible combination circuit board |
| CN105990276A (en) * | 2015-03-06 | 2016-10-05 | 奕力科技股份有限公司 | Flexible substrate semiconductor packaging device with heat radiating structure |
| CN109887900A (en) * | 2019-03-08 | 2019-06-14 | 中国科学院微电子研究所 | Large size chip system packaging structure with Rigid Flex and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN206100746U (en) * | 2016-07-11 | 2017-04-12 | 嘉基电子科技(苏州)有限公司 | Heat radiator combined device |
| KR102483238B1 (en) * | 2016-08-01 | 2022-12-30 | 삼성전자 주식회사 | Heat dissipation apparatus and electronic device having the same |
| US11272639B2 (en) * | 2016-11-25 | 2022-03-08 | Huawei Technologies Co., Ltd. | Heat dissipation panel, heat dissipation apparatus, and electronic device |
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2021
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07182069A (en) * | 1993-12-22 | 1995-07-21 | Hitachi Ltd | Cooling structure for electronic device |
| US5959839A (en) * | 1997-01-02 | 1999-09-28 | At&T Corp | Apparatus for heat removal using a flexible backplane |
| CN1819185A (en) * | 2004-09-03 | 2006-08-16 | 斯塔克特克集团有限公司 | Die module system and method |
| WO2016107133A1 (en) * | 2014-12-29 | 2016-07-07 | 中兴通讯股份有限公司 | Directly thermally conductive rigid-flexible combination circuit board |
| CN105990276A (en) * | 2015-03-06 | 2016-10-05 | 奕力科技股份有限公司 | Flexible substrate semiconductor packaging device with heat radiating structure |
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| CN113568483A (en) | 2021-10-29 |
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