CN105990276A - Flexible substrate semiconductor packaging device with heat radiating structure - Google Patents
Flexible substrate semiconductor packaging device with heat radiating structure Download PDFInfo
- Publication number
- CN105990276A CN105990276A CN201510100164.6A CN201510100164A CN105990276A CN 105990276 A CN105990276 A CN 105990276A CN 201510100164 A CN201510100164 A CN 201510100164A CN 105990276 A CN105990276 A CN 105990276A
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- base plate
- radiator structure
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Abstract
The invention provides a flexible substrate semiconductor packaging device with a heat radiating structure. The flexible substrate semiconductor packaging device comprises a flexible substrate, a semiconductor element, a printed circuit board, and a heat conducting piece. The flexible substrate comprises an input end and a first line layer. The semiconductor element is arranged on the first line layer. The printed circuit board is adjacent to the input end of the flexible substrate and comprises a second line layer which is electrically connected to the first line layer. The heat conducting piece is arranged on the flexible substrate and comprises a main body part and a first extension part which extends outward from the main body part. The invention is characterized in that the printed circuit board also comprises a heat radiation piece which is in contact with the first extension part and is separated from the second line layer. The heat energy generated by the operation of the semiconductor element is transferred to the heat conducting piece, and thus the effect of cooling is achieved.
Description
Technical field
The present invention relates to a kind of flexible base plate semiconductor packages assembly, fit particularly to one
The flexible base plate semiconductor encapsulation device with radiator structure for display floater.
Background technology
As resolution ratio (Resolution) specification of liquid crystal display comes 4k HD (4k HD
For monitor resolution line call-out " specification, number of pixels is 3840x2160), and in order to realize
The stereoscopic visual effect of three dimensional display (Three Dimensions Display is called for short 3D), aobvious
Show that the pixel renewal frequency of device must be promoted to 120Hz from 60Hz, above-mentioned liquid crystal display
Technical progress, is all greatly improved integrated circuit (Integrated Circuits is called for short IC) driver
Driving load.Owing to heat energy can be converted electric energy to and becomes one during IC driver start
Individual pyrotoxin, when heat energy cannot be conducted to elsewhere and have been focused into same region,
I.e. producing so-called focus (Hot Spot), the IC driver being positioned at focus will be because of excessive temperature
And produce mistake start.
Refering to Fig. 1, existing a kind of flexible base plate semiconductor packages assembly 1 (reference China platform
Gulf patent of invention announces No. I441298), it is connected to a display floater 2 and a print
Between printed circuit board 3.
This flexible base plate semiconductor packages assembly 1 includes a piece of flexible substrate the 11st,
Be arranged at the IC driver of on this flexible substrate 11 the 12nd, one be arranged at this bendable base
Plate 11 and the heat-conducting piece 13 for aluminum, and a piece of rib being arranged on this heat-conducting piece 13
Part 14, this heat-conducting piece 13 is positioned between this IC driver 12 and this strengthening part 14.Should
Flexible substrate 11 includes in the input 111 being reversed and an output 112,
This input 111 is connected to this printed circuit board (PCB) 3, and this output 112 is connected to this display
On panel 2.
This display floater 2 includes the bottom surface 21 of a neighbouring back light unit, and a phase
Instead in this bottom surface 21 the pixel display front 22 can fitted for a piece of Polarizer, say at this
Bright, this back light unit and this Polarizer are all not shown in the figures, a frame unit 4
Can be by this flexible base plate semiconductor packages assembly the 1st, this display floater 2 and this back light unit
Become a liquid crystal display module in being assembled in metal framework in the lump.
Due to, the thermal energy conduction path of existing this kind of flexible base plate semiconductor packages assembly 1,
Heat energy can only be conducted to this flexible substrate through this heat-conducting piece 13 of aluminum from this pyrotoxin
The two ends of 11, therefore effectively heat radiation scope is limited only on this flexible substrate 11, and,
As the slim light-weighted demand of this liquid crystal display module promotes, allow and originally contact when assembling
The material of this frame unit 4 on this flexible base plate semiconductor packages assembly 1 is by originally
The aluminium alloy of heavier-weight is reelected with the reinforced plastic of lighter in weight, described herein, by force
Changing plastic cement is to be about the macromolecule epoxy resin (Epoxy) of 0.19W/mK as base with thermal conductivity factor
The composite of body, be about the aluminium of 237W/mK compared to thermal conductivity factor for, is less useful for
Thermal energy conduction, thus have hot(test)-spot temperature because heat energy accumulate and constantly raise and hot spot region from
The situation that local extends to full wafer flexible substrate 11 occurs, and operating ambient temperature is too high will lead
Cause this IC driver 12 to make a mistake start, so that this display floater 2 presents mistake
Display picture.
From the foregoing, it will be observed that existing this kind of flexible base plate semiconductor packages assembly 1, because heat radiation
Path and effective heat radiation scope are limited on this flexible substrate 11 so that integral heat sink face
Amass not enough and heat energy cannot be conducted to non-focus location from focus efficiently again, so
Cooling-down effect is limited.
Content of the invention
It is an object of the invention to provide one can increase effective area of dissipation, makes hot(test)-spot temperature
Decline thus allow IC driver can maintain the flexible base plate with radiator structure of normal start
Semiconductor encapsulation device.
The flexible base plate semiconductor encapsulation device with radiator structure of the present invention, comprises a piece of
Flexible substrate, semiconductor element, a printed circuit board (PCB), and a heat-conducting piece.
This flexible substrate include an input, two-layer in the insulating barrier being reversed, and
One layer of first line layer between described insulating barrier.
This semiconductor element is arranged on this first line layer.
This printed circuit board (PCB) adjacent to this input of this flexible substrate, including one layer with this
One line layer is in the second line layer of electrical connection.
This heat-conducting piece is arranged on this flexible substrate, including one is positioned at described insulating barrier
The wherein main part on a layer, and one from outward extending first extension of this main part.
This printed circuit board (PCB) also includes that one contacts simultaneously with this first extension of this heat-conducting piece
With this second line layer radiating piece separately.
The flexible base plate semiconductor encapsulation device with radiator structure of the present invention, this printing electricity
The material of this radiating piece of road plate has metal material.
The flexible base plate semiconductor encapsulation device with radiator structure of the present invention, this printing electricity
This radiating piece of road plate and the material of this heat-conducting piece all contain copper.
The flexible base plate semiconductor encapsulation device with radiator structure of the present invention, this printing electricity
This radiating piece of road plate and the material of this heat-conducting piece are respectively provided with carbon complex material.
The flexible base plate semiconductor encapsulation device with radiator structure of the present invention, this is bendable
The described insulating barrier of substrate wherein one layer be layer protective layer, another layer is one layer of supporting layer,
This first line layer has two difference not by this protective layer institute's coating and away from this input
Composition surface, this semiconductor element include an end face, four respectively with this end face be at an angle of
Linking lateral surface, and two respectively with this end face in the convex block that connects being reversed, described outside
Side is coated with one layer of adhesive-layer, and the described convex block that connects lays respectively at described composition surface.
The flexible base plate semiconductor encapsulation device with radiator structure of the present invention, this heat-conducting piece
Main part be arranged at this supporting layer and position and correspond to this semiconductor element.
The flexible base plate semiconductor encapsulation device with radiator structure of the present invention, this is bendable
Substrate also includes an output in contrast to this input, and it is defeated that this semiconductor element is positioned at this
Enter end with this output between, this heat-conducting piece also include one from this main part towards this output
The second extension that direction extends.
The flexible base plate semiconductor encapsulation device with radiator structure of the present invention, this heat-conducting piece
Main part be arranged at this protective layer and be positioned between this input and this semiconductor element.
The flexible base plate semiconductor encapsulation device with radiator structure of the present invention, this semiconductor
This end face of element is coated with one layer of adhesive layer, and this heat-conducting piece also includes one from this main part
Extend to the second extension on this adhesive layer towards this semiconductor element direction.
The flexible base plate semiconductor encapsulation device with radiator structure of the present invention, this is bendable
Substrate also includes an output in contrast to this input, and it is defeated that this semiconductor element is positioned at this
Entering between end and this output, this second extension of this heat-conducting piece is defeated towards this from this adhesive layer
Go out extreme direction to extend.
The beneficial effects of the present invention is: extended to by this first extension of this heat-conducting piece
On this radiating piece of this printed circuit board (PCB), utilize whereby this printed circuit board (PCB) this radiating piece and
The thin copper film being positioned on this printed circuit board (PCB) is to increase effective area of dissipation, so position can be helped
In this semiconductor element effective temperature-reducing of focus, thus, prevent this semiconductor element because of too high
Ambient operating temperature and produce mistake start situation occur.
Brief description
Fig. 1 is a profile, and existing a kind of flexible base plate semiconductor packages assembly is described,
It is suitable for and be connected between a display floater and a printed circuit board (PCB), and can be with a framework
Unit is assembled into a liquid crystal display module jointly；
Fig. 2 is a top view, illustrates that the present invention has the flexible base plate of radiator structure and partly leads
One first embodiment of body packaging system；
Fig. 3 is a profile, and explanation is the III-III cutting line direction along Fig. 2；
Fig. 4 is a upward view, illustrates that the present invention has the flexible base plate of radiator structure and partly leads
One the second embodiment of body packaging system；
Fig. 5 is a profile, and explanation is the V-V cutting line direction along Fig. 4；
Fig. 6 is a upward view, illustrates that the present invention has the flexible base plate of radiator structure and partly leads
One the 3rd embodiment of body packaging system；
Fig. 7 is a profile, and explanation is the VII-VII cutting line direction along Fig. 6.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment the present invention is described in detail:
Refering to Fig. 2,3, the present invention has the flexible base plate semiconductor encapsulation device of radiator structure
One first embodiment of 5 a, it is adaptable to display floater 2 in a display module,
Comprise a piece of flexible substrate the 51st, semiconductor element the 52nd a, heat-conducting piece 53, and
One printed circuit board (PCB) 54.This display floater 2 has the end of a neighbouring back light unit
Face 21, and one show in contrast to this bottom surface 21 pixel can fitted for a piece of Polarizer
Front 22, described herein, this back light unit and this Polarizer are all not shown in the figures.
In addition, it is noted that this display floater 2 is not limited to display panels,
Also can be active matrix organic LED (Active Matrix Organic Light
Emitting Diode, is called for short AMOLED) panel.
This flexible substrate 51, including input the 511st, one in contrast to this input
The output of 511 the 512nd, two-layer is in the insulating barrier being reversed, and one layer between described insulation
First line layer 513 between Ceng.
In the present first embodiment, wherein the one of the described insulating barrier of this flexible substrate 51
Layer is layer protective layer 514, and another layer is one layer of supporting layer 515, this first line layer 513
There are two difference not by 514 coatings of this protective layer and the joint away from this input 511
Surface 516.
Additionally supplementary notes, this supporting layer 515 can be Kapton
(Polymide Film is called for short PI), this first line layer 513 can be electric conductivity and thermal conductivity
All good copper conductor, this protective layer 514 is the welding resisting layer being commonly called as, and material also can be PI,
It is mainly used for protecting copper conductor.
In the present first embodiment, this semiconductor element 52 is an IC driver, should be partly
Conductor element 52 is positioned between this input 511 and this output 512, and be arranged at this
On one line layer 513.This semiconductor element 52 include an end face the 521st, four respectively with
Lateral surface 522 of the angled linking of this end face 521, and two respectively with this end face 521 in
The convex block 523 that connects being reversed, described lateral surface 522 is coated with one layer of adhesive-layer 55, institute
State the convex block 523 that connects and lay respectively at described composition surface 516.In the present first embodiment, should
Adhesive-layer 55 is the resin (Resin) with insulating property (properties), described convex connect block 523 material be
Metallic gold, described composition surface 516 is then respectively coated metallic tin, utilizes eutectic juncture
(Eutectic Bonding) allows this semiconductor element 52 joint be positioned this first line layer 513
On, in addition, also can utilize anisotropic conducting rubber, (Anisotropic Conductive Paste is called for short
ACP) reach same effect, due to, with regard to described convex connect block 523 be respectively positioned in described in connect
Close the combination on surface 516, be that the art tool usually intellectual is familiar with and non-
The technology emphasis of the present invention, just no longer describes in detail at this.
This heat-conducting piece 53 is arranged on this flexible substrate 51, including one be positioned at described absolutely
The wherein main part on a layer of edge layer the 531st, one outward extending from this main part 531
First extension 532, and one from this main part 531 towards this output 512 direction extend
The second extension 533.In the present first embodiment, the main part 531 of this heat-conducting piece 53
It is arranged at this supporting layer 515 and position corresponds to this semiconductor element 52.Additionally supplementary notes
, the material of this heat-conducting piece 53 contains metal material, and in the present first embodiment, this is led
Warmware 53 contains copper.
This printed circuit board (PCB) 54 adjacent to this input 511 of this flexible substrate 51, including
One layer with this first line layer 513 in the second line layer 541 electrically connecting, and one with should
This first extension 532 of heat-conducting piece 53 contacts and with this second line layer 541 separately
Radiating piece 542.In the present first embodiment, the material of this second line layer 541 is permissible
Containing all good copper of electric conductivity and thermal conductivity, this radiating piece 542 of this printed circuit board (PCB) 54
Material there is metal material, it is preferred that this radiating piece 542 of this printed circuit board (PCB) 54
Material contain copper.Here, illustrate, this second line layer 541 and this heat radiation
Part 542 all can be respectively a copper-plated metal pad, and described copper-plated metal pad is both needed to through surface
Processing procedure (Surface Finish) becomes the copper facing gold that surface is coated with one layer of nickel-gold layer (Ni/Au)
Belong to pad, utilize the anti-oxidation characteristics that metallic gold itself is excellent whereby, prevent surface oxidation situation
Occur.
It is noted that this radiating piece 542 of this printed circuit board (PCB) 54 and this heat-conducting piece
The material of 53 all be readily modified as select thermal conductivity factor can reach 400W/mK contain carbon complex
Material.
When a signal of telecommunication can through this from this second line layer 541 of this printed circuit board (PCB) 54
Scratch this first line layer 513 of formula substrate 51 when being sent to this semiconductor element 52, start
This semiconductor element 52 of start then can convert electric energy to heat energy according to Joule's law and become
One pyrotoxin, this heat-conducting piece 53 of the present invention is about the copper of 401W/mK by thermal conductivity factor
Made, correspond to this pyrotoxin by the position of the main part 531 of this heat-conducting piece 53, just
Efficiently heat energy can be conducted to being positioned at this printed circuit board (PCB) 54 through this first extension 532
This radiating piece 542 on release, say, that compared to this flexible base plate semiconductor existing
For the heat radiation scope of encapsulation assembly 1 is limited only on this flexible substrate 11, the present invention
By by heat energy from the main part 531 of this heat-conducting piece 53 through this first extension 532 conduct to
This radiating piece 542 of this printed circuit board (PCB) 54, just can increase effective heat radiation scope, in addition,
Also the thin copper film on this printed circuit board (PCB) 54 can be utilized to increase effective area of dissipation, so can be more
Contribute to cooling, thus, prevent this semiconductor element 52 because of operating ambient temperature further
Too high and the situation of the start that makes a mistake.
Via above explanation, can again advantages of the present invention be summarized as follows:
First, the present invention is by increasing effective area of dissipation and this heat-conducting piece 53 and this radiating piece
542 is all to use thermal conductivity preferably copper, compared to this semiconductor packages assembly 1 existing
It is only capable of heat energy from the two ends of this pyrotoxin conduction to this flexible substrate 11 and this heat-conducting piece
13 be use the poor aluminium of thermal conductivity for, be more conducive to avoid this semiconductor element 52 because of
Too high ambient operating temperature and produce mistake start situation occur.
2nd, this radiating piece 542 that the present invention is positioned on this printed circuit board (PCB) 54 is plated surface
There is a copper-plated metal pad of this nickel-gold layer, the copper-plated metal pad after this kind of surface treated process,
On its surface because of the metallic gold more excellent containing oxidation resistance, so this kind of surface is coated with
This copper-plated metal pad of this nickel-gold layer just can be prevented effectively from oxidation and occur.
3rd, this heat-conducting piece 53 of the present invention could be used that heat conduction with the material of this radiating piece 542
Coefficient can reach the carbon complex material of 400W/mK, due to carbon complex material manufacturing cost relatively
Cheap, compared to this used heat conduction of heat-conducting piece 13 of this semiconductor packages assembly 1 existing
For coefficient is about the aluminium of 237W/mK, not only can reach more preferable heat radiation function, also simultaneously
Contribute to reducing manufacturing cost.
Refering to Fig. 4,5, for the present invention have radiator structure flexible base plate semiconductor packages dress
Putting second embodiment of 5, this second embodiment is similar to this first embodiment, and this is years old
Two embodiments are with the Main Differences of this first embodiment:
This semiconductor element 52 is positioned between this input 511 and this output 512, at this
In second embodiment, this end face 521 of this semiconductor element 52 is coated with one layer of adhesive layer
56, the main part 531 of this heat-conducting piece 53 is arranged at this protective layer 514 and is positioned at this input
Between 511 and this semiconductor element 52.This second extension 533 of this heat-conducting piece 53 certainly should
Main part 531 extends on this adhesive layer 56 towards this semiconductor element 52 direction.Mend at this
Filling explanation, this adhesive layer 56 is the resin with insulating property (properties).
In addition, it is preferred that this second extension 533 of this heat-conducting piece 53 is from this adhesive layer
56 extend towards this output 512 direction.
So, this second embodiment also can reach the purpose identical with this first embodiment above-mentioned
With effect.
Refering to Fig. 6,7, for the present invention have radiator structure flexible base plate semiconductor packages dress
Putting the 3rd embodiment of 5, the 3rd embodiment is similar to this first embodiment, and this is years old
Three embodiments are with the Main Differences of this first embodiment:
The main part 531 of this heat-conducting piece 53 is arranged at this protective layer 514 and is positioned at this input
Between 511 and this semiconductor element 52.
So, the 3rd embodiment also can reach the purpose identical with this first embodiment above-mentioned
With effect.
In sum, the present invention can extend to this by this first extension 532 of this heat-conducting piece 53
On this radiating piece 542 of printed circuit board (PCB) 54, and this heat-conducting piece 53 and this radiating piece 542
Material all use the high copper of thermal conductivity ratio aluminium, and this radiating piece 542 can be a position
Copper-plated metal pad on this printed circuit board (PCB) 54, and the surface of this copper-plated metal pad is coated with
This nickel-gold layer of the anti-oxidation of one layer of energy, so, just can utilize this printed circuit board (PCB) 54 should
Radiating piece 542 and the thin copper film that is positioned on this printed circuit board (PCB) 54 are to increase effective radiating surface
Long-pending, so this semiconductor element 52 effective temperature-reducing of focus can be helped to be positioned at, thus, prevent
The situation that this semiconductor element 52 produces mistake start because of too high ambient operating temperature occurs,
So the purpose of the present invention really can be reached.
Claims (10)
1. there is a flexible base plate semiconductor encapsulation device for radiator structure, comprise a piece of flexible
Formula substrate, semiconductor element, a printed circuit board (PCB), and a heat-conducting piece,
This flexible base plate semiconductor encapsulation device with radiator structure is characterised by:
This flexible substrate, including input, a two-layer are in the insulation being reversed
Layer, and one layer of first line layer between described insulating barrier；
This semiconductor element, is arranged on this first line layer；
This printed circuit board (PCB), this input of this flexible substrate neighbouring, including one layer
With this first line layer in the second line layer electrically connecting；
This heat-conducting piece is arranged on this flexible substrate, including one is positioned at described insulation
The wherein main part on a layer of layer, wherein, this heat-conducting piece also includes one from this master
Outward extending first extension of body, this printed circuit board (PCB) also includes that one is led with this
This first extension of warmware contact and with this second line layer heat radiation separately
Part.
2. the flexible base plate semiconductor packages dress with radiator structure according to claim 1
Put, it is characterised in that: the material of this radiating piece of this printed circuit board (PCB) has metal material
Material.
3. the flexible base plate semiconductor packages dress with radiator structure according to claim 2
Put, it is characterised in that: this radiating piece of this printed circuit board (PCB) and the material of this heat-conducting piece
All contain copper.
4. the flexible base plate semiconductor packages dress with radiator structure according to claim 1
Put, it is characterised in that: this radiating piece of this printed circuit board (PCB) and the material of this heat-conducting piece
It is respectively provided with carbon complex material.
5. the flexible base plate with radiator structure according to any one of claim 1 to 4
Semiconductor encapsulation device, it is characterised in that: the described insulating barrier of this flexible substrate
Wherein one layer is layer protective layer, and another layer is one layer of supporting layer, this first line layer
There are two difference not by this protective layer institute's coating and the table of joint away from this input
Face, this semiconductor element includes an end face, four ranks angled with this end face respectively
The lateral surface connecing, and two respectively with this end face in the convex block that connects being reversed, described
Lateral surface is coated with one layer of adhesive-layer, and the described convex block that connects lays respectively at described composition surface.
6. the flexible base plate semiconductor packages dress with radiator structure according to claim 5
Put, it is characterised in that: the main part of this heat-conducting piece is arranged at this supporting layer and position pair
Should be in this semiconductor element.
7. the flexible base plate semiconductor packages dress with radiator structure according to claim 6
Put, it is characterised in that: this flexible substrate also includes one in contrast to this input
Output, this semiconductor element is positioned between this input and this output, this heat conduction
Part also includes second extension extending from this main part towards this output direction.
8. the flexible base plate semiconductor packages dress with radiator structure according to claim 5
Put, it is characterised in that: the main part of this heat-conducting piece is arranged at this protective layer and is positioned at this
Between input and this semiconductor element.
9. the flexible base plate semiconductor packages dress with radiator structure according to claim 8
Put, it is characterised in that: this end face of this semiconductor element is coated with one layer of adhesive layer,
This heat-conducting piece also includes that one extends to this from this main part towards this semiconductor element direction
The second extension on adhesive layer.
10. the flexible base plate semiconductor packages dress with radiator structure according to claim 9
Put, it is characterised in that: this flexible substrate also includes defeated in contrast to this input
Going out end, this semiconductor element is positioned between this input and this output, this heat-conducting piece
This second extension from this adhesive layer towards this output direction extend.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510100164.6A CN105990276A (en) | 2015-03-06 | 2015-03-06 | Flexible substrate semiconductor packaging device with heat radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510100164.6A CN105990276A (en) | 2015-03-06 | 2015-03-06 | Flexible substrate semiconductor packaging device with heat radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105990276A true CN105990276A (en) | 2016-10-05 |
Family
ID=57039409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510100164.6A Pending CN105990276A (en) | 2015-03-06 | 2015-03-06 | Flexible substrate semiconductor packaging device with heat radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105990276A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113568483A (en) * | 2021-07-26 | 2021-10-29 | 南昌华勤电子科技有限公司 | Heat radiation assembly and server |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000172191A (en) * | 1998-12-04 | 2000-06-23 | Fujitsu Ltd | Planar display device |
| US7259448B2 (en) * | 2001-05-07 | 2007-08-21 | Broadcom Corporation | Die-up ball grid array package with a heat spreader and method for making the same |
| CN101692443A (en) * | 2008-04-17 | 2010-04-07 | 三星电子株式会社 | Chip on film type semiconductor package and display device |
| US20120193803A1 (en) * | 2011-01-28 | 2012-08-02 | Renesas Electronics Corporation | Semiconductor device, method for producing semiconductor device, and display |
| TWM457374U (en) * | 2013-01-09 | 2013-07-11 | Elitegroup Computer Sys Co Ltd | Embedded printed circuit board structure |
-
2015
- 2015-03-06 CN CN201510100164.6A patent/CN105990276A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000172191A (en) * | 1998-12-04 | 2000-06-23 | Fujitsu Ltd | Planar display device |
| US7259448B2 (en) * | 2001-05-07 | 2007-08-21 | Broadcom Corporation | Die-up ball grid array package with a heat spreader and method for making the same |
| CN101692443A (en) * | 2008-04-17 | 2010-04-07 | 三星电子株式会社 | Chip on film type semiconductor package and display device |
| US20120193803A1 (en) * | 2011-01-28 | 2012-08-02 | Renesas Electronics Corporation | Semiconductor device, method for producing semiconductor device, and display |
| TWM457374U (en) * | 2013-01-09 | 2013-07-11 | Elitegroup Computer Sys Co Ltd | Embedded printed circuit board structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113568483A (en) * | 2021-07-26 | 2021-10-29 | 南昌华勤电子科技有限公司 | Heat radiation assembly and server |
| CN113568483B (en) * | 2021-07-26 | 2023-07-14 | 南昌华勤电子科技有限公司 | Radiating assembly and server |
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Address after: Taiwan Hsinchu County China jhubei City, Taiwan two yuan Street No. 1 10 floor 1 Applicant after: ILI TECHNOLOGY Corp. Address before: Taiwan Hsinchu County Tai Yuan Street Chinese jhubei City, No. 26 5 floor 1 Applicant before: Morning hair Polytron Technologies Inc. |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20170420 Address after: Taiwan Hsinchu County Tai Yuan Street Chinese jhubei City, No. 26 5 floor 1 Applicant after: Morning hair Polytron Technologies Inc. Address before: Taiwan Hsinchu County Tai Yuan Street Chinese jhubei City, No. 38 8 floor Applicant before: ILI TECHNOLOGY Corp. |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161005 |