CN113561051B - 一种晶圆再生处理装置及控制系统 - Google Patents
一种晶圆再生处理装置及控制系统 Download PDFInfo
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- CN113561051B CN113561051B CN202110857063.9A CN202110857063A CN113561051B CN 113561051 B CN113561051 B CN 113561051B CN 202110857063 A CN202110857063 A CN 202110857063A CN 113561051 B CN113561051 B CN 113561051B
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- Prior art keywords
- polishing
- wafer
- oil
- clamping arm
- turntable
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- 230000008929 regeneration Effects 0.000 title claims abstract description 26
- 238000011069 regeneration method Methods 0.000 title claims abstract description 26
- 238000012545 processing Methods 0.000 title description 27
- 238000005498 polishing Methods 0.000 claims abstract description 149
- 239000007788 liquid Substances 0.000 claims abstract description 69
- 238000011084 recovery Methods 0.000 claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 235000012431 wafers Nutrition 0.000 claims description 128
- 238000004140 cleaning Methods 0.000 claims description 22
- 239000003153 chemical reaction reagent Substances 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 6
- 239000000725 suspension Substances 0.000 claims description 6
- 238000012958 reprocessing Methods 0.000 claims 5
- 238000004064 recycling Methods 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 19
- 238000005260 corrosion Methods 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 8
- 239000012530 fluid Substances 0.000 abstract description 4
- 238000005406 washing Methods 0.000 abstract description 4
- 239000003921 oil Substances 0.000 description 52
- 239000010408 film Substances 0.000 description 27
- 239000000243 solution Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 16
- 238000000227 grinding Methods 0.000 description 12
- 239000002699 waste material Substances 0.000 description 12
- 238000005507 spraying Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000000926 separation method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110857063.9A CN113561051B (zh) | 2021-07-28 | 2021-07-28 | 一种晶圆再生处理装置及控制系统 |
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CN202110857063.9A CN113561051B (zh) | 2021-07-28 | 2021-07-28 | 一种晶圆再生处理装置及控制系统 |
Publications (2)
Publication Number | Publication Date |
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CN113561051A CN113561051A (zh) | 2021-10-29 |
CN113561051B true CN113561051B (zh) | 2022-04-19 |
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CN202110857063.9A Active CN113561051B (zh) | 2021-07-28 | 2021-07-28 | 一种晶圆再生处理装置及控制系统 |
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CN116890266B (zh) * | 2023-06-14 | 2024-02-06 | 广州统力新能源有限公司 | 一种bipv组件的生产工艺 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10217113A (ja) * | 1997-01-31 | 1998-08-18 | Okamoto Kosaku Kikai Seisakusho:Kk | ウエハ両面研磨/研削装置 |
CN1396632A (zh) * | 2001-07-05 | 2003-02-12 | 瓦克硅电子股份公司 | 半导体片两面实施材料去除切削的方法 |
CN1441713A (zh) * | 2000-05-31 | 2003-09-10 | 三菱住友硅晶株式会社 | 使用双面抛光装置的半导体晶片抛光方法 |
CN104097134A (zh) * | 2013-04-12 | 2014-10-15 | 硅电子股份公司 | 用于借助同时双面抛光来抛光半导体晶片的方法 |
CN105451940A (zh) * | 2013-08-09 | 2016-03-30 | 福吉米株式会社 | 研磨完的研磨对象物的制造方法及研磨用组合物试剂盒 |
CN110871385A (zh) * | 2018-08-29 | 2020-03-10 | 东泰高科装备科技(北京)有限公司 | 双面抛光机与抛光方法 |
CN210678251U (zh) * | 2019-07-19 | 2020-06-05 | 南开大学 | 磁吸式抛光夹具和抛光装置 |
CN111805400A (zh) * | 2020-07-17 | 2020-10-23 | 中国科学院微电子研究所 | 抛光装置 |
-
2021
- 2021-07-28 CN CN202110857063.9A patent/CN113561051B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10217113A (ja) * | 1997-01-31 | 1998-08-18 | Okamoto Kosaku Kikai Seisakusho:Kk | ウエハ両面研磨/研削装置 |
CN1441713A (zh) * | 2000-05-31 | 2003-09-10 | 三菱住友硅晶株式会社 | 使用双面抛光装置的半导体晶片抛光方法 |
CN1396632A (zh) * | 2001-07-05 | 2003-02-12 | 瓦克硅电子股份公司 | 半导体片两面实施材料去除切削的方法 |
CN104097134A (zh) * | 2013-04-12 | 2014-10-15 | 硅电子股份公司 | 用于借助同时双面抛光来抛光半导体晶片的方法 |
CN105451940A (zh) * | 2013-08-09 | 2016-03-30 | 福吉米株式会社 | 研磨完的研磨对象物的制造方法及研磨用组合物试剂盒 |
CN110871385A (zh) * | 2018-08-29 | 2020-03-10 | 东泰高科装备科技(北京)有限公司 | 双面抛光机与抛光方法 |
CN210678251U (zh) * | 2019-07-19 | 2020-06-05 | 南开大学 | 磁吸式抛光夹具和抛光装置 |
CN111805400A (zh) * | 2020-07-17 | 2020-10-23 | 中国科学院微电子研究所 | 抛光装置 |
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Address after: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Applicant after: Shanghai Shenhe Investment Co.,Ltd. Address before: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Applicant before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |
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Effective date of registration: 20230706 Address after: No. 21, Nanhai Road, Yi'an District, Tongling City, Anhui Province 244151 Patentee after: Anhui fulede Changjiang semiconductor material Co.,Ltd. Address before: 201900 No. 181, Shanlian Road, Baoshan City Industrial Park, Baoshan District, Shanghai Patentee before: Shanghai Shenhe Investment Co.,Ltd. |