CN113556860A

CN113556860A - Circuit board assembly and electronic equipment

Info

Publication number: CN113556860A
Application number: CN202010341409.5A
Authority: CN
Inventors: 李贺
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd; Royole Corp
Priority date: 2020-04-26
Filing date: 2020-04-26
Publication date: 2021-10-26

Abstract

The application provides a circuit board assembly and an electronic device. The circuit board assembly comprises a first substrate, and the elasticity of a first elastic area of the first substrate is larger than that of a second elastic area of the first substrate. The first conductive part comprises a first conductive part and a second conductive part which are connected, the first conductive part is arranged corresponding to the first elastic area, and the second conductive part is arranged corresponding to the second elastic area. The second conductive part comprises a third conductive part and a fourth conductive part which are connected, the orthographic projection of the third conductive part on the first substrate is at least partially positioned in the orthographic projection of the second conductive part on the first substrate, and the third conductive part is electrically connected with the second conductive part. The joint of the first conductive part and the second conductive part is arranged corresponding to the second elastic area, so that the second conductive part and the third conductive part are prevented from deforming when the first conductive part deforms, and the stability of the circuit board assembly is improved.

Description

Circuit board assembly and electronic equipment

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to a circuit board assembly and electronic equipment.

Background

With the continuous development of electronic devices, the electronic devices are favored by users due to their portability and rich and varied operability. But at the same time, the expectations and requirements of users for electronic devices are also increasing. For example, in current electronic devices, especially flexible electronic devices, it is generally necessary to make the first substrate have certain elasticity so that the base thereof can be stretched or bent. However, the connection performance between the first conductive member disposed on the first substrate and the second conductive member connected to the first conductive member may be affected during the stretching or bending process, and even the connection portion may be broken, resulting in connection failure.

Disclosure of Invention

In view of this, the present application provides in a first aspect a circuit board assembly comprising:

the first substrate is provided with a first elastic area and a second elastic area, the elasticity of the first elastic area is greater than that of the second elastic area, and the first elastic area is arranged on at least one side of the second elastic area;

the first conductive part is arranged on the first substrate and comprises a first conductive part and a second conductive part which are connected, the first conductive part is arranged corresponding to the first elastic area, and the second conductive part is arranged corresponding to the second elastic area;

the second substrate, the second conductive piece and the first conductive piece are arranged on the same side of the first substrate, the second conductive piece is arranged on the second substrate, and the second conductive piece is arranged close to the first conductive piece compared with the second substrate; the second conductive part comprises a third conductive part and a fourth conductive part which are connected, the orthographic projection of the third conductive part on the first substrate is at least partially positioned in the orthographic projection of the second conductive part on the first substrate, and the third conductive part is electrically connected with the second conductive part.

The first aspect of the present application provides a circuit board assembly by providing a first substrate with a first elastic region having high elasticity and a second elastic region having low elasticity. And the first conductive part of the first conductive part is arranged corresponding to the first elastic area, the second conductive part is arranged corresponding to the second elastic area, and the third conductive part connected with the second conductive part is arranged corresponding to the second conductive part. The connection position of the first conductive part and the second conductive part is arranged corresponding to the second elastic area of the first substrate, so that when the first conductive part corresponding to the first elastic area is elastically stretched or bent, the second elastic area cannot deform, and therefore the elasticity of the second conductive part does not affect the second elastic area, namely, the connection performance between the second conductive part and the third conductive part connected corresponding to the second elastic area is not affected, namely, the connection performance between the first conductive part and the second conductive part is improved, and the stability of the circuit board assembly is improved.

A second aspect of the present application provides an electronic device, characterized in that the electronic device comprises a circuit board assembly as provided in the first aspect of the present application.

The electronic equipment that this application second aspect provided, through adopting the circuit board subassembly that this application first aspect provided, can improve circuit board subassembly's connection performance, improve electronic equipment's stability.

Drawings

In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.

Fig. 1 is a schematic cross-sectional view of a circuit board assembly according to an embodiment of the present disclosure.

FIG. 2 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present disclosure

Fig. 3 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 4 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 5 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 6 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 7 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 8 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 9 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 10 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 11 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 12 is a top view of the first substrate and the first conductive member.

Fig. 13 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 14 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 15 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 16 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 17 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 18 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 19 is a top view of a second substrate according to yet another embodiment of the present application.

Fig. 20 is a top view of a second substrate according to yet another embodiment of the present application.

Fig. 21 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Fig. 22 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application.

Description of reference numerals:

a circuit board assembly-1, a first substrate-10, a first elastic region-11, a second elastic region-12, a receiving groove-13, a first surface-14, a mounting hole-15, a second surface-16, a third surface-17, a groove-18, a first conductive member-20, a first conductive member-21, a second conductive member-22, a first conductive surface-23, a first through hole-24, a second substrate-30, a first surface-31, a second surface-32, a side surface-33, a second through hole-34, a second conductive member-40, a third conductive member-41, a fourth conductive member-42, a second conductive surface-43, an adhesive layer-50, a first conductive adhesive member-60, a second conductive adhesive member-61, a third conductive member-70, a fourth conductive member-71, a fifth conductive member-72, a via-73.

Detailed Description

The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic cross-sectional view of a circuit board assembly according to an embodiment of the present disclosure. The present embodiment provides a circuit board assembly 1, where the circuit board assembly 1 includes a first substrate 10, a first conductive member 20, a second substrate 30, and a second conductive member 40. The first substrate 10 has a first elastic region 11 and a second elastic region 12, wherein the elasticity of the first elastic region 11 is greater than that of the second elastic region 12, and the first elastic region 11 is disposed on at least one side of the second elastic region 12. The first conductive member 20 is disposed on the first substrate 10, the first conductive member 20 includes a first conductive portion 21 and a second conductive portion 22 connected to each other, the first conductive portion 21 is disposed corresponding to the first elastic region 11, and the second conductive portion 22 is disposed corresponding to the second elastic region 12. The second substrate 30, the second conductive member 40, and the first conductive member 20 are disposed on the same side of the first substrate 10, the second conductive member 40 is disposed on the second substrate 30, and the second conductive member 40 is disposed closer to the first conductive member 20 than the second substrate 30; the second conductive member 40 includes a third conductive portion 41 and a fourth conductive portion 42 connected to each other, an orthogonal projection of the third conductive portion 41 on the first substrate 10 is at least partially located in an orthogonal projection of the second conductive portion 22 on the first substrate 10, and the third conductive portion 41 is electrically connected to the second conductive portion 22.

The first substrate 10 provided in the present application may be a Printed Circuit (FPC) Board or a Printed Circuit Board (PCB) Board. The first substrate 10 includes a first elastic region 11 having high elasticity and a second elastic region 12 having low elasticity. Alternatively, the elasticity of the first elastic zone 11 can be differentiated from the elasticity of the second elastic zone 12 by the amount of deformation. For example, the amount of deformation of the first elastic region 11 is greater than or equal to 5%. The second elastic zone 12 is deformed by less than 5%. Next, the first elastic region 11 is disposed on at least one side of the second elastic region 12. The present embodiment is illustrated with the first elastic zone 11 disposed on one side of the second elastic zone 12. Of course, the first elastic region 11 is also disposed corresponding to the periphery of the second elastic region 12 such that the first elastic region 11 is disposed around the second elastic region 12.

The first conductive member 20 may be a conductive line formed by printing, spraying, or the like. The first conductive member 20 is disposed on the first substrate 10. Optionally, the first conductive member 20 also has a certain elasticity such that the first conductive member 20 deforms in conjunction with the first member. The first conductive member 20 includes a first conductive portion 21 and a second conductive portion 22 connected to each other. The first conductive part 21 is disposed corresponding to the first elastic region 11, and the second conductive part 22 is disposed corresponding to the second elastic region 12. It is also understood that when the first elastic region 11 is deformed, the first conductive portion 21 is also deformed together. Since the second conductive portion 22 is disposed corresponding to the second elastic region 12, the second conductive portion 22 does not deform together with the first conductive portion 21.

The second substrate 30 is connected to the second conductive member 40, and the second substrate 30 is used for carrying the second conductive member 40. The second substrate 30 may be a Printed Circuit (FPC) Board or a Printed Circuit Board (PCB) Board. The second substrate 30 may have no elasticity or at least a portion of the second substrate 30 may have elasticity. And the second conductive member 40 includes a third conductive portion 41 and a fourth conductive portion 42 connected to each other, an orthographic projection of the third conductive portion 41 on the first substrate 10 is at least partially located within an orthographic projection of the second conductive portion 22 on the first substrate 10, and the third conductive portion 41 is electrically connected to the second conductive portion 22. It is also understood that at least a portion of third conductive portion 41 is directly corresponding to second conductive portion 22, and third conductive portion 41 is electrically connected to second conductive portion 22, thereby conducting signals with second conductive portion 22 through third conductive portion 41.

In the related art, since the first substrate 10 is the first elastic region 11, when the first conductive portion 21 is deformed, the second conductive portion 22 and the third conductive portion 41 are deformed together, so that the connection performance between the second conductive portion 22 and the third conductive portion 41 is reduced, and even the second conductive portion 22 and the third conductive portion 41 are cracked in a serious case. In the present invention, the second elastic region 12 is provided, and the second conductive portion 22 and the third conductive portion 41 are provided corresponding to the second elastic region 12. When the first conductive part 21 is deformed, the second conductive part 22 and the third conductive part 41 are disposed on the second elastic region 12 with low elasticity, so that the second conductive part 22 and the third conductive part 41 are not deformed along with the first conductive part 21. Therefore, the connection performance between second conductive portion 22 and third conductive portion 41 can be improved. The stability of the circuit board assembly 1 is improved.

As for the fourth conductive portion 42, the fourth conductive portion 42 may be disposed corresponding to the elastic region, and may also be disposed corresponding to the second elastic region 12. Alternatively, the first conductive portion 21 and the fourth conductive portion 42 are disposed on opposite sides of the second conductive portion 22.

Optionally, the circuit board assembly 1 further includes an adhesive layer 50, one side of the adhesive layer 50 is adhered to the first substrate 10, and the other side of the adhesive layer 50 is adhered to the second substrate 30 or the second conductive member 40. The second substrate 30 and the second conductive member 40 can be fixed on the first substrate 10 by the adhesive layer 50. And when the first conductive member 20 and the second conductive member 40 are positioned differently, the parts to which the adhesive layer 50 is adhered are also different. Further alternatively, the adhesive layer 50 is formed by curing a liquid adhesive glue.

And how second conductive portion 22 is connected to third conductive portion 41. Referring again to fig. 1, in an embodiment of the present application, the circuit board assembly 1 further includes a first conductive adhesive 60 disposed between the second conductive portion 22 and the third conductive portion 41, and the first conductive adhesive 60 adheres the second conductive portion 22 and the third conductive portion 41.

In the present application, first conductive adhesive 60 can be used to connect second conductive portion 22 and third conductive portion 41 together, thereby further improving the connection performance between second conductive portion 22 and third conductive portion 41. And the first conductive adhesive 60 has conductivity. Electrical signals can still be transmitted between second conductive portion 22 and third conductive portion 41. Alternatively, the first conductive adhesive 60 may be formed by curing liquid adhesive glue, or the first conductive adhesive 60 may be a conductive tape.

Optionally, the first conductive member 20 has a first conductive surface 23, the second conductive member 40 has a second conductive surface 43, the first conductive surface 23 and the second conductive surface 43 are disposed in a face-to-face manner, and the first conductive adhesive 60 adheres the first conductive surface 23 and the second conductive surface 43. The first conductive adhesive member 60 can be adhered to the first conductive surface 23 and the second conductive surface 43, so that the conductive performance of the circuit board assembly 1 is further improved. Optionally, the heat resistant temperature of the first conductive adhesive 60 is 100-.

In another embodiment of the present application, please refer to fig. 2, and fig. 2 is a schematic cross-sectional view of a circuit board assembly in another embodiment of the present application. In the present embodiment, third conductive portion 41 is directly connected to second conductive portion 22.

In another embodiment of the present application, the third conductive portion 41 may be directly connected to the second conductive portion 22, so that the electrical signal is directly transmitted from the second conductive portion 22 to the third conductive portion 41, thereby improving the conductive performance of the circuit board assembly 1.

As for the positional relationship of the first conductive member 20 and the second conductive member 40. Referring to fig. 1 again, in an embodiment of the application, the first conductive member 20 is disposed closer to the first substrate 10 than the second conductive member 40, and the other side of the bonding layer 50 is bonded to the second conductive member 40. In one embodiment of the present application, the first conductive member 20 may be disposed at a lower portion, and the second conductive member 40 may be disposed at an upper portion. This allows the first conductive members 20 to be connected to the first substrate 10, thereby improving the connection performance of the first conductive members 20 and preventing the first conductive portion 21 and the second conductive portion 22 from being broken during the deformation of the first conductive portion 21. At this time, the other side of the adhesive layer 50 is adhered to the second conductive member 40.

Referring to fig. 3, fig. 3 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In the present embodiment, a receiving groove 13 is formed in the first substrate 10, and at least a part of the adhesive layer 50 is disposed in the receiving groove 13. In the present application, the first substrate 10 may be provided with a receiving groove 13, and at least a portion of the adhesive layer 50 may be disposed in the receiving groove 13, so as to reduce the thickness of the circuit board assembly 1.

Referring to fig. 4, fig. 4 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In this embodiment, the surface of the first substrate 10 on which the accommodating groove 13 is formed is defined as a first surface 14, and an end surface of the second conductive member 40 close to the first conductive member 20 is flush with the first surface 14. The depth of the receiving groove 13 can be further increased, and the entire bonding layer 50 is disposed in the receiving groove 13, thereby further reducing the thickness of the circuit board assembly 1. In addition, the end surface of the second conductive member 40 close to the first conductive member 20 is flush with the first surface 14 to improve flatness, and the second conductive member 40 and the first surface 14 of the first substrate 10 are used to reduce the opening of the receiving slot 13 and prevent other impurities such as dust from entering the receiving slot 13.

Referring to fig. 5, fig. 5 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In this embodiment, at least a portion of the second conductive member 40, or the second conductive member 40 and at least a portion of the second substrate 30 are also disposed in the accommodating cavity 13.

The depth of the receiving groove 13 can be further increased, so that the entire bonding layer 50 is disposed in the receiving groove 13, and at least a portion of the second conductive member 40, or the second conductive member 40 and at least a portion of the second substrate 30 are also disposed in the receiving groove 13, thereby further reducing the thickness of the circuit board assembly 1. In this embodiment, the second conductive member 40 and a part of the second substrate 30 are also disposed in the accommodating groove 13.

Referring to fig. 5 again, in the present embodiment, the first substrate 10 is further provided with a plurality of mounting holes 15 disposed at intervals, the mounting holes 15 are communicated with the side wall of the receiving groove 13 formed by the first substrate 10, at least a portion of the first conductive member 20 is disposed in the mounting holes 15, and at least a portion of the second conductive member 22 is disposed in the receiving groove 13.

Since the third conductive part 41 of the second conductive member 40 is disposed in the housing groove 13, and the second conductive part 22 of the first conductive member 20 is disposed below the third conductive part 41 and needs to be connected to the third conductive part 41, the second conductive part 22 is also disposed in the housing groove 13. Two embodiments are presented in this application. In the first embodiment of the present application, a plurality of mounting holes 15 may be further formed on the first substrate 10, and the mounting holes 15 are communicated with the side wall of the receiving groove 13 formed on the first substrate 10, so that the first conductive member 20 can enter the receiving groove 13 through the mounting holes 15, and at least a portion of the second conductive portion 22 is disposed in the receiving groove 13. In addition, the plurality of mounting holes 15 are arranged at intervals, so that when the first conductive members 20 are prepared, the plurality of first conductive members 20 can be arranged in an insulating manner, signal interference among the first conductive members 20 is prevented, and the tensile property of the first conductive members 20 can be improved.

Referring to fig. 6, fig. 6 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In this embodiment, a surface of the first substrate 10 on which the accommodating groove 13 is opened is defined as a first surface 14, and a vertical distance between one end of the mounting hole 15 far from the accommodating groove 13 and the first surface 14 is smaller than a vertical distance between one end of the mounting hole 15 close to the accommodating groove 13 and the first surface 14.

The present application may also enable the mounting hole 15 to be disposed obliquely, so that the first conductive member 20 is easier to enter the receiving slot 13 from the mounting hole 15 when the first conductive member 20 is formed, and the difficulty in preparing the first conductive member 20 is reduced.

Referring to fig. 7, fig. 7 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In this embodiment, the surface of the first substrate 10 on which the accommodating groove 13 is formed is defined as a first surface 14, and an end surface of the second substrate 30 away from the second conductive member 40 is flush with the first surface 14.

The depth of the receiving groove 13 can be further increased, so that the second substrate 30 and the second conductive member 40 are both disposed in the receiving groove 13, thereby further reducing the overall thickness of the circuit board assembly 1. In addition, the end face of the second substrate 30 facing away from the second conductive member 40 is flush with the first surface 14, so that the flatness of the surface of the circuit board assembly 1 can be improved while the circuit board assembly 1 is lowered. In addition, the accommodating groove 13 also has a limiting function, so that the relative position precision is provided, and the assembly difficulty of the second substrate 30 and the second conductive member 40 is reduced.

Referring to fig. 8, fig. 8 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In the present embodiment, a surface of the first substrate 10 on which the housing groove 13 is opened is defined as a first surface 14, at least a part of the first conductive portion 21 is provided on the first surface 14, and at least a part of the second conductive portion 22 is provided in the housing groove 13.

In the second embodiment of the present application, at least a part of the first conductive portion 21 may be provided on the first surface 14, and at least a part of the second conductive portion 22 may be provided in the housing groove 13. It can also be understood that the first conductive member 20 is bent from the first surface 14 into the first receiving groove 13, so as to avoid forming the mounting hole 15 on the first substrate 10, thereby reducing the difficulty in manufacturing the circuit board assembly 1. In the present embodiment, a part of the first conductive part 21 is disposed on the first surface 14, a part of the first conductive part 21 is disposed in the housing groove 13, and the whole second conductive part 22 is disposed in the housing groove 13.

Referring to fig. 9, fig. 9 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In the present embodiment, as can be seen from the above, in an embodiment of the present application, the first conductive member 20 may be disposed below, and the second conductive member 40 may be disposed above. In another embodiment of the present application, the present application may further enable the first conductive member 20 to be disposed away from the first substrate 10 compared to the second conductive member 40, and enable the other side of the bonding layer 50 to be bonded to the second substrate 30.

In another embodiment of the present application, the first conductive member 20 may be disposed above and the second conductive member 40 may be disposed below, which may reduce the difficulty of bonding the first conductive bonding element 60, and may make the first missile bonding element more easily bonded between the second conductive portion 22 and the third conductive portion 41.

Optionally, referring to fig. 9 again, a receiving groove 13 is formed on the first substrate 10, and the second substrate 30 and the second conductive member 40 are disposed in the receiving groove 13; the surface of the first substrate 10, on which the receiving groove 13 is formed, is defined as a first surface 14, at least a portion of the first conductive portion 21 is disposed on the first surface 14, and at least a portion of the second conductive portion 22 extends out of the first surface 14.

In the present application, the accommodating groove 13 is formed in the first substrate 10, and the second substrate 30 and the second conductive member 40 are disposed in the accommodating groove 13, so that the heights of the second substrate 30 and the second conductive member 40 are reduced, the first conductive member 20 is disposed above the second conductive member 40, and the bonding difficulty of the first conductive bonding member 60 is reduced.

Referring to fig. 10, fig. 10 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In this embodiment, the circuit board assembly 1 further includes a second conductive adhesive member 61, the second conductive adhesive member 61 is disposed between the first substrate 10 and the first conductive member 20, the second conductive adhesive member 61 and the first substrate 10 are surrounded to form a receiving groove 13, and the second substrate 30 and the second conductive member 40 are disposed in the receiving groove 13; at least a part of the first conductive part 21 is disposed on the second conductive adhesive part 61, and at least a part of the second conductive part 22 extends out of the second conductive adhesive part 61.

The present application may also increase the height of the first conductive member 20 by the second conductive adhesive member 61, so that the first conductive member 20 is located above the second conductive member 40, thereby reducing the adhesion difficulty of the first conductive adhesive member 60.

Referring to fig. 11 and 12 together, fig. 11 is a schematic cross-sectional view of a circuit board assembly according to still another embodiment of the present application. Fig. 12 is a top view of the first substrate and the first conductive member. In this embodiment, the surface of the first substrate 10 on which the first conductive member 20 is disposed is defined as a second surface 16, and the area of the second conductive portion 22 is larger than the area of the first conductive portion 21 in a direction parallel to the second surface 16.

According to the invention, the area of the second conductive part 22 is larger than that of the first conductive part 21, so that the difficulty of connecting the second conductive part 22 with the third conductive part 41 is reduced, and the second conductive part 22 and the third conductive part 41 are more easily connected. Alternatively, as shown in fig. 12, the shape of the second conductive portion 22 may be circular in a direction parallel to the second surface 16, or the shape of the second conductive portion 22 may be other shapes.

Referring to fig. 13, fig. 13 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In the present embodiment, the second conductive portion 22 has a first through hole 24, and the first through hole 24 penetrates the second conductive portion 22 and exposes the first substrate 10.

In the present application, the second conductive portion 22 may further be provided with a first through hole 24, so that the first conductive adhesive 60 can enter the first through hole 24, thereby further improving the connection effect between the first conductive adhesive 60 and the first substrate 10.

Referring to fig. 14, fig. 14 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In this embodiment, the first substrate 10 further has a groove 18, and a part of the second conductive portion 22 is disposed in the groove 18.

The first substrate 10 may further be provided with a groove 18, so that a part of the second conductive portion 22 is disposed in the groove 18, and thus the second conductive portion 22 also encloses the groove 18, so that the first conductive adhesive 60 can enter the groove 18, and the connection effect between the first conductive adhesive 60 and the first substrate 10 can be further improved. In addition, the cured first conductive adhesive member 60 can also improve the shear force in the stretching direction, and improve the stretch resistance.

Referring to fig. 15, fig. 15 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In this embodiment, a surface of the first substrate 10 on which the groove 18 is formed is defined as a third surface 17, and an opening size of an end of the groove 18 close to the third surface 17 is larger than an opening size of an end of the groove 18 far from the third surface 17.

The present application can also make the opening size of the end of the groove 18 close to the third surface 17 larger than the opening size of the end of the groove 18 far from the third surface 17, so that the first conductive adhesive member 60 can enter the groove 18 more easily, thereby further improving the performance of the present application

Referring to fig. 16, fig. 16 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In this embodiment, a surface of the first substrate 10 on which the groove 18 is formed is defined as a third surface 17, and an opening size of the groove 18 on the third surface 17 is smaller than a maximum opening size of an end of the groove 18 away from the third surface 17.

The present application can also make the opening size of the groove 18 on the third surface 17 smaller than the maximum opening size of the end of the groove 18 far away from the third surface 17, that is, the opening size of the groove 18 on the third surface 17 is not the largest, but the maximum opening size is only provided at the end far away from the third surface 17, so that the shearing force in the stretching direction (i.e. horizontal direction) can be increased, and the force in the vertical direction can also be increased, thereby further improving the stretch-proof performance.

Referring to fig. 17 and 18 together, fig. 17 is a schematic cross-sectional view of a circuit board assembly according to still another embodiment of the present application. Fig. 18 is a schematic cross-sectional view of a circuit board assembly according to yet another embodiment of the present application. In this embodiment, the second substrate 30 and the second conductive member 40 are further provided with a second through hole 34, and the second through hole 34 penetrates through the second substrate 30 and the second conductive member 40.

The second through holes 34 may also be formed in the second substrate 30 and the second conductive member 40, so that the first conductive adhesive 60 and the second through holes 34 flow between the first conductive member 20 and the second conductive member 40, the difficulty in preparing the first conductive adhesive 60 is reduced, and the connection performance between the first conductive adhesive 60 and the second substrate 30 and the second conductive member 40 is improved. And the flow direction of the first conductive adhesive 60 may be also restricted by the sidewall of the second through hole 34.

Optionally, referring to fig. 17 and fig. 18 again, a surface of the second substrate 30 away from the second conductive component 40 is defined as a first surface 31, a surface of the second conductive component 40 away from the second substrate 30 is defined as a second surface 32, and surfaces of the second substrate 30 and the second conductive component 40 close to the first conductive component 21 are defined as side surfaces 33; the second through hole 34 penetrates the first surface 31, the second surface 32 (as shown in fig. 18), or the second through hole 34 penetrates the first surface 31, the second surface 32, and the side surface 33 (as shown in fig. 17). When the second through hole 34 penetrates through the first surface 31 and the second surface 32, the second through hole 34 is closed, so that the adjacent two first conductive adhesive members 60 are prevented from contacting.

Referring to fig. 19, fig. 19 is a top view of a second substrate according to still another embodiment of the present disclosure. In the present embodiment, when the second through hole 34 penetrates the first surface 31, the second surface 32, and the side surface 33, an opening size of an end of the second through hole 34 close to the side surface 33 is larger than an opening size of an end of the second through hole 34 far from the side surface 33.

The present application may make the opening size of the end of the second through hole 34 close to the side surface 33 larger than the opening size of the end of the second through hole 34 far from the side surface 33, thereby preventing the first conductive adhesive 60 from flowing out of the second through hole 34. For example, the sidewall of the second through hole 34 may be a circular arc having a length less than half of the circumference of a circle formed by taking the center of the circular arc as the center.

Referring to fig. 20, fig. 20 is a top view of a second substrate according to still another embodiment of the present disclosure. In the present embodiment, when the second through hole 34 penetrates the first surface 31, the second surface 32, and the side surface 33, the opening size of the second through hole 34 on the side surface 33 is smaller than the maximum opening size of one end of the second through hole 34 away from the side surface 33.

The present application may also make the opening size of the second through hole 34 on the side surface 33 smaller than the maximum opening size of the end of the second through hole 34 away from the side surface 33, that is, the opening size of the second through hole 34 on the side surface 33 is not the largest, but the maximum opening size is only at the end away from the second through hole 34 on the side surface 33, so as to further improve the shearing force of the first conductive adhesive 60 in the stretching direction and improve the stretch-proof performance. For example, the sidewall of the second through hole 34 may be a circular arc having a length greater than one-half of the circumference of a circle formed by taking the center of the circular arc as the center of the circle and the radius of the circular arc as the radius.

Referring to fig. 21, fig. 21 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In this embodiment, the circuit board assembly 1 further includes a third conductive member 70, or the circuit board assembly 1 further includes a third conductive member 70 and a fourth conductive member 71, where the third conductive member 70 is disposed on a sidewall of the second through hole 34 opened in the second substrate 30 and the second conductive member 40, the fourth conductive member 71 is disposed on the first surface 31, and the third conductive member 70 connects the second conductive member 40 and the fourth conductive member 71.

In the present application, a third conductive member 70 and a fourth conductive member 71 may be further added, so that the third conductive member 70 is disposed on the second substrate 30 and the sidewall of the second through hole 34 opened in the second conductive member 40, and the fourth conductive member 71 is disposed on the first surface 31, which may be understood as electrically connecting the second conductive member 40 through the third conductive member 70 and the fourth conductive member 71, so that a component is disposed on the fourth conductive member 71, and an electrical signal on the second conductive member 40 is more easily transmitted to the component. Alternatively, the third conductive member 70 may be a part of the second substrate 30 and the second conductive member 40, or the third conductive member 70 may be made of other conductive materials.

Referring to fig. 22, fig. 22 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application. In this embodiment, when the circuit board assembly 1 further includes a third conductive member 70 and a fourth conductive member 71, the circuit board assembly 1 further includes a plurality of via holes 73, and the via holes 73 penetrate through the fourth conductive member 71, the second substrate 30, and the second conductive member 40; the circuit board assembly 1 further includes a fifth conductive member 72, the fifth conductive member 72 is disposed on the fourth conductive member 71, the second substrate 30, and a sidewall of the via hole 73 formed in the second conductive member 40, and the fifth conductive member 72 connects the second conductive member 40 and the fourth conductive member 71.

A plurality of via holes 73 may be further formed, and a fifth conductive member 72 is additionally disposed on a sidewall of the via hole 73, so that the fifth conductive member 72 connects the second conductive member 40 and the fourth conductive member 71. Therefore, the second conductive member 40 and the fourth conductive member 71 can be electrically connected through the via 73, so that the problem of structural fracture caused by disconnection of the third conductive member 70 and the second conductive member 40 or disconnection of the third conductive member 70 and the fourth conductive member 71 in the through hole is prevented, and the connection stability is improved. It will also be appreciated that the via 73 is used to provide a guarantee for the electrical connection between the second conductive member 40 and the fourth conductive member 71. Alternatively, the third conductive member 70 may be a part of the second substrate 30 and the second conductive member 40, or the third conductive member 70 may be made of other conductive materials.

The application further provides electronic equipment, which is characterized by comprising the circuit board assembly provided by the above embodiment of the application.

The electronic equipment that this application second aspect provided, through adopting the circuit board subassembly that this application above-mentioned embodiment provided, can improve circuit board subassembly's connection performance, improve electronic equipment's stability.

The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A circuit board assembly, comprising:

2. The circuit board assembly of claim 1, wherein the third conductive portion directly connects the second conductive portion.

3. The circuit board assembly of claim 1, further comprising a first conductive adhesive disposed between the second conductive portion and the third conductive portion, the first conductive adhesive bonding the second conductive portion and the third conductive portion.

4. The circuit board assembly of claim 1, further comprising an adhesive layer, one side of the adhesive layer being adhered to the first substrate and the other side of the adhesive layer being adhered to the second substrate or the second conductive member.

5. The circuit board assembly of claim 4, wherein the first conductive member is disposed closer to the first substrate than the second conductive member, and the other side of the adhesive layer adheres to the second conductive member.

6. The circuit board assembly of claim 5, wherein the first substrate defines a receiving cavity, and at least a portion of the adhesive layer is disposed in the receiving cavity; or at least part of the second conductive piece is also arranged in the accommodating groove; or, the second conductive member and at least a part of the second substrate are also disposed in the accommodating groove.

7. The circuit board assembly of claim 6, wherein the first substrate further defines a plurality of mounting holes spaced apart from each other, the mounting holes are in communication with sidewalls of the receiving cavity defined by the first substrate, at least a portion of the first conductive member is disposed in the mounting holes, and at least a portion of the second conductive member is disposed in the receiving cavity.

8. The circuit board assembly of claim 4, wherein the first conductive member is disposed farther from the first substrate than the second conductive member, and the other side of the adhesive layer is adhered to the second substrate.

9. The circuit board assembly of claim 8, further comprising a second conductive adhesive disposed between the first substrate and the first conductive member, wherein the second conductive adhesive and the first substrate define a receiving slot, and wherein the second substrate and the second conductive member are disposed in the receiving slot; at least part of the first conductive part is arranged on the second conductive adhesive part, and at least part of the second conductive part extends out of the second conductive adhesive part.

10. The circuit board assembly of claim 8, wherein the first substrate defines a receiving slot, and the second substrate and the second conductive member are disposed in the receiving slot; the surface of the first substrate, on which the containing groove is formed, is defined as a first surface, at least part of the first conductive part is arranged on the first surface, and at least part of the second conductive part extends out of the first surface.

11. The circuit board assembly of claim 1, wherein the second conductive portion defines a first through hole, the first through hole penetrating the second conductive portion and exposing the first substrate.

12. The circuit board assembly of claim 1, wherein the first substrate further defines a recess, and a portion of the second conductive portion is disposed in the recess.

13. The circuit board assembly of claim 1, wherein the second substrate and the second conductive member further define a second via hole, the second via hole penetrating through the second substrate and the second conductive member.

14. The circuit board assembly of claim 13, further comprising a third conductive member, or the circuit board assembly further comprises a third conductive member and a fourth conductive member, wherein the third conductive member is disposed on a sidewall of the second through hole opened by the second substrate and the second conductive member, the fourth conductive member is disposed on the first surface, and the third conductive member connects the second conductive member and the fourth conductive member.

15. The circuit board assembly of claim 14, wherein when the circuit board assembly further comprises a third electrically conductive member and a fourth electrically conductive member, the circuit board assembly further comprises a plurality of vias extending through the fourth electrically conductive member, the second substrate, and the second electrically conductive member; the circuit board assembly further comprises a fifth conductive piece, the fifth conductive piece is arranged on the fourth conductive piece, the second substrate and the side wall of the via hole formed in the second conductive piece, and the fifth conductive piece is connected with the second conductive piece and the fourth conductive piece.

16. An electronic device, characterized in that the electronic device comprises a circuit board assembly according to any of claims 1-15.