CN108135079A - A kind of circuit board - Google Patents
A kind of circuit board Download PDFInfo
- Publication number
- CN108135079A CN108135079A CN201810012357.XA CN201810012357A CN108135079A CN 108135079 A CN108135079 A CN 108135079A CN 201810012357 A CN201810012357 A CN 201810012357A CN 108135079 A CN108135079 A CN 108135079A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- boss
- conductive component
- pedestal
- curved surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
Abstract
This application provides a kind of circuit boards, the circuit board is made of circuit board and the conductive component being arranged in the circuit board, the circuit board is made of at least one boss of pedestal and setting on the base, and the conductive component is disposed at least one boss surface.The circuit board that the application provides, conductive component is arranged on the surface of the boss of circuit board, conductive component stress suffered in drawing process can be effectively reduced, that is, strain of the conductive component in drawing process is reduced, so as to reduce the variation of resistance value of the conductive component in drawing process.Reduce influence of the resistance variations of conductive component to circuit board performance, improve the performance of circuit board.
Description
Technical field
This application involves electronics fields, more specifically, a kind of circuit board being related in electronics field.
Background technology
In recent years, wearable device opens huge application city in Information and Communication Technology, health care etc.
.Wearable device, which not only needs to meet, to be minimized, lightweight and low-power consumption, and to consider human body personal design and
Ensure the comfort level of wearing.In order to meet these demands, very important point is exactly the circuit board made in wearable device
Have tensility, and stretchable metal line can be realized in stretchable circuit board.But for current
Wearable device, it is very serious there are one during stretchable metal line is realized in stretchable circuit board
The problem of：The resistance of stretchable metal line is especially big as circuit board changes during stretching.It can cause in this way
The performance of metal line in circuit board is seriously degenerated, and seriously affects the normal performance of wearable device.Therefore, it realizes small
The stretchable metal line of the wearable device of type, and ensure that it reduces the variation of its resistance to the greatest extent in drawing process and seems
It is extremely important.
Invention content
This application provides a kind of circuit boards, can so that conductive component in the circuit board is electric when circuit board is stretched
The variation of resistance is smaller.Reduce influence of the resistance variations of conductive component to circuit board performance, improve the performance of circuit board.
In a first aspect, providing a kind of circuit board, the circuit board is by circuit board and is arranged in leading in the circuit board
Electrical components form, which is characterized in that the circuit board is made of at least one boss of pedestal and setting on the base, at this
The conductive component is disposed at least one boss surface.
The circuit board that first aspect provides, conductive component is arranged in the boss surface of circuit board, without directly setting
It puts on base-plates surface.Conductive component stress suffered in drawing process can be effectively reduced, that is, reduces conductive component and exists
Strain in drawing process, so as to reduce the variation of resistance value of the conductive component in drawing process.Reduce conductive component
Influence of the resistance variations to circuit board performance improves the performance of circuit board.
In a kind of possible realization method of first aspect, the shape on the surface of at least one boss includes：Plane, wave
At least one of the curved surface of shape wave and zigzag curved surface.In the realization method, boss has above-mentioned several surface shapes
Shape can improve the stability of the conductive component of arrangement, improve the property of circuit board in order to the manufacture of boss and arrangement conductive component
Energy saves the manufacture cost of circuit board.
In a kind of possible realization method of first aspect, the shape on the surface of at least one boss includes waveform
In the case of at least one of curved surface and zigzag curved surface, also, the height of the trough of the waveform curved surface and/or zigzag curved surface
In the case that degree is identical with the height of the pedestal, which is arranged in the wave crest of the waveform curved surface or zigzag curved surface
Place.In the realization method, which is arranged at the wave crest of the waveform curved surface or zigzag curved surface.Increasing can be reached
The purpose of conductive component forced area arranged in the boss surface is added in, so as to reduce conductive component resistance when stretching at this
Variation, improve the performance of circuit board.
In a kind of possible realization method of first aspect, the thickness of at least one boss is d1, the thickness of the pedestal
It spends for d2, d1And d2Ratio be ranging from less than or equal to 3, and more than or equal to 0.5.In the realization method, in boss
Upper arrangement conductive component, can be while manufacture circuit board cost and control circuit plate bulk be saved, and further reduce is drawn
The variation of conductive component resistance when stretching the circuit board.Improve the performance of the circuit board.
In a kind of possible realization method of first aspect, the material identical of the pedestal and at least one boss or
It is different.In the realization method in the case of the material identical of pedestal and boss, convenient for the global formation of circuit board, and
And in the case of material identical, the overall mechanical properties that can cause circuit board are identical, and the mechanics for improving circuit board is special
Property and performance.It, can be according to pedestal and the specific different requirement of boss in the different situation of the material of pedestal and boss
Flexible selection material improves flexibility and the performance of circuit board selection.
In a kind of possible realization method of first aspect, the material of the material of the pedestal and/or at least one boss
Material includes any one or more in following material：Silicon rubber, polydimethylsiloxane, thermoplastic polyurethane TPU.
In the realization method, circuit board is prepared using these materials, material source is convenient, saves the cost of manufacture circuit board.And
And it can so that the tensility of the circuit board is more prominent, and with preferable rigidity.Extend the use of the circuit board
Service life.
In a kind of possible realization method of first aspect, which includes being arranged at least one boss table
Metal line on face and/or the chip being bonded at least one boss surface.It, not only can be in electricity in the realization method
The variation of metal line resistance is reduced during roadbed plate stretching, the stress at die bonding can also be reduced, improve the reliable of bonding
Property, so as to improve the reliability of circuit board and performance.
In a kind of possible realization method of first aspect, the material of the metal line includes：Gold, silver, copper, carbon, on
State material nano particle or nano wire and the conducing composite material that is made of above-mentioned nano particle or nano wire it is any one
Kind.In the realization method, material source is convenient, can save the cost of manufacture circuit board.Also, gone out by these material manufactures
Metal line tensility it is more prominent, and with preferable rigidity, extend the use of the metal line and circuit board
Service life.
Second aspect provides a kind of terminal device, including radio circuit and processor, the radio circuit and the processor
At least one of include circuit in any one possible realization method of above-mentioned first aspect or above-mentioned first aspect
Plate.
The terminal device that second aspect provides, when the component of terminal device is stretched, i.e., the circuit board quilt in the component
During stretching, conductive component can be effectively reduced because resistance variations are excessive caused by strain is excessive.It can cause circuit base
The variation of conductive component resistance when circuit board is stretched on plate reduces.Reduce the resistance variations of conductive component to circuit
The influence of plate performance.The performance of circuit board and the performance of the component are improved, so as to improve the performance of the terminal device and user's body
It tests.
Description of the drawings
Fig. 1 is the structure diagram of the metal line material of the composite material composition cylinder of metallic particles and resin.
Fig. 2 is printed on the signal in circuit board by the metal line that the composite material of metallic particles and resin forms
Figure.
Fig. 3 is that the metal line that the existing composite material by metallic particles and resin forms is printed on plane circuit base
The schematic diagram of cross-sectional structure on plate.
Fig. 4 is the schematic diagram of the circuit board cross-sectional structure of the application one embodiment.
Fig. 5 is the schematic diagram of the relationship of pulling force being subject on stress and the cross section on a certain cross section of object.
Fig. 6 is the schematic diagram of the circuit board cross-sectional structure of the application one embodiment.
Fig. 7 is the structure diagram of the circuit board cross-sectional of the application one embodiment.
Fig. 8 is the structure diagram of the circuit board cross-sectional of the application another embodiment.
Fig. 9 is the schematic diagram of the circuit board cross-sectional structure of the application one embodiment.
Figure 10 is the schematic diagram of the circuit board cross-sectional structure of the application another embodiment.
Figure 11 is the schematic diagram of the circuit board cross-sectional structure of the application one embodiment.
Figure 12 is the schematic diagram of the circuit board cross-sectional structure of the application another embodiment.
Figure 13 is the change of the resistance of the extensibility and metal line of circuit board when arranging metal line in circuit board
Relational graph between rate.
Figure 14 is the schematic diagram of the mold cross-sectional structure of the application one embodiment.
Figure 15 is that the liquid material coating rear mold that circuit board is carried out on mold of the application one embodiment is transversal
The schematic diagram of face structure.
Figure 16 is the schematic diagram of the circuit board cross-sectional structure of the application another embodiment.
Figure 17 is the cross-sectional structure that silver ink water rear mold is coated in the groove of mold of another embodiment of the application
Schematic diagram.
Figure 18 is the liquid of deposited traces substrate in the mold with metal ink layer of another embodiment of the application
The schematic diagram of the cross-sectional structure of material rear mold.
Figure 19 is the schematic diagram of the cross-sectional structure of the circuit board of the application another embodiment.
Figure 20 is the circuit board cross-sectional knot formed after adhering chip in the circuit board of the application one embodiment
The schematic diagram of structure.
Figure 21 is the schematic diagram of the mold cross-sectional structure of the application another embodiment.
Figure 22 is the schematic diagram of the circuit board cross-sectional structure of the application another embodiment.
Specific embodiment
Below in conjunction with attached drawing, the technical solution in the application is described.
Terminal device in the embodiment of the present application can be wearable device, which can refer to user equipment, connect
Enter terminal, subscriber unit, subscriber station, movement station, mobile station, remote station, remote terminal, mobile equipment, user terminal, terminal,
Wireless telecom equipment, user agent or user apparatus.Terminal device can also be cellular phone, wireless phone, session initiation association
Discuss (Session Initiation Protocol, SIP) phone, wireless local loop (Wireless Local Loop, WLL)
It stands, personal digital assistant (Personal Digital Assistant, PDA), the handheld device with wireless communication function, meter
Calculate equipment or be connected to other processing equipments of radio modem, mobile unit, the terminal device in future 5G networks or
Terminal device in the Public Land Mobile Network network (Public Land Mobile Network, PLMN) of person's future evolution
Deng, for example, wearable device can be flexible sports watch, motion bracelet, flexibility sensor etc..The product of its mainstream
Form is included using wrist as the watch kind (including the products such as wrist-watch and wrist strap) supported, using the footwear that foot is support (including footwear, socks
Son or future other legs on wearable product), using head for support glasses class (including glasses, the helmet, headband etc.) and
All kinds of non-mainstream product form such as intelligent clothing, school bag, crutch, accessories etc..The embodiment of the present application does not limit this.
For wearable device, the circuit board in wearable device is made to minimize and have tensility and is pursued at present
Target.Circuit board in wearable device is by circuit board and the conductive component being printed in circuit board (for example, hardware cloth
Line) composition.That is, it is required that circuit board miniaturization is obtained in wearable device and has tensility, and can
Stretchable metal line is realized in stretchable circuit board, forms final stretchable circuit board.In order to make circuit
The miniaturized structure of substrate and metal line, researcher have invented the hardware cloth being made of the composite material of metallic particles and resin
Line.This novel metal line material has tensility in itself, can be printed in stretchable circuit board.Fig. 1 is
The structure diagram of the metal line material of the composite material of metallic particles and resin composition cylinder.In Fig. 1, it is round to represent
Metallic particles exists between metallic particles and metallic particles and largely contacts.The other parts of cylinder are filled by resin.
Fig. 2 is printed on the schematic diagram in circuit board by the metal line that the composite material of metallic particles and resin forms.In Fig. 2,
A large amount of metal line is arranged in circuit board.Fig. 3 is the gold that the existing composite material by metallic particles and resin forms
Belong to the schematic diagram for the cross-sectional structure that wiring is printed in plane circuit board.As shown in figure 3, more metal lines are arranged in
It in the circuit board of plane, can contact, can not also contact between metal line and metal line.And not in plane
Metal line is arranged on all surfaces of the circuit board of type.For example, by being arranged in by the metal line that silver ink water is prepared
In the circuit board of plane.In the case of traditional metal wiring structure shown in Fig. 3, due to the thickness of metal wiring layer
Very small, under normal circumstances, the thickness of circuit board is tens times or even hundreds times of metal line layer thickness.It is equivalent to metal
The ratio of the thickness of wiring layer and the thickness of circuit substrate layer is almost 0.For same reference data, it is equivalent to metal
The height (the sum of thickness of metal line layer thickness and circuit board) of wiring layer and the height (thickness of circuit board of circuit board
Degree) ratio be almost 1.When circuit board is stretched, since the cross-sectional area of entire circuit board everywhere is held when stretching
The pulling force received is identical, and pulling force is acted in circuit board, and the surface layout of circuit board have a thickness very little have gold
Belong to wiring layer, the cross-sectional area for being equivalent to the stress of metal wiring layer and circuit substrate layer is identical.Therefore, the strain of the two
It is identical.And during the use of user, finally so that circuit board achievees the purpose that certain strain is final.In electricity
When base board is stretched, since the strain of circuit board and the strain facies of metal line are same.The resistance value of metal line is with gold
Belong to the variation of cloth line strain, the variation of resistance value is very big.For example, when circuit board is stretched to 50% strain, quite
50% strain is stretched in metal line, the resistance value of metal line can increase to 24 times of initial value.
As described above, when circuit board is stretched, since the stress that circuit board and metal line are subject to is identical
's.When circuit board is stretched, metal line can also be stretched.Therefore, in metal line, gold in resin metal particles and gold
Contact area between metal particles can be reduced, and can lead to the resistance of the metal line material in circuit board can increase in this way.Example
Such as, when the strain of circuit board reaches 20%, the strain that metal line is stretched to 20%, the resistance of metal line are equivalent to
Value can be increased to more than twice of initial value.It seriously degenerates so as to cause the conducting wire in circuit board, seriously affects conductor wire
The sensitivity on road and normal performance so that the hydraulic performance decline of circuit board, so as to seriously affect the performance of wearable device and just
Normal operating accuracy, poor user experience.
Based on the above problem, the embodiment of the present application provides a kind of circuit board, can cause the conduction in circuit board
Component (for example, metal line when) variation of resistance when circuit board is stretched is smaller.The resistance for reducing conductive component becomes
Change the influence to wearable device performance, the performance of circuit board is improved, so as to improve the performance of wearable device and user experience.
Fig. 4 is the schematic diagram for the circuit board cross-sectional structure that the application one embodiment provides.As shown in figure 4, the circuit
Plate is made of circuit board and the conductive component being arranged in the circuit board.The circuit board is by pedestal and is arranged on the pedestal
On at least one boss composition, be disposed with the conductive component at least one boss surface.
Specifically, as shown in figure 4, the circuit board is by circuit board and the conductive component group being arranged in the circuit board
Into the circuit board is made of, also, at least one boss of pedestal and setting on the base at least one boss table
The conductive component is disposed on face.I.e. conductive component is not directly arranged on pedestal, and is arranged on the boss of the circuit board
On surface.Pedestal in the embodiment of the present application is equivalent to circuit board shown in Fig. 3.In this way, when the circuit board is stretched,
Since conductive component is arranged in the boss surface.It is compared to the setting of existing circuit board and conductive component, conductive part
Part has the forced area of bigger, by the pulling force that circuit board and conductive component are born be it is identical, conductive component
The stress being subject to can be less than the stress that circuit board is subject to.That is the strain that the strain of conductive component is compared to circuit board can subtract
It is small.When circuit board is stretched while being stretched (be equivalent to circuit board), conductive component can be effectively reduced because straining
Resistance variations are excessive caused by big.The conductive component in circuit board boss surface can be caused in circuit board (pedestal) quilt
The variation of resistance reduces during stretching.Reduce influence of the resistance variations of conductive component to circuit board performance.Improve circuit board
Performance, so as to improve the performance of wearable device and user experience.
It is specifically illustrated below in conjunction with Fig. 5 and Fig. 6.
Fig. 5 is the schematic diagram of the relationship of pulling force being subject on stress and the cross section on a certain cross section of object.Such as Fig. 5
Shown, stress (σ) on a certain cross section can be by the pulling force (F) and the corresponding cross section that are received on the cross section
Forced area (S) is calculated according to formula (1)：
σ(N/mm2)=F (N)/S (mm2) (1)
By formula (1) it is found that answering on the cross section can be reduced by increasing the forced area on a certain cross section
Power.Therefore, circuit board provided by the embodiments of the present application is made of circuit board and the conductive component being arranged in circuit board.
The circuit board is made of at least one boss structure of pedestal and setting on the base, at least one boss surface
It is disposed with the conductive component.Fig. 6 is the schematic diagram for the circuit board cross-sectional structure that the application one embodiment provides.The circuit
Substrate is made of at least one boss and pedestal.The thickness of boss is d1, the thickness of the part of the pedestal is d2.Conductive component (example
Such as, the metal material of liquid either chip) it coating or is bonded on the surface of the boss.As shown in Figure 6.Boss and pedestal can
To be made by identical or different material.For example, can be dimethyl silicone polymer (Poly dimethyl siloxane,
PDMS), thermoplastic polyurethane (Thermoplastic polyurethanes, TPU) or silicon rubber etc..Conductive component is arranged
In boss surface, i.e., in the boss surface of circuit board.Conductive component can take up the surface of entire boss, can also account for
According to a part for boss surface.The structure of circuit board provided by the embodiments of the present application can be by changing d1/d2Ratio adjust
Save the stress distribution in boss surface.According to above-mentioned formula (1), compared to relatively thin region (thickness d2), thick region
(thickness d1+d2) there is the cross-sectional area of bigger.The cross-sectional area in thick region is (d1+d2) multiply the width (length) of pedestal, it is thin
The cross-sectional area in region is d2Multiply the width (length) of pedestal.Since the width (length) of pedestal is equal, thick region has larger
Cross-sectional area.According to the interaction of power, when circuit board (pedestal) is stretched, the horizontal stroke of entire circuit board everywhere during stretching
The pulling force that sectional area is born is identical, and therefore, the stress in the big region of cross-sectional area is less than the small region of cross-sectional area
Stress.According to the force equation that elastic properties of materials deforms, stress is multiplied by strain equal to elasticity modulus, for specific material, bullet
Property modulus is a constant.Therefore, the relationship between the resistance value of conductive component and the strain of conductive component and conductive component
Relationship between resistance value and the stress of conductive component is identical.Conductive component is arranged in the boss surface of circuit board, it can
To effectively reduce conductive component (for example, metal line) stress suffered in drawing process, that is, reduce conductive component and drawing
Strain during stretching, so as to reduce the variation of resistance value of the conductive component in drawing process.Reduce the electricity of conductive component
Influence of the resistive to circuit board performance improves the performance of circuit board, so as to improve the performance of wearable device and user experience.
Optionally, the shape on the surface of at least one boss includes：Plane, corrugated curved surface and zigzag curved surface
At least one of.
Specifically, Fig. 7 is the structure diagram of the circuit board cross-sectional of the application one embodiment.It as shown in fig. 7, should
The surface of boss can be plane, which is arranged on all or part of surface of the plane boss.Alternatively, figure
8 be the structure diagram of the circuit board cross-sectional of the application another embodiment.As shown in figure 8, the boss has trapezoidal horizontal stroke
Cross sectional shape.The manufacture cost of circuit board can be saved in order to the manufacture of boss and arrangement conductive component.It should be understood that.The boss
The cross-sectional shape or other cross-sectional shapes that can also have curl trapezoidal.This is not restricted for the embodiment of the present application.
Optionally, the surface of the boss can also be corrugated curved surface or zigzag curved surface.Fig. 9 is the application one
The schematic diagram of the circuit board cross-sectional structure of a embodiment.As shown in figure 9, the surface of the boss can be corrugated song
Face.Alternatively, Figure 10 is the schematic diagram of the circuit board cross-sectional structure of the application one embodiment.As shown in Figure 10, the boss
Surface can be zigzag curved surface.Conductive component is printed or is bonded on the waveform or zigzag curved surface.Wave
The boss of the curved surface of shape or zigzag curved surface can the very raising conductive component of limits quantity, improve the conduction of arrangement
The stability of component.Also, when circuit board is stretched, due to corrugated curved surface or zigzag curved surface inherently
With tensility, therefore, the variation that conductive component is strained when stretching significantly more efficient can be reduced.So as to significantly more efficient
Reduce the variation degree of conductive component resistance.
It should be understood that in the embodiment of the present application, Fig. 9 and Figure 10 only depict the feelings that a boss is set in circuit board
Condition can also include multiple boss structures as shown in Figure 9 and Figure 10 in circuit board.Moreover, boss structure on pedestal
Surface can also be other shapes.Also, multiple boss structures on the pedestal can be the group for having different surfaces shape
It closes.For example, there are 3 boss on the pedestal.First boss has the surface of planar shaped, and second boss has shown in Fig. 9
Corrugated surface.Third boss has zigzag surface shown in Fig. 10.This is not restricted for the embodiment of the present application.
Optionally, in the shape on the surface of at least one boss includes waveform curved surface and zigzag curved surface at least
In the case of one kind, also, the height feelings identical with the height of the pedestal of the trough of the waveform curved surface and/or zigzag curved surface
Under condition, which is arranged at the wave crest of the waveform curved surface or zigzag curved surface.
Specifically, as shown in figure 11, Figure 11 is the signal of the circuit board cross-sectional structure of the application one embodiment
Figure.The circuit board includes multiple boss, and all boss all have corrugated surface, the height of the waveform curved surface trough
(the sum of thickness at the trough of boss and the thickness of pedestal) is identical with the height of the pedestal.Thickness i.e. at the trough of boss with
The sum of thickness of pedestal is identical with the thickness of pedestal, the thickness d of boss at trough1It is 0.Alternatively, as shown in figure 12, Figure 12 is this
Apply for the schematic diagram of the circuit board cross-sectional structure of one embodiment.The circuit board includes multiple boss, and all boss are all
With zigzag surface, the height (the sum of thickness of thickness and pedestal at the trough of boss) of the zigzag curved surface trough with
The height of the pedestal is identical.Thickness and the sum of the thickness of pedestal i.e. at the trough of boss is identical with the thickness of pedestal, at trough
The thickness d of boss1It is 0.Here " height " refers to relative to same reference data, using the reference data as under 0 height
Relative altitude.In this case, due to the height of waveform curved surface or zigzag curved surface trough and the height phase of the pedestal
Together.Be equivalent at the trough of boss and be not provided with boss, i.e., at the trough of boss arrange conductive component strain and directly
The same, the cross-sectional area phase of conductive component stress in the case of two kinds in the strain that conductive component is arranged on the pedestal of no boss
Together, therefore the stress that is subject to is also identical.Conductive component is arranged i.e. at the trough of waveform curved surface or zigzag curved surface not
Can achieve the purpose that increase this at conductive component stress cross-sectional area, it is impossible to reduce the stress and strain that conductive component is subject to,
The variation of conductive component resistance when stretching at this cannot be reduced.It is equivalent to the wave in waveform curved surface or zigzag curved surface
At paddy, the thickness d of the boss1It is 0.Therefore, which should be arranged in the wave of the waveform curved surface or zigzag curved surface
At peak, i.e., conductive component is arranged in d1More than 0 region, the conductive component stress surface for increasing and being arranged on the boss can be reached
Long-pending purpose, so as to reduce the variation of conductive component resistance when stretching at this.
It should be understood that in embodiments herein, the surface of the pedestal can be such as the plane as shown in Fig. 9 to 12, when
Can also be so curved surface, for example, waveform curved surface.I.e. at least one boss can be located at the pedestal with waveform curved surface
On.The surface of the pedestal can also be the surface of other shapes, for example, zigzag surface.The embodiment of the present application is not made herein
Limitation.
It should also be understood that in the embodiment of the present application, in multiple boss on the base, multiple boss can be respectively provided with
Different surfaces.And it is possible to conductive component is arranged on some or all of boss in multiple boss, on each boss
The conductive component of arrangement can regard a complete circuit as.For example, the surface of multiple boss can include waveform curved surface
With zigzag curved surface.As long as the thickness of boss is more than 0, i.e. d1More than 0, it is possible to conductive component is arranged on the boss, i.e.,
So that the cross-sectional area of the stress of conductive component increases, to reduce the stress and strain that conductive component is subject to, reduce conductive at this
The variation of component resistance when stretching.This is not restricted for the embodiment of the present application.
Figure 13 is metal line (one kind of conductive component) to be arranged in traditional plane circuit board and in the application
When metal line is arranged in the circuit board for the structure with boss that embodiment provides, the extensibility and hardware cloth of circuit board
Relational graph between the change rate (R/R0) of the resistance of line.In the embodiment of the present application, the extensibility of circuit board is pedestal
Extensibility.R0 is resistance when circuit board does not stretch, i.e., the resistance of metal line when circuit board extensibility is 0%.R
For resistance of the metal line under a certain extensibility of circuit board.As can be seen from Figure 13.It is provided in the embodiment of the present application
Circuit board on boss on arrange conductive component, metal line can be effectively reduced with resistance when circuit board stretches
Variation.The variation of circuit board conductive component resistance when stretching is reduced, improves the performance of circuit board.
Optionally, the thickness of at least one boss is d1, the thickness of the pedestal is d2, d1And d2Ratio ranging from
Less than or equal to 3, and more than or equal to 0.5.
Specifically, it is illustrated for shown in fig. 6.The thickness of some boss is d in the circuit board1, should
The thickness of pedestal is d2, in d1And d2Ratio be ranging from less than or equal to 3, and more than or equal in the case of 0.5, according to
The result of simulation can save manufacture circuit board cost and control circuit plate body it is found that arrange conductive component on the boss
While product, the further variation for reducing conductive component resistance when stretching the circuit board.Improve the performance of the circuit board.
It should be understood that in the embodiment of the present application, the surface for boss structure is waveform curved surface or zigzag curved surface, d1
Value to be calculated according to different positions.For example, calculate the stress at tooth peak or at wave crest, d1Measure tooth peak or
At person's wave crest.When calculating the stress at tooth paddy or at trough, d1It measures at tooth paddy or at trough.d1And d2Ratio
Also meet other value conditions.This is not restricted for the embodiment of the present application.
Optionally, the material identical or difference of the pedestal and at least one boss.
Specifically, the material of the pedestal and at least one boss may be the same or different, in material identical
In the case of, convenient for the global formation of circuit board, also, in the case of material identical, it can cause the entirety of circuit board
Mechanical property is identical, improves the mechanical characteristic and performance of circuit board.In the different situation of the material of pedestal and boss,
Can material flexibly be selected from the specific different requirement of boss according to pedestal, improve the flexibility and use of circuit board selection
Performance.
Optionally, the material of the material of the pedestal and/or at least one boss includes any one in following material
It is or a variety of：Silicon rubber, polydimethylsiloxane, thermoplastic polyurethane TPU.
It should be understood that in the embodiment of the present application, the material of the pedestal and/or at least one boss can be PDMS, silicon
Rubber and TPU combinations of any one or more.Or it can also be other common circuit baseplate materials.Using these materials come
The pedestal and boss are prepared, material source is convenient, saves the cost of manufacture circuit board.And it is possible to the so that circuit produced
The tensility of substrate is more prominent, and with preferable rigidity.Extend the service life of the circuit board.The embodiment of the present application
This is not restricted.
Optionally, which includes being arranged in metal line and/or bonding at least one boss surface
Chip at least one boss surface.
Specifically, the conductive component can include printing or be coated on the surface of at least one boss, and
With the conductive metal layer that certain thickness conductive material is formed, the conductive metal layer on each boss can regard a gold as
Belong to wiring.Either or by the metal line prepared in advance directly weld or be bonded on the boss.It for example, will
The conductive material of liquid is coated on all or part of surface of at least one boss, and formation can be with metal line.Alternatively,
Can also be by conductive adhesive on the surface of at least one boss chip.Alternatively, it can also be first leading liquid
Electric material is coated on all or part of surface of at least one boss, and chip then is pasted onto the painting by conducting resinl
It is furnished on the boss of conductive material.In this way, can not only reduce the variation of metal line resistance when circuit board stretches, may be used also
To reduce the stress at die bonding, the reliability of bonding is improved, so as to improve the reliability of circuit board and performance.
It should be understood that.In the embodiment of the present application, which can be curved surface.The chip of the curved can be arranged in tool
Have at the wave crest of waved surface or zigzag curved surface boss and at trough.When the surface of at least one boss is curved surface,
Certain positions of the wave crest of its curved surface can also make planar shaped, for arranging chip.What can preferably be realized in this way should
The tensile property of circuit board improves the stability of conductive component.It is applied in wearable device, wearable set can be improved
Standby performance and user experience.
It should be understood that in the embodiment of the present application, which can also include bonding, weld or be printed on the boss
On other electronic components etc., this is not restricted for the embodiment of the present application.
Optionally, the material of the metal line includes：Gold, silver, copper, carbon, the nano particle of above-mentioned material or nano wire, with
And any one for the conducing composite material being made of above-mentioned nano particle or nano wire.By the use of these materials as conductive material
To manufacture metal line.Or directly the conductive material of liquid is coated on boss and forms metal line.Material source is convenient,
Save the cost of manufacture circuit board.Also, it is more prominent by the tensility of metal line that these material manufactures go out, and have
There is preferable rigidity, extend the service life of the metal line and circuit board.
For example, the conductive material being coated in the boss surface can be silver ink water, copper ink etc..It can also be copper nanometer
The composite material of line or nano silver wire or copper nano-wire and nano silver wire composition.
In another example the conductive material can also be copper nano particles either silver nano-grain or copper nano particles and silver
The composite material of nano particle composition.
In another example the conductive material can also be the composite material or silver nanoparticle of copper nano particles and resin composition
The composite material of grain and resin composition.
In another example the conductive material can also be organic conductive material, such as polyaniline, semiconductor, silicon or indium oxide
Tin, alloy or compound conductive material etc..
It should be understood that in the embodiment of the present application, which can also be the conductive material of other types or type.
This is not restricted for the embodiment of the present application.
With reference to specific embodiment, the manufacture circuit board of the embodiment of the present application is described in detail.
Embodiment one：
First, the mold of the circuit board is prepared on a silicon substrate by photoetching and etching technique, mold cross section knot
The schematic diagram of structure is as shown in figure 14, at least one groove which has and circuit board is mutually identical.It is as follows：
By photoresist film graphically on a silicon substrate, exposed region is then etched away by the mixed acid solution of hydrofluoric acid and hydrogen peroxide
Domain.After etching, the depth and width of the groove needed, as shown in figure 14, the width and depth of groove be respectively 500 μm and
150μm.Photoresist film is washed using acetone solvent.Obtain mold as shown in figure 14.Then, by rod coater in mould
The liquid material of liquid, i.e. deposited traces substrate of the coating with retractility thin-film material on tool.In the present embodiment, pedestal and convex
The material of platform is identical.If pedestal is different with the material of boss, the coating of the liquid material of boss can be first carried out, treats it
After solidification, then carry out the coating of the liquid material of pedestal.Figure 15 is after the liquid material of the progress circuit board on mold is coated with
The schematic diagram of mold cross-sectional structure.In the groove of mold and other parts carry out the liquid material coating of circuit board respectively
Or printing.Ultimately form the circuit board.The pedestal and the material of boss that the present embodiment uses are PDMS, are kept at 70 DEG C
100 minutes i.e. curable.Then, the PDMS after curing from mold is stripped down, just obtains the circuit board.Utilize Figure 15
The shape for the circuit board that shown Mold Making goes out is as shown in figure 16.Wherein, the thickness of the boss in the circuit board is d1,
The thickness of pedestal is d2, in the present embodiment, the amount of the liquid material by controlling coated base so that d2Value also be 150 μm.
That is d1And d2Value be respectively 150 μm and 150 μm.Finally, metallic ink is dropped in the boss surface in the circuit board.Gold
The thickness for belonging to ink layer is 20nm.Plain conductor can be formed in 30 minutes by being heated to 100 DEG C of heat preservations.The metallic ink that the present embodiment uses
Water is silver ink water.When the design by mold groove and the control of the amount of the fluent material of deposited traces substrate, by d1And d2Thickness
When angle value control is 170 microns and 150 microns, d1/d2Ratio for 1.1, at this point, the stress of metal line becomes conventional plane
The half of stress suffered by metal line on type substrate.In the present embodiment, the thickness of the layer of metallic ink can be in coating metal ink
It is controlled during water layer.Thickness, shape and the position of metal ink layer can arbitrarily control.As long as in the boss surface i.e.
It can.
Embodiment two：
First, the mold of the circuit board is prepared on a silicon substrate by photoetching and etching technique, the structure of the mold is such as
Shown in 14, which has and the mutually identical groove of circuit board.It is as follows：Photoresist film is patterned in silicon substrate
On plate, the exposed region of silicon is then etched away by the mixed acid solution of hydrofluoric acid and hydrogen peroxide.After etching, needed
The depth and width of groove, as shown in figure 14, the width and depth of groove are respectively 500 μm and 150 μm.It is clear using acetone solvent
Wash off photoresist film.Obtain mold as shown in figure 14.Then, applying conductive material or tack core in the groove of the mold
Piece.In the present embodiment, it is silver ink water to use conductive material.Silver ink water is dropped in the groove of mold.The thickness of silver inks water layer
No more than the depth of groove.Figure 17 is the schematic diagram for the cross-sectional structure that silver ink water rear mold is coated in the groove of mold.
For example, the thickness of the silver inks water layer is 20nm, then, chip with silver inks water layer or is being bonded with by rod coater
The liquid material of liquid, i.e. deposited traces substrate of the coating with retractility thin-film material on mold.In the present embodiment, pedestal and
The material of boss is identical.If pedestal is different with the material of boss, the coating of the liquid material of boss can be first carried out, is treated
After it is solidified, then carry out the coating of the liquid material of pedestal.Figure 18 is the deposited traces base in the mold with metal ink layer
The schematic diagram of the cross-sectional structure of the liquid material rear mold of plate.The pedestal and the material of boss that the present embodiment uses are PDMS,
It keeps can be cured for 100 minutes at 70 DEG C.Then, under the PDMS for containing metal line (silver inks water layer) is removed from mold
Come, just obtain the circuit board.Figure 19 is the schematic diagram of the cross-sectional structure of circuit board obtained by this method.Pass through control
The amount of the liquid material of coated base so that the thickness d of pedestal2Value for 100 μm, the thickness of boss is d1.That is d1And d2Value
Respectively 150 μm and 100 μm.Since elder generation carries out bonding or the coating of conductive component in the groove of mold, conductive part
It the position of part should be in groove.In the present embodiment, it is the groove by mold in the thickness of metal ink layer, location and shape
Location and shape control.
Embodiment three：
Due to the stress problem in circuit board drawing process, directly chip is welded or is adhered in circuit board
It is a key technology.The embodiment of the present application is also valuable for the welding of chip and stretching circuit board.First, pass through
Photoetching and etching technique prepare the mold of the circuit board on a silicon substrate, and the structure of the mold is as shown in figure 14, mold tool
There is the groove mutually identical with circuit board.It is as follows：By photoresist film graphically on a silicon substrate, then pass through hydrogen
The mixed acid solution of fluoric acid and hydrogen peroxide etches away the exposed region of silicon.After etching, the depth and width of the groove needed
Degree, as shown in figure 14, the width and depth of groove are respectively 500 μm and 150 μm.Photoresist film is washed using acetone solvent.
Obtain mold as shown in figure 14.Then, the liquid with retractility thin-film material is coated on mold by rod coater,
That is the liquid material of deposited traces substrate.In the present embodiment, the material of pedestal and boss is identical.If pedestal and boss
Material is different, can first carry out the coating of the liquid material of boss, after its solidification, then carries out the painting of the liquid material of pedestal
Cloth.The pedestal and the material of boss that the present embodiment uses are PDMS, keep can be cured for 100 minutes at 70 DEG C.It then, will be solid
PDMS after change is stripped down from mold, just obtains circuit board.The circuit board gone out using the Mold Making shown in Figure 14
The schematic diagram of cross-sectional structure is as shown in figure 16.Amount by the liquid material for controlling coated base so that the thickness d of pedestal2
Value be 100 μm.The thickness of boss is d1, d1And d2Value be respectively 150 μm and 100 μm.By die bonding in the circuit base
Plate has in boss surface.Figure 20 is the signal of circuit board cross-sectional structure formed after adhering chip in the circuit board
Figure.As shown in figure 20.The adhering chip in the boss surface of the circuit board.The adhesive linkage can be conductive tape, Huo Zheke
Chip is welded on the boss in a manner of using welding, the thickness of the adhesive linkage is the thickness of the welding layer.In this way may be used
To effectively reduce the stress of adhesive linkage, the reliability of adhering chip is improved.Improve the service life of the circuit board.
Example IV：
The present embodiment is the circuit board for being directed to the boss with waveform or zigzag curved surface, with sawtooth curved surface
Boss circuit board for illustrate.First, which is prepared by photoetching and etching technique on a silicon substrate
Mold, the schematic diagram of the mold cross-sectional structure is as shown in figure 21, the mold have and the mutually identical groove of circuit board,
I.e. the surface of the mold groove is also zigzag.It is as follows：By photoresist film graphically on a silicon substrate, Ran Houtong
The mixed acid solution for crossing hydrofluoric acid and hydrogen peroxide etches away the exposed region of silicon.After etching, the depth of the groove needed
With width to get the height gone out to incised groove wave crest and trough, since silicon has anisotropy, etched by etchant solution
When can also have anisotropy.Therefore, the surface of zigzag or corrugated groove can be obtained.Then, pass through bar type
Coating machine is coated with the liquid material of liquid, i.e. deposited traces substrate with retractility thin-film material on mold.The present embodiment
In, the material of pedestal and boss is identical.If pedestal is different with the material of boss, the liquid material of boss can be first carried out
Coating, after its solidification, then carry out the coating of the liquid material of pedestal.The pedestal and the material of boss that the present embodiment uses be
PDMS, keeps can be cured for 100 minutes at 70 DEG C.Then, the PDMS after curing from mold is stripped down, just obtains electricity
Base board.The cross-sectional structure of circuit board gone out using the Mold Making shown in Figure 21 is as shown in figure 22.Then in the sawtooth
The arrangement of conductive component is carried out on the boss of shape.For example, carry out the printing of conductive material of liquid or the bonding of chip.
The embodiment of the present application provides a kind of terminal device, which includes radio circuit and processor storage,
Any one or more circuit boards provided including any one above-mentioned embodiment in the radio circuit and processor.
Terminal device provided by the embodiments of the present application, the circuit board in the terminal device by circuit board and are arranged in the electricity
Conductive component composition on base board, the circuit board have at least one boss structure, also, at least one boss knot
The conductive component is disposed on structure.I.e. conductive component is not directly arranged in the circuit board of plane, and is arranged on the electricity
On the boss structure of base board.When circuit board is stretched while being stretched (be equivalent to circuit board), it can effectively reduce and lead
Electrical components are because resistance variations are excessive caused by strain is excessive.The conductive component in circuit board can be caused in circuit board
The variation of resistance reduces when being stretched.Reduce influence of the resistance variations of conductive component to circuit board performance.Improve circuit board
Performance, so as to improve the performance of the terminal device and user experience.
It should be understood that the terminal device is other than including above-mentioned radio circuit, processor, can also include memory,
The components such as input unit, display unit, voicefrequency circuit, power supply, sensor.The memory, input unit, display unit, audio
One or more in the components such as circuit, power supply, sensor can also include above-mentioned circuit board provided by the embodiments of the present application.
It will be understood by those skilled in the art that the component that above-mentioned terminal device includes does not form the restriction to terminal device, for example,
The terminal device can either combine certain components or different components arrangement including more or fewer components.This includes
Other component can include above-mentioned circuit board provided by the embodiments of the present application.
It should also be understood that above-mentioned be intended merely to that those skilled in the art is helped to more fully understand the embodiment of the present application, and have to
Limit the range of the embodiment of the present application.Those skilled in the art are according to given above-mentioned example, it is clear that can carry out various etc.
The modification or variation of valency either above-mentioned arbitrary two kinds or the arbitrarily combination of various embodiments.Such modification, variation or group
Scheme after conjunction is also fallen into the range of the embodiment of the present application.
It should also be understood that term "and/or" in the embodiment of the present application, only a kind of incidence relation for describing affiliated partner,
Expression may have three kinds of relationships.Specifically, A and/or B can be represented：Individualism A exists simultaneously A and B, individualism B
These three situations.In addition, character "/" herein, it is a kind of relationship of "or" to typically represent forward-backward correlation object.
Those of ordinary skill in the art may realize that each exemplary lists described with reference to the embodiments described herein
Member and algorithm steps can be realized with the combination of electronic hardware or computer software and electronic hardware.These functions are actually
It is performed with hardware or software mode, specific application and design constraint depending on technical solution.Professional technician
Described function can be realized using distinct methods to each specific application, but this realization is it is not considered that exceed
Scope of the present application.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit can refer to the corresponding process in preceding method embodiment, and details are not described herein.
The specific embodiment of the above, only the application, but the protection domain of the application is not limited thereto, it is any
In the technical scope that those familiar with the art discloses in the application, change or replacement can be readily occurred in, should all be contained
It covers within the protection domain of the application.Therefore, the protection domain of the application should be based on the protection scope of the described claims.
Claims (8)
1. a kind of circuit board, the circuit board is made of circuit board and the conductive component being arranged in the circuit board,
It is characterized in that, the circuit board is made of pedestal and at least one boss being arranged on the pedestal, described at least one
The conductive component is disposed in a boss surface.
2. circuit board according to claim 1, which is characterized in that the shape on the surface of at least one boss includes：
At least one of plane, corrugated curved surface and zigzag curved surface.
3. circuit board according to claim 2, which is characterized in that the shape on the surface of at least one boss includes
In the case of at least one of waveform curved surface and zigzag curved surface, also, the waveform curved surface and/or zigzag curved surface
In the case that the height of trough is identical with the height of the pedestal, the conductive component is arranged in the waveform curved surface or sawtooth
At the wave crest of shape curved surface.
4. circuit board according to claim 1 or 2, which is characterized in that the thickness of at least one boss is d1, it is described
The thickness of pedestal is d2, d1And d2Ratio be ranging from less than or equal to 3, and more than or equal to 0.5.
5. circuit board according to any one of claim 1 to 4, which is characterized in that the pedestal with it is described at least one
The material identical or difference of boss.
6. circuit board according to any one of claim 1 to 5, which is characterized in that the material of the pedestal and/or described
The material of at least one boss includes any one or more in following material：Silicon rubber, polydimethylsiloxane, heat
Plastic polyurethane TPU.
7. circuit board according to any one of claim 1 to 6, which is characterized in that the conductive component includes being arranged in
Metal line at least one boss surface and/or the chip being bonded at least one boss surface.
8. a kind of terminal device, which is characterized in that the terminal device include radio circuit and processor, the radio circuit and
At least one of described processor includes the circuit board described in any one of claim 1 to 7.
Priority Applications (1)
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| CN201810012357.XA CN108135079B (en) | 2018-01-05 | 2018-01-05 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810012357.XA CN108135079B (en) | 2018-01-05 | 2018-01-05 | Circuit board |
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| CN108135079B CN108135079B (en) | 2020-07-28 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113556860A (en) * | 2020-04-26 | 2021-10-26 | 深圳市柔宇科技有限公司 | Circuit board assembly and electronic equipment |
| TWI823772B (en) * | 2023-02-08 | 2023-11-21 | 友達光電股份有限公司 | Electronic device and method for fabricating the same |
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|---|---|---|---|---|
| US6319024B1 (en) * | 1999-06-09 | 2001-11-20 | Avaya Technology Corp. | Strain relief mechanism for a plug-in protector panel |
| JP2006202913A (en) * | 2005-01-19 | 2006-08-03 | Ricoh Co Ltd | Wiring structure and method of manufacturing the same |
| CN107148808A (en) * | 2014-08-29 | 2017-09-08 | 诺基亚技术有限公司 | Device and associated method for deformable electronic device |
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2018
- 2018-01-05 CN CN201810012357.XA patent/CN108135079B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6319024B1 (en) * | 1999-06-09 | 2001-11-20 | Avaya Technology Corp. | Strain relief mechanism for a plug-in protector panel |
| JP2006202913A (en) * | 2005-01-19 | 2006-08-03 | Ricoh Co Ltd | Wiring structure and method of manufacturing the same |
| CN107148808A (en) * | 2014-08-29 | 2017-09-08 | 诺基亚技术有限公司 | Device and associated method for deformable electronic device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113556860A (en) * | 2020-04-26 | 2021-10-26 | 深圳市柔宇科技有限公司 | Circuit board assembly and electronic equipment |
| TWI823772B (en) * | 2023-02-08 | 2023-11-21 | 友達光電股份有限公司 | Electronic device and method for fabricating the same |
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| CN108135079B (en) | 2020-07-28 |
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