CN113551769A - Focal plane assembly structure for hyperspectral earth observation ultraviolet imaging spectrometer - Google Patents
Focal plane assembly structure for hyperspectral earth observation ultraviolet imaging spectrometer Download PDFInfo
- Publication number
- CN113551769A CN113551769A CN202110817350.7A CN202110817350A CN113551769A CN 113551769 A CN113551769 A CN 113551769A CN 202110817350 A CN202110817350 A CN 202110817350A CN 113551769 A CN113551769 A CN 113551769A
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- focal plane
- heat
- heat sink
- sink copper
- copper block
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- 238000003384 imaging method Methods 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 91
- 239000010949 copper Substances 0.000 claims abstract description 91
- 229910052802 copper Inorganic materials 0.000 claims abstract description 91
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 32
- 239000010439 graphite Substances 0.000 claims abstract description 32
- 230000017525 heat dissipation Effects 0.000 claims abstract description 15
- 229910001069 Ti alloy Inorganic materials 0.000 claims abstract description 3
- 238000003825 pressing Methods 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 8
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 238000001228 spectrum Methods 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 230000007704 transition Effects 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 2
- 238000002788 crimping Methods 0.000 claims 1
- 238000012856 packing Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 6
- 238000001444 catalytic combustion detection Methods 0.000 description 67
- 238000013461 design Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000571 coke Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 230000010349 pulsation Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000003380 propellant Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/429—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to measurement of ultraviolet light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A40/00—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production
- Y02A40/10—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production in agriculture
Abstract
The invention discloses a focal plane component structure of an ultraviolet imaging spectrometer for hyperspectral earth observation, which comprises: the heat sink copper block 2(6) penetrates through a middle bayonet of the C-shaped CCD drive circuit board and is limited by a flange, a 275CCD pin and the circuit board are welded to form a connector, the connector is installed on the focal plane cover plate (5) through a heat insulation flexible gasket (10), the heat sink copper block 1(4) is connected with the heat sink copper block 2(6) through a red copper screw, the heat sink copper block 1(4) is installed on the focal plane cover plate (5) through a titanium alloy gasket in a heat insulation mode, the hot end of the auxiliary graphite film heat conduction band (3) is adhered to the 275CCD shell, the cold end is adhered to the hot end of the flexible graphite film heat conduction cable (2), the heat sink copper block 1(4) is pressed on the heat sink copper block through the flexible heat conduction cable, and heat is transferred to the satellite heat dissipation system through the flexible graphite film heat conduction cable (2) to achieve heat dissipation. The whole set of device can realize the requirement of the CCD on thermal elasticity and mechanical stability, and meet the thermal control index of a 275CCD element.
Description
Technical Field
The invention belongs to the technical field of focal plane assembly structure design in space remote sensing engineering, and relates to a focal plane assembly structure for a hyperspectral earth observation ultraviolet imaging spectrometer.
Background
The invention is mainly used for quantitatively monitoring the distribution and the change of global/regional trace pollutant gas components (O3, NO2, HCHO, SO2 and the like), acquiring the horizontal distribution of high spectral resolution and high spatial resolution of atmospheric trace gas, monitoring the air quality change of the upper part and the global part of China and the distribution and transportation process of pollutant gas, and analyzing the influence of the human activity emission and natural emission process on the atmospheric composition and the global climate change.
Because the CCD belongs to a precise electronic component, the internal structural characteristics determine that the CCD cannot bear larger stress and deformation, thrust pulsation change generated by unstable combustion of a launch vehicle engine, unbalanced rotation of rotating equipment, an aircraft structure and a liquid propellant which are special for a liquid launch vehicle, a storage tank and a supply system interact to generate longitudinal self-excited vibration under the pressure and the thrust pulsation change of a combustion chamber, inevitable assembly stress generated in the assembly process of a focal plane component and temperature stress caused by the fact that the CCD experiences the temperature difference from the ground to the space can influence the CCD, the focal plane structure is generally subjected to mechanical consideration, and the CCD is kept to be mechanically reliable under the condition of meeting the temperature requirement.
As the ultraviolet band signal is weaker, the high signal-to-noise ratio is crucial for a high-resolution imaging spectrometer and a spectrum instrument for detecting weak spectrum signals, and in order to enhance the detection capability of 300nm-500nm ultraviolet spectrum signals, many CCDs adopt the design of focal plane active and passive refrigeration structures, so that the dark current noise of the detector is reduced to enhance the signal-to-noise ratio of the system, and the spectrometer can carry out long-time integral imaging on weak targets.
Disclosure of Invention
The 275 large area array CCD of E2V company is applied for the first time in engineering in the field of domestic and aerospace, and the invention provides a CCD refrigerating device which has simple and reasonable structure, small size and light weight, can keep the thermal elasticity and dynamic stability of the CCD and can provide refrigeration for the CCD to keep the temperature below-20 ℃ so as to meet the requirement of low signal-to-noise ratio.
In the prior art, the coke surface structure is complex, the process implementation difficulty is high, and in order to solve the technical problems, the adopted technical scheme is as follows: a focal plane assembly structure for a hyperspectral earth observation ultraviolet imaging spectrometer comprises a flexible heat conducting cable pressing plate (1), a flexible graphite film heat conducting cable (2), an auxiliary graphite film heat conducting belt (3), a heat sink copper block (1) (4), a focal plane cover plate (5), a heat sink copper block (2) (6), a focal plane box body (7), a focal plane assembly fixing plate (8), a CCD heat insulating plate (9), a heat insulating flexible gasket (10), a focal plane assembly connecting leg (1) (11), a focal plane assembly connecting leg (2) (12) and an E2V275CCD and C-shaped CCD driving circuit board, wherein the heat sink copper block (2) (6) penetrates through a bayonet of the C-shaped CCD driving circuit board and is limited by a flash edge of the heat sink copper block (2) (6), a CCD 275 heat radiating surface and a contact surface of the heat sink copper block (2) (6) are filled with silicon rubber, a 275 pin penetrates through a welding hole of the C-shaped CCD driving circuit board for welding, the heat sink copper block (1) (4) is installed on the focal plane cover plate (5), the heat sink copper blocks 1 and 4 and the heat sink copper blocks 2 and 6 are fastened and connected by red copper screws, the hot end of the auxiliary graphite film heat conduction band (3) is adhered to a 275CCD shell, the cold end of the auxiliary graphite film heat conduction band is connected with the hot end of the flexible graphite film heat conduction cable (2) in a pressing mode through the flexible heat conduction cable pressing plate (1) on the heat sink copper blocks 1 and 4 to form a CCD heat dissipation surface central heat conduction path which is connected with a CCD side surface shell heat conduction path in parallel, and heat inside the focal surface is transferred to the satellite heat pipe through the flexible graphite film heat conduction cable (2) and finally transferred out through the radiation cooling plate. The focal plane box body (7) is connected with the focal plane cover plate (5), the CCD thermal baffle (9) is connected with the focal plane box body (7), and the focal plane box body (7) is connected to the focal plane component fixing plate (8) through a focal plane component connecting leg (1), (11) and a focal plane component connecting leg (2), (12).
Preferably, the heat-conducting heat sink is composed of two parts, namely a heat sink copper block 1(4) and a heat sink copper block 2(6), wherein the two parts are made of red copper materials. Wherein, the heat sink copper block 2(6) is thicker, has higher rigidity and strong deformation resistance, and the heat sink copper block 1(4) is thinner, has larger surface area and is beneficial to heat transfer. The two are connected by red copper screws.
Preferably, the heat sink copper block 2(6) penetrates through a bayonet of the C-shaped CCD drive circuit board, the position is limited by the flange of the heat sink copper block 2(6), a small amount of silicon rubber is filled between the heat dissipation surface of the 275CCD and the contact surface of the heat sink copper block 2(6), and the pins of the 275CCD penetrate through welding holes of the C-shaped CCD drive circuit board for welding.
Preferably, the structural form of the C-shaped CCD driving circuit board increases the flexibility of the circuit board, and one end of the C-shaped CCD driving circuit board is opened to provide a space for thermal elasticity release of the heat sink copper blocks 2 (6).
Preferably, the thermally insulating flexible gasket (10) is a polyimide material.
Preferably, the hot end of the auxiliary graphite film heat conduction belt (3) is adhered to the 275CCD shell, and the cold end of the auxiliary graphite film heat conduction belt together with the hot end of the flexible graphite film heat conduction cable (2) is pressed on the heat sink copper block 1(4) through the flexible heat conduction cable pressing plate (1) to form a central heat conduction path of the CCD heat dissipation surface which is connected with the heat conduction path of the CCD side shell in parallel.
Preferably, the transition connection between the heat sink copper block 1(4) and the heat conduction system of the satellite heat pipe is a flexible graphite film heat conduction cable (2).
Preferably, the focal plane box body (7) is provided with a detachable CCD heat insulation plate (9).
The main technical indexes of the invention are as follows:
1) micro-stress contact is ensured between the CCD and the structural part;
2) the focal plane structure can ensure that the CCD meets the dynamic and thermoelastic stability under the severe mechanical environment;
3) the on-track starting working temperature of the CCD is kept below-20 ℃;
275CCD is not applied in domestic engineering, and has the advantages compared with the prior satellite-borne focal plane structure:
in the structural design, the structural form of the heat-conducting heat sink is firstly designed in a segmented mode and comprises a heat-sink copper block 1(4) and a heat-sink copper block 2(6), the heat-sink copper block 2(6) penetrates through a bayonet of the C-shaped CCD driving circuit board and is limited by the flange of the heat-sink copper block 2(6), a small amount of silicon rubber is filled between the heat-sink copper block 2(6) and a CCD heat dissipation surface for heat transfer, and finally the CCD is welded on the C-shaped CCD driving circuit board through CCD pins, and the heat-conducting heat sink copper block, the heat-sink copper block and the CCD heat dissipation surface form a whole in an assembly relation. When the heat sink copper blocks 1(4) are connected with the heat sink copper blocks 2(6), the stress transmitted to the CCD is smaller because the heat sink copper blocks 2(6) are thicker, have larger rigidity and stronger deformation resistance and have smaller self stress. Meanwhile, the design form of the C-shaped CCD driving circuit board can increase the flexibility of the circuit board, when the heat sink copper block 2(6) generates stress deformation, the C-shaped CCD driving circuit board can absorb the stress generated by the heat sink copper block, and the opening at one end is also beneficial to the stress release when the heat sink copper block 2(6) deforms, so that the stress transmitted to the heat dissipation surface of the CCD by the heat conduction heat sink can be greatly reduced through the structural design, and the micro-stress assembly of the CCD can also be realized. The C-shaped CCD driving circuit board is designed into a C-shaped one-end opening form, so that the assembly is convenient, and the assembly difficulty is reduced.
In the design of dynamic and thermoelastic stability, such as when the focal plane assembly is subjected to external vibrations, the absorption of vibrations can be carried out in two ways: 1. the flexible graphite film heat conducting cable (2) connected with the heat sink copper blocks (1) and (4) is used for isolating vibration generated by other parts such as external heat pipes to a certain degree. 2. The vibration transmitted to the inside of the focal plane can be partially responded by high rigidity offset of the heat sink copper blocks 2 and 6, meanwhile, partial vibration is transmitted to the C-shaped CCD driving circuit board through the flash, the vibration absorption is carried out by utilizing the flexibility of the C-shaped CCD driving circuit board, and the heat insulation flexible gasket (10) between the C-shaped CCD driving circuit board and the focal plane cover plate (5) can also absorb the vibration. Through the vibration isolation measures of the two aspects, the dynamic stability of the CCD is ensured. In addition to the above measures, the thermal elastic stability can also realize the free expansion of the heat sink copper blocks 2 and 6 through the opening at one end of the C-shaped CCD drive circuit board. Vibration tests of aerospace departments under given conditions prove that the CCD can still keep normal and stable work in a severe dynamic environment, and therefore the requirement of mechanical stability is met.
In the aspect of CCD cooling, the hot end of the auxiliary graphite film heat conduction belt (3) is adhered to the 275CCD shell, the cold end and the hot end of the flexible graphite film heat conduction cable (2) are connected in parallel with the heat sink copper block 1(4) in a pressing mode through the flexible heat conduction cable pressing plate (1) to form a central heat conduction path of a CCD radiating surface and a heat conduction path of the CCD side shell, the two paths of heat conduction are combined to improve the heat conduction efficiency, the reliability of a thermal control system is improved, the difficulty of an assembly process is reduced, and a complex structure such as active refrigeration is omitted. Vacuum thermal test proves that the temperature of the CCD detector can be reduced to-24 ℃ from the ambient temperature (25 ℃), and the temperature fluctuation after stabilization is less than 1 ℃, so that indexes such as dark current, thermal noise and the like generated in a CCD detector circuit are effectively inhibited.
Drawings
Fig. 1, fig. 2 and fig. 3 are schematic diagrams of a basic structure of the present invention.
In the figure, 1-flexible heat conducting cable pressing connection plate, 2-flexible graphite film heat conducting cable, 3-auxiliary graphite film heat conducting belt, 4-heat sink copper block 1, 5-focal plane cover plate, 6-heat sink copper block 2, 7-focal plane box body, 8-focal plane component fixing plate, 9-CCD heat insulating plate, 10-heat insulating flexible gasket, 11-focal plane component connecting leg 1, 12-focal plane component connecting leg 2.
Detailed Description
Preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
Referring to fig. 1, 2 and 3, a focal plane assembly structure for hyperspectral earth observation ultraviolet imaging spectrometer is composed as follows:
the heat sink copper block 26 passes through a C-shaped CCD driving circuit board bayonet and is limited by the flange of the heat sink copper block 26, the pins of the 275CCD are welded through the C-shaped CCD driving circuit board, a small amount of silicon rubber is filled between the heat dissipation surface of the 275CCD and the contact surface of the heat sink copper block 26, the heat sink copper block 14 is arranged on the coke surface cover plate 5 and is insulated by a titanium alloy gasket, the C-shaped CCD driving circuit board is arranged on the coke surface cover plate 5 by a heat insulation flexible gasket 10 which is matched with a size chain relationship, the copper block 14 is tightly connected with the heat sink copper block 26 by red copper screws, the hot end of the auxiliary graphite film heat conduction belt 3 is adhered to the 275CCD shell, the cold end of the auxiliary graphite film heat conduction belt is connected with the hot end of the flexible graphite film heat conduction cable 2 in a pressing mode through the flexible heat conduction cable pressing plate 1 on the heat sink copper block 14 in a pressing mode to form a central heat conduction path of a CCD heat dissipation surface, the central heat conduction path is connected with a heat conduction path of the CCD side shell in parallel, and heat inside a focal surface is transferred to the satellite heat pipe through the cold end of the flexible graphite film heat conduction cable 2 and finally transferred out through the radiation plate. The focal plane box 7 is connected with the focal plane cover plate 5, the CCD thermal baffle 9 is connected with the focal plane box 7, and the focal plane box 7 is connected to the focal plane component fixing plate 8 through a focal plane component connecting leg 111 and a focal plane component connecting leg 212.
A heat sink copper block 14 and a heat sink copper block 26, both of red copper material.
When the heat sink copper block 26 is used, the heat sink copper block 26 penetrates through a bayonet of the C-shaped CCD drive circuit board, the position is limited by the flash of the heat sink copper block 26, a small amount of silicon rubber is filled between the 275CCD radiating surface and the contact surface of the heat sink copper block 26, the 275CCD pins penetrate through welding holes of the C-shaped CCD drive circuit board for welding, and when the heat sink copper block 26 is assembled with the heat sink copper block 14, the heat sink copper block 26 is thick, high in rigidity and strong in deformation resistance, so that the self stress is small, and the micro-stress contact between the heat conduction heat sink and the radiating surface is realized; the vibration stress transmitted to the inside of the focal plane can be transmitted to the C-shaped CCD drive circuit board through the fins of the heat sink copper block 26, and the C-shaped flexible design of the C-shaped CCD drive circuit board and the heat insulation flexible gasket 10 between the C-shaped CCD drive circuit board and the focal plane cover plate 5 are utilized for absorbing vibration; the flexible graphite film heat conducting cable 2 connected with the heat sink copper block 14 is used for carrying out vibration isolation to a certain extent on vibration generated by other parts such as an external heat pipe; the design of the C-shaped CCD driving circuit board also provides a stress releasing space for the thermal deformation of the thermal precipitation copper block 26; the CCD heat dissipation surface → the heat sink copper block 26 → one path of heat conduction path of the heat sink copper block 14 and the CCD shell → the auxiliary graphite film heat conduction band 3 are connected in parallel and converged to the flexible graphite film heat conduction cable 2, and finally the heat is conducted to the external satellite heat pipe and the radiation cooling plate to perform the passive heat dissipation mode, so that the accurate temperature reduction of the CCD is completed.
It will be apparent to those skilled in the art that various modifications and variations can be made in the structure of a focal plane assembly for a hyperspectral earth observation ultraviolet imaging spectrometer of the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention are within the scope of the claims of the present invention and their equivalents, the present invention is also intended to encompass such modifications and variations.
Claims (8)
1. The utility model provides a focal plane subassembly structure for high spectrum earth observation ultraviolet imaging spectrometer, includes flexible heat conduction cable crimping board (1), flexible graphite membrane heat conduction cable (2), supplementary graphite membrane heat conduction area (3), heat sink copper billet 1(4), focal plane apron (5), heat sink copper billet 2(6), focal plane box body (7), focal plane subassembly fixed plate (8), CCD heat insulating board (9), thermal-insulated flexible packing ring (10), focal plane subassembly connecting leg 1(11), focal plane subassembly connecting leg 2(12) and E2V275CCD and C style of calligraphy CCD drive circuit board, its characterized in that:
1) the heat-conducting heat sink connected with the 275CCD heat dissipation surface consists of two parts, namely a heat sink copper block 1(4) and a heat sink copper block 2 (6);
2) the heat sink copper block 2(6) penetrates through a bayonet of the C-shaped CCD drive circuit board, the position is limited by the flash of the heat sink copper block 2(6), the contact surface between the 275CCD heat dissipation surface and the heat sink copper block 2(6) is filled with silicon rubber, and the 275CCD pin penetrates through a welding hole of the C-shaped CCD drive circuit board for welding;
3) a heat-insulating flexible gasket (10) is added between the C-shaped CCD drive circuit board and the focal plane cover plate (5) for connection;
4) the hot end of the auxiliary graphite film heat conduction belt (3) is adhered to the 275CCD shell, the cold end of the auxiliary graphite film heat conduction belt (3) and the hot end of the flexible graphite film heat conduction cable (2) are connected to the heat sink copper block (1) (4) in a pressing mode through the flexible heat conduction cable pressing plate (1), and a central heat conduction path of a CCD heat dissipation surface is formed and is connected with a heat conduction path of the CCD side shell in parallel;
5) the focal plane box body (7) is provided with a detachable CCD thermal baffle (9).
2. The focal plane assembly structure for a hyperspectral earth observation ultraviolet imaging spectrometer as claimed in claim 1 wherein: the heat sink copper blocks 1(4) and the heat sink copper blocks 2(6) are made of red copper materials; wherein the heat sink copper block 2(6) is thicker than the heat sink copper block 1 (4); the surface area of the heat sink copper blocks 1(4) is larger than that of the heat sink copper blocks 2(6), and the heat sink copper blocks are connected through red copper screws.
3. The focal plane assembly structure for a hyperspectral earth observation ultraviolet imaging spectrometer as claimed in claim 1 wherein: an opening at one end of the C-shaped CCD drive circuit board can provide space for thermal elasticity release of the heat sink copper blocks 2 and 6.
4. The focal plane assembly structure for a hyperspectral earth observation ultraviolet imaging spectrometer as claimed in claim 1 wherein: the heat insulating flexible gasket (10) is a polyimide gasket.
5. The focal plane assembly structure for a hyperspectral earth observation ultraviolet imaging spectrometer as claimed in claim 1 wherein: the heat in the focal plane is transferred to the heat pipe on the satellite through the flexible graphite film heat conducting cable (2) and finally is transferred out through the radiation plate.
6. The focal plane assembly structure for a hyperspectral earth observation ultraviolet imaging spectrometer as claimed in claim 1 wherein: the heat sink copper blocks 1 and 4 are in transition connection with the satellite heat pipe by adopting a flexible graphite film heat conducting cable (2).
7. The focal plane assembly structure for a hyperspectral earth observation ultraviolet imaging spectrometer as claimed in claim 1 wherein: the focal plane box body (7) is connected with the focal plane cover plate (5), the CCD thermal baffle (9) is connected with the focal plane box body (7), and the focal plane box body (7) is connected to the focal plane component fixing plate (8) through a focal plane component connecting leg (1) (11) and a focal plane component connecting leg (2) (12).
8. The focal plane assembly structure for a hyperspectral earth observation ultraviolet imaging spectrometer as claimed in claim 1 wherein: the heat sink copper blocks 1 and 4 are arranged on a focal plane cover plate (5) and are insulated by a titanium alloy gasket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110817350.7A CN113551769B (en) | 2021-07-20 | 2021-07-20 | Focal plane assembly structure for hyperspectral earth observation ultraviolet imaging spectrometer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110817350.7A CN113551769B (en) | 2021-07-20 | 2021-07-20 | Focal plane assembly structure for hyperspectral earth observation ultraviolet imaging spectrometer |
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| Publication Number | Publication Date |
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| CN113551769A true CN113551769A (en) | 2021-10-26 |
| CN113551769B CN113551769B (en) | 2023-06-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110817350.7A Active CN113551769B (en) | 2021-07-20 | 2021-07-20 | Focal plane assembly structure for hyperspectral earth observation ultraviolet imaging spectrometer |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5596228A (en) * | 1994-03-10 | 1997-01-21 | Oec Medical Systems, Inc. | Apparatus for cooling charge coupled device imaging systems |
| CN203801144U (en) * | 2014-04-03 | 2014-08-27 | 深圳市步步美科技有限公司 | Flexible printed circuit board, flexible printed circuit board arrangement structure and display device |
| CN112763095A (en) * | 2020-12-29 | 2021-05-07 | 中国科学院合肥物质科学研究院 | CCD temperature control system of satellite-borne hyperspectral detector |
-
2021
- 2021-07-20 CN CN202110817350.7A patent/CN113551769B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5596228A (en) * | 1994-03-10 | 1997-01-21 | Oec Medical Systems, Inc. | Apparatus for cooling charge coupled device imaging systems |
| CN203801144U (en) * | 2014-04-03 | 2014-08-27 | 深圳市步步美科技有限公司 | Flexible printed circuit board, flexible printed circuit board arrangement structure and display device |
| CN112763095A (en) * | 2020-12-29 | 2021-05-07 | 中国科学院合肥物质科学研究院 | CCD temperature control system of satellite-borne hyperspectral detector |
Non-Patent Citations (3)
| Title |
|---|
| 常振 等: "基于科学级CCD的紫外成像系统设计与实现", 中国激光, vol. 44, no. 8, pages 0804002 - 1 * |
| 张泉 等: "机载成像光谱仪CCD制冷系统设计与实现", 光子学报, vol. 46, no. 3, pages 0311004 - 1 * |
| 武耀 等: "光机热集成分析在高光谱成像仪紫外镜头中的应用", 应用光学, vol. 37, no. 2, pages 262 - 266 * |
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| Publication number | Publication date |
|---|---|
| CN113551769B (en) | 2023-06-13 |
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