CN113543479A - Ultrathin circuit board and preparation method thereof - Google Patents
Ultrathin circuit board and preparation method thereof Download PDFInfo
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- CN113543479A CN113543479A CN202010314097.9A CN202010314097A CN113543479A CN 113543479 A CN113543479 A CN 113543479A CN 202010314097 A CN202010314097 A CN 202010314097A CN 113543479 A CN113543479 A CN 113543479A
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- 238000002360 preparation method Methods 0.000 title abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 238000005553 drilling Methods 0.000 claims abstract description 73
- 238000000034 method Methods 0.000 claims abstract description 37
- 230000002093 peripheral effect Effects 0.000 claims abstract description 23
- 238000000926 separation method Methods 0.000 claims abstract description 11
- 238000012545 processing Methods 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The application discloses ultra-thin circuit board and preparation method thereof, the method includes: the method comprises the following steps of alternately stacking a substrate and separation paper, wherein the substrate comprises a circuit board area and a peripheral area arranged around the circuit board area, the circuit board area comprises a plurality of circuit board units, and each circuit board unit comprises at least two conductive layers which are stacked and not electrically connected; controlling the plate placing machine to sequentially grab the substrate and the separation paper to separate the substrate from the separation paper, and simultaneously controlling the plate placing machine to place the grabbed substrate on the laser drilling equipment after grabbing the substrate each time; and controlling the laser drilling equipment to form a first positioning through hole for positioning in the peripheral area, and forming a through hole communicated with at least two conductive layers in each circuit board unit. The preparation method provided by the application can simplify the preparation process of the ultrathin circuit board and improve the preparation efficiency of the ultrathin circuit board.
Description
Technical Field
The application relates to the technical field of circuit board preparation, in particular to an ultrathin circuit board and a preparation method thereof.
Background
With the vigorous development of the electronic industry, electronic products have entered into the research and development stage of functionalization and intellectualization, and on the premise, printed circuit boards are also developing towards light, thin, short and small design trends under the condition of satisfying the good electrical and thermal performance of electronic products.
Wherein along with the circuit board is more and more thin, more and more light, its processing degree of difficulty also is more and more big, and the inventor of this application discovers, to ultra-thin circuit board, if still use traditional processing technology to process it, harms the circuit board easily, makes its yields low, still can reduce machining efficiency simultaneously.
Disclosure of Invention
The technical problem mainly solved by the application is to provide the ultrathin circuit board and the preparation method thereof, which can simplify the preparation process of the ultrathin circuit board and improve the preparation efficiency of the ultrathin circuit board.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a method of manufacturing an ultra-thin circuit board, the method including: the method comprises the following steps of alternately stacking a substrate and separation paper, wherein the substrate comprises a circuit board area and a peripheral area arranged around the circuit board area, the circuit board area comprises a plurality of circuit board units, and each circuit board unit comprises at least two conductive layers which are stacked and not electrically connected; controlling a plate placing machine to sequentially grab the substrate and the separation paper to separate the substrate from the separation paper, and simultaneously controlling the plate placing machine to place the grabbed substrate on laser drilling equipment after grabbing the substrate each time; and controlling the laser drilling equipment to form a first positioning through hole for positioning in the peripheral area, and forming a through hole communicated with the at least two conductive layers in each circuit board unit.
In order to solve the above technical problem, another technical solution adopted by the present application is: the utility model provides an ultra-thin circuit board, ultra-thin circuit board is equipped with the via hole that is used for the positioning hole of location and communicates its interior at least two-layer conducting layer, wherein, positioning hole and the via hole all adopts laser drilling's mode to form.
The beneficial effect of this application is: this application sets up base plate and range upon range of crisscross setting of separation paper, the state of local vacuum has been avoided appearing between two adjacent base plates, thereby guarantee to put the trigger and can snatch the sola base plate automatically, create the condition for the mode formation first positioning through-hole that adopts laser drilling, on the other hand adopts the mode formation first positioning through-hole and conducting hole of laser drilling, thereby can adopt same laser drilling equipment to process in the course of working, need not to carry the base plate, can reduce the base plate and take place the possibility that warp and roll over the damage, and compare mechanical drilling, at the in-process that adopts laser drilling to form first positioning through-hole, need not the pin, lower pin, it is simple and fast, can realize processing automation, first positioning through-hole adopts laser drilling's mode to form in addition, its process dimension can not be restricted, can reach the ideal size.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic flow chart diagram of one embodiment of a method for manufacturing an ultra-thin circuit board according to the present application;
FIG. 2 is a schematic structural diagram of a staggered lamination arrangement of a substrate and a separating paper;
FIG. 3 is a schematic top view of a substrate;
FIG. 4 is a diagram of a manufacturing process corresponding to FIG. 1;
fig. 5 is a schematic structural diagram of an embodiment of the ultrathin circuit board of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing an ultra-thin circuit board according to the present invention, and with reference to fig. 2, fig. 3, and fig. 4, the method includes:
s110: the substrate 1000 and the separating paper 2000 are alternately stacked, wherein the substrate 1000 comprises a circuit board area 1100 and a peripheral area 1200 arranged around the circuit board area 1100, the circuit board area 1100 comprises a plurality of circuit board units 1110, and each circuit board unit 1110 comprises at least two conductive layers 1111 which are stacked and not electrically connected.
Specifically, the substrate 1000 in this application is an ultra-thin substrate, the thickness of which is usually below 60 μm, and the substrate 1000 and the separating paper 2000 (or a partition in other embodiments) are stacked in a staggered manner, that is, one separating paper 2000 is disposed between every two substrates 1000, and one substrate 1000 is disposed between every two separating papers 2000, so that a phenomenon that two adjacent substrates 1000 are tightly attached together due to partial vacuum caused by the fact that the substrate 1000 is too thin can be avoided, and conditions are created for a following plate placing machine to automatically grasp a single substrate 1000.
The substrate 1000 includes a circuit board region 1100 and a peripheral region 1200, wherein the circuit board region 1100 is processed to form a circuit pattern, the peripheral region 1200 is cut off, and the circuit board region 1100 includes a plurality of circuit board units 1110, and the circuit board units 1110 are cut in the subsequent process to be independent from each other to form an ultra-thin circuit board.
Meanwhile, each circuit board unit 1110 includes at least two conductive layers 1111 disposed in a stacked manner and not electrically connected to each other, and in a subsequent process, the conductive layers 1111 are patterned to obtain a circuit pattern.
In an application scenario, the substrate 1000 is a core board, and the two opposite surfaces of the substrate 1000 are both provided with the conductive layer 1111, wherein the conductive layer 1111 may be made of copper, which is an easily available and cheap material.
For convenience of description, the drawings schematically illustrate the substrate 1000 with the conductive layer 1111 disposed on both surfaces opposite to each other.
The base plate 1000 and the paper spacer 2000 may be stacked in a staggered manner by manual operation, or the base plate 1000 and the paper spacer 2000 may be stacked in a staggered manner by machine operation.
S120: the plate placing machine is controlled to sequentially grab the substrate 1000 and the separating paper 2000 to separate the substrate 1000 from the separating paper 2000, and meanwhile, after the plate placing machine grabs the substrate 1000 each time, the grabbed substrate 1000 is placed on the laser drilling equipment.
Specifically, since the substrate 1000 and the spacer paper 2000 are stacked in a staggered manner, the plate placing machine can automatically capture the substrate 1000, and at this time, the plate placing machine places the captured substrate 1000 on the laser drilling equipment after separating the substrate 1000 from the spacer paper 2000 each time.
S130: the laser drilling apparatus is controlled to form a first positioning through hole 1201 for positioning in the peripheral region 1200 and to form a via hole 1112 communicating at least two conductive layers 1111 in each circuit board unit 1110.
Specifically, the first positioning through hole 1201 is located in the peripheral region 1200, and is used for positioning the substrate 1000 according to the position of the first positioning through hole 1201 by various processing equipment in a subsequent process.
The via 1112 is connected to at least two conductive layers 1111, and a conductive material is formed in the via 1112 in a subsequent process to electrically connect the at least two conductive layers 1111.
In the present embodiment, the first positioning through hole 1201 and the via hole 1112 are formed by laser drilling. Laser drilling refers to a process that laser is focused and then used as a high-intensity heat source to heat materials, so that the materials in a laser action area are melted or gasified and then evaporated to form holes.
In the prior art, two substrates 1000 are generally placed in direct stacking contact, at this time, because the substrates 1000 are too thin, a partial vacuum state may occur in two adjacent substrates 1000, which results in that a processing device cannot grab a single substrate 1000, and only can grab the substrate 1000 manually by an operator, and further results in that a first positioning through hole 1201 can be processed on the substrate 1000 only in a mechanical drilling manner, and after the first positioning through hole 1201 is processed, a via hole 1112 is processed in a laser drilling manner, that is, in the prior art, two devices need to be used for processing the first positioning through hole 1201 and the via hole 1112, wherein the mechanical drilling process is as follows: the substrate 1000 is placed on the pins of a mechanical drilling apparatus, the first positioning through hole 1201 is then drilled, the substrate 1000 together with the pins is then removed from the mechanical drilling apparatus, and finally the substrate 1000 and the pins are separated.
In the above embodiment, the substrate 1000 and the spacer paper 2000 are stacked and staggered, so that a partial vacuum state between two adjacent substrates 1000 is avoided, and the plate placing machine can automatically grasp a single substrate 1000, conditions are created for forming the first positioning through hole 1201 by using a laser drilling method, and on the other hand, the first positioning through hole 1201 and the via hole 1112 are formed by using the laser drilling method, so that the same laser drilling equipment can be used for processing in the processing process, the substrate 1000 does not need to be carried, the possibility of deformation and breakage of the substrate 1000 can be reduced, compared with mechanical drilling, in the process of forming the first positioning through hole 1201 by using laser drilling, no pin or lower pin is needed, the method is simple and fast, the processing automation can be realized, and in addition, the first positioning through hole 1201 is formed by using the laser drilling method, the processing size of the first positioning through hole can not be limited, the ideal size can be achieved.
With reference to fig. 4, in the present embodiment, in consideration of the following steps of forming a conductive material in the via hole 1112 by using a method such as electroplating or vapor deposition, in order to ensure the robustness of the conductive material in the via hole 1112, the present application forms the via hole 1112 by using laser blind via drilling, so that the cross section of the via hole 1112 along the thickness direction of the substrate 1000 is hourglass-shaped, and the contact area between the conductive material and the via hole 1112 is increased.
Wherein, forming the via hole 1112 by using a laser blind hole opposite-punching mode means: a blind hole is formed on one side surface of the substrate 1000, and then a hole is drilled at the other side of the substrate 1000 corresponding to the blind hole to a connected blind hole, thereby forming a via hole 1112.
With reference to fig. 4, in order to ensure the processing accuracy of the via 1112, the step S130 specifically includes: controlling the laser drilling equipment to form a first positioning through hole 1201 in the peripheral area 1200 and a blind hole 1113 in each circuit board unit 1110 at the same time; controlling the laser drilling equipment to turn over the substrate 1000; controlling the laser drilling equipment to position the substrate 1000 according to the first positioning through hole 1201; and controlling the laser drilling equipment to drill holes on the substrate 1000 corresponding to the blind holes 1113 until the blind holes 1113 are communicated, thereby obtaining a through hole 1112 communicated with the at least two conductive layers 1111.
Specifically, after the substrate 1000 is turned over by 180 degrees by the laser drilling equipment, the substrate 1000 is positioned according to the first positioning through hole 1201, so that the drilling precision of the laser drilling equipment on the surfaces of the two sides of the substrate 1000 can be guaranteed to be the same, the machining success of the via hole 1112 is further guaranteed, other positioning marks or positioning holes do not need to be made, the machining steps are reduced, and the machining efficiency is improved.
It should be noted that, due to the nature of laser drilling, the first positioning through hole 1201 and the blind hole 1113 are both tapered holes, that is, both the first positioning through hole and the blind hole have trapezoidal cross sections along the thickness direction of the substrate 1000.
Continuing to refer to fig. 4, in the present embodiment, while the laser drilling apparatus forms the first positioning through hole 1201 and the blind hole 1113, a second positioning through hole 1114 is also formed on each circuit board unit 1110, wherein the second positioning through hole 1114 has a different function from the first positioning through hole 1201, and the second positioning through hole 1114 has a function of positioning the circuit board unit 1110 according to the position of the second positioning through hole 1114 when the individual circuit board units 1110 are required to be positioned after the circuit board units 1110 are independent from each other, for example, after the ultra-thin circuit board leaves a factory, if a purchaser of the ultra-thin circuit board needs to rework the ultra-thin circuit board, the processing apparatus may position the ultra-thin circuit board according to the function of the second positioning through hole 1114 during the processing process.
Like the first positioning through hole 1201 and the blind hole 1113, the second positioning through hole 1114 is also a tapered hole, i.e., it has a trapezoidal cross section along the thickness direction of the substrate 1000.
Of course, in other embodiments, the second positioning through hole 1114 may not be formed at the same time as the first positioning through hole 1201 and the blind hole 1113 are formed, and is not limited herein.
In the present embodiment, the laser drilling apparatus positions the substrate 1000 before the first positioning through hole 1201 is formed.
Specifically, the processing accuracy of the first positioning through-hole 1201 and the blind hole 1113 can be ensured by positioning the substrate 1000.
In other embodiments, the substrate 1000 may not be positioned before the first positioning through hole 1201 is formed, for example, a trigger may be provided to accurately feed the substrate 1000 to a fixed position of the laser drilling apparatus each time, and then the laser drilling apparatus directly processes the substrate 1000 when the laser drilling apparatus detects that the substrate 1000 exists at the fixed position.
In this embodiment, the laser drilling apparatus positions the substrate 1000 by photographing the edge of the substrate 1000.
Specifically, the edge position of the substrate 1000 is determined by photographing the edge of the substrate 1000, thereby positioning the substrate 1000.
In an application scenario, the laser drilling apparatus uses a CCD camera to photograph the edge of the substrate 1000 to position the substrate 1000.
In particular, the CCD camera has the advantages of low cost, low noise, low dark current, high sensitivity, wide spectral response, etc., and is widely used in the fields of industrial detection, etc.
In the present embodiment, the laser drilling apparatus simultaneously forms the first positioning through-hole 1201 and the blind hole 1113 using different processing parameters.
Specifically, the size requirements of the first positioning through hole 1201 and the blind hole 1113 are different, so that the first positioning through hole 1201 and the blind hole 1113 are formed simultaneously by using different processing parameters.
When the second positioning through holes 1114 need to be formed simultaneously, the laser drilling equipment processes the second positioning through holes 1114 according to processing parameters different from those of the first positioning through holes 1201 and the blind holes 1113, that is, although the laser drilling equipment simultaneously forms the first positioning through holes 1201, the second positioning through holes 1114 and the via holes 1112, the laser beams used are different, and are specifically determined by the sizes of the first positioning through holes 1201, the second positioning through holes 1114 and the blind holes 1113.
Wherein the processing parameter comprises at least one of laser power, pulse width and spot diameter.
With continued reference to fig. 4, after the via 1112 is formed, a conductive material is also disposed within the via 1112 in order to electrically connect the conductive layer 1111.
Specifically, a conductive material can be formed in the via 1112 by electroplating, wherein the conductive material can be at least one of copper, gold, and aluminum.
With continued reference to fig. 4, after the conductive material is disposed, the conductive layer 1111 is further patterned to form a circuit pattern, the peripheral region 1200 of the substrate 1000 is cut, and the circuit board region 1100 is cut to obtain a plurality of independent circuit board units 1110, i.e., ultra-thin circuit boards.
The circuit board area 1100 may be cut by mechanical cutting or laser cutting, which is not limited herein.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an ultra-thin circuit board 200 according to an embodiment of the present disclosure, which includes a positioning through hole 201 for positioning and a via hole 202 communicating with at least two conductive layers 210 therein, wherein the positioning through hole 201 and the via hole 202 are formed by laser drilling.
The via hole 202 in the present embodiment is the via hole 1112 in the above embodiment, and the positioning through hole 201 may be the first positioning through hole 1201 in the above embodiment, or may be the second positioning through hole 1114, and when the positioning through hole 201 is the first positioning through hole 1201, the ultra-thin circuit board 200 in the present application refers to the substrate 1000 from which the peripheral area 1200 is not cut, and when the positioning through hole 201 is the second positioning through hole 1114, the ultra-thin circuit board 200 refers to the circuit board unit 1110 in the above embodiment.
The manufacturing method of the ultra-thin circuit board 200 is the same as the related manufacturing method, and the detailed method can be referred to the above embodiment and is not described herein again.
In conclusion, the substrate and the separation paper are arranged in a stacking and staggered mode, the condition that partial vacuum exists between two adjacent substrates is avoided, thereby ensuring that the plate placing machine can automatically grab a single substrate, creating conditions for forming the first positioning through hole by adopting a laser drilling mode, forming the first positioning through hole and the conducting hole by adopting the laser drilling mode, therefore, the same laser drilling equipment can be adopted for processing in the processing process, the substrate does not need to be carried, the possibility of deformation and breakage of the substrate can be reduced, compared with mechanical drilling, in the process of forming the first positioning through hole by adopting laser drilling, an upper pin and a lower pin are not needed, the method is simple and rapid, the processing automation can be realized, in addition, the first positioning through hole is formed in a laser drilling mode, the machining size of the first positioning through hole is not limited, and the ideal size can be achieved.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A method for manufacturing an ultra-thin circuit board, the method comprising:
the method comprises the following steps of alternately stacking a substrate and separation paper, wherein the substrate comprises a circuit board area and a peripheral area arranged around the circuit board area, the circuit board area comprises a plurality of circuit board units, and each circuit board unit comprises at least two conductive layers which are stacked and not electrically connected;
controlling a plate placing machine to sequentially grab the substrate and the separation paper to separate the substrate from the separation paper, and simultaneously controlling the plate placing machine to place the grabbed substrate on laser drilling equipment after grabbing the substrate each time;
and controlling the laser drilling equipment to form a first positioning through hole for positioning in the peripheral area, and forming a through hole communicated with the at least two conductive layers in each circuit board unit.
2. The manufacturing method according to claim 1, wherein the step of controlling the laser drilling device to form a first positioning through hole for positioning in the peripheral area and a via hole communicating the at least two conductive layers in each of the circuit board units comprises:
and controlling the laser drilling equipment to form the first positioning through hole for positioning in the peripheral area, and forming the through hole in each circuit board unit in a blind hole opposite-drilling mode.
3. The method for manufacturing a printed circuit board according to claim 2, wherein the step of controlling the laser drilling device to form the first positioning through hole for positioning in the peripheral area and to form the via hole in each of the circuit board units by blind hole drilling includes:
controlling the laser drilling equipment to form the first positioning through hole for positioning in the peripheral area and form a blind hole in each circuit board unit;
controlling the laser drilling equipment to overturn the substrate;
controlling the laser drilling equipment to position the substrate according to the first positioning through hole;
and controlling the laser drilling equipment to drill holes at the positions, corresponding to the blind holes, of the substrate until the blind holes are communicated, so that the through holes communicated with the at least two conductive layers are obtained.
4. The manufacturing method according to claim 3, wherein before controlling the laser drilling apparatus while forming the first positioning through-hole for positioning in the peripheral area and forming a blind hole in each of the circuit board units, further comprising:
and controlling the laser drilling equipment to position the substrate.
5. The method of claim 4, wherein the step of controlling the laser drilling apparatus to position the substrate comprises:
and controlling the laser drilling equipment to photograph the edge of the substrate so as to position the substrate.
6. The manufacturing method according to claim 3, wherein the step of controlling the laser drilling device while forming the first positioning through-hole for positioning in the peripheral area, and forming a blind hole in each of the circuit board units, comprises:
and controlling the laser drilling equipment to simultaneously form the first positioning through hole and the blind hole by adopting different processing parameters, wherein the processing parameters comprise at least one of laser power, pulse width and spot diameter.
7. The manufacturing method according to claim 3, wherein the step of controlling the laser drilling apparatus while forming the first positioning through-hole for positioning in the peripheral area, forming a blind hole in each of the circuit board units, further comprises:
and controlling the laser drilling equipment to simultaneously form the first positioning through hole for positioning in the peripheral area, the blind hole and the second positioning through hole for positioning in each circuit board unit.
8. The method of manufacturing according to claim 1, further comprising:
and arranging a conductive material in the through hole to electrically connect the at least two conductive layers.
9. The method of manufacturing according to claim 8, further comprising:
cutting off the peripheral region of the substrate;
and cutting the circuit board area to obtain a plurality of independent circuit board units.
10. The utility model provides an ultra-thin circuit board, its characterized in that, ultra-thin circuit board is equipped with the via hole that is used for the positioning through hole of location and communicates its interior at least two-layer conducting layer, wherein, positioning through hole and the via hole all adopts laser drilling's mode to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010314097.9A CN113543479A (en) | 2020-04-20 | 2020-04-20 | Ultrathin circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010314097.9A CN113543479A (en) | 2020-04-20 | 2020-04-20 | Ultrathin circuit board and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113543479A true CN113543479A (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010314097.9A Pending CN113543479A (en) | 2020-04-20 | 2020-04-20 | Ultrathin circuit board and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6211485B1 (en) * | 1996-06-05 | 2001-04-03 | Larry W. Burgess | Blind via laser drilling system |
| CN101699936A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating |
| CN104244584A (en) * | 2013-06-24 | 2014-12-24 | 北大方正集团有限公司 | Laser drilling alignment method |
| CN110744628A (en) * | 2019-10-31 | 2020-02-04 | 东莞市开方实业有限公司 | Punch press all-in-one |
| CN110868804A (en) * | 2019-10-11 | 2020-03-06 | 衢州顺络电路板有限公司 | Method for manufacturing printed circuit board for portable card type equipment |
-
2020
- 2020-04-20 CN CN202010314097.9A patent/CN113543479A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6211485B1 (en) * | 1996-06-05 | 2001-04-03 | Larry W. Burgess | Blind via laser drilling system |
| CN101699936A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating |
| CN104244584A (en) * | 2013-06-24 | 2014-12-24 | 北大方正集团有限公司 | Laser drilling alignment method |
| CN110868804A (en) * | 2019-10-11 | 2020-03-06 | 衢州顺络电路板有限公司 | Method for manufacturing printed circuit board for portable card type equipment |
| CN110744628A (en) * | 2019-10-31 | 2020-02-04 | 东莞市开方实业有限公司 | Punch press all-in-one |
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Application publication date: 20211022 |