CN113542539B

CN113542539B - Photosensitive assembly with anti-shake function and corresponding camera module

Info

Publication number: CN113542539B
Application number: CN202010299235.0A
Authority: CN
Inventors: 陈飞帆; 戎琦; 袁栋立; 魏罕钢
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-04-16
Filing date: 2020-04-16
Publication date: 2022-10-04
Anticipated expiration: 2040-04-16
Also published as: CN113542539A; CN115699784A; WO2021208724A1

Abstract

The invention relates to a photosensitive assembly with an anti-shake function, which comprises: a circuit board; the photosensitive chip is arranged on the upper surface of the circuit board; the base is positioned below the circuit board and is connected with the circuit board through a support shaft; the supporting seat surrounds the periphery of the base, and the top surface of the supporting seat is suitable for mounting a lens component; and a driving module including a plurality of sub elevating driving modules disposed between the base and the circuit board and distributed around the supporting shaft. The invention also provides a corresponding camera module. The invention can realize the anti-shake function of the photosensitive assembly with smaller space cost and can realize optical anti-shake on a plurality of degrees of freedom.

Description

Photosensitive assembly with anti-shake function and corresponding camera module

Technical Field

The invention relates to the technical field of camera modules, in particular to a photosensitive assembly with an anti-shake function and a corresponding camera module.

Background

With the popularization of mobile electronic devices, technologies related to camera modules applied to mobile electronic devices for helping users to obtain images (e.g., videos or images) have been rapidly developed and advanced, and in recent years, camera modules have been widely applied to various fields such as medical treatment, security, industrial production, and the like. Currently, in the field of consumer electronics (e.g., the field of mobile phones), the optical anti-shake function has become one of the common functions of a camera module. When an electronic device (such as a smart phone) takes pictures, the shaking is inevitable for various reasons. For example, when a handheld smart phone is used for shooting, a photographer is often difficult to hold a stable mobile phone for a long time, the mobile phone is easy to be unstable due to key actions during shooting, and the situations can cause the picture shake in a view frame and influence the imaging quality of a camera module. Currently, optical anti-shake is typically achieved by optical image stabilizers. Optical Image Stabilizer, abbreviated as OIS. In the prior art, an optical image stabilizer is usually disposed on an optical lens of a camera module having an optical anti-shake function. Particularly, in order to improve the imaging quality of the camera module, most of the existing solutions are that a voice coil motor is arranged on the lens, the voice coil motor drives the lens to move, the shake of the lens is corrected, and the imaging quality is effectively improved. However, the anti-shake effect of the voice coil motor disposed in the optical lens is limited. On one hand, the camera module needs to rely on the photosensitive chip to image, and in many actual shooting scenes, the camera module shakes not only the optical lens, but also the photosensitive chip may shake. For example, when a photographer shakes the mobile phone unstably, not only the position of the optical lens but also the position of the photo sensor chip may be shifted, and merely adjusting the position of the optical lens may not be enough to correct the frame shift. On the other hand, the driving capability of the voice coil motor itself disposed in the optical lens is also limited, for example, the stroke of the voice coil motor is limited, and it is difficult to correct the shake when the shake amplitude is large.

In order to effectively promote the imaging quality of the camera module, the anti-shake technology aiming at the photosensitive chip appears in the prior art. For example, it is proposed to provide a pan/tilt head at the bottom of a photosensitive assembly, and the photosensitive assembly is mounted on the pan/tilt head to realize anti-shake. However, the volume occupied by the cradle head structure is large, the thickness of the mobile phone can be increased, and the current trend of thinning the smart phone is not met. Moreover, because the holder is large in size, for a smart phone with an extremely precious internal space, the adoption of the holder-based anti-shake scheme may significantly increase the design difficulty of the smart phone and occupy the space of other modules (such as a battery).

Therefore, there is a need for an anti-shake solution for photosensitive components that can be miniaturized.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide an anti-shake solution for a photosensitive assembly, which can realize miniaturization.

In order to solve the above technical problem, the present invention provides a photosensitive assembly with an anti-shake function, comprising: a circuit board; the photosensitive chip is arranged on the upper surface of the circuit board; the base is positioned below the circuit board and is connected with the circuit board through a supporting shaft; the supporting seat surrounds the periphery of the base, and the top surface of the supporting seat is suitable for mounting a lens component; and the driving module comprises a plurality of sub lifting driving modules, and the sub lifting driving modules are arranged between the base and the circuit board and distributed around the supporting shaft.

The plurality of sub-lifting driving modules are respectively arranged at different positions of the supporting shaft.

Each sub lifting driving module is suitable for driving the circuit board to ascend or descend at the position where the sub lifting driving module is located, and the inclination angle of the circuit board relative to the base is adjusted by controlling the driving force and the lifting direction of each sub lifting driving module.

The circuit board is rectangular; the plurality of sub-lifting driving modules are respectively arranged at the positions corresponding to the four corners of the circuit board.

The sub-lifting driving module comprises a first magnetic element connected with the bottom surface of the circuit board and a second magnetic element connected with the base.

The first magnetic element comprises a metal core connected with the bottom surface of the circuit board and a coil arranged on the metal core; or the first magnetic element is a magnet.

The second magnetic element comprises a metal core connected with the top surface of the base and a coil arranged on the metal core.

The second magnetic element is a magnet, and the magnet is embedded or partially embedded in the base.

Wherein the support shaft has elasticity.

Wherein, the support shaft is made of shape memory alloy.

The photosensitive assembly further comprises elastic supporting elements connected with the base and the circuit board, and the elastic supporting elements realize distributed elastic supporting at multiple positions of the circuit board.

The elastic supporting element comprises a plurality of springs, and two ends of each spring are connected with the bottom surface of the circuit board and the top surface of the base respectively.

The plurality of sub-lifting driving modules are also suitable for synchronously driving the circuit board to ascend or descend so as to adjust the height of the circuit board relative to the base.

The driving module also comprises a second driving module which comprises a shape memory alloy push rod, a push rod block, a bottom surface extension block and a base extension block; the base extends the piece by the top surface of base upwards extends and forms, the both ends of shape memory alloy push rod are connected respectively the base extends the piece with the push rod piece, the bottom surface extends the piece certainly the bottom surface of circuit board extends and forms, the push rod piece with the side of bottom surface extension piece sets up relatively.

When the shape memory alloy push rod is in a normal temperature state, a gap is formed between the push rod block and the side surface of the bottom surface extension block; the shape memory alloy push rod is suitable for stretching after the temperature is increased, so that the push rod block contacts and pushes the bottom surface extension block to move in the horizontal direction.

The driving module further comprises a second driving module, and the second driving module comprises a bottom surface extension block and a shape memory alloy wire; one end of the shape memory alloy wire is connected with the bottom surface extension block, and the other end of the shape memory alloy wire is connected with the supporting seat; the bottom surface extension block is formed by extending the bottom surface of the circuit board downwards.

The driving module further comprises a second driving module, and the second driving module comprises a bottom surface extension block and a shape memory alloy wire; one end of the shape memory alloy wire is connected with the bottom surface extension block, and the other end of the shape memory alloy wire is connected with the base extension block; the base extension block is formed by upward extension of the top surface of the base, and the bottom surface extension block is formed by downward extension of the bottom surface of the circuit board.

The driving module further comprises a second driving module, and the second driving module comprises a bottom surface extension block, a shape memory alloy push rod and a push rod block; the two ends of the shape memory alloy push rod are respectively connected with the supporting seat and the push rod block, the bottom surface extension block extends downwards from the bottom surface of the circuit board to form, and the side surfaces of the push rod block and the bottom surface extension block are oppositely arranged.

Wherein the driving module comprises at least one x-axis driving module and at least one y-axis driving module, wherein the x-axis driving module is the second driving module arranged along the x-axis direction and is suitable for driving the circuit board to move along the x-axis, and the y-axis driving module is the second driving module arranged along the y-axis direction and is suitable for driving the circuit board to move along the y-axis.

The x-axis driving module is arranged on an x-axis of the circuit board, wherein the x-axis is an axis of the circuit board parallel to the x-axis.

The y-axis driving module is arranged on the circuit board and on a y-axis, wherein the y-axis is an axis parallel to the y-axis of the circuit board.

The number of the x-axis driving modules is even, and the even number of the x-axis driving modules are symmetrically arranged on two sides of an x central axis of the circuit board; the driving force is synchronously applied by the x-axis driving modules on two sides of the x central axis to drive the circuit board to translate along the x axis; the driving force is applied by the x-axis driving module positioned on one side of the x central axis to form torque, so that the circuit board is driven to rotate around the z axis; wherein the x central axis is the central axis of the circuit board parallel to the x axis.

The number of the y-axis driving modules is even, and the even number of the y-axis driving modules are symmetrically arranged on two sides of a y central axis of the circuit board; the driving force is synchronously applied by the y-axis driving modules on two sides of the y central axis to drive the circuit board to translate along the y axis; the driving force is jointly applied by the x-axis driving module positioned on one side of the x central axis and the y-axis driving module positioned on one side of the y central axis to form torque, and then the circuit board is driven to rotate around the z axis; and the y central axis is the central axis of the circuit board parallel to the y axis.

Wherein, photosensitive assembly still includes: the two ends of the metal wire are respectively and electrically connected with the circuit board and the photosensitive chip; the optical filter is positioned above the photosensitive chip; and the optical filter seat is formed on the upper surface of the circuit board and surrounds the periphery of the photosensitive chip, and the optical filter is arranged on the optical filter seat.

The optical filter seat is a molding part which is manufactured on the upper surface of the circuit board through a molding process, and the metal wire is covered by the molding part.

Wherein, the supporting seat and the base are integrally formed.

According to another aspect of the present application, there is also provided a camera module, which includes: an optical lens; and any one of the photosensitive assemblies described above, wherein the optical lens is mounted on the support base of the photosensitive assembly.

The optical lens is provided with a motor, and the bottom of the motor is arranged on the top surface of the supporting seat of the photosensitive assembly.

Compared with the prior art, the application has at least one of the following technical effects:

1. this application can realize sensitization component's anti-shake function with less space cost.

2. The control device can realize the controlled movement of the circuit board and the chip attached to the circuit board in the z-axis direction, the Rx rotating direction and the Ry rotating direction. The x axis and the y axis are mutually perpendicular radial coordinate axes, the radial direction is a direction parallel to the photosensitive surface of the photosensitive chip, and the z axis is an axial (or height direction) coordinate axis, namely a coordinate axis in the normal direction of the photosensitive surface. Rx represents the direction of rotation about the x-axis, ry represents the direction of rotation about the y-axis, and Rz represents the direction of rotation about the z-axis.

3. The control method and the control device can realize the controlled movement of the circuit board and the chip attached to the circuit board in the x-axis direction, the y-axis direction and/or the Rz-axis rotation direction.

4. The controlled movement of the circuit board in the z-axis direction, the Rx rotating direction and the Ry rotating direction can be realized through the electromagnet formed by the extending column on the bottom surface of the circuit board.

5. The present application may enable controlled movement of a circuit board in an x-axis direction, a y-axis direction, and/or an Rz-axis rotational direction via SMA-based components.

6. Traditional module anti-shake can only be overcome in this application, makes its anti-shake more accurate through removing the chip.

7. The application provides an anti-shake structure, but realizability and designability are stronger, do benefit to and carry out large batch production.

Drawings

FIG. 1 is a schematic side view of a photosensitive assembly with an anti-shake function according to an embodiment of the present disclosure;

fig. 2 is a schematic top view illustrating the arrangement positions of the circuit board 10 and the driving module in an embodiment of the present application;

FIG. 3 is a schematic diagram illustrating the structure and operation of a sub-lift drive module in one embodiment of the present application;

fig. 4 is a schematic view showing the structure and operation of a sub-lift driving module according to another embodiment of the present application;

FIG. 5 is a schematic diagram illustrating a side view of a sub-lift drive module according to yet another embodiment of the present application;

FIG. 6 illustrates a schematic side view of an x-axis drive module in one embodiment of the present application;

FIG. 7 illustrates a schematic top view of a horizontal drive module in one embodiment of the present application;

FIG. 8 illustrates a schematic side view of an x-axis drive module in another embodiment of the present application;

fig. 9 shows a schematic top view of a horizontal drive module with Rz rotation functionality in an embodiment of the present application.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.

It will be further understood that the terms "comprises," "comprising," "includes," "including" and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after the list of listed features, that the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict.

The invention is further described below with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a schematic side view of a photosensitive assembly with an anti-shake function according to an embodiment of the present disclosure. Referring to fig. 1, in the present embodiment, a photosensitive assembly 100 includes a circuit board 10, a photosensitive chip 20 attached to an upper surface of the circuit board 10, a molding part 30 formed on the upper surface of the circuit board 10 and surrounding the photosensitive chip 20, and a filter 40 (also sometimes referred to as a color filter) mounted on a surface of the molding part 30. The bottom surface of the circuit board 10 is connected to a support shaft 70 in this embodiment, and the support shaft 70 may be located in a central region of the circuit board 10. The bottom end of the supporting shaft 70 is connected to a base 60, the edge portion of the base 60 can be connected to a supporting seat 61 (the supporting seat 61 can also be integrally formed with the base 60), the supporting seat 61 can be ring-shaped and surround the circuit board 10 and keep a certain interval with the circuit board 10, so that the circuit board 10 has a certain horizontal moving space, and the top surface of the supporting seat 61 is higher than the top surface of the molding part 30. The top surface of the support base 61 can be used for supporting and bonding the bottom surface of the optical lens assembly, thereby forming a complete camera module. In this embodiment, the photosensitive chip 20 can be electrically connected to the circuit board 10 through a Wire Bonding process (also called Wire Bonding). Metal wires (e.g., gold wires 12) for making electrical connection may be covered by the molding 30 to reduce the height and lateral dimensions of the photosensitive assembly 100. Here, the height is a dimension in the optical axis direction of the camera module (i.e., the normal direction of the light sensing surface), and the lateral dimension is a dimension in the direction perpendicular to the optical axis of the camera module. The driving module 50 is disposed between the bottom surface of the circuit board 10 and the base 60 in this embodiment to achieve controlled movement of the circuit board 10 relative to the base 60. When the photosensitive chip 20 shakes, the driving device can drive the circuit board 10 to move, so as to drive the photosensitive chip 20 attached to the circuit board 10 to move, and thus shake compensation is realized. In this embodiment, the photosensitive chip 20 is directly fixed on the upper surface of the circuit board 10, the photosensitive chip 20 is conducted with the circuit board 10 through the gold wire 12, and the gold wire 12 is encapsulated in the base (i.e., the molding portion 30) of the optical filter 40 by using a molding process, so that the gold wire 12 can be protected from a breakpoint problem caused by frequent movement of the circuit board 10. Meanwhile, due to the molding process, the height of the module base 60 can be effectively reduced. The optical lens can be directly fixed together by glue and the supporting base 61 (in another embodiment, the top of the supporting base 61 can also be designed into a thread structure matching with the optical lens, and the optical lens can be fixed on the supporting base 61 by the thread structure). Because the shooting device shakes, corresponding shake can also occur to the components installed in the shooting device, and when the detection device detects the shake, the driving module 50 can be controlled to drive the photosensitive chip 20 to perform corresponding shake compensation, so that adverse effects of the shake on the shooting process are avoided, and the imaging quality of the module is effectively improved. With the chip anti-shake structure, when the position of the photosensitive chip 20 is shifted relative to the optical axis of the lens (for example, the photographing device shakes to move the position of the photosensitive chip 20 correspondingly), the position detection module (not shown in fig. 1) can detect the shift of the photosensitive chip 20, and transmit the information to the control center, and the control center controls the photosensitive chip 20 to move to some extent according to a preset program to compensate the influence caused by shaking. The driving module 50 provides power for the movement of the whole of the photosensitive chip 20 and the circuit board 10, so that the chip can move to a proper position to compensate for the shake, thereby effectively improving the imaging quality of the module.

Further, fig. 2 is a schematic top view illustrating an arrangement position of the circuit board 10 and the driving module in an embodiment of the present application. Referring to fig. 2, the driving module includes a multi-point elevating driving module. Generally, the photo-sensing chip has a rectangular shape. The multi-point elevation driving module may include four sub elevation driving modules corresponding to four corners of the photo sensor chip, i.e., a first sub elevation driving module 1, a second sub elevation driving module 3, a third sub elevation driving module 4, and a fourth sub elevation driving module 6. The support shaft 70 may have elasticity (e.g., elasticity under certain conditions) to elastically support the wiring board 10. The wiring board 10 is shown in phantom in fig. 2, and the wiring board 10 includes a board body, a flexible connection tape 10a, and a connector 10b. The flexible connection band 10a is used to connect the circuit board main body of the circuit board 10 and the connector 10b, and the center of the circuit board 10 is referred to as the center of the circuit board main body, which will not be described in detail below. In this embodiment, when the four sub-elevating driving modules are simultaneously elevated (the direction of the driving force is parallel to the z-axis), the circuit board 10 is integrally elevated, i.e. moves upward along the z-axis; when the four sub-elevating drive modules are simultaneously lowered, the wiring board 10 is integrally moved downward, i.e., downward along the z-axis. Here the z-axis is the normal direction of the light-sensing surface. In this embodiment, the sub-lift driving module can be realized by an electromagnetic driving principle. The two electromagnets are respectively arranged at the corresponding positions of the bottom surface of the circuit board 10 and the top surface of the base 60, and the magnitude of the interaction force of the magnetic poles of the two electromagnets can be controlled by controlling the magnitude and the direction of the coil current, so that the circuit board 10 can move. In this embodiment, the multi-point lifting driving module can not only drive the circuit board 10 and the photosensitive chip to move along the z-axis direction, but also drive the circuit board 10 and the photosensitive chip to tilt in two directions of pitching and swinging and left and right swinging. Here pitch can be described as the Rx direction, which means rotation about the x-axis, and yaw can be described as the Ry direction, which means rotation about the y-axis. In particular, each sub-elevating driving module may be implemented based on an electromagnetic driving principle.

Further, fig. 3 shows a schematic diagram of a sub-lift driving module in an embodiment of the present application. Referring to fig. 3, in the present embodiment, the sub elevating driving module may include a first magnetic element 51a and a second magnetic element 51b, wherein the first magnetic element 51a may be mounted on (e.g., adhered to) the bottom surface of the circuit board 10, and the second magnetic element 51b may be mounted on (e.g., adhered to) the upper surface of the base 60. In one example, the first magnetic element 51a may include a metal core in a columnar shape mounted (e.g., attached) to the bottom surface of the wiring board 10 and a coil surrounding the metal core. The coil may be electrically connected to the circuit board 10, so that the direction and magnitude of the magnetic field of the first magnetic element 51a are controlled by controlling the magnitude and flow direction of the coil current through the circuit arranged in the circuit board 10. Similarly, the second magnetic element 51b may also include a cylindrical metal core mounted to the upper surface of the base 60 and a coil surrounding the metal core. The coil of the second magnetic element 51b may be electrically connected to the base 60 to control the direction and magnitude of the magnetic field of the second magnetic element 51 b. The bottom surface of the first magnetic element 51a faces the top surface of the second magnetic element 51b, so that the first magnetic element 51a and the second magnetic element 51b can be repelled or attracted to each other by controlling the direction of the current flowing through the coils of the first magnetic element 51a and the second magnetic element 51 b. When the first and second

magnetic members

51a and 51b repel each other, the wiring board 10 is lifted at the position where the sub-lift drive module is located, and when the first and second

magnetic members

51a and 51b attract each other, the wiring board 10 is pulled down at the position where the sub-lift drive module is located. The four sub-up-down driving modules located at the four corners have the same working principle and structure, and when the four driving modules are matched with each other, the circuit board 10 can perform pitch swing (Rx) and/or side-to-side swing (Ry) as expected.

More specifically, the working principle of pitch (Rx) and yaw (Ry) is as follows: when the circuit board 10 needs to realize inclination (tilt), the second sub-lifting drive module 3 and the fourth sub-lifting drive module 6 are connected with currents in a specified direction and a specified magnitude, and due to mutual repulsion of the electromagnets, the circuit board 10 is jacked up to a certain height at a corresponding position, so that pitching and swinging are realized. Meanwhile, the first sub-lifting driving module 1 and the third sub-lifting driving module 4 may not be powered on, so that when the positions of the second sub-lifting driving module 3 and the fourth sub-lifting driving module 6 are lifted by force, the positions of the first sub-lifting driving module 1 and the third sub-lifting driving module 4 may be lowered, and the correction of the pitch position of the circuit board 10 is integrally achieved. Since the photosensitive chip is attached to the circuit board 10, the pitch position of the photosensitive chip is also corrected along with the circuit board 10. If the response speed of adjusting the inclination angle of the chip needs to be increased, the second sub-lifting driving module 3 and the fourth sub-lifting driving module 6 can be arranged, and the first sub-lifting driving module 1 and the third sub-lifting driving module 4 work simultaneously. Wherein, the electromagnets of the second sub-lifting driving module 3 and the fourth sub-lifting driving module 6 generate repulsive force, and the electromagnets of the first sub-lifting driving module 1 and the third sub-lifting driving module 4 generate attractive force. Since the accepted driving force of the wiring board 10 can be doubled, the adjustment of the pitch position of the chip can be completed in a short time. Further, in this embodiment, the magnitude and direction of the coil current may also be set according to actual requirements, so as to adjust the pitch deflection angle of the photosensitive chip.

The principle of tilt correction in the roll (Ry) direction is consistent with the pitch direction. If the response speed of the photosensitive chip is required to be improved, the plurality of sub lifting driving modules can work simultaneously. For example, the electromagnets of the first sub elevation driving module 1 and the second sub elevation driving module 3 generate repulsive force, and the third sub elevation driving module 4 and the fourth sub elevation driving module 6 generate attractive force, so that the position of the photosensitive chip is adjusted in a left-right rocking direction in a short time. Of course, in another example, only one pair of sub elevation driving modules (for example, the first sub elevation driving module 1 and the second sub elevation driving module 3) may be powered on, and the other pair of sub elevation driving modules (for example, the third sub elevation driving module 4 and the fourth sub elevation driving module 6) may not be powered on. This also enables the position of the photosensitive chip to be adjusted in the lateral direction. Further, in this embodiment, the magnitude and direction of the coil current can be set according to actual requirements, so as to adjust the left-right swinging angle of the photosensitive chip. Further, it is also possible to energize only one of the sub-hoist drive modules (e.g., the first sub-hoist drive module 1) in one of the orientations, thereby adjusting the tilt angle of the wiring board 10 at that orientation (such tilt angle adjustment actually includes adjustment of the pitch component and the yaw component).

Further, in another embodiment of the present application, in the sub-elevating driving module, the metal core may be directly molded on the bottom of the circuit board 10. For example, when the circuit board 10 is a PCB (sometimes referred to as a hard board), the metal core may be formed directly on the bottom of the circuit board 10 by a copper-plating process (or other metal-plating processes). The PCB board itself may be a multilayer board formed by alternating lamination of conductive and insulating layers, with different conductive layers being electrically connectable through to vias, which are often filled with copper or other conductive materials. The process of forming the metal core may be implemented with reference to a copper implant process of forming the via hole. The metal core root may be formed inside the wiring board 10 and then extend out of the bottom surface of the wiring board 10. The metal core may be wound with a preformed coil. It is noted that the metal core and the conductive coil may be separated by an insulating layer, which in one embodiment may be part of a pre-formed coil, i.e. the coil may include an insulating layer and then be wrapped around the metal core. Similarly, the metal core connected to the base 60 may also be directly formed on the upper surface of the base 60 through a copper-plating process (or other metal-plating processes are also possible).

Further, in still another embodiment of the present application, in the sub lift driving module, the metal core may be prefabricated and then attached (e.g., bonded) to the bottom surface of the wiring board 10. In this embodiment, the coil structure for forming the magnetic field may be directly fabricated on the surface of the metal core through an etching process (or other micromachining process). The coil structure and the metal core can be isolated by an insulating layer. The insulating layer may be a process layer in an etching process (or other micromachining processes), for example, the insulating layer may be first fabricated on the surface of the metal core, then the metal layer is laid, and then the metal layer is etched to form the required coil structure. Similarly, the metal core to which the base 60 is attached may be prefabricated and then bonded to the base 60. Also, the coil structure for forming the magnetic field may be directly fabricated on the surface of the metal core through an etching process (or other micromachining process). In the specific implementation, a large number of metal cores with coil structures can be manufactured on one substrate in batches, and then the single metal cores with coil structures are obtained through cutting, so that the production efficiency is improved.

Further, in one embodiment of the present application, in the sub-lift driving module, a magnet made of a permanent magnetic material may be used instead of the electromagnet attached to (e.g., bonded to) the bottom surface 11 of the circuit board 10. And the electromagnet can be attached (e.g., adhered) to the top surface of the base 60 at the base 60, so that the sub-lift driving module can control the relative position and posture of the circuit board 10 and the base 60 by controlling the direction and magnitude of the coil current. In one embodiment of the present application, the base 60 may be implemented by a PCB board, in which a circuit may be disposed. In this way, a part of the circuit board 10 can be transferred to the base 60 (i.e. a part of the functional circuit can be embedded in the base 60), thereby reducing the wiring difficulty of the circuit board 10 and also contributing to reducing the area and/or thickness of the circuit board 10. The base 60 can be directly connected with the main board of the terminal device, so that the power-on is realized.

Further, in one embodiment of the present application, the metal core and the coil on the upper surface of the base 60 may be replaced by a magnet. The magnet may be embedded in the base 60 (fig. 4 shows a schematic view of the structure and the operation mechanism of a sub up-down driving module in a modified embodiment of the present application, in which the second magnetic element 51b is a magnet embedded in the base 60), or a part of the magnet may be embedded in the base 60 (fig. 5 shows a schematic view of the structure and the operation mechanism of a sub up-down driving module in a modified embodiment of the present application, in which the second magnetic element 51b is a magnet embedded in the base 60). This can reduce the height occupied by the second magnetic element 51b connected to the base 60, thereby reducing the gap between the bottom surface 11 of the circuit board 10 and the upper surface of the base 60, and further reducing the thickness of the photosensitive assembly. In addition, when the second magnetic element 51b of the base 60 is a magnet, the base 60 may not be provided with a circuit, and the base 60 may not use a component such as a PCB board that can implement a circuit structure. For example, the base 60 may be a molded plate made based on a molding process. The magnets may be embedded or partially embedded in the module board during the molding process. The supporting seat 61 on the peripheral side of the base 60 may be integrally formed by a molding process.

Further, still referring to fig. 1, in one embodiment of the present application, a plurality of springs may be disposed between the bottom surface of the circuit board 10 and the upper surface of the base 60, and these springs may serve as auxiliary support. I.e., springs distributed at various locations may assist the centrally located support shaft 70 in supporting the circuit board 10 and various components fabricated or mounted on the circuit board 10. A plurality of springs may be distributed around each of the sub-lift driving modules. The spring may be formed in a spiral shape, both ends of which are connected to the bottom surface of the circuit board 10 and the upper surface of the base 60, respectively, and the sub-lift driving module is formed in a substantially bar shape and is disposed inside the spiral spring. The distributed arrangement of the plurality of springs can assist the supporting shaft 70 to support the circuit board 10 well, and at the same time, since the supporting is elastic, the driving module can still drive the circuit board 10 to move, thereby adjusting the position. The size and the material of the spring can be determined according to actual conditions, so that the spring has proper elastic force, the spring can play an auxiliary supporting role on the circuit board, and the driving of the driving module can be prevented from being blocked (in other words, the arrangement of the spring does not put an excessive requirement on the driving force of the driving module). For example, a plurality of springs having a small elastic coefficient may be disposed around each sub elevation driving module to play a role of auxiliary support while preventing an obstruction to the driving of the sub elevation driving module. Of course, the arrangement of the springs is not limited to be distributed around the sub-lift driving modules, for example, in another embodiment, all or part of the springs may be arranged at positions between the sub-lift driving modules (for example, at positions far away from the sub-lift driving modules), and such arrangement of the springs may also assist in supporting the shaft 70, so as to provide a better support for the circuit board 10, while the driving modules may still drive the circuit board 10 to displace, thereby performing position adjustment. In other embodiments, the spring may be replaced by an elastic component with other shapes, as long as the spring can play a role of assisting and supporting the circuit board 10 and various components manufactured or mounted on the circuit board 10, and the arrangement of the spring does not affect the driving structure to drive the circuit board 10 in different directions.

Further, in one embodiment of the present application, the support shaft 70 may be an elastic member so as to allow the wiring board 10 to move in the raising and lowering directions.

Further, in one embodiment of the present application, the support shaft 70 may be made of Shape Memory Alloy (SMA). Thus, by changing the temperature of the support shaft 70, the support shaft 70 can be made to have a certain degree of elasticity. This elasticity is sometimes referred to as pseudoelasticity or superelasticity (superelasticity) of the shape memory alloy. The pseudo-elasticity (pseudoelasticity) or super-elasticity (super-elasticity) of the shape memory alloy allows the support shaft 70 to be deformed to some extent, thereby realizing the lifting motion, the pitch motion and the yaw motion of the circuit board 10 under the driving of each sub-lifting driving module.

In some embodiments of the present application, it is desirable to utilize scalability to Shape Memory Alloys (SMAs). The material of the shape memory alloy generates thermal elastic martensite phase transformation inside, so that the part made of the shape memory alloy has the deformation recovery capability. Generally speaking, shape memory alloys may have a high temperature phase austenite phase and a low temperature phase martensite phase. Shape memory alloys can exhibit two properties depending on different thermal loading conditions. Some shape memory alloys have a one-way memory effect, e.g., the shape memory alloy deforms at a lower temperature and can recover its shape prior to deformation when heated. Using this effect, SMA pushrods in some embodiments can be made (as described in more detail below). Some shape memory alloys can recover high-temperature phase shapes when the temperature rises, and can recover low-temperature phase shapes when the temperature falls, and the shape memory alloys have a two-way memory effect. Such shape memory alloys may also be used to fabricate SMA components in some embodiments of the present application. After the thermo-elastic martensitic transformation of the SMA component, the resulting martensite may expand as the temperature decreases and contract as the temperature increases, and thus such shape memory alloys may be used as materials for SMA wires in some embodiments (as will be described in more detail below with respect to the use of SMA wires in this application).

Further, for some shape memory alloys, the martensitic transformation may be caused not only by temperature but also by stress. For such stress-induced martensitic transformation, the transformation temperature is linear with the stress. With this characteristic, the support shaft 70 in some embodiments of the present application can be made. Under the action of the driving module (for example, under the action of the multi-point lifting driving module), the stress of the supporting shaft 70 changes, and further, the induced martensite phase transformation causes the length of the supporting shaft 70 to change, so that the supporting shaft 70 has a certain elasticity (the elasticity refers to the pseudo-elasticity or super-elasticity of the SMA).

Further, in an embodiment of the present application, the driving module may further include a horizontal driving module. The horizontal drive module may also be referred to as a radial drive module. Horizontal or radial directions are to be understood as respective directions of movement parallel to the photosensitive surface of the photosensitive chip. Still referring to fig. 2, the radial drive module may include a first x-axis drive module 2 and a second x-axis drive module 5, which may be implemented based on shape memory alloy technology. FIG. 6 illustrates a side view of an x-axis drive module in one embodiment of the present application. Referring to fig. 6, the x-axis drive module includes a base extension block 62, SMA push rods 52, push rod blocks 53, and bottom surface extension block 13. The base extension block 62 is formed to extend upward from the top surface of the base 60. The bottom surface extension block 13 is formed by extending downwards from the bottom surface of the circuit board 10. The bottom surface extension block 13 may be preformed and then bonded to the bottom surface of the circuit board 10, or may be formed directly on the circuit board 10 (e.g., using a copper-plating process). The SMA push rod 52 is made of an SMA material (i.e., a shape memory alloy). The SMA push rod 52 is connected at one end to the base extension block 62 and at the other end to the push rod block 53. The SMA push rod 52 may be in a horizontal posture, the push rod block 53 and the bottom surface extension block 13 are arranged oppositely (the relative arrangement refers to the relative arrangement in position, and the side surface of the push rod block 53 and the side surface of the bottom surface extension block 13 are close to each other and are substantially parallel), and in a non-working state, a gap may be provided between the two (the push rod block 53 and the bottom surface extension block 13). When the SMA push rod 52 is in a certain temperature range, the SMA push rod 52 can expand and contract along with the change of the temperature. Therefore, by controlling the temperature of the SMA push rod 52 (for example, by raising the temperature of the SMA push rod 52), the SMA push rod 52 can be extended, the push rod block 53 contacts the side surface of the bottom surface extension block 13, and when the SMA push rod 52 is extended continuously, the push rod block 53 pushes the bottom surface extension block 13 to move towards the positive x-axis direction (refer to fig. 6), so as to drive the circuit board 10 and the chip on the circuit board 10 to move towards the positive x-axis direction. In this embodiment, the supporting shaft 70 at the center may have a certain elasticity, so as to allow the circuit board 10 to realize the positive x-axis movement under the pushing of the SMA pushing rod 52. Fig. 6 can be regarded as a schematic diagram of the working principle of the second x-axis drive module 5. The first x-axis driving module 2 may adopt a similar working mechanism to realize that the circuit board 10 and the chip on the circuit board 10 move toward the negative x-axis direction.

Further, fig. 7 shows a schematic top view of a horizontal drive module in an embodiment of the present application. Referring to fig. 7, in this embodiment, the horizontal driving module may include two x-axis driving modules and two y-axis driving modules. Two x-axis driving modules may be disposed at both ends of the support shaft 70 along the x-axis, and two y-axis driving modules may be disposed at both ends of the support shaft 70 along the y-axis. The specific design and arrangement of the y-axis driving module can refer to the description of the x-axis driving module in the foregoing, and details are not repeated here.

Further, in one embodiment of the present application, the SMA push rod may be self-heated by an electric current to reach a temperature required to stretch the SMA push rod. The SMA push rods may be arranged in a folded configuration. Leads connecting the circuit board may be arranged along the support shaft so as to be connected to two electrodes (an input electrode and an output electrode) of the SMA push rod. Due to the adoption of the folded shape, two electrodes of the SMA push rod can be uniformly arranged at one end connected with the supporting shaft. The folding position of the SMA push rod is regarded as the other end of the SMA push rod, and the push rod block can be connected with the SMA push rod at the other end, namely the folding position of the SMA push rod is connected with the SMA push rod.

Further, FIG. 8 shows a schematic side view of an x-axis drive module in another embodiment of the present application. Referring to fig. 8, in this embodiment, the horizontal driving module may be implemented based on an SMA wire 54, and both ends of the SMA wire 54 may be connected to the bottom surface extension block 13 and the supporting seat 61, respectively. The ends of the SMA wire 54 are tensioned to provide a tension. The SMA wire 54 is contracted by controlling the temperature, and the bottom surface extension block 13 and the wiring board 10 are moved in the positive x-axis direction. Specifically, SMA wires 54 that contract with increasing temperature may be employed. The support shaft 70 may have some elasticity, and the support shaft 70 may be biased in a negative direction of the x-axis in a natural state. The temperature is raised to contract the SMA wire 54 to overcome the spring force of the support shaft 70 and pull the support shaft 70 toward the center, thereby completing calibration of the reference state. Thus, based on the reference state, when the temperature is continuously raised, the SMA wire 54 can be continuously contracted to realize the movement of the wiring board 10 in the positive x-axis direction, and the SMA wire 54 can be controlled to be reduced in contraction by the temperature reduction, so that the movement of the wiring board 10 in the negative x-axis direction can be realized by the elastic force of the support shaft 70. In other words, in this embodiment, the x-axis bi-directional movement can be realized by means of one x-axis driving module. Of course, the present application is not limited to such an x-axis drive module and is not so limited. For example, in another embodiment, two SMA wire 54 based x-axis drive modules may be symmetrically arranged. By controlling the temperature of the two x-axis drive modules simultaneously, the SMA wire 54 of one of the x-axis drive modules contracts, and the SMA wire 54 of the other x-axis drive module expands (or contracts less), so that the x-axis positive direction or negative direction movement of the circuit board 10 can be realized.

Further, in one embodiment of the present application, the SMA wire 54 may be self-heated by an electric current to achieve controlled expansion and contraction of the SMA wire 54. The current for the SMA wire 54 may be provided directly from the base 60, the base 60 may be molded as a hollow structure, the connection point of the SMA wire 54 may be directly led out from the base, and other circuits may be directly disposed inside the base 60 to better protect the circuit. In this embodiment, a part of the circuit board 10 may be transferred to the base 60 to be implemented (i.e., a part of the functional circuit may be embedded in the base 60), so as to reduce the wiring difficulty of the circuit board 10 and also help to reduce the area and/or thickness of the circuit board 10. The base 60 can be directly connected with the main board of the terminal device, so that the power-on is realized.

In the above embodiments, the SMA wire may not be rigid and may therefore have a smaller wire diameter, thereby saving SMA material.

Further, in an embodiment of the present application, the horizontal driving module may be implemented based on an SMA wire. Specifically, the horizontal drive module may include a bottom surface extension block and an SMA wire. One end of the SMA wire is connected with the bottom surface extension block, and the other end of the SMA wire is connected with the base extension block. The base extension block is formed by upward extension of the top surface of the base, and the bottom surface extension block is formed by downward extension of the bottom surface of the circuit board. The position of the base extension block can be referred to fig. 6. Compared with the embodiment of fig. 6, the SMA push rod and the push rod block thereof are replaced by SMA wires in the embodiment. Further, in one embodiment of the present application, the horizontal driving module may include an x-axis driving module and a y-axis driving module. The x-axis drive module and the y-axis drive module may both be implemented based on SMA wires. That is, both ends of the SMA wire may be connected to the bottom surface extension block 13 and the support base 61, respectively. The two ends of the SMA wire are tensioned to form a certain tension. The SMA wire is contracted by controlling the temperature, and the bottom surface extension block 13 and the wiring board 10 are moved in the positive or negative direction of the x-axis or the y-axis. Note that in this embodiment, the SMA wires of the x-axis drive module and the SMA wires of the y-axis drive module are perpendicular to each other. In actual operation, the mutual influence of the two axial directions needs to be considered. For example, contraction or expansion of the SMA wire in the x-axis may cause some degree of tilting of the SMA wire in the y-axis, thereby changing the desired length of the SMA wire in the y-axis. That is, the SMA wires in the y-axis may need to be adaptively telescopic to accommodate movement of the wiring board 10 in the x-axis direction. Conversely, the expansion and contraction of the y-axis SMA wires also requires the adaptive expansion and contraction of the x-axis SMA wires to accommodate the movement of the circuit board 10 in the y-axis direction. In one embodiment, a required displacement vector of the circuit board 10 may be calculated in advance, then required lengths of the x-axis SMA wires and the y-axis SMA wires according to the displacement vector are calculated, and the expansion and contraction of the x-axis SMA wires and the y-axis SMA wires are controlled according to the calculated lengths. In this embodiment, the respective bidirectional movements of the x-axis and the y-axis, and the combined movement of the x-axis and the y-axis directions (i.e., the vector displacement having both the x-axis component and the y-axis component) can be realized by the elasticity of the single x-axis driving module and the single y-axis driving module and the supporting shaft 70 itself. In another embodiment, two symmetrically arranged x-axis drive modules and two symmetrically arranged y-axis drive modules may be employed to achieve the bi-directional movement of the x-axis and y-axis, respectively, and the combined movement in the x-axis and y-axis directions.

Further, in one embodiment of the present application, at least one of the x-axis driving modules may be offset from the center of the supporting shaft 70 (where offset may be understood as that the central axes of the SMA wires or SMA push rods of the x-axis driving module are not coincident with the central x-axis ax1 of the circuit board 10, and refer to fig. 9), so that the SMA wires of the x-axis driving module form a certain torque (a torque taking the center of the supporting shaft 70 as a rotation center) when contracting or expanding, thereby achieving rotation of the circuit board 10 around the z-axis, i.e., rotation in the Rz direction. Here, the z-axis direction is a normal direction of the photosensitive surface of the photosensitive chip. In another embodiment of the present application, in the horizontal driving module, at least one x-axis driving module and at least one y-axis driving module may be offset from the center of the supporting shaft 70 by a certain distance, so that the SMA wires of the x-axis driving module and the y-axis driving module form a certain torque when contracting or expanding, thereby implementing the rotation of the circuit board 10 around the z-axis, i.e., the rotation in the Rz direction. The design can increase the total torque provided by the horizontal driving module, and is helpful for improving the response speed in the Rz direction, thereby enhancing the anti-shake capability in the Rz direction.

Further, fig. 9 shows a schematic top view of a horizontal driving module with Rz rotation functionality in an embodiment of the present application. Referring to fig. 9, in this embodiment, the number of the x-axis driving modules may be even, and the even number of the x-axis driving modules are symmetrically arranged on two sides of the x central axis ax1 of the circuit board 10; the x-axis driving modules on two sides of the x central axis ax1 synchronously apply driving force to drive the circuit board 10 to translate along the x axis; the driving force is applied by the x-axis driving module positioned on one side of the x central axis ax1 to form torque, so that the circuit board 10 is driven to rotate around the z axis; where the x central axis ax1 is the central axis of the wiring board 10 parallel to the x axis.

Further, still referring to fig. 9, in an embodiment of the present application, the y-axis driving modules may have an even number, and the even number of y-axis driving modules are symmetrically arranged on both sides of the y central axis ax2 of the wiring board 10; the y-axis driving modules on two sides of the y central axis ax2 synchronously apply driving force to drive the circuit board 10 to translate along the y axis; the x-axis driving module located on one side of the x central axis ax1 and the y-axis driving module located on one side of the y central axis ax2 jointly apply driving force to form torque, and then the circuit board 10 is driven to rotate around the z axis; wherein the y central axis ax2 is a central axis of the circuit board 10 parallel to the y axis. Referring to fig. 9, solid arrows mark driving forces of the x-axis driving module and the y-axis driving module when the driving circuit board rotates clockwise in the Rz direction, wherein the SMA push rods of the y-axis driving module on the left side of the y central axis ax2 and the x-axis driving module on the lower side of the x central axis ax1 are both heated and extended, so as to generate the driving force as shown by the solid arrows in fig. 9, and further generate a clockwise torque with the center of the supporting shaft (i.e., the center of the circuit board) as the rotation center. Dotted arrows mark the driving forces of the x-axis driving module and the y-axis driving module when the driving circuit board rotates counterclockwise in the Rz direction, wherein the SMA push rods of the y-axis driving module on the right side of the y central axis ax2 and the x-axis driving module on the upper side of the x central axis ax1 are both heated and extended, so as to generate the driving forces shown by dotted arrows in fig. 9, and further generate a counterclockwise torque taking the center of the supporting shaft (i.e., the center of the circuit board) as a rotation center.

In an embodiment of the present application, a plurality of sub-driving modules may be disposed between the circuit board 10 and the base 60 of the photosensitive assembly, and the sub-driving modules may be arranged in an array. One part of the sub-driving modules are the sub-lifting driving modules, and the other part of the sub-driving modules can be sub-horizontal driving modules (the structure of the sub-horizontal driving modules can be the same as that of the x-axis driving module or the y-axis driving module in any of the previous embodiments). The metal core in the sub-lifting driving module is arranged on the bottom surface of the circuit board 10, the sub-horizontal driving module and the bottom surface extension block 13 are arranged on the bottom surface of the circuit board 10, and the metal core or the extension block on the bottom surface of the circuit board 10 not only can help to realize the movement of the circuit board 10 and the chip on each degree of freedom, but also can help to strengthen the structural strength of the circuit board 10, so that the photosensitive chip is strengthened, and the warping condition of the photosensitive chip under the influence of various interference factors such as external force, temperature, humidity and the like is avoided or inhibited. The current camera module is developing towards the direction of a large-size chip (large-size light-sensitive surface), and as the area of the chip is increased, how to solve the problem of chip warpage in the manufacturing and using processes also becomes a difficult point of technical progress of the camera module. In this embodiment, because the bottom surface of the circuit board 10 is provided with the plurality of metal cores or the plurality of extending blocks arranged in an array, the structural strength of the circuit board 10 can be enhanced while the chip anti-shake function is realized, and the problem that a large-sized chip is easy to bend in the module assembling and using processes is solved. It should be noted that the plurality of metal cores or extension blocks disposed on the bottom surface of the circuit board 10 are not limited to regular array arrangement, and even if the metal cores or extension blocks are irregularly arranged in a hash manner, the structural strength of the circuit board 10 can be enhanced, which helps solve the problem that a large-sized chip is easy to bend during module assembly and use.

In the above embodiment, the sub-lifting driving modules are all realized based on an electromagnetic driving principle. However, the present application is not limited to this, and in another embodiment of the present application, four SMA elements may be disposed at four corners of the circuit board 10 as connectors between the circuit board 10 and the base 60, and the four connectors may operate independently or simultaneously. By utilizing the characteristics of the SMA, more precise tilt (i.e., tilt angle) adjustment of the wiring board 10 can be achieved in a plurality of orientations in cooperation with one another. In an initial state, the SMA element may serve to support the circuit board 10, connect the circuit board 10 and the base 60, and when an external influence is applied to deform the SMA element, the SMA element may be driven to move a corresponding position of the circuit board 10 (i.e., a position where the SMA element is connected) toward a certain set orientation, so as to adjust a position of the chip. By the method, the left-right swing of the chip can be realized, and the pitching swing of the chip can also be realized.

Further, in an embodiment of the present application, a camera module is further provided, where the camera module may include an optical lens and the photosensitive component with an anti-shake function in any of the foregoing embodiments. The optical lens may be mounted on the top surface of the support base 61 of the photosensitive assembly. In this embodiment, the photosensitive chip can move in a plurality of directions in a controlled manner relative to the supporting base 61, thereby providing the anti-shake capability for the camera module.

Further, in an embodiment of the present application, the image capturing module may include an optical lens and the photosensitive element with an anti-shake function in any of the foregoing embodiments. The optical lens can be provided with a motor, and the motor can provide an optical anti-shake function and a focusing function for the lens. The bottom surface of the motor may be mounted on the top surface of the support base 61 of the photosensitive assembly. In this embodiment, camera lens and sensitization chip can be for supporting seat 61 respective independent adjustment to realize the image anti-shake function better, promote better and shoot the quality. In the module of making a video recording of this embodiment, photosensitive assembly can realize the controlled movement of chip in a plurality of directions with the volume that reduces, when realizing the chip anti-shake, the guarantee device is miniaturized, helps reducing the size of the module of making a video recording.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention may be modified or substituted with equivalents without departing from the spirit and scope of the technical solutions of the present invention, and all of them should be covered by the scope of the claims of the present invention.

Claims

1. A photosensitive assembly with an anti-shake function, comprising:

a circuit board;

the photosensitive chip is arranged on the upper surface of the circuit board;

a base which is located below the circuit board and is connected with the circuit board through a support shaft, and the support shaft has elasticity;

the supporting seat surrounds the periphery of the base, and the top surface of the supporting seat is suitable for mounting a lens component;

and the driving module comprises a plurality of sub lifting driving modules, and the sub lifting driving modules are arranged between the base and the circuit board and distributed around the supporting shaft.

2. A photosensitive assembly according to claim 1, wherein said plurality of sub elevation drive modules are respectively provided at different positions of said supporting shaft.

3. A photosensitive assembly according to claim 1, wherein each of the sub elevation driving modules is adapted to drive the circuit board to ascend or descend at a position thereof, and the inclination angle of the circuit board with respect to the base is adjusted by controlling the magnitude and the ascending and descending direction of the driving force of each of the sub elevation driving modules.

4. A photosensitive assembly according to claim 1, wherein the circuit board is rectangular; the plurality of sub-lifting driving modules are respectively arranged at the positions corresponding to the four corners of the circuit board.

5. A photosensitive assembly according to claim 1, wherein the sub-elevating driving module includes a first magnetic member connected to the bottom surface of the circuit board and a second magnetic member connected to the base.

6. The photosensitive assembly of claim 5, wherein the first magnetic element comprises a metal core connected to the bottom surface of the circuit board and a coil disposed on the metal core; or the first magnetic element is a magnet.

7. A photosensitive assembly according to claim 5, wherein said second magnetic element includes a metal core connected to the top surface of said base and a coil provided on said metal core.

8. A photosensitive assembly according to claim 5, wherein the second magnetic element is a magnet, and the magnet is embedded or partially embedded in the base.

9. A photosensitive assembly according to claim 1, wherein the support shaft is formed of a shape memory alloy.

10. A photosensitive assembly according to claim 1, further comprising an elastic support member connecting the base and the circuit board, wherein a plurality of the elastic support members realize distributed elastic support at a plurality of positions of the circuit board.

11. A photosensitive assembly according to claim 10, wherein the elastic support member comprises a plurality of springs, and both ends of the springs are respectively connected to the bottom surface of the circuit board and the top surface of the base.

12. The photosensitive assembly of claim 3, wherein the plurality of sub-lifting driving modules are further adapted to synchronously drive the circuit board to ascend or descend so as to adjust the height of the circuit board relative to the base.

13. A photosensitive assembly according to claim 1, wherein the driving module further comprises a second driving module including a shape memory alloy pusher, a pusher block, a bottom surface extension block, and a base extension block; the base extends the piece by the top surface of base upwards extends and forms, the both ends of shape memory alloy push rod are connected respectively the base extends the piece with the push rod piece, the bottom surface extends the piece certainly the bottom surface of circuit board extends and forms, the push rod piece with the side of bottom surface extension piece sets up relatively.

14. A photosensitive assembly according to claim 13, wherein the push rod block is spaced from the side surface of the bottom surface extension block in a normal temperature state of the shape memory alloy push rod; the shape memory alloy push rod is suitable for stretching after the temperature is increased, so that the push rod block contacts and pushes the bottom surface extension block to move in the horizontal direction.

15. A photosensitive assembly according to claim 1, wherein the drive module further comprises a second drive module including a bottom surface extension block and a shape memory alloy wire; one end of the shape memory alloy wire is connected with the bottom surface extension block, and the other end of the shape memory alloy wire is connected with the supporting seat; the bottom surface extension block is formed by extending the bottom surface of the circuit board downwards.

16. A photosensitive assembly according to claim 1, wherein the drive module further includes a second drive module including a bottom surface extension block and a shape memory alloy wire; one end of the shape memory alloy wire is connected with the bottom surface extension block, and the other end of the shape memory alloy wire is connected with the base extension block; the base extension block is formed by upward extension of the top surface of the base, and the bottom surface extension block is formed by downward extension of the bottom surface of the circuit board.

17. A photosensitive assembly according to claim 1, wherein the driving module further comprises a second driving module, the second driving module comprising a bottom surface extension block, a shape memory alloy push rod and a push rod block; the two ends of the shape memory alloy push rod are respectively connected with the supporting seat and the push rod block, the bottom surface extension block extends downwards from the bottom surface of the circuit board to form, and the side surfaces of the push rod block and the bottom surface extension block are oppositely arranged.

18. A photosensitive assembly according to claim 14, 15, 16 or 17, wherein said driving module comprises at least one x-axis driving module and at least one y-axis driving module, wherein said x-axis driving module is said second driving module arranged along the x-axis direction and adapted to drive said circuit board to move along the x-axis, and said y-axis driving module is said second driving module arranged along the y-axis direction and adapted to drive said circuit board to move along the y-axis.

19. A photosensitive assembly according to claim 18, wherein the x-axis drive module is disposed on an x-axis of the circuit board, wherein the x-axis is an axis of the circuit board parallel to the x-axis.

20. A photosensitive assembly according to claim 19, wherein the y-axis driving module is disposed on a y-axis of the circuit board, wherein the y-axis is an axis of the circuit board parallel to the y-axis.

21. A photosensitive assembly according to claim 18, wherein the x-axis drive modules have an even number, and the even number of the x-axis drive modules are symmetrically arranged on both sides of an x-central axis of the wiring board; the driving force is synchronously applied by the x-axis driving modules on two sides of the x central axis to drive the circuit board to translate along the x axis; the driving force is applied by the x-axis driving module positioned on one side of the x central axis to form torque, so that the circuit board is driven to rotate around the z axis; wherein the x central axis is the central axis of the circuit board parallel to the x axis.

22. A photosensitive assembly according to claim 21, wherein said y-axis drive modules have an even number, and the even number of said y-axis drive modules are symmetrically arranged on both sides of a y-axis line of said wiring board; the driving force is synchronously applied by the y-axis driving modules on two sides of the y central axis to drive the circuit board to translate along the y axis; the driving force is jointly applied by the x-axis driving module positioned on one side of the x central axis and the y-axis driving module positioned on one side of the y central axis to form torque, so that the circuit board is driven to rotate around the z axis; and the y central axis is the central axis of the circuit board parallel to the y axis.

23. A photosensitive assembly according to claim 1, further comprising:

the two ends of the metal wire are respectively and electrically connected with the circuit board and the photosensitive chip;

the optical filter is positioned above the photosensitive chip; and

and the optical filter seat is formed on the upper surface of the circuit board and surrounds the periphery of the photosensitive chip, and the optical filter is arranged on the optical filter seat.

24. A photosensitive assembly according to claim 23, wherein said filter holder is a molded part formed on an upper surface of said circuit board by a molding process, and said metal wire is covered by said molded part.

25. A photosensitive assembly according to claim 1, wherein the supporting base is integrally formed with the base.

26. The utility model provides a module of making a video recording which characterized in that includes:

an optical lens;

the photosensitive assembly of any one of claims 1 to 25, said optical lens being mounted to said support of said photosensitive assembly.

27. The camera module of claim 26, wherein the optical lens has a motor, a bottom of the motor is mounted on a top surface of the support base of the photosensitive element.