CN113540315A - Plant lighting LED packaging method - Google Patents
Plant lighting LED packaging method Download PDFInfo
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- CN113540315A CN113540315A CN202110651862.0A CN202110651862A CN113540315A CN 113540315 A CN113540315 A CN 113540315A CN 202110651862 A CN202110651862 A CN 202110651862A CN 113540315 A CN113540315 A CN 113540315A
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 235000012431 wafers Nutrition 0.000 claims abstract description 55
- 239000003292 glue Substances 0.000 claims abstract description 36
- 238000001228 spectrum Methods 0.000 claims abstract description 20
- 238000005286 illumination Methods 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000741 silica gel Substances 0.000 claims abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 7
- 239000000843 powder Substances 0.000 claims description 16
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 5
- 230000000243 photosynthetic effect Effects 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000499 gel Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 230000029553 photosynthesis Effects 0.000 abstract description 7
- 238000010672 photosynthesis Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000001502 supplementing effect Effects 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 12
- 239000013589 supplement Substances 0.000 description 6
- 238000005457 optimization Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 239000001369 metatartaric acid Substances 0.000 description 2
- 230000008635 plant growth Effects 0.000 description 2
- 235000013311 vegetables Nutrition 0.000 description 2
- 229930192334 Auxin Natural products 0.000 description 1
- 239000002363 auxin Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- SEOVTRFCIGRIMH-UHFFFAOYSA-N indole-3-acetic acid Chemical compound C1=CC=C2C(CC(=O)O)=CNC2=C1 SEOVTRFCIGRIMH-UHFFFAOYSA-N 0.000 description 1
- 238000001748 luminescence spectrum Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cultivation Of Plants (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a plant lighting LED packaging method which comprises a plurality of LED wafers, an SMC support, pins, silica gel and fluorescent glue, wherein the LED wafers comprise a first LED wafer, a second LED wafer and a third LED wafer, 1 first LED wafer and 1 third LED wafer are arranged in a first support bowl, 2 second LED wafers are arranged in a second support bowl, 1 first LED wafer and 1 third LED wafer are arranged in a third support bowl, the LED wafers are bonded through gold wires to connect positive and negative pins of the SMC support, and the fluorescent glue is coated on the LED wafers. Compared with the traditional method for manufacturing the white light LED, the method has better light color quality performance, can realize the function of simulating the solar spectrum by adjusting the light source spectrum to irradiate the plant, and ensures that the photosynthesis of the plant illumination is more sufficient, thereby achieving the function of supplementing light to the plant.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a plant lighting LED packaging method.
Background
At present, more and more people grow in greenhouses, including vegetable greenhouses, flower greenhouses, fruit greenhouses and the like. With the development of greenhouse planting technology, people can eat more kinds of out-of-season vegetables and fruits. Greenhouse planting enables crops in the greenhouse to obtain a better growing environment than outside open-air crops, such as: when strong wind, rainstorm, hail and sudden temperature drop occur, the plants in the greenhouse cannot be damaged. The plants in the greenhouse have a better growing environment than the plants in the open air, but also have a growing condition which is not higher than that of the plants in the open air, namely illumination.
Illumination is one of the essential conditions for plant growth, and sunlight satisfies the conditions for plants to perform photosynthesis, which generates energy for plant growth. The outdoor plants can receive the irradiation of sunlight in all directions (except dark corners), and the sunlight is uniformly distributed, so that the phenomenon that the auxin in the plants is not uniformly distributed and the plants grow unhealthy can not be caused. The greenhouse planting can cause the condition of uneven sunlight irradiation due to construction materials, heat preservation equipment and the like, and in addition, in rainy or haze days in cloudy days, the plants in the greenhouse can not grow healthily due to no illumination for a long time.
In order to meet the requirement of plants in the greenhouse on illumination, people develop plant light supplement lamps. The plant light supplement lamp is developed according to the principle that plants use sunlight for photosynthesis, and light replaces sunlight. The LED plant light supplement lamp is a fourth generation plant light supplement lamp, can well meet the requirement of plants on illumination, can adjust the spectrum, and has a red-blue spectrum with most light colors absorbed by the plants through photosynthesis. It has low heat productivity and can contact with plants in a short distance; the occupied space is small, and the device can be used on a plant planting cabinet; the service life is long. Although the existing plant light supplement lamp has the advantages, the light source spectrum simulation solar spectrum function cannot be adjusted to irradiate the plant, so that the illumination photosynthesis of the plant is more sufficient, and the plant light supplement function cannot be achieved.
Disclosure of Invention
The invention aims to provide a plant lighting LED packaging method, which has better light color quality performance compared with the traditional method for manufacturing a white light LED, can realize the function of simulating the solar spectrum by adjusting the light source spectrum to irradiate plants, so that the photosynthesis of plant lighting is more sufficient, thereby achieving the function of supplementing light to the plants and solving the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a plant lighting LED packaging method comprises a plurality of LED wafers, an SMC support, pins, silica gel and fluorescent glue, wherein the LED wafers comprise a first LED wafer, a second LED wafer and a third LED wafer, 1 first LED wafer and 1 third LED wafer are arranged in a first support bowl, 2 second LED wafers are arranged in a second support bowl, 1 first LED wafer and 1 third LED wafer are arranged in a third support bowl, the LED wafers are bonded through gold wires to connect positive and negative pins of the SMC support, the fluorescent glue is coated on the LED wafers, the LED light color quality of the first support bowl meets Ra >90, R9>50, TM-30-18, Rg >90, Rf >90, the chromaticity coordinate meets E653 chromaticity standard, the LED light color chromaticity coordinate of the second support bowl meets YS chromaticity standard through a combination mode of blue powder and green powder fluorescent powder, the LED light color quality of the third support bowl meets Ra >98, r9>90, R12>90, TM-30-18, Rg >90, Rf >90, the chromaticity coordinate meets the S353 chromaticity standard, the light source can adjust the spectrum through current regulation to meet the sunlight irradiation requirement, the plant illumination response curve efficiency requirement can be matched, and the plant photosynthetic radiation utilization rate is more than 90%.
Further, the first LED chip is a 405-410nm LED chip, the second LED chip is a 455-460nm LED chip, and the third LED chip is a 440-445nm LED chip.
Furthermore, the fluorescent glue is a mixture of blue powder, green powder, multiple kinds of fluorescent powder and transparent silica gel.
Further, the chromaticity wide capacity of the packaged white light LED is controlled within a 3-step MacAdam ellipse.
Further, the LED wafer is fixed on the SMC bracket through insulating glue or silver glue by a die bonder, and after die bonding is finished, the LED wafer is baked for 2 hours by an oven at 160 ℃ with 150-.
Further, a first LED wafer and a third LED wafer in the first support bowl cup are connected in series, 2 second LED wafers in the second support bowl cup are connected in series, and a first LED wafer and a third LED wafer in the third support bowl cup are connected in series.
Compared with the prior art, the invention has the beneficial effects that:
compared with the traditional method for manufacturing the white light LED, the method for packaging the plant lighting LED has better light color quality performance, can realize the function of simulating the solar spectrum by adjusting the light source spectrum to irradiate the plant, and ensures that the photosynthesis of the plant lighting is more sufficient, thereby achieving the function of supplementing light to the plant.
Drawings
FIG. 1 is a schematic diagram of the structure of an LED product of the present invention;
FIG. 2 is a chromaticity drop bin map requirement index of the LED product finished product of the present invention;
FIG. 3 is a graph of the luminescence spectrum of the finished LED product of the present invention;
FIG. 4 is a mixed spectrum of the product of the present invention;
FIG. 5 is mixed spectrum test data for a product of the present invention;
FIG. 6 is the product mix spectrum test data (TM-30-18) of the present invention;
FIG. 7 is a table of spectral parameters for the product of the present invention.
In the figure: 1. a first LED wafer; 2. a second LED wafer; 3. a third LED wafer; 4. a pin; 5. fluorescent glue; 6. SMC support; 7. a first rack bowl; 8. a second rack bowl; 9. and a third support bowl.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-3, a method for packaging plant lighting LEDs comprises a plurality of LED chips, an SMC support 6, pins 4, silica gel, and fluorescent gel 5, wherein the LED chips include a first LED chip 1, a second LED chip 2, and a third LED chip 3, 1 first LED chip 1 and 1 third LED chip 3 are disposed in a first support cup 7, 2 second LED chips 2 are disposed in a second support cup 8, 1 first LED chip 1 and 1 third LED chip 3 are disposed in a third support cup 9, the LED chips connect positive and negative pins 4 of the SMC support 6 by gold wire bonding, the fluorescent gel 5 is coated on the LED chips, the LED color quality of the first support cup 7 satisfies Ra >90, R9>50, TM-30-18, Rg >90, Rf >90, and the chromaticity coordinate satisfies E653 standard (fig. 7), the LED light color chromaticity coordinate of the second support bowl 8 meets YS chromaticity standard (figure 7), the LED light color quality of the third support bowl 9 meets Ra >98, R9>90, R12>90, TM-30-18, Rg >90 and Rf >90, the chromaticity coordinate meets S353 chromaticity standard (figure 7), the light source can adjust the spectrum through current adjustment to meet the sunlight irradiation requirement, the efficiency requirement of a plant illumination response curve can be matched, and the plant photosynthetic radiation utilization rate is more than 90% (figure 4).
In fig. 2 to 4, 10 denotes E653(6500K), 11 denotes YS (2800K), 12 denotes E353(3500K), 13 denotes a 6500K spectrum, 14 denotes a 2800K spectrum, and 15 denotes a 3500K spectrum.
The fluorescent glue 5 is a mixture of blue powder, green powder, multiple fluorescent powders and transparent silica gel.
1) As a further optimized scheme of the plant lighting LED packaging method, the first LED wafer 1, the second LED wafer 2 and the third LED wafer 3 are fixed on the SMC support 6 in a die bonding mode through insulating glue (or silver glue) by a die bonder, and after die bonding is finished, the LED wafers are completely fixed on the SMC support 6 by baking for 2 hours in an oven at the temperature of 150-;
2) as a further optimized scheme of the plant lighting LED packaging method, after die bonding and baking, the pins 4 of the positive and negative electrodes of the SMC support 6 are connected by a wire bonding technology through a gold wire bonding machine, the first LED wafer 1 and the third LED wafer 3 in the first support bowl 7 are connected in series, the 2 second LED wafers 2 in the second support bowl 8 are connected in series, and the first LED wafer 1 and the third LED wafer 3 in the third support bowl 9 are connected in series;
3) as a further optimization scheme of the plant lighting LED packaging method, after the step 2) is finished, 3 kinds of fluorescent glue solutions are respectively prepared, namely 6500K fluorescent glue solution, 2800K fluorescent glue solution and 3500K fluorescent glue solution, wherein the fluorescent glue solution is a mixture of glue, blue powder with the emission wavelength of 465-485nm, green powder with the emission wavelength of 520-535nm and red powder with the emission wavelength of 635-660 nm;
A.6500K fluorescent glue solution is prepared, and the fluorescent glue solution is glue: 465nm blue powder: green powder of 525 nm: 655 fluorescent powder ≈ 3:1.3: 1.3:0.12, so that the light color meets the requirement of color parameter E653 given by 5) (FIG. 7);
B.2800K fluorescent glue solution is prepared, wherein the fluorescent glue solution is glue: 525nm yellow-green powder: 635nm red powder ≈ 3: 0.12:0.89, so that the light color meets the requirement of color parameter YS given by 5) (figure 7);
C.3500K fluorescent glue solution, wherein the fluorescent glue solution is glue: 465nm blue powder: green powder of 525 nm: 655 fluorescent powder ≈ 3: 2.56:3.12:0.48, so that the light color meets the requirement of color parameter E353 (figure 7) given by 5);
4) as a further optimized scheme of the plant lighting LED packaging method, after the step 3) is finished, the prepared glue solution is poured into a glue barrel of a glue dispenser, after the glue discharging and the bubble discharging are finished, 6500K fluorescent glue solution is dispensed into a first bracket bowl 7 according to the requirement of color parameters, 2800K fluorescent glue solution is dispensed into a second bracket bowl 8 according to the requirement of color parameters, 3500K fluorescent glue solution is dispensed into a third bracket bowl 9 according to the requirement of color parameters, and the glue solution is baked at 80 ℃/0.5H +160 ℃/4H;
5) as a further optimization scheme of the plant lighting LED packaging method, after the step 4) is finished, the LED product subjected to dispensing and baking is threshed and then is subjected to light splitting by a light splitting tester according to given required color parameters (figure 7);
6) as a further optimization scheme of the plant lighting LED packaging method, the product LED manufactured in the step 4) meets the requirement that the chromaticity width capacity is controlled within a 3-order MacAdam ellipse (figure 7);
7) as a further optimized scheme of the plant lighting LED packaging method, the product LED prepared in the step 4) meets Ra >98, R9>90, R12>90, TM-30-18, Rg >90 and Rf >90 (fig. 5 and 6);
8) as a further optimization scheme of the plant lighting LED packaging method, 4) the product LED prepared in step 4) meets the requirement that a light source can meet the sunlight irradiation requirement by adjusting the spectrum through current regulation, can match the efficiency requirement of a plant lighting response curve, and has the plant photosynthetic radiation utilization rate of more than 90 percent (figure 4).
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (6)
1. A plant lighting LED packaging method is characterized by comprising a plurality of LED wafers, an SMC support (6), pins (4), silica gel and fluorescent glue (5), wherein the LED wafers comprise a first LED wafer (1), a second LED wafer (2) and a third LED wafer (3), 1 first LED wafer (1) and 1 third LED wafer (3) are arranged in a first support bowl (7), 2 second LED wafers (2) are arranged in a second support bowl (8), 1 first LED wafer (1) and 1 third LED wafer (3) are arranged in a third support bowl (9), the LED wafers enable positive and negative pins (4) of the SMC support (6) to be connected through gold wire bonding, the fluorescent glue (5) is coated on the LED wafers, the LED light color quality of the first support bowl (7) meets Ra >90 through a blue powder and green powder fluorescent powder combination mode, r9 is more than 50, TM-30-18, Rg is more than 90, Rf is more than 90, the chromaticity coordinate meets the E653 chromaticity standard, the LED light color chromaticity coordinate of the second support bowl (8) meets the YS chromaticity standard, the LED light color quality of the third support bowl (9) meets Ra is more than 98, R9 is more than 90, R12 is more than 90, TM-30-18, Rg is more than 90, Rf is more than 90, the chromaticity coordinate meets the S353 chromaticity standard, the light source can adjust the spectrum through current to meet the sunlight irradiation requirement, the efficiency requirement of a plant illumination response curve can be matched, and the plant photosynthetic radiation utilization rate is more than 90%.
2. The method as claimed in claim 1, wherein the first LED chip (1) is 405-410nm LED chip, the second LED chip (2) is 455-460nm LED chip, and the third LED chip (3) is 440-445nm LED chip.
3. The method for encapsulating LED for plant illumination according to claim 1, wherein the phosphor gel (5) is a mixture of blue phosphor and green phosphor, a plurality of phosphors, and transparent silica gel.
4. The method for packaging a plant lighting LED as recited in claim 1, wherein the chromaticity latitude of the packaged white light LED is controlled within a 3 rd order MacAdam ellipse.
5. The method for packaging LED of claim 1, wherein the LED chip is fixed on the SMC holder (6) by die bonding with a die bonder through an insulating adhesive or a silver adhesive, and the LED chip is completely fixed on the SMC holder (6) by baking for 2h with an oven at 160 ℃ and 150 ℃ after die bonding.
6. A plant lighting LED packaging method according to claim 1, wherein the first LED chip (1) and the third LED chip (3) in the first rack cup (7) are connected in series, the 2 second LED chips (2) in the second rack cup (8) are connected in series, and the first LED chip (1) and the third LED chip (3) in the third rack cup (9) are connected in series.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118299372A (en) * | 2024-04-30 | 2024-07-05 | 东莞市立德达光电科技有限公司 | Sky blue spectrum LED and preparation method thereof |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103972220A (en) * | 2014-05-13 | 2014-08-06 | 山东明华光电科技有限公司 | Double-cup surface-mount-device-type LED with light color adjustable and manufacturing process thereof |
| CN104952861A (en) * | 2014-03-27 | 2015-09-30 | 江苏稳润光电有限公司 | Low-cost, high-brightness and large-power white light LED |
| CN107833875A (en) * | 2017-11-09 | 2018-03-23 | 江苏稳润光电科技有限公司 | A kind of high colour gamut LED backlight and its processing method |
| CN108010908A (en) * | 2017-11-10 | 2018-05-08 | 江苏稳润光电科技有限公司 | One kind allows the comfortable white light led method for packing of people's sense organ |
| CN108022919A (en) * | 2017-11-02 | 2018-05-11 | 江苏稳润光电科技有限公司 | A kind of raising white light LEDs enter BIN rate methods |
| CN109148430A (en) * | 2018-07-02 | 2019-01-04 | 江苏稳润光电科技有限公司 | A kind of led plant illumination light source production method |
| CN109256458A (en) * | 2018-11-09 | 2019-01-22 | 深圳市迈森光电科技有限公司 | A kind of LED product encapsulating structure and its packaging method |
| CN109411456A (en) * | 2018-10-16 | 2019-03-01 | 江苏稳润光电科技有限公司 | A kind of LED light source for fresh lamp illumination |
| CN109461722A (en) * | 2018-10-16 | 2019-03-12 | 江苏稳润光电科技有限公司 | A kind of amphichrome lamp illumination LED light source |
| CN109560074A (en) * | 2018-12-20 | 2019-04-02 | 南昌易美光电科技有限公司 | A kind of plant growth lighting device |
| CN208862026U (en) * | 2018-11-09 | 2019-05-14 | 深圳市迈森光电科技有限公司 | A kind of LED product encapsulating structure |
| CN110085724A (en) * | 2019-03-28 | 2019-08-02 | 永曜电机(深圳)有限公司 | A kind of eyeshield LED light source |
| CN110364517A (en) * | 2019-08-10 | 2019-10-22 | 浙江英特来光电科技有限公司 | A kind of three-in-one full-spectrum LED paster light source |
| CN110444649A (en) * | 2019-08-16 | 2019-11-12 | 山东光因照明科技有限公司 | The full-spectrum LED light-source encapsulation method and its encapsulating structure of simulated solar irradiation |
| CN111627895A (en) * | 2020-05-21 | 2020-09-04 | 江西鸿利光电有限公司 | LED light-emitting device with double-color temperature structure |
-
2021
- 2021-06-11 CN CN202110651862.0A patent/CN113540315A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104952861A (en) * | 2014-03-27 | 2015-09-30 | 江苏稳润光电有限公司 | Low-cost, high-brightness and large-power white light LED |
| CN103972220A (en) * | 2014-05-13 | 2014-08-06 | 山东明华光电科技有限公司 | Double-cup surface-mount-device-type LED with light color adjustable and manufacturing process thereof |
| CN108022919A (en) * | 2017-11-02 | 2018-05-11 | 江苏稳润光电科技有限公司 | A kind of raising white light LEDs enter BIN rate methods |
| CN107833875A (en) * | 2017-11-09 | 2018-03-23 | 江苏稳润光电科技有限公司 | A kind of high colour gamut LED backlight and its processing method |
| CN108010908A (en) * | 2017-11-10 | 2018-05-08 | 江苏稳润光电科技有限公司 | One kind allows the comfortable white light led method for packing of people's sense organ |
| CN109148430A (en) * | 2018-07-02 | 2019-01-04 | 江苏稳润光电科技有限公司 | A kind of led plant illumination light source production method |
| CN109461722A (en) * | 2018-10-16 | 2019-03-12 | 江苏稳润光电科技有限公司 | A kind of amphichrome lamp illumination LED light source |
| CN109411456A (en) * | 2018-10-16 | 2019-03-01 | 江苏稳润光电科技有限公司 | A kind of LED light source for fresh lamp illumination |
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