CN113540187B - Display panel and preparation method thereof - Google Patents

Abstract

The application provides a display panel and a preparation method of the display panel, wherein the display panel comprises an array substrate, a pixel limiting layer and a current carrier layer which are arranged in a stacked manner, the current carrier layer is positioned at one side of the pixel limiting layer, which is away from the array substrate, and the pixel limiting layer comprises a plurality of pixel openings and a pixel limiting body; the display panel is divided into a pixel opening area and a pixel limiting area surrounding the pixel opening area, wherein the pixel opening area comprises a plurality of pixel openings, and the pixel limiting body is positioned in the pixel limiting area; the pixel opening includes adjacent first and second pixel openings, the pixel defining body includes first and second bodies at least between the first and second pixel openings, the first and second bodies are connected, the first body surrounds the first pixel opening, and the first body includes a thermally deformable material. The first body can be thermally deformed to drive the carrier layer on the first body to break, so that the crosstalk problem is solved.

Description

Display panel and preparation method thereof

Technical Field

The application relates to the technical field of display, in particular to a display panel and a preparation method of the display panel.

Background

An OLED (Organic Light Emitting Diode ) has the advantages of being bendable, self-luminous, wide in color gamut, and the like, and is one of the technologies that are receiving wide attention in the display industry at present.

The conventional OLED display panel generally includes a driving substrate, an organic light emitting layer, and an encapsulation layer. The organic light emitting layer generally includes a light emitting material layer and a carrier layer, which is a common layer, and crosstalk exists between adjacent sub-pixels, which affects the display effect.

Disclosure of Invention

In view of the above, the present application provides a display panel and a method for manufacturing the display panel, which solve the problem of display crosstalk.

The first aspect of the application provides a display panel, which comprises an array substrate, a pixel limiting layer and a carrier layer, wherein the array substrate, the pixel limiting layer and the carrier layer are arranged in a stacked mode, the carrier layer is positioned on one side, away from the array substrate, of the pixel limiting layer, and the pixel limiting layer comprises a plurality of pixel openings and a pixel limiting body;

the display panel is divided into a pixel opening area and a pixel limiting area surrounding the pixel opening area, the pixel opening area comprises the plurality of pixel openings, and the pixel limiting body is positioned in the pixel limiting area;

the pixel openings include adjacent first and second pixel openings, the pixel defining body includes first and second bodies at least between the first and second pixel openings, the first and second bodies are connected, the first body surrounds the first pixel opening, and the first body includes a thermally deformable material.

Further, the first pixel opening is a blue pixel opening, the second pixel opening is a red pixel opening or a green pixel opening, and the first pixel body surrounds the blue pixel opening.

Further, the first body includes a first base body and a first thermal deformation portion, the first thermal deformation portion is located at one side of the first base body, which is close to the carrier layer, and the first thermal deformation portion includes a thermal deformation material.

Further, the light-emitting material layer is further included, and the upper surface of the first substrate is not lower than the upper surface of the light-emitting material layer.

Further, the first body includes a substrate and thermally deformable particles doped in the substrate.

Further, the second body comprises a thermal deformation material, and the first body and the second body are opposite in thermal deformation characteristics.

Further, the thermal deformation material is a thermal expansion material or a thermal contraction material.

Further, the thermal deformation material is an oriented deformation material, and the thermal deformation material deforms along the direction perpendicular to the array substrate.

Further, a third body is further included, the third body being composed of a thermally stable material, the third body being located between the first body and the first pixel opening.

The application also provides a preparation method of the display panel, which comprises the following steps:

forming a first body on an array substrate, the first body defining a first pixel opening, the first body comprising a thermally deformable material;

forming a second body on the array substrate, wherein the second body is connected with the first body and defines a second pixel opening;

forming a carrier layer;

and controlling the temperature to reach a preset temperature, and thermally deforming the first body to separate the carrier layer.

According to the preparation method of the display panel, the first body and the second body are arranged between the first pixel opening and the second pixel opening, the first body surrounds the first pixel opening, and the first body comprises the thermal deformation material, so that the first body can change in volume under the action of temperature, the carrier layer arranged on the first body is broken under the pulling of the first body, and the problem of crosstalk among sub-pixels caused by the fact that the carrier layer serves as a common layer of different sub-pixels is solved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:

FIG. 1 is a schematic top view of a display panel according to an embodiment of the application;

FIG. 2 is a schematic view of a cross-sectional structure corresponding to the B-B direction shown in FIG. 1;

FIG. 3 is a schematic cross-sectional view of a display panel according to another embodiment of the present application;

FIG. 4 is a schematic cross-sectional view of the display panel according to the embodiment shown in FIG. 3 after thermal deformation of the first body;

FIG. 5 is a schematic cross-sectional view of a display panel according to another embodiment of the present application;

fig. 6 is a schematic cross-sectional view of a display panel according to another embodiment of the application.

Reference numerals illustrate:

a display panel 10; a pixel opening area PA; a pixel defining area NPA; an array substrate 100; a pixel defining layer 200; the pixel defining body 210; a first body 211; a second body 212; a third body 213; a first substrate 2111, a first thermal deformation 2112, a pixel opening 220; a first pixel opening 221; a first pixel opening 222; a carrier layer 310; a layer 320 of luminescent material.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to fall within the scope of the present application.

In general, a display panel includes an array substrate, a pixel defining layer, and a light emitting layer. The array substrate includes a driving layer and an anode, the pixel defining layer includes a pixel defining body and a pixel opening, the pixel opening may include a red sub-pixel opening, a green sub-pixel opening, a blue sub-pixel opening, and the light emitting layer includes a carrier layer and a light emitting material layer. The carrier layer comprises one or more layers of film layers such as a hole injection layer, a hole transmission layer, an electron injection layer, an electron transmission layer and the like, and has the function of assisting in light emission. The luminescent material layer is at least partially formed in the pixel opening, and the luminescent material layers of adjacent sub-pixels are spaced apart. The luminescent material layer is usually prepared by a Fine Metal Mask (FMM), the luminescent material light layers of adjacent sub-pixels are spaced, the carrier layer is usually prepared by a common mask (common metal mask, CMM) on the whole surface, and the carrier layer is a common layer and covers the sub-pixels with different colors. The inventor researches find that the common layer has a lateral conduction condition, especially the P-type material doped in the cavity injection layer in some OLED devices has higher conductivity, and the lateral conduction is more serious, so that crosstalk is caused in the OLED pixel lighting process, or a lighting phenomenon of adjacent pixels is formed under the condition that the pixels are not lighted, and the display effect is influenced.

In view of the above problems, the present application provides a display panel, including an array substrate, a pixel defining layer and a carrier layer, wherein the array substrate, the pixel defining layer and the carrier layer are stacked, the carrier layer is located at a side of the pixel defining layer facing away from the array substrate, and the pixel defining layer includes a plurality of pixel openings and a pixel defining body; the display panel is divided into a pixel opening area and a pixel limiting area surrounding the pixel opening area, wherein the pixel opening area comprises a plurality of pixel openings, and the pixel limiting body is positioned in the pixel limiting area;

the pixel opening includes adjacent first and second pixel openings, the pixel defining body includes first and second bodies at least between the first and second pixel openings, the first and second bodies are connected, the first body surrounds the first pixel opening, and the first body includes a thermally deformable material.

According to the application, the first body and the second body are arranged between the first pixel opening and the second pixel opening, and the first body surrounds the first pixel opening, so that the first body comprises a thermal deformation material, namely the first body has thermal deformation characteristics, and can change in volume under the action of temperature, such as expansion or contraction under the action of temperature, and thermal deformation is generated. Due to the thermal deformation of the first body, the carrier layer arranged on the first body breaks under the pulling of the first body, so that the problem of crosstalk among sub-pixels caused by the carrier layer serving as a common layer of different sub-pixels is solved.

The following describes the present application in detail with reference to the drawings.

Referring to fig. 1 and 2, fig. 1 is a schematic top view of a display panel according to an embodiment of the application, and fig. 2 is a schematic cross-sectional view of the display panel corresponding to the direction B-B shown in fig. 1. For ease of illustration, fig. 2 shows a schematic cross-sectional structure of carrier layer 310 prior to breaking. The display panel 10 includes an array substrate 100, a pixel defining layer 200, and a carrier layer 310 stacked on one another, the carrier layer 310 being located on a side of the pixel defining layer 200 facing away from the array substrate 100, the pixel defining layer 200 including a plurality of pixel openings 220 and a pixel defining body 210. The display panel 10 is divided into a pixel opening area PA and a pixel defining area NPA surrounding the pixel opening area PA, the pixel opening area PA includes a plurality of pixel openings 220, that is, the plurality of pixel openings 220 define the range of the pixel opening area PA, and the pixel defining body 210 is located in the pixel defining area NPA. The pixel opening 220 includes adjacent first and second pixel openings 221 and 222, the pixel defining body 210 includes at least first and second bodies 211 and 212 between the first and second pixel openings 221 and 222, the first and second bodies 211 and 212 are connected, the first body 211 surrounds the first pixel opening 221, and the first body 211 includes a heat deformable material. The pixel defining body 210 includes at least the first body 211 and the second body 212 between the first pixel opening 221 and the second pixel opening 222, that is, the first body 211 and the second body 212 include portions between the first pixel opening 221 and the second pixel opening 222, so that separation of the carrier layers between the different pixel openings can be achieved, and an effect of preventing crosstalk is improved. It can be appreciated that the first body 211 and the second body 212 may have different thermal deformation characteristics, or have different thermal deformation characteristics with the first body 212 under the condition of thermal deformation of the first body 211, so that the carrier layer 310 surrounding the first pixel opening 221 can be ensured to break under the effect of thermal deformation of the first body 211, and meanwhile, the breaking effect can be improved due to the difference of the thermal deformation characteristics of the first body 211 and the second body 212, so as to solve the crosstalk problem caused by the common carrier layer 310.

The first pixel opening 221 may be a blue pixel opening, the second pixel opening 222 may be a red pixel opening or a green pixel opening, and the first body 211 surrounds the blue pixel opening. Because the blue sub-pixels are easily affected by the material, the crosstalk problem between the adjacent pixels is easily caused by the blue sub-pixels, so that the first body 211 is arranged to surround the blue pixel openings, the crosstalk problem between the sub-pixels with different colors can be efficiently solved, and because the red sub-pixels or the green sub-pixels have weak influence on the sub-pixels with other colors, the same separation design is not required to be continuously performed on the carrier layer 310 between the red sub-pixels or the green sub-pixels, and the process difficulty can be reduced.

Similarly, the first pixel opening 221 may be a red pixel opening or a green pixel opening, and the common layer surrounding the first pixel opening is blocked, so that the crosstalk problem can be solved. By arranging the first body 211 surrounding the first pixel opening 221 to include the thermal deformation material, the remaining pixel defining areas can be the second body 212, and the crosstalk problem existing in the whole display panel 10 can be solved only by thermally deforming the pixel defining body of the partial area, so that the influence of the reduced thermal deformation on the pixel opening can be reduced, the manufacturing difficulty can be reduced, and the manufacturing yield of the display panel can be improved.

In addition, the red sub-pixel is more susceptible to crosstalk than the green sub-pixel, and thus the first body 211 and the second body 212 adjacently arranged may be disposed at least between the red pixel opening and the blue pixel opening.

Referring to fig. 3 and 4, fig. 3 is a schematic cross-sectional structure of a display panel according to still another embodiment of the present application, and fig. 3 is a schematic cross-sectional structure of a first body before thermal deformation. Fig. 4 is a schematic cross-sectional structure of the display panel according to the embodiment shown in fig. 3 after the first body is thermally deformed. In the present embodiment, the first body 211 includes a first base 2111 and a first thermally deformable portion 2112, the first thermally deformable portion 2112 is located on a side of the first base 2111 near the carrier layer 310, and the first thermally deformable portion 2112 includes a thermally deformable material. That is, the first body 211 is provided with a structure including a thermal deformation material in a region closer to the carrier layer 310, so that the requirement of blocking the carrier layer 310 can be satisfied, the thermal deformation range can be reduced, and the thermal deformation efficiency can be improved.

The display panel 10 further includes a luminescent material layer 320, and in one embodiment, the upper surface of the first substrate 2111 is not lower than the upper surface of the luminescent material layer 320. With continued reference to fig. 3 and 4, or the luminescent material layer 320 is located on a side of the first thermal deformation 2112 adjacent to the array substrate 100. In the present application, the carrier layer 310 includes a hole injection layer, and since the main common layer causing the crosstalk problem is the hole injection layer, the hole injection layer may be blocked by giving a temperature condition capable of thermally deforming the thermally deformable material after the hole injection layer is formed, or may be performed after all of the carrier layer 310 and the light emitting material layer 320 are formed. In this embodiment, the upper surface of the first body 211 is not lower than the upper surface of the luminescent material layer 320, and specifically, the upper surface of the first body 2111 is higher than the upper surface of the luminescent material layer 320 or is flush with the upper surface of the luminescent material layer 320, so that the influence of the first thermal deformation portion 2112 on the luminescent material layer 320 can be reduced, and the process flexibility is improved. In addition, the hole injection layer is in direct contact with the first body 211, further improving the blocking effect. The first substrate 2111 has opposite upper and lower surfaces, and the upper surface referred to in the present application is a surface of the first substrate 2111 facing away from the array substrate 100. The luminescent material layer 320 is at least located in the pixel opening area PA, and the luminescent material layers 320 between adjacent pixel openings are arranged at intervals, so that color mixing is avoided, and meanwhile, part of the luminescent material layer 320 can be formed in the pixel limiting area NPA adjacent to the pixel openings, so that the preparation difficulty is reduced.

In the present application, the thermal deformation material may be a thermal expansion material or a thermal contraction material, both of which can change the shape under the action of temperature, the process is simple, and the first body 211 including the thermal deformation material can drive the carrier layer 310 thereon to break under thermal deformation, so as to solve the problem of crosstalk.

The first body 211 includes a thermal deformation material, and in particular, the first body 211 may be composed of the thermal deformation material. The pixel opening structure also comprises a substrate and thermal deformation particles doped in the substrate, wherein the thermal deformation particles are thermal deformation materials, so that the duty ratio of the deformation materials is reduced, and the influence of thermal deformation on the pixel opening is reduced.

When the second body 212 is made of a thermally stable material, the substrate material may be the same as the second body 212 material, and specifically, the material of the pixel defining layer in the existing design may be used. Likewise, when first body 211 includes first base 2111 and first thermally deformable portion 2112, the materials of first base 2111 and second body 212 may be the same. If the first thermal deformation portion 2112 includes a substrate and thermal deformation particles doped in the substrate, the substrate material of the first thermal deformation portion 2112, the first substrate 2111 and the second body 212 may be the same, so as to reduce the difficulty of preparation.

When the first body 211 includes a substrate and thermal deformation particles doped in the substrate, the thermal deformation coefficient of the thermal deformation particles may be 1.2-1.5 times that of the substrate material, so as to meet the thermal deformation requirement, and the same aging process is used to avoid the influence of the excessive difference of the thermal deformation coefficients on the size of the pixel opening, and the pixel deformation.

Preferably, the temperature range at which the thermal deformation material is thermally deformed is not higher than 100 ℃. The thermal deformation material can be selected from materials with a thermal deformation coefficient not greater than 10%, that is, the thermal expansion rate or the thermal shrinkage rate of the thermal deformation material is not greater than 10%, the thermal expansion rate can be defined as B1/A1, wherein B1 refers to the difference between the volume after thermal expansion and the volume before thermal expansion, A1 refers to the volume before thermal expansion, correspondingly, the thermal shrinkage rate can be defined as B2/A2, B2 refers to the difference between the volume before thermal shrinkage and the volume after thermal shrinkage, and A2 refers to the volume before thermal shrinkage, so that the partition effect can be ensured, and the influence on the pixel opening in the thermal deformation process can be reduced.

When the first body 211 includes a substrate and thermally deformable particles doped in the substrate, the thermally deformable particles may have a stripe structure, for example, a prism, and the doping period is longer than the extending direction of the edges and is perpendicular to the array substrate 100, so that the thermal deformation can be more limited in the direction perpendicular to the array substrate 100, thereby improving the influence of the expansion direction on the pixel opening area PA. Preferably, the deformed particle size is no greater than 0.1 microns.

The thermal deformation material may be a single pass deformation material, that is, when the material expands or contracts after heating, the first body does not return to the original state even if the temperature returns to the original temperature. The thermally deformable material may also be a recoverable material, that is to say a material which is characterised by deformation under the action of temperature, the first body returning to its original state when the temperature returns to its original temperature.

Specifically, taking the thermal deformation material as an example of the thermal expansion material, the first body 211 is thermally expanded to break the carrier layer 310, and when the thermal expansion is performed, the first body 211 is larger than the initial shape, and at least the first body 211 is larger in the direction perpendicular to the array substrate 100, so when the thermal expansion material is a single-pass deformation material, the second body 212 can select the thermal stability material, and when the first body 211 is prepared, the upper surface of the first body 211 is closer to the array substrate 100 than the upper surface of the second body 212, the first body 211 expands under the heating condition, and in the control final state, the upper surface of the first body 211 is flush or substantially flat than the upper surface of the pixel defining body. In addition, before the carrier layer is formed, the first body and the second body have a break difference, so that the difficulty of forming the continuous film layer is increased, the carrier layer is broken under the assistance of thermal deformation, in addition, the opposite surfaces of the first body 211 and the second body 212 are perpendicular to the array substrate, the difficulty of forming the continuous film layer is further improved under the effect of the break difference, and the subsequent film layer is broken conveniently.

Accordingly, for the recoverable material, taking thermal expansion as an example, before thermal deformation, the upper surface of the first body 211 is flush with the upper surface of the pixel defining body, the first body 211 expands when heated, the carrier layer 310 is blocked, and the first body 211 returns to the original state when the temperature returns to the original state, thereby maintaining a relatively flat surface.

Corresponding to the heat shrinkage material, when the heat shrinkage material is a single-pass deformation material, the upper surface of the first body 211 protrudes from the upper surface of the second body 212 before heating, and when the heat shrinkage material is a recoverable material, the upper surface of the first body 211 is flush with the upper surface of the second body 212.

In one embodiment, the thermal deformation material is an oriented deformation material, and the thermal deformation material deforms along a direction perpendicular to the array substrate 100, so that the pixel opening is not extruded while the carrier layer 310 is ensured to be broken.

In one embodiment, the second body 212 comprises a thermal deformation material, and the first body 211 and the second body 212 have opposite thermal deformation characteristics. Specifically, the first body 211 may include a material having a thermal expansion characteristic, and the corresponding second body 212 may include a material having a thermal contraction characteristic, whereas the first body 211 includes a material having a thermal contraction characteristic, and the corresponding second body 212 may include a material having a thermal expansion characteristic, and further, a material having opposite thermal deformation characteristics in the same temperature range may be used, so that opposite thermal deformation of the first body 211 and the second body 212 occurs under the same temperature condition, and thus fracture of the common layer may be further enhanced.

Of course, when the second body 212 includes the thermal deformation material, the second body 212 may entirely include the thermal deformation material, or the second body 212 may also include a second base and a second thermal deformation portion, where the second thermal deformation portion is located on a side of the second base away from the array substrate 100. In addition, the second substrate and the first substrate 2111 may be made of the same material. The second matrix may be composed of a thermally deformable material, may include a substrate and thermally deformable particles doped in the substrate, and similarly, the substrate may be the same as the second matrix material. The specific material choices are not described in detail herein.

In the above embodiment, the first body 211 surrounds the first pixel opening 221, and the first body 211 side may be in direct contact with the carrier layer 310, where the first body 211 side refers to a surface near the first pixel opening 221. Or the first body 211 defines a first pixel opening 221.

Referring to fig. 5, fig. 5 is a schematic cross-sectional view of a display panel according to another embodiment of the present application, where the common layer is still not broken before thermal deformation and illustrated in fig. 5, in this embodiment, the display panel 10 further includes a third body 213, where the third body 213 is made of a thermally stable material, and the third body 213 is located between the first body 211 and the first pixel opening 221. In other words, in the present embodiment, the first body 211 having the thermal deformation characteristic and the first pixel opening 221 are separated by the third body 213, and the influence on the pixel opening is reduced, and in the present embodiment, it is considered that the third body 213 finally defines the range of the first pixel opening 221, and the third body 213 may surround the entire range of the third pixel opening or may be a partial range as long as the first body 211 and the first pixel opening 221 can be separated.

In the present application, the pixel defining layer 200 may further include a pixel defining substrate, or the same pixel defining layer as in the conventional design may be formed first, the pixel defining substrate is formed on the surface of the array substrate 100, and then the first body 211 is formed thereon, and the first body 211 includes a thermal deformation material.

Of course, the first body 211 and the second body 212 may be directly formed on the surface of the array substrate 100, and the first body 211 and the second body 212 may include a thermal deformation material and have thermal deformation characteristics, in this embodiment, when the first body 211 or the second body 212 needs to have thermal deformation characteristics, the first body 211 or the second body may be provided with a laminated substrate and a thermal deformation portion structure, the substrate is located on one side of the thermal deformation portion near the array substrate 100, and the relative positions of the thermal deformation and the light-emitting material layer 320 or the common layer in the direction perpendicular to the array substrate 100 may be further adjusted as required, so that the common layer is broken on the basis of not increasing the thickness of the conventional display panel 10, thereby reducing the influence on the pixel opening.

Referring to fig. 6, fig. 6 is a schematic cross-sectional view of a display panel according to another embodiment of the present application. Along the direction of the array substrate 100 approaching the pixel defining layer 200, the projection area of the first body 211 on the array substrate 100 may be increased, for example, gradually increased. Specifically, the surface of the second body 212 connected to the first body 211, which is close to the first body 211, may be formed gradually away from the first pixel opening 221 along the direction of the array substrate 100, which is close to the pixel defining layer 200, thereby reducing the arrangement range of the first body 211 while ensuring a sufficient contact area between the first body 211 and the carrier layer 310. Also, the pixel opening is typically an opening gradually increasing along the direction of the array substrate 100 approaching the pixel defining layer 200, and thus, the first body 211 may have an inverted trapezoid-like shape along a section perpendicular to the direction of the array substrate 100. Of course, there may be right trapezoid shapes as shown in fig. 2-4.

In addition, the first body 211 may include a first sub-body surrounding the first pixel opening 221 and a second sub-body surrounding the first sub-body, wherein the first sub-body may further define the first pixel opening 221, and the second sub-body may be spaced apart from the first sub-body by a reinforcement body made of a thermally stable material or a material having a thermal deformation characteristic opposite to that of the first sub-body, and the reinforcement material may be the same as that of the second body 212. By providing the first sub-body, the second sub-body, and the reinforcing portion, a plurality of regions having different thermal deformation characteristics are formed between the first pixel opening 221 and the second pixel opening 222 at intervals, and the partition effect is improved.

The application provides a preparation method of a display panel. The display panel manufacturing method includes forming a first body 211 on the array substrate 100, the first body 211 defining a first pixel opening 221, the first body 211 including a thermal deformation material; forming a second body 212 on the array substrate 100, the second body 212 being connected to the first body 211, the second body 212 defining a second pixel opening 222; forming a carrier layer 310; the control temperature reaches a preset temperature, and the first body 211 is thermally deformed to block the carrier layer 310. The first body 211 and the second body 212 are included between the first pixel opening 221 and the second pixel opening 222, and the first body 211 defines the first pixel opening 221, so that the carrier layer 310 between adjacent sub-pixels can be blocked by the first body 211, and crosstalk is avoided. The above-described manufacturing method may be used to form the display panel 10 in the foregoing embodiment

According to the preparation method of the display panel, after the carrier layer 310 is formed, a preset temperature environment is provided, so that the first body 211 is thermally deformed to drive the carrier layer 310 positioned on the first body to break, and the problem of color cross is avoided.

Further, forming carrier layer 310 includes forming a hole injection layer; or the hole injection layer and the hole transport layer are formed, since the hole injection layer has a large influence on crosstalk, thermal deformation of the first body 211 may be performed immediately after the hole injection layer is formed, so that the hole injection layer breaks. Also, the hole transport layer has some influence on cross color, and thus thermal deformation of the first body 211 may be performed immediately after the hole transport layer is formed. It is of course also possible to thermally deform the first body 211 after forming all of the carrier layers 310 and before forming the cathode, at least to fracture the hole injection layer. The specific preparation process for forming the pixel defining layer 200 and the carrier layer 310 may be a preparation method in the prior art, which is not described herein.

The application also provides a display device which comprises the display panel provided by any embodiment, and the display device can solve the crosstalk problem due to the display panel.

In this specification, each embodiment or implementation is described in a progressive manner, and each embodiment focuses on a difference from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims (9)

1. The display panel is characterized by comprising an array substrate, a pixel limiting layer and a carrier layer, wherein the array substrate, the pixel limiting layer and the carrier layer are arranged in a stacked mode, the carrier layer is positioned on one side, away from the array substrate, of the pixel limiting layer, and the pixel limiting layer comprises a plurality of pixel openings and a pixel limiting body;

the display panel is divided into a pixel opening area and a pixel limiting area surrounding the pixel opening area, the pixel opening area comprises the plurality of pixel openings, and the pixel limiting body is positioned in the pixel limiting area;

the pixel openings comprise adjacent first and second pixel openings, the pixel defining body comprises first and second bodies at least between the first and second pixel openings, the first and second bodies are connected, the first body surrounds the first pixel opening, the first body comprises a thermal deformation material;

the first body comprises a first matrix and a first thermal deformation part, the first thermal deformation part is positioned on one side of the first matrix, which is close to the carrier layer, and the first thermal deformation part comprises a thermal deformation material.

2. The display panel of claim 1, wherein the first pixel opening is a blue pixel opening, the second pixel opening is a red pixel opening or a green pixel opening, and the first body surrounds the blue pixel opening.

3. The display panel of claim 1, further comprising a luminescent material layer, wherein the first substrate upper surface is not lower than the luminescent material layer upper surface.

4. The display panel of claim 1, wherein the first body comprises a substrate and thermally deformable particles doped in the substrate.

5. The display panel of claim 1, wherein the second body comprises a thermally deformable material, the first body and the second body having opposite thermal deformation characteristics.

6. The display panel according to claim 1, wherein the thermal deformation material is a thermal expansion material or a thermal contraction material.

7. The display panel of claim 1, wherein the thermal deformation material is an oriented deformation material, the thermal deformation material being deformed in a direction perpendicular to the array substrate.

8. The display panel of claim 1, further comprising a third body composed of a thermally stable material, the third body being located between the first body and the first pixel opening.

9. A method for manufacturing a display panel, comprising:

forming a first body on the array substrate, wherein the first body defines a first pixel opening, the first body comprises a first matrix and a first thermal deformation part, the first thermal deformation part is positioned at one side of the first matrix, which is close to the carrier layer, and the first thermal deformation part comprises a thermal deformation material;

forming a second body on the array substrate, wherein the second body is connected with the first body and defines a second pixel opening;

forming a carrier layer;

and controlling the temperature to reach a preset temperature, and thermally deforming the first body to separate the carrier layer.