CN113539895A - Chip baking and curing method and chip mounting method - Google Patents
Chip baking and curing method and chip mounting method Download PDFInfo
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- CN113539895A CN113539895A CN202110673807.1A CN202110673807A CN113539895A CN 113539895 A CN113539895 A CN 113539895A CN 202110673807 A CN202110673807 A CN 202110673807A CN 113539895 A CN113539895 A CN 113539895A
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- 238000001723 curing Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 34
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 64
- 238000010438 heat treatment Methods 0.000 claims abstract description 55
- 239000003292 glue Substances 0.000 claims abstract description 48
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 32
- 230000000694 effects Effects 0.000 abstract description 8
- 238000012360 testing method Methods 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000000151 deposition Methods 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 15
- 229910052709 silver Inorganic materials 0.000 description 15
- 239000004332 silver Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 13
- 239000000084 colloidal system Substances 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to the technical field of semiconductor packaging and testing, and discloses a chip baking and curing method and a chip mounting method. The chip baking and curing method utilizes an oven with a nitrogen charging valve and an exhaust fan to bake chips and cure glue on the chips, and comprises the following steps: heating the oven to a first temperature in the heating volatilization section, and keeping the first temperature in the oven for a first time, wherein an exhaust fan and a nitrogen charging valve are started in the heating volatilization section; in the heating and curing section, the exhaust fan is closed, the oven is heated, the temperature of the oven is raised to a second temperature, and the oven is kept at the second temperature for a second time period; and in the cooling and temperature-reducing section, cooling the oven. The chip baking and curing method and the chip mounting method provided by the invention can bake and cure the glue on the chip, can timely remove the volatile matters of the glue in the oven, prevent the volatile matters from depositing and attaching to the surface of the chip product, and ensure the baking and curing effect of the chip product and the quality of the chip product.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging and testing, in particular to a chip baking and curing method and a chip mounting method.
Background
The semiconductor sealing and testing mainly comprises the following procedures: thinning, scribing, mounting, bonding, plastic packaging, rib cutting and forming and the like. The chip mounting process comprises the steps of dispensing, chip pasting and baking solidification.
The baking and curing process is used for removing components such as a diluent in glue, and the baking and curing effect directly influences the quality of the product welding line, the layering of the product, the service life of the product and the like.
In the prior art, baking and curing are mostly carried out in an oven, and only glue curing is considered during baking and curing, but the influence of volatile matters on the product quality is not considered. Volatile matters generated after the glue is baked cannot be discharged from the oven, and the volatile matters remained in the oven are easy to deposit and attach to the surface of a chip product, so that the chip product is polluted, and the quality of the chip product is influenced.
Disclosure of Invention
The invention aims to provide a chip baking and curing method and a chip mounting method, which can improve the chip baking and curing effect and the chip product quality by optimizing the chip baking and curing process.
In order to solve the above problems, in a first aspect, the present invention provides a method for baking and curing a chip, which uses an oven with a nitrogen charging valve and an exhaust fan to bake the chip and cure glue on the chip, the method comprising:
heating the oven in a heating and volatilizing section to enable the temperature in the oven to rise to a first temperature and enable the oven to keep the first temperature for a first time, wherein the exhaust fan and the nitrogen charging valve are opened in the heating and volatilizing section;
in the heating and curing section, the exhaust fan is closed, the oven is heated, the temperature in the oven is raised to a second temperature, and the oven is kept at the second temperature for a second time period, wherein the second temperature is a preset glue curing temperature, and the second time period is time required for the glue to be cured at the second temperature;
and cooling the oven in a cooling and temperature-reducing section.
In one embodiment, the first temperature is in a range of 95 ℃ to 105 ℃.
In one embodiment, the time required to heat the oven to bring the oven temperature to the first temperature is 10min to 15 min.
In one embodiment, the first time period is 35min to 45 min.
In one embodiment, the nitrogen charging flow rate of the nitrogen charging valve is 60L/MIN-80L/MIN.
In one embodiment, the heating and curing section comprises a first constant temperature zone, a temperature rise zone and a second constant temperature zone; in the first constant temperature interval, closing the exhaust fan and keeping the oven at the first temperature; heating the oven in the temperature-rising interval to rise the temperature in the oven to the second temperature, wherein the time of the temperature-rising interval is 30-40 min; maintaining the oven at the second temperature in the second constant temperature zone.
In one embodiment, said cooling said oven comprises: cooling the oven to reduce the temperature in the oven to a third temperature; and opening the exhaust fan, and cooling the oven to reduce the temperature in the oven to a fourth temperature.
In one embodiment, the third temperature is in a range of 80 ℃ to 120 ℃.
In one embodiment, the fourth temperature is in a range of 80 ℃ to 85 ℃.
The chip baking and curing method provided by the invention comprises three stages: a heating volatilization section, a heating solidification section and a cooling temperature reduction section. Wherein, in the heating and volatilizing section, the volatilization amount of the glue can reach 90 percent of the total volatilization amount, and the volatile matters generated in the stage can be discharged by using an exhaust fan; in the heating and curing section, the glue can be baked and cured; in the cooling and temperature-reducing section, the temperature of the oven can be reduced, so that the baked and cured chip product can be taken out conveniently. According to the chip baking and curing method, the heating and volatilizing section is additionally arranged in front of the heating and curing section, glue volatile matters in the oven can be timely discharged, and the content of volatile matters in the oven is reduced, so that the volatile matters are prevented from being deposited and attached to the surface of a chip product in the subsequent baking and curing process, the problem of chip product layering is effectively solved, the yield of the chip product is improved, and the baking and curing effect and the quality of the chip product are ensured.
In a second aspect, the present invention provides a chip mounting method, including:
attaching the chip to the frame by using glue;
and baking the chip by using the chip baking and curing method in the first aspect to cure the glue.
The chip mounting method provided by the invention comprises two processes of mounting and baking and curing, wherein the chip baking and curing method comprises three stages: a heating volatilization section, a heating solidification section and a cooling temperature reduction section. In the heating and volatilizing section, the volatilization amount of the glue can reach 90 percent of the total volatilization amount, and volatile matters generated in the stage can be discharged by utilizing an exhaust fan; in the heating and curing section, the glue can be baked and cured; in the cooling and temperature-reducing section, the temperature of the oven can be reduced, so that the baked and cured chip product can be taken out conveniently. According to the chip mounting method, the chip baking and curing method is improved, the heating and volatilizing section is additionally arranged in front of the heating and curing section, glue volatile matters in the oven can be discharged in time, the content of volatile matters in the oven is reduced, so that the volatile matters are prevented from being deposited and attached to the surface of a chip product in the subsequent baking and curing process, the problem of chip product layering is effectively solved, the yield of the chip product is improved, and the baking and curing effect and the quality of the chip product are ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a flowchart of a chip baking and curing method according to an embodiment of the present invention;
FIG. 2 is a baking curve diagram of a chip baking and curing method according to an embodiment of the present invention;
FIG. 3 is a graph of volatilization characteristics of silver colloid at 100 ℃;
FIG. 4 is a flowchart of step S13 in FIG. 1;
fig. 5 is a flowchart of a chip mounting method according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the patent. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
In a first aspect, the invention provides a chip baking and curing method, which utilizes an oven to bake and cure glue on a chip. The oven is provided with a nitrogen charging valve, has an automatic nitrogen charging function and can be charged with nitrogen in the baking process; the oven is also provided with a volatile matter discharge air port, a fresh air compensation air port and an exhaust fan, so that air in the oven can be exhausted and fresh air outside the oven can be introduced; in addition, still be equipped with automatic switch in volatile substance discharge wind gap department, and the oven presets intelligent program, can realize automatic control.
As shown in fig. 1 and 2, the die bake curing method includes the following steps.
S11: and heating the oven in the heating volatilization section to raise the temperature in the oven to a first temperature and keep the oven at the first temperature for a first time, wherein the exhaust fan and the nitrogen charging valve are opened in the heating volatilization section.
The first temperature and the first time length are preset values, the glue volatilization amount is relatively large at the first temperature, the frame for loading the chip is not easy to oxidize, and the proportion of the glue volatilization amount in the volatilization total amount exceeds 90% in the first time length. The values of the first temperature and the first time period are related to the type of glue, as shown in fig. 2, in one embodiment, the first temperature is 100 ℃, and the first time period is 40min, but not limited thereto.
When the exhaust fan operates, the volatile matter discharge air port can be automatically opened and can lead out the gas containing volatile matters in the oven, and meanwhile, the fresh air compensation air port is opened and can lead the fresh air outside the oven into the oven, so that the content of the glue volatile matters in the oven can be effectively reduced by opening the exhaust fan.
After the nitrogen filling valve is opened, nitrogen can be filled into the oven, so as to reduce the oxygen content in the oven and ensure that the product is not oxidized.
It should be noted that, the opening time of the nitrogen charging valve and the exhaust fan is not exclusive, and in an embodiment, as shown in fig. 2, the nitrogen charging valve may be opened at the beginning of the baking curing, and the exhaust fan may be controlled to be opened when the oven temperature is increased to 100 ℃ and t is 10 min.
S12: and in the heating and curing section, the exhaust fan is closed, the oven is heated, the temperature in the oven is raised to a second temperature, and the oven is kept at the second temperature for a second time.
The second temperature and the second time duration are preset values, and the glue can be cured within the second temperature and the second time duration. The values of the second temperature and the second time duration are related to the type of the glue, and as shown in the graph of fig. 2, the second temperature is set to 200 ℃, and the second time duration is set to 90min for clearly explaining the solution of the present application and cannot limit the protection scope of the present application.
The frame for loading the chip is made of metal materials, the oxidation speed of the frame is also improved along with the rise of the temperature in the oven, the exhaust fan is closed, the nitrogen filling valve is kept open, the nitrogen filling valve can fill nitrogen into the oven in the baking process, so that the oxygen content in the oven can be effectively reduced, and the oxidation speed of the frame is further reduced. Further, the oven can be heated after the oxygen content in the oven is reduced to below 5000PPM, and the subsequent steps are carried out.
In one embodiment, the heat curing section comprises a first constant temperature zone, a temperature rise zone and a second constant temperature zone. As shown in fig. 2, the section t (50min, 80min) is a first constant temperature zone, in the first constant temperature zone, the exhaust fan is closed and the nitrogen charging valve is opened, the temperature in the oven is kept unchanged and the oxygen content is continuously reduced, and when the section t is 80min, the oxygen content in the oven is reduced to below 5000 PPM; the temperature rise interval is a t (80min, 110min) segment, the temperature in the oven is continuously raised in the temperature rise interval, and when the t is 110min, the temperature in the oven is raised to 200 ℃; and (t) (110min, 200min) section is a second constant temperature section, the temperature in the oven is kept unchanged in the second constant temperature section, and the glue can be solidified.
S13: and cooling the oven in a cooling and temperature-reducing section.
After the glue is cured, the oven can be cooled to gradually reduce the temperature in the oven, and then the chip product after being cured is taken out from the oven.
The chip baking and curing method provided by the invention comprises three stages: a heating volatilization section, a heating solidification section and a cooling temperature reduction section. Wherein, in the heating and volatilizing section, the volatilization amount of the glue can reach 90 percent of the total volatilization amount, and the volatile matters generated in the stage can be discharged by using an exhaust fan; in the heating and curing section, the glue can be baked and cured; in the cooling and temperature-reducing section, the temperature of the oven can be reduced, so that the baked and cured chip product can be taken out conveniently. According to the chip baking and curing method, the heating and volatilizing section is additionally arranged in front of the heating and curing section, glue volatile matters in the oven can be timely discharged, and the content of volatile matters in the oven is reduced, so that the volatile matters are prevented from being deposited and attached to the surface of a chip product in the subsequent baking and curing process, the problem of chip product layering is effectively solved, the yield of the chip product is improved, and the baking and curing effect and the quality of the chip product are ensured.
When the chip is mounted, the chip needs to be fixed on the frame by glue. The frame is made of metal material, and the oxidation speed of the metal material is positively correlated with the temperature. Taking a frame as an example, the inventor tests through multiple experiments that the frame is baked for 1 hour under the condition of not charging nitrogen, and the frame is not oxidized when the baking temperature is set to be 80-120 ℃; when the baking temperature was set to 130 ℃, the frame was slightly oxidized; when the baking temperature is set to 140 ℃, severe oxidation of the frame occurs.
Furthermore, in the related art, the glue is mostly silver glue, the chip can be fixed on the frame by utilizing the silver glue, the types of the silver glue are different according to different raw material proportions, but the volatilization characteristics of various types of the silver glue are similar. The inventor tests for many times, and the silver colloid has large volatilization amount and high volatilization speed when the baking temperature is 95-105 ℃. In summary, the first temperature can be set to 95-105 ℃ according to the volatilization characteristics of the silver colloid and the oxidation condition of the framework.
Alternatively, in one embodiment provided by the present invention, the first temperature may be set to 100 ℃. Taking a silver colloid as an example, a baking test is carried out on the silver colloid, the volatilization characteristic curve of the silver colloid under the condition of 100 ℃ is shown in figure 3, and the volatilization amount of the silver colloid accounts for more than 90 percent of the total volatilization amount in the first 35min-45 min. In conclusion, the first time period can be set to 35-45min according to the characteristic volatilization curve of the silver colloid.
As shown in fig. 3, which is a volatilization curve of silver paste at 100 ℃, alternatively, in an embodiment provided by the present invention, the first temperature can be set to 100 ℃, and the first time period can be set to 40 min.
It is understood that in some embodiments, the first temperature may be set to other values depending on the actual physical and chemical parameters of the silver paste. In addition, the exhaust time can be shortened or prolonged according to different actual operating parameters of the oven, such as the first temperature and the power of the exhaust fan, or according to different baking curing requirements, and the design can be specifically carried out according to actual conditions, which is not limited herein.
In the process of baking and curing the chip, the quality of the chip is easily affected by sudden change of the environmental temperature. In one embodiment of the present invention, in order to ensure the quality of the chip and the baking and curing effect, the time required for heating the oven to raise the temperature of the oven to the first temperature is 10 min.
Further, in one embodiment provided by the present invention, the time required to heat the oven to raise the oven temperature to the second temperature is 30 min.
It will be appreciated that to further increase the safety of the heating process, in some embodiments, the heating time may also be extended. For example, the heating time to the first temperature may be set to any value of 10min to 15min, and the heating time to the second temperature may be set to any value of 30min to 40min, which may be designed according to actual circumstances, and is not limited herein.
When the nitrogen charging valve is used for charging nitrogen into the oven, the nitrogen charging flow rate is different along with the difference of the opening degree of the nitrogen charging valve. In order to ensure the nitrogen charging speed and the nitrogen charging pressure, in the chip baking and curing method provided by the invention, the flow of the nitrogen charging valve can be set to be 60L/MIN-80L/MIN.
In the chip baking and curing method provided by the invention, the mode of cooling the oven is not unique.
For example, in one embodiment provided by the present invention, as shown in fig. 2 and 4, the cooling oven comprises:
s131: and cooling the oven to reduce the temperature in the oven to a third temperature.
The third temperature is a preset value, and when the temperature in the oven is lower than the third temperature, the frame is not easy to oxidize.
S132: and opening the exhaust fan, and cooling the oven to reduce the temperature in the oven to a fourth temperature.
When the exhaust fan operates, the volatile matter exhaust air port and the fresh air compensation air port are both opened, and high-temperature gas in the oven can be led out by utilizing the exhaust fan, and low-temperature gas outside the oven can be led in, so that the gas flow replacement speed can be accelerated, and the cooling speed of the oven is improved. And the fourth temperature is a preset value, and when the temperature of the oven is reduced to the fourth temperature, the chip product can be taken out of the oven.
It is understood that, in some embodiments, to avoid the frame from being oxidized, the temperature of the oven may also be directly reduced to the fourth temperature, which may be specifically designed according to practical situations and is not limited herein.
Taking a frame as an example, the inventor tests through multiple experiments that when the baking temperature is set to be 80-120 ℃, the frame is not oxidized; when the baking temperature was set to 130 ℃, the frame was slightly oxidized; when the baking temperature is set to 140 ℃, severe oxidation of the frame occurs. In summary, in the chip baking and curing method provided by the present invention, the third temperature can be set to any value of 80 ℃ to 120 ℃. Alternatively, in one embodiment provided by the present invention, the third temperature may be set to 100 ℃.
In order to ensure the safety of operators and avoid the oxidation of the frame, the fourth temperature can be set to any value between 80 and 85 ℃ in the chip baking and curing method provided by the invention. Alternatively, in one embodiment provided by the present invention, the fourth temperature may be set to 80 ℃.
It should be noted that, the time required for cooling the oven from the second temperature to the third temperature and from the third temperature to the fourth temperature is related to the set temperature, and the process is controlled by the temperature during actual operation, and the next curve can be shifted to when the temperature reaches the preset value. As shown in fig. 2, in an embodiment, the time required for the oven to cool from the second temperature to the third temperature is 30min, and the time required for the oven to cool from the third temperature to the fourth temperature is 10min, but is not limited thereto.
Referring to fig. 2, a chip baking and curing method provided by the present invention includes a heating and volatilizing section, a heating and solidifying section, and a cooling and cooling section. Specifically, the heating and volatilizing section comprises a heating interval and a volatile matter removing interval, wherein t ═ (0, 10min) is the heating interval, and at the stage, the nitrogen charging valve can be opened and the oven can be heated, so that the temperature in the oven is raised to 100 ℃; and t is (10min, 50min) a volatile matter removing interval, and the temperature of the oven is maintained at the constant temperature at the stage, and an exhaust fan is started to discharge volatile matters in the oven. The heating and curing section comprises a first constant temperature interval, a temperature rise interval and a second constant temperature interval, wherein the t ═ 50min, 80min section is the first constant temperature interval, the oven is kept at a constant temperature at the stage, the exhaust fan is closed, the nitrogen charging valve is kept open, and the oxygen content in the oven is reduced to below 5000 PPM; the t (80min, 110min) section is a temperature rise section, and the oven is heated at the stage, so that the temperature in the oven is raised to 200 ℃; and (5) setting the section t (110min, 200min) as a second constant temperature section, and maintaining the constant temperature of the oven at the stage to cure the glue. The cooling and temperature-reducing section comprises a first temperature-reducing section and a second temperature-reducing section, wherein the section t (200min, 230min) is the first temperature-reducing section, and the temperature of the oven is cooled at the stage, so that the temperature in the oven is reduced to 100 ℃; and (230min, 240min) segment is a second cooling interval, and the oven is continuously cooled at the stage, and the exhaust fan is started to reduce the temperature in the oven to 80 ℃.
In a second aspect, the present invention further provides a chip mounting method, as shown in fig. 5, the chip mounting method includes the following steps.
S21: the chip is attached to the frame by glue.
Wherein, the glue can be silver glue. The chip is attached to the frame after spot-bonding on the frame.
S22: and baking the chip by using the chip baking and curing method as in the first aspect to cure the glue.
The chip mounting method provided by the invention comprises two processes of mounting and baking and curing, wherein the chip baking and curing method comprises three stages: a heating volatilization section, a heating solidification section and a cooling temperature reduction section. In the heating and volatilizing section, the volatilization amount of the glue can reach 90 percent of the total volatilization amount, and volatile matters generated in the stage can be discharged by utilizing an exhaust fan; in the heating and curing section, the glue can be baked and cured; in the cooling and temperature-reducing section, the temperature of the oven can be reduced, so that the baked and cured chip product can be taken out conveniently. According to the chip mounting method, the chip baking and curing method is improved, the heating and volatilizing section is additionally arranged in front of the heating and curing section, glue volatile matters in the oven can be discharged in time, the content of volatile matters in the oven is reduced, so that the volatile matters are prevented from being deposited and attached to the surface of a chip product in the subsequent baking and curing process, the problem of chip product layering is effectively solved, the yield of the chip product is improved, and the baking and curing effect and the quality of the chip product are ensured.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. A chip baking and curing method is characterized in that an oven with a nitrogen charging valve and an exhaust fan is used for baking chips and curing glue on the chips, and the chip baking and curing method comprises the following steps:
heating the oven in a heating and volatilizing section to enable the temperature in the oven to rise to a first temperature and enable the oven to keep the first temperature for a first time, wherein the exhaust fan and the nitrogen charging valve are opened in the heating and volatilizing section;
in the heating and curing section, the exhaust fan is closed, the oven is heated, the temperature in the oven is raised to a second temperature, and the oven is kept at the second temperature for a second time period, wherein the second temperature is a preset glue curing temperature, and the second time period is time required for the glue to be cured at the second temperature;
and cooling the oven in a cooling and temperature-reducing section.
2. The die bake curing method of claim 1, wherein the first temperature is in the range of 95 ℃ to 105 ℃.
3. The method for baking and curing chips as claimed in claim 1 or 2, wherein the oven is heated to raise the temperature in the oven to the first temperature for 10min-15 min.
4. The method for baking and curing chips as claimed in claim 1 or 2, wherein the first time period is 35min to 45 min.
5. The method for baking and curing chips as claimed in claim 1, wherein the nitrogen charging flow rate of the nitrogen charging valve is 60L/MIN-80L/MIN.
6. The baking and curing method for chips as claimed in claim 1, wherein the heating and curing section comprises a first constant temperature zone, a temperature rise zone and a second constant temperature zone; in the first constant temperature interval, closing the exhaust fan and keeping the oven at the first temperature; heating the oven in the temperature-rising interval to rise the temperature in the oven to the second temperature, wherein the time of the temperature-rising interval is 30-40 min; maintaining the oven at the second temperature in the second constant temperature zone.
7. The die bake curing method of claim 1, wherein said cooling said oven comprises: cooling the oven to reduce the temperature in the oven to a third temperature; and opening the exhaust fan, and cooling the oven to reduce the temperature in the oven to a fourth temperature.
8. The die bake curing method of claim 7, wherein the third temperature is in the range of 80 ℃ to 120 ℃.
9. The die bake curing method of claim 7, wherein the fourth temperature is in the range of 80 ℃ to 85 ℃.
10. A chip mounting method is characterized by comprising the following steps:
attaching the chip to the frame by using glue;
baking the chip by using the chip baking and curing method as claimed in any one of claims 1 to 9 to cure the glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115179469A (en) * | 2022-07-21 | 2022-10-14 | 江苏邑文微电子科技有限公司 | Polyimide oven curing process conversion method applied to semiconductor device |
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| CN102798283A (en) * | 2012-08-11 | 2012-11-28 | 南通华达微电子集团有限公司 | Control device and method for gas pressure in silver slurry curing oven |
| CN205900574U (en) * | 2016-08-12 | 2017-01-18 | 南京华伯新材料有限公司 | Intrinsic thin layer heterojunction HIT low temperature silver thick liquid curing equipment |
| CN111540809A (en) * | 2020-04-13 | 2020-08-14 | 常州比太科技有限公司 | Solar cell silicon chip drying and curing integrated equipment |
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| CN102798283A (en) * | 2012-08-11 | 2012-11-28 | 南通华达微电子集团有限公司 | Control device and method for gas pressure in silver slurry curing oven |
| CN205900574U (en) * | 2016-08-12 | 2017-01-18 | 南京华伯新材料有限公司 | Intrinsic thin layer heterojunction HIT low temperature silver thick liquid curing equipment |
| CN111540809A (en) * | 2020-04-13 | 2020-08-14 | 常州比太科技有限公司 | Solar cell silicon chip drying and curing integrated equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115179469A (en) * | 2022-07-21 | 2022-10-14 | 江苏邑文微电子科技有限公司 | Polyimide oven curing process conversion method applied to semiconductor device |
| CN115179469B (en) * | 2022-07-21 | 2023-06-23 | 江苏邑文微电子科技有限公司 | Polyimide oven curing process conversion method applied to semiconductor device |
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Application publication date: 20211022 |