CN113534623A - Developer additive composition - Google Patents
Developer additive composition Download PDFInfo
- Publication number
- CN113534623A CN113534623A CN202110858023.6A CN202110858023A CN113534623A CN 113534623 A CN113534623 A CN 113534623A CN 202110858023 A CN202110858023 A CN 202110858023A CN 113534623 A CN113534623 A CN 113534623A
- Authority
- CN
- China
- Prior art keywords
- parts
- component
- surfactant
- additive composition
- developer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000654 additive Substances 0.000 title claims abstract description 16
- 230000000996 additive effect Effects 0.000 title claims abstract description 16
- 239000000203 mixture Substances 0.000 title claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 14
- 239000012153 distilled water Substances 0.000 claims abstract description 14
- 230000003381 solubilizing effect Effects 0.000 claims abstract description 13
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 12
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 11
- 239000003960 organic solvent Substances 0.000 claims abstract description 11
- 239000004094 surface-active agent Substances 0.000 claims description 25
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 9
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 229920000570 polyether Polymers 0.000 claims description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 claims description 6
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 6
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 6
- 239000013530 defoamer Substances 0.000 claims description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 4
- YHRUOJUYPBUZOS-UHFFFAOYSA-N 1,3-dichloropropane Chemical compound ClCCCCl YHRUOJUYPBUZOS-UHFFFAOYSA-N 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- 150000001298 alcohols Chemical class 0.000 claims description 3
- 239000003945 anionic surfactant Substances 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 230000008859 change Effects 0.000 abstract description 2
- 229910052806 inorganic carbonate Inorganic materials 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 22
- 239000006260 foam Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000693 micelle Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229920000136 polysorbate Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229920001213 Polysorbate 20 Polymers 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 125000003172 aldehyde group Chemical group 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002401 polyacrylamide Polymers 0.000 description 2
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 2
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000661 sodium alginate Substances 0.000 description 2
- 235000010413 sodium alginate Nutrition 0.000 description 2
- 229940005550 sodium alginate Drugs 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- -1 fatty acid ester Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 230000003204 osmotic effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000012487 rinsing solution Substances 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005063 solubilization Methods 0.000 description 1
- 230000007928 solubilization Effects 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 238000003079 width control Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The invention relates to a developer additive composition, comprising a first component and a second component, wherein the first component is used for solubilizing and reducing the surface tension of a developer solution; the second component is used for separating out a dry film dissolved in the developing solution; the first component comprises 35-50 parts of nonionic surfactant, 20-30 parts of defoaming agent and 120 parts of distilled water; the second component comprises 20-50 parts of organic solvent, 10-30 parts of organic compound and 160 parts of distilled water. The invention has the advantages that: reduce the tank liquor and change frequency, reduce artifical and environmental protection cost: most of the developing solution is inorganic carbonate, the PH of the developing solution is gradually reduced along with the increase of the dissolving amount of the dry film, the dissolving capacity is obviously reduced, and the like.
Description
Technical Field
The invention relates to a developer additive composition, and relates to the field of photoresist development.
Background
Integrated circuits have now entered the deep sub-micron stage and are continually evolving. With the rapid development of industries such as mobile phones, computers, household appliances, automotive electronics and the like, the domestic PCB industry is in the golden period of rapid development. With the development of the PCB industry, customers have higher and higher requirements on the appearance of the PCB and the impedance among various wires, and the width control of the wires is more strict. The development is an important process in the PCB manufacturing process, and the development quality directly influences the quality of the PCB. The developing process is to remove the unexposed part of the photosensitive film by chemical reaction to expose the copper pattern circuit to be etched and removed. As the resolution of the image is increased, the line width and the aperture size become smaller and smaller, and the influence of the development condition on the line becomes more obvious.
In the development process, when the dry film constantly dissolved into developing solution, the property of a medicine of solution can descend rapidly, and the dry film dissolution rate descends, leads to containing too much dry film piece in the developing solution, and easily be stained with inside the equipment, has increased the dry film and has inversely glued the probability on the circuit board, can cause the short circuit of circuit figure, product defect, the yield of direct influence product. In the prior art, the main adopted solution is to regularly maintain the developing line, and increase the frequency of replacing bath solution, rinsing solution and disassembling equipment, which can increase the cost of labor and waste liquid treatment and environmental hazard.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a developer additive composition, and the technical scheme of the invention is as follows:
a developer additive composition comprising a first component for solubilizing and reducing developer surface tension and a second component; the second component is used for separating out a dry film dissolved in the developing solution; the first component comprises 35-50 parts of nonionic surfactant, 20-30 parts of defoaming agent and 120 parts of distilled water; the second component comprises 20-50 parts of organic solvent, 10-30 parts of organic compound and 160 parts of distilled water.
The nonionic surfactant comprises a solubilizing surfactant and a surfactant for reducing tension, wherein the solubilizing surfactant is polyoxyethylene ether surfactant; the surfactant for reducing tension is a carboxylic acid group type anionic surfactant.
The defoaming agent is a polyether defoaming agent.
The organic solvent is one or a composition of more of dichloromethane, tetrahydrofuran, chlorobenzene, DMF, acetonitrile, 1, 3-dichloropropane, toluene, xylene, ethyl acetate or micromolecular alcohols according to any proportion.
The organic compound is a compound containing carboxyl, hydroxyl, aldehyde group, amino or nitro group.
The invention has the advantages that:
1. reduce the tank liquor and change frequency, reduce artifical and environmental protection cost: most of the developing solution is inorganic carbonate, the PH of the developing solution is gradually reduced along with the increase of the dissolving amount of the dry film, and the dissolving capacity is obviously reduced.
The solubilizing component contained in the first component of the developer additive is a surfactant, one end of the molecular structure of which is hydrophilic and the other end of which is hydrophobic; can form a micelle in water, and the inside of the whole micelle is nonpolar and the outside is polar. The micelle is a tiny colloidal particle, and the dispersion system of the micelle belongs to colloidal solution, so that a dry film is occluded or adsorbed, the dissolving amount is increased, the service life of the developing solution is prolonged, the frequency of tank liquor replacement is reduced, and the labor and environmental protection cost is saved.
2. Reduce the reverse sticky of circuit board, improve the product yield: in the developer use, the PH of liquid medicine reduces gradually, makes when dissolving the membrane ability and reducing, and the phenomenon also can appear appearing separating out to the sensitization dry film, and this just makes on going the roller with the dry film residue, can anti-stick to the face on, residual copper when causing the etching, and product yield low scheduling problem.
The other nonionic surfactant contained in the first component of the developing additive can reduce the surface tension of water and improve the permeability of a developing solution, so that the developing solution is promoted to enter between patterns, photoresist in a line width and a pore diameter with smaller sizes is fully dissolved, and a developing part is fully dissolved; in addition, the non-ionic surfactant can be attached to the surface of the photoresist after development, the adhesive force between dry film residues and the board surface is reduced, and when the non-ionic surfactant is cleaned, the non-ionic surfactant is favorable for thoroughly removing reverse sticky substances of the photoresist with large molecular weight, avoids the residue of the reverse sticky substances, and further greatly improves the yield of chips and panels.
3. Bath foam problem: in the developing process, a spraying device is mainly adopted, and the developing solution can be continuously stirred to generate a plurality of foams. Too much foam can cause the poor development of the PCB, slow the later-stage production and affect the development quality. In addition, too much foam affects the cleaning of the board, and bath solution overflows with the foam. The polyether defoamer contained in the component A of the developing additive has good water solubility, has good defoaming effect under alkaline conditions, can effectively reduce foams generated by a developing neutralizer during spraying, prevents foam residues, does not need to additionally add a defoamer, and reduces cost. Most of the defoaming agents for the PCB sold in the market at present are modified silicone oil, and the products easily cause silicon spots on the board surface to remain, so that the performance of the subsequent products is changed. The defoaming agent selected in the product is a polyether defoaming agent, does not contain silicon, does not cause silicon residue on the board surface, and further reduces the product defects.
4. The waste liquid treatment problem is as follows: most of the existing developing additive products are photopolymerization inhibition products, which disperse and neutralize the electrical property of free radicals in a developing solution to inhibit the polymerization of a photoinitiator and a photopolymerization monomer, thereby achieving the effect of reducing the reverse sticking of a dry film. The photopolymerization inhibitor is added, so that a dry film is difficult to precipitate again during waste liquid treatment, and the problems of high COD (chemical oxygen demand) of waste water, increased environmental protection pressure and the like are caused. Particularly, the second component is added, so that the osmotic pressure on two sides of the surfactant membrane can be changed, the surfactant micelle is damaged, the dry membrane dissolved in the developing solution is precipitated again, the dry membrane can be removed by filtration, the COD in the waste liquid is reduced, and the wastewater treatment cost is reduced.
Detailed Description
The invention will be further described with reference to specific embodiments, and the advantages and features of the invention will become apparent as the description proceeds. These examples are illustrative only and do not limit the scope of the present invention in any way. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention, and that such changes and modifications may be made without departing from the spirit and scope of the invention.
The invention relates to a developer additive composition, comprising a first component and a second component, wherein the first component is used for solubilizing and reducing the surface tension of a developer solution; the second component is used for separating out a dry film dissolved in the developing solution; the first component comprises 35-50 parts of nonionic surfactant, 20-30 parts of defoaming agent and 120 parts of distilled water; the second component comprises 20-50 parts of organic solvent, 10-30 parts of organic compound and 160 parts of distilled water.
The nonionic surfactant comprises a solubilizing surfactant and a surfactant for reducing tension, wherein the solubilizing surfactant is a polyoxyethylene ether surfactant (such as fatty alcohol-polyoxyethylene ether, alkylphenol polyoxyethylene ether, tween and the like); the surfactant for reducing tension is carboxylic acid group type anionic surfactant (such as sodium alginate, carboxymethyl cellulose, acrylic acid copolymer, polyacrylamide and the like).
The defoaming agent is polyether defoaming agent (such as glycerol polyether fatty acid ester).
The organic solvent is one or a composition of more of dichloromethane, tetrahydrofuran, chlorobenzene, DMF, acetonitrile, 1, 3-dichloropropane, toluene, xylene, ethyl acetate or micromolecular alcohols according to any proportion.
The organic compound is a compound containing carboxyl, hydroxyl, aldehyde group, amino or nitro group.
Example 1:
a first component: the solubilizing surfactant is Tween 20, the Tween 20 accounts for 20 parts by weight, the surfactant for reducing tension is sodium alginate 30 parts by weight, and the defoaming agent is modified polyether self-defoaming surfactant Amulan CF-2020 parts by weight; distilled water 100 parts
A second component: 20 parts of methanol as an organic solvent, 10 parts of urea as an organic compound and 130 parts of distilled water.
Example 2:
a first component: 15 parts of nonylphenol polyoxyethylene ether serving as a solubilizing surfactant, 20 parts of polyacrylic acid serving as a surfactant for reducing tension, 30 parts of GP-type glycerol polyether serving as a defoaming agent and 120 parts of distilled water;
a second component: the organic solvent is 50 parts of tetrahydrofuran; the organic compound is 30 parts of N-methylacetamide; 150 parts of distilled water
Example 3:
a first component: the solubilizing surfactant is Tween 40, the Tween 40 accounts for 30 parts by weight, the surfactant for reducing tension is polyacrylamide 20 parts by weight, the defoaming agent 20 parts by weight and distilled water 100 parts by weight;
a second component:
30 parts of isohexane glycol as an organic solvent, 25 parts of GPE type polyoxyethylene (polyoxypropylene) ether as an organic compound and 160 parts of distilled water.
In the compatibility of the invention, the first component mainly comprises a nonionic surfactant with solubilization, a surfactant for reducing the surface tension of a developing solution and a polyether defoamer with excellent water solubility. The addition of the developer in the developing tank can effectively prolong the service life of the developer and reduce the defects caused by reverse adhesion of a dry film. The second component mainly comprises organic solvent with small molecular weight and strong polar organic compound. The dry film dissolved in the developing solution can be effectively separated out by adding the developing solution in the process of treating the developing waste liquid, so that the waste liquid treatment cost is reduced, and the environmental protection pressure is reduced.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (5)
1. A developer additive composition comprising a first component for solubilizing and reducing developer surface tension and a second component; the second component is used for separating out a dry film dissolved in the developing solution; the first component comprises 35-50 parts of nonionic surfactant, 20-30 parts of defoaming agent and 120 parts of distilled water; the second component comprises 20-50 parts of organic solvent, 10-30 parts of organic compound and 160 parts of distilled water.
2. A developer additive composition according to claim 1, wherein said nonionic surfactants comprise a solubilizing surfactant which is a polyoxyethylene ether surfactant and a tonicity-lowering surfactant; the surfactant for reducing tension is a carboxylic acid group type anionic surfactant.
3. A developer additive composition according to claim 1, wherein said defoamer is a polyether defoamer.
4. A developer additive composition according to claim 2 or 3, wherein said organic solvent is one or more of dichloromethane, tetrahydrofuran, chlorobenzene, DMF, acetonitrile, 1, 3-dichloropropane, toluene, xylene, ethyl acetate or small molecular alcohols in any proportion.
5. The developer additive composition of claim 4, wherein said organic compound is a compound containing a carboxyl, hydroxyl, aldehyde, amino, or nitro group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110858023.6A CN113534623A (en) | 2021-07-28 | 2021-07-28 | Developer additive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110858023.6A CN113534623A (en) | 2021-07-28 | 2021-07-28 | Developer additive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113534623A true CN113534623A (en) | 2021-10-22 |
Family
ID=78121248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110858023.6A Pending CN113534623A (en) | 2021-07-28 | 2021-07-28 | Developer additive composition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113534623A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103293881A (en) * | 2013-05-24 | 2013-09-11 | 京东方科技集团股份有限公司 | Developing solution component |
| CN106227003A (en) * | 2016-09-29 | 2016-12-14 | 杭州格林达化学有限公司 | A kind of developer composition and preparation method thereof |
| CN108345188A (en) * | 2017-12-29 | 2018-07-31 | 江苏乐彩印刷材料有限公司 | A kind of CTP plates developer solution |
-
2021
- 2021-07-28 CN CN202110858023.6A patent/CN113534623A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103293881A (en) * | 2013-05-24 | 2013-09-11 | 京东方科技集团股份有限公司 | Developing solution component |
| CN106227003A (en) * | 2016-09-29 | 2016-12-14 | 杭州格林达化学有限公司 | A kind of developer composition and preparation method thereof |
| CN108345188A (en) * | 2017-12-29 | 2018-07-31 | 江苏乐彩印刷材料有限公司 | A kind of CTP plates developer solution |
Non-Patent Citations (2)
| Title |
|---|
| 徐飞: "物理化学", vol. 2, 30 July 2020, 华中科技大学出版社, pages: 202 - 204 * |
| 李平忠、马瑞菊: "医用化学", vol. 1, 30 September 2020, 四川大学出版社, pages: 15 - 17 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102449131B (en) | Compositions and methods for removing organic substances | |
| US3796602A (en) | Process for stripping polymer masks from circuit boards | |
| CN101364056A (en) | Detergent for photo resist | |
| CN1441043A (en) | Composition for cleaning | |
| CN110597026B (en) | Dry film removing process for flexible circuit board | |
| CN106707702A (en) | Dry film removing solution for copper alloy indium tin oxide plated conductive film and preparation method thereof | |
| EP1904898A1 (en) | Method for fine line resist stripping | |
| CN101534608B (en) | Manufacturing method of flexible circuit board | |
| CN113534623A (en) | Developer additive composition | |
| EP0953879B1 (en) | Aqueous developing solutions for reduced developer residue | |
| CN109880699B (en) | Developing neutralizer | |
| JP5015553B2 (en) | Aqueous alkaline photoresist cleaning composition and method of using the composition | |
| JP5444172B2 (en) | Dry film resist thinning method | |
| CN114276712A (en) | Ink stripping liquid and stripping process of circuit board ink | |
| CN108377615A (en) | Copper face for PCB pattern transfer pre-treatment processing procedures is bonded solution | |
| US20040255974A1 (en) | Equipment cleaner | |
| JP3051611B2 (en) | Cleaning solution and cleaning method for alkaline developing device | |
| JP2012073424A (en) | Method for thinning dry film resist | |
| KR100357292B1 (en) | Developing solution for printed wiring board and manufacturing method of printed wiring board | |
| JP5498871B2 (en) | Method of thinning photocrosslinkable resin layer | |
| CN104635439A (en) | Photoresist stripping liquid and applications thereof | |
| JP2012104771A (en) | Thinning method of dry film resist | |
| Chu et al. | Development of new photoresist stripping agent | |
| CN115052430A (en) | Reworking method for poor dry film of PCB | |
| JP3186478U (en) | Dry film resist thinning equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |