CN113529040A - Carbon material surface treatment method - Google Patents
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- CN113529040A CN113529040A CN202010643204.2A CN202010643204A CN113529040A CN 113529040 A CN113529040 A CN 113529040A CN 202010643204 A CN202010643204 A CN 202010643204A CN 113529040 A CN113529040 A CN 113529040A
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- 239000003575 carbonaceous material Substances 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000004381 surface treatment Methods 0.000 title claims description 29
- 230000007704 transition Effects 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 238000001465 metallisation Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000011810 insulating material Substances 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 87
- 239000011241 protective layer Substances 0.000 claims description 12
- 238000005468 ion implantation Methods 0.000 claims description 10
- 238000001704 evaporation Methods 0.000 claims description 8
- 230000008020 evaporation Effects 0.000 claims description 8
- 229910052723 transition metal Inorganic materials 0.000 claims description 6
- 150000003624 transition metals Chemical class 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 abstract description 6
- 239000007769 metal material Substances 0.000 abstract description 5
- 238000005219 brazing Methods 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- 239000010439 graphite Substances 0.000 description 10
- 229910002804 graphite Inorganic materials 0.000 description 10
- 238000001755 magnetron sputter deposition Methods 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007123 defense Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0635—Carbides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a method for treating the surface of a carbon material, which comprises the following steps: s1: injecting carbide on the surface of the carbon material base material to form a basic transition layer on the surface of the carbon material base material; s2: injecting an insulating material into the surface of the basic transition layer to form an insulating layer on the surface of the basic transition layer; s3: attaching metal to the surface of the insulating layer to form a first metallization layer on the surface of the insulating layer; the method for treating the surface of the carbon material can form the first metallization layer on the surface of the carbon material so as to metalize the surface of the carbon material, so that the carbon material and the metal material can be connected in a brazing mode, and the operability and the application reliability of the carbon material are improved; the method for treating the surface of the carbon material can form an insulating layer on the surface of the carbon material, so that the surface of the carbon material is insulated, and the carbon material achieves the insulating property similar to that of a ceramic substrate.
Description
Technical Field
The invention relates to the field of surface treatment of base materials, in particular to a method for surface treatment of a carbon material.
Background
Carbon materials are based on carbon elements, such as: graphite products, and impregnated products using graphite as a base material. The carbon material has excellent mechanical property and heat conduction and heat dissipation performance, so that the carbon material is widely applied to national defense and military, chip bearing and packaging and other high-precision industries. For example: the three-level containing substrate of the nuclear power station lining is applied to the radiation level, the conduction level and the stack level, the outer layer coating of high-speed missiles and return satellites, the packaging base material of semiconductors, lasers and power chips and the like.
The heat conduction and radiation performance of the carbon material is particularly prominent, and can be clearly seen from the following table:
1. density: the same volume of material, graphite, is the most lightweight material.
2. Specific heat: the ability of graphite to absorb heat is on a medium to upper level for the same weight.
3. Coefficient of thermal conductivity: due to the lamellar structure of the graphite crystal and the anisotropy of the thermal conductivity coefficient, the actually measured thermal conductivity coefficient of the graphite block prepared by the powder laminating processing mode is about 260-300, which is close to that of the metal aluminum.
4. Thermal emissivity: the graphite has the most excellent performance, and under the precondition of the same volume or weight, the same external heat dissipation environment and the continuous injection of the same power (energy), the graphite can ensure that an object carried or coated by the graphite reaches thermal balance at the lowest temperature, thereby protecting the application reliability of the object. The excellent heat radiation performance enables the graphite to be applied to heat sink packaging materials of aerospace satellites, nuclear reactors, lasers and power chips and other high-precision national defense scenes.
At present, many technical and technological problems of the carbon material are not well solved, and the special properties of the carbon material also limit the application of the carbon material in specific scenes, such as: because the bonding force between molecular layers of the carbon material is poor, the carbon material can not be well infiltrated for a plurality of surface treatment materials, and the problems of surface coating and fixation are solved in the application scenes of a plurality of carbon materials by adopting a special glue bonding mode. The use of carbon materials in the power chip packaging industry is also limited due to their electrical conductivity. At present, many application scenes of the carbon material are temporarily replaced and used by special ceramics and various metal materials.
In summary, the problems to be solved by carbon materials at present are two points:
1. how to insulate the carbon material surface;
2. how to make the carbon material well wetted by the surface treatment material.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method for surface treatment of a carbon material.
The invention is realized by the following technical scheme:
the invention provides a method for treating the surface of a carbon material, which comprises the following steps:
s1: injecting carbide on the surface of the carbon material base material to form a basic transition layer on the surface of the carbon material base material;
s2: and injecting an insulating material into the surface of the basic transition layer to form an insulating layer on the surface of the basic transition layer.
Further, in step S1, a carbide is implanted into the surface of the carbon material base material by ion implantation.
Further, in step S1, the carbide is a carbide having a cubic molecular lattice form.
Further, in step S2, an insulating material is implanted in the base transition layer by means of ion implantation.
Further, the method for surface treatment of the carbon material further comprises the following steps:
s3: and attaching metal to the surface of the insulating layer to form a first metallization layer on the surface of the insulating layer.
Further, in step S3, a metal is deposited on the surface of the insulating layer by vapor deposition.
Further, the first metallization layer comprises a first transition layer, a first base layer and a first protective layer; the first transition layer is made of transition metal, the first substrate layer is made of high-conductivity metal, and the first protective layer is made of inert metal.
Further, the method for surface treatment of the carbon material further comprises the following steps:
s1-2: and attaching metal to the surface of the basic transition layer to form a second metallization layer on the surface of the basic transition layer.
Further, in step S1-2, a metal is attached to the surface of the base transition layer by evaporation.
Further, the second metallization layer comprises a second transition layer, a second base layer and a second protective layer; the second transition layer is made of transition metal, the second substrate layer is made of high-conductivity metal, and the second protective layer is made of inert metal.
The invention has the beneficial effects that:
1. the method for treating the surface of the carbon material can form the first metallization layer on the surface of the carbon material so as to metalize the surface of the carbon material, and further the carbon material and the metal material can be connected in a brazing mode, so that the operability and the operation reliability of the carbon material are improved.
2. The method for treating the surface of the carbon material can form an insulating layer on the surface of the carbon material, so that the surface of the carbon material is insulated, and the carbon material achieves the insulating property similar to that of a ceramic substrate.
Drawings
FIG. 1 is a schematic block diagram of a method for surface treatment of a carbon material according to the present invention;
FIG. 2 is a schematic structural view of the carbon material substrate after being treated through steps S1-S3;
FIG. 3 is a schematic structural view of the carbon material substrate after being processed through steps S1 and S2;
FIG. 4 is a schematic structural view of the carbon material substrate after being treated through steps S1 and S1-2.
Detailed Description
In order to more clearly and completely explain the technical scheme of the invention, the invention is further explained with reference to the attached drawings.
Referring to fig. 1 to 4, the present invention provides a method for surface treatment of a carbon material, which includes the following steps:
s1: injecting carbide on the surface of the carbon material base material to form a basic transition layer 10 on the surface of the carbon material base material;
s2: and injecting an insulating material into the surface of the basic transition layer 10, so that an insulating layer 20 is formed on the surface of the basic transition layer 10.
In the present embodiment, the method of surface treatment of the carbon material can form the insulating layer 20 on the surface of the carbon material, thereby insulating the surface of the carbon material and further achieving the insulating property of the carbon material similar to that of a ceramic substrate.
Further, in step S1, a carbide is implanted into the surface of the carbon material base material by ion implantation.
In the present embodiment, the ion implantation method includes: vacuum electron beam, high-temperature plasma diffusion, vacuum sputtering, high-temperature sintering and the like, wherein magnetron sputtering is one of vacuum sputtering, and magnetron sputtering is preferably used as an ion implantation process; the implantation (diffusion) thickness should be specifically tailored to the application scenario and the degree of weld robustness, and should generally be controlled within the range of 2-10 um.
Further, in step S1, the carbide is a carbide having a cubic molecular lattice form.
In the present embodiment, silicon carbide is preferable as the carbide.
Further, in step S2, an insulating material is implanted into the base transition layer 10 by ion implantation.
In the present embodiment, the ion implantation method includes: vacuum electron beam, high-temperature plasma diffusion, vacuum sputtering, high-temperature sintering and the like, wherein magnetron sputtering is one of vacuum sputtering, and magnetron sputtering is preferably used as an ion implantation process; the injection (diffusion) thickness should be specifically processed according to the application scenario and electrical insulation performance, and should be generally controlled within the range of 2-10 um; the insulating material includes all oxides having insulating properties and various mixed insulating materials, such as: silicon nitride, aluminum oxide, titanium oxide, other ceramic mixtures, and the like, with silicon dioxide being preferred.
Further, the method for surface treatment of the carbon material further comprises the following steps:
s3: and adhering metal on the surface of the insulating layer 20 to form a first metallization layer 30 on the surface of the insulating layer 20.
In the present embodiment, the method of surface treatment of the carbon material can form the insulating layer 20 on the surface of the carbon material to insulate the surface of the carbon material, thereby achieving an insulating property similar to that of a ceramic substrate, and can adhere a metal to the surface of the insulating layer 20 to form the first metalized layer 30 on the surface of the insulating layer 20 to metalize the surface of the carbon material, thereby enabling the carbon material and the metal material to be connected by soldering, thereby improving the operability and operational reliability of the carbon material, and finally enabling the carbon material to be well wetted by the surface treatment material.
Further, in step S3, a metal is deposited on the surface of the insulating layer 20 by vapor deposition.
In the present embodiment, the vapor deposition method includes: vacuum evaporation, vacuum electron beam, ion diffusion, vacuum sputtering, and the like, and magnetron sputtering is one of vacuum sputtering, and magnetron sputtering is preferable as an evaporation process.
In this embodiment, after step S2 is completed, a corresponding metallization pattern is formed by vapor deposition according to the form of the mask, and the thickness of the vapor deposition needs to be processed according to the current design of the first metallization layer 30, and is generally within the range of 2-10 um.
Further, the first metallization layer 30 includes a first transition layer 32, a first base layer 31, and a first protection layer 33; the first transition layer 32 is made of a transition metal, the first base layer 31 is made of a high-conductivity metal, and the first protective layer 33 is made of an inert metal.
In the present embodiment, the first transition layer 32 is made of chromium, nickel, or an alloy thereof, preferably chromium metal, and has a thickness of 6 to 10A (a is a unit angstrom); the first substrate layer 31 is made of silver, copper or alloy thereof, preferably copper metal, and has a thickness of 2-10 um; the first protective layer 33 is made of gold, silver, platinum or an alloy thereof, preferably gold metal, and has a thickness of 0.1-0.5 um.
Further, the method for surface treatment of the carbon material further comprises the following steps:
s1-2: and adhering metal to the surface of the base transition layer 10, so that a second metallization layer 40 is formed on the surface of the base transition layer 10.
In the present embodiment, the method for surface treatment of a carbon material can form the second metallization layer 40 on the surface of the carbon material to metallize the surface of the carbon material, and further, the carbon material and the metal material can be connected by brazing, so that the operability and operational reliability of the carbon material are improved, and finally, the carbon material can be well infiltrated by the surface treatment material.
In this embodiment, after step S1 is completed, a corresponding metallization pattern is formed by evaporation according to the form of the mask, and the thickness of the evaporation needs to be processed according to the current design of the second metallization layer 40, and is generally within the range of 2-10 um.
Further, in step S1-2, a metal is attached to the surface of the base transition layer 10 by evaporation.
In the present embodiment, the vapor deposition method includes: vacuum evaporation, vacuum electron beam, ion diffusion, vacuum sputtering, and the like, and magnetron sputtering is one of vacuum sputtering, and magnetron sputtering is preferable as an evaporation process.
Further, the second metallization layer 40 includes a second transition layer 42, a second base layer 41, and a second protection layer 43; the second transition layer 42 is made of a transition metal, the second substrate layer 41 is made of a high-conductivity metal, and the second protective layer 43 is made of an inert metal.
In this embodiment, the second transition layer 42 is made of chromium, nickel or an alloy thereof, preferably chromium metal, and has a thickness of 6 to 10A (a is angstrom); the second substrate layer 41 is made of silver, copper or alloy thereof, preferably copper metal, and has a thickness of 2-10 um; the second protective layer 43 is made of gold, silver, platinum or their alloys, preferably gold metal, and has a thickness of 0.1-0.5 um.
Of course, the present invention may have other embodiments, and based on the embodiments, those skilled in the art can obtain other embodiments without any creative effort, and all of them are within the protection scope of the present invention.
Claims (10)
1. A method for surface treatment of a carbon material, characterized in that the method for surface treatment of a carbon material comprises the steps of:
s1: injecting carbide on the surface of the carbon material base material to form a basic transition layer on the surface of the carbon material base material;
s2: and injecting an insulating material into the surface of the basic transition layer to form an insulating layer on the surface of the basic transition layer.
2. The method for surface treatment of a carbon material as claimed in claim 1, wherein in step S1, a carbide is implanted into the surface of the carbon material base material by ion implantation.
3. The method for surface treatment of a carbon material as claimed in claim 1, wherein the carbide is a carbide having a cubic molecular lattice form in step S1.
4. The method for surface treatment of a carbon material as claimed in claim 1, wherein in step S2, an insulating material is implanted in the base transition layer by means of ion implantation.
5. The method for surface treatment of a carbon material according to claim 1, further comprising the steps of:
s3: and attaching metal to the surface of the insulating layer to form a first metallization layer on the surface of the insulating layer.
6. The method for surface treatment of a carbon material as claimed in claim 5, wherein in step S3, a metal is deposited on the surface of the insulating layer by evaporation.
7. The method for surface treatment of a carbon material as claimed in claim 5, wherein the first metallization layer comprises a first transition layer, a first base layer and a first protective layer; the first transition layer is made of transition metal, the first substrate layer is made of high-conductivity metal, and the first protective layer is made of inert metal.
8. The method for surface treatment of a carbon material according to claim 1, further comprising the steps of:
s1-2: and attaching metal to the surface of the basic transition layer to form a second metallization layer on the surface of the basic transition layer.
9. The method for surface treatment of a carbon material as claimed in claim 8, wherein in step S1-2, a metal is attached to the surface of the base transition layer by evaporation.
10. The method for surface treatment of a carbon material according to claim 8, wherein the second metallization layer comprises a second transition layer, a second base layer, and a second protective layer; the second transition layer is made of transition metal, the second substrate layer is made of high-conductivity metal, and the second protective layer is made of inert metal.
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| JPH09201896A (en) * | 1996-01-30 | 1997-08-05 | Kawasaki Steel Corp | Heat resistant and oxidation resistant carbon material |
| CN102216241A (en) * | 2008-12-08 | 2011-10-12 | 东洋炭素株式会社 | Method for producing carbon material, and carbon material |
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| CN207678068U (en) * | 2017-12-25 | 2018-07-31 | 广东全宝科技股份有限公司 | A kind of ultra-high conducting heat type ceramic substrate |
| CN109348649A (en) * | 2018-09-20 | 2019-02-15 | 武汉光谷创元电子有限公司 | Heat sink composite material plating process and its product |
| CN110777335A (en) * | 2018-11-08 | 2020-02-11 | 纳峰真空镀膜（上海）有限公司 | Temperature resistant carbon coating |
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Application publication date: 20211022 |