CN113527737A - Preparation method of low-dielectric high-performance modified benzocyclobutene resin composite material - Google Patents
Preparation method of low-dielectric high-performance modified benzocyclobutene resin composite material Download PDFInfo
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- CN113527737A CN113527737A CN202110867684.5A CN202110867684A CN113527737A CN 113527737 A CN113527737 A CN 113527737A CN 202110867684 A CN202110867684 A CN 202110867684A CN 113527737 A CN113527737 A CN 113527737A
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- composite material
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- benzocyclobutene
- benzocyclobutene resin
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- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical class C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 239000000463 material Substances 0.000 title claims abstract description 32
- 239000000805 composite resin Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 55
- 229920005989 resin Polymers 0.000 claims abstract description 55
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 17
- 239000004744 fabric Substances 0.000 claims abstract description 15
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- 230000001680 brushing effect Effects 0.000 claims abstract description 11
- 238000005303 weighing Methods 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 9
- 239000000835 fiber Substances 0.000 claims abstract description 6
- 239000010453 quartz Substances 0.000 claims abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 5
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- 239000004693 Polybenzimidazole Substances 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000004643 cyanate ester Substances 0.000 claims description 3
- 239000012943 hotmelt Substances 0.000 claims description 3
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 claims description 3
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229920002480 polybenzimidazole Polymers 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 2
- 239000002131 composite material Substances 0.000 abstract description 10
- 238000005452 bending Methods 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000178 monomer Substances 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000009745 resin transfer moulding Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2371/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2465/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2471/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2471/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2471/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/10—Silicon-containing compounds
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention belongs to the technical field of aviation composite material manufacturing, and provides a preparation method of a low-dielectric high-performance modified benzocyclobutene resin composite material2Heating under the condition to carry out prepolymerization; then weighing a certain amount of one or two of thermoplastic resin or thermosetting resin, adding the weighed thermoplastic resin or thermosetting resin into the prepolymerized benzocyclobutene resin, and uniformly mixing; adding a certain amount of solvent, and uniformly brushing the solvent on the surface of the quartz fiber treated by the impregnating compound to obtain impregnated cloth; finally, the impregnated cloth is cut and then superposed to prepareAnd (3) forming a laminated plate, and curing to obtain the modified benzocyclobutene resin composite material. The invention solves the problem that benzocyclobutene is not suitable for directly preparing prepreg and composite material. The dielectric constant of the prepared modified benzocyclobutene resin composite material is 3.0-3.2, the tensile strength is 650-750 MPa, the bending strength is 380-550 MPa, and the water absorption rate is less than 0.2% within the range of 20-450 ℃.
Description
Technical Field
The invention belongs to the technical field of aviation composite material manufacturing, relates to a modified benzocyclobutene resin composite material, and particularly relates to a preparation method of a low-dielectric high-performance modified benzocyclobutene resin composite material.
Background
Benzocyclobutene resin (BCB resin) is a large class of multifunctional polymer materials, and has excellent electrical properties, low moisture absorption rate, high thermal stability and chemical stability. Benzocyclobutene resins exhibit very low dielectric constants and loss tangents over a wide range of frequencies and temperatures. The dielectric constant of benzocyclobutene resin with a general structure is in a range of 2.5-2.7, and the dielectric property of the resin is almost unchanged in a temperature range of 25-200 ℃. The hydrophobic molecular structure of benzocyclobutene resin makes it have low moisture absorption rate. Benzocyclobutene resin has high thermal stability, and the glass transition temperature of the benzocyclobutene resin is generally more than 350 ℃ and the thermal decomposition temperature of the benzocyclobutene resin is more than 400 ℃. The benzocyclobutene resin can resist corrosive atmosphere such as acid and alkali, has good solvent resistance and low swelling rate in organic solvent. Based on the excellent comprehensive performance of the material, the material can be used in the field of wave-transparent composite materials.
The carbon fiber composite material with excellent performance is prepared by adopting BCB monomers abroad through resin transfer molding, a series of BCB unit monomers containing ether ketone structures are synthesized by the American DOW company, and the prepared composite material has excellent comprehensive performance due to the ether ketone structure, and has potential application value in the fields of high-speed passenger planes, high-speed trains and the like. The resin-based carbon fiber composite material prepared by the monomer through an RTM process has excellent comprehensive performance, is aged for 500 hours at 203 ℃ in the air, has no change in bending strength, bending modulus and weight, and is listed as one of candidate materials for high-speed airliners by Boeing aircraft company.
However, benzocyclobutene resins are not suitable for the direct preparation of prepregs and composites.
Disclosure of Invention
In order to solve the problems, the invention provides a preparation method of a low-dielectric high-performance modified benzocyclobutene resin composite material.
The technical scheme of the invention is as follows:
a preparation method of a low-dielectric high-performance modified benzocyclobutene resin composite material comprises the following steps:
step one, weighing a certain amount of benzocyclobutene resin, and introducing N2Heating under the condition to carry out prepolymerization;
weighing a certain amount of one or two of thermoplastic resin or thermosetting resin, adding the weighed thermoplastic resin or thermosetting resin into the prepolymerized benzocyclobutene resin, and uniformly mixing;
step three, adding a certain amount of solvent into the uniformly mixed resin obtained in the step two, and uniformly mixing to facilitate brushing;
step four, uniformly brushing the resin solution obtained in the step three on the surface of the quartz fiber treated by the impregnating compound to obtain impregnated cloth;
and step five, cutting the impregnated cloth obtained in the step four, superposing the cut impregnated cloth to prepare a laminated plate, and curing the laminated plate to obtain the modified benzocyclobutene resin composite material.
Further, in the first step, the mixture is heated to 175-185 ℃ and prepolymerized for 3 hours.
Further, the thermoplastic resin in the second step is one or more of polysulfone, polyethersulfone, polyphenylene oxide, polyetheretherketone, polyimide and the like.
Further, the thermosetting resin in the second step is one or more of cyanate ester, thermosetting polyphenylene oxide, benzoxazine, polybenzimidazole resin and the like.
Furthermore, the mass fraction of the benzocyclobutene resin in the first step is 100 parts, and the mass fraction of one or two of the thermoplastic resin or the thermosetting resin in the second step is 0.5-30 parts.
Further, the mixing mode in the second step includes mechanical mixing and hot melt mixing.
Further, the solvent in the third step is any one of toluene, xylene and mesitylene.
Furthermore, the impregnating compound in the fourth step is an impregnating compound containing a vinyl group.
Furthermore, the curing mode in the fifth step is that the curing time is 3-10 h under the environment that the temperature is 180-230 ℃ and the pressure is 0.3-0.5 MPa.
The invention has the advantages that:
1. the invention solves the problem that benzocyclobutene is not suitable for directly preparing prepreg and composite material. The dielectric constant of the prepared modified benzocyclobutene resin composite material is 3.0-3.2, the tensile strength is 650-750 MPa, the bending strength is 380-550 MPa, and the water absorption rate is less than 0.2% within the range of 20-450 ℃.
2. The modified benzocyclobutene resin composite material prepared by the invention can be used for composite material parts with higher requirements on wave transmission performance.
Detailed Description
This section is an example of the present invention and is provided to explain and illustrate the technical solutions of the present invention.
A preparation method of a low-dielectric high-performance modified benzocyclobutene resin composite material comprises the following steps:
step one, weighing a certain amount of benzocyclobutene resin, and introducing N2Heating under the condition to carry out prepolymerization;
weighing a certain amount of one or two of thermoplastic resin or thermosetting resin, adding the weighed thermoplastic resin or thermosetting resin into the prepolymerized benzocyclobutene resin, and uniformly mixing;
step three, adding a certain amount of solvent into the uniformly mixed resin obtained in the step two, and uniformly mixing to facilitate brushing;
step four, uniformly brushing the resin solution obtained in the step three on the surface of the quartz fiber treated by the impregnating compound to obtain impregnated cloth;
and step five, cutting the impregnated cloth obtained in the step four, superposing the cut impregnated cloth to prepare a laminated plate, and curing the laminated plate to obtain the modified benzocyclobutene resin composite material.
In the first step, heating to 175-185 ℃, and carrying out prepolymerization for 3 h.
The thermoplastic resin in the second step is one or more of polysulfone, polyethersulfone, polyphenylether, polyetheretherketone, polyimide and other resins.
The thermosetting resin in the second step is one or more of cyanate ester, thermosetting polyphenyl ether, benzoxazine, polybenzimidazole resin and the like.
The mass fraction of the benzocyclobutene resin in the first step is 100 parts, and the mass fraction of one or two of the thermoplastic resin or the thermosetting resin in the second step is 0.5-30 parts.
The mixing mode in the second step comprises mechanical mixing and hot melt mixing.
The solvent in the third step is any one of toluene, xylene and mesitylene.
The impregnating compound in the fourth step is an impregnating compound containing vinyl groups.
The curing mode in the fifth step is that the curing time is 3-10 h under the environment that the temperature is 180-230 ℃ and the pressure is 0.3-0.5 MPa.
Two practical embodiments of the invention are described below.
Example 1:
a preparation method of a low-dielectric high-performance modified benzocyclobutene resin composite material is realized by the following steps:
step one, weighing a certain amount of benzocyclobutene resin in N2And carrying out prepolymerization under the condition.
And step two, weighing 0.5-30 parts of polyphenyl ether, adding the polyphenyl ether into the prepolymerized benzocyclobutene resin, and uniformly mixing.
And step three, adding a certain amount of toluene into the uniformly mixed resin obtained in the step two, and uniformly mixing so as to facilitate brushing.
And step four, uniformly brushing the resin solution obtained in the step three on the surface of the quartz fiber treated by the vinyl impregnating compound to prepare the impregnated cloth.
And step five, cutting the dipped fabric obtained in the step four to prepare a laminated board, wherein the curing temperature is 180-230 ℃, the curing time is 3-10 h, and the curing pressure is 0.3-0.5 MPa. The dielectric constant of the modified benzocyclobutene resin composite material obtained after curing is 3.2, and the bending strength is 382 MPa.
Example 2:
a preparation method of a low-dielectric high-performance modified benzocyclobutene resin composite material is realized by the following steps:
step one, weighing a certain amount of benzocyclobutene resin in N2And carrying out prepolymerization under the condition.
And step two, weighing 0.5-30 parts of cyanate, adding the cyanate into the prepolymerized benzocyclobutene resin, and uniformly mixing.
And step three, adding a certain amount of toluene into the uniformly mixed resin obtained in the step two, and uniformly mixing so as to facilitate brushing.
And step four, uniformly brushing the resin solution obtained in the step three on the surface of the quartz fiber treated by the vinyl impregnating compound to prepare the impregnated cloth.
And step five, cutting the dipped fabric obtained in the step four to prepare a laminated board, wherein the curing temperature is 180-230 ℃, the curing time is 3-10 h, and the curing pressure is 0.3-0.5 MPa. The dielectric constant of the modified benzocyclobutene resin composite material obtained after curing is 3.2, and the tensile strength is 750 MPa.
Claims (9)
1. A preparation method of a low-dielectric high-performance modified benzocyclobutene resin composite material is characterized by comprising the following steps:
step one, weighing a certain amount of benzocyclobutene resin, and introducing N2Heating under the condition to carry out prepolymerization;
weighing a certain amount of one or two of thermoplastic resin or thermosetting resin, adding the weighed thermoplastic resin or thermosetting resin into the prepolymerized benzocyclobutene resin, and uniformly mixing;
step three, adding a certain amount of solvent into the uniformly mixed resin obtained in the step two, and uniformly mixing to facilitate brushing;
step four, uniformly brushing the resin solution obtained in the step three on the surface of the quartz fiber treated by the impregnating compound to obtain impregnated cloth;
and step five, cutting the impregnated cloth obtained in the step four, superposing the cut impregnated cloth to prepare a laminated plate, and curing the laminated plate to obtain the modified benzocyclobutene resin composite material.
2. The preparation method of the low-dielectric high-performance modified benzocyclobutene resin composite material according to claim 1, characterized in that in the first step, the material is heated to 175-185 ℃ and prepolymerized for 3 h.
3. The preparation method of the low-dielectric high-performance modified benzocyclobutene resin composite material according to claim 1, characterized in that the thermoplastic resin in the second step is one or more of polysulfone, polyethersulfone, polyphenylether, polyetheretherketone, polyimide and the like.
4. The method for preparing the low-dielectric high-performance modified benzocyclobutene resin composite material according to claim 1, characterized in that the thermosetting resin in the second step is one or more of cyanate ester, thermosetting polyphenylene oxide, benzoxazine, polybenzimidazole resin and the like.
5. The preparation method of the low-dielectric high-performance modified benzocyclobutene resin composite material according to claim 1, characterized in that the mass fraction of the benzocyclobutene resin in the first step is 100 parts, and the mass fraction of one or both of the thermoplastic resin and the thermosetting resin in the second step is 0.5-30 parts.
6. The preparation method of the low-dielectric high-performance modified benzocyclobutene resin composite material according to claim 1, characterized in that the mixing mode in the second step comprises mechanical mixing and hot melt mixing.
7. The preparation method of the low-dielectric high-performance modified benzocyclobutene resin composite material according to claim 1, characterized in that the solvent in the third step is any one of toluene, xylene and mesitylene.
8. The method for preparing the low-dielectric high-performance modified benzocyclobutene resin composite material according to claim 1, characterized in that the impregnating compound in the step four is an impregnating compound containing a vinyl group.
9. The preparation method of the low-dielectric high-performance modified benzocyclobutene resin composite material according to claim 1, characterized in that the curing mode in the fifth step is that the curing time is 3-10 h under the environment that the temperature is 180-230 ℃ and the pressure is 0.3-0.5 MPa.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110867684.5A CN113527737A (en) | 2021-07-30 | 2021-07-30 | Preparation method of low-dielectric high-performance modified benzocyclobutene resin composite material |
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| CN202110867684.5A CN113527737A (en) | 2021-07-30 | 2021-07-30 | Preparation method of low-dielectric high-performance modified benzocyclobutene resin composite material |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010275527A (en) * | 2009-04-28 | 2010-12-09 | Hitachi Chem Co Ltd | Resin composition, resin varnish, composite material and method for producing the same, prepreg and resin film |
| CN104513456A (en) * | 2013-09-27 | 2015-04-15 | 深圳光启创新技术有限公司 | Prepreg, forming method thereof and wave-transmitting material |
| CN111647247A (en) * | 2020-05-29 | 2020-09-11 | 上海材料研究所 | Resin composition for high-frequency high-speed copper-clad plate and application thereof |
| CN112029241A (en) * | 2020-08-26 | 2020-12-04 | 中国航空工业集团公司济南特种结构研究所 | Preparation method of low-dielectric high-temperature-resistant benzocyclobutene resin composite material |
-
2021
- 2021-07-30 CN CN202110867684.5A patent/CN113527737A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010275527A (en) * | 2009-04-28 | 2010-12-09 | Hitachi Chem Co Ltd | Resin composition, resin varnish, composite material and method for producing the same, prepreg and resin film |
| CN104513456A (en) * | 2013-09-27 | 2015-04-15 | 深圳光启创新技术有限公司 | Prepreg, forming method thereof and wave-transmitting material |
| CN111647247A (en) * | 2020-05-29 | 2020-09-11 | 上海材料研究所 | Resin composition for high-frequency high-speed copper-clad plate and application thereof |
| CN112029241A (en) * | 2020-08-26 | 2020-12-04 | 中国航空工业集团公司济南特种结构研究所 | Preparation method of low-dielectric high-temperature-resistant benzocyclobutene resin composite material |
Non-Patent Citations (1)
| Title |
|---|
| 祖群等, 国防工业出版社 * |
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Application publication date: 20211022 |