CN118085500A - Epoxy resin mixture for prepreg and preparation method and application thereof - Google Patents
Epoxy resin mixture for prepreg and preparation method and application thereof Download PDFInfo
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- CN118085500A CN118085500A CN202410212063.7A CN202410212063A CN118085500A CN 118085500 A CN118085500 A CN 118085500A CN 202410212063 A CN202410212063 A CN 202410212063A CN 118085500 A CN118085500 A CN 118085500A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 136
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 136
- 239000000203 mixture Substances 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 52
- 239000012745 toughening agent Substances 0.000 claims abstract description 44
- 230000008569 process Effects 0.000 claims abstract description 43
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 37
- 239000007822 coupling agent Substances 0.000 claims abstract description 37
- 239000000945 filler Substances 0.000 claims abstract description 34
- 239000007788 liquid Substances 0.000 claims abstract description 34
- 239000007787 solid Substances 0.000 claims abstract description 25
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000002994 raw material Substances 0.000 claims abstract description 13
- 239000000126 substance Substances 0.000 claims abstract description 12
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 8
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 38
- 238000002156 mixing Methods 0.000 claims description 29
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 26
- 239000004917 carbon fiber Substances 0.000 claims description 26
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 12
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 10
- 238000004321 preservation Methods 0.000 claims description 10
- 229920000459 Nitrile rubber Polymers 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000805 composite resin Substances 0.000 claims description 6
- 229920002292 Nylon 6 Polymers 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- 125000003636 chemical group Chemical group 0.000 claims description 4
- 239000010425 asbestos Substances 0.000 claims description 3
- 229920000747 poly(lactic acid) Polymers 0.000 claims description 3
- 239000004626 polylactic acid Substances 0.000 claims description 3
- 229910052895 riebeckite Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 239000011863 silicon-based powder Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 25
- 239000011148 porous material Substances 0.000 abstract description 13
- 230000007547 defect Effects 0.000 abstract description 12
- 238000004132 cross linking Methods 0.000 abstract description 6
- 125000000524 functional group Chemical group 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 23
- 239000004744 fabric Substances 0.000 description 17
- 238000011056 performance test Methods 0.000 description 16
- 238000007430 reference method Methods 0.000 description 13
- 238000007906 compression Methods 0.000 description 12
- 230000006835 compression Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- -1 phenolic aldehyde Chemical class 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2413/00—Characterised by the use of rubbers containing carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2463/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2467/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2467/04—Polyesters derived from hydroxy carboxylic acids, e.g. lactones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2477/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2477/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention discloses an epoxy resin mixture for prepreg, a preparation method and application thereof, wherein the epoxy resin mixture for prepreg comprises the following raw materials in parts by weight: 20-40 parts of liquid multifunctional epoxy resin, 10-20 parts of solid o-cresol formaldehyde epoxy resin, 10-20 parts of toughening agent, 5-10 parts of filler, 1-3 parts of coupling agent and 10-20 parts of curing agent. The multifunctional epoxy resin contains a plurality of epoxy groups, and can form a denser crosslinking structure, so that the strength, modulus and temperature resistance of the epoxy resin are improved, other contained functional groups can react with active groups of other substances in the mixture to reach more crosslinking density, form a stable and uniform chemical bonding structure with other effective components, fully exert the effects of various reactive auxiliary agents, and can be used for preparing prepregs, a non-autoclave curing process can be adopted, the thickness of a finished product exceeds 5mm, the section effect is good, and the prepreg has no defects such as pore bubbles.
Description
Technical Field
The invention relates to the field of epoxy resin, in particular to an epoxy resin mixture for prepreg, a preparation method and application thereof.
Background
At present, high-performance epoxy resin-based carbon fiber composite materials are rapidly developed, wherein a plurality of high-performance parts need to be pre-impregnated, along with international competition of China aerospace industry equipment outlets, manufacturing cost needs to be reduced, in order to reduce molding and curing cost, OOA (non autoclave curing) technology is increasingly developed, the high-performance epoxy resin-based carbon fiber composite materials are gradually applied to aerospace and national defense fields from common civil fields, the thickness of the general parts of the existing pre-impregnated materials after layering cannot exceed 5mm, and otherwise, more interlayer defects can occur. In order to solve the problem of forming and manufacturing a part of thick pieces, an autoclave process with high cost has to be used, and the cost of mass production is increased.
The China patent CN115975346B discloses an epoxy resin premix for OOA curing prepreg and a preparation method thereof, and the invention adopts a non-autoclave process (OOA) and the thickness of a finished product is not more than 5mm.
The Chinese patent with publication number CN116063819B discloses a medium-temperature curing epoxy resin premix for unmanned aerial vehicle structural members and a preparation method, wherein the epoxy resin premix comprises the following materials in parts by weight: 20-40 parts of multifunctional epoxy resin, 10-20 parts of solid phenolic epoxy resin, 10-20 parts of toughening agent and 5-10 parts of curing agent. The multifunctional epoxy resin is selected from one of MF-2133, MF-4230 or S-610. The solid phenolic epoxy resin is selected from one or more of NPCN-703, NPCN-704 or ECN-1273. The material obtained by the interaction reaction of the multifunctional epoxy resin, the solid phenolic epoxy resin and the curing agent dicyandiamide has high temperature resistance, and the glass transition temperature of the cured material can reach more than 200 ℃. The end groups of the toughening agent and the epoxy resin are subjected to gradual mutual reaction grafting, so that the toughening agent and the epoxy resin are uniformly distributed after being combined, and the problems of aggregation, sedimentation and the like of the toughening agent are avoided. The grafting process has a large number of macromolecular structures, so that the viscosity of the premix is gradually increased, and the optimal viscosity for prepreg production is achieved. However, the patent is applied to the OOA process after prepreg layup, and the thickness of the part cannot exceed 5mm. The patent uses an autoclave process with an applied air pressure, and the formulation of the patent is not suitable for non-autoclave processes, which if used, may result in a prepreg with interlaminar defects.
Disclosure of Invention
The invention aims to solve the technical problems of the prior art, and provides an epoxy resin mixture for prepreg, a preparation method and application thereof, and the prepared epoxy resin mixture is further used for preparing prepreg, wherein the thickness of a finished product exceeds 5mm and can reach 10-30mm by adopting a non-autoclave curing process, and the defects of good section effect, no pore bubbles and the like are overcome.
In order to solve the technical problems, the invention adopts the following technical scheme: an epoxy resin mixture for prepreg comprises the following raw materials in parts by weight:
20-40 parts of liquid multifunctional epoxy resin, 10-20 parts of solid o-cresol formaldehyde epoxy resin, 10-20 parts of toughening agent, 5-10 parts of filler, 1-3 parts of coupling agent and 10-20 parts of curing agent;
the number of epoxy groups in the liquid multifunctional epoxy resin is 3-4;
Preferably, the epoxy resin mixture for the prepreg comprises the following raw materials in parts by weight: 20-30 parts of liquid multifunctional epoxy resin, 10-15 parts of solid o-cresol formaldehyde epoxy resin, 15-20 parts of toughening agent, 7.5-10 parts of filler, 1-3 parts of coupling agent and 15-20 parts of curing agent.
The liquid multifunctional epoxy resin comprises a plurality of epoxy groups, and the epoxy resin mixture is prepared by interaction with solid o-cresol formaldehyde epoxy resin, a toughening agent, a filler, a coupling agent and a curing agent, and can be used for preparing a carbon fiber resin-based composite material by adopting a non-autoclave curing process, wherein the thickness of the prepreg exceeds 5mm, and the prepreg has a good section effect and has no defects such as pore bubbles.
The o-cresol formaldehyde epoxy resin has moderate modulus, and is suitable for being mixed with liquid multifunctional epoxy resin.
In a preferred embodiment of the present invention, the liquid multifunctional epoxy resin needs to have a viscosity of less than 3000cps at 25 ℃.
In a preferred embodiment of the present invention, the filler includes one or more of fine silica powder, alumina powder and asbestos powder.
In a preferred embodiment of the present invention, the coupling agent comprises a first group and a second group;
The first group reacts with a chemical group on the surface of the inorganic molecule, and the second group reacts with the organic molecule;
preferably, the coupling agent comprises one or two of Michaelquest A-1110 and Pick chemical BYK-C8001.
In a preferred embodiment of the present invention, the toughening agent includes a carboxyl-terminated component therein;
Preferably, the toughening agent comprises one or more of carboxyl terminated nitrile rubber, nylon 6 powder and polylactic acid.
In a preferred embodiment of the present invention, the curing agent comprises amine groups;
preferably, the curing agent comprises one or two of 4,4-DDS and 3, 3-DDS.
In a preferred embodiment of the present invention, the solid orthocresol formaldehyde epoxy is composed of one or two of south Asian electrons NPCN-701, NPCN-703, NPCN-704;
the liquid multifunctional epoxy resin consists of one or more of Henschel MY0510, mitsubishi chemical tetra D-X and Hubei Zhenzhengfeng MF-4230.
The invention also discloses a preparation method of the epoxy resin mixture for the prepreg, which comprises the following steps:
s1, weighing: preparing liquid multifunctional epoxy resin, solid o-cresol formaldehyde epoxy resin, a toughening agent, a filler, a coupling agent and a curing agent according to parts by mass;
S2, preparing a resin mixture: heating the liquid multifunctional epoxy resin, continuously adding the solid o-cresol formaldehyde epoxy resin, preserving heat, fully mixing and dissolving to obtain an epoxy resin solution;
S3, adding and mixing various auxiliary agents: and (2) adding a toughening agent into the epoxy resin solution in the step (S2), heating and mixing to completely dissolve the toughening agent, cooling, adding a filler, a coupling agent and a curing agent, and fully mixing and discharging.
In a preferred embodiment of the invention, the S2 heating temperature is 90-120 ℃;
the heat preservation time in S2 is 30-60min;
S3, heating to 90-120 ℃, and heating and mixing for 30-60min in S3;
the temperature after the temperature is reduced in the step S3 is 60-80 ℃;
and S3, mixing for 15-30min after cooling.
The invention also discloses an application of the epoxy resin mixture for the prepreg or the epoxy resin mixture prepared according to the preparation method in the carbon fiber resin-based composite material, wherein the carbon fiber resin-based composite material adopts a non-autoclave curing process, the carbon fiber resin-based composite material is prepared from the prepreg, and the thickness of the prepreg exceeds 5mm.
The Chinese patent with publication number CN116063819B adopts an autoclave process, the largest difference of the non-autoclave process is that no filler, coupling agent and other materials which can fill interlayer defects in the OOA process exist in the patent unlike the autoclave with external air pressure, and if the autoclave process in the patent is changed to the OOA process, the prepreg can have interlayer pores.
The multilayer laminated board under the condition of no external pressurizing force generally has the defects that the more the number of layers is in the curing process, the more easily the problem that gas is difficult to discharge in the curing process or pores are generated under the action of internal stress in the reaction process, and the laminated board is caused.
The invention achieves the effect of preparing thick parts under the OOA technology through the interaction of high crosslinking, uniform distribution of each component, pore filling and the like in the plate curing process by selecting high-functionality resin (polyfunctional epoxy resin, o-cresol formaldehyde epoxy resin), reactive toughening agent, filler, coupling agent and the like.
Compared with the prior art, the invention has the following beneficial effects:
In the invention, the multifunctional epoxy resin contains a plurality of epoxy groups, and can react with a curing agent to form a denser crosslinking structure, so that the strength, modulus and temperature resistance of the epoxy resin are improved, and simultaneously, more epoxy groups can also react with other active groups of substances in the mixture (such as carboxyl end groups in a toughening agent, nucleophilic group amino groups in a coupling agent and the like), so that more crosslinking density is achieved, a stable and uniform chemical bonding structure is formed with other effective components, and the effects of various reactive auxiliary agents are fully exerted. The epoxy resin with 3-4 functional groups selected in the invention is resin with the viscosity lower than 3000cps at the room temperature of 25 ℃, is favorable for the viscosity adjustment of the whole system, is not too high, and is more favorable for the production of prepregs when being matched with the viscosity adjusted by other resins.
The o-cresol formaldehyde epoxy resin is beneficial to improving the crosslinking density of the system, improving the temperature resistance, the strength and the corrosion resistance, and simultaneously, the viscosity of the whole mixture can be adjusted by matching the solid phenolic aldehyde and the liquid multifunctional epoxy resin, so that the viscosity suitable for prepreg production is achieved (for example, the temperature of a coating film of a dry prepreg is usually between 60 and 90 ℃ and the viscosity of the coating film is usually between 20000 and 50000 cps).
The filler can fill the defect that the internal bubbles of the epoxy resin prepreg are difficult to discharge in the curing process of the thicker piece through intermolecular force and smaller surface tension diffusion of the filler and the epoxy resin, and simultaneously can improve the wear resistance and the thermal stability of the premix and further enhance the shock resistance; the coupling agent is a substance with an amphoteric structure, one part of groups in molecules of the substance can react with chemical groups on the inorganic surface to form chemical bonding, and the other part of groups have the property of organophilic substances and can chemically react with organic molecules or generate stronger intermolecular action, so that two materials with distinct properties are firmly combined, the dispersion state of inorganic filler in the epoxy resin mixture matrix is more uniform, and the basic performance of the filler is fully exerted; amine groups in the curing agent react with epoxy groups in the epoxy resin to form a stable structure of a three-dimensional network, so that the epoxy resin is cured into a hard solid, and the DDS curing agent used in the invention can improve the strength, rigidity and corrosion resistance of the epoxy resin cured material; the toughening agent can improve the impact resistance of a resin system, and the toughening agent contains carboxyl end components and can be chemically bonded with epoxy resin to form a stable cross-linked structure so as to fully play a role in toughening. The toughening agent without active groups cannot be well combined with epoxy groups, so that the toughening effect is affected, and the situation of uneven dispersion can be generated in the mixing process.
Drawings
FIG. 1 is a schematic diagram of the epoxy resin mixture of example 1.
FIG. 2 is a 10mm laminate cut surface made from a prepreg made from the epoxy resin of example 1 and a HF20 grade 220gsm carbon fiber twill fabric.
FIG. 3 is a cut surface of a 30mm laminate made from a prepreg made from the epoxy resin of example 1 and a HF20 grade 220gsm carbon fiber twill fabric.
FIG. 4 is a 10mm laminate cut surface made from a prepreg made from the epoxy resin of example 2 and a HF20 grade 220gsm carbon fiber twill fabric.
FIG. 5 is a cut surface of a 10mm laminate made from a prepreg made from the epoxy resin of example 3 and a HF20 grade 220gsm carbon fiber twill fabric.
FIG. 6 is a cut surface of a 10mm laminate made from a prepreg made from comparative example 1 epoxy resin and HF20 grade 220gsm carbon fiber twill fabric.
FIG. 7 is a cut surface of a 10mm laminate made from a prepreg made from comparative example 2 epoxy resin and HF20 grade 220gsm carbon fiber twill fabric.
FIG. 8 is a cut surface of a 10mm laminate made from a prepreg made from comparative example 3 epoxy resin and HF20 grade 220gsm carbon fiber twill fabric.
FIG. 9 is a cut surface of a 10mm laminate made from a prepreg made from comparative example 4 epoxy resin and HF20 grade 220gsm carbon fiber twill fabric.
FIG. 10 is a cut surface of a 10mm laminate made from a prepreg made from comparative example 5 epoxy resin and HF20 grade 220gsm carbon fiber twill fabric.
Detailed Description
Example 1
The invention relates to an epoxy resin mixture for prepreg, which consists of the following raw materials in parts by weight:
liquid multifunctional epoxy resin: MY0510:20 parts of
O-cresol formaldehyde epoxy resin: NPCN-701:10 parts of
Toughening agent: carboxyl terminated nitrile rubber: 10 parts of
Filler: silicon micropowder: 5 parts of
Coupling agent: silquest A-1110:1 part of
Curing agent: 4,4-DDS:10 parts of
Adding the weighed liquid multifunctional epoxy resin into a dispersing machine, heating to 90 ℃, adding solid o-cresol formaldehyde epoxy resin, preserving heat for 30min, fully dissolving, adding a toughening agent, preserving heat and mixing for 30min, cooling to 60 ℃, adding a filling agent, a coupling agent and a curing agent, maintaining the temperature of 60 ℃ for dispersing and mixing for 15min, and discharging.
The main performance test of the resin system is as follows:
TABLE 1 Performance test of the resin prepared in example 1
| Test item | Test condition/reference method | Test results |
| Viscosity (75 ℃ C.) | ASTM D4287 | 26800cps |
| Gel time (150 ℃ C.) | ASTM D2471 | 48min |
| Tg (DSC method) | GB/T 19466.2 | 215℃ |
The resin is made into prepreg with 43% resin content by using Hengshen HF 20-grade 220gsm carbon fiber twill fabric, and the main mechanical properties of the laminated board are shown in table 2 (the layering mode of the test laminated board in the examples and the comparative examples is shown in the attached table 15) by adopting an OOA curing process (heat preservation for 3 hours at 180 ℃):
TABLE 2 mechanical Properties of the laminates obtained in example 1
| Test item | Test condition/reference method | OOA process test results |
| Tensile strength at 0 degree | ASTM D3039 | 695Mpa |
| Tensile modulus at 0 DEG | ASTM D3039 | 68Gpa |
| Tensile strength at 90 DEG | ASTM D3039 | 669Mpa |
| Tensile modulus at 90 DEG | ASTM D3039 | 66Gpa |
| Compression strength at 0 degree | ASTM D6641 | 769Mpa |
| Compression modulus at 0 DEG | ASTM D6641 | 59Gpa |
| Flexural Strength | ASTM D790 | 880Mpa |
| Flexural modulus | ASTM D790 | 54Gpa |
| Short beam shear Strength | ASTM D2344 | 90Mpa |
| In-plane shear Strength | ASTM D3518 | 117Mpa |
| In-plane shear modulus | ASTM D3518 | 90Gpa |
The prepreg is solidified into a 10mm thick-layer laminated board according to an OOA process, the section effect is shown in figure 2, and the defects of good section effect, no pore bubbles and the like are overcome. And then the prepreg is cured according to an OOA process to prepare a 30mm laminated board, the effect of the section is shown in figure 3, and the effect is still good.
Example 2
The invention relates to an epoxy resin mixture for prepreg, which consists of the following raw materials in parts by weight:
Liquid multifunctional epoxy resin: tetra D-X:40 parts of
O-cresol formaldehyde epoxy resin: NPCN-703:20 parts of
Toughening agent: nylon 6 powder: 20 parts of
Filler: alumina powder: 10 parts of
Coupling agent: BYK-C8001:3 parts of
Curing agent: 3,3-DDS:20 parts of
Adding the weighed liquid multifunctional epoxy resin into a dispersing machine, heating to 120 ℃, adding solid o-cresol formaldehyde epoxy resin, preserving heat for 60min, fully dissolving, adding a toughening agent, preserving heat and mixing for 60min, cooling to 80 ℃, adding a filler, a coupling agent and a curing agent, maintaining the temperature of 80 ℃ and dispersing and mixing for 30min, and discharging.
The main performance test of the resin system is as follows:
TABLE 3 Performance test of the resin prepared in example 2
| Test item | Test condition/reference method | Test results |
| Viscosity (75 ℃ C.) | ASTM D4287 | 30800cps |
| Gel time (150 ℃ C.) | ASTM D2471 | 46min |
| Tg (DSC method) | GB/T 19466.2 | 212℃ |
The resin is prepared into prepreg with 43% resin content by using constant HF 20-grade 220gsm carbon fiber twill fabric, and the main mechanical properties of the laminated board are as follows by adopting an OOA curing process (heat preservation for 3 hours at 180 ℃):
TABLE 4 mechanical Properties of the laminates obtained in example 2
| Test item | Test condition/reference method | OOA process test results |
| Tensile strength at 0 degree | ASTM D3039 | 692Mpa |
| Tensile modulus at 0 DEG | ASTM D3039 | 69Gpa |
| Tensile strength at 90 DEG | ASTM D3039 | 674Mpa |
| Tensile modulus at 90 DEG | ASTM D3039 | 68Gpa |
| Compression strength at 0 degree | ASTM D6641 | 760Mpa |
| Compression modulus at 0 DEG | ASTM D6641 | 62Gpa |
| Flexural Strength | ASTM D790 | 899Mpa |
| Flexural modulus | ASTM D790 | 57Gpa |
| Short beam shear Strength | ASTM D2344 | 92Mpa |
| In-plane shear Strength | ASTM D3518 | 110Mpa |
| In-plane shear modulus | ASTM D3518 | 88Gpa |
The prepreg is solidified into a 10mm thick-layer laminated board according to an OOA process, the section effect is shown in figure 4, and the defects of good section effect, no pore bubbles and the like are overcome.
Example III
The invention relates to an epoxy resin mixture for prepreg, which consists of the following raw materials in parts by weight:
Liquid multifunctional epoxy resin: MY0510:10 parts of MF-4230:10 parts of
O-cresol formaldehyde epoxy resin: NPCN-701:7.5 parts, NPCN-704:7.5 parts
Toughening agent: carboxyl terminated nitrile rubber: 5 parts of nylon 6 powder: 5 parts of polylactic acid: 5 parts of
Filler: silicon micropowder: 2.5 parts of aluminum oxide powder: 2.5 parts of asbestos powder: 2.5 parts of
Coupling agent: silquest A-1110:1 part, BYK-C8001:1 part of
Curing agent: 4,4-DDS:7.5 parts, 3-DDS:7.5 parts
Adding the weighed liquid multifunctional epoxy resin into a dispersing machine, heating to 105 ℃, adding solid o-cresol formaldehyde epoxy resin, preserving heat for 45min, fully dissolving, adding a toughening agent, preserving heat and mixing for 45min, cooling to 70 ℃, adding a filler, a coupling agent and a curing agent, maintaining the temperature of 70 ℃ and dispersing and mixing for 23min, and discharging.
The main performance test of the resin system is as follows:
TABLE 5 Performance test of the resin prepared in example 3
| Test item | Test condition/reference method | Test results |
| Viscosity (75 ℃ C.) | ASTM D4287 | 29800cps |
| Gel time (150 ℃ C.) | ASTM D2471 | 49min |
| Tg (DSC method) | GB/T 19466.2 | 210℃ |
The resin is prepared into prepreg with 43% resin content by using constant HF 20-grade 220gsm carbon fiber twill fabric, and the main mechanical properties of the laminated board are as follows by adopting an OOA curing process (heat preservation for 3 hours at 180 ℃):
TABLE 6 mechanical Properties of the laminates obtained in example 3
| Test item | Test condition/reference method | OOA process test results |
| Tensile strength at 0 degree | ASTM D3039 | 688Mpa |
| Tensile modulus at 0 DEG | ASTM D3039 | 64Gpa |
| Tensile strength at 90 DEG | ASTM D3039 | 668Mpa |
| Tensile modulus at 90 DEG | ASTM D3039 | 69Gpa |
| Compression strength at 0 degree | ASTM D6641 | 760Mpa |
| Compression modulus at 0 DEG | ASTM D6641 | 63Gpa |
| Flexural Strength | ASTM D790 | 892Mpa |
| Flexural modulus | ASTM D790 | 55Gpa |
| Short beam shear Strength | ASTM D2344 | 93Mpa |
| In-plane shear Strength | ASTM D3518 | 121Mpa |
| In-plane shear modulus | ASTM D3518 | 86Gpa |
The prepreg is solidified into a 10mm thick-layer laminated board according to an OOA process, the section effect is shown in figure 5, and the defects of good section effect, no pore bubbles and the like are overcome.
Comparative example 1
The invention relates to an epoxy resin mixture for prepreg, which consists of the following raw materials in parts by weight:
Liquid bisphenol a epoxy resin: NPEL-128:20 parts (Universal bisphenol A epoxy resin)
O-cresol formaldehyde epoxy resin: NPCN-701:10 parts of
Toughening agent: carboxyl terminated nitrile rubber: 10 parts of
Filler: silicon micropowder: 5 parts of
Coupling agent: silquest A-1110:1 part of
Curing agent: 4,4-DDS:10 parts of
Adding the weighed liquid multifunctional epoxy resin into a dispersing machine, heating to 90 ℃, adding solid o-cresol formaldehyde epoxy resin, preserving heat for 30min, fully dissolving, adding a toughening agent, preserving heat and mixing for 30min, cooling to 60 ℃, adding a filling agent, a coupling agent and a curing agent, maintaining the temperature of 60 ℃ for dispersing and mixing for 15min, and discharging.
The main performance test of the resin system is as follows:
TABLE 7 Performance test of the resin prepared in comparative example 1
| Test item | Test condition/reference method | Test results |
| Viscosity (75 ℃ C.) | ASTM D4287 | 28200cps |
| Gel time (150 ℃ C.) | ASTM D2471 | 53min |
| Tg (DSC method) | GB/T 19466.2 | 170℃ |
The resin is prepared into prepreg with 43% resin content by using constant HF 20-grade 220gsm carbon fiber twill fabric, and the main mechanical properties of the laminated board are as follows by adopting an OOA curing process (heat preservation for 3 hours at 180 ℃):
TABLE 8 mechanical Properties of the laminates prepared in comparative example 1
After the liquid epoxy resin is replaced by bisphenol A epoxy resin, the glass transition temperature (Tg) is obviously reduced, and meanwhile, the mechanical properties of the laminated board are also greatly reduced.
The prepreg is solidified into a 10mm thick-layer laminated board according to an OOA process, the effect of the section is shown in figure 6, and the section has a few tiny pores, so that the nondestructive effect of the board is poor.
Comparative example 2
The invention relates to an epoxy resin mixture for prepreg, which consists of the following raw materials in parts by weight:
liquid multifunctional epoxy resin: MY0510:20 parts of
O-cresol formaldehyde epoxy resin: NPCN-701:10 parts of
Toughening agent: carboxyl terminated nitrile rubber: 10 parts of
Filler: calcium carbonate: 5 parts of
Coupling agent: silquest A-1110:1 part of
Curing agent: 4,4-DDS:10 parts of
Adding the weighed liquid multifunctional epoxy resin into a dispersing machine, heating to 90 ℃, adding solid o-cresol formaldehyde epoxy resin, preserving heat for 30min, fully dissolving, adding a toughening agent, preserving heat and mixing for 30min, cooling to 60 ℃, adding a filling agent, a coupling agent and a curing agent, maintaining the temperature of 60 ℃ for dispersing and mixing for 15min, and discharging.
The main performance test of the resin system is as follows:
TABLE 9 Performance test of the resin produced in comparative example 2
| Test item | Test condition/reference method | Test results |
| Viscosity (75 ℃ C.) | ASTM D4287 | 25500cps |
| Gel time (150 ℃ C.) | ASTM D2471 | 49min |
| Tg (DSC method) | GB/T 19466.2 | 209℃ |
The resin is prepared into prepreg with 43% resin content by using constant HF 20-grade 220gsm carbon fiber twill fabric, and the main mechanical properties of the laminated board are as follows by adopting an OOA curing process (heat preservation for 3 hours at 180 ℃):
TABLE 10 mechanical Properties of the laminates prepared in comparative example 2
With other fillers, calcium carbonate, the compression and bending properties of the laminate are greatly reduced.
The prepreg is solidified into a 10mm thick-layer laminated board according to an OOA process, the section effect is shown in figure 7, and the fact that more continuous larger pores exist in the section is seen, so that the nondestructive effect of the board is poor.
Comparative example 3
The invention relates to an epoxy resin mixture for prepreg, which consists of the following raw materials in parts by weight:
liquid multifunctional epoxy resin: MY0510:20 parts of
O-cresol formaldehyde epoxy resin: NPCN-701:10 parts of
Toughening agent: carboxyl terminated nitrile rubber: 10 parts of
Filler: silicon micropowder: 5 parts of
Coupling agent: KH-550:1 part (replacement of general silane coupling agent)
Curing agent: 4,4-DDS:10 parts of
Adding the weighed liquid multifunctional epoxy resin into a dispersing machine, heating to 90 ℃, adding solid o-cresol formaldehyde epoxy resin, preserving heat for 30min, fully dissolving, adding a toughening agent, preserving heat and mixing for 30min, cooling to 60 ℃, adding a filling agent, a coupling agent and a curing agent, maintaining the temperature of 60 ℃ for dispersing and mixing for 15min, and discharging.
The main performance test of the resin system is as follows:
TABLE 11 Performance test of the resins produced in comparative example 3
| Test item | Test condition/reference method | Test results |
| Viscosity (75 ℃ C.) | ASTM D4287 | 28000cps |
| Gel time (150 ℃ C.) | ASTM D2471 | 47min |
| Tg (DSC method) | GB/T 19466.2 | 212℃ |
The resin is prepared into prepreg with 43% resin content by using constant HF 20-grade 220gsm carbon fiber twill fabric, and the main mechanical properties of the laminated board are as follows by adopting an OOA curing process (heat preservation for 3 hours at 180 ℃):
TABLE 12 mechanical Properties of the laminates prepared in comparative example 3
| Test item | Test condition/reference method | OOA process test results |
| Tensile strength at 0 degree | ASTM D3039 | 700Mpa |
| Tensile modulus at 0 DEG | ASTM D3039 | 63Gpa |
| Tensile strength at 90 DEG | ASTM D3039 | 680Mpa |
| Tensile modulus at 90 DEG | ASTM D3039 | 65Gpa |
| Compression strength at 0 degree | ASTM D6641 | 690Mpa |
| Compression modulus at 0 DEG | ASTM D6641 | 40Gpa |
| Flexural Strength | ASTM D790 | 680Mpa |
| Flexural modulus | ASTM D790 | 59Gpa |
| Short beam shear Strength | ASTM D2344 | 85Mpa |
| In-plane shear Strength | ASTM D3518 | 60Mpa |
| In-plane shear modulus | ASTM D3518 | 70Gpa |
After the coupling agent is replaced, the mechanical properties of the laminated board part are obviously reduced, and particularly, the in-plane shear strength is only half of that of the laminated board part.
The coupling agent of the present application comprises a first group and a second group; the first group reacts with a chemical group on the surface of the inorganic molecule, and the second group reacts with the organic molecule. The coupling agent selected in the present application has unexpected effects compared to the silane coupling agent in this comparative example.
The prepreg is solidified into a 10mm thick-layer laminated board according to an OOA process, the effect of the section is shown in figure 8, and the defect that the board has a poor nondestructive effect is overcome due to the fact that more tiny pores exist in the section.
Comparative example 4
The invention relates to an epoxy resin mixture for prepreg, which consists of the following raw materials in parts by weight:
liquid multifunctional epoxy resin: MY0510:20 parts of
O-cresol formaldehyde epoxy resin: NPCN-701:10 parts of
Toughening agent: carboxyl terminated nitrile rubber: 10 parts of
Filler: silicon micropowder: 5 parts of
Coupling agent: silquest A-1110:1 part of
Curing agent: dicyandiamide: 5 parts (changing the type of curing agent)
Adding the weighed liquid multifunctional epoxy resin into a dispersing machine, heating to 90 ℃, adding solid o-cresol formaldehyde epoxy resin, preserving heat for 30min, fully dissolving, adding a toughening agent, preserving heat and mixing for 30min, cooling to 60 ℃, adding a filling agent, a coupling agent and a curing agent, maintaining the temperature of 60 ℃ for dispersing and mixing for 15min, and discharging.
The main performance test of the resin system is as follows:
TABLE 13 Performance test of the resins produced in comparative example 4
| Test item | Test condition/reference method | Test results |
| Viscosity (75 ℃ C.) | ASTM D4287 | 27300cps |
| Gel time (150 ℃ C.) | ASTM D2471 | 42min |
| Tg (DSC method) | GB/T 19466.2 | 190℃ |
The resin is prepared into prepreg with 43% resin content by using constant HF 20-grade 220gsm carbon fiber twill fabric, and the main mechanical properties of the laminated board are as follows by adopting an OOA curing process (heat preservation for 3 hours at 180 ℃):
TABLE 14 mechanical Properties of the laminates prepared in comparative example 4
| Test item | Test condition/reference method | OOA process test results |
| Tensile strength at 0 degree | ASTM D3039 | 685Mpa |
| Tensile modulus at 0 DEG | ASTM D3039 | 59Gpa |
| Tensile strength at 90 DEG | ASTM D3039 | 660Mpa |
| Tensile modulus at 90 DEG | ASTM D3039 | 58Gpa |
| Compression strength at 0 degree | ASTM D6641 | 773Mpa |
| Compression modulus at 0 DEG | ASTM D6641 | 48Gpa |
| Flexural Strength | ASTM D790 | 888Mpa |
| Flexural modulus | ASTM D790 | 44Gpa |
| Short beam shear Strength | ASTM D2344 | 88Mpa |
| In-plane shear Strength | ASTM D3518 | 114Mpa |
| In-plane shear modulus | ASTM D3518 | 78Gpa |
After the curing agent is replaced, the glass transition temperature (Tg) and the modulus of each mechanical property of the laminated board are reduced.
The prepreg was cured according to the OOA process to a 10mm thick laminate, the cut-plane effect of which is shown in fig. 9, and which is seen to be better than the first, second and third comparative examples, but still with a small amount of voids, unlike the first, second and third examples.
Comparative example 5
The invention relates to an epoxy resin mixture for prepreg, which consists of the following raw materials in parts by weight:
liquid multifunctional epoxy resin: MY0510:20 parts of
O-cresol formaldehyde epoxy resin: NPCN-701:10 parts of
Toughening agent: high density polyethylene HDPE:10 parts (Replacing toughener)
Filler: silicon micropowder: 5 parts of
Coupling agent: silquest A-1110:1 part of
Curing agent: 4,4-DDS:10 parts of
Adding the weighed liquid multifunctional epoxy resin into a dispersing machine, heating to 90 ℃, adding solid o-cresol formaldehyde epoxy resin, preserving heat for 30min, fully dissolving, adding a toughening agent, preserving heat and mixing for 30min, cooling to 60 ℃, adding a filling agent, a coupling agent and a curing agent, maintaining the temperature of 60 ℃ for dispersing and mixing for 15min, and discharging.
The main performance test of the resin system is as follows:
TABLE 15 Performance test of the resin produced in comparative example 5
| Test item | Test condition/reference method | Test results |
| Viscosity (75 ℃ C.) | ASTM D4287 | 32300cps |
| Gel time (150 ℃ C.) | ASTM D2471 | 42min |
| Tg (DSC method) | GB/T 19466.2 | 182℃ |
The resin is prepared into prepreg with 43% resin content by using constant HF 20-grade 220gsm carbon fiber twill fabric, and the main mechanical properties of the laminated board are as follows by adopting an OOA curing process (heat preservation for 3 hours at 180 ℃):
TABLE 16 mechanical Properties of the laminates prepared in comparative example 5
After being replaced by the toughening agent without active groups, the glass transition temperature (Tg) and the modulus of each mechanical property of the laminated board are obviously reduced.
The prepreg is solidified into a 10mm thick-layer laminated board according to an OOA process, the section effect is shown in figure 10, and the section effect is shown as a phenomenon that not only some pores exist, but also a small amount of toughening agent powder is unevenly aggregated is different from that of the first, second and third embodiments.
Table 17HF20 grade 220gsm carbon fiber twill prepreg formation test laminates layup
| Test item | Layering mode | Layer number |
| Warp stretching | [(0/90)]5s | 10 |
| Weft stretching | [(0/90)]5s | 10 |
| Warp compression | [(0/90)]4s | 8 |
| Warp direction bending | [(0/90)]4s | 8 |
| Short beam shearing | [(0/90)]4s | 8 |
| In-plane shearing | [(45/-45)]5s | 10 |
Claims (10)
1. The epoxy resin mixture for the prepreg is characterized by comprising the following raw materials in parts by weight:
20-40 parts of liquid multifunctional epoxy resin, 10-20 parts of solid o-cresol formaldehyde epoxy resin, 10-20 parts of toughening agent, 5-10 parts of filler, 1-3 parts of coupling agent and 10-20 parts of curing agent;
the number of epoxy groups in the liquid multifunctional epoxy resin is 3-4;
Preferably, the epoxy resin mixture for the prepreg comprises the following raw materials in parts by weight: 20-30 parts of liquid multifunctional epoxy resin, 10-15 parts of solid o-cresol formaldehyde epoxy resin, 15-20 parts of toughening agent, 7.5-10 parts of filler, 1-3 parts of coupling agent and 15-20 parts of curing agent.
2. The epoxy resin mixture for prepregs according to claim 1, wherein:
the viscosity of the liquid multifunctional epoxy resin at 25 ℃ is required to be lower than 3000cps.
3. The epoxy resin mixture for prepregs according to claim 1, wherein:
The filler comprises one or more of silicon powder, aluminum oxide powder and asbestos powder.
4. An epoxy resin mixture for prepregs according to claim 3, characterized in that:
The coupling agent includes a first group and a second group;
The first group reacts with a chemical group on the surface of the inorganic molecule, and the second group reacts with the organic molecule;
preferably, the coupling agent comprises one or two of Michaelquest A-1110 and Pick chemical BYK-C8001.
5. An epoxy resin mixture for prepregs according to any one of claims 1-4, characterized in that:
The toughening agent comprises a carboxyl end component;
Preferably, the toughening agent comprises one or more of carboxyl terminated nitrile rubber, nylon 6 powder and polylactic acid.
6. An epoxy resin mixture for prepregs according to any one of claims 1-4, characterized in that:
The curing agent includes amine groups;
preferably, the curing agent comprises one or two of 4,4-DDS and 3, 3-DDS.
7. An epoxy resin mixture for prepregs according to any one of claims 1-4, characterized in that:
the solid o-cresol formaldehyde epoxy resin consists of one or two of south Asia electrons NPCN-701, NPCN-703 and NPCN-704;
The liquid multifunctional epoxy resin consists of one or two of Hensmei MY0510, mitsubishi chemical tetra D-X and Hubei Zhenzhengfeng MF-4230.
8. A method for preparing the epoxy resin mixture for prepregs according to any one of claims 1 to 7, comprising the steps of:
s1, weighing: preparing liquid multifunctional epoxy resin, solid o-cresol formaldehyde epoxy resin, a toughening agent, a filler, a coupling agent and a curing agent according to parts by mass;
S2, preparing a resin mixture: heating the liquid multifunctional epoxy resin, continuously adding the solid o-cresol formaldehyde epoxy resin, preserving heat, fully mixing and dissolving to obtain an epoxy resin solution;
S3, adding and mixing various auxiliary agents: and (2) adding a toughening agent into the epoxy resin solution in the step (S2), heating and mixing to completely dissolve the toughening agent, cooling, adding a filler, a coupling agent and a curing agent, and fully mixing and discharging.
9. The method for producing an epoxy resin mixture for prepregs according to claim 8, characterized in that:
S2, heating to 90-120 ℃;
the heat preservation time in S2 is 30-60min;
S3, heating to 90-120 ℃, and heating and mixing for 30-60min in S3;
the temperature after the temperature is reduced in the step S3 is 60-80 ℃;
and S3, mixing for 15-30min after cooling.
10. Use of an epoxy resin mixture for prepregs according to any one of claims 1-7 or prepared according to the preparation method of claims 8 or 9 in carbon fiber resin based composites, characterized in that the carbon fiber resin based composites are prepared from prepregs having a thickness exceeding 5mm using a non autoclave curing process.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110128785A (en) * | 2019-05-10 | 2019-08-16 | 汉硕高新材料（天津）有限公司 | A kind of high-temperature-resistant epoxy resin and synthesis technology for material prepreg |
| CN113290981A (en) * | 2021-01-14 | 2021-08-24 | 南亚新材料科技股份有限公司 | Halogen-free copper-clad plate for automobile electronic material and preparation method and application thereof |
| CN114230973A (en) * | 2021-11-29 | 2022-03-25 | 航天特种材料及工艺技术研究所 | Epoxy resin composition for OOA process and preparation method of composite material thereof |
| CN116694030A (en) * | 2023-06-27 | 2023-09-05 | 北京霜辰月科技有限公司 | Ultra-light high-strength composite material and preparation method and application thereof |
| CN117320292A (en) * | 2023-09-21 | 2023-12-29 | 山东金宝电子有限公司 | Preparation method of halogen-free low-CTE copper-clad plate |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110128785A (en) * | 2019-05-10 | 2019-08-16 | 汉硕高新材料（天津）有限公司 | A kind of high-temperature-resistant epoxy resin and synthesis technology for material prepreg |
| CN113290981A (en) * | 2021-01-14 | 2021-08-24 | 南亚新材料科技股份有限公司 | Halogen-free copper-clad plate for automobile electronic material and preparation method and application thereof |
| CN114230973A (en) * | 2021-11-29 | 2022-03-25 | 航天特种材料及工艺技术研究所 | Epoxy resin composition for OOA process and preparation method of composite material thereof |
| CN116694030A (en) * | 2023-06-27 | 2023-09-05 | 北京霜辰月科技有限公司 | Ultra-light high-strength composite material and preparation method and application thereof |
| CN117320292A (en) * | 2023-09-21 | 2023-12-29 | 山东金宝电子有限公司 | Preparation method of halogen-free low-CTE copper-clad plate |
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